JPS6468938A - Removal of defective semiconductor element - Google Patents

Removal of defective semiconductor element

Info

Publication number
JPS6468938A
JPS6468938A JP62225737A JP22573787A JPS6468938A JP S6468938 A JPS6468938 A JP S6468938A JP 62225737 A JP62225737 A JP 62225737A JP 22573787 A JP22573787 A JP 22573787A JP S6468938 A JPS6468938 A JP S6468938A
Authority
JP
Japan
Prior art keywords
pellet
rear surface
defective pellet
defective
sucking nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62225737A
Other languages
Japanese (ja)
Inventor
Hiroyuki Yasutake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP62225737A priority Critical patent/JPS6468938A/en
Publication of JPS6468938A publication Critical patent/JPS6468938A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To release a defective pellet from an electron sheet easily, by pushing up a part close to the edge of the defective pellet, chucking the rear surface of the detective pellet by means of a sucking nozzle, and lifting up the pellet. CONSTITUTION:An upper end surface 1a of a pushing-up pin 1 is cut in a slant shape. The slanted upper end surface 1a of said pushing-up pin 1 is pushed to the rear surface of a defective pellet 3 through an electron sheet 4. The defective pellet 3 is pushed up in a slant attitude with said pushing-up pin 1. An inserting space S for a sucking nozzle 2 is secured between a part of a rear surface 3a of the defective pellet 3 and the electron sheet 4. Then, the sucking nozzle 2 is inserted into the inserting space S between the rear surface 3a of the defective pellet 3 and the electron sheet 4. A part of the rear surface 3a of the defective pellet 3 is chucked with said sucking nozzle 2. With the sucking nozzle 2 being attached to a part of the rear surface 3a of the defective pellet 3, the sucking nozzle 2 is lifted up to the slant upper part. Thus, the defective pellet 3 is released and removed from the electron sheet 4.
JP62225737A 1987-09-09 1987-09-09 Removal of defective semiconductor element Pending JPS6468938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62225737A JPS6468938A (en) 1987-09-09 1987-09-09 Removal of defective semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62225737A JPS6468938A (en) 1987-09-09 1987-09-09 Removal of defective semiconductor element

Publications (1)

Publication Number Publication Date
JPS6468938A true JPS6468938A (en) 1989-03-15

Family

ID=16834042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62225737A Pending JPS6468938A (en) 1987-09-09 1987-09-09 Removal of defective semiconductor element

Country Status (1)

Country Link
JP (1) JPS6468938A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6547902B2 (en) * 1999-12-15 2003-04-15 Kabushiki Kaisha Shinkawa Die bonding method and apparatus
WO2003071848A1 (en) * 2002-02-15 2003-08-28 Motorola, Inc. Process and apparatus for disengaging semiconductor die from an adhesive film
WO2013035813A1 (en) * 2011-09-06 2013-03-14 矢崎総業株式会社 Display device for vehicle

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6547902B2 (en) * 1999-12-15 2003-04-15 Kabushiki Kaisha Shinkawa Die bonding method and apparatus
WO2003071848A1 (en) * 2002-02-15 2003-08-28 Motorola, Inc. Process and apparatus for disengaging semiconductor die from an adhesive film
US6889427B2 (en) 2002-02-15 2005-05-10 Freescale Semiconductor, Inc. Process for disengaging semiconductor die from an adhesive film
WO2013035813A1 (en) * 2011-09-06 2013-03-14 矢崎総業株式会社 Display device for vehicle
EP2755075A1 (en) * 2011-09-06 2014-07-16 Yazaki Corporation Display device for vehicle
EP2755075A4 (en) * 2011-09-06 2015-04-01 Yazaki Corp Display device for vehicle
US9304318B2 (en) 2011-09-06 2016-04-05 Yazaki Corporation Display device for vehicle

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