JPS5984841U - Guyang bonding equipment - Google Patents

Guyang bonding equipment

Info

Publication number
JPS5984841U
JPS5984841U JP1983151464U JP15146483U JPS5984841U JP S5984841 U JPS5984841 U JP S5984841U JP 1983151464 U JP1983151464 U JP 1983151464U JP 15146483 U JP15146483 U JP 15146483U JP S5984841 U JPS5984841 U JP S5984841U
Authority
JP
Japan
Prior art keywords
guyang
bonding equipment
bonding
equipment
young
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983151464U
Other languages
Japanese (ja)
Inventor
隆幸 丸山
Original Assignee
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーエプソン株式会社 filed Critical セイコーエプソン株式会社
Priority to JP1983151464U priority Critical patent/JPS5984841U/en
Publication of JPS5984841U publication Critical patent/JPS5984841U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来の装置を説明するための正面図。 第２図は、本考案の一実施例の正面断面図。 １・・・・・・ツール、２・・・・・・半導体、３・・
・・・・バンブ、４・・・・・・断熱材、５・・・・・
・ならいボール、６・・・−・・ならいボール受、７・
・・・・・パターン、８・・・・・・テープ、９・・・
・・・半導体受は台、１０・・・・・・受は台。FIG. 1 is a front view for explaining a conventional device. FIG. 2 is a front sectional view of an embodiment of the present invention. 1...Tools, 2...Semiconductors, 3...
...Banbu, 4...Insulation material, 5...
・Training ball, 6...-・Training ball catch, 7・
...Pattern, 8...Tape, 9...
...The semiconductor receiver is a stand, 10...The receiver is a stand.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体を単体ごとに給材しボンディングを行なうギヤン
グボンディング装置において、前記半導体に形成された
バンブ面を、ツール面になられせるための球面滑動部か
らなるならい機構を有することを特徴とするギヤングボ
ンディング装置。A gear bonding apparatus for supplying and bonding semiconductors individually, characterized by having a tracing mechanism consisting of a spherical sliding part for making a bump surface formed on the semiconductor become a tool surface. Young bonding equipment.
JP1983151464U 1983-09-30 1983-09-30 Guyang bonding equipment Pending JPS5984841U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983151464U JPS5984841U (en) 1983-09-30 1983-09-30 Guyang bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983151464U JPS5984841U (en) 1983-09-30 1983-09-30 Guyang bonding equipment

Publications (1)

Publication Number Publication Date
JPS5984841U true JPS5984841U (en) 1984-06-08

Family

ID=30335636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983151464U Pending JPS5984841U (en) 1983-09-30 1983-09-30 Guyang bonding equipment

Country Status (1)

Country Link
JP (1) JPS5984841U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS518066B1 (en) * 1967-06-23 1976-03-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS518066B1 (en) * 1967-06-23 1976-03-13

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