JP5583475B2 - Pickup device - Google Patents

Description

  The present invention relates to a pickup device for individually peeling semiconductor chips attached to a wafer sheet from the wafer sheet.

  In the manufacture of a semiconductor device, semiconductor chips attached to a wafer sheet and diced into individual pieces are individually picked up by a collet on a pickup stage, separated from the wafer sheet, and sent to a bonding process.

  The conventional pick-up device vacuum-sucks the transferred semiconductor chip wafer sheet to the pick-up stage, and sucks the semiconductor chip with a collet while protruding the protruding needle from the stage to lift the semiconductor chip. Was peeled from the wafer sheet.

  In addition, as a pickup device that does not use a push-up needle, there has been proposed one in which a number of suction grooves extending in the chip feed direction are formed on a pickup stage, and a piece protruding slightly upward is provided on the front side thereof (patent) Reference 1). In this apparatus, the wafer sheet and the semiconductor chip are fed while being sucked by the suction groove so as to cross the top of the piece, so that the wafer sheet and the chip protruding from the edge of the piece onto the suction groove are sequentially peeled off together with the feed.

JP 2005-64172 A

  Some semiconductor chips have a die attach film (DAF) for adhesion to a substrate mounted on the lower surface. The DAF is notched for each semiconductor chip during dicing, and is peeled from the wafer sheet together with the semiconductor chip. However, in this case, in any of the above devices, due to the adhesiveness of DAF, peeling from the wafer sheet is insufficient, or after peeling from the wafer sheet, it may adhere to the DAF of the adjacent chip. is there. As a result, proper transfer by the collet is not performed, resulting in product defects or requiring control parameter changes. Moreover, in the apparatus of Patent Document 1, since the semiconductor chip is fed while being sucked by the suction groove, there is a drawback that the feeding speed is limited and the peeling operation takes time.

  Furthermore, there is a demand for an apparatus capable of more quickly and reliably peeling a wafer sheet even if it is a semiconductor chip without a DAF.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a pickup device capable of quickly and surely peeling a semiconductor chip from a wafer sheet in order to meet the above demand.

In order to achieve the above object, the present invention is a pickup device for individually peeling semiconductor chips attached to a wafer sheet from the wafer sheet, and is a plane formed on the pickup stage for receiving semiconductor chip pieces together with the wafer sheet. A recess having dimensions, an insertion means for inserting a semiconductor chip piece together with a wafer sheet into the recess, a collet that sucks and picks up the semiconductor chip in the recess, and a semiconductor chip in the recess In order to determine the insertion depth , a pickup device provided with a needle protruding from the bottom surface of the recessed portion is provided.

  A pickup apparatus according to the present invention includes a recessed portion formed on a pickup stage and having a planar dimension for receiving a semiconductor chip piece together with a wafer sheet, and an insertion means for inserting the semiconductor chip piece together with the wafer sheet into the recessed portion. And a collet that picks up and picks up the semiconductor chip in the recessed portion, and by inserting the semiconductor chip into the recessed portion together with the wafer sheet by the inserting means, the semiconductor chip located in the recessed portion and the semiconductor located therearound The semiconductor chip is immediately peeled from the wafer sheet due to the step generated between the chip and the chip. In addition, when a DAF is mounted on a semiconductor chip, the DAFs of adjacent semiconductor chips are separated from each other by the stepped portion of the recessed portion, so that they are reliably separated to avoid the problem of peeling failure and adhesion to the adjacent DAF. Is done.

  In particular, after the semiconductor chip is sent together with the wafer sheet onto the recess, it is pushed down by the collet or sucked by the pressure reducing means of the pickup stage as an insertion means, so that the semiconductor chip is fed into the recess and inserted into the recess. Therefore, the operation is quick.

It is sectional drawing which shows the operation | movement step of the pick-up apparatus which concerns on one Embodiment of this invention. It is sectional drawing which shows the operation | movement stage of the pick-up apparatus following FIG. It is a timing chart which shows operation | movement of the pick-up apparatus of FIG. It is sectional drawing which shows the operation | movement stage of the pick-up apparatus which concerns on other embodiment of this invention. FIG. 5 is a cross-sectional view showing an operation stage of the pickup device following FIG. 4. FIG. 6 is a cross-sectional view showing an operation stage of the pickup device following FIG. 5. It is sectional drawing which shows the operation | movement step of the pick-up apparatus which concerns on further another embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. 1 and 2 are cross-sectional views showing an operation stage of a pickup apparatus according to an embodiment of the present invention, centering on a pickup stage. In the following drawings, the dimensions in the height direction are shown enlarged from the actual size for easy understanding.

  The semiconductor chip P that has undergone the dicing process is sent to the pickup stage in a state of being stuck on a wafer sheet S stretched on a wafer ring (not shown). In the pickup stage, the wafer sheet S is stretched in the surface direction by a holder disposed on a table T around the pickup stage. The semiconductor chip P has a DAF attached to the lower surface.

  The pickup stage 1 includes a housing 10 disposed in a mounting hole of the table T. The housing 10 includes an upper wall 11 and a side wall 12 depending from the upper wall 11, and the lower part is connected to a suction device (not shown). The upper wall 11 includes a peripheral edge portion 14 aligned in the same plane as the table T, and a central recessed portion 13. The recessed portion 13 has a planar dimension for receiving the semiconductor chip P together with the wafer sheet S and DAF. The depth is set to a dimension sufficient for peeling from the wafer sheet S described below by the insertion of the semiconductor chip P, and can be, for example, 300 to 500 μm. A plurality of suction holes 16 are formed in the peripheral portion 14, and a needle through hole 15 is formed in the central portion of the recessed portion 13, and each penetrates the upper wall 11 in the vertical direction.

  The needle 2 is disposed at a position facing the through hole 15. The lower part of the needle 2 is connected to a lifting device (not shown). By the operation of the lifting device, the needle 2 moves backward from the recessed portion 13 and advances forward from the bottom of the recessed portion 13 through the through hole 15. The position can be taken. In this embodiment, the needle 2 further functions as a push-up needle that operates following the rise of the collet.

  A collet 3 is disposed above the pickup stage 1. The collet 3 is provided with a suction port leading to a suction source on the lower surface, and moves up and down and horizontally by a driving device (not shown) to sequentially suck the semiconductor chips P on the wafer sheet S and transfer them to the bonding process.

  Hereinafter, the process of picking up the semiconductor chip P using this pickup device will be described. The steps of the process are shown in FIGS. 1 (a) to 2 (e), and the corresponding timing chart is shown in FIG.

  FIG. 1 (a) shows a state where the semiconductor chip P attached with the DAF and attached to the wafer sheet S is transferred onto the pickup stage 1 (step 1 (a) in the timing chart of FIG. 3).

  The needle 2 is in a retracted position lower than the recessed portion 13. The suction from the housing 10 through the suction hole 16 is performed after the wafer sheet S is transferred onto the pickup stage 1, whereby the transfer is performed smoothly and quickly, and after the transfer, the wafer sheet S is sucked by suction. It is held on the peripheral edge 14. The collet 3 stands by above the pickup stage 1.

  Next, as shown in FIG. 1 (b), the needle 2 is raised to the advanced position. This position determines the height of the wafer sheet S inserted into the recess 13 (step 1 (b) in FIG. 3). The protruding height from the recessed portion 13 can be determined as appropriate within the range of the depth of the recessed portion 13.

  Next, as shown in FIG. 1C, the collet 3 is lowered and further lowered in contact with the semiconductor chip P, thereby inserting the semiconductor chip P into the recessed portion 13 (step 1 (c) in FIG. )). The lowering is performed over a preset distance so that the wafer sheet S contacts the needle 2. Thus, in this embodiment, the collet 3 functions as an insertion means for inserting the semiconductor chip piece into the recess together with the wafer sheet.

  The suction force in the housing 10 also acts on the wafer sheet S in the recessed portion 13 through the through hole 15. During this insertion, the semiconductor chip P is immediately peeled off from the wafer sheet S due to a step generated between the semiconductor chip P in the recessed portion 13 and the semiconductor chip P ′ located around the semiconductor chip P. Further, since the DAF of the semiconductor chip P is separated from the DAF of the adjacent semiconductor chip P ′ by the step of the recessed portion, it is surely separated. As a result, defective peeling of DAF and adhesion to adjacent DAF are avoided. Further, when the semiconductor chip P is inserted into the recessed portion 13, the wafer sheet S is stretched by the step of the recessed portion 13, so that the wafer sheet portion located at the peripheral portion of the semiconductor chip P is sheared by shifting in the surface direction. Causes peeling. Thereby, peeling by the next collet 3 raise is performed more smoothly.

  Further, since the needle 2 is in the forward position, the semiconductor chip P and the wafer sheet S are subjected to the lower pressure reduction from the collet 3 while being supported by the needle 2 from below, and the above operation is performed in a stable state sandwiched between the two. Done.

  Next, as shown in FIG. 2 (d), the collet 3 is lifted while acting (step 2 (d) in FIG. 3). Since the wafer sheet portion on the lower surface of the adjacent semiconductor chip P ′ is sucked onto the upper wall 11 by suction from the suction hole 16, the semiconductor chip P is peeled off from the wafer sheet S as the collet 3 rises. At this time, it is desirable that the needle 2 is also raised in synchronism with the collet 3 to a height at which peeling occurs or in the vicinity thereof. Thereby, the pushing-up force of the needle 2 supplements the suction force of the collet 3, and the peeling operation can be made more reliable. However, when only the suction by the collet 3 is sufficient, the synchronous rise of the needle 2 may be omitted.

  Next, as shown in FIG. 2 (e), with the semiconductor chip P adsorbed by the collet 3, the needle 2 descends and returns to the retracted position (step 2 (e) in FIG. 3). Thereby, the collet 3 can move horizontally to a predetermined position and transfer the semiconductor chip P to the bonding process.

  4 and 5 are cross-sectional views showing the operation stage of the pickup device according to another embodiment of the present invention, focusing on the pickup stage. In the figure, the same or similar parts as those in the previous embodiment are denoted by the same reference numerals and a part of the description is omitted.

  In the housing 10 of this pickup device, a movable block 17 is provided that is supported so as to be movable up and down with respect to the peripheral edge portion 1 of the pickup stage. A guide wall 19 is fixed inside the side wall 12 in the housing 10, and the movable block 17 can move up and down along the guide wall 19. A driving rod 18 is coupled to the lower end portion of the movable block 17, and the driving rod is connected to a driving device (not shown). By the operation of the driving device, the movable block 17 has the same height as the peripheral portion 14 of the pickup stage. It moves up and down so as to take a standby position and a lowered position at which the recessed portion 13 is formed. A needle 2 for determining the insertion depth of the semiconductor chip in the recessed portion 13 is also provided in the housing 10. The needle 2 can have the same configuration as that described in the previous embodiment.

  The movable block 17 has a planar size corresponding to the recessed portion described in the previous embodiment. In this embodiment, the outer shape is rectangular in plan view, and a vertical hole for loosely passing the needle 2 through the center portion. 21 is formed. Instead of this, the movable block 17 may be configured such that two block bodies are arranged in the direction in which the semiconductor chip P is conveyed or perpendicular thereto, and a gap through which the needle 2 passes is provided.

  FIG. 4A shows a state where the movable block 17 and the needle 2 are in the lowered position, and the concave portion 13 is located above the movable block 17. FIG. 4B shows a state where the movable block 17 and the needle 2 are in the standby position, and the movable block 17 and the needle 2 are at the same height as the peripheral edge portion 14 of the pickup stage 1.

  This pickup device operates as follows. While the DAF is attached and the semiconductor chip P attached to the wafer sheet S is transferred onto the pickup stage 1, the movable block 17 and the needle 2 are in the standby position as shown in FIG. At this stage, suction in the housing 10 is not acting.

  When a predetermined semiconductor chip P reaches the pickup stage 1, suction acts in the housing 10, and the collet 3 descends to contact the upper surface of the semiconductor chip P. In this state, as shown in FIG. 5C, the movable block 17 and the needle 2 are lowered, and the collet 3 is also lowered in synchronization therewith. Accordingly, the semiconductor chip P is lowered together with the wafer sheet S while being supported by the movable block 17 and the upper end of the needle 2.

  Therefore, for example, when suction is suddenly applied from the state shown in FIG. 4 (a), the semiconductor chip P and the wafer sheet S are suddenly lowered to receive an impact, which may cause problems such as displacement and tilting. By being supported by the block 17 and the upper end of the needle 2, the semiconductor chip P and the wafer sheet S are lowered at a predetermined speed even under the suction action, so that such trouble is avoided.

  Next, as shown in FIG. 5 (d), the movable block 17 is lowered to a height at which the concave portion 13 is formed above, and the tip of the needle 2 is inserted into the concave portion 13. Determine the height. That is, according to the previous embodiment, the needle 2 takes an advanced position that protrudes upward from the bottom surface of the recessed portion 13 in FIG. 5 (c) with respect to the retracted position in FIG. 4 (a). In this way, the semiconductor chip P and the wafer sheet S are inserted into the recessed portion 13 in a stable state where the semiconductor chip P and the wafer sheet S are supported by the needle 2 from below and receive the lower pressure from the collet 3 and are sandwiched between them. Since the effect by this insertion is the same as the content demonstrated in previous embodiment, description is abbreviate | omitted here.

  Next, as shown in FIG. 6 (e), the collet 3 rises while acting suction. As a result, the semiconductor chip P is peeled off from the wafer sheet S in the same manner as described with reference to FIG. At this time, it is desirable that the needle 2 is also raised in synchronism with the collet 3 to a height at which separation occurs or in the vicinity thereof so as to supplement the suction force of the collet 3. However, when the suction by the collet 3 is sufficient, the synchronous rise of the needle 2 may be omitted.

  Next, as shown in FIG. 6 (f), the needle 2 descends and returns to the retracted position, and the collet 3 can move horizontally to a predetermined position to transfer the semiconductor chip P to the bonding process.

  FIG. 7 (e ′) shows a deformation mode when the collet 3 is raised. In FIG. 6 (e), only the needle 2 is raised, but here, the movable block 17 and the needle 2 are raised from the state of FIG. 6 (d). The needle 2 rises in synchronism with the collet 3 to a predetermined position (peeling height) higher than the peripheral edge 14 of the pickup stage 1, and the movable block 17 stops in the middle of the ascent and stops between the peripheral edge 14 and the needle 2. Stay at the height of Thus, since the needle 2 protrudes with the movable block 17 lifted to some extent, the wafer sheet S is peeled from the semiconductor chip P over a wider range. Further, the push-up force that the wafer sheet S receives from the needle 2 is reduced. Thereafter, the state is the same as in FIG.

  Thus, since the movable block 17 can be moved up and down, the lowering speed of the semiconductor chip P can be controlled as described above, and the concave portion 13 can be adjusted by adjusting the lowering distance of the movable block 17. By changing the depth of the needle 2 and further changing the height of the needle 2, the flexibility of the operation is enhanced, and the amount of insertion into the recessed portion can be easily optimized.

  The present invention is not limited to the above embodiment, and various modifications can be made. For example, the suction applied to the housing may be continuously applied throughout the stage of the pickup operation as long as the wafer sheet can be moved. For this purpose, it is desirable to raise the needle to a height equal to or close to the peripheral edge so that the wafer sheet can move without entering the recess.

  Even when the semiconductor chip does not include the DAF, the semiconductor chip P can be picked up by the same operation as described above. Also in this case, the semiconductor chip is quickly and reliably peeled from the wafer sheet by being inserted into the recessed portion.

  By making the advance position adjustable, the needle can handle different thicknesses of semiconductor chips, wafer sheets, etc. If the thickness is constant, the advance position is set to a predetermined height. You can also When the thicknesses are constant, the needle may be fixed at a position protruding from the bottom surface of the recess, or the needle may be omitted and the wafer sheet may be received at the bottom of the recess. In that case, it is desirable to separately provide a push-up needle that can be moved up and down from the recessed portion, and to raise it in synchronism with the collet while supporting the semiconductor chip from below.

  Also, a push-up needle can be provided separately from the needle that determines the amount of the semiconductor chip inserted into the recess, and the push-up needle can be raised in synchronism with the collet that rises with the adsorbed semiconductor chip. . In this case, it is desirable to connect each drive source to the needle and the push-up needle.

  The semiconductor chip pieces can be inserted into the recessed portion together with the wafer sheet by suction acting on the recessed portion, and in this case, the decompression means that acts on the recessed portion functions as the inserting means. This suction is preferably applied after the semiconductor chip has moved onto the recess. Further, both the pressing by the collet and the suction acting on the recessed portion can be used as the insertion means.

  In order to sequentially pick up the semiconductor chips on the wafer sheet, the pickup stage may be moved in the horizontal direction instead of moving the collet in the horizontal direction every time one pickup operation is completed.

1 Pickup Stage 2 Needle 3 Collet 13 Recessed Part 17 Movable Block 17
P Semiconductor chip S Wafer sheet

Claims (5)

A pick-up device for individually peeling semiconductor chips attached to a wafer sheet from the wafer sheet,
A recess formed on the pickup stage and having a planar dimension for receiving a semiconductor chip piece together with the wafer sheet; an insertion means for inserting the semiconductor chip piece together with the wafer sheet into the recess; and a semiconductor chip in the recess. A pick-up apparatus comprising: a collet to be picked up by suction; and a needle protruding from the bottom surface of the recessed portion to determine the insertion depth of the semiconductor chip into the recessed portion .   The pickup device according to claim 1, wherein the insertion unit is achieved by an operation of pushing down the semiconductor chip into the recessed portion by the collet.   2. The pickup apparatus according to claim 1, wherein the inserting means is achieved by a pressure reducing means for sucking the semiconductor chip together with the wafer sheet into the recessed portion in the pickup stage. The pickup device according to any one of claims 1 to 3 , wherein a height of the needle protruding from a bottom surface of the recessed portion is adjustable . A movable block supported to be movable up and down with respect to the pickup stage, the movable block having a planar dimension corresponding to the recessed portion, and a standby position having the same height as the peripheral edge of the pickup stage; move up and down to take the lowered position for forming the recessed portion upwardly, the movable block according to claim 1 to claim 4, characterized in that the longitudinal bore for passing the needle is formed The pick-up apparatus in any one of.

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