JP2007194571A - Separation method and equipment of semiconductor chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a separation method and equipment of an innovative and very thin semiconductor chip, by which the semiconductor chip hasn't any scar, crack and chipping even with very thin form, and the semiconductor chip is separated from an adhesive tape with very sufficient yield to make it possible to take out the semiconductor chip, by taking care that any stress concentration doesn't occur in the semiconductor chip in case of peeling off the semiconductor chip from the adhesive tape, accordingly the semiconductor chip of 20 μm to 30 μm in the very thin form can be peeled off from the adhesive tape that has been conventionally considered impossible. <P>SOLUTION: The separation method of the semiconductor chip constitutes the steps of approaching a collet 9 to pinch a semiconductor chip 2 and an adhesive tape 3, by means of the collet 9 and a nozzle 8 in the state of pushing up the semiconductor chip 2 from the nozzle 8; synchronizing the nozzle 8 with the collet 9 at the same speed in this state to elevate the nozzle 8 and the collet 9; and peeling off a square portion 2d of the semiconductor chip 2 from the adhesive tape 3 in the first place. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip separation method and apparatus, and more particularly, to a semiconductor chip separation method capable of peeling an ultrathin semiconductor chip having a thickness of 20 to 30 μm, which has been impossible in the past, from an adhesive tape. In order to prevent stress concentration on the semiconductor chip when the semiconductor chip is peeled off from the adhesive tape, there is no scratch, crack, chipping, etc. The present invention relates to an epoch-making ultrathin semiconductor chip separation method and apparatus, which can often be separated from an adhesive tape and taken out.

In a semiconductor manufacturing process, a semiconductor wafer chip is affixed on an adhesive tape, semiconductor elements are formed on the semiconductor wafer, and the semiconductor elements are cut and separated one by one by a dicing apparatus to form a semiconductor chip. The semiconductor chips are spaced apart from each other, separated one by one, separated and taken out (pickup).

At this time, as a means for separating the semiconductor chip from the adhesive tape, there are many conventional methods, and a typical one pushes up the semiconductor chip from below the adhesive tape with a plurality of pointed needles. At the same time, it is a system in which it is adsorbed by a collet located above the semiconductor chip and separated from the adhesive tape for separation (Patent Documents 1 and 2).

However, since the tip of the needle is small in diameter and sharp, there is a problem that stress concentration occurs at the push-up position. In particular, due to the recent increase in mounting density in devices such as mobile phones, the thickness of the semiconductor chip is, for example, 20 to 20 Since the thickness is as thin as 50 μm, there is a possibility that the semiconductor chip may be damaged or the semiconductor chip may be broken during the push-up.

Further, in separating the semiconductor chip, the Dun bonding apparatus disclosed in Patent Document 1 is configured such that the thrust needle vibrates in the axial direction of the thrust needle or in the direction perpendicular thereto. Similarly, there are a semiconductor chip with a rotational motion and a rocking motion (Patent Document 3) when separating the semiconductor chip. However, these require operations in various directions to separate the semiconductor chip. There is a problem that the structure becomes more complicated than that in which the driving direction of the push-up needle and the like and the separation direction of the semiconductor chip coincide with each other, and the time required for the separation of the semiconductor chip becomes longer.

As a device that does not use a push-up needle, there is a device that separates and separates the adhesive tape where the semiconductor chip is attached only by an adsorption operation (Patent Documents 4 and 5). However, in these cases, stress concentration occurs on the semiconductor chip surface at the end surface portion of the suction hole, which causes scratches and cracks.

Also in these cases. Since the semiconductor chip to be separated and the adjacent semiconductor chip are in the same plane, if the collet is large, the semiconductor chip in contact with the surrounding semiconductor chip adjacent to the semiconductor chip to be separated may be damaged or cracked. Therefore, the collet had to be made smaller than the size of the semiconductor chip.

However, if the collet is smaller than the semiconductor chip, the end of the semiconductor chip protrudes from the collet adsorption surface, stress concentration occurs at the contact position between the protruding part and the end of the collet, and scratches and cracks may occur. There were many.

And in the case of the structure which heats an adhesive tape and isolate | separates a semiconductor chip, there existed a fault that an adhesive paste remained on the back surface by the influence of heat (patent document 6).

20 to 22 includes a nozzle 4 that pushes up the adhesive tape 3 to which the semiconductor chip 2 is adhered, a nozzle holder (not shown) that holds the nozzle, and a cross section. A vacuum suction hole 5a formed in a circular shape and provided with a collet 5 formed with a suction hole 5b that communicates with the vacuum suction hole 5b and opens in a cup shape. The nozzle 4 is raised in a state in which air is sucked downward (not shown) and the adhesive tape 2 is adsorbed to the nozzle 4, and the semiconductor chip 2 is separated from the adhesive tape 3 and separated. However, since the tip end portion 4a of the nozzle 4 is a flat surface and the circumferential angle portion 4b is a right angle, the circumferential angle portion of the nozzle 4 of the semiconductor chip 2 is pushed up as shown in FIG. Part facing 4b In addition, it is inevitable that scratches 2a, cracks or chips 2b are generated. As shown in FIGS. 21 and 22, the semiconductor chip 2 is vacuum-adsorbed by the collet 5 in such a defective product. As a result, the yield as a product is very poor, and the semiconductor chip 2 having a thickness of 20 to 30 μm, which is a very thin type, cannot be used.

JP-A-5-109869 JP 2002-184836 A JP 2000-323437 A JP 2000-353710 A JP 2001-118862 A JP-A-7-335720

  The present invention has been made in order to eliminate the above-described drawbacks of the prior art, and an object of the present invention is to form the tip of the nozzle into a convex smooth curved surface, and the semiconductor chip by the curved surface of the nozzle In this state, the collet is approached and the semiconductor chip and the adhesive tape are sandwiched between the collet and the nozzle. In this state, the nozzle and the collet are synchronized and raised at the same speed by the synchronous drive device of the nozzle and the collet. By first peeling the square part of the semiconductor chip from the adhesive tape, in addition to the same speed synchronous movement of the nozzle and collet, the semiconductor chip is pushed up by a curved surface close to a very smooth spherical surface It is possible to completely prevent the stress concentration from occurring at the position facing the peripheral edge of the nozzle of the square part of the nozzle, and the thickness is 20 to 30 μm. Even conductor chips, scratches, cracks, no chipping occurs, is to provide a semiconductor chip separation method and apparatus can be sufficiently put to practical use.

Another object is to form the tip of the nozzle in a cross shape with a hard material, fill the recesses at the four corners formed by the cross of the hard material with a soft material, and form the square portion of the soft material on the slope. The collet is approached with the semiconductor chip pushed up by the cross-shaped hard material of the nozzle and the soft material at the four corners, and the semiconductor chip and the adhesive tape are sandwiched between the collet and the nozzle. In this state, the nozzle and the collet And the nozzle and the collet synchronous drive device at the same speed, and the semiconductor chip square part is first peeled off from the adhesive tape, thereby facing the peripheral part of the nozzle of the semiconductor chip square part. However, by making it hit the soft material and its slope when pushing up, the generation of stress concentration at the corresponding position of the semiconductor chip is completely eliminated, and the semiconductor is in a very good state. Is to start peeling from the adhesive tape, and to prevent damage such as scratches, cracks, chips, etc. to the semiconductor chip. The separation from the adhesive tape can be sufficiently put into practical use.

In the present invention, the tip of the nozzle is formed into a convex and smoothly curved surface as described above, and the semiconductor chip and the nozzle are adhered to each other by bringing the collet closer with the semiconductor chip pushed up by the curved surface of the nozzle. In this state, the nozzle and the collet are raised synchronously at the same speed by the nozzle and collet synchronous drive device, and the square part of the semiconductor chip is first peeled off from the adhesive tape. In addition to the same-speed synchronous movement of the semiconductor chip and the collet, the adhesive tape and the semiconductor chip are pushed up by a curved surface close to a very smooth spherical surface, so that stress concentration occurs at the position facing the peripheral edge of the nozzle of the square part of the semiconductor chip. Even an ultra-thin semiconductor chip having a thickness of 20 to 30 μm does not cause scratches, cracks, chips, etc. An effect that can provide a semiconductor chip separation method and apparatus be practiced in.

In addition, the tip of the nozzle is formed into a cross shape with a hard material, and the concave portions at the four corners formed by the cross of the hard material are filled with the soft material to form the square portion of the soft material on the inclined surface. The collet is approached with the semiconductor chip pushed up by the letter-shaped hard material and the soft material at the four corners, and the semiconductor chip and the adhesive tape are sandwiched between the collet and the nozzle. In this state, the nozzle and collet are connected to the nozzle and collet. Since the synchronous drive device is synchronously moved up at the same speed and the square portion of the semiconductor chip is peeled off from the adhesive tape first, the position of the square portion of the semiconductor chip facing the peripheral edge of the nozzle By making it hit a soft material and its slope when raising, it is possible to completely eliminate the occurrence of stress concentration at that position of the semiconductor chip, and the semiconductor in a very good state There is an effect that the square portion of the chip starts to peel from the adhesive tape, and as a result, the semiconductor chip is not damaged, cracked, chipped or the like, and the ultrathin semiconductor chip of 20 to 30 μm from the adhesive tape is not damaged. The effect that the separation can be sufficiently put into practical use is obtained.

In short, the present invention (Claim 1) is supported by a nozzle holder while vacuum-sucking an adhesive tape to which a semiconductor chip is stuck, and the semiconductor chip is pushed up by a nozzle, separated from the adhesive tape, and separated. In the semiconductor chip separation method of taking out the semiconductor chip from the adhesive tape while being vacuum sucked by a collet, the tip of the nozzle is formed into a convex smooth curved surface, and the semiconductor chip is pushed up by the curved surface of the nozzle In this state, the collet is moved closer to sandwich the semiconductor chip and the adhesive tape between the collet and the nozzle. In this state, the nozzle and the collet are synchronously raised at the same speed, and the semiconductor chip The square portion is first peeled off from the adhesive tape.

Further, in the present invention (invention 2), the pressure-sensitive adhesive tape to which the semiconductor chip is attached is supported by a nozzle holder while being vacuum-sucked, the semiconductor chip is pushed up by the nozzle, separated from the pressure-sensitive adhesive tape, and separated. In the semiconductor chip separation method, in which the semiconductor chip is taken out from the adhesive tape while being vacuum-sucked by a collet, the tip of the nozzle is formed into a cross shape with a hard material, and the four corner recesses formed by the cross of the hard material A soft material is filled to form a square of the soft material on a slope, and the collet is brought close to the nozzle while the semiconductor chip is pushed up by the cross-shaped hard material of the nozzle and the soft material at the four corners. And the nozzle sandwich the semiconductor chip and the adhesive tape, and in this state, the nozzle and the collet are synchronized at the same speed. Raised, it is characterized in that for peeling the rectangular portion of the semiconductor chip to the first from the adhesive tape.

Further, in the present invention (invention 3), the pressure-sensitive adhesive tape to which the semiconductor chip is attached is supported by a nozzle holder while being vacuum-sucked, and the semiconductor chip is pushed up by the nozzle, separated from the pressure-sensitive adhesive tape, and separated. In a semiconductor chip separating apparatus for taking out the semiconductor chip from the adhesive tape while being vacuum sucked by a collet, the tip of the nozzle is formed into a convex smooth curved surface, and the semiconductor chip is pushed up by the curved surface of the nozzle In this state, the collet is moved closer, the semiconductor chip and the adhesive tape are sandwiched between the collet and the nozzle, and the nozzle and the collet are raised at the same speed in this state. A driving device is provided, and the square portion of the semiconductor chip is first peeled off from the adhesive tape. It is characterized in that it has constructed.

Further, in the present invention (Claim 4), the pressure-sensitive adhesive tape to which the semiconductor chip is attached is supported by a nozzle holder while being vacuum-sucked, and the semiconductor chip is pushed up by the nozzle, separated from the pressure-sensitive adhesive tape, and separated. In the semiconductor chip separating apparatus for taking out the semiconductor chip from the adhesive tape while being vacuum-sucked by a collet, the tip of the nozzle is formed into a cross shape with a hard material, and the recesses at the four corners formed by the cross of the hard material Filling with a soft material to form a square portion of the soft material on a slope, the collet is brought close to the nozzle while the semiconductor chip is pushed up by the cross-shaped hard material of the nozzle and the soft material at the four corners. The semiconductor chip and the adhesive tape are sandwiched between the collet and the nozzle, and the nozzle and the collet are synchronized at the same speed in this state. With a synchronous drive apparatus nozzle and collet raising Te, it is characterized in that the rectangular portion of the semiconductor chip and configured to initially peeled from the adhesive tape.

Hereinafter, the present invention will be described based on embodiments shown in the drawings. As shown in FIGS. 1 to 7, the semiconductor chip separation device 11 according to the present invention supports the adhesive tape 3 with the semiconductor chip 2 attached thereto by vacuum suction while supporting the semiconductor chip 2 by the nozzle 8. Is a semiconductor chip separating device for separating and separating the separated semiconductor chip 2 from the adhesive tape 3 while vacuum-sucking the separated semiconductor chip 2 with a collet 9, comprising a nozzle holder 6, a nozzle 8, A collet 9, means for evacuating along the outer peripheral shape of the nozzle 8, and a nozzle and collet synchronous drive device (not shown) are provided.

First, the first embodiment of the present invention shown in FIGS. 3 to 12 will be described. The nozzle holder 6 has a vacuum suction hole 6a larger than the outer peripheral shape of the semiconductor chip 2, and further sucks the adhesive tape 3 in a wide range. A plurality of vacuum suction holes 6b are provided, and are fixed to a base (not shown) so as not to move.

As shown in FIGS. 3, 4, 7, etc., the nozzle 8 is basically formed in a quadrangular prism shape with a horizontal cross section, and the length of one side of the square (the thickness of the nozzle 8) is Similarly, it is equal to the length of one side of the square semiconductor chip 2 and is set to have the same dimension, and the tip 8a is formed as a smooth curved surface 8b, that is, a curved surface 8b close to a spherical surface.

As shown in FIGS. 5, 6, 7, etc., the collet 9 has the same size as the length of one side of the semiconductor chip 2, and has a horizontal cross section with a size that allows vacuum suction to the square portion 2 d of the semiconductor chip 2. A vacuum suction hole 9a having a small diameter is formed in the center of the square, and a suction hole 9b that is communicated with the vacuum suction hole 9a and has a large square cup shape is formed in the lower end 9c. Has been. The upper portion 9d is formed in a cylindrical shape with a circular horizontal cross section.

The means for evacuating along the outer peripheral shape of the nozzle 8 is not shown, but is connected to a vacuum source such as a known vacuum pump. For example, the nozzle holder 6 and the collet 9 have a vacuum suction of about 420 mmHg. The vacuum suction holes 6a, 6b, 9a and the suction hole 9b have the ability to suck air.

Although not shown in the drawing, the nozzle and collet synchronous driving device brings the collet 9 close together with the semiconductor chip 2 pushed up by the nozzle 8 and sandwiches the semiconductor chip 2 and the adhesive tape 3 between the collet 9 and the nozzle 8. In this state, the nozzle 8 and the collet 9 are configured to rise synchronously at the same speed, so that stress concentration is not generated in the square portion 2d of the semiconductor chip 2, that is, the square of the semiconductor chip 2 is formed. The square portion 2d is first peeled off from the adhesive tape 3 without applying excessive force to the portion, that is, the square portion 2d starts to peel from the adhesive tape 3 earlier than the other portions. is there.

Next, the second embodiment of the present invention shown in FIGS. 13 to 19 will be described. The nozzle 28 is formed in a cross shape with a hard material 12 such as a hardened steel having a tip 28a made of stainless steel or chrome plating, The concave portions 28b formed by the hard material crosses 28c are filled with a soft material 10 such as urethane dust or foaming urethane resin to form the squares of the soft material on the inclined surface 10a having an angle of about 45 ° with respect to the horizontal plane. The adhesive tape 3 and the semiconductor chip 2 are pushed up by the cross-shaped hard material 12 and the soft materials 10 at the four corners.
Since the other parts are the same as those of the first embodiment, the same parts are denoted by the same reference numerals in the drawings, and the description thereof is omitted.

The method for separating a semiconductor chip according to the present invention (Claim 1) is to support the adhesive tape 3 to which the semiconductor chip 2 is attached by the nozzle holder 6 while sucking the vacuum, and push the semiconductor chip 2 up by the nozzle 8 to stick the adhesive tape. In the method for separating a semiconductor chip, the tip 8a of the nozzle 8 is formed into a convex and smooth curved surface in a method for separating the separated semiconductor chip 2 from the adhesive tape 3 while vacuuming the separated semiconductor chip 2 with a collet 9. The collet 9 is approached with the semiconductor chip 2 pushed up by the curved surface 8b of the nozzle, and the semiconductor chip 2 and the adhesive tape 3 are sandwiched between the collet 9 and the nozzle 8, and the nozzle 8 and the collet 9 are held in this state. In this method, the rectangular portion 2d of the semiconductor chip 2 is first peeled off from the adhesive tape 3 by being raised at the same speed in synchronization.

The semiconductor chip separation method according to the present invention (Claim 2) is that the adhesive tape 3 to which the semiconductor chip 2 is attached is supported by the nozzle holder 6 while being vacuum-sucked, and the semiconductor chip 2 is pushed up by the nozzle 28 to stick the adhesive tape. In the method of separating the semiconductor chip, the tip 28a of the nozzle 28 is formed in a cross shape with the hard material 12 in the method for separating the semiconductor chip 2 from the adhesive tape 3 while being vacuum-sucked by the collet 9 and separated. The recesses 28b at the four corners formed by the crosses 28c of the hard material 12 are filled with the soft material 10 to form the squares of the soft material 10 on the inclined surface 10a, and the cross-shaped hard material 12 of the nozzle 28 and its four corners. In the state where the semiconductor chip 2 is pushed up by the soft material 10, the collet 9 is brought close to the semiconductor chip 2 and the adhesive tape by the collet 9 and the nozzle 28. The flop 3 sandwiched, raised by synchronizing the nozzle 28 and the collet 9 at the same speed in this state, a method of initially separate the rectangular portion 2d of the semiconductor chip 2 from the adhesive tape 3.

The present invention is configured as described above, and its operation will be described below. First, the operation of the first embodiment of the present invention shown in FIGS. 5 to 12 will be described. As shown in FIG. 7, when the semiconductor chip 2 to be peeled and separated is affixed to the adhesive tape 3 and conveyed right above the nozzle 8, the arrow A is inserted in the vacuum suction holes 6a and 6b of the nozzle holder 6. As described above, air is sucked into a negative pressure state close to a vacuum, and the adhesive tape 3 is adsorbed and adhered to the nozzle holder 6.
Therefore, the nozzle 8 rises slightly and the curved surface 8b of the tip 8a contacts the adhesive tape 3, and pushes the adhesive tape 3 slightly. At this time, the collet 9 is still waiting upward and is not in contact with the semiconductor chip 2, so the suction force from above by the collet 9 does not act at all. The semiconductor chip 2 is still attached to the adhesive tape 3 at any part.

Therefore, as shown in FIG. 8, the collet 9 descends as shown by the arrow B, and the cup-shaped suction hole 9b comes into contact with the semiconductor chip 2, and at the same time, the vacuum suction hole 9c in the collet 9 also sucks as shown by the arrow C. Is started, the semiconductor chip 2 is sucked into the suction hole 9b. At this time, since the length of one side of the square of the collet 9 is set to be equal to the length of one side of the square of the semiconductor chip 2, a suction force acts on all the square portions 2 d of the semiconductor chip 2. As a result, an upward bending moment to be peeled off from the adhesive tape 3 acts on the square portion 2d of the semiconductor chip 2, and the square portion 2d receives a force of warping upward, and preparation for peeling is started. .

Here, the nozzle and collet synchronous drive device, which is the greatest feature of the present invention, works, and a process that has never been performed conventionally is performed. That is, as shown in FIG. 9, in a state where the semiconductor chip 2 and the adhesive tape 3 are sandwiched from above and below by the nozzle 8 and the collet 9, the nozzle 8 and the collet 9 rise as shown by an arrow D at the same speed. Thereby, since the semiconductor chip 2 is already sucked by the collet 9 through the suction hole 9b of the collet 9, it is maintained in a flat shape in the horizontal direction. On the other hand, the adhesive tape 3 is warped upward by the curved surface 8b of the tip 8b of the nozzle 8. Therefore, while the central portion of the semiconductor chip 2 of the adhesive tape 3 remains adhered, only the square portion 2d is peeled off from the adhesive tape 3 first. At this time, since the tip portion 8a of the nozzle 8 is a smooth curved surface 8b, stress concentration hardly occurs in the square portion 2d of the semiconductor chip 2, and therefore, an excessive force does not act on the semiconductor chip 2. Further, the peeling of the semiconductor chip 2 proceeds, and the semiconductor chip 2 is not damaged, cracked, chipped, etc., and the yield of the product is remarkably improved.
The semiconductor chip 2 can be practically used with a thickness of 100 μm or less, and can be peeled off at a practical level even with an extremely thin semiconductor chip 2 having a thickness of 20 to 30 μm. Was found as a result of the test.

When the semiconductor chip 2 is peeled off from the adhesive tape 3 in this manner, as shown in FIG. 10, the nozzle and collet synchronous drive device is stopped, the nozzle 8 is stopped, and only the collet 9 is raised as shown by the arrow E. The semiconductor chip 2 can be completely separated from the adhesive tape 3 and taken out. Then, the semiconductor chip 2 is conveyed to another stage (not shown) while being adsorbed by the collet 9.

When the separation of the semiconductor chip 2 from the adhesive tape 3 is completed, the nozzle 8 starts to descend as shown in FIG. 11, and the nozzle 8 is completely separated from the adhesive tape 3 as shown in FIG. The semiconductor chip 2 separation process is completed.
Then, the adhesive tape 3 moves in the horizontal direction, and the next semiconductor chip 2 is conveyed directly above the nozzle 8, and the semiconductor chip 2 separation process is successively performed in the same manner.

Next, the operation of the second embodiment of the present invention shown in FIGS. 13 to 19 will be described. In this embodiment, the soft material 10 is used for the tip portion 28a of the nozzle 28, and the square portion 2d is formed on the inclined surface 10a. Using this soft material, along with the inclined surface 10a, the semiconductor chip at the time of separation is used. This is to prevent the stress concentration of the square part 2d.
As shown in FIG. 16, when the semiconductor chip 2 to be separated is conveyed directly above the nozzle 28, the adhesive tape stops, and air as shown by an arrow A from the vacuum suction hole 6 b of the nozzle holder 6. The suction tape is sucked and vacuumed, and the adhesive tape 3 is adsorbed to the nozzle holder 6.
Therefore, the nozzle 28 rises slightly, and the tip 28 a, that is, the cross 28 c of the hard material 12 and the flat portion 10 b of the soft material 10 come into contact with the adhesive tape 3.

Therefore, as shown in FIG. 17, when the collet 9 descends as shown by the arrow B, the suction hole 9b comes into contact with the semiconductor chip 2, and at this time, the air is also shown in the vacuum suction hole 9a of the collet 9 as shown by the arrow C. Is sucked into the suction hole 9b, and the adhesive tape 3 is pushed slightly upward from the bottom by the nozzle 28. Therefore, the semiconductor chip 2 warps upward slightly, and as a result, the rectangular portion of the semiconductor chip 2 is bent. A bending moment for peeling from the adhesive tape 3 acts on 2d, and preparation for peeling is made.

Therefore, as shown in FIG. 18, when the synchronous drive of the nozzle and the collet, which is the greatest feature of the present invention, is activated, the nozzle 28 and the collet 9 are integrally raised at the same speed as indicated by the arrow D. The pressure-sensitive adhesive tape 3 is warped upward and larger than the state of FIG. 17, while the semiconductor chip 2 is adsorbed horizontally to the collet 9, so that the square portion 2 d is peeled off from the pressure-sensitive adhesive tape 3 first. . At this time, the rectangular portion 2d of the adhesive tape 3 and the semiconductor chip 2 is curved along the inclined surface 10a of the soft material 10, so that it is received very softly and warps upward, and the rectangular portion 2d of the semiconductor chip 2 is bent. Since no stress concentration occurs and no excessive force acts on the square portion 2d, no scratches, cracks, chips, etc. occur on the square portion 2d, and the adhesive tape 3 of the ultra-thin semiconductor chip 2 having a thickness of 20 to 30 μm. Can be separated, and the yield of the product is remarkably improved as compared with the prior art.

Next, as shown in FIG. 19, when the collet 9 rises as shown by an arrow E, the semiconductor chip 2 is completely peeled off from the adhesive tape 3, separated and taken out, and transported to another stage, where one semiconductor chip 2 The separation process is completed.

As described above, the semiconductor chip separation method and apparatus of the present invention enable practical separation of an ultrathin semiconductor chip of 20 to 30 μm, which has been impossible in the past, from an adhesive tape. This is an extremely highly useful invention.

It is a perspective view of the semiconductor chip stuck on the adhesive tape. FIG. 2 is a partially enlarged perspective view of FIG. 1. 3 to 12 relate to the first embodiment of the present invention, and FIG. 3 is a perspective view showing the mutual relationship between the semiconductor chip and the nozzle for pushing it up from below. It is a front view of a nozzle. It is the perspective view seen from under the collet. It is a longitudinal cross-sectional view of a collet. It is a longitudinal cross-sectional view of the separation apparatus of a semiconductor chip which shows the state which the adhesive tape was adsorbed by the nozzle holder and the nozzle raised a little and contacted the adhesive tape. It is a longitudinal cross-sectional view which shows the state from which the collet descend | falls from the state of FIG. 7, contacts the semiconductor chip, and the vacuum suction by the collet was started. It is a longitudinal cross-sectional view which shows the state which the nozzle and collet synchronous drive device act | operates, a nozzle and a collet raise synchronously at the same speed, and the square part of a semiconductor chip peels from an adhesive tape first. It is a longitudinal cross-sectional view which shows the state which a collet raises and a semiconductor chip is completely isolate | separated from an adhesive tape and taken out. It is a longitudinal cross-sectional view which shows the state in which the nozzle fell a little from the state of FIG. It is a longitudinal cross-sectional view which shows the state which the nozzle fell further, the front-end | tip part left | separated from the adhesive tape, the adhesive tape became movable, and the separation process of the semiconductor chip was completed. 13 to 26 relate to the second embodiment of the present invention, and FIG. 13 is a perspective view of the nozzle. It is a top view of a nozzle. It is a front view of a nozzle. It is a longitudinal cross-sectional view of the separation apparatus of a semiconductor chip which shows the state which the nozzle raised a little and the front-end | tip part contacted the adhesive tape. It is a longitudinal cross-sectional view which shows the state from which the collet descend | falls from the state of FIG. 16, and vacuum suction was started from both the nozzle holder and the collet. It is a longitudinal cross-sectional view which shows the state which the nozzle and collet synchronous drive device act | operates, a nozzle and a collet raise synchronously at the same speed, and the square part of a semiconductor chip peels from an adhesive tape first. It is a longitudinal cross-sectional view which shows the state which only a collet raises further from the state of FIG. 18, and a semiconductor chip is isolate | separated completely from an adhesive tape. 20 to FIG. 22 relate to a conventional example, and FIG. 20 shows a result that the adhesive tape and the semiconductor chip are pushed up by a nozzle whose horizontal section is circular and whose circumferential angle is right angle. It is a fragmentary longitudinal cross-sectional view of the separation device of the semiconductor chip which shows the state which occurs. It is a fragmentary longitudinal cross-section which shows the state from which the collet adsorb | sucked the defective semiconductor chip with the damage | wound, and was isolate | separated from the adhesive tape. FIG. 22 is a partially enlarged longitudinal sectional view of FIG. 21.

Explanation of symbols

2 Semiconductor chip 2d Square part 3 Adhesive tape 4 Nozzle 4a Tip part 4b Circumferential corner part 5 Collet 5a Vacuum suction hole 5b Suction hole 6 Nozzle holder 6a Vacuum suction hole 6b Vacuum suction hole 8 Nozzle 8a Tip part 8b Curved surface 9 Collet 9a Vacuum Suction hole 9b Suction hole 10 Soft material 10a Slope 10b Plane portion 11 Semiconductor chip separation device 12 Hard material 28 Nozzle 28a Tip portion 28b Recess 28c Cross

Claims (4)

The adhesive tape to which the semiconductor chip is attached is supported by a nozzle holder while vacuum sucking, the semiconductor chip is pushed up by the nozzle and separated from the adhesive tape, and the separated semiconductor chip is vacuum sucked by a collet. In the method of separating a semiconductor chip taken out from the adhesive tape, the tip of the nozzle is formed into a convex and smoothly curved shape, and the collet is brought close to the collet while the semiconductor chip is pushed up by the curved surface of the nozzle. The semiconductor chip and the adhesive tape are sandwiched between the nozzle and the nozzle, and in this state, the nozzle and the collet are raised synchronously at the same speed, and the square portion of the semiconductor chip is first peeled from the adhesive tape A method for separating a semiconductor chip, comprising: The adhesive tape to which the semiconductor chip is attached is supported by a nozzle holder while vacuum sucking, the semiconductor chip is pushed up by the nozzle and separated from the adhesive tape, and the separated semiconductor chip is vacuum sucked by a collet. In the method of separating a semiconductor chip taken out from the adhesive tape, the tip of the nozzle is formed in a cross shape with a hard material, and the soft material is filled in the recesses at the four corners formed by the cross of the hard material. A square is formed on the inclined surface, and the semiconductor chip is brought close to the collet and the nozzle while the semiconductor chip is pushed up by the cross-shaped hard material of the nozzle and the soft material of the four corners. In this state, the adhesive tape is pinched, and the nozzle and the collet are raised at the same speed in synchronism with the semiconductor chip. The semiconductor chip separation methods, characterized in that for peeling the rectangular portion first from the adhesive tape. The adhesive tape to which the semiconductor chip is attached is supported by a nozzle holder while vacuum sucking, the semiconductor chip is pushed up by the nozzle and separated from the adhesive tape and separated, and the separated semiconductor chip is vacuum sucked by a collet In the separation device for a semiconductor chip taken out from the adhesive tape, the tip of the nozzle is formed in a convex and smoothly curved shape, and the collet is brought close to the collet while the semiconductor chip is pushed up by the curved surface of the nozzle. The semiconductor chip and the adhesive tape are sandwiched between the nozzle and the collet, and in this state, the nozzle and the collet are driven synchronously at the same speed, and the nozzle and the collet synchronous drive device are provided. The part is configured to be peeled first from the adhesive tape. The semiconductor chip of the separation device. The adhesive tape to which the semiconductor chip is attached is supported by a nozzle holder while vacuum sucking, the semiconductor chip is pushed up by the nozzle and separated from the adhesive tape, and the separated semiconductor chip is vacuum sucked by a collet. In the separation device for semiconductor chips taken out from the adhesive tape, the tip of the nozzle is formed into a cross shape with a hard material, and the soft material is filled in the recesses at the four corners formed by the cross of the hard material. A rectangular portion is formed on the inclined surface, and the semiconductor chip is brought close to the collet and the nozzle by bringing the collet close in a state where the semiconductor chip is pushed up by the cross-shaped hard material and the soft material at the four corners of the nozzle. A nozzle and a collet that sandwich the adhesive tape and raise the nozzle and the collet synchronously at the same speed in this state. With a synchronous drive apparatus Tsu bets, the semiconductor chip semiconductor chip separating apparatus the rectangular portion, characterized by being configured so as to initially peeled from the adhesive tape.

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