JPS5878635U - Semiconductor die bonding equipment - Google Patents

Semiconductor die bonding equipment

Info

Publication number
JPS5878635U
JPS5878635U JP17335081U JP17335081U JPS5878635U JP S5878635 U JPS5878635 U JP S5878635U JP 17335081 U JP17335081 U JP 17335081U JP 17335081 U JP17335081 U JP 17335081U JP S5878635 U JPS5878635 U JP S5878635U
Authority
JP
Japan
Prior art keywords
hole
semiconductor die
die bonding
bonding equipment
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17335081U
Other languages
Japanese (ja)
Other versions
JPS6344990Y2 (en
Inventor
裕 丸山
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP17335081U priority Critical patent/JPS5878635U/en
Publication of JPS5878635U publication Critical patent/JPS5878635U/en
Application granted granted Critical
Publication of JPS6344990Y2 publication Critical patent/JPS6344990Y2/ja
Granted legal-status Critical Current

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Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第３図は従来のダンボンディング装置の一
部を示し、第１図はホルダの図ａは上面図、同図すは断
面図、第２図および第３図はペレットピックアップ工程
を説明するためのいずれも断面図、第４図以降はこの考
案の１実施例にかかり、第４図はホルダの図ａは上面図
、同図すは図ａのＡＡ’線に沿う断面図、第５図および
第６図。 はペレットピックアップ工程を説明するためのいずれも
断面図である。 １０・・・・・・シート、１１・・・・・・ホルダ、１
２・・・・・・ホルダ本体、１２ａ・・・・・・（ホル
ダ本体軸心の）透孔、１２ｐ・・・・・・ホルダ本体の
頂面、１２Ｖ、１２Ｖ’・・・、・・・頂面の減圧透孔
、１３・・・・・・ピン、２０・・・・・・半導体ペレ
ット、３０・・・・・・コレット。Figures 1 to 3 show a part of a conventional Dan bonding device. All of them are sectional views for explanation; FIG. 4 and subsequent figures show one embodiment of the invention; FIG. 4 shows a top view of the holder; Figures 5 and 6. 2A and 2B are cross-sectional views for explaining the pellet pickup process. 10...Sheet, 11...Holder, 1
2...Holder body, 12a...Through hole (at the axis of the holder body), 12p...Top surface of the holder body, 12V, 12V'... - Decompression hole on top surface, 13...pin, 20...semiconductor pellet, 30...collet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 垂直に設けられた棒状のホルダ本体と、前記ボルタ本体
の軸心に設けられた透孔と、前記透孔内を上下し頂部を
透孔から突出させるピン六からなるピックアップピンホ
ルダを有する半導体グイポンディング装置において、ホ
ルダ本体の頂面が凸面になるとともに、この凸面に減圧
透孔を具備したことを特徴とするピックアップピンホル
ダを有する半導体グイポンディング装置。A semiconductor guide having a pickup pin holder consisting of a vertically provided rod-shaped holder body, a through hole provided at the axis of the bolt body, and a pin 6 that moves up and down within the through hole and has a top portion protruding from the through hole. 1. A semiconductor device for pounding a semiconductor device, having a pickup pin holder, characterized in that the top surface of the holder body is a convex surface, and the convex surface is provided with a vacuum hole.
JP17335081U 1981-11-24 1981-11-24 Semiconductor die bonding equipment Granted JPS5878635U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17335081U JPS5878635U (en) 1981-11-24 1981-11-24 Semiconductor die bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17335081U JPS5878635U (en) 1981-11-24 1981-11-24 Semiconductor die bonding equipment

Publications (2)

Publication Number Publication Date
JPS5878635U true JPS5878635U (en) 1983-05-27
JPS6344990Y2 JPS6344990Y2 (en) 1988-11-22

Family

ID=29965214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17335081U Granted JPS5878635U (en) 1981-11-24 1981-11-24 Semiconductor die bonding equipment

Country Status (1)

Country Link
JP (1) JPS5878635U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109729A (en) * 1987-10-22 1989-04-26 Fujitsu Ltd Whole-surface cut chip release device
US9439557B2 (en) 2005-08-30 2016-09-13 Boston Scientific Scimed, Inc. Articulation joint

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109729A (en) * 1987-10-22 1989-04-26 Fujitsu Ltd Whole-surface cut chip release device
US9439557B2 (en) 2005-08-30 2016-09-13 Boston Scientific Scimed, Inc. Articulation joint

Also Published As

Publication number Publication date
JPS6344990Y2 (en) 1988-11-22

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