JPH0214547A - Picking-up apparatus of electronic component - Google Patents

Abstract

PURPOSE:To reduce the damage to a chip and to reduce an irregularity in the timing of a separation by a method wherein a pushing-up rod arranged and installed in the central part of a stage strips an electronic component from an adhesive stage, the electronic component is pushed up by means of a pushing-up needle and the electronic component is sucked by means of a collet. CONSTITUTION:A chip 1 is pasted on an adhesive tape 2. A pushing rod 11 whose tip is flat is installed in the center of a stage 10 arranged at the lower part; it is surrounded by four pushing-up pins 12. When the tip of a collet 3 is lowered to a position which is a little higher than the chip 1, the collet is stopped momentarily; while the pushing-up rod 11 pushes up the chip 1 via the tape 2 from the lower part and strips the chip 1 from the tape 2, the chip 1 is sucked by a chip-holding part 8. During this process, since the surface of the pushing-up rod 11 is flat, the chip 1 is not tilted. The chip is sucked by a vacuum hole 4 in the collet 3. During this process, the pushing-up pins 14 break the tape 2 from the lower part, are raised, push up the chip 1 slightly and separate the tape 2.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a pick-up device for electronic components, and more particularly to a pick-up device for semiconductor chips that peels off an adhesive tape and adsorbs a semiconductor chip.

(Prior Art) Conventionally, as technologies in this type of field, there have been, for example, the following.

FIG. 3 is a big amplifier process diagram using a conventional semiconductor chip pickup device.

As shown in the figure, a semiconductor knob (hereinafter simply referred to as a chip) 1 is adhered onto an adhesive tape 2. The collet 3 disposed above has a vacuum hole 4 in the center for sucking a predetermined chip, and a chip holding portion 8 is formed at its lower end. This chip holding portion 8 is sloped and has a bowl shape. This is because when the chip 1 is suctioned, when the chip surface is suctioned, chips from the chip or foreign objects such as dust and metal pieces are caught between the collet 3 and the chip 1, and this causes scratches and impressions on the chip surface. This is to prevent the chip surface from being directly adsorbed by the collet in order to avoid damage to the chip 1. A suction device 5 for sucking the tape 2 downward is disposed on the lower side, and a push-up needle 6 is disposed at the center of this attachment device 5.

Therefore, first, from the state shown in FIG. 3(a), the collet 3 and the push-up needle 6 operate synchronously in a direction approaching a predetermined chip 1. During this operation, as shown in FIG. 3(b), just before the chip holder 8 contacts the chip 1, the push-up needle 6 pushes up the chip 1 through the adhesive tape 2, and while peeling off the chip 1 and the tape 2, , bring the chip 1 close to the chip holder 8.

At this time, as shown in FIG. 3(b)', the adhesive tape 2 is sucked downward by the suction lower provided in the suction device 5 to ensure that the chip 1 and the tape 2 are peeled off. There is a way. Next, in FIG. 3(c), the chip I and the tape 2 are separated, and the chip 1 comes into contact with the chip holding section 8, is sucked through the vacuum hole 4, and is held by suction.

(Problems to be Solved by the Invention) However, in the conventional chip pick-up method described above, due to the adhesive strength of the adhesive tape, static electricity, etc., the timing at which the chip and tape are separated is not constant, and each The tip may not be properly attracted to the colleft due to variations in the thickness of the tip, variations in the position or height of the push-up needle, or misalignment or malfunction of the push-up operation due to wear on the tip of the needle during use. I can't do it,
As shown in FIG. 4(a), the chip may be sucked at an angle, or as shown in FIG. 4(b), the chip may be sucked out of position, resulting in scratches on the chip surface. Chip chipping may occur at the four corners of the chip, causing serious defects in product quality or as shown in Figure 4 (b).
), there is a problem that if the incorrect position adsorption occurs, the chip cannot be placed in the correct predetermined position.

In the present invention, when picking up the chips described above,
The purpose of the present invention is to provide a big amplification device for electronic components that can perform more appropriate big amplification of chips by eliminating problems such as scratches on the chip and inability to set the chip in the correct position. .

(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention pushes up an electronic component attached to an adhesive tape from below the electronic component, and sucks the pushed out electronic component with a collet. A pick-up device for electronic components includes a stage arranged below, a push-up bar arranged in the center of the stage and whose upper surface is flat, and a push-up bar arranged so as to surround the push-up keyhole. A push-up needle is provided, and the push-up bar ascends from below the electronic component, peels off the electronic component from the adhesive tape in advance, then pushes the electronic component upward with the push-up needle, and adsorbs a predetermined electronic component with the collet. It is configured to do so.

(Function) According to the present invention, as shown in FIG. 1 and FIG.
First, the push-up rod 11 is raised to peel off the chip 1 from the adhesive tape 2 in advance, and then the push-up needle 12 pushes the chip 1 upward, and the collet 3 attracts a predetermined chip.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a chip pickup showing an embodiment of the present invention.
FIG. 2 is an enlarged plan view of the stage of the pickup device.

As shown in FIG. 1, a chip 1 is pasted on an adhesive tape 2. As shown in FIG. Reference numeral 3 denotes a collet for attracting a thousand knobs, which is arranged above and has a chip vacuum hole 4 in the center and a chip holding part 8 at the lower end. As shown in Fig. 2, in the center of the stage 10 placed below, there is a flat tip pushed up! I 11 is provided, and four push-up needles 12 are arranged so as to surround this.

The chip pickup process will be described below.

First, as shown in FIG. 1(a), the collet 3 and the push-up rod 11 operate synchronously in a direction approaching the chip 1.

Next, as shown in FIG. 1(b), the tip of the collet 3 is placed at a position slightly higher than the tip 1, for example, 0.1 m or more.
When the robot descends to a height of 0.2 m, the operation will be temporarily stopped. In parallel with or before and after the operation of the collet 3, the push-up rod 11 pushes up the chip 1 from below through the tape 2, and while peeling off the chip 1 and the tape 2, the chip 1 is attracted to the chip holding part 8. At this time, since the upper surface of the push-up rod 11 is flat, the chip 1 rises without tilting.

The lifted chip 1 is attracted by the vacuum hole 4 of the collet 3. At this time, as shown in FIG. 1(c), the push-up needles 12 arranged so as to surround the push-up rod 11
It breaks through tape 2 from below and rises. At this time, chip 1 is pushed up slightly to completely separate tape 2. However, the collet 3 is raised by the above-mentioned push-up amount so that no more than necessary force is applied to the chip 1. In this case, the height of chip 1 is 0.35 mm when the thickness of chip 1 is 0.35 mm.
2 to 0.3fi, and if the height of the chip 1 is this high, there is no risk of external damage to adjacent chips caused by this or that.

In the above embodiment, the four push-up needles 12 are arranged so as to surround the push-up rod 11, but the number of push-up needles can be increased or decreased as appropriate. Furthermore, the shapes of the push-up rod and push-up needle can be modified as appropriate.

Furthermore, the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

(Effects of the Invention) As described in detail above, according to the present invention, a push-up bar with a flat upper surface is provided separately from the push-up needle, and the push-up bar rises to attach the chip and the adhesive tape in advance. After peeling off, the chip is pushed upward with a push-up needle, and a predetermined chip is attracted by a collet. With this two-step push-up method, the chip and adhesive tape can be completely separated with less force than before, minimizing damage to the chip and eliminating variations in the timing of separation. It is small and prevents the chip from being sucked in a tilted state. Furthermore, when a chip is picked up by the collet, it is done at a higher position than other chips, so there is no external damage to other chips.

[Brief explanation of the drawing]

FIG. 1 is a diagram of a chip pickup process using a chip pickup device according to an embodiment of the present invention, FIG. 2 is an enlarged plan view of the stage of the pickup device of the present invention, and FIG. 3 is a conventional chip pickup device. FIG. 4 is a diagram illustrating problems with the prior art. 1... Semiconductor chip, 2... Adhesive tape, 3...
Collet, 4... Vacuum hole, 8... Chip holding part, 1
o... Stage, 11... Push-up rod, push-up needle.

Claims (1)

[Scope of Claims] An electronic component pickup device that pushes up an electronic component affixed to an adhesive tape from below and sucks the pushed out electronic component with a collet, comprising: (a) disposed below; a stage; (b) a push-up bar disposed at the center of the stage and having a flat upper surface; (c) a push-up needle disposed so as to surround the push-up bar; (d) ) The push-up rod is configured to rise from below the electronic component, peel off the electronic component from the adhesive tape in advance, push up the electronic component upward with the push-up needle, and adsorb a predetermined electronic component with the collet. A pick-up device for electronic components, which is characterized by: