TWI823702B - Device configured to push electronic substrate - Google Patents

Device configured to push electronic substrate Download PDF

Info

Publication number
TWI823702B
TWI823702B TW111146638A TW111146638A TWI823702B TW I823702 B TWI823702 B TW I823702B TW 111146638 A TW111146638 A TW 111146638A TW 111146638 A TW111146638 A TW 111146638A TW I823702 B TWI823702 B TW I823702B
Authority
TW
Taiwan
Prior art keywords
platform
electronic substrate
electronic
substrate
air chamber
Prior art date
Application number
TW111146638A
Other languages
Chinese (zh)
Other versions
TW202425202A (en
Inventor
黃聖哲
林清儒
劉禹輝
Original Assignee
斯託克精密科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 斯託克精密科技股份有限公司 filed Critical 斯託克精密科技股份有限公司
Priority to TW111146638A priority Critical patent/TWI823702B/en
Priority to CN202311224298.XA priority patent/CN118156205A/en
Application granted granted Critical
Publication of TWI823702B publication Critical patent/TWI823702B/en
Publication of TW202425202A publication Critical patent/TW202425202A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Die Bonding (AREA)
  • Bipolar Transistors (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)

Abstract

A device configured to push an electronic substrate includes a platform, a gas room, an air pump, and a sucking mechanism. The platform is configured to carry the electronic substrate. The gas room is disposed at a corresponding position of the platform carrying the electronic substrate. The air pump communicates with the gas room, and is capable of pumping outside air into the gas room. The sucking mechanism is disposed on the platform, and configured to suck and fix the electronic substrate carried by the platform.

Description

用以頂推電子基板之裝置Device used to push electronic substrates

本發明是有關於一種頂推裝置，且特別是有關於一種頂推電子基板之裝置。The present invention relates to a pushing device, and in particular to a device for pushing an electronic substrate.

半導體元件通常是利用磊晶的方式成長於一成長基板上，但隨著半導體元件的各種不同應用的變化，半導體元件最終在成品上時未必會留在原先的成長基板上，而有可能會轉移至一轉移基板上，而最終再轉移至一目標基板上，而形成一最終的成品。Semiconductor components are usually grown on a growth substrate using epitaxy. However, as the various applications of semiconductor components change, the semiconductor components may not necessarily remain on the original growth substrate when they are finally placed on the finished product, but may be transferred. to a transfer substrate, and finally transferred to a target substrate to form a final product.

當欲將半導體元件從轉移基板轉移至目標基板時，有一種方法是將轉移基板與目標基板的正面互相面對，並壓合轉移基板與目標基板。習知的壓合方式是將轉移基板與目標基板利用機構對位後直接壓合，讓兩個基板的平面全面接觸。然而，兩個平面的共面狀態不易藉由機構調整，且轉移基板與目標基板的平面度要求高，因此製作費時且費用高。此外，用習知的壓合方式來壓合轉移基板與目標基板時，容易產生壓合力道不均勻的情形，而無法良好的掌控壓合的均勻度。When a semiconductor element is to be transferred from a transfer substrate to a target substrate, one method is to face the front surfaces of the transfer substrate and the target substrate to each other and press the transfer substrate and the target substrate together. The conventional lamination method is to align the transfer substrate and the target substrate using a mechanism and then laminate them directly so that the planes of the two substrates are in full contact. However, the coplanar state of the two planes is difficult to adjust mechanically, and the flatness requirements of the transfer substrate and the target substrate are high, so the production is time-consuming and expensive. In addition, when using conventional lamination methods to laminate the transfer substrate and the target substrate, uneven lamination force is likely to occur, and the uniformity of lamination cannot be well controlled.

本發明提供一種用以頂推電子基板之裝置，其可均勻地對電子基板施加頂推的壓力。The present invention provides a device for pushing an electronic substrate, which can apply pushing pressure uniformly to the electronic substrate.

本發明的一實施例提出一種用以頂推電子基板之裝置，其係包括一平台、一氣室、一抽氣泵及一吸附機構。平台係用以承載一電子基板，氣室係設置於平台承載電子基板之相對位置處。抽氣泵係與氣室連通，而可將外界之空氣抽入氣室內。吸附機構係設置於平台上，其可吸附固定承載於平台上之電子基板。An embodiment of the present invention provides a device for pushing an electronic substrate, which includes a platform, an air chamber, an air pump and an adsorption mechanism. The platform is used to carry an electronic substrate, and the air chamber is disposed at a relative position where the platform carries the electronic substrate. The air pump is connected with the air chamber and can pump outside air into the air chamber. The adsorption mechanism is arranged on the platform and can adsorb and fix the electronic substrate carried on the platform.

在本發明的實施例的用以頂推電子基板之裝置中，可以藉由抽氣泵將外界之空氣抽入氣室內，以使氣室內的空氣壓力可以頂推位於氣室上的電子基板。由於空氣的壓力在不同的位置上是均勻的，因此氣室內的空氣可以對電子基板均勻地施加頂推的壓力，以使電子基板與另一暫時貼附有電子元件的轉移基板均勻地壓合，進而提升電子元件與電子基板的電性接合良率。In the device for pushing the electronic substrate according to the embodiment of the present invention, external air can be drawn into the air chamber through an air pump, so that the air pressure in the air chamber can push the electronic substrate located on the air chamber. Since the pressure of the air is uniform at different locations, the air in the air chamber can evenly exert pushing pressure on the electronic substrate, so that the electronic substrate can be evenly pressed with another transfer substrate that is temporarily attached with electronic components. , thereby improving the electrical bonding yield of electronic components and electronic substrates.

圖1A、圖1B及圖1C依序為繪示本發明的一實施例的用以頂推電子基板之裝置在執行暫時基板與電子基板的壓合製程的流程的剖面示意圖。請參照圖1A、圖1B及圖1C，本實施例的用以頂推電子基板之裝置100，其係包括一平台110、一氣室120、一抽氣泵130及一吸附機構140。平台110係用以承載一電子基板50，氣室120係設置於平台110承載電子基板50之相對位置處。在本實施例中，氣室120例如為平台110上的凹陷，而當平台110承載電子基板50時，氣室120位於電子基板50下方。1A , 1B and 1C are schematic cross-sectional views in sequence illustrating the process of a device for pushing an electronic substrate during a lamination process of a temporary substrate and an electronic substrate according to an embodiment of the present invention. Referring to FIGS. 1A, 1B and 1C, the device 100 for pushing electronic substrates in this embodiment includes a platform 110, an air chamber 120, an air pump 130 and an adsorption mechanism 140. The platform 110 is used to carry an electronic substrate 50 , and the air chamber 120 is disposed at a relative position where the platform 110 carries the electronic substrate 50 . In this embodiment, the air chamber 120 is, for example, a recess on the platform 110 , and when the platform 110 carries the electronic substrate 50 , the air chamber 120 is located below the electronic substrate 50 .

抽氣泵130係與氣室120連通，而可將外界之空氣抽入氣室120內。在本實施例中，平台110上可具有氣體傳輸通道112，而設置於平台110外部的抽氣泵130可經由氣體傳輸通道112與氣室120連通。也就是說，外界之空氣被抽氣泵130抽入氣體傳輸通道112而被傳輸到氣室120中。The air pump 130 is connected with the air chamber 120 and can pump outside air into the air chamber 120 . In this embodiment, the platform 110 may have a gas transmission channel 112 , and the air pump 130 provided outside the platform 110 may communicate with the gas chamber 120 via the gas transmission channel 112 . That is to say, the external air is sucked into the gas transmission channel 112 by the air pump 130 and transmitted to the air chamber 120 .

吸附機構140係設置於平台110上，其可吸附固定承載於平台110上之電子基板50。在本實施例中，吸附機構140可為吸嘴、真空吸盤或其他具有吸附力的元件。藉吸附機構吸附平台110所承載之電子基板50，而於電子基板50與氣室120間形成一密閉空間122。具體而言，密閉空間122即為吸附機構吸附平台110所承載之電子基板50時，平台110上用以形成氣室120的凹陷與電子基板50所封閉而成的空間。The adsorption mechanism 140 is disposed on the platform 110 and can adsorb and fix the electronic substrate 50 carried on the platform 110 . In this embodiment, the adsorption mechanism 140 may be a suction nozzle, a vacuum suction cup, or other components with adsorption force. The electronic substrate 50 carried on the platform 110 is adsorbed by the adsorption mechanism, and a sealed space 122 is formed between the electronic substrate 50 and the air chamber 120 . Specifically, the sealed space 122 is a space enclosed by the recess used to form the air chamber 120 on the platform 110 and the electronic substrate 50 when the adsorption mechanism adsorbs the electronic substrate 50 carried by the platform 110 .

當欲將一轉移基板60上的電子元件70轉移至電子基板50時，可依序進行圖1A至圖1C的步驟。轉移基板60上可藉由黏著層62貼附有電子元件70，電子元件70可為晶片，例如為發光二極體晶片、積體電路晶片或其他電子晶片。電子元件70上可以有接墊72。在本實施例中，多個電子元件70呈陣列地排列於轉移基板60上。另一方面，電子基板50上可設有接墊52，其電性連接至電子基板50上或內部的電路。欲將轉移基板上的電子元件70轉移至電子基板50時，可先執行如圖1A的步驟，在接墊52上形成凸塊54，例如是焊料凸塊或其他材質的凸塊，而後利用吸附機構140將電子基板50吸附於平台110上。When the electronic component 70 on a transfer substrate 60 is to be transferred to the electronic substrate 50, the steps of FIG. 1A to FIG. 1C can be performed in sequence. Electronic components 70 can be attached to the transfer substrate 60 through the adhesive layer 62 . The electronic components 70 can be chips, such as light-emitting diode chips, integrated circuit chips, or other electronic chips. The electronic component 70 may have pads 72 thereon. In this embodiment, a plurality of electronic components 70 are arranged in an array on the transfer substrate 60 . On the other hand, the electronic substrate 50 may be provided with pads 52 that are electrically connected to circuits on or within the electronic substrate 50 . When the electronic components 70 on the transfer substrate are to be transferred to the electronic substrate 50, the steps as shown in FIG. 1A can be performed first to form bumps 54 on the pads 52, such as solder bumps or bumps of other materials, and then use adsorption. The mechanism 140 adsorbs the electronic substrate 50 to the platform 110 .

另一方面，利用一轉移平台220上的吸附機構230將轉移基板60吸附於轉移平台220上，並使轉移基板60上具有電子元件70的一側面向電子基板50。吸附機構230可為吸嘴、真空吸盤或其他具有吸附力的元件。On the other hand, an adsorption mechanism 230 on the transfer platform 220 is used to adsorb the transfer substrate 60 to the transfer platform 220 , with the side of the transfer substrate 60 having the electronic components 70 facing the electronic substrate 50 . The adsorption mechanism 230 may be a suction nozzle, a vacuum suction cup, or other components with adsorption force.

接著，如圖1B所繪示的步驟，使轉移平台220與平台110靠近，而使轉移基板60上的電子元件70的接墊72接觸電子基板50上的凸塊54。此外，利用抽氣泵130將外界之空氣抽入氣室120內，以使密閉空間122中的氣壓上升，進而使空氣對電子基板50施加往上的均勻壓力。如此一來，轉移基板60與電子基板50便能夠被均勻地壓合，也就是不同的位置處的壓合力道大致上一致。Next, in the step shown in FIG. 1B , the transfer platform 220 is brought close to the platform 110 so that the pads 72 of the electronic component 70 on the transfer substrate 60 contact the bumps 54 on the electronic substrate 50 . In addition, the air pump 130 is used to draw outside air into the air chamber 120 to increase the air pressure in the sealed space 122 , thereby causing the air to exert upward uniform pressure on the electronic substrate 50 . In this way, the transfer substrate 60 and the electronic substrate 50 can be pressed evenly, that is, the pressing force at different positions is substantially the same.

轉移平台220的中央設有一透光窗板210，透光窗板210的材質例如為石英或其他適當的透光材質。在轉移基板60與電子基板50被均勻地壓合時，一雷射產生器300可發出一雷射光束302。雷射光束302穿透透光窗板210而照射於接墊72與凸塊54的界面，以使凸塊54產生熔融。然後，關閉雷射光束302或將雷射光束302移動至下一個電子元件70的接墊72與凸塊54的位置，待凸塊54降溫後，接墊72與凸塊54便產生接合。在本實施例中，雷射光束302例如是紅外光束。然而，在其他實施例中，雷射光束302亦可以是可見光束或紫外光束。A light-transmitting window panel 210 is provided in the center of the transfer platform 220. The material of the light-transmitting window panel 210 is, for example, quartz or other appropriate light-transmitting materials. When the transfer substrate 60 and the electronic substrate 50 are evenly pressed, a laser generator 300 can emit a laser beam 302. The laser beam 302 penetrates the light-transmitting window plate 210 and irradiates the interface between the pad 72 and the bump 54 to cause the bump 54 to melt. Then, the laser beam 302 is turned off or moved to the position of the pad 72 and the bump 54 of the next electronic component 70. After the bump 54 cools down, the pad 72 and the bump 54 are joined. In this embodiment, the laser beam 302 is, for example, an infrared beam. However, in other embodiments, the laser beam 302 may also be a visible beam or an ultraviolet beam.

再來，執行如圖1C的步驟，使轉移平台220與平台110互相遠離，此時，接墊72與凸塊54的接合力會大於黏著層62與電子元件70的黏著力，因此電子元件70會脫離黏著層62而固定於電子基板50上的凸塊54上。如此一來，即完成將電子元件70從轉移基板60轉移至電子基板50的製程。Next, perform the steps as shown in FIG. 1C to move the transfer platform 220 and the platform 110 away from each other. At this time, the bonding force between the pad 72 and the bump 54 will be greater than the adhesion force between the adhesive layer 62 and the electronic component 70 . Therefore, the electronic component 70 It will be separated from the adhesive layer 62 and fixed on the bumps 54 on the electronic substrate 50 . In this way, the process of transferring the electronic components 70 from the transfer substrate 60 to the electronic substrate 50 is completed.

圖2為繪示本發明的另一實施例的用以頂推電子基板之裝置在類似圖1B的步驟的剖面示意圖。請參照圖2，本實施例的用以頂推電子基板之裝置100a與圖1B的用以頂推電子基板之裝置100類似，而兩者的差異在於，在本實施例的用以頂推電子基板之裝置100a中，氣室120上更設置有一撓性膜150，而於撓性膜150與氣室120間形成密閉空間122。也就是說，撓性膜150與平台110的凹陷封閉成密閉空間122，而當抽氣泵130將外界之空氣抽入氣室120內，以使密閉空間122中的氣壓上升時，撓性膜150被氣壓往上頂推，進而使撓性膜150對電子基板50施加往上的均勻的接觸力。FIG. 2 is a schematic cross-sectional view of a device for pushing an electronic substrate in steps similar to FIG. 1B according to another embodiment of the present invention. Please refer to Figure 2. The device 100a for pushing the electronic substrate in this embodiment is similar to the device 100 for pushing the electronic substrate in Figure 1B. The difference between the two is that in this embodiment, the device 100a for pushing the electronic substrate In the substrate device 100a, a flexible membrane 150 is further provided on the air chamber 120, and a sealed space 122 is formed between the flexible membrane 150 and the air chamber 120. That is to say, the flexible membrane 150 and the recess of the platform 110 are closed to form a closed space 122, and when the air pump 130 draws outside air into the air chamber 120 to increase the air pressure in the closed space 122, the flexible membrane 150 Being pushed upward by the air pressure, the flexible film 150 exerts a uniform upward contact force on the electronic substrate 50 .

圖3為繪示本發明的又一實施例的用以頂推電子基板之裝置在類似圖1A的步驟的剖面示意圖。請參照圖3，本實施例的用以頂推電子基板之裝置100b與圖1A的用以頂推電子基板之裝置100類似，而兩者的差異如下所述。在圖1A的用以頂推電子基板之裝置100中，吸附機構140是設置於平台110的頂面114。然而，在本實施例的用以頂推電子基板之裝置100a中，吸附機構140是設置於平台110的外側，而當吸附機構140吸附電子基板50時，電子基板50承靠於平台110的頂面114。在本實施例中，即使吸附機構140未位於平台110上，仍可視為平台110的一部分。FIG. 3 is a schematic cross-sectional view of a device for pushing an electronic substrate in steps similar to FIG. 1A according to another embodiment of the present invention. Referring to FIG. 3 , the device 100 b for pushing the electronic substrate in this embodiment is similar to the device 100 for pushing the electronic substrate in FIG. 1A , and the differences between the two are as follows. In the device 100 for pushing electronic substrates in FIG. 1A , the adsorption mechanism 140 is disposed on the top surface 114 of the platform 110 . However, in the device 100a for pushing the electronic substrate in this embodiment, the adsorption mechanism 140 is disposed outside the platform 110. When the adsorption mechanism 140 adsorbs the electronic substrate 50, the electronic substrate 50 rests on the top of the platform 110. Face 114. In this embodiment, even if the adsorption mechanism 140 is not located on the platform 110, it can still be regarded as a part of the platform 110.

圖4為繪示本發明的又一實施例的用以頂推電子基板之裝置在類似圖1A的步驟的剖面示意圖。請參照圖4，本實施例的用以頂推電子基板之裝置100c與圖1A的用以頂推電子基板之裝置100類似，而兩者的差異如下所述。在本實施例的用以頂推電子基板之裝置100c中，吸附機構140是位於平台110的底部，其可包括抽氣泵144與位於平台110底部的氣體傳輸通道142。在類似於圖1A的步驟中，當將電子基板50放置於平台110上時，抽氣泵144可透過氣體傳輸通道142將密閉空間122中的空氣抽出至外界，以產生負壓，如此電子基板50便能夠被吸附在平台110上。FIG. 4 is a schematic cross-sectional view of a device for pushing an electronic substrate in steps similar to FIG. 1A according to another embodiment of the present invention. Referring to FIG. 4 , the device 100 c for pushing the electronic substrate in this embodiment is similar to the device 100 for pushing the electronic substrate in FIG. 1A , and the differences between the two are as follows. In the device 100c for pushing electronic substrates in this embodiment, the adsorption mechanism 140 is located at the bottom of the platform 110, and may include an air pump 144 and a gas transmission channel 142 located at the bottom of the platform 110. In a step similar to FIG. 1A , when the electronic substrate 50 is placed on the platform 110 , the air pump 144 can extract the air in the closed space 122 to the outside through the gas transmission channel 142 to generate negative pressure, so that the electronic substrate 50 It can be adsorbed on the platform 110.

在一實施例中，平台110的頂面114上可設有一墊圈160，墊圈160位於電子基板50的邊緣與平台110的頂面114之間。墊圈160可具有彈性，墊圈160例如呈環狀而環繞氣室120的頂部，當電子基板50被吸附於平台110上時，墊圈會受到壓迫，進而確保了密閉空間122的密閉性。In one embodiment, a gasket 160 may be disposed on the top surface 114 of the platform 110 , and the gasket 160 is located between the edge of the electronic substrate 50 and the top surface 114 of the platform 110 . The gasket 160 may be elastic. For example, the gasket 160 may be annular and surround the top of the air chamber 120 . When the electronic substrate 50 is adsorbed on the platform 110 , the gasket will be compressed, thereby ensuring the sealing of the enclosed space 122 .

在圖1A至圖1C、圖2及圖3的實施例中，電子基板50的邊緣與平台110的頂面114之間也可以設有墊圈160，以進一步確保密閉空間122的密閉性。In the embodiments of FIGS. 1A to 1C , 2 and 3 , a gasket 160 may also be provided between the edge of the electronic substrate 50 and the top surface 114 of the platform 110 to further ensure the sealing of the enclosed space 122 .

綜上所述，在本發明的實施例的用以頂推電子基板之裝置中，可以藉由抽氣泵將外界之空氣抽入氣室內，以使氣室內的空氣壓力可以頂推位於氣室上的電子基板。由於空氣的壓力在不同的位置上是均勻的，因此氣室內的空氣可以對電子基板均勻地施加頂推的壓力，以使電子基板與另一暫時貼附有電子元件的轉移基板均勻地壓合，進而提升電子元件與電子基板的電性接合良率。To sum up, in the device for pushing the electronic substrate according to the embodiment of the present invention, the outside air can be sucked into the air chamber by the air pump, so that the air pressure in the air chamber can push the electronic substrate located on the air chamber. of electronic substrates. Since the pressure of the air is uniform at different locations, the air in the air chamber can evenly exert pushing pressure on the electronic substrate, so that the electronic substrate can be evenly pressed with another transfer substrate that is temporarily attached with electronic components. , thereby improving the electrical bonding yield of electronic components and electronic substrates.

50:電子基板 52、72:接墊 54:凸塊 60:轉移基板 62:黏著層 70:電子元件 100、100a、100b、100c:用以頂推電子基板之裝置 110:平台 112、142:氣體傳輸通道 114:頂面 120:氣室 122:密閉空間 130、144:抽氣泵 140、230:吸附機構 150:撓性膜 160:墊圈 210:透光窗板 220:轉移平台 300:雷射產生器 302:雷射光束50: Electronic substrate 52, 72: Pad 54: Bump 60:Transfer substrate 62:Adhesive layer 70: Electronic components 100, 100a, 100b, 100c: devices used to push electronic substrates 110:Platform 112, 142: Gas transmission channel 114:Top surface 120:Air chamber 122:Confined space 130, 144: Air pump 140, 230: Adsorption mechanism 150:Flexible film 160: Washer 210: Translucent window panel 220:Transfer platform 300:Laser generator 302:Laser beam

圖1A、圖1B及圖1C依序為繪示本發明的一實施例的用以頂推電子基板之裝置在執行暫時基板與電子基板的壓合製程的流程的剖面示意圖。 圖2為繪示本發明的另一實施例的用以頂推電子基板之裝置在類似圖1B的步驟的剖面示意圖。 圖3為繪示本發明的又一實施例的用以頂推電子基板之裝置在類似圖1A的步驟的剖面示意圖。 圖4為繪示本發明的又一實施例的用以頂推電子基板之裝置在類似圖1A的步驟的剖面示意圖。 1A , 1B and 1C are schematic cross-sectional views in sequence illustrating the process of a device for pushing an electronic substrate during a lamination process of a temporary substrate and an electronic substrate according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of a device for pushing an electronic substrate in steps similar to FIG. 1B according to another embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of a device for pushing an electronic substrate in steps similar to FIG. 1A according to another embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of a device for pushing an electronic substrate in steps similar to FIG. 1A according to another embodiment of the present invention.

50:電子基板 50: Electronic substrate

52、72:接墊 52, 72: Pad

54:凸塊 54: Bump

60:轉移基板 60:Transfer substrate

62:黏著層 62:Adhesive layer

70:電子元件 70: Electronic components

100:用以頂推電子基板之裝置 100: Device used to push electronic substrates

110:平台 110:Platform

112:氣體傳輸通道 112:Gas transmission channel

120:氣室 120:Air chamber

122:密閉空間 122:Confined space

130:抽氣泵 130:Air pump

140、230:吸附機構 140, 230: Adsorption mechanism

210:透光窗板 210: Translucent window panel

220:轉移平台 220:Transfer platform

300:雷射產生器 300:Laser generator

302:雷射光束 302:Laser beam

Claims (3)

一種用以頂推電子基板之裝置，其係包括： 一平台，其係用以承載一電子基板； 一氣室，其係設置於該平台承載電子基板之相對位置處； 一抽氣泵，其係與該氣室連通，而可將外界之空氣抽入氣室內；以及 一吸附機構，其係設置於該平台上，其可吸附固定承載於該平台上之該電子基板。 A device used to push electronic substrates, which includes: a platform for carrying an electronic substrate; An air chamber, which is arranged at a position opposite to where the platform carries the electronic substrate; An air pump is connected to the air chamber and can pump outside air into the air chamber; and An adsorption mechanism is provided on the platform and can adsorb and fix the electronic substrate carried on the platform. 如請求項1所述的用以頂推電子基板之裝置，其中藉該吸附機構吸附該平台所承載之該電子基板，而於該電子基板與該氣室間形成一密閉空間。The device for pushing an electronic substrate as described in claim 1, wherein the electronic substrate carried by the platform is adsorbed by the adsorption mechanism to form a sealed space between the electronic substrate and the air chamber. 如請求項1所述的用以頂推電子基板之裝置，其中於該氣室上更設置有一撓性膜，而於該撓性膜與該氣室間形成一密閉空間。The device for pushing electronic substrates as described in claim 1, wherein a flexible film is further provided on the air chamber, and a sealed space is formed between the flexible film and the air chamber.
TW111146638A 2022-12-05 2022-12-05 Device configured to push electronic substrate TWI823702B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW111146638A TWI823702B (en) 2022-12-05 2022-12-05 Device configured to push electronic substrate
CN202311224298.XA CN118156205A (en) 2022-12-05 2023-09-21 Device for pushing electronic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111146638A TWI823702B (en) 2022-12-05 2022-12-05 Device configured to push electronic substrate

Publications (2)

Publication Number Publication Date
TWI823702B true TWI823702B (en) 2023-11-21
TW202425202A TW202425202A (en) 2024-06-16

Family

ID=89722749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111146638A TWI823702B (en) 2022-12-05 2022-12-05 Device configured to push electronic substrate

Country Status (2)

Country Link
CN (1) CN118156205A (en)
TW (1) TWI823702B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101086973B (en) * 2007-05-28 2011-05-25 东莞彩显有机发光科技有限公司 A sealing and pressing method of organic illuminant part and encapsulation device for this method
TWI402171B (en) * 2010-11-11 2013-07-21 C Sun Mfg Ltd Pressing device and pressing method thereof
TWI494220B (en) * 2009-07-24 2015-08-01 Toray Eng Co Ltd A bonding apparatus and method of a substrate, and a substrate bonded head
TWI564982B (en) * 2011-04-26 2017-01-01 尼康股份有限公司 A substrate holding device, a substrate bonding device, a substrate holding method, a substrate bonding method, a laminated semiconductor device, and a laminated substrate
TW202135229A (en) * 2020-02-27 2021-09-16 日商鎧俠股份有限公司 Bonding apparatus and bonding method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101086973B (en) * 2007-05-28 2011-05-25 东莞彩显有机发光科技有限公司 A sealing and pressing method of organic illuminant part and encapsulation device for this method
TWI494220B (en) * 2009-07-24 2015-08-01 Toray Eng Co Ltd A bonding apparatus and method of a substrate, and a substrate bonded head
TWI402171B (en) * 2010-11-11 2013-07-21 C Sun Mfg Ltd Pressing device and pressing method thereof
TWI564982B (en) * 2011-04-26 2017-01-01 尼康股份有限公司 A substrate holding device, a substrate bonding device, a substrate holding method, a substrate bonding method, a laminated semiconductor device, and a laminated substrate
TW202135229A (en) * 2020-02-27 2021-09-16 日商鎧俠股份有限公司 Bonding apparatus and bonding method

Also Published As

Publication number Publication date
TW202425202A (en) 2024-06-16
CN118156205A (en) 2024-06-07

Similar Documents

Publication Publication Date Title
JP6367084B2 (en) Semiconductor chip bonding method and semiconductor chip bonding apparatus
TWI650238B (en) Vacuum filming device and method
TWI665757B (en) Semiconductor manufacturing device and method for manufacturing semiconductor device
KR20030028391A (en) Separation mechanism for adhesive tape, separation apparatus for adhesive tape, separation method for adhesive tape, pickup apparatus for semiconductor chip, pickup method for semiconductor chip, manufacturing method for semiconductor apparatus, and manufacturing apparatus for semiconductor apparatus
TWI823702B (en) Device configured to push electronic substrate
CN112331089B (en) Adsorption device, laminating equipment and laminating method of substrate
TWI744181B (en) Chip-transferring module, and device and method for transferring and bonding chips
TWI827095B (en) Apparatus configured to transfer electronic device, method for welding electronic device, and method for manufacturing light-emitting diode display
JP6616457B2 (en) Chip joining method and chip joining apparatus
JPH1167839A (en) Manufacture of electronic equipment
US20240145427A1 (en) Apparatus configured to transfer electronic component, method for bonding electronic component, and method for manufacturing light-emitting diode display
TWI681515B (en) Manufacturing semiconductor package apparatus, laser processing method and workpiece flattening method
TWI843161B (en) Device configured to weld an electronic element, method for welding an electronic element, and method for manufacturing a light-emitting diode display
JP4615202B2 (en) Method and apparatus for attaching semiconductor thin film
TWI680524B (en) Vacuum soft pad module capable of fixing a substrate with an un-flattened surface
US20240006564A1 (en) Device configured to bond an electronic component, method for bonding an electronic component, and method for manufacturing a light-emitting diode display
JP6906586B2 (en) Semiconductor chip joining method and semiconductor chip joining device
KR102527289B1 (en) Substrate bonding method
WO2024085024A1 (en) Lifting method and receiving substrate
TW202201715A (en) Light-emitting chip carrying structure and method of manufacturing the same
KR101791102B1 (en) Method of attaching semiconductor chip using ultrasonic wave
CN111653501A (en) Semiconductor package manufacturing apparatus, laser processing method, and leveling method for processing carrier board
CN115295451A (en) Bonding apparatus and bonding method
TWI426838B (en) Method and device for manufacturing a laminated-board assembly and laminated-board assembly thereof
TW202303777A (en) Substrate processing apparatus and substrate processing method