JPS5710941A - Supplying method for semiconductor element - Google Patents

Supplying method for semiconductor element

Info

Publication number
JPS5710941A
JPS5710941A JP8507080A JP8507080A JPS5710941A JP S5710941 A JPS5710941 A JP S5710941A JP 8507080 A JP8507080 A JP 8507080A JP 8507080 A JP8507080 A JP 8507080A JP S5710941 A JPS5710941 A JP S5710941A
Authority
JP
Japan
Prior art keywords
collet
pellet
feeders
slide shaft
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8507080A
Other languages
Japanese (ja)
Inventor
Fumio Takahashi
Yuji Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8507080A priority Critical patent/JPS5710941A/en
Publication of JPS5710941A publication Critical patent/JPS5710941A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Abstract

PURPOSE:To improve operation efficiency by a method wherein a chip tray placed on an XY table is mounted at the middle of lead frame feeders juxtaposed, and a pellet of the tray is supplied alternately to the feeders by means of two pairs of collets. CONSTITUTION:When a slide shaft is moved in the A direction and further lowered, the collet 8a approaches to the element 11a1 and the collet 8b to the pellet of the chip tray 3, and the pellet 51 is attracted by means of the collet 8b. The slide shaft 6 is elevated while a position of the pellet 52 placed on the XY table is moved to the middle of the feeders 1a, 1b, the slide shaft is shifted in the A' direction and dropped, the collet 8a is positioned at the pellet 52 and the collet 8b at an element placing location of the lead frame 10b, the collet 8a adsorbs the pellet 52 and the pellet 51 is placed on the collet 8b. The operation is repeated, and work is quickened.
JP8507080A 1980-06-25 1980-06-25 Supplying method for semiconductor element Pending JPS5710941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8507080A JPS5710941A (en) 1980-06-25 1980-06-25 Supplying method for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8507080A JPS5710941A (en) 1980-06-25 1980-06-25 Supplying method for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5710941A true JPS5710941A (en) 1982-01-20

Family

ID=13848361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8507080A Pending JPS5710941A (en) 1980-06-25 1980-06-25 Supplying method for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5710941A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022834U (en) * 1983-07-22 1985-02-16 関西日本電気株式会社 Semiconductor device manufacturing equipment
DE3708119A1 (en) * 1986-03-15 1987-09-24 Tdk Corp DEVICE AND METHOD FOR ATTACHING A SWITCHING ELEMENT ON A PRINTED CIRCUIT BOARD
US8793867B2 (en) 2010-03-03 2014-08-05 Samsung Techwin Co., Ltd. Head nozzle and apparatus for mounting electronic parts

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022834U (en) * 1983-07-22 1985-02-16 関西日本電気株式会社 Semiconductor device manufacturing equipment
DE3708119A1 (en) * 1986-03-15 1987-09-24 Tdk Corp DEVICE AND METHOD FOR ATTACHING A SWITCHING ELEMENT ON A PRINTED CIRCUIT BOARD
US8793867B2 (en) 2010-03-03 2014-08-05 Samsung Techwin Co., Ltd. Head nozzle and apparatus for mounting electronic parts

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