TWI665757B - Semiconductor manufacturing device and method for manufacturing semiconductor device - Google Patents

Abstract

When the die is pushed up by the push-up unit, the wafer may be deformed and flexed until leakage occurs under the suction surface of the collet.

It is a semiconductor manufacturing device characterized by including a collet portion for adsorbing a wafer; the collet portion includes a tubular portion having a second suction hole, and a holding portion and a position of the suction portion holding the first suction hole. A third suction hole formed on the outer peripheral portion of the tubular portion between the holding portion and the tubular portion and the outer peripheral portion, and the third suction hole is bent by the peripheral portion of the wafer being bent downward. A leak occurs, and the outer peripheral portion is pressed down and abuts on the peripheral portion of the wafer by an increase in the internal pressure. The occurrence of the leak is eliminated and the internal pressure is reduced, the outer peripheral portion is pulled up and the Means to pull up the peripheral part.

Description

   Semiconductor manufacturing device and method for manufacturing semiconductor device   

The present disclosure relates to a semiconductor manufacturing apparatus and can be applied to, for example, a die bonder including a collet.

Generally, a semiconductor wafer referred to as a wafer, for example, a wafer bonder mounted on a surface of a wiring board, a lead frame, or the like (hereinafter, collectively referred to as a substrate) generally uses suction nozzles such as collets repeatedly. The wafer is transferred to a substrate, and the bonding material is heated while applying a pressing force, thereby performing a bonding operation (operation).

Among the wafer bonding steps using a semiconductor manufacturing apparatus such as a wafer bonder, there is a peeling step of peeling off a wafer that has been divided from a semiconductor wafer (hereinafter, simply referred to as a wafer). In the peeling step, the wafer is pushed up by the push-up unit from the back of the dicing tape, and each of the dicing tape held in the wafer supply section is peeled off and transferred to the substrate using an adsorption nozzle such as a collet.

    [Prior technical literature]         [Patent Literature]    

[Patent Document 1] Japanese Patent Laid-Open No. 2015-76410

When the die is pushed up by the push-up unit, the wafer may be deformed until it is bent under the suction surface of the collet, and leakage may occur.

An object of the present invention is to provide a semiconductor manufacturing apparatus that does not affect the loss of vacuum suction force due to leakage even if the wafer is deformed.

Other problems and novel features of the present invention can be understood in detail from the description of the present specification and the drawings.

In the disclosure of this specification, a summary of a representative is briefly explained as follows.

That is, the semiconductor manufacturing apparatus is provided with a collet that automatically moves up and down in accordance with the cross-sectional shape of the picked up die.

According to the semiconductor manufacturing apparatus described above, leakage can be reduced.

1‧‧‧die supply department

11‧‧‧ wafer

13‧‧‧ Push-up unit

16‧‧‧ Cutting Tape

2‧‧‧Pick up department

21‧‧‧Pickup head

22‧‧‧ Collet Department

23‧‧‧ Adsorption Department

24‧‧‧ Central

26‧‧‧Vacuum suction hole

27‧‧‧Vacuum suction groove

28‧‧‧ Peripheral Department

29‧‧‧ Telescopic Tube Department

3‧‧‧ Intermediate Stage Department

31‧‧‧ intermediate stage

4‧‧‧ Junction

41‧‧‧Joint head

7‧‧‧Control Department

10‧‧‧ Wafer Splicer

D‧‧‧Chip

P‧‧‧ substrate

FIG. 1 is a conceptual view of a die bonder of the embodiment as viewed from above.

Fig. 2 is an explanatory diagram of the operation of the pickup head and the bonding head when viewed from the direction of arrow A in Fig. 1.

FIG. 3 is a perspective view illustrating an appearance of the wafer supply unit in FIG. 1.

FIG. 4 is a schematic cross-sectional view showing a main part of the wafer supply section of FIG. 1. FIG.

FIG. 5 is a top view of the push-up unit of FIG. 4.

6 is a cross-sectional view of a collet portion and a push-up unit in a comparative example.

Fig. 7 is a bottom view of a collet portion of a comparative example.

Fig. 8 is an explanatory view of a collet portion of the embodiment.

FIG. 9A is a cross-sectional view of the collet portion and the push-up unit of the embodiment.

9B is a cross-sectional view of the collet portion and the push-up unit in the embodiment.

9C is a cross-sectional view of the collet portion and the push-up unit in the embodiment.

9D is a cross-sectional view of the collet portion and the push-up unit of the embodiment.

9E is a cross-sectional view of the collet portion and the push-up unit of the embodiment.

FIG. 10 is a flowchart for explaining a pickup operation of the wafer bonder according to the embodiment.

FIG. 11 is a flowchart for explaining a method of manufacturing a semiconductor device according to the embodiment.

FIG. 12 is an explanatory diagram of a collet portion according to Modification 1. FIG.

13A is a cross-sectional view of a collet portion and a push-up unit according to Modification 1. FIG.

FIG. 13B is a cross-sectional view of a collet portion and a push-up unit according to Modification 1. FIG.

FIG. 13C is a cross-sectional view of a collet portion and a push-up unit according to Modification 1. FIG.

13D is a cross-sectional view of a collet portion and a push-up unit according to Modification 1. FIG.

FIG. 13E is a cross-sectional view of a collet portion and a push-up unit according to Modification 1. FIG.

FIG. 14 is an explanatory view of a collet portion according to Modification 2. FIG.

15A is a cross-sectional view of a collet portion and a push-up unit according to Modification 2. FIG.

15B is a cross-sectional view of a collet portion and a push-up unit according to Modification 2. FIG.

FIG. 15C is a cross-sectional view of a collet portion and a push-up unit according to Modification 2. FIG.

15D is a cross-sectional view of a collet portion and a push-up unit according to Modification 2. FIG.

15E is a cross-sectional view of a collet portion and a push-up unit according to Modification 2. FIG.

FIG. 16 is an explanatory diagram of a collet portion according to Modification 3. FIG.

17A is a cross-sectional view of a collet portion and a push-up unit according to Modification 3. FIG.

FIG. 17B is a cross-sectional view of a collet portion and a push-up unit according to Modification 3. FIG.

FIG. 17C is a cross-sectional view of a collet portion and a push-up unit according to Modification 3. FIG.

FIG. 17D is a cross-sectional view of a collet portion and a push-up unit according to Modification 3. FIG.

17E is a cross-sectional view of a collet portion and a push-up unit according to Modification 3. FIG.

FIG. 18 is an explanatory diagram of a collet portion according to Modification 4. FIG.

FIG. 19 is a flowchart for explaining a modification of the pickup operation of the wafer bonder of the embodiment.

20A is a cross-sectional view of a collet portion and a push-up unit according to the embodiment.

20B is a cross-sectional view of the collet portion and the push-up unit in the embodiment.

Hereinafter, examples and modifications will be described using drawings. However, in the following description, the same components are assigned the same drawing numbers, and repeated descriptions are omitted. In addition, the drawings can make the explanation more clear. When compared with the actual appearance, the width, thickness, and shape of each part are also shown in a pattern, which is only an example after all, and is not intended to limit the scope of the present invention. Explanation.

    [Example]    

FIG. 1 is a schematic plan view showing a die bonder of the embodiment. FIG. 2 is an explanatory diagram of the actions of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. 1.

The wafer bonder 10 basically includes a wafer supply unit 1, a pick-up unit 2, an intermediate stage portion 3, a bonding unit 4, a transfer unit 5, a substrate supply unit 6, a substrate carry-out unit 7, and monitoring and control. Control unit 8 for each part operation.

First, the wafer supply unit 1 supplies the assembled wafer D to the substrate P. The wafer supply unit 1 includes a wafer holding table 12 that holds the wafer 11 and a push-up unit 13 that pushes the wafer D up from the wafer 11 and is shown in broken lines. The wafer supply unit 1 is moved in the XY direction by a driving means (not shown) to move the picked-up wafer D at the position of the push-up unit 13.

The pick-up section 2 includes a pick-up head 21 for picking up a wafer D, a Y-driving section 23 for a pick-up head that moves the pick-up head 21 in the Y direction, and an unillustrated one that moves the collet section 22 up, down, and moves the X-direction. Drive section. The pick-up head 21 includes a collet section 22 (see also FIG. 2) that sucks and holds the pushed-up wafer D to the front end, and picks up and places the wafer D from the wafer supply section 1 on the intermediate stage 31. The pickup head 21 includes drive units (not shown) for raising, lowering, rotating, and moving the collet portion 22 in the X direction.

The intermediate stage section 3 includes an intermediate stage 31 on which the wafer D is temporarily placed, and a stage identification camera 32 for identifying the wafer D on the intermediate stage 31.

The bonding portion 4 picks up the wafer D from the intermediate stage 31, and bonds the wafer D on the transferred substrate P, or performs lamination on the wafer P already bonded on the substrate P. The bonding section 4 includes a bonding head 41 having a collet 42 (see also FIG. 2) for holding and holding the wafer D at the front end, and a Y driving section 43 for moving the bonding head 41 in the Y direction, similarly to the pickup head 21. And a substrate identification camera 44 that captures a position identification mark (not shown) of the substrate P and a substrate identification position.

With this configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 32, picks up the wafer D from the intermediate stage 31, and uses the imaging data of the substrate recognition camera 44 to The wafer D is bonded.

The transfer unit 5 includes a substrate transfer pallet 51 on which one or a plurality of substrates P (four in FIG. 1) are placed, and a pallet rail 52 that moves with the substrate transfer pallet 51. The transfer unit 5 has the same structure provided in parallel. The first and second conveying sections. The substrate transfer pallet 51 is moved by driving a nut (not shown) provided on the substrate transfer pallet 51 by a ball screw (not shown) provided along the pallet rail 52.

With such a configuration, the substrate transfer tray 51 is placed on the substrate supply unit 6 to place the substrate P, and moves along the tray rail 52 to the bonding position. After bonding, it moves to the substrate carrying portion 7 and transfers the substrate P to the substrate Carry out section 7. The first and second transfer units are driven independently of each other. While the substrate P placed on one substrate transfer tray 51 is bonding the wafer D, and the other substrate transfer tray 51 is used, the substrate P is removed and returned to the substrate supply. The unit 6 prepares for placing a new substrate P and the like.

The control unit 8 is a memory including a program (software) that stores and monitors the operation of each unit of the chip splicer 10, and a central processing unit (CPU) that executes the programs stored in the memory.

Next, the configuration of the wafer supply unit 1 will be described using FIGS. 3 and 4. FIG. 3 is a perspective view showing the appearance of a wafer supply unit. FIG. 4 is a schematic cross-sectional view showing a main part of a wafer supply section.

The wafer supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction), and a push-up unit 13 that moves in the vertical direction. The wafer holding table 12 includes an expansion ring 15 holding a wafer ring 14 and a support ring 17 for horizontally positioning a dicing tape 16 that holds a plurality of wafers D held on the wafer ring 14. The push-up unit 13 is disposed inside the support ring 17.

The wafer supply unit 1 lowers the expansion ring 15 holding the wafer ring 14 when the wafer D is pushed up. As a result, the dicing tape 16 held on the wafer ring 14 is stretched and the interval between the wafers D is increased, and the wafer D is pushed up from below the wafer D by the push-up unit 13 to improve the pick-up property of the wafer D. In addition, along with the reduction in thickness, the adhesive for bonding the wafer to the substrate is changed from a liquid state to a thin film state, and a thin film-shaped adhesive material called a die attach film (DAF) 18 is pasted between the wafer 11 and the dicing tape 16. On the wafer 11 having the wafer film 18, dicing is performed on the wafer 11 and the wafer film 18. Therefore, in the peeling step, the wafer 11 and the wafer film 18 are peeled from the dicing tape 16. In the following, the presence of the wafer film 18 is ignored, and the peeling step will be described.

Next, the push-up unit will be described using FIG. 5. FIG. 5 is a top view of the push-up unit of FIG. 4.

The push-up unit 13 basically has a push-up block portion 131 and a peripheral portion 132 surrounding the push-up block portion 131. The push-up block section 131 includes a first block 131a and a second block 131b located inside the first block 131a. The peripheral portion 132 has a plurality of suction holes 132a.

Next, a review technique (hereinafter, referred to as a comparative example) by the present inventors will be described with reference to FIGS. 6 and 7. Fig. 6 is a longitudinal sectional view showing a collet portion and a push-up unit in a comparative example. FIG. 7 is a bottom view of the collet portion of FIG. 6. FIG.

As shown in FIG. 6, the collet portion 22R includes a rubber head holder 25R and a rubber head holder 24R holding the rubber head 25R. A vacuum suction hole 251R is provided in the rubber head 25R. A vacuum suction hole 26R is provided in the center of the rubber head holder 24R, and a vacuum suction groove 27R is provided on the upper side of the rubber head 25R of the rubber head holder 24R. As shown in FIG. 7, the rubber head 23R has a rectangular shape similar to the wafer D in plan view, and is formed to have the same size as the wafer D. The push-up unit 13 is the same as the push-up unit 13 of the embodiment.

The picking operation of the comparative example starts from the positioning of the wafer D (the peeling target wafer) as the target on the dicing tape 16 on the push-up unit 13 and the collet portion 22R. When the positioning is completed, vacuum is passed through the suction holes 132 a or the gaps 131 c and 131 d of the push-up unit 13 to suck the cutting tape 16 on the upper surface of the push-up unit 13. In this state, the collet portion 22R is lowered and landed while being evacuated toward the device surface of the wafer D. Here, when the main part of the push-up unit 13, that is, the push-up block portion 131 is raised, the wafer D is raised and raised next to the collet portion 22R and the push-up block 131. The peripheral portion is still vacuum-adsorbed on the peripheral portion 132 of the push-up block portion 131, and tension is generated around the wafer D. As a result, the dicing tape 16 is peeled off around the wafer D. On the other hand, at this time, the periphery of the wafer D is subjected to stress and bending on the outside. In this way, a gap occurs between the lower surface of the collet, and air flows into the vacuum suction system (leakage) of the collet portion 22R. Once leaked, when the wafer D is separated, it cannot be held again until the wafer D flexes under the suction surface.

Next, the collet portion of the embodiment will be described using FIG. 8. Fig. 8 (A) is a longitudinal sectional view of a collet portion according to the embodiment. Fig. 8 (B) is a bottom view of the collet portion of Fig. 8 (A).

The collet portion 22 includes a suction portion 25, a central portion 24 holding the suction portion 25, an outer peripheral portion 28 located outside the central portion 24, and a telescopic tube (snake tube) portion 29 located on the outer peripheral portion 28.

The suction section 25 is formed of, for example, a rubber head, and is provided with a vacuum suction hole (first suction hole) (not shown) similar to the comparative example. The suction section 25 has a rectangular shape similar to the wafer D, but is smaller than the wafer D.

The central portion 24 includes a holding portion 241 holding the suction portion 25, a tubular portion 242 extending upward from the holding portion 241, and a mounting portion 243 extending horizontally from the tubular portion 242. A vacuum suction hole (second suction hole) 26 is provided in the center of the tubular portion 242, and a vacuum suction groove 27 is provided on the upper surface side of the suction portion 25 of the holding portion 241.

The outer peripheral portion 28 is formed of a vertical portion 281 and a horizontal portion 282 and has a box shape. The outer peripheral portion 28 has a space 283 between the outer peripheral portion 28 and the central portion 24. A portion of the inside of the vertical portion 281 facing the outside of the holding portion 241 of the central portion 24 is narrowed to form a suction hole (third suction hole) 285. The outer peripheral portion 28 is movable up and down along the tubular portion 242. A contact portion 221 that is in contact with the wafer D is provided below the vertical portion 281 of the outer peripheral portion 28. The contact portion 221 is deformed by a force from above, and can be closely adhered following the deformation of the wafer D.

The telescopic tube portion (telescoping tube mechanism) 29 is arranged to surround the tubular portion 242. The upper end of the telescopic tube 291 is connected to the mounting portion 243, and the lower end is connected to the horizontal portion 282 of the outer peripheral portion 28. There is room 292. The space 292 is connected by the space 283 and the communication hole 284 provided in the horizontal portion 282 of the outer peripheral portion 28. The space 292 is connected to the vacuum suction hole 26 through a hole (not shown). The outer peripheral portion 28 moves up and down by the vertical movement of the telescopic tube portion 29.

The outer periphery of the bottom surface of the collet portion 22 is the same rectangular shape as the wafer D, and has the same size as the wafer D. The outer periphery of the bottom surface of the collet portion 22 may be made larger or smaller than the wafer D. However, it is necessary that the inner side of the outer peripheral portion 28 (the contact portion 221) is positioned more than the outer peripheral position of the wafer D.

Next, the pick-up operation according to the collet unit according to the embodiment will be described with reference to FIGS. 5, 9A to 9E, and 10. 9A to 9E are cross-sectional views of the collet portion and the push-up unit of the embodiment. FIG. 10 is a flowchart showing a processing flow of a pickup operation.

Step S1: The control unit 8 moves the wafer holding table 12 so that the picked-up wafer D is positioned directly above the push-up unit 13, and positions the peeling target wafer on the push-up unit 13 and the collet unit 22. The push-up unit 13 is moved so that the upper surface of the push-up unit 13 comes into contact with the back surface of the cutting tape 16. At this time, as shown in FIG. 9A, the control unit 8 is configured so that each of the blocks 131a, 131b of the push-up block portion 131 and the surface of the peripheral portion 132 form the same plane. The gaps 131c and 131d between the blocks are evacuated, and the cutting tape 16 is attracted to the upper surface of the push-up unit 13.

Step S2: As shown in FIG. 9A, the control unit 8 lowers the collet portion 22 while applying a vacuum, and lands on the wafer D to be peeled, using the suction portion 25 having the suction hole and the suction hole 285 ( (See FIG. 8) The wafer D is sucked.

Step S3: The control unit 8 raises the first block 131a and the second block 131b of the push-up block unit 131, which are the main parts of the push-up unit 13. Thereby, the wafer D is lifted under the collet portion 22 and the push-up block portion 131, and the peripheral portion of the dicing tape 16 is still vacuum-adsorbed on the peripheral portion 132 of the push-up block portion 131, and Tension is generated around the wafer D, and as a result, the dicing tape 16 is peeled off around the wafer D. On the other hand, at this time, as shown in FIG. 9B, the periphery of the wafer D is subjected to stress and bending on the lower side. In this way, a gap is formed between the lower surface of the collet and the vacuum suction system of the collet portion 22 (leakage occurs).

However, as shown in FIG. 9C, the spaces 283 and 292 of the collet portion 22 are released from the vacuum, and the retractable tube 291 is used to expand the retractable tube 291 in the downward direction to lower the outer peripheral portion 28. Thereby, the influence of leakage is absorbed.

Step S4: The control part 8 raises the collet part 22. Thereby, as shown in FIG. 9D, the wafer D is peeled from the dicing tape 16. As shown in FIG. 9E, the spaces 283 and 292 inside the collet portion 22 become vacuum, the telescopic tube 291 narrows upward, the outer peripheral portion 28 is pulled up, the periphery of the wafer D is also pulled up, and the wafer D becomes flat. Even if the wafer D is separated and flexed under the suction surface due to leakage, the wafer D can be kept flat again. Thereby, the flat wafer D can be transferred.

Step S5: The control unit 8 creates the blocks 131a, 131b of the push-up block portion 131 to form the same plane as the surface of the peripheral portion 132, and stops using the gap 131c between the suction hole 132a of the peripheral portion 132 and the block. 131d 的 attracting cutting tape 16. The control unit 8 moves the push-up unit 13 so that the upper surface of the push-up block portion 131 is separated from the rear surface of the cutting tape 16.

The control unit 8 performs steps S1 to S5 repeatedly, and picks up a good wafer of the wafer 11.

Next, a method for manufacturing a semiconductor device using a wafer bonder according to an embodiment will be described with reference to FIG. 11. FIG. 11 is a flowchart showing a method of manufacturing a semiconductor device.

Step S11: The wafer ring 14 holding the dicing tape 16 holding the wafer D divided from the wafer 11 is stored in a wafer cassette (not shown) and carried into the wafer adapter 10. The control unit 8 supplies the wafer ring 14 to the wafer supply unit 1 from a wafer cassette filled with the wafer ring 14. In addition, the substrate P is prepared and carried into the wafer bonder 10. The control unit 8 places the substrate P on the substrate transfer tray 51 in the substrate supply unit 6.

Step S12: The control unit 8 picks up the divided wafer from the wafer by using steps S1 to S5.

Step S13: The control unit 8 mounts the picked-up wafer on the substrate P or laminates the bonded wafer. The control unit 8 places the wafer D picked up from the wafer 11 on the intermediate stage 31, picks up the wafer D again from the intermediate stage 31 with the bonding head 41, and performs bonding on the transferred substrate P.

Step S14: The control unit 8 is based on the substrate carrying-out unit 7 and takes out the substrate P to which the wafer D is bonded from the substrate carrying tray 51. The substrate P is carried out from the wafer bonder 10.

    <Modification 1>    

Next, a collet portion according to Modification 1 will be described with reference to FIG. 12. FIG. 12 (A) is a longitudinal sectional view of a collet portion according to Modification 1. FIG. Fig. 12 (B) is a bottom view of the collet portion of Fig. 12 (A).

The collet portion 22A is a thing in which a hat portion 222 is added to the collet portion 22. The cap portion 222 is adhered to the contact portion 221 of the collet portion 22 in a thin plate shape, and is connected to the outside of the holding portion 241 and the lower surface of the outer peripheral portion 28. In this example, vacuum introduction grooves 223 are provided at eight locations. By providing the cap portion 222, the number of places that follow the deformation of the wafer D increases, and the adhesion with the wafer D is improved. In addition, a portion having no cap portion 222 under the outer peripheral portion 28 has a contact portion 221 in the same manner as in the embodiment. Instead of the cap portion 222, a sheet-like structure having a suction hole may be provided between the lower surface of the holding portion 241 and the lower surface of the outer peripheral portion 28. The cap portion may be added to a collet portion of Modifications 2 and 3 described later.

Next, the pick-up operation according to the collet section according to Modification 1 will be described with reference to FIGS. 13A to 13E. 13A to 13E are cross-sectional views of a collet portion and a push-up unit according to Modification 1. FIG. 13A to 13E are diagrams corresponding to Figs. 9A to 9E, respectively.

As shown in FIG. 13A, the control unit 8 is configured to push up each of the blocks 131a, 131b of the block portion 131 to form the same plane as the surface of the peripheral portion 132, and pass through the suction hole 132a of the peripheral portion 132 to the block. The gaps 131c and 131d are evacuated, and the cutting tape 16 is adsorbed on the upper surface of the push-up unit 13 (step S1).

In addition, as shown in FIG. 13A, the control unit 8 lowers the collet portion 22A while vacuuming, and lands on the wafer D to be peeled, and uses the suction portion 25 and the suction hole 283 with suction holes to lift the wafer. D adsorption (step S2).

As shown in FIG. 13B, when the control unit 8 raises the first block 131a and the second block 131b of the push-up block 131, which is the main part of the push-up unit 13, the periphery of the wafer D is formed on the lower side to receive Stress and bending cause a gap between the lower surface of the collet and air flow into the vacuum suction system (leakage) of the collet portion 22A. However, as shown in FIG. 13C, the spaces 283 and 292 of the collet portion 22A are released from the vacuum, and the restoring force of the telescopic tube 291 is used to expand the telescopic tube 291 in the downward direction to lower the outer peripheral portion 28 (step S3). Thereby, the influence of leakage is absorbed. When the outer peripheral portion 28 is lowered, the hat portion 222 is inclined.

As shown in FIG. 13D, when the control unit 8 raises the collet, the wafer D is peeled from the dicing tape 16 (step S4). As shown in FIG. 13E, the spaces 283 and 292 inside the collet portion 22A become vacuum, the telescopic tube 291 narrows upward, the outer peripheral portion 28 is pulled up, the periphery of the wafer D is also pulled up, and the wafer D becomes flat. When the outer peripheral portion 28 rises, the hat portion 222 also becomes horizontal. Even if the wafer D is separated and flexed due to the leak until it is under the suction surface, the wafer D can be kept flat again. Thereby, the flat wafer D can be transferred.

    <Modification 2>    

Next, a collet portion according to Modification 2 will be described with reference to FIG. 14. Fig. 14 (A) is a longitudinal sectional view of a collet portion according to the embodiment. Fig. 14 (B) is a bottom view of the collet portion of Fig. 14 (A).

The collet part 22B is a thing provided with the diaphragm part 29B instead of the telescopic tube part 29 of the collet part 22. The diaphragm (diaphragm) portion (diaphragm mechanism) 29B is arranged to surround the tubular portion 242. The inner end of the diaphragm 291B is connected to the lower portion of the mounting portion 243B, and the outer end is connected to the upper portion of the cylindrical portion 286B provided on the upper portion of the outer peripheral portion 28B. . The tube portion 286B is annular in a plan view. A space 283 between the central portion 24B and the outer peripheral portion 28B and a space 292B between the tubular portion 242 and the diaphragm portion 29B are connected by a communication hole 284 provided in the horizontal portion 282 of the outer peripheral portion 28B. The space 292B is connected to the vacuum suction hole 26 through a hole (not shown). Normally, the lower surface of the mounting portion 243B is positioned lower than the upper portion of the cylindrical portion 286B. The diaphragm portion 29B moves up and down to constitute the outer peripheral portion 28B move up and down.

Next, the pick-up operation according to the collet section according to Modification 2 will be described with reference to FIGS. 9A to 9E and 15A to 15E. 15A to 15E are cross-sectional views of a collet portion and a push-up unit according to Modification 2. FIG. 15A to 15E are diagrams corresponding to Figs. 9A to 9E, respectively.

As shown in FIG. 15A, the control unit 8 is configured to push up the blocks 131a, 131b of the block portion 131 to form the same plane as the surface of the peripheral portion 132, and pass through the suction holes 132a of the peripheral portion 132 and the blocks. The gaps 131c and 131d are evacuated, and the cutting tape 16 is adsorbed on the upper surface of the push-up unit 13 (step S1).

In addition, as shown in FIG. 15A, the control unit 8 lowers the collet portion 22B while evacuating, and lands on the wafer D to be peeled, and uses the suction portion 25 having the suction hole and the suction hole 283 to hold the wafer. D adsorption (step S2).

As shown in FIG. 15B, when the control unit 8 raises the first block 131a and the second block 131b of the push-up block section 131, which is the main part of the push-up unit 13, the periphery of the wafer D is formed on the lower side to receive Stress and bending cause a gap between the lower surface of the collet and air flow into the vacuum suction system of the collet portion 22B (leakage occurs). However, as shown in FIG. 15C, the spaces 283 and 292B of the collet portion 22B are released from the vacuum, the upper surface is leveled by the restoring force of the diaphragm 291B, and the outer peripheral portion 28B is lowered (step S3). Thereby, the influence of leakage is absorbed.

As shown in FIG. 15D, when the control unit 8 raises the collet, the wafer D is peeled from the dicing tape 16 (step S4). As shown in FIG. 15E, the spaces 283 and 292B inside the collet portion 22B become vacuum, the upper peripheral portion of the diaphragm 291B moves in the upward direction, the outer peripheral portion 28B is pulled up, the periphery of the wafer D is also pulled up, and the wafer D becomes flat. Even if the wafer D is separated and flexed due to the leak until it is under the suction surface, the wafer D can be kept flat again. Thereby, the flat wafer D can be transferred.

    <Modification 3>    

Next, a collet portion according to Modification 3 will be described with reference to FIG. 16. Fig. 16 (A) is a longitudinal sectional view of a collet portion according to the embodiment. Fig. 16 (B) is a bottom view of the collet portion of Fig. 16 (A).

The collet portion 22C is a piston portion 29C provided in place of the telescopic tube portion 29 of the collet portion 22. The piston portion 29C is disposed so as to surround the tubular portion 242 and includes a cover portion 291C and a spring 293C. The inner end of the cover portion 291C is connected to the lower surface of the mounting portion 243C, and the outer end is connected to the upper portion of the cylindrical portion 286C. The spring 293C is provided between the horizontal portions 282 of the outer peripheral portion 28C. A space 283 between the central portion 24C and the outer peripheral portion 28C and a space 292C between the tubular portion 242 and the piston portion 29C are connected by a communication hole 284 provided in the horizontal portion 282 of the outer peripheral portion 28C. The space 292C is connected to the vacuum suction hole 26 through a hole (not shown). The tube portion 286C is annular in a plan view. The spring 293C moves up and down, and the outer peripheral portion 28C moves up and down.

Next, the pick-up operation by the collet unit according to Modification 3 will be described with reference to FIGS. 17A to 17E. 17A to 17E are cross-sectional views of a collet portion and a push-up unit according to Modification 3. FIG. 17A to 17E are diagrams corresponding to Figs. 9A to 9E, respectively.

As shown in FIG. 17A, the control unit 8 is configured to push up each of the blocks 131a, 131b of the block portion 131 to form the same plane as the surface of the peripheral portion 132, and pass through the suction hole 132a of the peripheral portion 132 to the block. The gaps 131c and 131d are evacuated, and the cutting tape 16 is adsorbed on the upper surface of the push-up unit 13 (step S1).

In addition, as shown in FIG. 17A, the control unit 8 lowers the collet portion 22C while vacuuming, and lands on the wafer D to be peeled, and uses the suction portion 25 and the suction hole 283 with suction holes to lift the wafer. D adsorption (step S2).

As shown in FIG. 17B, when the control unit 8 raises the first block 131a and the second block 131b of the push-up block section 131, which is the main part of the push-up unit 13, the periphery of the wafer D is formed on the lower side to receive Stress and bending cause a gap between the lower surface of the collet and air flow into the vacuum suction system of the collet portion 22C (leakage occurs). However, as shown in FIG. 17C, the spaces 283 and 292C of the collet portion 22C are released from the vacuum, and the restoring force of the spring 293C is used to lower the outer peripheral portion 28C (step S3). Thereby, the influence of leakage is absorbed.

As shown in FIG. 17D, when the control unit 8 raises the collet, the wafer D is peeled from the dicing tape 16 (step S4). As shown in FIG. 17E, the spaces 283 and 292C inside the collet portion 22C become vacuum, the lower end of the spring 293C moves upward, the outer peripheral portion 28C is pulled up, the periphery of the wafer D is also pulled up, and the wafer D becomes flat. Even if the wafer D is separated and flexed due to the leak until it is under the suction surface, the wafer D can be kept flat again. Thereby, the flat wafer D can be transferred.

    <Modification 4>    

Next, a collet portion according to Modification 4 will be described with reference to FIG. 18. 18 is a longitudinal sectional view of a collet portion according to a fourth modification.

The collet portion 22D is obtained by changing the diaphragm configuration of the diaphragm portion 29B of the collet portion 22B. The diaphragm portion 29D may be configured such that the two diaphragms 291B and 293B are arranged in parallel and spaced apart at two places so as to surround the tubular portion 242. The inner end of the diaphragm 291B is connected to the lower surface of the mounting portion 243B, and the outer end is connected to the upper portion of the outer peripheral portion 28D. The inner end of the diaphragm 293B is provided with a horizontal portion 282 instead of the outer peripheral portion 28B of Modification 2. The inner end is connected to the lower surface of the mounting portion 244B at the same interval as the diaphragm 291B, and the outer end is connected to the outer peripheral portion 28D . With this structure, the inner surface of the outer peripheral portion 28D and the outer surface of the holding portion 241 are constantly kept parallel with two diaphragms to prevent contact. This can prevent foreign matter, bite, and malfunction due to contact.

    <Modification 5>    

Next, a modified example of the pick-up operation by the collet unit according to the embodiment will be described with reference to FIGS. 9A to 9C, 19, 20A, and 20B.

Step S1: The control unit 8 moves the wafer holding table 12 so that the picked-up wafer D is positioned directly above the push-up unit 13, and positions the peeling target wafer on the push-up unit 13 and the collet unit 22. The push-up unit 13 is moved so that the upper surface of the push-up unit 13 comes into contact with the back surface of the cutting tape 16. At this time, as shown in FIG. 9A, the control unit 8 is configured so that each of the blocks 131a, 131b of the push-up block portion 131 forms the same plane as the surface of the peripheral portion 132, and passes through the suction holes 132a of the peripheral portion 132 and The gaps 131c and 131d between the blocks are evacuated, and the cutting tape 16 is attracted to the upper surface of the push-up unit 13.

Step S2: As shown in FIG. 9A, the control unit 8 lowers the collet portion 22 while vacuuming, and lands on the wafer D to be peeled, and uses the suction portion 25 having the suction hole and the suction hole 283 to Wafer D is adsorbed.

Step S3: The control unit 8 raises the first block 131a and the second block 131b of the push-up block unit 131, which are the main parts of the push-up unit 13. Thereby, the wafer D is lifted under the collet portion 22 and the push-up block portion 131, and the peripheral portion of the dicing tape 16 is still vacuum-adsorbed on the peripheral portion 132 of the push-up block portion 131, and Tension is generated around the wafer D, and as a result, the dicing tape 16 is peeled off around the wafer D. On the other hand, at this time, as shown in FIG. 9B, the periphery of the wafer D is subjected to stress and bending on the lower side. In this way, a gap is formed between the lower surface of the collet and the vacuum suction system of the collet portion 22 (leakage occurs).

However, as shown in FIG. 9C, the spaces 283 and 292 of the collet portion 22 are released from the vacuum, and the retractable tube 291 is used to expand the retractable tube 291 in the downward direction to lower the outer peripheral portion 28.

Step S31: The control unit 8 makes each block 131a, 131b of the push-up block portion 131 and the surface of the peripheral portion 132 form the same plane to lower the collet. Thereby, as shown in FIG. 20A, the spaces 283 and 292 inside the collet portion 22 become vacuum, the telescopic tube 291 becomes narrower in the upward direction, the outer peripheral portion 28 is pulled up, the periphery of the wafer D is also pulled up, and the wafer D Becomes flat. Even if the wafer D is separated and flexed due to the leak until it is under the suction surface, the wafer D can be kept flat again. Thereby, the flat wafer D can be transferred.

Step S4: The control part 8 raises the collet part 22. Thereby, as shown in FIG. 20B, the wafer D is peeled from the dicing tape 16.

Step S51: The control unit 8 stops the suction cutting tape 16 using the suction holes 132a of the peripheral portion 132 and the gaps 131c and 131d between the blocks. The control unit 8 moves the push-up unit 13 so that the upper surface of the push-up portion 131 is separated from the rear surface of the cutting tape 16.

The control unit 8 performs steps S1 to S51 repeatedly, and picks up a good wafer of the wafer 11.

The picking operation of the fifth modification is applicable not only to the collets of the embodiment but also to the collet portions of the first to fourth modifications. The same effect can be exhibited by using the collet portion of the comparative example and performing the same operation as that of the pickup operation of the fifth modification. Even if the wafer D is deflected in the state shown in FIG. 6, when the wafer D is leveled (wafer D is deflected) when it is performed in the same manner as in step S31 (FIG. 20A), the collet portion 22R can hold the wafer D again. . Thereby, when raising the collet part 22R in step S4, the wafer D can be peeled from the dicing tape 16 similarly to FIG. 20B.

According to the above embodiments and modifications, the following effects can be achieved.

(1) With regard to the collet of the embodiment, the cross-sectional shape of the picked-up wafer can be followed, and the outer peripheral portion of the collet can be automatically picked up and down to prevent leakage when the wafer is sucked, and can be reliably picked up.

(2) With regard to the collet of the embodiment, the outer peripheral portion of the collet can be moved up and down automatically (naturally) using the telescopic tube function in response to the suction pressure in the collet.

(3) With regard to the collet of the embodiment, the reaction force (restoring force) of the collet outer peripheral portion to the wafer and the reference position of the outer peripheral portion when picking up can be controlled using the reaction force of the telescopic tube.

(4) Regarding the collets of Modifications 2 and 4, the outer peripheral portion of the collet can be moved up and down automatically (naturally) by the diaphragm in response to the suction pressure in the collet.

(5) Regarding the collets of Modifications 2 and 4, the back pressure of the diaphragm can be controlled, and the reaction force (restoring force) and position of the collet outer peripheral portion to the wafer can be controlled.

(6) Regarding the collets of Modifications 2 and 4, the back pressure of the diaphragm can be controlled, and the wafer is adsorbed in a state where the position of the outer peripheral portion is protruded at the start of pickup.

(7) Regarding the collet of Modification 1, the cap structure is provided on the outer periphery of the suction portion, and the cross-sectional shape of the picked-up wafer can be changed, so that the outer periphery of the collet can be automatically moved up and down to press down the cap structure. Peripheral to prevent leakage.

(8) With regard to the collet according to Modification 1, the outer peripheral portion and the surface of the suction portion have a sheet-like structure, and the cross-sectional shape of the picked-up wafer can be changed to suppress the outer peripheral portion to prevent leakage.

(9) With regard to the collet according to Modification 3, the outer peripheral portion of the collet can be automatically (naturally) moved up and down by using the compression force formed by the internal pressure of the piston according to the adsorption pressure in the collet by having a piston shape. move.

(10) Regarding the pickup operation of the modification 5, the wafer D can be formed horizontally by lowering the collet portion and the push-up block portion, so that the inside of the collet portion 22 can be made more vacuum.

In the foregoing, the creation by the creator of the present case has been specifically described based on the embodiment and the modification, but the creation is not limited to the foregoing embodiment and modification, and of course, various changes can be made.

In the embodiment, an example is described in which a wafer is pushed up using a block, but a pin (injection needle) may be used instead of the block.

In the embodiment, an example in which a wafer film is used is described, but it may be provided in a preform portion of a substrate coating adhesive without using a wafer film.

In addition, in the embodiment, a wafer bonder that picks up a wafer from a wafer supply unit with a pick-up head and places it on an intermediate stage, and uses a bonding head to bond a wafer placed on the intermediate stage to a substrate will be described. However, it is not limited to this, and can be applied to a semiconductor manufacturing apparatus that picks up a wafer from a wafer supply unit.

For example, the present invention is also applicable to a wafer bonder that does not have an intermediate stage and a pick-up head, and uses a bonding head to bond a wafer of a wafer supply unit to a substrate.

It can also be applied to a flip-chip bonder that does not have an intermediate stage, picks up a wafer from a wafer supply unit, rotates the wafer pick-up head upward, delivers the wafer to a bonding head, and bonds the bonding head to a substrate.

In addition, it can be applied to a wafer sorter that does not have an intermediate stage and a bonding head, and mounts a wafer picked up by a pick-up head from a wafer supply unit on a tray or the like.

Claims (14)

A semiconductor manufacturing apparatus is characterized by including a collet section for adsorbing a die. The collet section includes a suction section having a first suction hole and a vicinity of a center that adsorbs the wafer, and a holding section that holds the suction section. A tubular portion connected to the holding portion and having a second suction hole connected to the first suction hole is positioned on the holding portion and the outer peripheral portion of the tubular portion, and on the holding portion and the tubular portion and the outer periphery. The third suction hole formed between the parts and the peripheral part of the wafer are deflected downward to cause the third suction hole to leak, and the internal pressure is increased to press the outer peripheral part to abut. It is connected to the peripheral portion of the wafer, and means for pulling up the outer peripheral portion and pulling up the peripheral portion of the wafer by eliminating the occurrence of the leakage and reducing the internal pressure. For example, the semiconductor manufacturing device described in item 1 of the patent application range, wherein the aforementioned means is a telescopic tube mechanism provided above the outer peripheral portion and outside the tubular portion; when the internal pressure is increased, the restoring force of the telescopic tube mechanism is used. The outer peripheral portion is depressed, and when the internal pressure is reduced, the outer peripheral portion is pulled up by its suction force. The semiconductor manufacturing device according to item 2 of the scope of patent application, wherein the telescopic tube mechanism includes a mounting portion extending horizontally from the tubular portion, a horizontal portion of the outer peripheral portion, and a level connected to the mounting portion and the outer peripheral portion. The telescopic tube formed between the parts communicates with a hole provided in the horizontal part of the outer peripheral part, so that the telescopic tube mechanism communicates with the third suction hole. The semiconductor manufacturing device according to item 1 of the scope of the patent application, wherein the aforementioned means is a diaphragm mechanism provided above the outer peripheral portion and outside the tubular portion; when the internal pressure increases, the outer periphery is restored by the restoring force of the diaphragm mechanism. When the internal pressure is reduced, the outer peripheral portion is pulled up by its suction force. The semiconductor manufacturing device according to item 4 of the scope of patent application, wherein the diaphragm mechanism is connected by a mounting portion extending horizontally from the tubular portion, a horizontal portion above the outer peripheral portion, a vertical portion above the outer peripheral portion, and The diaphragm is formed between the mounting portion, the horizontal portion of the upper portion of the outer peripheral portion, and the vertical portion of the upper portion of the outer peripheral portion, and communicates with a hole provided in the upper portion of the outer peripheral portion to connect the diaphragm mechanism to the second pumping portion. The suction holes communicate. The semiconductor manufacturing device according to item 4 of the scope of patent application, wherein the diaphragm mechanism includes a first mounting portion extending horizontally from the tubular portion, and a second mounting portion extending horizontally from the tubular portion below the first mounting portion. A mounting portion, a horizontal portion above the outer peripheral portion, a first diaphragm connected between the first mounting portion and the upper portion of the outer peripheral portion, and a connection between the second mounting portion and the upper portion below the outer peripheral portion The second diaphragm is formed between the outer peripheral portions. The semiconductor manufacturing device according to item 1 of the patent application range, wherein the aforementioned means is a piston mechanism provided above the outer peripheral portion and outside the tubular portion; when the internal pressure increases, the outer periphery is restored by the restoring force of the piston mechanism. When the internal pressure is reduced, the outer peripheral portion is pulled up by its suction force. The semiconductor manufacturing device according to item 6 of the scope of patent application, wherein the piston mechanism is connected by a mounting portion extending horizontally from the tubular portion, a horizontal portion above the outer peripheral portion, a vertical portion above the outer peripheral portion, and one end. A cover portion which is a vertical portion connected to the lower portion of the mounting portion and the tubular portion and the other end of which is connected to the upper portion of the outer peripheral portion, and a spring portion connected between the cover portion and the horizontal portion of the upper portion of the outer peripheral portion, and A hole provided in an upper portion of the outer peripheral portion communicates with the piston mechanism and the second suction hole. The semiconductor manufacturing device according to item 1 of the scope of patent application, further comprising a unit for sucking the wafer from below the dicing tape, pushing up, and a pick-up head for mounting the collet. The semiconductor manufacturing device according to item 8 of the scope of patent application, further comprising an intermediate stage on which the wafer picked up by the pickup head is placed, and a wafer to be placed on the intermediate stage is placed on a substrate or on a substrate. A bonding head for bonding on a bonded wafer. According to the semiconductor manufacturing apparatus described in claim 1 in the patent application scope, the wafer further includes a die attach film between the wafer and the dicing tape. A method for manufacturing a semiconductor device, comprising: (a) a step of preparing a wafer ring for holding a dicing tape with a wafer, (b) a step of preparing the substrate, and (c) a step of pushing the wafer by the push-up unit. The step of pushing up and picking up the wafer with the collet; the step (c) includes: (c1) a step of adsorbing the dicing tape, (c2) after the step (c1), lowering the collet and adsorbing the aforementioned In the wafer step, (c3) the step of raising the block of the push-up unit and the collet after the step (c2), and (c4) after the step (c3), the push-up The block of the unit and the step of lowering the collet, and (c5) the step of raising the collet after the step (c4). The method for manufacturing a semiconductor device according to item 11 of the scope of patent application, further comprising (d) a step of bonding the wafer on a substrate or a wafer to be bonded. For example, the method for manufacturing a semiconductor device according to item 12 of the application, wherein the step (c) further includes a step of placing the picked-up wafer on an intermediate stage; the step (d) further includes a step from the aforementioned The intermediate stage picks up the aforementioned wafer.