JPS5860938U - Semiconductor chip sorting equipment - Google Patents
Semiconductor chip sorting equipmentInfo
- Publication number
- JPS5860938U JPS5860938U JP15415581U JP15415581U JPS5860938U JP S5860938 U JPS5860938 U JP S5860938U JP 15415581 U JP15415581 U JP 15415581U JP 15415581 U JP15415581 U JP 15415581U JP S5860938 U JPS5860938 U JP S5860938U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- suction cup
- chip sorting
- semiconductor
- sorting equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図および第２図は、従来の半導体チップの選別工程
を示す説明図、第３図および第４図は、本考案の選別装
置による半導体チップの選別工程を示す説明図、第５図
および第６図は、上記装置 ・における頭体に設ける
吸引カップの内径の範囲を説明するための平面図および
一部切欠断面図である。
１・・・・・・粘着テープ、１ａ・・・・・・糊付面、
２・・川・半導体ウェハ、３・・・・・・半導体チップ
、３ａ・・曲除去すべき半導体チップ、４．１４・・・
・・・真空ノズル、５．１３・・・・・・押し上げピン
、６・・囲わん曲部、７・・・・・・選別装置、８・・
・・・・吸引カップ、９・・曲頭体、１０・・・・・・
支持台、１１．１２・・・・・・透孔、１５・・曲真空
引き孔。1 and 2 are explanatory diagrams showing a conventional semiconductor chip sorting process, FIGS. 3 and 4 are explanatory diagrams showing a semiconductor chip sorting process by the sorting apparatus of the present invention, and FIGS. FIG. 6 is a plan view and a partially cutaway sectional view for explaining the range of the inner diameter of the suction cup provided on the head body in the above device. 1...Adhesive tape, 1a...Glued side,
2...River/semiconductor wafer, 3...semiconductor chip, 3a...semiconductor chip to be curved removed, 4.14...
... Vacuum nozzle, 5.13 ... Push-up pin, 6 ... Surrounding curved part, 7 ... Sorting device, 8 ...
...Suction cup, 9...Curved head, 10...
Support stand, 11.12...Through hole, 15...Curved vacuum hole.
Claims (2)
れ、細分化された半導体チップを貼着した粘着テープと
、このテープ上に配置され、前記チップを吸着する真空
ノズルと、前記吸引カップの底部を貫通して鉛直方向に
往復動可能に設けられ、前記吸引カップ上に到来した半
導体チップの１つを押し上げる押し上げピンとを有する
ことを特徴とする半導体チップの選別装置。(1) a head body having a suction cup; an adhesive tape supplied onto the head body to which finely divided semiconductor chips are attached; a vacuum nozzle placed on the tape to attract the chips; 1. A semiconductor chip sorting device comprising: a push-up pin that is provided so as to be able to reciprocate vertically through the bottom of a suction cup, and that pushes up one of the semiconductor chips that has arrived on the suction cup.
１辺の長さをａとしたときにＤの範囲をＪ５≦Ｄ≦Ｊ”
５１０、．９としたことを特徴とする実用新案登録請求
の範囲第１項記載の半導体チップの選別装置。(2) When the inner diameter of the suction cup is D, and the length of one side of the semiconductor j-tube is a, the range of D is J5≦D≦J”
510,. 9. A semiconductor chip sorting device according to claim 1 of the utility model registration claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15415581U JPS5860938U (en) | 1981-10-19 | 1981-10-19 | Semiconductor chip sorting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15415581U JPS5860938U (en) | 1981-10-19 | 1981-10-19 | Semiconductor chip sorting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5860938U true JPS5860938U (en) | 1983-04-25 |
Family
ID=29946754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15415581U Pending JPS5860938U (en) | 1981-10-19 | 1981-10-19 | Semiconductor chip sorting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5860938U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011243797A (en) * | 2010-05-19 | 2011-12-01 | Canon Machinery Inc | Pickup device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5681938A (en) * | 1979-10-05 | 1981-07-04 | Shinkawa Ltd | Limit detecting device of die-bonder |
| JPS5812948B2 (en) * | 1978-12-25 | 1983-03-10 | 東洋紡績株式会社 | Single-sided pile knitted fabric and its manufacturing method |
-
1981
- 1981-10-19 JP JP15415581U patent/JPS5860938U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812948B2 (en) * | 1978-12-25 | 1983-03-10 | 東洋紡績株式会社 | Single-sided pile knitted fabric and its manufacturing method |
| JPS5681938A (en) * | 1979-10-05 | 1981-07-04 | Shinkawa Ltd | Limit detecting device of die-bonder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011243797A (en) * | 2010-05-19 | 2011-12-01 | Canon Machinery Inc | Pickup device |
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