JPS6461031A - Device for mounting chip - Google Patents

Device for mounting chip

Info

Publication number
JPS6461031A
JPS6461031A JP62218554A JP21855487A JPS6461031A JP S6461031 A JPS6461031 A JP S6461031A JP 62218554 A JP62218554 A JP 62218554A JP 21855487 A JP21855487 A JP 21855487A JP S6461031 A JPS6461031 A JP S6461031A
Authority
JP
Japan
Prior art keywords
tray
chips
chuck
corner
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62218554A
Other languages
Japanese (ja)
Other versions
JPH088293B2 (en
Inventor
Katsunori Nishiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP62218554A priority Critical patent/JPH088293B2/en
Priority to US07/237,578 priority patent/US4868974A/en
Priority to CA000576092A priority patent/CA1297665C/en
Priority to AU21709/88A priority patent/AU598393B2/en
Priority to EP88114280A priority patent/EP0306021B1/en
Priority to DE3852736T priority patent/DE3852736T2/en
Publication of JPS6461031A publication Critical patent/JPS6461031A/en
Publication of JPH088293B2 publication Critical patent/JPH088293B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To move a chip to a home position of a tray by obliquely supporting the tray by using a stage in a specific direction, and vibrating the tray by vibrating means. CONSTITUTION:Chips 5 are placed in the recesses 21 of a tray 20, the tray 20 is fed above the tray chuck 12 of a stage 11, engaged within the chuck groove 14 of the chuck 12, and secured. After the tray 20 is chucked, a lifter 13 is operated to incline the chuck 12, and the tray 20 is so inclined that the one corner of the recess 21 becomes lower than the other corner. Then, the tray 20 is finely vibrated by vibrating means, the chips 5 are slid in the recesses 21, and one corner coincides with the lower corner of the recess 21. Thus, all the chips 5 are brought into contact with the corners of the same positions of the recesses 21, and the chips 5 are positioned. Thereafter, it is attracted by a collet 15, and picked up.
JP62218554A 1987-09-01 1987-09-01 Chip mounting device Expired - Lifetime JPH088293B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP62218554A JPH088293B2 (en) 1987-09-01 1987-09-01 Chip mounting device
US07/237,578 US4868974A (en) 1987-09-01 1988-08-29 Chip mounting apparatus
CA000576092A CA1297665C (en) 1987-09-01 1988-08-30 Chip mounting apparatus
AU21709/88A AU598393B2 (en) 1987-09-01 1988-08-31 Chip mounting apparatus
EP88114280A EP0306021B1 (en) 1987-09-01 1988-09-01 Chip mounting apparatus
DE3852736T DE3852736T2 (en) 1987-09-01 1988-09-01 Device for mounting chips.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62218554A JPH088293B2 (en) 1987-09-01 1987-09-01 Chip mounting device

Publications (2)

Publication Number Publication Date
JPS6461031A true JPS6461031A (en) 1989-03-08
JPH088293B2 JPH088293B2 (en) 1996-01-29

Family

ID=16721758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62218554A Expired - Lifetime JPH088293B2 (en) 1987-09-01 1987-09-01 Chip mounting device

Country Status (1)

Country Link
JP (1) JPH088293B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010055252A (en) * 1999-12-10 2001-07-04 마이클 디. 오브라이언 off loader of singulation device for manufacturing semiconductor package
KR100799896B1 (en) * 2005-01-07 2008-01-31 에이에스엠 어쌤블리 오토메이션 리미티드 Apparatus and method for aligning devices on carriers
CN101819919A (en) * 2009-02-16 2010-09-01 佳能安内华股份有限公司 Tray, tray support member, and vacuum processing apparatus
CN106952851A (en) * 2017-04-17 2017-07-14 如皋市大昌电子有限公司 A kind of Jolting bulk quantity of chips alignment system
WO2017178364A1 (en) * 2016-04-14 2017-10-19 Muehlbauer GmbH & Co. KG Device, system, and method for aligning electronic components
CN113295734A (en) * 2021-04-27 2021-08-24 浙江朗德电子科技有限公司 Micro-miniature sensor chip

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010055252A (en) * 1999-12-10 2001-07-04 마이클 디. 오브라이언 off loader of singulation device for manufacturing semiconductor package
KR100799896B1 (en) * 2005-01-07 2008-01-31 에이에스엠 어쌤블리 오토메이션 리미티드 Apparatus and method for aligning devices on carriers
CN101819919A (en) * 2009-02-16 2010-09-01 佳能安内华股份有限公司 Tray, tray support member, and vacuum processing apparatus
WO2017178364A1 (en) * 2016-04-14 2017-10-19 Muehlbauer GmbH & Co. KG Device, system, and method for aligning electronic components
JP2019514220A (en) * 2016-04-14 2019-05-30 ミュールバウアー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト Apparatus, system and method for positioning electronic components
US10604358B2 (en) 2016-04-14 2020-03-31 Muehlbauer GmbH & Co. KG Device, system and method for aligning electronic components
CN106952851A (en) * 2017-04-17 2017-07-14 如皋市大昌电子有限公司 A kind of Jolting bulk quantity of chips alignment system
CN106952851B (en) * 2017-04-17 2023-06-13 如皋市大昌电子有限公司 Jolt type batch chip positioning system
CN113295734A (en) * 2021-04-27 2021-08-24 浙江朗德电子科技有限公司 Micro-miniature sensor chip

Also Published As

Publication number Publication date
JPH088293B2 (en) 1996-01-29

Similar Documents

Publication Publication Date Title
DE3874981D1 (en) VACUUM DEVICE FOR HOLDING WORKPIECES.
EP0405855A3 (en) Ion implanting apparatus and process for fabricating semiconductor integrated circuit device by using the same apparatus
ATE194728T1 (en) DEVICE FOR COUPLING LOADING AND UNLOADING DEVICES WITH SEMICONDUCTOR PROCESSING MACHINES
EP0408216A3 (en) Method for processing wafers and producing semiconductor devices and apparatus for producing the same
EP0386447A3 (en) Apparatus and method for processing a semiconductor wafer
DE3889473D1 (en) Device for handling a wafer.
CA2231852A1 (en) Substrate processing apparatus and method
EP0344764A3 (en) Process for the wet-chemical surface treatment of semiconductor chips
MY108895A (en) Method for extending wafer-supporting sheet
IL85329A (en) Apparatus for handling semiconductor wafers
JPS6461031A (en) Device for mounting chip
EP0405301A3 (en) Method and apparatus for handling semiconductor wafers
JPS6461033A (en) Device for mounting chip
JPS5720444A (en) Feeding device for semiconductor wafer
EP0426007A3 (en) Apparatus for loading and re-slicing semiconductor wafer
EP0304945A3 (en) Magnetic force detecting semiconductor device and methodmagnetic force detecting semiconductor device and method for manufacturing the same for manufacturing the same
JPS6461032A (en) Device for mounting chip
JPS5434774A (en) Article transfer device
JPS5719219A (en) Wafer carrier jig conveyor
KR960012649B1 (en) Wafer scale or full wafer memory system, package, method thereof and wafer processing method employed therein
JPS569141A (en) Supporting method for article
JPS6445543A (en) Transfer device
JPS5710941A (en) Supplying method for semiconductor element
SG72609A1 (en) A semiconductor device for fabrication process
JPS57160815A (en) Article supply method and jig