KR101726899B1 - Substrate-bonding device and method - Google Patents

Abstract

There is provided an apparatus for bonding a first substrate having a wiring electrode pattern formed on its surface and a second substrate having a wiring electrode pattern on its surface so as to face each other with the wiring electrode patterns facing each other, And means for bending the second substrate while holding the second substrate so that the first substrate or the second substrate coated with the curable resin is brought close to each other and the second substrate is pressed toward the first substrate And means for bonding the substrate. An apparatus and a method for bonding a plurality of wiring electrode patterns to each other by increasing a contact area of opposing wiring electrode patterns with respect to the entire surface of a substrate having a relatively large area on which a wiring electrode pattern is formed while suppressing the application amount of the curable resin to a minimum, to provide.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate joining apparatus,

The present invention relates to a substrate joining apparatus and method for joining a substrate on which a wiring electrode pattern is formed to each other by using a curable resin.

BACKGROUND ART An apparatus and a method for mounting a semiconductor chip or a substrate on which an electronic circuit is formed on a substrate having a wiring electrode pattern formed on its surface are widely used. In recent years, sufficient strength can not be ensured only by soldering of the electrode joint portions in accordance with the narrow pitch of the wiring electrode patterns on the semiconductor chip or the substrate. Therefore, the curable resin flows into the periphery of the joint portion, An underfill method for improving the bonding strength is used.

The width of the wiring electrode pattern is progressively narrowed and a high mounting accuracy is required. On the other hand, the semiconductor chip and the substrate are made larger and larger, and a relatively large area substrate is mounted on the substrate.

When the substrate is bonded onto the substrate, the material and thickness of each substrate and the thermal history at the manufacturing step are different. Therefore, when the substrate is warped due to the temperature change, the warping state is different. An external force (hereinafter, stress) is applied. Stress is repeatedly applied to the wiring pattern on the substrate or in the inside of the substrate, thereby leading to a failure of the product, such as heat insulation and breakage of the wiring, peeling of the bonding surface, and the like.

Bonding of the substrates by the curable resin such as the underfill method is an effective technique for solving the problem in which the warpage state of each substrate is different due to the temperature change and can prevent the product from failing.

BACKGROUND ART [0002] Conventionally, an apparatus and a method for bonding a substrate by pressing a substrate with a curable resin applied to a bonding portion and its periphery have been used. In the case where the second substrate is bonded onto the first substrate coated with the curable resin, if air bubbles (hereinafter referred to as voids) are mixed between the substrates when at least one surface of the substrate has a bending or the like There is a case. Since the voids mixed in are surrounded by the curable resin having a high viscosity around the periphery, it is difficult to completely remove the void even if the substrate is pressed.

The term " curable resin " as used herein refers to a resin that maintains fluidity at room temperature but retains flowability before being irradiated with heat, such as thermosetting resin or ultraviolet light, Or a photo-curable resin, and means a resin having a property of being fluidized at first but hardening by physical change or chemical reaction.

When the voids are mixed, a chemical reaction occurs between the electrode and nitrogen, oxygen, water, impurities contained in the void, and the electrode is corroded. In addition, when the voids are mixed, the degree of deformation of the substrate is different because the thermal expansion coefficient is different between the substrate material and the void portion when a temperature change of the substrate occurs. The difference in degree of deformation of the substrate due to the temperature change causes stress on the wiring electrode pattern on the substrate or on the bonding surface between the substrates. When the stress is generated, the product is connected to a fault such as heat insulation or breakage of the wiring, peeling of the bonding surface, or the like.

Therefore, it is necessary to prevent the incorporation of voids when joining the substrates to prevent the product from failing.

According to Patent Document 1, a method of bonding a protective substrate with a curable resin to an organic EL element formation substrate using a plurality of retainers is disclosed. According to this method, it is possible to form a junction that is less likely to generate bubbles, and the film thickness of the curable resin becomes uniform to a predetermined thickness.

According to Patent Document 2, there is disclosed a manufacturing method of an EL display device in which a substrate is bent in a convex shape to be brought into contact with a resin adhesive, and then the substrate is returned to a flat shape continuously from the top of the convex surface toward the peripheral region. According to this method, the entire surface can be bonded without causing the bubbles to curl up.

Japanese Patent Application Laid-Open No. 2005-317273 Japanese Patent Application Laid-Open No. 11-283739

When interrupting the wiring electrode pattern formed on the surface of one substrate and the outside air as in the case of the substrate of the organic EL, it is preferable to focus on prevention of mixing of the voids when the substrate is bonded. Therefore, a large number of curable resins can be used for joining the substrates, and it is also easy to prevent the incorporation of voids.

However, when the substrates on which the wiring electrode patterns are formed are bonded to each other, it is necessary to ensure that all the wiring electrode patterns on the opposing substrate are in contact with each other, and it is preferable to increase the contact area of the wiring electrode patterns. Therefore, it is not preferable to use a large amount of the curable resin, which is an insulating material, because it may lead to a contact failure.

If the substrates having curved surfaces are bonded to each other, the curable resin, which is an insulating material, remains between the opposing wiring electrode patterns, which interferes with the electric conduction between the opposing electrodes, thereby increasing the possibility that the substrates will not operate normally. Therefore, in the case of joining substrates having curved surfaces to each other, it is necessary to perform joining while appropriately removing the curable resin while preventing entry of voids.

In addition, in order to prevent the incorporation of voids, when a large amount of curable resin as an insulating material is used to firmly adhere the wiring electrode patterns to each other, it is necessary to press the substrates with considerable force or to increase the pressing time. If the pressing pressure is increased, more compressive stress is applied to the substrate than necessary, and cracks may occur in the substrate or the wiring electrode pattern. If the pressing time is increased, the number of sheets that can be processed in a predetermined time is reduced, and the productivity is lowered.

It is necessary to sufficiently consider not only the prevention of the mixing of voids but also the method of repressurization. In the case of pressing by a plurality of retaining supporters, a uniform load is not applied to the entire substrate, and the contact area varies. Further, in the holding mechanism that only holds the periphery, the load at the center portion is insufficient, so that the contact area can not be increased, and the weight of the peripheral portion is increased, which may lead to breakage of the substrate.

First, there is a method in which a void-free bonding is performed first, and then a repressurization is performed in another step. However, if the applied load is released once, the curable resin enters between the electrodes at that time and the curable resin can be completely removed And the like.

Therefore, in the prior art, it is very difficult to bond the substrates on which the wiring electrode patterns are formed, while preventing the voids from being mixed.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to increase the contact area of opposing wiring electrode patterns with respect to the entire surface of a relatively large area of the substrate on which the wiring electrode pattern is formed while suppressing the incorporation of voids while minimizing the application amount of the curable resin And to provide an apparatus and a method for joining the same.

In order to solve the above-mentioned problems,

There is provided an apparatus for bonding a first substrate on which a wiring electrode pattern is formed on a surface thereof and a second substrate having a wiring electrode pattern on the surface thereof with the wiring electrode patterns mutually opposed to each other,
And a balloon head portion having a container structure in which an inner portion is an air chamber, wherein the balloon head portion has an elastic body provided so as to close the opening portion of the housing,

And an elastic body of the balloon head portion includes means for holding the second substrate,
The balloon head portion is connected to an air chamber communication port connected to pressure adjusting means for adjusting the pressure of the air chamber inside the housing,

And means for deforming the surface of the elastic body of the balloon head portion to warp the second substrate while holding the second substrate,

Wherein at least one of the first substrate and the second substrate is coated with a curable resin,

And means for bringing the first substrate and the second substrate close to each other,

Wherein the balloon head portion has a structure for pressing the second substrate toward the first substrate by a pressure applied to the surface of the elastic body of the housing.

According to a second aspect of the present invention,

And board deforming means for deforming the surface of the elastic body to bend the second board while holding the second board in the balloon head portion,
And a surface of the elastic body is deformed by adjusting a pressure of the air chamber,

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And the second substrate is made to conform to the surface shape of the first substrate when the second substrate is pressed against the first substrate.

According to a third aspect of the present invention,

The bonding apparatus for a substrate according to claim 1 or 2, wherein the curing resin is cured in a state in which the second substrate is pressed onto the first substrate.

According to a fourth aspect of the present invention,

There is provided a method of joining a first substrate having a wiring electrode pattern on its surface and a second substrate having a wiring electrode pattern on its surface by mutually opposing the wiring electrode patterns to each other,
A balloon head portion having a container structure having an inner air chamber and an elastic body provided so as to close an opening of the housing,

Holding the second substrate with the surface of the elastic body of the balloon head portion;

And deforming the surface of the elastic body of the balloon head portion so as to bend the second substrate while holding the second substrate,

Wherein at least one of the first substrate and the second substrate is coated with a curable resin,

A step of bringing the first substrate and the second substrate close;

Bonding the second substrate and the first substrate while keeping the second substrate to conform to the surface shape of the first substrate;

And pressing the second substrate toward the first substrate by a pressure applied to the surface of the elastic body of the housing of the balloon head portion.

According to a fifth aspect of the present invention,

And a step of curing the curable resin in a state in which the second substrate is pressed onto the first substrate.

According to a sixth aspect of the present invention,

A substrate joining head for joining a second substrate to a first substrate,
And a balloon head portion having a container structure in which an inner portion is an air chamber, wherein the balloon head portion has an elastic body provided so as to close the opening portion of the housing,
And an air chamber communication port for adjusting the pressure in the air chamber is connected to the housing,

And the elastic body has means for holding the second substrate by using the surface of the elastic body,

And means for deforming the surface holding the second substrate and for bending the second substrate.

According to a seventh aspect of the present invention,

Wherein the air chamber is provided with substrate deforming means for deforming the surface holding the second substrate,

The substrate bonding head according to claim 6, wherein the substrate holding head has a structure in which the surface holding the second substrate is deformed to warp the second substrate.

According to an eighth aspect of the present invention,

The air chamber communication port is connected to a means for controlling the pressure in the air chamber,

The substrate bonding head according to claim 6, wherein the substrate bonding head has a structure in which the pressure in the air chamber is adjusted and the surface of the elastic body holding the second substrate is deformed to warp the second substrate.

According to a ninth aspect of the present invention,

And has a structure capable of applying an equal load to the second substrate by making the second substrate conform to the surface shape of the first substrate when the second substrate is pressed against the first substrate Is the substrate bonding head according to any one of claims 6 to 8.

By using the apparatus and method for bonding a substrate of the present invention, substrates having wiring electrode patterns on their surfaces are bonded to each other through a curable resin, thereby preventing the voids from being mixed, It becomes possible to increase the contact area. As a result, the reliability of the conduction of the wiring is improved, and the failure of the product due to the conduction failure can be prevented.

1 is a perspective view showing an example of an embodiment of the present invention.
2 is a front view of a main component device showing an example of an embodiment of the present invention.
3 is a system configuration diagram showing an example of an embodiment of the present invention.
4 is a flowchart showing a procedure of substrate bonding according to an embodiment of the present invention.
5 (a) to 5 (e) are sectional views of a head at the time of substrate bonding according to the embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Device Configuration]

1 is a perspective view showing an example of an embodiment of the present invention.

2 is a front view of a main component device showing an example of an embodiment of the present invention.

In each drawing, three axes of the orthogonal coordinate system are X, Y and Z, and the XY plane is a horizontal plane and the Z direction is a vertical direction. In particular, the direction of the arrow Z is upward in the direction of the arrow, and the reverse direction is expressed in the downward direction.

The substrate joining apparatus 1 includes a stage 2, a head 3, a tray conveying unit 4, a coating unit 5, a hardening unit 6, (7), and a control unit (9).

The stage unit 2 includes an X1-axis stage 21 provided on the apparatus base 20 of the substrate joining apparatus 1 and a first substrate mounting table 22 provided on the X1-axis stage 21 Consists of. The X1-axis stage 21 can move the first substrate mounting table 22 in the X direction.

On the first substrate mounting table 22, a carrier 60 for mounting the first substrate 11 can be mounted. The carrier 60 is a member of a frame or a plate structure, which is used for handling the first substrate 11. The carrier 60 may have various shapes such as one for the first substrate 11 and one for the plurality of the first substrates 11. The carrier 60 may have various sizes and dimensions So that the first substrate 11 can be handled as a substrate having the same dimensions.

The carrier 60 is mounted on the first substrate mounting table 22 and held so as not to be displaced even when an external force is applied. As a holding method, a flat surface is brought into contact with each other to form a groove or a hole in advance, and the groove or hole is communicated with a vacuum source, A method of forming a groove, a hole, or protrusion in advance in the carrier 60, holding the corresponding protrusion, groove or hole of the carrier 60, or holding it by vacuum suction after the fitting.

Since the stage unit 2 has the above-described apparatus structure, the first substrate 11 can be loaded on the substrate mounting table using the carrier 60 and moved in the X direction.

The head 3 includes a Y1-axis stage 33 provided on a structure of a door-like structure composed of a column 31 and a beam 32 installed on the apparatus base 20, Axis motor 36 provided on the head up-and-down moving mechanism 34 and a balloon head portion 7 provided on the?

The Y1-axis stage 33 is capable of moving the head up-and-down moving mechanism 34 loaded thereon in the Y-direction. The motor 35 is mounted on the head up-and-down moving mechanism 34 so that the? -Axis motor 36 and the balloon head portion 7 can be moved in the Z direction.

The? -Axis motor 36 is also capable of rotating the balloon head 7 in the? Direction.

The tray transfer section 4 includes an X2 axis stage 41 provided on the apparatus base 40, a second substrate mounting table 42 mounted on the X2 axis stage 41, A beam 44 installed on the strut 43, a Y2-axis stage 45 provided on the beam 44, a Z2-axis stage 46 mounted on the Y2-axis stage 45, And a hand portion 47 mounted on the Z2-axis stage 46. The hand portion 47 is mounted on the Z2-

The X2-axis stage 41 can move the second substrate mounting table 42 in the X direction. The Y2-axis stage 45 can move the Z2-axis stage 46 in the Y direction. The Z2-axis stage 46 can move the hand portion 47 in the Z direction.

On the second substrate mounting table 42, a tray 48 for arranging the second substrates 12 side by side can be mounted. The tray 48 has a structure in which a plurality of second substrates 12 are arranged and the trays 48 are stacked in several layers so that they can be handled at one time.

The tray 48 is stacked on the second substrate mounting table 42 and held so as not to be displaced even when an external force is applied. As a holding method, there is a method in which flat surfaces are brought into contact with each other, grooves or holes are formed in advance at the contacting portions, the grooves or holes are communicated with a vacuum source, A method of forming a groove, a hole, or protrusion in advance in the tray 48, and fitting a protrusion, a groove, or a hole of the tray 48 corresponding thereto, or holding it by vacuum suction after the fitting.

The second substrate 12 is loaded on the substrate mounting table using the tray 48 and moved in the X direction and the hand portion 47 is moved to the Y Direction and the Z direction, so that the second substrate 12 can be picked up.

The second substrate 12 picked up by the hand portion 47 of the tray conveyance unit 4 can be installed. Further, the mounting cage 26 is arranged so as to be able to pick up the second substrate 12a, which has been installed thereon, at the tip end portion of the balloon head portion 7.

The upper surface of the mounting claw 26 is substantially flat and has a plurality of holes or grooves formed on its surface. Since the hole or groove communicates with the vacuum source through the valve, the second substrate 12a can be adsorbed and held at a negative pressure. The second substrate 12a which is installed is attracted and held by the negative pressure so that it is possible to prevent the second substrate 12a from slipping off from the upper surface of the mounting claw 26 while being mounted on the mobile 47 by the hand 47 or while being mounted on the cage 26 none.

The coating unit 5 includes a Z axis stage 51 provided on the Y1 axis stage 33 of the head part 3 and a dispenser 53 provided on the Z axis stage 51 . A motor 52 is mounted on the Z axis stage 51 so that the dispenser 53 can move in the Z direction. Since the Z-axis stage 51 can be moved in the Y direction, the dispenser 53 can be moved to any position in the Y and Z directions.

The dispenser 53 includes a syringe for filling the curable resin 55, a piston for extruding the filled curable resin 55, and a piston for pressing the curable resin 55 to a predetermined position on the first substrate 11 Needle part.

As the curable resin 55, a resin such as epoxy, phenol, melamine, polyester, polyurethane, polyimide, etc., or a resin obtained by adding a curing agent to the resin can be cited.

The components of the curable resin 55 and the coating conditions such as the viscosity and the application amount are appropriately set according to the strength after desired curing and the area of the second substrate 12 to be bonded.

When the curing resin 55 in the syringe is removed, it is supplemented appropriately. At the time of replenishment, it is possible to prevent the generation of voids in the syringe by switching the valves of the delivery line and supplying them by pressure feeding. Further, by performing the defoaming treatment in advance of the curable resin 55 to be applied, generation of voids after coating can be prevented.

In the embodiment shown in Fig. 1, the head 3 and the coating unit 5 are juxtaposed on the Y1-axis stage 33, but a stage capable of moving in the Y direction is provided, The head portion 3 and the coating unit portion 5 may be mounted on different Y-direction moving means by providing the head portion 5 and the Y-direction moving means.

The head unit 3 may be provided with the coating unit 5 so that the head unit 3 and the coating unit 5 move integrally in the Y direction.

The control unit 9 includes an information input means 91, an information output means 92 and a detecting means 93 and is structured to be capable of exchanging information with the outside.

Fig. 2 is a front view of the main device according to the embodiment of the present invention. Fig. The hardening unit 6 is disposed on the X1-axis stage 21 below the first substrate mounting table 22. The curing unit 6 may be irradiated with a light beam having a predetermined wavelength, such as an ultraviolet ray irradiation unit for irradiating ultraviolet rays such as a UV lamp or an infrared ray irradiation unit for irradiating infrared rays such as an infrared ray heater have. The hardened resin 55 absorbs the light beam irradiated from the hardening unit 6 and starts hardening.

The second substrate 12b held at the tip end of the balloon head portion 7 in the head portion 3 is attached to the first substrate 11 because the bonding apparatus 1 of the substrate has the above- And the second substrate 12b is pressed toward the first substrate 11. In order to cure the curable resin in this state, ultraviolet rays may be irradiated or heated. The detailed structure of the balloon head 7 will be described later.

The first substrate mounting table 22 is structured to include a frame with a center portion cut off. Therefore, the portion where the second substrate 12 is bonded on the first substrate 11 is structured such that the energy 61 irradiated from the hardening unit 6 is transmitted and irradiated. The cut-away portion may be used not only in the case of a simple space but also in combination of a lattice shape or a mesh reinforcing member, a transparent material, or the like through which the energy 61 can be substantially transmitted.

The carrier 60 may have a structure in which an outer frame and a glass material transparent to the inner side are combined, or a structure in which an outer frame and a lattice-like member are combined inside thereof.

The carrier 60 has a structure in which a sufficient reaction force is generated with respect to the pressure from the head portion 3 although the carrier 60 takes various forms depending on the dimensions and thickness of the first substrate 11 and the layout on which the second substrate is attached. It may be a material or a structure through which the energy 61 irradiated from the curing unit 6 is transmitted.

3, the control unit 9 is provided with a control computer 90, an information inputting unit 91, an information outputting unit 92, a detecting unit 93, an information recording unit 94, And a device control unit 95 are connected and included.

As the control computer 90, a numerical calculation unit such as a microcomputer, a personal computer, and a workstation may be mounted. As the information input means 91, a keyboard, a mouse, a switch, and the like can be exemplified. As the information output means 92, an image display display, a lamp, and the like can be exemplified.

As the deflecting means 93, a buzzer, a speaker, a lamp, and the like can be cited as examples that can be cautioned to an operator. As the information recording means 94, a semiconductor recording medium, a magnetic recording medium, a magneto-optical recording medium, or the like such as a memory card or a data disk can be exemplified. As the device control unit 95, a device called a programmable controller or a motion controller can be exemplified.

The device control unit 95 includes an X1 axis stage 21, a Y1 axis stage 33, a Z1 axis stage, a? Axis motor 36, an X2 axis stage 41, a Y2 axis stage 45, A Z2-axis stage 46, and a control amplifier (not shown).

It is also connected to other control devices (not shown). The device control unit 95 is capable of operating or stopping the respective devices by giving control signals to the control amplifiers of the connected devices.

Setting or changing of the application condition of the curable resin 55 is performed by using the information input means 91 connected to the control computer 90 of the control unit 9 and confirmed by the information display means 92. [

Further, the set application conditions can be registered in the information recording means 94 connected to the control computer 90, so that they can be appropriately read, edited, and changed.

[Flow of Substrate Bonding]

Fig. 4 is a flowchart showing the steps of joining the substrates step by step. The first substrate 11 is loaded on the substrate carrier 60 (s101), the substrate carrier 60 is loaded on the first substrate mounting table 22 (s102), and the substrate carrier 60 is vacuum-adsorbed (S103).

Next, an alignment mark (not shown) on the first substrate 11 is read by an observation camera (not shown) (s104), and the position information of the alignment mark on the first substrate 11 is read out . The positional information of the alignment mark on the acquired first substrate 11 is transferred to the control computer 90 of the control unit 9 and the position of the first substrate 11 stacked on the substrate mounting table 22 It is used to calculate and calculate posture.

The first substrate 11 is moved to the resin application position on the basis of the information of the position and attitude of the first substrate 11 obtained as described above (s105), and a predetermined amount of the curable resin is applied (s106).

Subsequently, the first substrate 11, to which a predetermined amount of the curable resin 55 has been applied, is moved to the pre-registered bonding position (s107).

A predetermined number of sheets of the second substrate 12 are stacked on the tray 48 in step s111 and the tray 48 is placed on the second substrate stacking table 42 in step s112, And is adsorbed and held (s113).

Next, the second substrate 12 is picked up by the movement mounting hand 47 of the tray conveying section 4 (s114), and the second substrate 12 is placed on the mounting table 26 (s115).

Subsequently, the head portion 3 of the stage portion 2 is moved and the second substrate 12a, which is stuck on the mounting claw 26 at the tip of the balloon head portion 7 of the head portion 3, (S116).

An alignment mark (not shown) on the surface of the second substrate 12b held by the balloon head portion 7 is read by an observation camera (not shown) (s117), and the second substrate 12b And the position information of the alignment mark on the alignment mark. The obtained positional information of the alignment mark is transmitted to the control computer 90 of the control unit 9 and used to calculate and calculate the position and posture of the first substrate 11 mounted on the substrate mounting table 22 .

The second substrate 12b is moved to the previously registered joining position based on the information of the position and posture of the second substrate 12b obtained as described above (s118). At this time, in the state where alignment of the first substrate 11 and the second substrate 12b is completed, the wiring electrode patterns contacting each other face each other.

The second substrate 12b held at the tip end of the balloon head portion 7 is bent (s121). The mechanism and the flow of bending the second substrate 12b are described in detail in the description of the balloon head 7 described later.

The second substrate 12b is moved downward in the Z direction (s122), and brought into contact with the curable resin 55 coated on the first substrate 11 (s123).

Further, the second substrate 12b is moved downward in the Z direction (s124) to conform to the first substrate 11 (s125). The mechanism and flow for causing the second substrate 12b to follow the first substrate 11 are described in detail in the following description of the balloon head 7.

Further, the second substrate 12b is pressed toward the first substrate 11 (s126), and ultraviolet rays are irradiated for a predetermined time while pressing the entire surface of the second substrate 12b (s127) (55).

After the curable resin 55 is cured, the suction holding of the second substrate 12b is released and the head part 3 is raised (s128).

Thereafter, the next second substrate is picked up from the tray 48 in the same manner as above to attach the next second substrate to the next bonding position set on the first substrate 11, 26). Subsequently, the operation of picking up the second substrate mounted next to the mounting claw 26, reading the alignment marks, aligning them, and attaching them to the first substrate is repeated.

After the predetermined number of second substrates 12 have been bonded onto the first substrate 11 as described above, the first substrate 11 together with the carrier 60 is placed on the first substrate mounting table 22 ). Thereafter, the first substrate loaded on the next carrier, to which the second substrate has not yet been attached, is loaded on the first substrate mounting table 22.

The first substrate 11 to which a predetermined number of second substrates are attached is taken out of the bonding apparatus 1 of the substrate together with the carrier 60. The first substrate thus taken out is removed from the carrier 60 and conveyed to the next process. By repeating the above-described processes, the desired number of first substrates to which the second substrate is attached can be produced.

The tray 48 in which the second substrate 12 is accommodated becomes empty when the second substrate 12 is picked up by the predetermined number of sheets so that the empty tray is taken out of the apparatus and the next tray 12 in which the second substrate 12 is accommodated Refill the tray.

[Balloon head part]

5A to 5E are cross-sectional views showing the internal configuration of the balloon head portion 7 and a state of bonding the substrates. 5 (a) is a view showing a state in which the second substrate 12b is held at the tip end of the balloon head portion 7. As shown in Fig. The balloon head portion 7 has a box or tubular container structure and includes a housing 70 having at least one side opened, a substrate deformation mechanism portion 71 disposed inside the housing 70, And a substrate holding film 72 provided so as to close the opening of the substrate holding film 70.

As the substrate holding film 72, an elastic material which can be stretched or shrinkable, such as rubber or a soft resin, or an elastic material which is a combination of a metal material and the elastic material appropriately and which is stretchable in the three-dimensional direction is used. The substrate holding film 72 may be the same as or smaller than the size seen from the plane of the second substrate 12b, but is preferably larger than the size seen from the plane of the second substrate 12b. The entire surface of the second substrate 12b is covered with the substrate holding film 72 even if the second substrate 12a is laid out on the mounting claw 26 in a staggered manner.

The substrate holding film 72 is provided with a substrate holding film communication port 721 for sucking and holding the second substrate 12b and is provided with suction means (not shown) outside the balloon head portion 7 ) Through a switching valve.

The air chamber 73 of the balloon head portion 7 communicates with an external pressure regulating means (not shown) through an air chamber communication port 731 provided in the housing 70. The pressure regulating means suitably includes a pressure supply means outside the apparatus, a pressure reducing means, and a switching valve means connected to the outside air.

The substrate deformation mechanism unit 71 includes a cylinder 711, a piston 712, a pressing head 713 provided on the piston, a piston pushing side communication port 714 communicating with the cylinder 711, (715).

The piston pushing side communication port 714 and the piston pulling side port 715 communicate with external pressure regulating means (not shown). The pressure regulating means suitably includes a pressure supply means outside the apparatus, a pressure reducing means, and a switching valve means connected to the outside air.

For example, when the pressure of the piston pushing side communication port 714 becomes higher than the pressure of the piston pulling side port 715, the piston 712 moves downward in the Z direction. Conversely, when the pressure of the piston pressure side communication port 714 becomes lower than the pressure of the piston pulling side port 715, the piston 712 moves upward in the Z direction.

The substrate holding film 72 is deformed when it is pushed downward in the Z direction by the substrate deformation mechanism unit 71. Thus, the second substrate 12b held at the tip end of the balloon head portion 7 can be bent.

The above operation corresponds to step s121 of bending the second substrate 12b held at the tip end of the balloon head portion 7 described above.

5 (b) is a view showing a state in which the second substrate 12b held by the balloon head portion 7 is bent.

The pressure in the air chamber 73 is such that the air chamber communication port 731 is in communication with the outside air and has the same pressure as the outside air. On the other hand, the piston pulling side communication port 715 is communicated with the outside air and the piston pushing side communication port 714 is pressed with a predetermined pressure (for example, 0.3 MPa).

Therefore, the piston 712 and the pressing head 713 connected to the piston 712 are moved downward in the Z direction and stopped. The substrate holding film 72 is deformed by pushing down the piston 712, and at the same time, the holding second substrate 12 is bent. At this time, in a state where the force to push down the piston 712, the reaction force inside the substrate holding film 72, and the reaction force against the bending of the second substrate 12 are balanced, deformation is stopped and the state is balanced have.

Subsequently, the air chamber communication port 731 is closed so that the inside of the air chamber is closed. At this time, pressurized air may be supplied to the inside of the air chamber 73 at a predetermined pressure (for example, 0.2 MPa) so as to be in a pressurized state.

The air chamber 73 is a space which is hermetically sealed by the housing 70 and the substrate holding film 72. When the pressurized fluid is supplied to the air chamber communication port 731, Becomes higher than the outside air, and the substrate holding film 72 is deformed to expand outward. The deformation of the substrate holding film 72 is stopped and balanced in a state in which the pressure of the air chamber 73 and the tension generated in the elastic body when the elastic body is deformed are balanced.

Subsequently, the head portion 3 is moved downward (that is, lowered) in the Z direction to bring the deformed second substrate 12 into contact with the curable resin 55 coated on the first substrate 11. 5C is a view showing a state in which the deformed second substrate 12 and the curable resin 55 applied on the first substrate 11 are in contact with each other.

Subsequently, the head portion 3 is lowered to bring the deformed second substrate 12 and the first substrate 11 into contact with each other. 5 (d) is a view showing a state in which the deformed second substrate 12 and the first substrate 11 are in contact with each other.

At this time, the curable resin 55 applied on the first substrate 11 spreads widely, penetrates into a gap of a slight irregularity between the first substrate 11 and the second substrate 12, And is applied. At this time, the opposing wiring electrode patterns of the first substrate 11 and the second substrate 12 are in contact with each other, and mixing of the voids is also prevented.

Further, the head portion 3 is lowered so that the peripheral portion of the second substrate 12 is brought into contact with the first substrate 11. At this time, the curable resin 55 reaches the outside of the peripheral portion of the second substrate 12, and the second substrate 12 is pressed toward the first substrate 11 to close a slight gap between the substrates .

This operation corresponds to step s125 in which the above-described second substrate 12 is made to follow the first substrate 11.

At this time, since the air chamber 73 is in an airtight state and the inner pressure is high and the second substrate holding film 72 is an elastic body having a larger dimension viewed from the plane than the second substrate 12, An equal force is applied to the entire surface of the second substrate 12.

It is possible to prevent the pressing force from concentrating on the foreign matter even if foreign matter is mixed in between the second substrate 12 and the second substrate holding film 72, I can apply force.

Thereafter, air further pressurized by a predetermined pressure (for example, 0.4 MPa) may be fed into the air chamber 73 and pressurized.

5E is a view showing a state in which the curable resin 55 is cured in a state in which the second substrate 12 is pressed toward the first substrate 11. As shown in Fig. The ultraviolet light is irradiated from the ultraviolet light irradiation unit for a predetermined period of time.

The ultraviolet rays are irradiated for a predetermined time (for example, 5 seconds) from the ultraviolet ray irradiation unit while the second substrate 12 is being pressed toward the first substrate 11. [ The energy intensity or irradiation time of ultraviolet rays to be irradiated may be suitably adjusted in accordance with the curing characteristics of the applied curing resin 55.

After the curing resin absorbs ultraviolet rays and cures, the piston pushing side communication port 714 is opened to the atmosphere to send pressurized air to the piston pulling side communication port 715, and the piston 712 is moved upward in the Z direction , Rise).

Subsequently, the substrate holding film communication port 721 is opened to the atmosphere, suitably compressed air is sent as occasion demands, and the suction holding of the substrate is released.

Thereafter, the air chamber communication port 731 is opened to the atmosphere, the pressurized state of the air chamber 731 is released, and the balloon head portion 7 is raised.

The balloon head portion 7 is composed of a housing having a container structure as described above, and has a structure as a substrate bonding head in which at least one surface is an elastic body. Thus, after the second substrate 12 is bent, it is bonded to the first substrate 11, and an even load can be applied according to the surface shape. Therefore, when joining the second substrate 12 to the first substrate 11, it is possible to prevent the incorporation of voids.

In addition, since the balloon head portion 7 has a structure capable of continuously deforming and pressing the second substrate 12 with one head, joining of the substrates can be performed in a short time. As a result, the production quantity per unit time can be increased.

Since the second substrate 12 is pressed toward the first substrate 11 by the balloon head portion 7 as described above, the distance between the opposing wiring electrode patterns of the first substrate 11 and the second substrate 12 The contact area of the contact surface increases. Thereafter, by curing the curable resin, the adhesion between the first substrate and the second substrate is maintained, and the contact area of the wiring electrode pattern is also maintained. As a result, the reliability of conduction is further improved.

When the curable resin 55 is heated and cured at a high temperature and then returned to room temperature, the adhesion between the first substrate and the second substrate is further enhanced by selecting a material having a property of causing thermal expansion. Alternatively, by selecting a material having a property of shrinking the volume with time in the curable resin 55, adhesion between the first substrate and the second substrate can be further enhanced even after curing. This further increases the contact area of the opposing wiring electrode patterns of the first substrate and the second substrate. As a result, the reliability of conduction is further improved.

The second substrate 12 is moved downward in the Z direction in the steps s121 to s123 to stop the falling immediately before the first substrate 11 is contacted with the second substrate 12, The substrate 12 may be warped and brought into contact with the curable resin 55 applied on the first substrate 11. Thereby, the force to push down the piston 712, the reaction force inside the substrate holding film 72, the reaction force against the bending of the second substrate 12, and the reaction force from the first substrate 11 are balanced , A stable balance state can be created.

Therefore, the second substrate is excessively bent so that the force to push down the piston 712, the reaction force inside the substrate holding film 72, and the reaction force against the bending of the second substrate 12 are not balanced, And can be prevented from being cracked.

In the step s127, it is preferable that the time for ultraviolet irradiation in a state in which the entire surface of the second substrate 12 is pressed is set to a time required for the curing resin to be completely cured. However, when the time required until the resin is completely cured is long (for example, 1 hour), the wiring electrode patterns of the first substrate 11 and the second substrate 12 are not separated from each other Ultraviolet rays or heating may be performed for a necessary time (for example, 5 seconds), and then the substrate may be taken out and completely cured by using another apparatus for a predetermined time (for example, one hour).

By dividing the curing step of the curable resin as described above by temporary curing and complete curing as described above, it is possible to shorten the time for bonding the substrate using the apparatus and method of the present invention. By doing so, it is possible to increase the production amount per unit time.

As another mode of the balloon head portion 7, the substrate deforming mechanism portion 71 is omitted, the pressure of the air chamber 73 is adjusted to deform the substrate holding film 72, and the held second substrate 12b may be exemplified. With this structure, even if the substrate deforming mechanism unit 71 is omitted, the second substrate 12b can be warped and bonded to the first substrate 11. As a result, the substrate can be bonded with a simple structure, and voids can be prevented from being mixed at the time of bonding.

In the above embodiment, as a method of curing the curable resin, a method of irradiating ultraviolet rays by using a material that is cured by ultraviolet rays, or a method of heating by using a material that is cured by heating is described. A method of heating and cooling using a material softened and cured by cooling, a method of humidifying by using a material cured by humidification, a method of drying by using a material which is cured by drying, It is also possible to perform the combination.

As a material to be cured by ultraviolet rays, there is a material which is polymerized when irradiated with ultraviolet rays to form a network structure of a polymer, and is cured and does not return to its original state. Examples thereof include epoxy resins, polythiol resins, unsaturated polyester resins, Urethane resin, and the like.

Examples of the material to be cured by heating include a phenol resin, an epoxy resin, a melamine resin, a urea resin, an unsaturated polyimide resin, and the like, which have a property that polymerization is caused by heating to form a network structure of a polymer, Ester resins, alkyd resins, urethane resins, thermosetting polyimides, and the like.

As the material softened by heating and cured by cooling, it is preferable to use a material such as polyethylene, polypropylene, polyvinyl chloride, polystyrene, PTFE, ABS resin, acrylic resin, And thermoplastic resins such as polyamide, polyimide, polyamideimide, nylon, polycarbonate, PET and the like.

As a material to be cured by humidification, a silicone resin and the like can be exemplified, which have a property of absorbing water and curing.

As the material to be cured by drying, there is a property that the moisture in the material is solidified by being released to the outside, and natural drying is exemplified.

As the curable resin 55 other than the above, a material which is cured by forcibly applying energy such as microwave or X-ray from the outside may be used.

In addition to the above embodiment, when the positions of the carrier 60 and the first substrate 11 placed on the first substrate mounting table 22 are easily shifted, the X1 axis stage 21 and the first substrate 11, Means for changing the angle of the first substrate mounting table 22 in the? Direction may be added between the mounting tables 22. In this case, the position of the alignment mark on the first substrate 11 can be read, the θ direction of the first substrate mounting table 22 can be adjusted, and the first substrate 11 can be aligned in a predetermined direction.

In the above embodiment, the carrier 60 is used. However, the first substrate 11 has a strength capable of generating a sufficient reaction force against the pressure from the head portion 3, It is not necessary to use the carrier 60 if it is possible to directly load the carrier 60 on the carrier 22.

As another embodiment, even if the first substrate 11 is a roll-wound sheet, if the sheet is extended and held on the carrier 60 or the substrate mounting table 22, It is possible to attach the second substrate 12 using the present invention.

The present invention can be used for mounting a substrate on which a wiring electrode pattern is formed on a surface of the substrate on which a wiring electrode pattern is formed.

1: bonding device of substrate
2:
3:
4:
5:
6: Curing unit part
7: Balloon head part
9:
11: a first substrate
12: second substrate
12a: a mounted second substrate
12b: a second substrate held by the balloon head portion
12c: a second substrate
20: Device base
21: X1 axis stage
22: first substrate loading table
26: Stabilization
31: Holding
32: beam
33: Y1 axis stage
34: head up-and-down movement mechanism
35: Motor
36: Theta axis motor
40: Device base
41: X2-axis stage
42: second substrate loading table
43: holding
44: beam
45: Y2 axis stage
46: Z2-axis stage
47: Hand part
48: Tray
51: Z-axis stage
52: Motor
53: Dispenser
55: Curable resin
60: substrate carrier
61: ultraviolet ray
70: Housing
71: substrate deformation mechanism
72: substrate holding film
73: air chamber
80: Syringe
81: Z-axis stage
82: Motor
90: Control computer
91: Information input means
92: Information display means
93: Detective means
94: Information recording means
95: Device control unit
96: Image information input section
711: Cylinder
712: Piston
713: Compression head
714: Piston pushing side communication port
715: Piston pulling side communication port
721: substrate holding film communication port
731: Air chamber communication port

Claims (9)

There is provided an apparatus for bonding a first substrate on which a wiring electrode pattern is formed on a surface thereof and a second substrate having a wiring electrode pattern on the surface thereof with the wiring electrode patterns mutually opposed to each other,
And a balloon head portion having a container structure in which an inner portion is an air chamber, wherein the balloon head portion has an elastic body provided so as to close the opening portion of the housing,
And an elastic body of the balloon head portion includes means for holding the second substrate,
The balloon head portion is connected to an air chamber communication port connected to pressure adjusting means for adjusting the pressure of the air chamber inside the housing,
And means for deforming the surface of the elastic body of the balloon head portion to warp the second substrate while holding the second substrate,
Wherein at least one of the first substrate and the second substrate is coated with a curable resin,
And means for bringing the first substrate and the second substrate close to each other,
Wherein the balloon head portion has a structure for pressing the second substrate toward the first substrate by a pressure applied to the surface of the elastic body of the housing. The apparatus according to claim 1, further comprising substrate changing means for deforming the surface of the elastic body to bend the second substrate while holding the second substrate,
And a surface of the elastic body is deformed by adjusting a pressure of the air chamber,
Wherein the second substrate is made to conform to the surface shape of the first substrate when the second substrate is pressed against the first substrate. The apparatus for bonding a substrate according to claim 1 or 2, wherein the curable resin is cured while the second substrate is pressed against the first substrate. There is provided a method of joining a first substrate having a wiring electrode pattern on its surface and a second substrate having a wiring electrode pattern on its surface by mutually opposing the wiring electrode patterns to each other,
A balloon head portion having a container structure having an inner air chamber and an elastic body provided so as to close an opening of the housing,
Holding the second substrate with the surface of the elastic body of the balloon head portion;
And deforming the surface of the elastic body of the balloon head portion so as to bend the second substrate while holding the second substrate,
Wherein at least one of the first substrate and the second substrate is coated with a curable resin,
A step of bringing the first substrate and the second substrate close;
Bonding the second substrate and the first substrate while keeping the second substrate to conform to the surface shape of the first substrate;
And pressing the second substrate toward the first substrate by a pressure applied to the surface of the elastic body of the housing of the balloon head portion. 5. The method of bonding a substrate according to claim 4, further comprising the step of curing the curable resin while the second substrate is pressed against the first substrate. A substrate joining head for joining a second substrate to a first substrate,
And a balloon head portion having a container structure in which an inner portion is an air chamber, wherein the balloon head portion has an elastic body provided so as to close the opening portion of the housing,
And an air chamber communication port for adjusting the pressure in the air chamber is connected to the housing,
And the elastic body has means for holding the second substrate by using the surface of the elastic body,
And means for deforming the surface holding the second substrate and for bending the second substrate. The substrate processing apparatus according to claim 6, wherein the air chamber is provided with substrate deforming means for deforming a surface holding the second substrate,
Wherein the second substrate has a structure in which the surface holding the second substrate is deformed to warp the second substrate. The air conditioner according to claim 6 or 7, wherein the air chamber communication port is connected to means for adjusting the pressure in the air chamber,
Wherein the second substrate has a structure in which the pressure in the air chamber is adjusted to deform the surface of the elastic body holding the second substrate to bend the second substrate. The method according to claim 6, wherein, when the second substrate is pressed against the first substrate, the second substrate is made to conform to the surface shape of the first substrate and an even load can be applied to the second substrate And a second substrate having a second substrate.

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