JP4230178B2 - Semiconductor chip peeling apparatus and method - Google Patents

Semiconductor chip peeling apparatus and method Download PDF

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Publication number
JP4230178B2
JP4230178B2 JP2002194983A JP2002194983A JP4230178B2 JP 4230178 B2 JP4230178 B2 JP 4230178B2 JP 2002194983 A JP2002194983 A JP 2002194983A JP 2002194983 A JP2002194983 A JP 2002194983A JP 4230178 B2 JP4230178 B2 JP 4230178B2
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peeling
semiconductor chip
base sheet
peeling member
vacuum suction
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JP2004039865A (en
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健一 前田
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Fujitsu Semiconductor Ltd
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Fujitsu Semiconductor Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

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  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体製造装置に係わり、特に半導体装置の製造工程において、基台シート上に貼り付けられた個片化された半導体チップを基台シートから剥離するための半導体チップ剥離装置および剥離方法に関する。
【０００２】
【従来の技術】
半導体装置の製造工程において、ウエハ上に形成された複数の半導体チップは、ダイシングにより個々の半導体チップに分離される。すなわち、該ウエハは粘着材を付着した基台シートに貼り付けられた状態で個々の半導体チップに分離されて個片化される。したがって、この個片化された半導体チップを使用するためには個々の半導体チップを基台シートから剥離しなければならない。
【０００３】
図７は、従来の半導体チップ剥離装置および剥離方法を説明するための簡略断面図を示す。個片化された複数の半導体チップ１が貼り付けられている基台シート２は、Ｘ−Ｙテーブル４上に載置されウエハリング３によって固定されている。基台シート２の上方には、上下方向に移動可能であり半導体チップ１を真空吸着するコレット５が設置されており、基台シート２の下方には上下方向に移動可能な剥離台６が設置されている。図７（Ａ）において、Ｘ−Ｙテーブル４により剥離すべき半導体チップ１を剥離台６の真上になるよう移動したのち、コレット５を半導体チップ１に接する位置まで下降して、かつ剥離台６を剥離台６の頂面が基台シート２に接する位置まで上昇させる。つぎに、図７（Ｂ）において、剥離台６の内部に収容され上部に鋭利なピン７を有し、かつ上下動可能な突き上げ機構８を上昇させて基台シート２の下面をある一定量突き上げる。ピン７の先端は基台シート２を貫通して半導体チップ１に突き当たる。同時にコレット５によって半導体チップ１を吸着してコレット５を上昇させ半導体チップ１を基台シート２から剥離する。
【０００４】
【発明が解決しようとする課題】
このような従来の半導体チップ剥離装置では、先端が鋭利なピンを突き上げて半導体チップ１の裏面に当接させながら剥離するため、半導体チップ１の裏面に強い突き上げ力が加わり割れてしまうおそれがある。とくに最近では半導体パッケージの多様化が進み、ごく薄い厚さの半導体チップの要求も増しているので、割れやすい傾向は強まっている。また、半導体チップの剥離時に半導体チップが割れないまでも、半導体チップにピン７による突き上げ力によるストレスが残り、後工程でのワイヤボンディングや半導体パッケージのモールド形成時に受ける応力の影響で割れる可能性もある。また、信頼性評価時にも、半導体チップが割れたり、電気的特性劣化などに結びつき、品質や信頼性にも影響を与えるという問題があった。
【０００５】
【課題を解決するための手段】
上記課題を解決するため請求項１の発明では、基台シートに貼り付けられた半導体チップを基台シートから剥離する半導体チップ剥離装置において、中央に向かって次第に低くなるすり鉢形状の上面を有し、中央部に開口が設けられ、基台シートが該上面に載置される真空吸着台と、この開口内に配置され、垂直方向にそれぞれ独立に移動可能な複数の剥離部材から構成される剥離台と、該剥離台の上方に位置する半導体チップを該剥離台の反対側から吸着保持するコレットを有することを特徴とする。請求項２の発明では、剥離台は、半導体チップと同じかまたはそれ以下の面積の頂面を有することを特徴とする。請求項３の発明では、剥離台は、入れ子状で嵌通する複数の剥離部材から構成されていることを特徴とする。請求項４の発明では、基台シートに貼り付けられた半導体チップを基台シートから剥離する半導体チップ剥離方法において、中央に向かって次第に低くなるすり鉢形状の上面を有し、中央部に開口が設けられ、基台シートが該上面に載置される真空吸着台と、開口内に配置され、垂直方向にそれぞれ独立に移動可能な複数の剥離部材から構成されている剥離台を設け、該剥離台を所定位置に位置せしめた後、真空吸着台により基台シートを吸着しながら複数の剥離部材を所定の時間差を設けて順次下方へ降下せしめることを特徴とする。請求項５の発明では、降下した該剥離部材を所定時間後に再度上昇せしめることを特徴とする。
【０００６】
すなわち、本発明は、すり鉢状の上面を有する真空吸着台と、この真空吸着台の中央部の開口内に配置され、垂直方向にそれぞれ独立に移動可能な複数の剥離部材から構成される剥離台をもつ半導体チップ剥離装置を使用し、この真空吸着台により、半導体チップが貼り付けられた基台シートを吸着しながら複数の剥離部材を所定の時間差を設けて段階的に順次下方へ降下せしめている。従って、半導体チップを基台シートから少しずつ徐々に剥離することができ、半導体チップを基台シートから剥離する際の、半導体チップに加わる機械的ストレスを低減でき、半導体チップ割れを防止できると共に機械的ストレスが残ることによる半導体チップ自体の信頼性の低下を防止できる半導体チップ剥離装置および剥離方法を提供することが可能となる。
【０００７】
【発明の実施の形態】
以下、本発明の実施例による半導体チップ剥離装置について図１〜図３を用いて説明する。
図１は、本発明の実施例による半導体チップ剥離装置の概略斜視図、図２は、本発明の実施例による半導体チップ剥離装置の概略構成図、図３は、図１における要部（真空吸着台１０および剥離台１３）の斜視図を示す。基台シート２上の半導体チップ１は光学カメラ９よって撮像され、撮像回路１４を通して制御装置１５に送られる。この撮像された情報に基づき制御装置１５がＸ−Ｙテーブル駆動回路１７を介してＸ−Ｙテーブル４を制御する。そして剥離すべき半導体チップ１は真空吸着台１０の中央部に設けられた剥離台１３の真上に位置づけられる。真空吸着台１０の上面１２は中央に向かって次第に低くなるすり鉢状の形状をしており、この中央部に開口１１を有している。この開口１１内には、垂直方向にそれぞれ独立に移動可能で入れ子状の複数の剥離部材１３−１〜１３−３から構成される剥離台１３が設けられている。剥離台１３は図３に示すように、３個の剥離部材１３−１、１３−２、１３−３から構成され、剥離部材１３−３は四角な筒状で、内部に剥離部材１３−２が嵌通する。剥離部材１３−２も四角な筒状で、さらに内部に剥離部材１３−１が嵌通している。中心の剥離部材１３−１は四角柱形状をしており、３個の剥離部材１３−１は剥離部材駆動回路２１により、また剥離部材１３−２は剥離部材駆動回路２０により、さらに剥離部材１３−３は剥離部材駆動回路１９によりそれぞれ独立に垂直方向に移動可能となっている。この剥離台１３は、半導体チップと同じかまたはそれ以下の面積の頂面を有している。なお、この真空吸着台１０自体も真空吸着台駆動回路１８により上下動可能である。そして、上方にはコレット駆動回路１６により上下動および左右方向に移動可能で、かつ半導体チップ１を真空吸着保持するコレット５が設置されている。
【０００８】
次に、図４および図５により本発明の第１の実施例による半導体チップ剥離方法を説明する。
図４は本発明の第１の実施例による半導体チップ剥離方法を説明するための図。図５は図４における要部拡大斜視図および断面図を示す。
図４（Ａ）に示すように、Ｘ−Ｙテーブル４を移動させ、基台シート２上の剥離すべき半導体チップ１をコレット５の真下になるよう位置づける。つぎに、図４（Ｂ）に示すように、すり鉢状の上面を有する真空吸着台１０を少し上昇させるとともにコレット５を下降させて半導体チップ１を真空吸着する。この時の真空吸着台１０の剥離台１３の各剥離部材１３−１〜１３−３の頂面は図５（Ａ）に示す位置にある。つぎに図４（Ｃ）に示すように剥離台１３の一番外側の剥離部材１３−３を下降させ、真空吸着台１０で基台シート２を吸着すると、まづ半導体チップ１の一番外側の部分の基台シート２が剥離される。つぎに、図４（Ｄ）に示すように剥離部材１３−２を下降させ、真空吸着台１０で基台シート２を吸着すると、その内側の部分の基台シート２が半導体チップ１から剥離される。
【０００９】
この時の真空吸着台１０の剥離台１３の各剥離部材１３−１〜１３−３の頂面は図５（Ｂ）に示す位置にある。つぎに、図４（Ｅ）に示すように中心部の剥離部材１３−１を下降させ、真空吸着台１０で基台シート２を吸着すると、基台シート２が半導体チップ１から完全に剥離される。この時の真空吸着台１０の剥離台１３の各剥離部材１３−１〜１３−３の頂面は図５（Ｃ）に示す位置にある。
【００１０】
このように、本発明の第１の実施例では、真空吸着台１０により、半導体チップ１が貼り付けられた基台シート２を吸着しながら複数の剥離部材１３−３〜１３−１を所定の時間差を設けて段階的に順次下方へ降下せしめている。従って、半導体チップ１を基台シート２から少しずつ徐々に剥離することができ、半導体チップ１を基台シート２から剥離する際の、半導体チップ１に加わる機械的ストレスを低減でき、半導体チップ割れを防止できると共に機械的ストレスが残ることによる半導体チップ自体の信頼性の低下を防止できる。
【００１１】
つぎに、本発明の第２の実施例による半導体チップ剥離方法を説明する。
図６は本発明の第２の実施例による半導体チップ剥離方法を説明するための図である。最初に、真空吸着台１０の剥離台１３の各剥離部材１３−１〜１３−３の頂面は図６（Ａ）に示す位置にある。つぎに図６（Ｂ）に示すように剥離台１３の一番外側の剥離部材１３−３を下降させ、真空吸着台１０で基台シート２を吸着すると、まづ半導体チップ１の一番外側の部分の基台シート２が半導体チップから剥離される。つぎに、剥離部材１３−２を下降させ、真空吸着台１０で基台シート２を吸着すると、その内側の部分の基台シート２が半導体チップ１から剥離される。ここまでの工程は、実施例１の剥離方法と同じであるが、実施例２の剥離方法では、つぎに、図６（Ｃ）に示すように一旦下降した剥離部材１３−３を再度上昇させ半導体チップの周囲を保持せしめる。その後、図６（Ｄ）に示すように中心の剥離部材１３−１を下降させ基台シートと半導体チップを剥離する。ここで、剥離部材１３−３の部分に対応する基台シートは、一旦半導体チップから剥離されているので、すでに粘着力を失っており再度粘着することはない。この後、図６（Ｄ）示す剥離部材１３−３を下降させてもよい。
【００１２】
この実施例２の剥離方法によると、中心の剥離部材１３−１を下降させる前に、上昇した剥離部材１３−３により半導体チップの周囲を一旦保持しているので、剥離時における半導体チップにかかる機械的ストレスをさらに低減でき、とくに厚さの薄い半導体チップまたは面積の大きな半導体チップまたは面積が大きくかつ厚さの薄い半導体チップを基台シートから剥離する場合に有効な方法である。
【００１３】
なお、本発明の実施例では、四角形状の３個の剥離部材を組み合わせた剥離台を使用した半導体チップ剥離装置を説明したが、半導体チップの面積、形状に合わせて楕円形状、菱形、台形等の剥離部材を使用し、組み合わせる剥離部材の個数も２個、または３個以上であってもよい。
また、複数個の剥離部材の下降順序やそのタイミング、一旦下降させた剥離部材を再度上昇させる等の設定は、半導体チップの大きさ、厚さ、基台シートの材質、その他の条件に応じて適宜変更可能である。
【００１４】
【発明の効果】
以上説明したように、本発明によれば、半導体チップを基台シートから少しずつ徐々に剥離することができ、半導体チップを基台シートから剥離する際の、半導体チップに加わる機械的ストレスを低減でき、半導体チップ割れを防止できると共に機械的ストレスが残ることによる半導体チップ自体の信頼性の低下を防止できる半導体チップ剥離装置および剥離方法を提供することが可能となる。
【図面の簡単な説明】
【図１】 本発明の実施例による半導体チップ剥離装置の概略斜視図。
【図２】 本発明の実施例による半導体チップ剥離装置の概略構成図。
【図３】 図１における要部拡大斜視図。
【図４】 本発明の第１の実施例による半導体チップ剥離方法を説明するための図。
【図５】 図４における要部拡大斜視図および断面図。
【図６】 本発明の第２の実施例による半導体チップ剥離方法を説明するための図。
【図７】 従来の半導体チップ剥離装置および剥離方法を説明するための図。
【符号の説明】
１ 半導体チップ １９〜２１ 剥離部材駆動回路
２ 基台シート
３ ウェハリング
４ Ｘ−Ｙテーブル
５ コレット
６ 剥離台
７ ピン
８ 突き上げ機構
９ 光学カメラ
１０ 真空吸着台
１１ 開口
１２ 真空吸着台の上面
１３ 剥離台
１４ 撮像回路
１５ 制御装置
１６ コレット駆動回路
１７ Ｘ−Ｙテーブル駆動回路
１８ 真空吸着台駆動回路[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor manufacturing apparatus, and in particular, in a semiconductor device manufacturing process, a semiconductor chip peeling apparatus and a peeling method for peeling an individual semiconductor chip attached on a base sheet from the base sheet. About.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device, a plurality of semiconductor chips formed on a wafer are separated into individual semiconductor chips by dicing. That is, the wafer is separated into individual semiconductor chips and separated into individual pieces in a state where the wafer is attached to a base sheet to which an adhesive material is attached. Therefore, in order to use the separated semiconductor chip, each semiconductor chip must be peeled off from the base sheet.
[0003]
FIG. 7 is a simplified cross-sectional view for explaining a conventional semiconductor chip peeling apparatus and peeling method. A base sheet 2 to which a plurality of separated semiconductor chips 1 are attached is placed on an XY table 4 and fixed by a wafer ring 3. A collet 5 that can move in the vertical direction and vacuum-sucks the semiconductor chip 1 is installed above the base sheet 2, and a peeling table 6 that can move in the vertical direction is installed below the base sheet 2. Has been. In FIG. 7A, the semiconductor chip 1 to be peeled by the XY table 4 is moved so as to be directly above the peeling table 6, and then the collet 5 is lowered to a position in contact with the semiconductor chip 1. 6 is raised to a position where the top surface of the peeling table 6 contacts the base sheet 2. Next, in FIG. 7 (B), the push-up mechanism 8 which has a sharp pin 7 in the upper part and is movable in the upper part and is moved up and down is lifted so that the lower surface of the base sheet 2 is fixed by a certain amount. Push up. The tip of the pin 7 penetrates the base sheet 2 and hits the semiconductor chip 1. At the same time, the semiconductor chip 1 is adsorbed by the collet 5 to raise the collet 5 and peel the semiconductor chip 1 from the base sheet 2.
[0004]
[Problems to be solved by the invention]
In such a conventional semiconductor chip peeling apparatus, a pin with a sharp tip is pushed up and peeled while being brought into contact with the back surface of the semiconductor chip 1, so that a strong push-up force is applied to the back surface of the semiconductor chip 1 and it may be cracked. . In particular, recently, the diversification of semiconductor packages has progressed, and the demand for extremely thin semiconductor chips has increased, so the tendency to break easily has increased. Further, even when the semiconductor chip is not broken when the semiconductor chip is peeled off, the stress due to the push-up force by the pins 7 remains on the semiconductor chip, and it may be cracked by the influence of the stress applied during wire bonding or semiconductor package molding in the subsequent process. is there. In addition, there was a problem that the reliability and the reliability of the semiconductor chip were broken and the electrical characteristics were deteriorated, thereby affecting the quality and reliability.
[0005]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, in the invention of claim 1, in a semiconductor chip peeling apparatus for peeling a semiconductor chip attached to a base sheet from the base sheet, it has a mortar-shaped upper surface that gradually decreases toward the center. , A vacuum suction table in which an opening is provided in the central portion and a base sheet is placed on the upper surface, and a peeling unit that is disposed in the opening and that is independently movable in the vertical direction. And a collet for adsorbing and holding a semiconductor chip located above the peeling table from the opposite side of the peeling table. The invention according to claim 2 is characterized in that the peeling table has a top surface having an area equal to or smaller than that of the semiconductor chip. The invention according to claim 3 is characterized in that the peeling table is composed of a plurality of peeling members which are inserted in a nested manner. According to a fourth aspect of the present invention, in the semiconductor chip peeling method for peeling the semiconductor chip attached to the base sheet from the base sheet, it has a mortar-shaped upper surface that gradually decreases toward the center, and an opening is formed in the center part. A peeling table comprising a vacuum suction table on which the base sheet is placed on the upper surface and a plurality of peeling members arranged in the opening and independently movable in the vertical direction; After the base is positioned at a predetermined position, the plurality of peeling members are sequentially lowered downward with a predetermined time difference while adsorbing the base sheet by the vacuum suction base. The invention according to claim 5 is characterized in that the lowered peeling member is raised again after a predetermined time.
[0006]
That is, the present invention relates to a vacuum suction table having a mortar-shaped upper surface, and a peeling table that is arranged in an opening at the center of the vacuum suction table and is configured to be independently movable in the vertical direction. Using this vacuum suction table, a plurality of peeling members are lowered step by step with a predetermined time difference while adsorbing the base sheet to which the semiconductor chip is attached. Yes. Therefore, the semiconductor chip can be gradually peeled from the base sheet little by little, the mechanical stress applied to the semiconductor chip when the semiconductor chip is peeled from the base sheet can be reduced, and the semiconductor chip can be prevented from cracking and the machine. It is possible to provide a semiconductor chip peeling apparatus and a peeling method capable of preventing the reliability of the semiconductor chip itself from being lowered due to the residual stress.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a semiconductor chip peeling apparatus according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a schematic perspective view of a semiconductor chip peeling apparatus according to an embodiment of the present invention, FIG. 2 is a schematic configuration diagram of a semiconductor chip peeling apparatus according to an embodiment of the present invention, and FIG. The perspective view of the stand 10 and the peeling stand 13) is shown. The semiconductor chip 1 on the base sheet 2 is imaged by the optical camera 9 and sent to the control device 15 through the imaging circuit 14. Based on the imaged information, the control device 15 controls the XY table 4 via the XY table driving circuit 17. The semiconductor chip 1 to be peeled is positioned directly above the peeling stand 13 provided at the center of the vacuum suction stand 10. The upper surface 12 of the vacuum suction table 10 has a mortar shape that gradually decreases toward the center, and has an opening 11 at the center. In the opening 11, there is provided a peeling table 13 composed of a plurality of nested peeling members 13-1 to 13-3 that can move independently in the vertical direction. As shown in FIG. 3, the peeling table 13 includes three peeling members 13-1, 13-2, and 13-3, and the peeling member 13-3 has a rectangular cylindrical shape and has a peeling member 13-2 inside. Is inserted. The peeling member 13-2 is also a square cylinder, and the peeling member 13-1 is further fitted inside. The central peeling member 13-1 has a quadrangular prism shape, the three peeling members 13-1 are provided by the peeling member drive circuit 21, the peeling member 13-2 is provided by the peeling member drive circuit 20, and the peeling member 13 is further removed. -3 can be moved independently in the vertical direction by the peeling member drive circuit 19. The peeling table 13 has a top surface having an area equal to or smaller than that of the semiconductor chip. The vacuum suction table 10 itself can also be moved up and down by a vacuum suction table drive circuit 18. A collet 5 that can be moved up and down and moved in the left-right direction by the collet drive circuit 16 and that holds the semiconductor chip 1 by vacuum suction is installed above.
[0008]
Next, the semiconductor chip peeling method according to the first embodiment of the present invention will be described with reference to FIGS.
FIG. 4 is a view for explaining a semiconductor chip peeling method according to the first embodiment of the present invention. FIG. 5 shows an enlarged perspective view and a sectional view of the main part in FIG.
As shown in FIG. 4A, the XY table 4 is moved, and the semiconductor chip 1 to be peeled on the base sheet 2 is positioned directly below the collet 5. Next, as shown in FIG. 4B, the vacuum suction table 10 having a mortar-shaped upper surface is slightly raised and the collet 5 is lowered to vacuum-suck the semiconductor chip 1. At this time, the top surfaces of the peeling members 13-1 to 13-3 of the peeling table 13 of the vacuum suction table 10 are located at the positions shown in FIG. Next, as shown in FIG. 4C, when the outermost peeling member 13-3 of the peeling table 13 is lowered and the base sheet 2 is sucked by the vacuum suction table 10, first, the outermost side of the semiconductor chip 1. The base sheet 2 is peeled off. Next, as shown in FIG. 4D, when the peeling member 13-2 is lowered and the base sheet 2 is sucked by the vacuum suction table 10, the base sheet 2 in the inner part is peeled from the semiconductor chip 1. The
[0009]
At this time, the top surfaces of the peeling members 13-1 to 13-3 of the peeling table 13 of the vacuum suction table 10 are located at the positions shown in FIG. Next, as shown in FIG. 4E, when the peeling member 13-1 at the center is lowered and the base sheet 2 is sucked by the vacuum suction table 10, the base sheet 2 is completely peeled from the semiconductor chip 1. The At this time, the top surfaces of the peeling members 13-1 to 13-3 of the peeling table 13 of the vacuum suction table 10 are located at the positions shown in FIG.
[0010]
As described above, in the first embodiment of the present invention, the plurality of peeling members 13-3 to 13-1 are set in a predetermined manner while adsorbing the base sheet 2 to which the semiconductor chip 1 is attached by the vacuum suction table 10. The time is gradually lowered downward with a time difference. Therefore, the semiconductor chip 1 can be gradually peeled off from the base sheet 2 and the mechanical stress applied to the semiconductor chip 1 when the semiconductor chip 1 is peeled off from the base sheet 2 can be reduced. In addition, the reliability of the semiconductor chip itself due to the remaining mechanical stress can be prevented.
[0011]
Next, a semiconductor chip peeling method according to the second embodiment of the present invention will be described.
FIG. 6 is a view for explaining a semiconductor chip peeling method according to the second embodiment of the present invention. First, the top surfaces of the peeling members 13-1 to 13-3 of the peeling table 13 of the vacuum suction table 10 are at the positions shown in FIG. Next, as shown in FIG. 6B, when the outermost peeling member 13-3 of the peeling table 13 is lowered and the base sheet 2 is sucked by the vacuum suction table 10, first, the outermost side of the semiconductor chip 1. The base sheet 2 of the part is peeled from the semiconductor chip. Next, when the peeling member 13-2 is lowered and the base sheet 2 is sucked by the vacuum suction table 10, the base sheet 2 in the inner part is peeled from the semiconductor chip 1. The steps so far are the same as the peeling method of Example 1, but in the peeling method of Example 2, the peeling member 13-3 once lowered is then raised again as shown in FIG. 6C. Hold the periphery of the semiconductor chip. Thereafter, as shown in FIG. 6D, the central peeling member 13-1 is lowered to peel the base sheet and the semiconductor chip. Here, since the base sheet corresponding to the part of the peeling member 13-3 is once peeled from the semiconductor chip, it has already lost the adhesive force and does not stick again. Thereafter, the peeling member 13-3 shown in FIG. 6 (D) may be lowered.
[0012]
According to the peeling method of the second embodiment, since the periphery of the semiconductor chip is once held by the raised peeling member 13-3 before the central peeling member 13-1 is lowered, it is applied to the semiconductor chip at the time of peeling. Mechanical stress can be further reduced, and this method is particularly effective when a semiconductor chip having a small thickness, a semiconductor chip having a large area, or a semiconductor chip having a large area and a small thickness is peeled from the base sheet.
[0013]
In the embodiment of the present invention, a semiconductor chip peeling apparatus using a peeling table in which three rectangular peeling members are combined has been described. However, an elliptical shape, a rhombus, a trapezoid, etc. according to the area and shape of the semiconductor chip. These peeling members are used, and the number of peeling members to be combined may be two, or three or more.
In addition, the descending order and timing of a plurality of peeling members, the setting of raising the peeling member once lowered, etc. are again set according to the size, thickness, material of the base sheet, and other conditions. It can be changed as appropriate.
[0014]
【The invention's effect】
As described above, according to the present invention, the semiconductor chip can be gradually peeled off from the base sheet, and the mechanical stress applied to the semiconductor chip when the semiconductor chip is peeled off from the base sheet is reduced. In addition, it is possible to provide a semiconductor chip peeling apparatus and a peeling method capable of preventing the semiconductor chip from being broken and preventing the deterioration of the reliability of the semiconductor chip itself due to the remaining mechanical stress.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a semiconductor chip peeling apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic configuration diagram of a semiconductor chip peeling apparatus according to an embodiment of the present invention.
FIG. 3 is an enlarged perspective view of a main part in FIG.
FIG. 4 is a view for explaining a semiconductor chip peeling method according to the first embodiment of the present invention.
5 is an enlarged perspective view and a cross-sectional view of a main part in FIG.
FIG. 6 is a view for explaining a semiconductor chip peeling method according to a second embodiment of the present invention.
FIG. 7 is a view for explaining a conventional semiconductor chip peeling apparatus and peeling method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Semiconductor chip 19-21 Peeling member drive circuit 2 Base sheet 3 Wafer ring 4 XY table 5 Collet 6 Peeling board 7 Pin 8 Pushing mechanism 9 Optical camera 10 Vacuum suction stand 11 Opening 12 Upper surface 13 of a vacuum suction stand Peeling stand 14 Imaging circuit 15 Control device 16 Collet drive circuit 17 XY table drive circuit 18 Vacuum suction table drive circuit

Claims (3)

基台シートに貼り付けられた半導体チップを該基台シートから剥離する半導体チップ剥離装置において、
中央に向かって次第に低くなるすり鉢形状の上面を有し、中央部に開口が設けられ、前記基台シートが該上面に載置される真空吸着台と、
該開口内に配置され、垂直方向にそれぞれ独立に移動可能な入れ子状で貫通する複数の剥離部材から構成される剥離台と、
各該剥離部材の頂面を該上面から所定の高さに保持したのち、外側の該剥離部材から順次下方へ降下せしめる該剥離部材の垂直方向への移動手段と、
該剥離台の上方に位置する半導体チップを該剥離台の反対側から吸着保持するコレットとを有し、
該移動手段は、最外側の該剥離部材を降下した後、最内側の該剥離部材を降下する前に、該最外側の該剥離部材を再び該所定の高さに上昇することを特徴とする半導体チップ剥離装置。The pasted semiconductor chip to the base sheet at the semiconductor chip peeling apparatus for peeling from the base sheet,
A vacuum suction table having a mortar-shaped upper surface that gradually decreases toward the center, an opening is provided in the center, and the base sheet is placed on the upper surface ;
A peeling table composed of a plurality of peeling members arranged in the opening and penetrating in a nested manner that can move independently in the vertical direction ;
A means for moving the peeling member in the vertical direction, which holds the top surface of each peeling member at a predetermined height from the upper surface and then descends sequentially from the outside peeling member;
A semiconductor chip which is located above the stripping stage have a collet for attracting and holding the opposite side of the release base,
The moving means raises the outermost peeling member again to the predetermined height after lowering the outermost peeling member and before lowering the innermost peeling member. Semiconductor chip peeling device. 前記剥離台は、半導体チップと同じかまたはそれ以下の面積の頂面を有することを特徴とする請求項１記載の半導体チップ剥離装置。  The semiconductor chip peeling apparatus according to claim 1, wherein the peeling table has a top surface having an area equal to or smaller than that of the semiconductor chip. 基台シートに貼り付けられた半導体チップを基台シートから剥離する半導体チップ剥離方法において、In the semiconductor chip peeling method for peeling the semiconductor chip attached to the base sheet from the base sheet,
中央に向かって次第に低くなるすり鉢形状の上面を有し、中央部に開口が設けられ、前記基台シートが該上面に載置される真空吸着台と、該開口内に配置され、垂直方向にそれぞれ独立に移動可能な入れ子状で貫通する複数の剥離部材から構成されている剥離台を設け、It has a mortar-shaped upper surface that gradually becomes lower toward the center, an opening is provided in the center, and the base sheet is placed on the upper surface, and is arranged in the opening, in the vertical direction Each is provided with a peeling table composed of a plurality of peeling members penetrating in a nested manner that can be moved independently,
該剥離台を該上面から所定の高さに位置せしめた後、該真空吸着台により基台シートを吸着しながら該複数の剥離部材を所定の時間差を設けて外側の該剥離部材から順次下方へ降下せしめる工程と、After the peeling table is positioned at a predetermined height from the upper surface, the plurality of peeling members are provided in a predetermined time difference while the base sheet is adsorbed by the vacuum suction table and sequentially downward from the outer peeling member. The step of lowering,
外側の該剥離部材から順次下方へ降下せしめる工程の際、最外側の該剥離部材を降下した後、最内側の該剥離部材を降下する前に、該最外側の該剥離部材を再び該所定の高さに上昇することを特徴とする半導体チップ剥離方法。In the step of sequentially lowering the outer peeling member downward, the outermost peeling member is lowered again after the outermost peeling member is lowered and before the innermost peeling member is lowered. A semiconductor chip peeling method characterized by rising to a height.
JP2002194983A 2002-07-03 2002-07-03 Semiconductor chip peeling apparatus and method Expired - Fee Related JP4230178B2 (en)

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