JPS56144551A - Collet - Google Patents

Collet

Info

Publication number
JPS56144551A
JPS56144551A JP4684080A JP4684080A JPS56144551A JP S56144551 A JPS56144551 A JP S56144551A JP 4684080 A JP4684080 A JP 4684080A JP 4684080 A JP4684080 A JP 4684080A JP S56144551 A JPS56144551 A JP S56144551A
Authority
JP
Japan
Prior art keywords
collet
pellet
constitution
ring
fitted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4684080A
Other languages
Japanese (ja)
Inventor
Tatsuo Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4684080A priority Critical patent/JPS56144551A/en
Publication of JPS56144551A publication Critical patent/JPS56144551A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To eliminate the need for working an Si tube and improve the vacuum- holding effect by providing an elastic O-ring on the end surface of a collet so as to project therefrom. CONSTITUTION:An elastic O-ring 9 is fitted into an annular groove 11 in the end of a collet 1 or fitted on the periphery of the end portion. By said constitution, the O- ring 9 elastically contacts with a pellet, and the collet never directly contacts therewith, so that no pellet will be damaged. In addition, by said constitution, the cutting process for the Si tube needed in the conventional method is eliminated, and nonuniformity resulting from the cutting is removed. Accordingly, vacuum-holding, separation and carrying of a pellet can be excellently performed.
JP4684080A 1980-04-11 1980-04-11 Collet Pending JPS56144551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4684080A JPS56144551A (en) 1980-04-11 1980-04-11 Collet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4684080A JPS56144551A (en) 1980-04-11 1980-04-11 Collet

Publications (1)

Publication Number Publication Date
JPS56144551A true JPS56144551A (en) 1981-11-10

Family

ID=12758530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4684080A Pending JPS56144551A (en) 1980-04-11 1980-04-11 Collet

Country Status (1)

Country Link
JP (1) JPS56144551A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59169044U (en) * 1983-04-26 1984-11-12 富士通株式会社 Semiconductor chip adsorption nozzle
JPS6167931A (en) * 1984-09-11 1986-04-08 Rohm Co Ltd Chucking device for die-bonding semiconductor pellet
JPH11163004A (en) * 1997-11-28 1999-06-18 Tosok Corp Collet for die bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59169044U (en) * 1983-04-26 1984-11-12 富士通株式会社 Semiconductor chip adsorption nozzle
JPS6167931A (en) * 1984-09-11 1986-04-08 Rohm Co Ltd Chucking device for die-bonding semiconductor pellet
JPH11163004A (en) * 1997-11-28 1999-06-18 Tosok Corp Collet for die bonding device

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