JPS59169044U - Semiconductor chip adsorption nozzle - Google Patents

Semiconductor chip adsorption nozzle

Info

Publication number
JPS59169044U
JPS59169044U JP6266183U JP6266183U JPS59169044U JP S59169044 U JPS59169044 U JP S59169044U JP 6266183 U JP6266183 U JP 6266183U JP 6266183 U JP6266183 U JP 6266183U JP S59169044 U JPS59169044 U JP S59169044U
Authority
JP
Japan
Prior art keywords
semiconductor chip
adsorption nozzle
elastic body
chip adsorption
shaped elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6266183U
Other languages
Japanese (ja)
Inventor
菅原　武久
吉人 金野
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP6266183U priority Critical patent/JPS59169044U/en
Publication of JPS59169044U publication Critical patent/JPS59169044U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は半導体チップをパッケージに固着する方法を説
明するための図、第２図はダイスボンディング装置の要
部斜視図、第３図は従来の角錐コレットの断面図、第４
図は従来の平面コレットの断面図、第５図は該平面コレ
ットに配設されている弾性体の斜視図、第６図は本考案
に係わるリング状弾性体あ斜視図、第７図はリング状弾
性体を配設した本考案の一実施例である吸着用ノズルの
断面図、第８図は本考案の他の実施例である弾性体の斜
視図である。 １・・・パッケージ、２・・・半導体チップ、３・・・
角錐コレット、４．７・・・吸引パイプ、５．　１３．
　１６・・・吸引孔、１１．１４・・・銅体、１２・・
・弾性体、１５・・・リング状弾性体、１８・・・枠形
状弾性体。Fig. 1 is a diagram for explaining the method of fixing a semiconductor chip to a package, Fig. 2 is a perspective view of the main parts of a die bonding device, Fig. 3 is a cross-sectional view of a conventional pyramidal collet, and Fig. 4
The figure is a sectional view of a conventional flat collet, Figure 5 is a perspective view of an elastic body disposed on the flat collet, Figure 6 is a perspective view of a ring-shaped elastic body according to the present invention, and Figure 7 is a ring-shaped elastic body. FIG. 8 is a cross-sectional view of a suction nozzle according to an embodiment of the present invention in which a shaped elastic body is arranged, and FIG. 8 is a perspective view of an elastic body according to another embodiment of the present invention. 1...Package, 2...Semiconductor chip, 3...
Pyramid collet, 4.7... Suction pipe, 5. 13.
16...Suction hole, 11.14...Copper body, 12...
- Elastic body, 15... Ring-shaped elastic body, 18... Frame-shaped elastic body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空吸引口を有する基体と、該真空吸引口の部分に取り
付けられたリング状弾性体とを具備し、半導体チップの
吸引時に、該リング状弾性体が該半導体チップの表面に
対して線接触する構造としたことを特徴とする半導体チ
ップ吸着用ノズル。A base body having a vacuum suction port and a ring-shaped elastic body attached to the vacuum suction port, the ring-shaped elastic body making line contact with the surface of the semiconductor chip when the semiconductor chip is sucked. A semiconductor chip suction nozzle characterized by a structure.
JP6266183U 1983-04-26 1983-04-26 Semiconductor chip adsorption nozzle Pending JPS59169044U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6266183U JPS59169044U (en) 1983-04-26 1983-04-26 Semiconductor chip adsorption nozzle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6266183U JPS59169044U (en) 1983-04-26 1983-04-26 Semiconductor chip adsorption nozzle

Publications (1)

Publication Number Publication Date
JPS59169044U true JPS59169044U (en) 1984-11-12

Family

ID=30192852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6266183U Pending JPS59169044U (en) 1983-04-26 1983-04-26 Semiconductor chip adsorption nozzle

Country Status (1)

Country Link
JP (1) JPS59169044U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435749U (en) * 1987-08-26 1989-03-03
JPH11163004A (en) * 1997-11-28 1999-06-18 Tosok Corp Collet for die bonding device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144551A (en) * 1980-04-11 1981-11-10 Hitachi Ltd Collet

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144551A (en) * 1980-04-11 1981-11-10 Hitachi Ltd Collet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435749U (en) * 1987-08-26 1989-03-03
JPH11163004A (en) * 1997-11-28 1999-06-18 Tosok Corp Collet for die bonding device

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