JPH0376139A - Upward pushing movement of semiconductor element - Google Patents

Abstract

PURPOSE:To keep semiconductor elements from being damaged in contact with each other by providing a pushing block to move up and down independently of a pushing needle in a cylindrical stage between its needle and in walls of the cylindrical stage, and lifting each semiconductor element horizontally by the above block and after that, pushing up the semiconductor element by the pushing needle. CONSTITUTION:A pushing block 2 is provided in a cylindrical stage 1 and is set so as to surround a needle 3 for pushing up and its upper face is formed into a flat shape. Each semiconductor element 6 that is pasted on an adhesive tape 5 is sucked by a vacuum source through each vacuum suction hole 8 and then, a nozzle 7 lowers to suck the semiconductor element 6. After that, the pushing block 2 is pushed up by a driving source and the element 6 is pushed up horizontally together with the adhesive tape 5. The semiconductor element peripheral part 9 of the adhesive tape on which the element 6 is pasted is separated by the above pushing up action. Then, the element 6 is pushed up by the pushing needle 3 through a pushing needle holder 4 and then, the element 6 is peeled off completely from the adhesive tape 5.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method of pushing up a semiconductor element attached to an adhesive tape when die bonding a semiconductor element, and in particular, a method of pushing up a semiconductor element attached to an adhesive tape when die bonding a semiconductor element. Regarding the method of peeling.

[Conventional technology]

Conventionally, this type of push-up method is shown in FIG. 5(a).

As shown in the operational cross-sectional views of the push-up unit in (b) and (c), the semiconductor element 6 attached to the adhesive tape 5 is
The adhesive tape 5 is vacuum-adsorbed onto a cylindrical stage 1 with vacuum suction holes 8, and after a suction nozzle 7 for picking up the semiconductor element 6 descends to the surface of the semiconductor element 6, it is attached to the push-up needle 3. The conventional method is to push up the semiconductor element 6 from the back side through the adhesive tape 5 and peel the semiconductor element 6 from the adhesive tape 5.

[Problem to be solved by the invention]

In the conventional push-up method described above, the semiconductor device is pushed up using only the push-up needle, so as the size of the semiconductor device increases, it is necessary to increase the push-up amount of the needle or increase the number of needles. . Therefore, when pushing up with one push-up needle 3 as shown in FIG. There was a drawback that the pellets were scratched 11.

Also, when using a plurality of push-up needles 3 to push up the semiconductor element 6 horizontally, as shown in the cross-sectional view of the push-up unit in FIG. If any one of the needles breaks, it becomes impossible to push up the semiconductor element 6 horizontally.
The drawback was that it damaged the semiconductor element in the same way as when thrusting up with a single needle.

Furthermore, when multiple needles are used, the wire portion breaks through the adhesive tape that adheres the semiconductor element, which increases the number of holes made by the needles and causes leaks (i.e., poor peeling) in the cylindrical stage. It became.

The method of the present invention differs from the conventional push-up method described above in that a push-up block is used to push up the semiconductor element horizontally before the semiconductor element is pushed up with the push-up needle.

[Means to solve the problem]

In the present invention, when picking up a semiconductor element during die bonding, the adhesive tape with the semiconductor element attached is vacuum-adsorbed onto a cylindrical stage, the semiconductor element is pushed up from below with a push-up needle, and the adhesive tape is peeled off. In this method, a push-up block that moves up and down independently of the push-up needle is provided between the push-up needle in the cylindrical stage, the push-up block pushes up the semiconductor device horizontally, and then the push-up needle is pushed up. This is a method of pushing up a semiconductor element by pushing up a semiconductor element with a lifting needle.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1(a) is a top view of a push-up unit used in a first embodiment of the present invention, and FIG. 1(b) is a sectional view thereof.

FIGS. 2(a) to 2(C) are cross-sectional views showing the thrusting operation of the first embodiment of the present invention.

The push-up block 2 is provided inside the cylindrical stage 1,
Moreover, it is set surrounding the push-up needle 3. The top surface is a horizontal surface. FIG. 2(a) shows the semiconductor device 6 attached to the adhesive tape 5 placed in the vacuum suction hole 8.
After adsorption with a vacuum source (not shown), the semiconductor element 6
This shows a state in which the nozzle 7 is lowered to adsorb the . Thereafter, as shown in FIG. 2(b), the push-up block 2 is pushed up by a drive source (not shown), and the semiconductor element 6 is pushed up horizontally together with the adhesive tape 5. By this pushing up, the semiconductor element peripheral portion 9 of the adhesive tape 5 to which the semiconductor element 6 was attached is torn off. Next, as shown in FIG. 2(C), the semiconductor element 6 is pushed up with the push-up needle 3 via the push-up needle holder 4, and the semiconductor element 6 is completely peeled off from the adhesive tape 5. FIGS. 3(a) to 3(c) show how the large semiconductor element 6a is pushed up in the first embodiment described above. As can be seen in this example, even if the size of the semiconductor element changes, the area of the adhesive tape 5 pushed up by the push-up block 2 is always constant, so the semiconductor element can be removed without changing the stroke of the push-up needle 3. The element 6a can be peeled off. Furthermore, as shown in FIG. 4(b), since the semiconductor element 6a is pushed up by a surface, there is no problem of the large semiconductor element tilting into contact, as shown in FIGS. 4(a) to 4(d). FIG. 2 is a sectional view showing the operation of the second embodiment of the present invention.

This embodiment shows the operation when a semiconductor element 6 is attracted by a collet 10. In FIG. 4(a), the semiconductor element 6 together with the adhesive tape 5 is attracted to the cylindrical stage 1. Next, as shown in FIG. 4(b), the push-up block 2 pushes up the semiconductor element 6 together with the adhesive tape 5.

Thereafter, the collet 1o descends to chuck the semiconductor element 6, as shown in FIG. 6(c). As shown in FIG. 2D, after the collet 10 chucks the semiconductor element 6, the push-up needle 3 pushes up the semiconductor element 6 and peels it off.

In this embodiment, the semiconductor element 6 to be picked up is
Since the collet 1o is pushed up higher than other adjacent semiconductor elements, there is an advantage that other semiconductor elements will not be damaged by the collet 1o.

[Effects of the Invention] As explained above, the push-up method of the present invention has the effect that since the push-up block pushes up the semiconductor device without tilting it, the semiconductor devices do not come into contact with each other and cause damage. There is. Furthermore, since the area of the adhesive tape that is pushed up by the push-up block is constant regardless of the size of the semiconductor element, there is also the advantage that there is no need to adjust the stroke of the needle.

The figure is a sectional view showing a conventional push-up unit in a push-up state using multiple needles.

1... Cylindrical stage, 2... Push-up block, 3
... Thrust-up needle, 4... Thrust-up needle holder, 5...
Adhesive tape, 6, 6a... Semiconductor element, 7... Nozzle, 8... Vacuum suction hole, 9... Semiconductor element periphery,
10... Collet, 11... Beret scratch.

Claims (1)

[Claims] When picking up a semiconductor element during die bonding, the adhesive tape to which the semiconductor element is attached is vacuum-adsorbed onto a cylindrical stage, and the semiconductor element is lifted up from below with a push-up needle to peel off the semiconductor element from the adhesive tape. In the push-up method, a push-up block that moves up and down independently of the push-up needle is provided between the push-up needle in the cylindrical stage, the push-up block pushes up the semiconductor element horizontally, and then the push-up needle A semiconductor device pushing-up method characterized by pushing up a semiconductor device.