JP6298871B1 - Resin material supply device, resin material supply method, resin molding device, and resin molded product manufacturing method - Google Patents

Abstract

The present invention provides a resin material supply device that supplies a resin material to a supply object such as a cavity of a resin molding device so as to be evenly closer than before. A resin material supply device includes a supply object holding unit (holding table) for holding a supply object (resin material transfer tray) to which a resin material is supplied, and the supply object holding unit. A moving part 17 that moves the relative position in the horizontal direction of the resin material supply port 121 with respect to the supply object held in the supply object holding part, and the relative position A control unit 19 that controls the moving unit 17 so as to pass through the entire supply target region of the supply object and return to the start position without passing the same position twice or more in the movement path from the start position; Is provided. By returning the relative position to the start position, the resin material P is supplied again to the vicinity of the start position 22 where the supply amount of the resin material P was small immediately after the start of supply, and the amount of the resin material P near the start position 22 is almost equal. Become. [Selection] Figure 1

Description

  The present invention relates to a resin material supply apparatus and method for supplying a resin material, a resin molding apparatus having the resin material supply apparatus, and a resin molded product manufacturing method using the resin material supply method.

  In order to protect an electronic component from an environment such as light, heat, and moisture, the electronic component is generally sealed with a resin. Examples of the resin sealing method include a compression molding method and a transfer molding method. In the compression molding method, a mold consisting of a lower mold and an upper mold is used, resin material is supplied to the cavity of the lower mold, a board with electronic components mounted is attached to the upper mold, and then the lower mold and the upper mold are heated. However, molding is performed by clamping both of them. In the transfer molding method, the substrate is attached to one of the upper mold and the lower mold, and then the lower mold and the upper mold are heated and both are clamped, and the resin is pressed into the cavity with a plunger. Done. In the transfer molding method, a part of the resin remains in the path for feeding the resin from the plunger to the cavity, resulting in waste, and the problem that the semiconductor substrate and wiring are damaged by the flow of the resin occurs. In recent years, compression molding has become the mainstream.

  In compression molding, generally, the resin material supplied to the cavity is powdery or granular (hereinafter collectively referred to as “powder”) or liquid. The powdery resin material does not flow freely in the cavity after the supply, and the liquid resin material generally does not flow in the cavity because it is highly viscous when used in compression molding. For this reason, the resin material flows in the cavity due to a decrease in viscosity caused by heating the resin material during molding, which may place a load on the electronic components. It is preferable to keep it. In the compression molding apparatus described in Patent Document 1, while the resin material is dropped from the resin material supply port of the slider to the cavity placed on the XY stage, the position of the resin material supply port is fixed and the XY stage is folded in a zigzag manner. The resin material is supplied into the cavity. FIG. 11 shows a path 92 of relative movement of the resin material supply port with respect to the cavity 91 in this conventional compression molding apparatus. The resin material in the cavity 91 is supplied by supplying the resin material at a constant supply speed (the amount of resin material supplied per unit time) while maintaining the movement speed at a constant value during the zigzag relative movement. Will be equal regardless of position.

JP 2013-042017 Gazette

  In general, in an apparatus for introducing a resin material into a cavity, it takes time (although a little) to reach the above-mentioned constant supply speed after the operation of supplying the resin material is started. It becomes lower than the constant supply rate. Therefore, even if the moving speed of the cavity is constant, the amount of the resin material at the position immediately after the start of supply (start position) is smaller than the amount of the resin material at other positions in the cavity. Thereby, the resin material in the cavity becomes uneven.

  The problem to be solved by the present invention is to provide a resin material supply apparatus and method capable of supplying a resin material to a supply object such as a cavity of a resin molding apparatus so as to be evenly closer than before. is there.

The resin material supply apparatus according to the present invention made to solve the above problems is
a) a supply object holding unit for holding a supply object to which a resin material is supplied;
b) a resin material supply port provided above the supply object holding unit;
c) a moving unit that moves a relative position in a horizontal direction of the resin material supply port with respect to the supply object held by the supply object holding unit;
d) Dividing the supply target region, which is a region for supplying the resin material to the supply target, into two partial regions symmetric with respect to a virtual dividing line, and the relative position returns from the single start position to the start position A control unit that controls the moving unit through the moving path so that the moving path is symmetric with respect to the dividing line and does not pass through the same position more than once and is folded back multiple times in each of the two partial regions ; It is characterized by providing.

The resin material supply method according to the present invention divides a supply target region that is a region for supplying a resin material to a supply target that is a target for supplying a resin material into two partial regions that are symmetrical with respect to a virtual dividing line, through a movement path relative horizontal position of the feed object and the feed resin material supply port provided above the object returns to the starting position from a single starting position, the travel path with respect to split line The supply object from the resin material supply port while moving the relative position in the supply target area so that it is symmetrical and does not pass through the same position more than once and is folded back multiple times in the two partial areas . It is characterized by supplying a resin material.

The resin molding apparatus according to the present invention is
The resin material supply device;
A first mold, a second mold having a cavity, a compression molding section having a mold clamping mechanism for clamping the first mold and the second mold;
And a transfer unit that transfers the supply object supplied with the resin material by the resin material supply device onto the cavity and supplies the resin material from the supply object to the cavity.

The resin molded product manufacturing method according to the present invention includes:
Supplying a resin material to the supply object by the resin material supply method;
Transferring the supply object supplied with the resin material to the cavity of the second mold, and supplying the resin material from the supply object to the cavity;
And a step of clamping the second mold in which the resin material is supplied to the cavity.

  According to the present invention, a resin material can be supplied to a supply object such as a cavity of a resin molding apparatus so as to be evenly closer than before.

The schematic block diagram which shows one Embodiment of the resin material supply apparatus which concerns on this invention. The figure which shows the state (a) with which the resin material was supplied to the resin material transfer tray, and the state (b) in which the resin material transfer tray was lifted and the resin material accommodation space was formed. The top view which shows the example of the track | orbit with which a resin material is supplied to this resin material transfer tray in the resin material transfer tray and the resin material supply apparatus of this embodiment. The graph which shows the time change of the target value of the resin material supply speed | rate from the resin material supply port to the resin material accommodating part of the resin material transfer tray, and a measured value. The resin material supplied to the resin material container of the resin material transfer tray is a longitudinal cross-sectional view parallel to the moving direction of the relative position, and shows a state immediately after the start of supply (a), and the state at the end of supply FIG. The longitudinal cross-sectional view perpendicular | vertical to the moving direction of the relative position of the resin material supplied to the resin material accommodating part of the resin material transfer tray. The top view which shows the other example of the track | orbit in which the resin material is supplied to a resin material transfer tray in the resin material transfer tray and the resin material supply apparatus of this embodiment. The schematic block diagram which shows the modification of the resin material supply apparatus of this embodiment. The longitudinal cross-sectional view which shows an example of the compression molding part which is a part of resin molding apparatus which concerns on this invention. Schematic which shows the example of a resin molding apparatus provided with a material acceptance module, a shaping | molding module, and a payout module. The top view which shows the track | orbit in which the resin material is supplied to a cavity in the conventional compression molding apparatus.

  In the resin material supply apparatus and method according to the present invention, the horizontal relative position of the resin material supply port with respect to the supply object held by the supply object holding unit is set twice in the movement path from the start position. The resin material is supplied from the resin material supply port to the supply object while being moved in the supply object region of the supply object so as to return to the start position without passing through the above. Thus, in order to move the relative position so that the relative position returns to the start position, a part or all of the resin material supplied at the end of the movement is supplied to the start position. Thereby, even if the amount of the resin material supplied to the start position decreases due to the slow supply rate of the resin material immediately after the supply of the resin material starts, a part of the resin material supplied at the end of the movement Alternatively, since the entire material is compensated by being supplied to the start position, the resin material supplied to the supply object becomes close to equal. Further, since the relative position does not pass the same position twice or more in the movement route, the resin material is not supplied twice or more to the same position and the supply amount of the resin material does not increase.

  In the resin material supply apparatus and method according to the present invention, when the relative position “returns to the start position”, in addition to the relative position returning to the same position as the start position, the resin material expands to reach the start position. It includes reaching a position away from the starting position by a certain distance.

The movement of the relative position may be due to the movement of the supply object holding unit, the movement of the resin material supply port, or the supply object holding unit and the resin material supply port. It may be due to both movements.
The supply object may be, for example, a cavity of a resin molding apparatus, or a resin material conveyance tray that conveys a resin material from a resin material supply apparatus to a cavity provided in the resin molding apparatus. Or the board | substrate with which the electronic component which is the target object which performs resin molding was mounted may be sufficient.
The resin material may be in a powder form or a liquid form.

  In the resin material supply apparatus and method according to the present invention, in order to supply the resin material evenly to the supply object, the supply of the resin material is usually supplied to the supply object from the moving speed of the relative position and the resin material supply port. Keep the speed constant. However, for example, in the case described below, either or both of the moving speed and the supply speed may be variable. In this case, since the movement speed is easier to control than the supply speed, it is desirable to make the supply speed constant by making the movement speed variable.

Examples of the case where the movement speed and / or the supply speed are variable include the following examples.
When the resin material is supplied to a cavity having a corner portion such as a rectangle, the resin material is sufficiently moved near the corner portion if the relative position is moved along a curved path in order to smoothly move the relative position. May not span. Therefore, when the relative position is moved in a curved line near the corner, the moving speed is slower (and / or the supply speed is faster) than when moving in a straight line, so that the resin material near the corner Therefore, the resin material can be made more uniform in the entire cavity.

  Further, when the relative position is moved along the edge of the cavity, the resin material does not spread outward from the edge, so that the amount of the resin material near the edge is larger than the other positions. Therefore, when the relative position is moved along the edge of the cavity, the moving speed is made faster (and / or the supply speed is made slower) than that when moving inside the cavity. The supply amount of the resin material can be reduced, and the resin material can be made more uniform in the entire cavity.

  The supply speed of the resin material may become unstable due to a failure of an apparatus for sending the resin material to the resin material supply port, in addition to the slowdown immediately after the start of supply. Therefore, the resin material supply apparatus according to the present invention can be provided with a supply speed detection unit that detects the supply speed of the resin material. In this case, when an abnormality in the supply speed (exceeding or falling below a predetermined setting range) is detected by the supply speed detection unit, a sound, light, or display device (display) is displayed to the manager of the apparatus. A warning unit that issues a warning by an image or the like may be further provided in the resin material supply device. Alternatively, the operation of the moving unit and the supply of the resin material from the resin material supply port may be stopped when an abnormality in the supply rate is detected by the supply rate detection unit. Similarly, in the resin material supply method according to the present invention, it is possible to detect the supply speed of the resin material while supplying the resin material to the supply object, and when an abnormality in the supply speed is detected. A warning may be issued or the supply of the resin material may be stopped.

  Hereinafter, more specific embodiments of the resin material supply device, the resin material supply method, the resin molding device, and the resin molded product manufacturing method according to the present invention will be described with reference to FIGS.

(1) Configuration of Resin Material Supply Device of the Present Embodiment FIG. 1 shows a schematic configuration of the resin material supply device 10 of the present embodiment. The resin material supply device 10 is a device that supplies a powdered resin material P to a resin material transfer tray 20 that is a supply object.

  The resin material supply device 10 includes a resin material holding unit 11 that holds the resin material P and a trough 12. One end of the trough 12 is connected to the resin material holding unit 11, and the other end is provided with a resin material supply port 121 that is an opening for supplying the resin material P to the resin material transfer tray 20. The resin material supply apparatus 10 includes an excitation unit 13 that vibrates the resin material holding unit 11 and the trough 12, and a weighing unit 14 that measures the weight of the resin material holding unit 11 and the trough 12 including the resin material P. Above the resin material holding unit 11, there is an original supply unit 15 that supplies the resin material P to the resin material holding unit 11. In the lower part of the original supply unit 15, an original supply port 151 that is an opening for supplying the resin material P to the resin material holding unit 11 and an original supply unit excitation unit 152 that vibrates the original supply unit 15 are provided. The resin material holding unit 11 is disposed directly below the original supply port 151.

  Immediately below the resin material supply port 121, a holding table (supply object holding unit) 16 that holds the resin material transfer tray 20 is disposed. Below the holding table 16, a moving unit 17 that moves the holding table 16 in the horizontal direction is provided. The moving unit 17 moves the holding table 16 at any speed within a range lower than a predetermined maximum speed in both the X direction (the horizontal direction in FIG. 1) and the Y direction (the direction perpendicular to the paper surface in FIG. 1). It can be moved, and can be moved simultaneously in both the X direction and the Y direction. Accordingly, the horizontal relative positions of the resin material supply port 121 and the holding table 16 can also be moved at an arbitrary speed in an arbitrary direction. A combination of the holding table 16 and the moving unit 17 is generally called an “XY stage”.

  The resin material supply device 10 also loads and places the resin material transfer tray 20 before the resin material P is supplied onto the holding table 16 and also places the resin material transfer tray 20 after the resin material P is supplied. A transfer unit 18 is provided to carry 20 out of the holding table 16.

The resin material supply apparatus 10 further includes a control unit 19 . A control unit 19 is embodied by hardware and software of a computer, controls the ON / OFF and the supply rate in supplying a resin material feed port 121 of the resin material P in the resin material transfer tray 20 The operation of the moving unit 17 is controlled. Details of the control by the control unit 19 will be described below together with the overall operation of the resin material supply apparatus 10.

  As shown in FIG. 2A, the resin material transfer tray 20 includes a resin material container 21 having a shape and size corresponding to a cavity of a molding die of a compression molding apparatus and corresponding to the supply target area. . The resin material container 21 includes a resin material container 211 that is a frame member having a rectangular opening, and a release film F that covers the lower surface of the opening of the resin material container 211. An adsorption mechanism (not shown) is provided on the lower surface of the resin material housing frame 211 to attract the release film F to the lower surface by sucking air. A stop portion 2111 is formed on the inner side of the opening portion of the resin material housing frame 211, with the lower end portion on the inner peripheral side projecting inward. A film that is a rectangular frame corresponding to the shape of the opening of the resin material housing frame 211 inside the resin material housing frame 211, has a protruding portion 2121 on the outer peripheral side, and is a ring having an inverted L-shaped cross section. A tension frame material 212 is provided. The side surface of the resin material housing frame 211 is held by the transfer unit 18. A film gripping portion 213 that grips an end portion of the release film F stretched on the lower surface of the resin material housing frame 211 is provided below the transfer portion 18.

  As will be described later, the resin material transfer tray 20 is supplied with the resin material P to the resin material container 21 by the resin material supply device 10 (FIG. 2 (a)), and then lifted by the transfer unit 18, the protruding portion Until the film 2121 comes into contact with the stop portion 2111, the film tension frame member 212 is lowered relative to the resin material housing frame 211 by its own weight. Thereby, the resin material accommodation space PA corresponding to the shape of the cavity of the molding die is formed (FIG. 2B).

(2) Operation of Resin Material Supply Device of this Embodiment and Resin Material Supply Method of This Embodiment Hereinafter, the operation of the resin material supply device 10 (resin material supply method of this embodiment) will be described.
The operator supplies the resin material P to the raw supply unit 15 in advance. Then, when the operator performs a predetermined operation using an input device (not shown) such as a touch panel provided in the resin material supply device 10, the operation of the resin material supply device 10 is started.

  First, the transfer unit 18 loads and places the resin material transfer tray 20 before the resin material P is supplied onto the holding table 16. Subsequently, in the moving unit 17, the resin material supply port 121 is arranged immediately above a predetermined start position 22 (see FIG. 3) in the resin material storage unit 21 of the resin material transfer tray 20 under the control of the control unit 19. As described above, the holding table 16 is moved in the horizontal direction. In the example of FIG. 3, the position near the edge of the long side of the resin material containing portion 21 having a substantially rectangular upper surface and near the center 245 of the long side is set as the start position 22. Any position in the portion 21 may be used.

  Next, the weighing unit 14 measures the weight of the resin material holding unit 11 and the trough 12 and the resin material P accommodated therein. Since the weight of the resin material holding part 11 and the trough 12 is known, the resin material in the resin material holding part 11 and the trough 12 is obtained by subtracting the weight of the resin material holding part 11 and the trough 12 from the weight measured here. The weight of P is determined. When the weight of the resin material P is sufficiently larger than the weight of the resin material to be supplied to the resin material accommodation portion 21 of the resin material transfer tray 20, the resin material P to the resin material accommodation portion 21 described in the next paragraph is used. The supply operation is started. On the other hand, when the weight of the resin material P is insufficient or zero, the control unit 19 applies the vibration from the original supply unit excitation unit 152 to the original supply unit 15 for a predetermined time. To control. As a result, the resin material P in the original supply unit 15 is supplied to the resin material holding unit 11 by a predetermined amount via the original supply port 151.

  Next, the control unit 19 controls the excitation unit 13 such that vibration is applied from the excitation unit 13 to the resin material holding unit 11 and the trough 12 with a certain strength. As a result, the resin material P is supplied from the resin material supply port 121 to the resin material container 21 of the resin material transfer tray 20 at a constant supply speed. Simultaneously with the start of the application of vibration, the control unit 19 controls the moving unit 17 to move the horizontal relative position of the resin material supply port 121 with respect to the resin material containing unit 21.

  FIG. 3 shows a trajectory 23 in which the relative position moves as an example. The relative position first moves from the start position 22 along one long side edge 241 of the resin material containing portion 21 to the vicinity of one short side edge 242 and draws a U-shape there, that is, a U-turn. Thus, the long side direction (the long side extends) while moving in the short side direction (the direction in which the short side extends) toward the edge 243 of the other long side by a distance equivalent to the width of the resin material supply port 121. Direction) is reversed. Here, the movement distance in the short side direction may be longer than the width of the resin material supply port 121 as long as the resin material P supplied from the resin material supply port 121 is within the range of expansion. Thereafter, when the relative position returns to the vicinity of the center 245 in the long side direction, the U-turn is similarly moved to the vicinity of the edge 242 of the one short side. When the U-turn is repeated in the vicinity of the edge of one short side and the center in the long side direction as described above, when the vicinity of the edge 243 of the other long side is reached, the relative position becomes the edge 243 of the other long side. To the vicinity of the edge 244 of the other short side. Therefore, the relative position reverses the direction of movement in the long side direction while moving in the short side direction toward the edge 241 of the one long side by a distance equivalent to the width of the resin material supply port 121 (U-turn). ) Thereafter, the relative position moves to the vicinity of the edge 241 of one long side while repeating the U-turn near the center 245 in the long side direction and the vicinity of the edge 244 of the other short side. Thus, the relative position passes through the entire resin material containing portion 21 that is the supply target region, and finally returns to the start position 22 along the edge 241 of one long side. During the movement of the relative position described so far, the supply of the resin material P from the resin material supply port 121 to the resin material accommodating portion 21 is continued.

  Here, the relative position of “passing through the entire supply target area of the supply target” means that the relative movement trajectory is closely spaced so that the resin material supply port passes through the entire supply target area (resin material In addition to the case of clogging (about the width of the supply port), it also includes the fact that the resin material supplied from the resin material supply port spreads and the tracks are spaced apart to the extent that the entire supply target area is reached. Furthermore, the distance between the track and the end of the supply target region is so far as the resin material supplied from the resin material supply port spreads and reaches the entire supply target region.

  As shown in FIG. 4, the supply speed of the resin material P does not reach the target value within a certain period (“rise period” in the figure) immediately after the start of supply. Therefore, as shown in FIG. 5 (a), the supply amount of the resin material P supplied to the vicinity of the start position 22 at the start of supply is less than the supply position after that. In FIG. 5A, the resin material P is also present on the opposite side of the movement direction of the relative position when viewed from the start position 22. This is because the resin material supply port 121 has a certain width. This is because, when the resin material P falls from the resin material supply port 121 to the resin material accommodating portion 21, it spreads in the horizontal direction. Then, when the relative position returns to the start position 22 after passing through the entire resin material accommodating portion 21, the resin material P is supplied again in the vicinity of the start position 22 where the supply amount of the resin material P was small immediately after the start of supply. Therefore, the amount of the resin material P in the vicinity of the start position 22 is closer to the amount of the resin material P at the other position than the case where the supply is not performed again (that is, close to the same) (FIG. 5B). ).

The speed at which the relative position is moved (moving speed) may be constant, but may be variable depending on the position as illustrated below. It should be noted that the movement speed of the relative position is easier to control after moving slightly than the rising period immediately after the start of movement. Therefore, in this embodiment, the moving speed in the time after the rising period is variable. For example, at the place where the U-turn is made on the track 23, the amount of the resin material P supplied to the region outside the curve (the region indicated by reference numeral 25 in FIG. 3) is smaller than that of the straight line. Therefore, supplying a larger amount resin material P in the portion of the curve by the moving speed of the relative position at which the U-turn. In this way, the resin material P supplied in a large amount to the curve spreads outside the curve with a small amount of the resin material P, so that the supply amount of the resin material P can be made nearly equal.

  Further, as shown in FIG. 6, since the resin material P1 supplied when the relative position moves along the edge 24 of the resin material accommodating portion 21 does not spread to the edge 24 side, the relative position is set at a constant speed. When it is moved, the resin material P2 supplied when moving inside the resin material accommodating portion 21 is increased. Therefore, by making the moving speed when the relative position moves along the edge 24 of the resin material containing portion 21 faster than the moving speed at other positions, the supply amount of the resin material P is made close to equal. Can do.

The planar shape of the resin material container of the resin material transfer tray that supplies the resin material with the resin material supply device 10 of the present embodiment (and the corresponding mold cavity of the compression molding device) is the rectangle shown in FIG. However, the present invention is not limited to this, and may be any shape such as a quadrilateral other than a rectangle, a polygon other than a quadrangle, or a circle. For example, when a resin material transfer tray 20A having a circular resin material container 21A is used, the relative position can be moved along the track 23A1 shown in FIG. In this movement, the relative position starts from the vicinity of the edge of the resin material accommodating portion 21A as the start position 22A, and first moves slightly less than 90 ° in an arc along the edge, and then toward the center of the circle. The operation of making a U-turn while moving by the width of, and making a U-turn after moving 90 degrees in the opposite direction in a concentric circle (arc) shape is repeated until reaching the vicinity of the center of the circle. The reason why “90 ° slightly” is used instead of 90 ° is to secure an area required for the U-turn. Subsequently, the relative position moves 180 ° weakly near the center of the circle, a U-turn while moving amount corresponding to the width of the resin material feed port 121 toward the edge of the resin material receiving portion 21A, concentric (arc) The operation of making a U-turn after moving 90 degrees in the opposite direction is repeated until reaching the vicinity of the edge. Further, the relative position moves slightly less than 180 ° in the vicinity of the edge, and the same operation as before is performed from the vicinity of the edge toward the center of the circle, and then the operation from the center of the circle toward the vicinity of the edge is performed. Then, when the relative position moves in an arc shape in the vicinity of the edge, the position reaches the start position 22A, and the series of movements ends.

  In the example of FIG. 7 (a), the relative position makes a U-turn every time it moves a little less than 90 °, and moves a little less than 180 ° when it reaches the center or edge of the circle. As shown by the figure, it is possible to make a U-turn every time it moves slightly less than 180 ° and move slightly less than 360 ° when it reaches the center or edge of the circle.

  FIG. 8 shows a schematic configuration of a modified resin material supply apparatus 10A. 10 A of resin material supply apparatuses of a modification have the supply speed detection part 191 and the alarm transmission part 192 in addition to the component which the above-mentioned resin material supply apparatus 10 has. The supply speed detection unit 191 acquires the weight weighed by the weighing unit 14 while supplying the resin material to the supply object, and detects the supply speed of the resin material to the supply object from the time change of the weight. The alarm transmission unit 192 generates an alarm sound when the resin material supply speed detected by the supply speed detection unit 191 is out of a predetermined range. The alarm transmitter 192 may emit light or display an image on the screen instead of emitting an alarm sound. If the supply speed deviates from the predetermined range, the amount of the resin material supplied to the supply object deviates from the target value. Thus, the resin is molded with the wrong amount of the resin material by issuing an alarm in this way. This can be prevented. Instead of providing the alarm transmission unit 192, a stop control unit that stops the apparatus when the supply rate of the resin material detected by the supply rate detection unit 191 is out of a predetermined range may be provided.

  In the examples so far, the case where the resin material is supplied to the resin material transfer tray 20 has been described as an example. However, even if the resin material is supplied from the resin material supply device 10 to the resin material transfer tray having a configuration other than the above, Good. Further, the mold may be carried, and the resin material may be supplied from the resin material supply device 10 to the cavity of the mold, or the resin material may be supplied from the resin material supply device 10 to the surface of the substrate on which the electronic component is mounted. You may supply. The resin material is not limited to powder and may be liquid.

(3) Embodiment of Resin Molding Apparatus (Compression Molding Apparatus) and Resin Molded Product Manufacturing Method of the Present Embodiment The resin molding apparatus of the present embodiment includes the above-described resin material supply apparatus 10 and the compression molding unit 30. Hereinafter, the structure of the compression molding part 30 is demonstrated using FIG.

  In the compression molding unit 30, tie bars 32 (four in total) are erected at four corners of the lower fixed platen 311, and a rectangular upper fixed platen 312 is provided near the upper end of the tie bar 32. A rectangular movable platen 33 is provided between the lower fixed platen 311 and the upper fixed platen 312. The movable platen 33 is provided with holes through which the tie bars 32 pass at the four corners, and can move up and down along the tie bars 32. A mold clamping device 34 that is a device for moving the movable platen 33 up and down is provided on the lower fixed plate 311.

  A lower heater 351 is disposed on the upper surface of the movable platen 33, and a lower mold LM, which is the second mold, is provided on the lower heater 351.

  An upper heater 352 is disposed on the lower surface of the upper fixed platen 312, and an upper mold UM that is the first molding die is attached below the upper heater 352. A substrate S on which a semiconductor chip is mounted can be attached to the lower surface of the upper mold UM. The upper mold UM and the lower mold LM are arranged to face each other.

  The operation of the compression molding unit 30 is as follows. First, the substrate S on which the semiconductor chip is mounted is attached to the lower surface of the upper mold UM by a substrate moving mechanism (not shown). Next, as described above, the resin material transfer tray 20 to which the resin material P is supplied in the resin material supply apparatus 10 is transferred directly above the lower mold LM by the transfer unit 18, and the resin material P in the resin material accommodation space PA is transferred. It is accommodated in the cavity MC together with the release film F. Note that the attachment of the substrate S to the upper mold UM and the accommodation of the resin material P in the lower mold LM may be performed in the reverse order.

  In this state, the lower heater 351 softens the resin material P in the cavity MC by heating, and the upper heater 352 heats the substrate S. While the resin material P and the substrate S are heated, the movable platen 33 is raised by the mold clamping device 34, the mold (upper mold UM and lower mold LM) is clamped, and the resin material P is cured. After the resin material P is cured, the mold is opened by lowering the movable platen 33 by the mold clamping device 34.

  A resin-sealed product (resin-molded product) in which the semiconductor chip is resin-sealed is manufactured by the operation (resin-molded product manufacturing method) of the resin material supply device 10 and the compression molding unit 30 described above. The obtained resin-sealed product is smoothly released from the lower mold LM when the inner surface of the lower mold LM is covered with the release film F.

  Next, another embodiment of the resin molding apparatus according to the present invention will be described with reference to FIG. The resin molding apparatus 40 according to this embodiment includes a material receiving module 41, a molding module 42, and a dispensing module 43. The material receiving module 41 is a device for receiving the resin material P and the substrate S from the outside and sending them to the molding module 42. The material receiving module 41 includes the resin material supply device 10 described above and includes a substrate receiving portion 411. One molding module 42 includes one set of the above-described compression molding section 30. Although three molding modules 42 are shown in FIG. 10, an arbitrary number of molding modules 42 can be provided in the resin molding apparatus 40. Further, even after the resin molding apparatus 40 is assembled and used, the number of molding modules 42 can be increased or decreased. The payout module 43 carries the resin molded product manufactured by the molding module 42 from the molding module 42 and holds it, and has a resin molded product holding portion 431.

  A substrate S, a resin material transfer tray 20, and a main transport device 46 for transporting the resin molded product are provided so as to penetrate the material receiving module 41, one or a plurality of molding modules 42, and the dispensing module 43. The transfer unit 18 described above constitutes a part of the main transfer device 46. Each module is provided with a sub-transport device 47 that transports the substrate S, the resin material transfer tray 20, and the resin molded product between the main transport device 46 and the devices in the module.

  In addition, the resin molding apparatus 40 includes a power source and a control unit (none of which are shown) for operating each of the modules.

  The operation of the resin molding apparatus 40 will be described. The board | substrate S is hold | maintained at the board | substrate receiving part 411 of the material reception module 41 by the operator. The main transport device 46 and the sub transport device 47 transport the substrate S from the substrate receiving unit 411 to the compression molding unit 30 in one of the molding modules 42, and the substrate S is an upper mold UM of the compression molding unit 30. Attach to. Subsequently, the main transport device 46 and the sub transport device 47 carry the resin material transfer tray 20 into the resin material supply device 10. The resin material supply apparatus 10 supplies the resin material P to the resin material transfer tray 20 as described above. The main transport device 46 and the sub transport device 47 transport the resin material transfer tray 20 supplied with the resin material P to the compression molding unit 30 of the molding module 42 in which the substrate S is attached to the upper mold UM, and perform the compression molding. After the resin material transfer tray 20 is disposed on the lower mold LM of the unit 30, the resin material P is supplied from the resin material transfer tray 20 to the cavity MC of the lower mold LM. Thereafter, the resin material transfer tray 20 is unloaded from the compression molding unit 30 by the main conveyance device 46 and the sub conveyance device 47, and then compression molding is performed in the compression molding unit 30. While performing the compression molding in the compression molding unit 30, by performing the same operation as before on the other compression molding units 30, the plurality of compression molding units 30 are shifted in parallel while being shifted in time. Compression molding can be performed. The resin molded product obtained by the compression molding is carried out from the compression molding unit 30 by the main conveyance device 46 and the sub conveyance device 47, and carried into the resin molded product holding unit 431 of the dispensing module 43 and held therein. The user appropriately takes out the resin molded product from the resin molded product holding portion 431.

  Needless to say, the present invention is not limited to the above-described embodiments, and various modifications other than the points described in the above description are possible.

DESCRIPTION OF SYMBOLS 10, 10A ... Resin material supply apparatus 11 ... Resin material holding | maintenance part 12 ... Trough 121 ... Resin material supply port 13 ... Excitation part 14 ... Metering part 15 ... Original supply part 151 ... Original supply port 152 ... Original supply part excitation part 16 ... Holding stand 17 ... Moving part 18 ... Transfer part 19 ... Control part 191 ... Supply speed detection part 192 ... Alarm transmission part 20, 20A ... Resin material transfer tray 21, 21A ... Resin material storage part 211 ... Resin material storage frame 2111 ... Stop Part 212 ... film tension frame member 2121 ... projection part 213 ... film gripping part 22, 22A ... start position 23, 23A1, 23A2, 92 ... trajectory 24, 241, 242, 243, 244 for movement of relative position ... resin material container Edge 245... Center 25 of the long side of the resin material accommodating portion... Area 30 outside the curve... Compression molding portion 311. Bar 33 ... Moveable platen 34 ... Clamping device 351 ... Lower heater 352 ... Upper heater 40 ... Resin molding device 41 ... Material receiving module 411 ... Substrate receiving unit 42 ... Molding module 43 ... Discharge module 431 ... Resin molded product holding unit 46 ... Main transport device 47 ... sub transport device 91 ... cavity F ... release film LM ... lower mold (second mold)
MC ... cavity P ... resin material PA ... resin material accommodation space S ... substrate UM ... upper mold (first mold)

Claims (10)

a) a supply object holding unit for holding a supply object to which a resin material is supplied;
b) a resin material supply port provided above the supply object holding unit;
c) a moving unit that moves a relative position in a horizontal direction of the resin material supply port with respect to the supply object held by the supply object holding unit;
d) Dividing the supply target region, which is a region for supplying the resin material to the supply target, into two partial regions symmetric with respect to a virtual dividing line, and the relative position returns from the single start position to the start position A control unit that controls the moving unit through the moving path so that the moving path is symmetric with respect to the dividing line and does not pass through the same position more than once and is folded back multiple times in each of the two partial regions ; A resin material supply device comprising:   2. The resin material supply apparatus according to claim 1, wherein one or both of a moving speed of the relative position and a supply speed of the resin material supplied from the resin material supply port are variable. a) a supply object holding unit for holding a supply object to which a resin material is supplied;
b) a resin material supply port provided above the supply object holding unit;
c) a moving unit that moves a relative position in a horizontal direction of the resin material supply port with respect to the supply object held by the supply object holding unit;
d) a control unit that controls the moving unit such that the relative position returns from the start position to the start position without passing through the same position twice or more in the movement path;
With
The tree fat material feeder you wherein feed rate moving speed is a variable that is equal speed. a) a supply object holding unit for holding a supply object to which a resin material is supplied;
b) a resin material supply port provided above the supply object holding unit;
c) a moving unit that moves a relative position in a horizontal direction of the resin material supply port with respect to the supply object held by the supply object holding unit;
d) a control unit that controls the moving unit so that the relative position returns from the start position to the start position without passing through the same position twice or more in the movement path;
e) Tree fat material feeder you anda feed speed detecting unit for detecting the feed rate of the resin material supplied from the resin material feed port. Dividing the supply target area, which is the area where the resin material is supplied to the supply target, which is the supply target of the resin material, into two partial areas symmetric with respect to the virtual dividing line, and the supply target and the supply target The horizontal relative position of the resin material supply port provided above passes through a moving path that returns from the single starting position to the starting position , and the moving path is symmetric with respect to the dividing line, and the same position is repeated twice or more. The resin material is supplied to the supply object from the resin material supply port while moving the relative position in the supply target area so as to be refracted multiple times in each of the two partial areas without passing through. Resin material supply method.   6. The resin material supply method according to claim 5, wherein either or both of the moving speed of the relative position and the supply speed of the resin material supplied from the resin material supply port are variable. The relative position in the horizontal direction between the supply object to be supplied with the resin material and the resin material supply port provided above the supply object passes through the same position twice or more in the movement path from the start position. The resin material is supplied to the supply object from the resin material supply port while moving in the supply object region of the supply object so as to return to the start position without
The tree fat material supply way to wherein the feed rate moving speed is a variable that is equal speed. The relative position in the horizontal direction between the supply object to be supplied with the resin material and the resin material supply port provided above the supply object passes through the same position twice or more in the movement path from the start position. The resin material is supplied to the supply object from the resin material supply port while moving in the supply object region of the supply object so as to return to the start position without
Tree fat material supply way to and detecting the feed rate of the resin material supplied from the resin material feed port. The resin material supply device according to any one of claims 1 to 4,
A first mold, a second mold having a cavity, a compression molding section having a mold clamping mechanism for clamping the first mold and the second mold;
A resin molding comprising: a transfer object that transfers a supply object supplied with a resin material by the resin material supply device onto the cavity, and supplies the resin material from the supply object to the cavity. apparatus. A step of supplying a resin material to the supply object by the resin material supply method according to claim 5;
Transferring the supply object supplied with the resin material to the cavity of the second mold, and supplying the resin material from the supply object to the cavity;
A method for producing a resin molded product, comprising: a first mold and a step of clamping a second mold in which a resin material is supplied to a cavity.

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