KR20230085693A - Apparatus and Method for Manufacturing large-area panel structure - Google Patents

Abstract

The technical idea of the present invention provides a method for manufacturing a large-area panel structure that includes the steps of: supplying a granular mold on at least one mold transfer tray; placing the mold transfer tray on a large area tray; forming a granular mold layer on a carrier by passing the granular mold through a redistribution tray; confirming the uniformity of the granular mold layer; and forming a molding layer of a large-area panel covering semiconductor chips by pressing a panel substrate on which the semiconductor chips are mounted to the granular mold layer. Therefore, it is possible to reduce the thickness uniformity and bending of the large-area panel.

Description

Large-area panel structure manufacturing apparatus and method for manufacturing large-area panel structure using the same {Apparatus and Method for Manufacturing large-area panel structure}

The technical idea of the present invention relates to an apparatus for manufacturing a large area panel structure and a method for manufacturing a large area panel structure using the same.

In order to protect electronic components from an external environment, a molding layer covering and protecting electronic components such as semiconductor chips is used. Methods for forming the molding layer include compression molding and transfer molding. In compression molding, a molding layer is formed by supplying a mold onto a cavity of a carrier and pressing a substrate on which an electronic component is mounted onto a mold filled in the cavity of the carrier. In the case of a large-area panel structure, due to its size, warpage may occur and total thickness variation may increase, and a non-molded issue in which a part of the large-area panel structure is not covered by the molding layer may occur.

A problem to be solved by the technical idea of the present invention is a large-area panel structure capable of reducing the thickness uniformity and warpage of a large-area panel without generating non-forming or flow marks on the outer portion of the large-area panel after manufacturing the large-area panel structure. It is to provide a manufacturing method of.

Another problem to be solved by the present invention is a large-area panel structure that can reduce the thickness uniformity and warpage of the large-area panel without the occurrence of non-forming or flow marks on the outer portion of the large-area panel after manufacturing the large-area panel structure. It is to provide manufacturing equipment.

In order to solve the above problems, the technical idea of the present invention is to supply granular molds on at least one mold transfer tray; placing the mold transfer tray on a large area tray; forming a granular mold layer on a carrier by passing the granular mold through a redistribution tray; checking the uniformity of the granular mold layer; and forming a molding layer of a large-area panel covering the semiconductor chips by pressing the panel substrate on which the semiconductor chips are mounted against the granular mold layer. It provides a large-area panel structure manufacturing method comprising a.

In one exemplary embodiment, the supply of the granular mold is made along a travel path from a single starting position on the mold transfer tray back to the starting position, the moving path moving the mold transfer tray relative to an imaginary centerline. It is symmetrical with respect to the dividing line when divided into two symmetric regions, and is characterized in that each of the two regions is bent multiple times.

As an exemplary embodiment, the method further comprises the step of additionally supplying granular molds to both ends of the mold transfer tray.

As an exemplary embodiment, the method may further include supplying the granular mold to an outer portion of the mold transfer tray.

As an exemplary embodiment, the granular mold is characterized in that it is additionally supplied in an L or U shape.

In an exemplary embodiment, the granular mold supply time to the outer portion of the mold transfer tray is longer than the granular mold supply time to the central portion of the mold transfer tray.

In an exemplary embodiment, the area of the redistribution tray is larger than that of the large-area tray.

As an exemplary embodiment, the microholes of the redistribution tray are circular.

In an exemplary embodiment, the size of the microholes at the outer portion of the redistribution tray is larger than the size of the microholes at the center of the redistribution tray.

In order to solve the above problems, the technical idea of the present invention is to supply a granular mold on one mold transfer tray; supplying the granular mold from the mold transfer tray onto a large-area tray; forming a granular mold layer on a carrier by passing the granular mold through a redistribution tray; checking the uniformity of the granular mold layer; and forming a molding layer of a large-area panel covering the semiconductor chips by pressing the panel substrate on which the semiconductor chips are mounted against the granular mold layer. It provides a method for manufacturing a large area panel structure comprising a.

As an exemplary embodiment, the area of the mold transfer tray is 0.25 to 0.5 times the area of the large-area tray.

In order to solve the above problems, the technical idea of the present invention is a large area panel structure manufacturing apparatus for manufacturing a large area panel structure including a panel substrate, semiconductor chips on the panel substrate, and a mold layer covering the semiconductor chips. As a mold supply device; large area tray; a mold transfer tray including a first surface on which a granular mold pattern is formed and rotatably mounted in the through hole of the large area tray; a redistribution tray disposed below the mold transfer tray and having minute holes through which the granular mold constituting the granular mold pattern passes; a carrier disposed below the redistribution tray and having a cavity accommodating a granular mold layer formed by stacking the granular molds passing through the fine holes of the redistribution tray; an inspection device for inspecting uniformity of the granular mold layer in the cavity of the carrier; and a pressing device supporting a panel substrate on which semiconductor chips are mounted and moving the panel substrate so that the semiconductor chips are embedded in the granular mold layer provided in the cavity of the carrier. It provides a manufacturing apparatus for a large area panel structure comprising a.

In an exemplary embodiment, the mold supply device includes a mold storage unit for storing the granular mold, the mold connected to the mold storage unit, and mounting the granular mold delivered from the mold storage unit on a tray stage. A granular mold supply unit including a trough for supplying to the transfer tray; a vibration unit configured to vibrate the mold storage unit; and a weight sensor configured to detect a weight of the mold storage unit. It is characterized in that it includes.

In one exemplary embodiment, the granular mold supply unit provides the granular mold to the mold transfer tray while moving along a predetermined movement trajectory, thereby forming the granular mold pattern on the first surface of the mold transfer tray; The tray stage is characterized in that the mold transfer tray on which the granular mold pattern is formed is transferred to the large-area tray.

According to exemplary embodiments of the present invention, by disposing the mold transfer tray on the large-area tray, it is possible to form a granular mold layer applicable to a large-area panel, and through the granular mold pattern, the large-area panel structure It is possible to prevent flow marks or under-molding, and by forming a uniform granular mold layer through the process of redistribution of granular mold, a large-area panel structure with reduced Total Thickness Variation (TTV) and warpage phenomenon can provide

1 is a flowchart schematically illustrating a manufacturing method of a large area panel structure according to exemplary embodiments of the present invention.
2A to 2F are conceptual diagrams illustrating each step of a method for manufacturing a large-area panel structure.
3A and 3B are top views showing a trajectory in which the relative position of the trough relative to the mold transfer tray moves.
4A is a schematic cross-sectional view of a carrier on which a granular mold layer is formed. 4B is a top view schematically showing a carrier on which a granular mold layer is formed.
5 is a plan view illustrating a manufacturing method of a large-area panel structure further including a step of additionally supplying a granular mold to an outer portion of a mold transfer tray according to an embodiment of the present invention.
6 is a top view illustrating a method of manufacturing a large-area panel structure, further including a step of additionally supplying a granular mold to an outer portion of a mold transfer tray according to an embodiment of the present invention.
7 is a manufacturing method of a large-area panel structure, characterized in that the granular mold supply time to the outer portion of the mold transfer tray is longer than the granular mold supply time to the central portion of the mold transfer tray according to an embodiment of the present invention. is a top view showing
8A is a perspective view illustrating a redistribution tray according to an embodiment of the present invention. 8B is a perspective view illustrating a redistribution tray according to an embodiment of the present invention.
9 is a flowchart schematically illustrating a method of manufacturing a large-area panel structure according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the concept of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the inventive concept may be modified in many different forms, and the scope of the inventive concept should not be construed as being limited due to the embodiments described below. Embodiments of the inventive concept are preferably interpreted as being provided to more completely explain the inventive concept to those with average knowledge in the art. The same sign means the same element throughout. Further, various elements and areas in the drawings are schematically drawn. Accordingly, the inventive concept is not limited by the relative size or spacing drawn in the accompanying drawings.

Terms such as first and second may be used to describe various components, but the components are not limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and conversely, a second element may be termed a first element, without departing from the scope of the inventive concept.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the concept of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the expression "comprises" or "has" is intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features or It should be understood that the presence or addition of a number, operation, component, part, or combination thereof is not precluded.

Unless defined otherwise, all terms used herein, including technical terms and scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the concept of the present invention belongs. In addition, commonly used terms as defined in the dictionary should be interpreted as having a meaning consistent with what they mean in the context of the technology to which they relate, and in an overly formal sense unless explicitly defined herein. It will be understood that it should not be interpreted.

1 is a flowchart schematically illustrating a manufacturing method of a large area panel structure according to exemplary embodiments of the present invention. 2A to 2F are conceptual views illustrating each step of a manufacturing method of a large-area panel structure. 3A and 3B are plan views showing a trajectory in which the relative position of the trough relative to the mold transfer tray moves.

Referring to FIG. 1 , a method of manufacturing a large-area panel structure including a panel substrate 310, semiconductor chips 320, and a molding layer 330 supplies a granular mold P on at least one mold transfer tray. (S110), arranging the mold transfer tray on a large-area tray (S120), passing the granular mold (P) through a redistribution tray to form a granular mold layer (PL) (S130), Checking uniformity of the granular mold layer PL (S140), and forming a molding layer covering the semiconductor chips by pressing a panel substrate on which semiconductor chips are mounted against the granular mold layer PL (S150) can include

Referring to FIGS. 1 and 2A , the mold supply device 100 may supply the granular mold P onto at least one mold transfer tray 210 (S110). The mold supply device 100 includes a trough 110, which is a passage through which the granular mold P is supplied, a mold storage unit 120 for storing the granular mold P before the granular mold P is supplied, and a trough 110, a vibration unit 130 for vibrating the mold storage unit 120, and a weight sensor 140 for measuring the weight of the granular mold P.

The trough 110 serves as a passage for supplying the granular mold P, and the granular mold P stored in the mold storage unit 120 may be supplied to the mold transfer tray 210 through the trough. The trough 110 may include an opening (not shown) for supplying the granular mold P to the mold transfer tray 210 . A part of the trough 110 may be connected to the mold storage unit 120 to receive the granular mold P from the mold storage unit 120 . Although the trough 110 is represented in the shape of a rectangular parallelepiped in FIG. 2a, it is not limited thereto and may have, for example, a cylindrical shape.

The mold storage unit 120 may store the granular mold P. A source supply unit (not shown) may be located above the mold storage unit 120 . When the amount of granular molds P stored in the mold storage unit 120 is insufficient, the source supply unit may supply as many granular molds P as necessary to the mold storage unit 120 .

The vibration unit 130 may vibrate the mold storage unit 120 and the trough 110 to supply the granular mold P to the mold transfer tray 210 . The operation of the vibration unit 130 may be controlled by the control unit 180 . The vibrator 130 may be configured to transmit and receive electrical signals to and from the control unit 180 . The vibration speed of the vibrating unit 130 is controlled by the control unit 180, thereby controlling the vibration speed of the mold storage unit 120 and the trough 110, thereby adjusting the supply speed of the granular mold P. .

The weight sensor 140 may measure the weight of the granular mold P. The weight sensor 140 may measure the sum of the weight of the trough 110, the weight of the mold storage unit 120, and the weight of the granular mold P stored in the mold storage unit 120. Since the weight of the trough 110 and the mold storage unit 120 is constant, subtracting the weight of the trough 110 and the mold storage unit 120 from the weight measured through the weight sensor 140 results in the granular mold P weight can be obtained. For example, the weight sensor 140 may include at least one weight sensor (not shown). The weight sensor 140 is configured to transmit and receive electrical signals to and from the control unit 180, and may be configured to transmit detected weight information to the control unit 180.

A tray stage 150 holding the mold transfer tray 210 may be disposed below the opening included in the trough 110 . The tray stage 150 serves to support the mold transfer tray 210 .

A stage driver 160 for moving the tray stage 150 may be disposed under the tray stage 150 . The stage driving unit 160 may be configured to transmit and receive electrical signals to and from the control unit 180 . Since the stage driver 160 can move the tray stage 150 at an arbitrary speed, the relative position of the trough 110 relative to the mold transfer tray 210 can be moved by the stage driver 160. The tray stage 150 can move in an arbitrary X-axis or Y-axis direction by the stage driving unit 160, and can also move simultaneously in the X-axis and Y-axis directions. The moving speed of the stage driving unit 160 may be controlled by a control signal from the control unit 180, and by controlling the moving speed of the stage driving unit 160, the relative speed of the trough 110 with respect to the mold transfer tray 210 can control.

Transfer units 170 may be disposed on both sidewalls of the tray stage 150 . The transfer unit 170 may place the mold transfer tray 210 on which the supply of the granular mold P is completed on the large-area tray 220 . The transfer unit 170 may be configured to grip and hold the mold transfer tray 210 and transfer the mold transfer tray 210 to the stage driving unit 160 or from the stage driving unit 160 to a target position. The transfer unit 170 is configured to transmit and receive electrical signals to and from the control unit 180, and an operation of the transfer unit 170 may be controlled by the control unit 180.

The mold supply device 100 may include a controller 180 . The controller 180 may control the operation of the mold supply device 100 . For example, the controller 180 may be configured to transmit and receive electrical signals to and from the mold supply device 100, and may control the operation of the mold supply device 100 through this. The control unit 180 may be implemented in hardware, firmware, software, or any combination thereof. For example, the controller 180 may be a computing device such as a workstation computer, desktop computer, laptop computer, or tablet computer. For example, the controller 180 may include a memory device such as a read only memory (ROM) and a random access memory (RAM), and a processor configured to perform predetermined operations and algorithms, such as a microprocessor and a central processing unit (CPU). ), GPU (Graphics Processing Unit), and the like. Also, the controller 180 may include a receiver and a transmitter for receiving and transmitting electrical signals. For example, the control unit 180 may receive an electrical signal from the vibrating unit 130 to adjust the vibration speed, receive the electrical signal from the vibrating unit 130, and provide feedback thereof.

A process in which the mold supply device 100 supplies the granular mold P onto the mold transfer tray 210 will be described.

First, the stage driving unit 160 operated by the control unit 180 is configured to align the trough 110 in the vertical direction (Z direction) with a predetermined starting position 211 (see FIG. 3A) on the mold transfer tray 210. The tray stage 150 is moved.

Next, the weight of the granular mold P stored in the mold storage unit 120 is detected by the weight sensor 140 . If the detected amount of the granular mold P is sufficiently greater than the predetermined reference value, the vibrating unit 130 operated by the control unit 180 vibrates the mold storage unit 120 and the trough 110 so as to be described later. Like the process, the granular mold P is supplied on the mold transfer tray 210 to form a granular mold pattern on the mold transfer tray 210 . If the detected amount of the granular mold P is less than a predetermined reference value, the source supply unit operated by the control unit 180 additionally supplies the granular mold P to the mold storage unit 120 and After that, the vibration unit 130 vibrates the mold storage unit 120 and the trough 110 to supply the granular mold P on the mold transfer tray 210 . Although the mold supply device 100 is shown as including one trough 110 in FIG. 2a, it is not limited thereto and may include two or more troughs 110, in which case the mold supply device 100 may include two The granular mold P may be supplied to the above mold transfer tray 210 at the same time according to the above-described process.

In an exemplary embodiment, the granular mold P may be an epoxy molding compound (EMC), but is not limited thereto. For example, the granular mold (P) is a polyimide or epoxy resin containing a reinforcing material such as an inorganic filler, specifically ABF (Ajinomoto Build-up Film), FR-4 (flame retardant4), BT (Bismaleimide Triazine) etc. may be included. The granular mold P may be, for example, in a solid or powder form, but is not limited thereto.

3A and 3B are plan views illustrating a trajectory in which the relative position of the trough 110 relative to the mold transfer tray 210 moves.

Hereinafter, a method of forming a granular mold pattern on the mold transfer tray 210 by moving the relative position of the trough 110 with respect to the mold transfer tray 210 in S110 will be described with reference to FIGS. 3A and 3B. do.

3A and 3B, the mold transfer tray 210 has a rectangular shape in plan view, and has two edges 212 and 214 parallel to the X-axis direction, and two edges 213 parallel to the Y-axis direction. 215). Two edges 212 and 214 parallel to the X-axis direction may be referred to as long-side edges, respectively, and two edges 213 and 215 parallel to the Y-axis direction may be respectively referred to as short-side edges. Also, the imaginary center line (A-A') may refer to a line passing through the center of the mold transfer tray 210 and passing through two areas of the mold transfer tray 210. For example, the imaginary center line A-A' may be a line connecting centers of the two edges 212 and 214 parallel to the X-axis direction.

Referring to FIG. 3A , in an exemplary embodiment, the relative position first moves from the starting position 211 of the mold transfer tray 210 to the vicinity of the edge 213 of one short side parallel to the X axis, and It moves a certain distance d1 in parallel with the Y-axis toward the edge 214 of the other long side. After that, the relative position moves in parallel with the X-axis to the vicinity of the center line 216 of the long side, and from there it moves in parallel with the Y-axis for a certain distance d2 toward the edge 214 of the other long side. After that, the relative position moves in parallel with the X axis to the vicinity of the edge 213 of one short side, and from there moves a certain distance d3 toward the edge 214 of the other long side in parallel with the Y axis. will do After that, the relative position moves in parallel with the X-axis to the vicinity of the center line 216 of the long side, and from there moves in parallel with the Y-axis for a certain distance d4 toward the edge 214 of the other long side. After that, the relative position moves parallel to the X axis to the vicinity of the edge 213 of one short side, and from there moves a certain distance d5 toward the edge 214 of the other long side in parallel with the Y axis. do. When the relative position moves a certain distance d5 and comes to the vicinity of the edge 214 of the other long side, the relative position moves to the vicinity of the edge 215 of the other short side parallel to the X axis. After that, the relative position moves in parallel with the Y-axis for a certain distance d5 toward the edge 212 on one of the long sides, and moves in parallel with the X-axis to the vicinity of the center line 216 of the long side. From there, the relative position moves in parallel with the Y-axis for a certain distance d4 toward the edge 212 of one long side, and moves in parallel with the X-axis to the vicinity of the edge 215 of the other short side. After that, the relative position moves in parallel with the Y-axis for a certain distance d3 toward the edge 212 of one of the long sides, and moves in parallel with the X-axis to the vicinity of the center line 216 of the long side. From there, the relative position moves parallel to the Y-axis for a certain distance d2 toward the edge 212 of one long side, and moves parallel to the X-axis to the vicinity of the edge 215 of the other short side. After that, the relative position is moved parallel to the Y-axis by a certain distance d1 toward the edge 212 on one of the long sides. When the relative position comes near one of the long side edges 212, the relative position moves in parallel with the X-axis to the starting position 211. The granular molds P supplied through this process may be symmetrical to each other based on the imaginary center line A-A' on the mold transfer tray 210 . Although the movement trajectory of the relative position is shown in FIG. 3A as above, the movement trajectory of the relative position is not limited thereto. For example, although the relative position is shown to move in a straight line in FIG. 3A, it moves from the starting position 211 of the mold transfer tray 210 to the vicinity of the edge 213 of one short side parallel to the X axis, , the moving direction of the relative position can be reversed while moving in the direction in which the short side extends toward the edge 214 of the long side of the other side so as to draw a U at that place. Even in this case, the granular molds P may be symmetrical to each other based on the imaginary center line A-A' on the mold transfer tray 210 .

Immediately after the supply of the granular mold P starts at the starting position 211 of the mold transfer tray 210, the supply speed of the granular mold P does not reach the set value, but returns to the starting position according to the moving trajectory of the relative position ( 211), the amount of the granular mold P is evenly supplied to the entire moving track.

Referring to FIG. 3B, in another embodiment, after the supply of the granular mold P according to the moving trajectory of the relative position shown in FIG. The granular mold P may be additionally supplied in the vicinity of the edge 213 of one short side and the vicinity of the edge 215 of the other short side in the direction toward or in the opposite direction. Even in this case, the granular molds P may be symmetrical to each other based on the imaginary center line A-A' on the mold transfer tray 210 .

When the granular mold P is supplied along the moving trajectory of the relative position shown in FIGS. 3A and 3B, the granular mold layer PL formed in the redistribution process to be described later is different from the case where the granular mold P is randomly supplied. The uniformity of can be further improved. Since the uniformity of the granular mold layer PL is improved, thickness uniformity and warpage of the large-area panel structure may be reduced.

Referring to FIGS. 1 and 2B , the mold transfer tray 210 may be disposed on the large-area tray 220 (S120). The mold transfer tray 210 may be disposed on the large-area tray 220 by the transfer unit ( 170 in FIG. 2A ). The transfer unit 170 may move the mold transfer tray 210 to align the mold transfer tray 210 on the target area within the large area tray 220 in the Z-axis direction. The operation of the transfer unit 170 may be controlled by the control unit 180 . 2B shows that 16 mold transfer trays 210 are disposed on the large-area tray 220, but is not limited thereto, and fewer or more mold transfer trays 210 may be disposed. By disposing a plurality of mold transfer trays 210 on the large-area tray 220, a large-area mold that can be used for a large-area panel structure can be manufactured.

Referring to FIGS. 1 and 2C , the granular mold layer PL may be formed on the carrier 240 by passing the granular mold P through the redistribution tray 230 (S130). In the step of forming the granular mold layer PL (S130), the mold transfer tray 210 is overturned and the granular mold P is lowered toward the redistribution tray 230, and the granular mold is filled by the redistribution tray 230. A step of redistributing (P) to form a uniform granular mold layer (PL) may be included. The large area tray 220 may be composed of a plurality of linear structures (not shown). As at least some of the plurality of linear structures are overturned, the mold transfer tray 210 disposed on the partial linear structure to be overturned among the plurality of mold transfer trays 210 disposed on the large-area tray 220 can be overturned As the mold transfer tray 210 is overturned, the granular mold P on the mold transfer tray 210 may descend (ie, free fall) toward the redistribution tray 230 .

The redistribution tray 230 may be disposed below the large area tray 220 . The redistribution tray 230 may be aligned with the large area tray 220 in the Z direction. When the granular mold P descends, the redistribution tray 230 vibrates up and down in the Z-axis direction to perform sieving. Since the redistribution tray 230 may include a plurality of fine holes H, the descending granular mold P passes through the plurality of fine holes H of the redistribution tray 230, as will be described later. A uniform granular mold layer PL may be formed on one surface of the cavity C to which the release film F is attached. As will be described later, the inspection device 250 can inspect the uniformity of the granular mold layer PL. When the granular mold layer PL is uniform, thickness uniformity and warpage of the large-area panel structure can be reduced.

4A is a schematic cross-sectional view of the carrier 240 on which the granular mold layer PL is formed. 4B is a top view schematically illustrating the carrier 240 on which the granular mold layer PL is formed. Hereinafter, the step of forming the granular mold layer PL on the carrier 240 will be described in detail with reference to FIGS. 2C, 4A, and 4B.

Referring to FIGS. 2C and 4A , a carrier 240 may be disposed below the redistribution tray 230 . The carrier 240 may include an adsorption mechanism (not shown) that sucks air in order to adsorb the release film F. A cavity C may be formed in the carrier 240 . The cavity C may have a rectangular shape in plan view, but is not limited thereto. A release film F may be covered on the surface of the carrier 240 defining the cavity C. The lower surface and both side surfaces of the release film F may contact the carrier 240 . The length of the release film F in the Z direction may be shorter than the length of the region S2 in the carrier 240 in which the cavity C is not formed in the Z direction. The granular mold layer PL may be formed on the release film F by stacking the granular mold P passing through the redistribution tray 230 .

1, 2c, 4a, and 4b again, after forming the granular mold layer PL on the carrier 240, the uniformity of the granular mold layer PL formed on the upper surface of the release film can be confirmed. Yes (S140). In an exemplary embodiment, the uniformity of the granular mold layer PL may be checked through the inspection device 250 . The inspection device 250 may be, for example, a camera. In this case, the inspection device 250 is configured to detect at least four surfaces of the granular mold layer PL, for example, the first region S1, the second region S2, and the third region S3 that are outer edges of the granular mold layer PL. ), and the fourth region S4 or more images, and comparing them with the reference image, it is possible to check the uniformity of the granular mold layer PL. If the uniformity of the granular mold layer PL passes the standard, the forming of the molding layer 330 of the large area panel structure 300 (S150) proceeds, but the uniformity of the granular mold layer PL does not pass the standard. If not, it is discarded and the step of supplying the granular mold P on the at least one mold transfer tray 210 starts again from step S110. By performing step S150, the large-area panel structure 300 with reduced thickness uniformity and warpage can be manufactured.

Referring to FIGS. 1 and 2D to 2F , the molding layer 330 of the large-area panel structure 300 is formed by pressing the panel substrate 310 on which semiconductor chips are mounted to the granular mold layer PL. It can (S150). The step of forming the molding layer 330 (S150) is the step of disposing the panel substrate 310 on which the semiconductor chips are mounted on the granular mold layer PL (S151), and the panel substrate 310 on which the semiconductor chips are mounted. A step of forming the molding layer 330 by pressing the granular mold layer PL (S153) and removing the carrier 240 and the release film (S153) may be included.

In step S151 , the prepared panel substrate 310 may be a substrate for a panel level fan-out semiconductor package. A plurality of semiconductor chips 320 may be mounted on the mounting surface of the panel substrate. The length of the panel substrate 310 in the X direction may be equal to or shorter than the length of the X direction of the region S1 where the granular mold layer PL is formed.

A plurality of semiconductor chips 320 may be disposed on the panel substrate 310 . The plurality of semiconductor chips 320 may include a plurality of individual devices of various types. For example, the plurality of individual elements include various microscopic elements, for example, MOSFETs such as CMOS transistors, image sensors such as CMOS imaging sensors (CIS), micro-electro-mechanical systems (MEMS), active elements, passive elements, etc. can include

The panel substrate 310 may be disposed to be aligned with the granular mold layer PL in the Z direction on the region S1 of the carrier 240 where the granular mold layer PL is formed. The panel substrate 310 may be disposed so that a mounting surface on which the plurality of semiconductor chips 320 disposed on the panel substrate 310 are mounted faces the granular mold layer PL.

In step S153, the semiconductor chips 320 mounted on the panel substrate 310 may be lowered toward Z "?" by the pressing device 260 so as to be buried in the granular mold layer PL. Semiconductor chips 320 When positioned to be embedded in the granular mold layer PL, the granular mold layer PL may be pressed using the press device 260, and appropriate heat may be applied to the granular mold layer PL. As appropriate pressure and heat are applied to the PL, a molding layer 330 covering the plurality of chips 320 and the panel substrate 310 may be formed. It may cover the lower surface (ie, the mounting surface of the panel substrate 310 on which the semiconductor chips 320 are mounted), and may cover the sidewall and lower surface of each of the plurality of chips 320. The plurality of semiconductor chips 320 may be placed in a granular mold. Since the pressure is uniformly applied in the direction toward the layer PL, warpage and total thickness variation (TTV) of the large-area panel structure 300 may be reduced.

In step S155 , after forming the molding layer 330 of the large area panel structure 300 , the carrier 240 and the release film on the carrier may be removed.

5 is a plan view illustrating a method for manufacturing a large-area panel structure, which further includes supplying a granular mold to an outer portion of a mold transfer tray according to an embodiment of the present invention. In FIG. 5 , arrows indicate paths through which the granular mold P is additionally supplied.

Referring to FIG. 5 , in an exemplary embodiment, after the first granular mold pattern PA1 is formed on the mold transfer tray 210 through the first granular mold pattern forming process, the second granular mold pattern forming process is performed. can be done For example, as described in FIG. 3A , a second granular mold pattern forming process is performed on the mold transfer tray 210 on which the first granular mold pattern PA1 is formed through the first granular mold pattern forming process. The secondary granular mold pattern PA2 can be formed. After the granular mold P is supplied on the mold transfer tray 210 according to the movement trajectory of the relative position shown in FIG. 3A, the granular mold P is additionally supplied in an L shape to the outer portion of the mold transfer tray 210. As a result, the secondary granular mold pattern PA2 may be formed. However, it is not limited thereto, and after the granular mold P is supplied according to the moving trajectory of the relative position according to FIG. 3B, the granular mold P may be additionally supplied. Since the outer portion of the mold transfer tray 210 may have a smaller supply amount of the granular mold P due to the direction change than the inner area of the mold transfer tray 210, by additionally supplying the granular mold P to the outer portion, It can solve the non-molding problem of the outer part and reduce the thickness uniformity. The controller 180 may additionally supply the granular mold P to the outer portion of the mold transfer tray 210 by controlling the operation of the mold supply device 100 . Additional supply of the granular mold P may be performed by slowing the moving speed of the relative position in the outer portion or by increasing the amount of the granular mold P supplied from the outer portion. 5, it is shown that the mold supply device 100 additionally supplies the granular mold P in an L shape to the outer portion of the mold transfer tray 210 through the two troughs 110, but is not limited thereto. For example, the mold supply device 100 may supply the granular mold P to the outer portion of the mold transfer tray 210 through the four troughs 110 .

6 is a top view illustrating a method for manufacturing a large-area panel structure, which further includes a step of additionally supplying a granular mold to an outer portion of a mold transfer tray according to an embodiment of the present invention. In FIG. 6, an arrow indicates a path through which the granular mold P is additionally supplied.

Referring to FIG. 6 , in an exemplary embodiment, after the first granular mold pattern PA3 is formed on the mold transfer tray 210 through the first granular mold pattern forming process, the second granular mold pattern forming process is performed. can be done For example, as described in FIG. 3A , a second granular mold pattern forming process is performed on the mold transfer tray 210 on which the first granular mold pattern PA3 is formed through the first granular mold pattern forming process. The secondary granular mold pattern PA4 can be formed. After the granular mold P is supplied on the mold transfer tray 210 according to the moving trajectory of the relative position shown in FIG. 3A, the granular mold P is additionally supplied in a U shape to the outer portion of the mold transfer tray 210. As a result, the secondary granular mold pattern PA4 may be formed. Since the outer portion of the mold transfer tray 210 may have a smaller supply amount of the granular mold P due to the direction change than the inner area of the mold transfer tray 210, by additionally supplying the granular mold P to the outer portion, It can solve the non-molding problem of the outer part and reduce the thickness uniformity. The controller 180 may additionally supply the granular mold P to the outer portion of the mold transfer tray 210 by controlling the operation of the mold supply device 100 . Additional supply of the granular mold P may be performed by slowing the moving speed of the relative position in the outer portion or by increasing the amount of the granular mold P supplied from the outer portion. 6, the mold supply device 100 is shown as additionally supplying the granular mold P in a U shape to the outer portion of the mold transfer tray 210 through the two troughs 110, but is not limited thereto. For example, the mold supply device 100 may supply the granular mold P to the outer portion of the mold transfer tray 210 through the four troughs 110 .

7 is a method for manufacturing a large-area panel structure, characterized in that the granular mold supply time to the outer portion of the mold transfer tray is longer than the granular mold supply time to the central portion of the mold transfer tray according to an embodiment of the present invention. It is a top view showing The marked region is the outer region, and means a region where the supply time of the granular mold P is longer.

Referring to FIG. 7 , in an exemplary embodiment, in the process of supplying the granular mold P on the mold transfer tray 210 through the mold supply device 100, the outer portion of the mold transfer tray 210 The supply time of the granular mold P may be longer than the supply time of the granular mold P to the center of the mold transfer tray 230 . This can be achieved by the stage driving unit 160 controlled by the controller 180 slowing the relative positioning speed at the outer part of the mold transfer tray 210 than the relative positioning speed at the center of the mold transfer tray 210 . Since the outer portion of the mold transfer tray 210 may have a smaller supply amount of the granular mold P due to the change in direction compared to the inner area of the mold transfer tray 210, the supply time of the granular mold P for the outer portion is reduced to the central portion. By making the granular mold (P) supply time longer than the supply time for the granular mold (P) can be further supplied to the outer portion. Through this, it is possible to solve the non-molding problem of the outer portion and reduce the thickness uniformity.

8A is a perspective view illustrating a redistribution tray 230b according to an embodiment of the present invention. 8B is a perspective view illustrating a redistribution tray 230c according to an embodiment of the present invention.

Referring to FIG. 8A , in an exemplary embodiment, the area of the redistribution tray 230b may be larger than the area of the large area tray 220 . When the redistribution tray 230 and the large-area tray 220 have the same area, the outer portion of the redistribution tray 230 has fewer fine holes than the center portion of the redistribution tray 230 having the same area, so the redistribution tray 230 ) The amount of the granular mold P passing through the outer portion of the redistribution tray 230 is smaller than the amount of the granular mold P passing through the center of the redistribution tray 230, so that the outer portion of the large area panel structure 300 is unmolded and the molding layer 330 thickness uniformity can be increased. On the other hand, when the area of the redistribution tray 230b is larger than the area of the large area tray 220, since all of the falling granular molds P pass through the center of the redistribution tray 230, the size of the large area panel structure 300 It is possible to prevent the outer portion from being unmolded, and the thickness uniformity of the molding layer 330 can also be reduced.

The plurality of micro-holes H of the redistribution tray 230b may be circular. However, it is not limited thereto, and for example, the plurality of micro-holes H of the redistribution tray 230b may have a polygonal shape such as a square.

According to FIG. 8B , in an exemplary embodiment, the outer micro-holes H2 of the redistribution tray 230c may be larger than the central micro-holes H1. When the micro-holes H2 at the outer portion of the redistribution tray 230 are equal to or smaller than the micro-holes H1 at the center of the redistribution tray 230, the amount of the granular mold P passing through the outer portion of the redistribution tray 230 When the amount of the granular mold P passing through the center of the redistribution tray 230 is less, the outer portion of the large-area panel structure 300 is unformed, and the thickness uniformity of the molding layer 330 can be increased. By making the outer microholes H2 of the redistribution tray 230c larger than the central microholes H1 of the redistribution tray 230c, the amount of the granular mold P passing through the outer portion is increased, and the large-area panel structure It is possible to prevent the outer portion of the 300 from being unmolded, and the thickness uniformity of the molding layer 330 can also be reduced.

The plurality of micro-holes H1 and H2 of the redistribution tray 230c may be circular. However, it is not limited thereto, and for example, the plurality of micro-holes H1 and H2 of the redistribution tray 230c may have a polygonal shape such as a square.

9 is a flowchart schematically illustrating a method (S200) of manufacturing a large-area panel structure according to an embodiment of the present invention. Since steps S230, S240, and S250 are the same as steps S130, S140, and S150 described with reference to FIG. 1, hereinafter, steps S210 and S220 will be mainly described.

Referring to FIGS. 2A and 9 , a granular mold P may be supplied on one mold transfer tray 210 (S210). The granular mold P may be supplied onto one mold transfer tray 210 in the same way as described above with reference to FIGS. 3A and 3B. In some embodiments, in step S210 , the granular mold P may be supplied to one mold transfer tray 210 a plurality of times. For example, in step S210 , the granular molds P may be supplied to one mold transfer tray 210 eight times, so that eight granular mold patterns may be formed on one mold transfer tray 210 . In some embodiments, one mold transfer tray 210 used in step S210 may have a larger area than the mold transfer tray 210 used in step S110, but is not limited thereto. In some embodiments, granular molds P may be additionally supplied to both ends of each granular mold pattern formed on one mold transfer tray 210 . For example, when four granular mold patterns are formed on one mold transfer tray 210, granular molds P may be additionally supplied to both ends of each granular mold pattern. In some embodiments, a granular mold P may be additionally supplied to an outer portion of each granular mold pattern formed on one mold transfer tray 210 . In some embodiments, after the granular mold P is supplied on one mold transfer tray 210 , the granular mold P may be additionally supplied in an L or U shape. In some embodiments, the supply time of the granular mold P at the outer portion of each granular mold pattern formed on one mold transfer tray 210 is longer than the supply time of the granular mold P at the center of each granular mold pattern. could be longer In some embodiments, the area of the mold transfer tray 210 may be about 0.25 times to about 0.5 times the area of the large area tray 220, but is not limited thereto.

The granular mold P may be supplied from one mold transfer tray 210 on which a plurality of granular mold patterns are formed to the large-area tray 220 (S220).

First, one mold transfer tray 210 on which a plurality of granular mold patterns are formed may be moved onto the large-area tray 220 by the transfer unit 170 . One mold transfer tray 210 moved onto the large-area tray 220 may supply the granular mold P onto the large-area tray 220 . For example, one mold transfer tray 210 may be formed of a plurality of rotatable linear structures, and at least some of the plurality of linear structures may rotate to supply the granular mold P onto the large-area tray 220 . However, it is not limited thereto.

In some embodiments, steps S210 and S220 may be performed a plurality of times so that the granular mold P may be supplied to the entire large area tray 220 . For example, when four granular mold patterns are formed on one mold transfer tray 210 in step S210, steps S210 and S220 are performed in order to supply the granular mold P to the entire large area tray 220. It can be done once, but is not limited thereto.

As above, exemplary embodiments have been disclosed in the drawings and specifications. Embodiments have been described using specific terms in this specification, but they are only used for the purpose of explaining the technical spirit of the present disclosure, and are not used to limit the scope of the present disclosure described in the meaning or claims. Therefore, those of ordinary skill in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical scope of protection of the present disclosure should be determined by the technical spirit of the appended claims.

100: mold supply device 110: trough
120: mold storage unit 130: vibration unit
140: weight sensor 150: tray stage
160: stage driving unit 170: transfer unit
180: control unit 210: mold transfer tray
220: large area tray 230: redistribution tray
240: carrier 250: inspection device
260: pressurizing device 300: large area panel structure
310: panel substrate 320: semiconductor chip
330: molding layer P: granular mold

Claims (14)

supplying a granular mold onto at least one mold transfer tray;
placing the mold transfer tray on a large area tray;
forming a granular mold layer on a carrier by passing the granular mold through a redistribution tray;
checking the uniformity of the granular mold layer; and
forming a molding layer of a large-area panel covering the semiconductor chips by pressing the panel substrate on which the semiconductor chips are mounted against the granular mold layer;
Method of manufacturing a large area panel structure comprising a. According to claim 1,
The supply of the granular mold is carried out along a movement path from a single starting position on the mold transfer tray back to the starting position, the moving path dividing the mold transfer tray into two areas symmetrical about an imaginary center line. A method of manufacturing a large-area panel structure, characterized in that it is symmetrical with respect to the center line when folded, and is bent a plurality of times in each of the two regions. According to claim 2,
The manufacturing method of the large-area panel structure, characterized in that it further comprises the step of additionally supplying a granular mold to both end sides of the mold transfer tray. According to claim 1,
The manufacturing method of the large-area panel structure, characterized in that it further comprises the step of additionally supplying the granular mold to the outer portion of the mold transfer tray. According to claim 4,
The method of manufacturing a large-area panel structure, characterized in that the granular mold is additionally supplied in an L or U shape. According to claim 1,
The manufacturing method of the large-area panel structure, characterized in that the granular mold supply time to the outer portion of the mold transfer tray is longer than the granular mold supply time to the central portion of the mold transfer tray. According to claim 1,
The method of manufacturing a large area panel structure, characterized in that the area of the redistribution tray is larger than the area of the large area tray. According to claim 1,
The method of manufacturing a large-area panel structure, characterized in that the fine holes of the redistribution tray are circular. According to claim 1,
The method of manufacturing a large-area panel structure, characterized in that the size of the fine holes at the outer portion of the redistribution tray is larger than the size of the fine holes at the center of the redistribution tray. supplying granular molds on one mold transfer tray;
supplying the granular mold from the mold transfer tray onto a large-area tray;
forming a granular mold layer on a carrier by passing the granular mold through a redistribution tray;
checking the uniformity of the granular mold layer; and
forming a molding layer of a large-area panel covering the semiconductor chips by pressing the panel substrate on which the semiconductor chips are mounted against the granular mold layer;
Method of manufacturing a large area panel structure comprising a. According to claim 10,
The method of manufacturing a large-area panel structure, characterized in that the area of the mold transfer tray is 0.25 to 0.5 times the area of the large-area tray. A large-area panel structure manufacturing apparatus for manufacturing a large-area panel structure including a panel substrate, semiconductor chips on the panel substrate, and a mold layer covering the semiconductor chips, comprising:
mold feeding device;
large area tray;
a mold transfer tray including a first surface on which a granular mold pattern is formed and rotatably mounted on the large-area tray;
a redistribution tray disposed below the mold transfer tray and having minute holes through which the granular mold constituting the granular mold pattern passes;
a carrier disposed below the redistribution tray and having a cavity accommodating a granular mold layer formed by stacking the granular molds passing through the fine holes of the redistribution tray;
an inspection device for inspecting uniformity of the granular mold layer in the cavity of the carrier; and
a pressing device that supports a panel substrate on which semiconductor chips are mounted and moves the panel substrate so that the semiconductor chips are embedded in the granular mold layer provided in the cavity of the carrier;
Manufacturing apparatus of a large area panel structure comprising a. According to claim 12,
The mold supply device,
a granular mold supply unit including a mold storage unit for storing the granular mold, and a trough connected to the mold storage unit and supplying the granular mold delivered from the mold storage unit to the mold transfer tray mounted on a tray stage;
a vibration unit configured to vibrate the mold storage unit; and
a weight sensor configured to detect a weight of the mold storage unit;
Manufacturing apparatus of a large area panel structure comprising a. According to claim 13,
the granular mold supply unit provides the granular mold to the mold transfer tray while moving along a predetermined movement trajectory to form the granular mold pattern on the first surface of the mold transfer tray;
wherein the tray stage transfers the mold transfer tray on which the granular mold pattern is formed to the large-area tray.

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