JPS6468938A - Removal of defective semiconductor element - Google Patents
Removal of defective semiconductor elementInfo
- Publication number
- JPS6468938A JPS6468938A JP62225737A JP22573787A JPS6468938A JP S6468938 A JPS6468938 A JP S6468938A JP 62225737 A JP62225737 A JP 62225737A JP 22573787 A JP22573787 A JP 22573787A JP S6468938 A JPS6468938 A JP S6468938A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- rear surface
- defective pellet
- defective
- sucking nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To release a defective pellet from an electron sheet easily, by pushing up a part close to the edge of the defective pellet, chucking the rear surface of the detective pellet by means of a sucking nozzle, and lifting up the pellet. CONSTITUTION:An upper end surface 1a of a pushing-up pin 1 is cut in a slant shape. The slanted upper end surface 1a of said pushing-up pin 1 is pushed to the rear surface of a defective pellet 3 through an electron sheet 4. The defective pellet 3 is pushed up in a slant attitude with said pushing-up pin 1. An inserting space S for a sucking nozzle 2 is secured between a part of a rear surface 3a of the defective pellet 3 and the electron sheet 4. Then, the sucking nozzle 2 is inserted into the inserting space S between the rear surface 3a of the defective pellet 3 and the electron sheet 4. A part of the rear surface 3a of the defective pellet 3 is chucked with said sucking nozzle 2. With the sucking nozzle 2 being attached to a part of the rear surface 3a of the defective pellet 3, the sucking nozzle 2 is lifted up to the slant upper part. Thus, the defective pellet 3 is released and removed from the electron sheet 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62225737A JPS6468938A (en) | 1987-09-09 | 1987-09-09 | Removal of defective semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62225737A JPS6468938A (en) | 1987-09-09 | 1987-09-09 | Removal of defective semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6468938A true JPS6468938A (en) | 1989-03-15 |
Family
ID=16834042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62225737A Pending JPS6468938A (en) | 1987-09-09 | 1987-09-09 | Removal of defective semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6468938A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6547902B2 (en) * | 1999-12-15 | 2003-04-15 | Kabushiki Kaisha Shinkawa | Die bonding method and apparatus |
WO2003071848A1 (en) * | 2002-02-15 | 2003-08-28 | Motorola, Inc. | Process and apparatus for disengaging semiconductor die from an adhesive film |
WO2013035813A1 (en) * | 2011-09-06 | 2013-03-14 | 矢崎総業株式会社 | Display device for vehicle |
-
1987
- 1987-09-09 JP JP62225737A patent/JPS6468938A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6547902B2 (en) * | 1999-12-15 | 2003-04-15 | Kabushiki Kaisha Shinkawa | Die bonding method and apparatus |
WO2003071848A1 (en) * | 2002-02-15 | 2003-08-28 | Motorola, Inc. | Process and apparatus for disengaging semiconductor die from an adhesive film |
US6889427B2 (en) | 2002-02-15 | 2005-05-10 | Freescale Semiconductor, Inc. | Process for disengaging semiconductor die from an adhesive film |
WO2013035813A1 (en) * | 2011-09-06 | 2013-03-14 | 矢崎総業株式会社 | Display device for vehicle |
EP2755075A1 (en) * | 2011-09-06 | 2014-07-16 | Yazaki Corporation | Display device for vehicle |
EP2755075A4 (en) * | 2011-09-06 | 2015-04-01 | Yazaki Corp | Display device for vehicle |
US9304318B2 (en) | 2011-09-06 | 2016-04-05 | Yazaki Corporation | Display device for vehicle |
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