JP2002124525A - Semiconductor chip separating device and method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for separating semiconductor chips by which the semiconductor chips can be reliably separated without using a sharp-pointed push-up pin. SOLUTION: A vacuum holder 22 has a top surface 22b gradually sloping down toward its center and an opening 22a formed in its center. Tape 18 on which semiconductor chips 20 are stuck is placed on the top surface 22b. A separating table 24 with a top surface having an area smaller than that of a semiconductor chip 20 is placed in the opening 22a of the vacuum holder 22 in such away that it can be vertically moved. A collet 14 for suction holding the semiconductor chips 20 is provided above the separating table 24. The position of the semiconductor chip 20 which is stuck on the tape 18 placed on the vacuum holder 22 is recognized by an optical camera.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and, more particularly, to a semiconductor chip peeling apparatus and method for peeling individualized semiconductor chips stuck on a tape from a tape in a semiconductor manufacturing process.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, a plurality of semiconductor chips formed on a wafer are separated into individual semiconductor chips by dicing or the like. That is, in the dicing step, the wafer is separated into individual semiconductor chips and singulated while being attached to a tape (dicing tape) provided with an adhesive. Therefore, in order to use the semiconductor chips thus singulated, the individual semiconductor chips must be separated from the tape.

In order to peel a semiconductor chip attached to a tape, the semiconductor chip to be peeled is vacuum-adsorbed by a collet while the semiconductor chip is pushed up from below the tape with a needle to peel the semiconductor chip from the tape. The method is commonly used. Then, the semiconductor chip separated from the tape is conveyed to a desired position while being held by suction at the collet.

In the above-described peeling method, a semiconductor chip attached to the surface of the tape is pushed up from the back side of the tape by a push-up pin. That is, by pressing the needle-shaped protrusion pin having a sharp tip against the semiconductor chip via the tape, the tip of the protrusion pin penetrates the tape and hits the semiconductor chip. Then, the push-up pins are further pressed against the semiconductor chip, thereby lifting the semiconductor chip from the tape and peeling the semiconductor chip from the tape.

[0005]

Since the push-up pins used in the above-described peeling method need to penetrate the tape and hit the semiconductor chip, the tips have a sharp shape of about several tens of μm. . Therefore, a small scratch is made on the surface of the semiconductor chip due to the contact of the tip of the push-up pin. Generally, the back surface (the surface opposite to the circuit forming surface) of a semiconductor chip attached to a tape is attached to the tape. Therefore, even if the back surface of the semiconductor chip is damaged to some extent due to the contact of the push-up pins, the circuit forming surface is not affected.

However, in recent years, semiconductor chips have become thinner, and there is a possibility that even a scratch that has no effect on a conventional semiconductor chip may lead to significant damage to the semiconductor chip. That is, when a thin semiconductor chip is pushed up by a sharp protrusion pin, the semiconductor chip may be broken. Further, the semiconductor chip damaged by the push-up pins has a problem that when it is deformed by an external force, the scratch becomes a starting point and easily breaks or cracks occur. Another problem is that even when an external force is applied to the semiconductor device after the semiconductor device is formed by sealing the semiconductor chip, cracks are similarly generated in the internal semiconductor chip.

Further, since the tip of the push-up pin is sharp, the tip may be broken during pushing up. If the tip of the push-up pin is broken, there is a possibility that a problem that the semiconductor chip cannot be completely peeled off or an adjacent semiconductor chip scatters may occur.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a semiconductor chip peeling apparatus and method capable of reliably peeling a semiconductor chip without using a sharp protrusion pin. I do.

[0009]

Means for Solving the Problems In order to solve the above problems, the present invention is characterized by taking the following means.

[0010] The invention according to claim 1 is a semiconductor chip peeling apparatus for peeling a semiconductor chip attached to a tape from the tape, wherein the upper surface is provided with a slope that becomes gradually lower toward the center. A vacuum holder having an opening formed in the center of the upper surface, and a tape to which a semiconductor chip is attached is placed on the upper surface, and the vacuum holder is disposed in the opening of the vacuum holder, and is movable in a vertical direction. A peeling table having a top surface having an area smaller than the semiconductor chip, a collet for sucking and holding the semiconductor chip located on the peeling table from the opposite side of the peeling table, and being disposed on the vacuum holder. And a position detecting means for detecting a position of the semiconductor chip attached to the tape.

According to a second aspect of the present invention, there is provided the semiconductor chip separating apparatus according to the first aspect, wherein at least one of a top dead center position and a bottom dead center position of the separation table is variable. Things.

According to a third aspect of the present invention, there is provided the semiconductor chip separating apparatus according to the first aspect, wherein a moving speed of the separating table is variable.

According to a fourth aspect of the present invention, there is provided a semiconductor chip separating method for separating a semiconductor chip from a tape, wherein the upper surface is provided with an inclination so as to gradually decrease toward the center, and the center of the upper surface is provided at the center. Having an opening formed,
A semiconductor chip to be peeled, wherein the tape to which the semiconductor chip is attached is arranged on the upper surface of a vacuum holder in which a peeling table having a top surface having an area smaller than the semiconductor chip is vertically movable within the opening. The tape is moved by moving the tape so that the tape is disposed on the peeling table, and suctioning the tape by the vacuum holder in a state where the semiconductor chip is disposed on the peeling table via the tape. According to each step of peeling the peripheral portion of the semiconductor chip from the tape, holding the semiconductor chip at a position supported by the peeling table, lowering the peeling table to completely peel the semiconductor chip from the tape It is characterized by having. Each of the means described above operates as follows.

According to the first and fourth aspects of the present invention, the semiconductor chip is held at a predetermined position by the peeling table and the collet, and the tape is pulled on the upper surface of the vacuum holder separated from the semiconductor chip by inclination. As a result, the semiconductor chip peels off from the tape. Therefore,
The semiconductor chip can be easily peeled off without using a sharp protrusion pin.

According to the second aspect of the present invention, the position of the top dead center and / or the position of the bottom dead center of the peeling table are made variable, so that the size of the semiconductor chip, the material of the tape or the peel strength of the adhesive material, etc. Even if the value changes, optimal peeling can be realized.

According to the third aspect of the present invention, by making the moving speed of the peeling table variable, it is possible to realize an optimum peeling speed corresponding to various peeling conditions.

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing the overall configuration of a semiconductor chip peeling apparatus according to one embodiment of the present invention. FIG. 2 shows FIG.
FIG. 2 is a simplified cross-sectional view showing a main part of the semiconductor chip peeling device shown in FIG.

A semiconductor chip peeling apparatus 10 according to one embodiment of the present invention comprises a peeling mechanism 12, a collet 14, and an optical camera 16, as shown in FIG. The semiconductor chip to be peeled is disposed between the peeling mechanism 12 and the collet 14 while being kept attached to a tape such as a UV (ultraviolet curing type) tape. The optical camera 16 is disposed above the collet 14 and detects the position of the semiconductor chip by recognizing an image of the semiconductor chip. The optical camera 16 functions as means for detecting the position of the semiconductor chip. In FIG. 1, a substantially square semiconductor chip is shown with diagonal lines in the center of the peeling mechanism 12, but is actually placed on the peeling mechanism 12 in a state of being attached to a tape as shown in FIG. You. In general, the back surface of the semiconductor chip will be peeled off from the UV tape, but a double-sided adhesive tape may be provided on the back surface of the semiconductor chip. In this case,
The double-sided adhesive tape is peeled off from the UV tape.

As shown in FIG. 2, the semiconductor chip 20 attached to the tape 18 is disposed on the peeling mechanism 12, and can be moved in a horizontal direction (XY directions) by an XY table or the like. The peeling mechanism 12 has a vacuum holder 22 and a peeling table 24. The vacuum holder 22 has an opening 2 at the center.
2a, and is provided in a state where the peeling table 24 is inserted into the opening 22a.

The peeling table 24 has a substantially square top surface and a cross section corresponding to the shape of the semiconductor chip 20. The opening 22a of the vacuum holder 22 has a substantially square shape larger than the cross-sectional shape of the separation table 24, and a predetermined space is formed between the opening 22a and the separation table 24. The peeling table 24 is moved vertically (Z direction) in the opening 22a by a moving mechanism (not shown).
Can be moved to

The vacuum holder 22 is connected to a vacuum source (not shown) such as a vacuum pump, and is configured to suck the tape 18 placed on the upper surface 22b of the vacuum holder 22. At the time of vacuum suction, vacuum evacuation is performed through the space between the peeling table 24 and the opening 22a.
The entire surface may be evacuated.

The upper surface 22b of the vacuum holder 22 is provided with a slope (taper) so as to gradually decrease toward the center. The inclination angle is several degrees with respect to the horizontal direction (XY plane), and is set to an angle at which the tape 18 can be deformed along the upper surface 22b when the tape 18 is sucked by the vacuum holder 22. . Specifically, considering the elasticity and peelability of the tape 18, the angle of the upper surface 22 b of the vacuum holder 22 (indicated by α in FIG. 2) is 170 to 17.
Preferably, it is 9 degrees. Although a large number of concentric circles are drawn on the upper surface 22b of the vacuum holder 22 in FIG. 1, this represents a fine concave portion on the upper surface 22b. That is, there is a very small dent between adjacent concentric circles. By keeping such a configuration, the tape 1
8 can be efficiently suction-held.

The collet 14 is connected to a vacuum source (not shown) such as a vacuum pump, and is provided for holding the semiconductor chip 20 by suction and holding it, and transporting the semiconductor chip 20 to a predetermined position. That is, the collet 14 is in the vertical direction (Z direction).
When the semiconductor chip 20 is to be peeled off, the semiconductor chip 20 is disposed at the center of the vacuum holder 22, that is, just above the peeling table 24. Then, the collet 14 suction-holds and lifts the semiconductor chip 20 located right above the peeling table 24.

An optical camera 16 is provided above the collet 14 as shown in FIG. 1, and the position of the semiconductor chip 20 is detected by recognizing the image of the semiconductor chip 20. The detection result is supplied to an XY table mechanism (not shown) for moving the tape 18 in the horizontal direction. Therefore, the tape 18 can be moved so that the semiconductor chip 20 to be peeled is located right above the peeling table 24.

Next, the operation of the semiconductor chip peeling apparatus 10 will be described with reference to FIG.

First, as shown in FIG.
The semiconductor chip 20 singulated on the surface 8 is placed on the vacuum holder 22 of the peeling mechanism 12. On this occasion,
The position of the semiconductor chip 20 to be separated is determined while the position of the semiconductor chip 20 is detected by the optical camera 16. Specifically, the semiconductor chip 20 to be peeled is arranged at the center of the vacuum holder 22, and the semiconductor chip 2 to be peeled is
The tape 18 is moved so that the peeling table 24 is located just below the zero. At this time, the peeling table 24 is located at substantially the same height as the outer periphery of the vacuum holder 22 (the position of the peeling table 24 is defined as a top dead center). Therefore, the tip of the peeling table 24 slightly projects from the opening 22a formed in the center of the vacuum holder 22, and supports the tape 18 from below.

When the positioning of the semiconductor chip to be peeled is completed, the suction action of the vacuum holder 22 is activated as shown in FIG.
8 to suck the air in the space formed. Tape 1
Since 8 itself has a certain degree of elasticity, it is drawn toward the upper surface 22 a of the vacuum holder 22.

However, since the peeling table 22 protrudes from the center of the vacuum holder 22, only the center of the tape 18 floats above the upper surface 22a of the vacuum holder 22. In such a state, the semiconductor chip 20 to be peeled is supported by the peeling table 24 via the tape 18, and the tape 18 other than the portion sandwiched between the peeling table 24 and the semiconductor chip 20 is It is drawn toward the upper surface 22a.

As described above, the top surface, that is, the cross-sectional shape of the peeling table 24 is set smaller than the surface of the semiconductor chip 20. Therefore, the portion of the tape 18 that is not sandwiched between the peeling table 24 and the semiconductor chip 20 is
Peel from 0. That is, peeling of the tape 18 from the periphery of the semiconductor chip 20 is started.

Next, as shown in FIG. 3C, the collet 14 is brought into contact with the semiconductor chip 20 to be peeled, and the semiconductor chip 20 is attracted and held on the collet 14 by a suction force. In this state, the semiconductor chip 20 remains disposed on the peeling table 24 via the tape 18.

Next, as shown in FIG.
Move 4 down. As a result, the tape 18 located below the semiconductor chip 20 is no longer supported by the peeling table 24 and is drawn toward the opening 22 a of the vacuum holder 22. The position of the peeling table 24 shown in FIG. At this time, since the semiconductor chip 20 is adsorbed and held by the collet 14, the collet 1 is left as it is.
4, and only the tape 18 is separated from the semiconductor chip 20 and moves downward. Therefore, the semiconductor chip 20 is completely separated from the tape 18 by moving the peeling table 24 downward.

In the state shown in FIG. 3C, since the peeling has started from the periphery of the semiconductor chip 20, the peeling proceeds from the peeled portion as a starting point, and the entire semiconductor chip 20 is reliably peeled. be able to.

When the semiconductor chip 20 is completely separated from the tape 18, as shown in FIG. 3E, the collet 14 rises while holding the semiconductor chip 20 by suction, and moves in the horizontal direction to remove the semiconductor chip 20. Move to desired position. At this time, the vacuum suction force acting on the vacuum holder 22 is released, and the peeling table 24 that has moved to the bottom dead center rises to the top dead center shown in FIG. Prepare for peeling. In order to quickly release the vacuum suction force of the vacuum holder 22, a vacuum breaking valve may be provided in a vacuum evacuation line, or air may be forcibly supplied to the vacuum holder 22.

Thereafter, as shown in FIG. 3F, based on the image recognition result of the optical camera 16, the XY table is driven to move the tape 18, and the semiconductor chip 20 to be peeled next is Arrange so that it is directly above. At this time, it is preferable that a defective semiconductor chip 20 is detected by an optical camera, and the defective semiconductor chip 20 is transferred to the next semiconductor chip without being separated. Usually, the final test is performed with the semiconductor chip attached to the tape. However, the semiconductor chip that has failed in the final test is marked with black ink or the like. Therefore, if the mark representing the defective product is image-recognized by the optical camera 16, the semiconductor chip determined to be defective can be detected.

In the above-described operation, the peeling table 24 is lowered after the semiconductor chip 20 is sucked and held by the collet 14. However, the semiconductor chip 20 is sucked and held by the collet 14 after the peeling table 24 is lowered. It may be. That is, the process shown in FIG. 3B is replaced with the process shown in FIG. As described above, when the peeling table 24 is first lowered, the semiconductor chip 20 abuts on the upper surface of the vacuum holder 22 via the tape 18.
Since the tape 18 is further drawn into the opening 22a, the semiconductor chip 20 is completely separated from the tape 18. Then, when the semiconductor chip 20 is completely peeled off, the collet 14 is brought into contact with the semiconductor chip 20 and is sucked and held by the collet 14.

However, in the case where the semiconductor chip 20 is easily peeled off, the semiconductor chip 20 is moved by the collet 14 before the suction by the vacuum holder 22 is started in a state where the peeling table 24 is located at the top dead center. It is preferable to hold by suction. As a result, the semiconductor chip 20 is sucked and held by the collet 14 while being attached to the tape 18. Therefore, even when the semiconductor chip 20 is peeled off only by suction by the vacuum holder 22, it is possible to prevent the position of the semiconductor device 20 from shifting.

In the above-described peeling table 24, the planar shape of the top surface that comes into contact with the tape 18 is substantially square, corresponding to the shape of the semiconductor chip 20. However, the semiconductor chip 2
When 0 is a rectangle, the top surface of the peeling table 24 may be substantially rectangular in accordance with this. Further, the shape is not limited to a square and a rectangle, and may be a polygon such as a quadrangle or a circle. In the case of a polygon, it is preferable that the corners be rounded to some extent so that the tape 18 does not hit the sharp corners.

Further, it is preferable to eliminate burrs by chamfering the corner between the top surface and the side surface of the peeling table 24. That is, it is preferable that the portion in contact with the tape 18 be formed so as not to have a sharp portion as much as possible so as not to damage the tape.

The size (area) of the top surface of the peeling table 24
Is determined by the size (area) of the semiconductor chip to be separated. If the size of the top surface of the separation table 24 is too small than the size of the semiconductor chip to be separated, the semiconductor chip may be separated before the separation table 24 is lowered. On the other hand, if the size is too large, the peeled portion by suction from the vacuum holder 22 before the peeling table 24 descends is too small, and there is a possibility that the peeling table 24 will not be completely peeled even if the peeling table 24 descends. Specifically, the size (area) of the top surface of the peeling table 24 is equal to the size (area) of the semiconductor chip to be peeled.
/ 3 to 2/3.

The position of the top dead center of the peeling table 24 is the same as the height of the outer peripheral portion of the vacuum holder 22 in the above example. However, when the peeling property is poor, the peeling can be more easily performed by setting the position of the top dead center of the peeling table 24 higher than the height of the outer peripheral portion of the vacuum holder 22. Conversely, when the semiconductor chip is easily peeled, the position of the top dead center of the peeling table 24 is set lower than the height of the outer peripheral portion of the vacuum holder 22 so that the peeling table can be completely peeled off when the peeling table is lowered. Can be adjusted.

When a semiconductor chip is detected by binarization detection for recognizing a semiconductor chip by converting it into a binary image,
The recognition rate can be increased by setting the position of the top dead center of the separation table 24 higher than the height of the outer peripheral portion of the vacuum holder 22. That is, in the binarization detection, the semiconductor chip 20 is recognized as white by detecting the reflected light from the semiconductor chip.
Here, by making the semiconductor chip 20 placed on the peeling table 24 slightly higher than the surroundings, the surrounding semiconductor chips 2
The 0 can be slightly outwardly inclined. As a result, the amount of light reflected from the surrounding semiconductor chip 20 reaching the optical camera 16 is reduced, and
Only the upper semiconductor chip 20 can be emphasized. Therefore, the recognition rate of the semiconductor chip 20 to be separated can be improved.

As described above, in order to cope with various conditions, the position of the top dead center of the separation table 24 is preferably variable.

It is preferable that the position of the bottom dead center of the peeling table 24 is also variable. That is, by setting the position of the bottom dead center of the peeling table 24 to a position where the semiconductor chip 20 is completely peeled off from the tape 18, unnecessary lowering of the peeling table 24 can be prevented. Time can be reduced. Here, the position where the semiconductor chip 20 is completely separated from the tape 18 is the position of the tape 18.
It is preferable that the position of the bottom dead center of the peeling table 24 is also variable because it changes depending on the material of the semiconductor chip 20, the shape of the semiconductor chip 20, and the peel strength of the adhesive.

Further, it is preferable that the moving speed of the peeling table 24, particularly the descending speed, is also variable. That is, the peeling table 24
If the lowering speed of the semiconductor chip 20 is too fast, the peeling proceeds rapidly, and the semiconductor chip 20 after the peeling may move by an impact. However, making the descending speed of the peeling table 24 slower than necessary increases the time of the peeling step. Here, since the peeling speed of the semiconductor chip 20 changes depending on the material of the tape 18, the shape of the semiconductor chip 20, and the peeling strength of the adhesive, the descending speed of the peeling table 24 is also preferably made variable.

It is preferable that the time during which the collet 14 stops at the position where the semiconductor chip 20 is suction-fixed, that is, the position (bottom dead center position) of the collet 14 shown in FIG. . This is because the time required for the semiconductor chip 20 to completely peel off varies depending on the material of the tape 18, the shape of the semiconductor chip 20, the peeling strength of the adhesive, and the like. Therefore, the collet is not raised until the semiconductor chip 20 is completely peeled off. That's why.

As described above, the semiconductor peeling device 10 according to the above-described embodiment does not use a member directly in contact with the back surface of the semiconductor chip 20 without using a sharp protrusion pin, so that the semiconductor chip 20 Does not scratch the back. Therefore, cracking and cracking of the semiconductor chip 20 due to such a scratch can be prevented. In addition, since an expensive bump pin is not used in the semiconductor chip peeling device 10, the manufacturing cost of the semiconductor chip peeling device can be reduced. Further, jig replacement for each semiconductor chip size is reduced, and work efficiency is improved.

In the above-described embodiment, if a small vertically movable stripping table is further provided at the center of the stripping table 24, the releasability can be further improved.

Further, the semiconductor chip 20 can be peeled only by the vacuum holder 22 without using the peeling table 24. That is, the state shown in FIG. 3A is set without the peeling table 24, and the collet 14 is brought into contact with the semiconductor chip 20 to be suction-held. Then, by suctioning the tape 18 by the vacuum holder 22, the tape 18 can be drawn to the upper surface 22 of the vacuum holder 22 as shown in FIG. Since the semiconductor chip 20 is sucked and held by the collet 14, the semiconductor chip 20 is separated from the tape 18. Such a peeling step is performed in advance by the peeling table 2.
Prepare a peeling device without 4 or see Fig. 3 (a)
It can also be achieved by fixing the peeling table 24 at the bottom dead center position in the state shown in FIG.

In the above-described embodiment, the peeling table 24 is configured to move only in the vertical direction. However, the peeling table 24 can also be moved in the horizontal direction (XY directions), so that peeling can be more reliably performed. Can also.

According to the present invention as described above, the following various effects can be realized.

According to the first and fourth aspects of the present invention, the semiconductor chip is held at a predetermined position by the peeling table and the collet, and the tape is pulled on the upper surface of the vacuum holder separated from the semiconductor chip by inclination. As a result, the semiconductor chip peels off from the tape. Therefore,
The semiconductor chip can be easily peeled off without using a sharp protrusion pin.

According to the second aspect of the present invention, the position of the top dead center and / or the position of the bottom dead center of the peeling table are made variable, so that the size of the semiconductor chip, the material of the tape or the peeling strength of the adhesive material, etc. Even if the value changes, optimal peeling can be realized.

According to the third aspect of the present invention, by making the moving speed of the peeling table variable, it is possible to realize an optimum peeling speed corresponding to various peeling conditions.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an overall configuration of a semiconductor chip peeling apparatus according to one embodiment of the present invention.

FIG. 2 is a simplified sectional view showing a main part of the semiconductor chip peeling apparatus shown in FIG.

FIG. 3 is a view for explaining the operation of the semiconductor chip peeling device shown in FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semiconductor chip peeling apparatus 12 Peeling mechanism 14 Collet 16 Optical camera 18 Tape 20 Semiconductor chip 22 Vacuum holder 22a Opening 22b Upper surface 24 Peeling table

Claims (4)

[Claims] 1. A semiconductor chip peeling device for peeling a semiconductor chip attached to a tape from a tape, comprising: an upper surface provided with an inclination so as to gradually decrease toward a center; and a center formed at the center of the upper surface. A vacuum holder on which a tape to which a semiconductor chip is attached is placed on the upper surface, and the semiconductor chip is disposed in the opening of the vacuum holder and is movable in a vertical direction. A peeling table having a top surface of a smaller area, a collet for sucking and holding a semiconductor chip located on the peeling table from the opposite side of the peeling table, and affixed to a tape placed on the vacuum holder. A semiconductor chip peeling device comprising: a position detecting means for detecting a position of a semiconductor chip. 2. The semiconductor chip peeling device according to claim 1, wherein at least one of a top dead center position and a bottom dead center position of said peeling table is variable. 3. The semiconductor chip peeling device according to claim 1, wherein the moving speed of the peeling table is variable. 4. A semiconductor chip peeling method for peeling a semiconductor chip from a tape, comprising: an upper surface provided with an inclination so as to gradually decrease toward a center; and an opening formed at the center of the upper surface. The tape on which the semiconductor chip is attached is disposed on the upper surface of a vacuum holder in which a peeling table having a top surface having an area smaller than the semiconductor chip is vertically movable within the opening. By moving the tape so that the semiconductor chip to be placed on the peeling table, in a state where the semiconductor chip is placed on the peeling table, by suctioning the tape by the vacuum holder, Peeling off the peripheral portion of the semiconductor chip from the tape, holding the semiconductor chip at a position supported by the peeling table, lowering the peeling table to remove the semiconductor chip from the tape. The semiconductor chip peeling method characterized by having each step of completely peeled off.