JPS6464330A - Positioning method for semiconductor device - Google Patents

Positioning method for semiconductor device

Info

Publication number
JPS6464330A
JPS6464330A JP62221293A JP22129387A JPS6464330A JP S6464330 A JPS6464330 A JP S6464330A JP 62221293 A JP62221293 A JP 62221293A JP 22129387 A JP22129387 A JP 22129387A JP S6464330 A JPS6464330 A JP S6464330A
Authority
JP
Japan
Prior art keywords
contact
hole
pin
brought
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62221293A
Other languages
Japanese (ja)
Inventor
Shigeo Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62221293A priority Critical patent/JPS6464330A/en
Publication of JPS6464330A publication Critical patent/JPS6464330A/en
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To eliminate the damage of a semiconductor device by providing elasticity in upward and downward directions, inserting a guide pin having a taper at its end into the reference hole of the device, bringing an attracting pad made of an elastic material into contact with the rear face of the device, and evacuating it in vacuum. CONSTITUTION:The diameter of the body of a guide pin 9 is formed larger than that of the reference hole 3 of a semiconductor device 1 to bring the hole 3 into contact with the tapered part of the end of the pin 9 to be engaged therewith. Since the pin 9 has elasticity in upward and downward directions, an attracting pad 10 is brought into contact with the rear face of the device 1 and evacuated in vacuum to brought the hole 3 into contact with the tapered part of the end of the pin 9 to be engaged therewith, the device can be brought into close contact with its reference face 11, and can be positioned at the face 11 of the device 1. Thus, since the hole 3 of the device is brought into contact with the end of the pin 9 to be sufficiently engaged, it is not necessary to cut the wall of the hole 3, to generate dusts or to destroy the device 1.
JP62221293A 1987-09-04 1987-09-04 Positioning method for semiconductor device Pending JPS6464330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62221293A JPS6464330A (en) 1987-09-04 1987-09-04 Positioning method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62221293A JPS6464330A (en) 1987-09-04 1987-09-04 Positioning method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6464330A true JPS6464330A (en) 1989-03-10

Family

ID=16764515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62221293A Pending JPS6464330A (en) 1987-09-04 1987-09-04 Positioning method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6464330A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785140A (en) * 1995-01-17 1998-07-28 Suzuki Motor Corporation Vehicular vibration isolating apparatus
JP2019140231A (en) * 2018-02-09 2019-08-22 株式会社デンソーウェーブ Light receiving module and method for inspecting light receiving module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785140A (en) * 1995-01-17 1998-07-28 Suzuki Motor Corporation Vehicular vibration isolating apparatus
JP2019140231A (en) * 2018-02-09 2019-08-22 株式会社デンソーウェーブ Light receiving module and method for inspecting light receiving module

Similar Documents

Publication Publication Date Title
EP0120794A3 (en) Apparatus for applying two-part surgical fasteners
CA1249351A (en) Apparatus and method for protection of a substrate
JPS6464330A (en) Positioning method for semiconductor device
ES2094121T3 (en) PROCEDURE FOR THE PNEUMATIC INSERTION OF AN ELECTRICAL LINE IN AN EMPTY ENVELOPE.
JPS57160815A (en) Article supply method and jig
MY100934A (en) Cord tightening device.
JPS57102712A (en) Core drill locating device
JPS6468938A (en) Removal of defective semiconductor element
JPS56120124A (en) Wafer replacement device
JPS6423171A (en) Inspecting device for semiconductor laser chip
JPS57201103A (en) Inserting body of throwaway tip
JPS56120137A (en) Semiconductor pellet pickup device
JPS6420860A (en) Box for disposing used syringes
JPS6448746A (en) Positioning method for sheet
ES481790A1 (en) Method of ultrasonic testing of the weld between a pipe and a plug to obturate this pipe, and plug adapted to this method.
JPS5646172A (en) Vent valve
JPS5638230A (en) Simple device for removing and fitting bracket and the like in foamed-plastic forming machine
SE8705053L (en) SATISFIED IN PREPARATION OF A TUBE POWDER PRESSURE BODY AND A FOOD IMPLEMENTED BY THE SUITABLE DEVICE
EP0101260A3 (en) Device for retaining material against a wall surface
JPS57154881A (en) Semiconductor device with optical fiber
JPS6437041A (en) Semiconductor device
JPS5712532A (en) Removing method of semiconductor element
JPS6478501A (en) Isolator
ATE26956T1 (en) PNEUMATIC COMPONENT FOR A VACUUM SUCTION HEAD OR A VACUUM NOZZLE.
ES294176U (en) Nut comprising an integrated elastic zone.