JPS56120137A - Semiconductor pellet pickup device - Google Patents

Semiconductor pellet pickup device

Info

Publication number
JPS56120137A
JPS56120137A JP2339480A JP2339480A JPS56120137A JP S56120137 A JPS56120137 A JP S56120137A JP 2339480 A JP2339480 A JP 2339480A JP 2339480 A JP2339480 A JP 2339480A JP S56120137 A JPS56120137 A JP S56120137A
Authority
JP
Japan
Prior art keywords
pellet
nozzle
pellets
spot
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2339480A
Other languages
Japanese (ja)
Inventor
Yuji Miura
Fumio Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2339480A priority Critical patent/JPS56120137A/en
Publication of JPS56120137A publication Critical patent/JPS56120137A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To arrange so that pellets may cause edge cracking or pressure breakdown by supporting the pellets flexibly at the lower part of the pellets and reducing a contact stress between a suction nozzle and a pellet with the help of a spot faced hole. CONSTITUTION:An optional pellet 1 to be sucked by a cassette ring 4 is caused to shift toward the lower part of a suction nozzle 2 and then the nozzle 2 arranged on a backup holder 5 is caused to descend to come in contact with the pellet 1, so that the nozzle sucks the pellet. In this case, because of the existence of the spot-faced hole, it suports the pellet 1 flexibly by the lower part of the pellet 1 when the sheet extends toward the hole 6 and a contact stress between the nozzle and the pellet 1 is eased by the spot-faced hole 6.
JP2339480A 1980-02-28 1980-02-28 Semiconductor pellet pickup device Pending JPS56120137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2339480A JPS56120137A (en) 1980-02-28 1980-02-28 Semiconductor pellet pickup device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2339480A JPS56120137A (en) 1980-02-28 1980-02-28 Semiconductor pellet pickup device

Publications (1)

Publication Number Publication Date
JPS56120137A true JPS56120137A (en) 1981-09-21

Family

ID=12109285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2339480A Pending JPS56120137A (en) 1980-02-28 1980-02-28 Semiconductor pellet pickup device

Country Status (1)

Country Link
JP (1) JPS56120137A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204247A (en) * 1983-05-04 1984-11-19 Rohm Co Ltd Tape guide at die pickup part in die bonding device
JP2009106430A (en) * 2007-10-29 2009-05-21 Manabu Kaseyama Holder for preventing thread loosening in bobbin for sewing machine
JP2011243797A (en) * 2010-05-19 2011-12-01 Canon Machinery Inc Pickup device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204247A (en) * 1983-05-04 1984-11-19 Rohm Co Ltd Tape guide at die pickup part in die bonding device
JP2009106430A (en) * 2007-10-29 2009-05-21 Manabu Kaseyama Holder for preventing thread loosening in bobbin for sewing machine
JP2011243797A (en) * 2010-05-19 2011-12-01 Canon Machinery Inc Pickup device

Similar Documents

Publication Publication Date Title
CA1249351A (en) Apparatus and method for protection of a substrate
JPS5250566A (en) Substrate soldering clip
EP0218873A3 (en) Film peeling apparatus
IT7827913A0 (en) TELEPHONE DEVICE WITH ELECTRONIC DEVICE, FOR SEARCHING AND AUTOMATIC CALLING OF NUMBERS, STORED IN THE SAME DEVICE.
JPS56120137A (en) Semiconductor pellet pickup device
JPS53100765A (en) Production of semiconductor device
JPS5733941A (en) Positioning device
JPS5583239A (en) Mounting tip element
JPS5329579B2 (en)
JPS57145716A (en) Lineup feeder of chiplike component
JPS523383A (en) Manufacturing method of semiconductor device electrode
JPS56120136A (en) Pellet mounting method
JPS5674933A (en) Preparation method of semiconductor device
JPS5753946A (en) Collet for die bonding
JPS5410664A (en) Semiconductor pellet removing device
JPS55127029A (en) Semiconductor device
JPS5375866A (en) Wafer transfer device
JPS51130169A (en) Semiconductor device
JPS5516450A (en) Semiconductor device
JPS5324779A (en) Clamper of wire bonder
JPS5228262A (en) Process for assembling semiconductor device
JPS6464330A (en) Positioning method for semiconductor device
JPS52156551A (en) Semiconductor wafer breaking method
JPS57107039A (en) Manufacture of semiconductor
JPS57136341A (en) Removing method for part from sheet