JP2000353710A - Manufacture of pellet pickup device and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a pellet pickup device with which a semiconductor pellet can be stripped off from a dicing table without fail and to pick up an ultrathin semiconductor pellet which could not be picked up by the conventional lifting-up pin. SOLUTION: Grooves 20 have an exterior shape larger than that of the prescribed semiconductor pellet of pick-up objective on the upper center part 25 of the back-up holder of a pellet pickup device, and the outer circumferentical edge of the semiconductor pellet 21 is arranged, when the semiconductor pellet is placed on the backup holder. The grooves are formed along the outer circumferential edge of the semiconductor pellet. The semiconductor pellet is stripped off from a dicing tape 22 by evacuating the grooves, and the semiconductor pellet is stripped off from the circumferential part of the dicing tape 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to peeling of semiconductor pellets from a dicing tape in a semiconductor device manufacturing process, and is particularly applied to a die bonder, a flip chip bonder, a tray filling device and the like.

[0002]

2. Description of the Related Art Generally, in a process of manufacturing a pellet-shaped semiconductor device, a predetermined thin film manufacturing process is performed on a semiconductor wafer to form a large number of semiconductor pellets at once. Then, an adhesive tape (referred to as dicing tape) made of synthetic resin or the like is attached to the back surface of the semiconductor wafer. The semiconductor wafer to which the dicing tape is attached is divided into individual semiconductor pellets by full cut dicing. Thereafter, a predetermined test is performed, and a good semiconductor pellet is pushed up by a push-up pin and taken out from the semiconductor wafer. In this step, it is desired that the semiconductor pellet can be stably taken out without damaging the semiconductor pellet when the semiconductor pellet is pushed up by the push-up pin.

Next, the problems of the conventional technique will be described with reference to FIGS. FIG. 13 is a perspective view showing a cross section of a main part of a device relating to a conventional typical pellet pickup mechanism. In general, the semiconductor pellets 1 are supplied to a pellet pickup mechanism while being aligned and attached to a dicing tape 2 and attached to a ring frame 3. The semiconductor pellet 1 is attached in the shape of a semiconductor wafer. That is, the back surface of the semiconductor wafer is adhered to the dicing tape 2, and the semiconductor wafer is subjected to full cut dicing along the dicing line and separated into individual semiconductor pellets 1.
The individual semiconductor pellets 1 remain attached to the dicing tape 2 in a state of full cut dicing. The ring frame 3 is configured to be freely movable in a horizontal direction by a mechanism (not shown).
A backup holder 4 is disposed below the dicing tape 2, and a push-up pin 5, a push-up pin holder 6, and a push-up shaft 7 are provided in the center of the backup holder 4.
Are mounted so that they can move up and down in a state where they are integrally connected. The inside of the backup holder 2 is evacuated. On the semiconductor pellet 1 and directly above the push-up pins, a collet 8 for adsorbing the semiconductor pellet.
Are arranged.

FIG. 14 is a sectional view for explaining a pickup procedure in the same conventional pellet pickup mechanism as FIG. The semiconductor pellet 1 is a dicing tape 2
Is pasted on. A backup holder 4 is installed below the dicing tape 2 so as to be in contact with the dicing tape 2, and a push-up pin 5 is provided in the center of the backup holder 4.
The push-up pin holder 6 and the push-up shaft 7 are sequentially connected and installed vertically movable. On the upper surface (tape mounting surface) of the backup holder 4, small grooves 10 are formed on the entire surface except the outer peripheral portion, and the respective grooves 10 are connected to each other at a portion (not shown) and are also connected to the inside of the backup holder 4 by holes 9. ing. Therefore, when the inside of the backup holder 4 is evacuated, the gap between the groove 10 on the surface of the backup holder 4 and the dicing tape 2 is in a vacuum state, and the dicing tape 2 can be attracted and fixed to the backup holder 4. In addition, the semiconductor pellet 1 is determined in advance by a predetermined means (not shown).
It is assumed that the positioning of the backup holder 4 has been completed.

FIG. 14A is a diagram showing an initial state of the pickup operation. When the pick-up operation starts, first, the push-up pin 5, the push-up pin holder 6, and the push-up shaft 7 rise as shown in FIG. 14B, and the tip of the push-up pin 5 rises to just before contact with the dicing tape 2. At the same time, the collet 8 descends to a predetermined height and waits. Next, the push-up pin 5 is further raised as shown in FIG. Semiconductor pellet 1
Is pushed up by the push-up pin 5, but the dicing tape 2 is 420 m in the groove 10 of the backup holder 4.
The semiconductor pellet 1 is pulled downward by a vacuum suction force of about mHg, and gradually starts peeling from the end of the semiconductor pellet 1. When the push-up pins 5 are further raised, the dicing tape 2 is completely peeled off from the semiconductor pellet 1 as shown in FIG. Finally, as shown in FIG. 16, the push-up pin 5 returns to the initial position, that is, the position shown in FIG. 14A, and the collet 8 conveys the semiconductor pellet 1 to the next step to complete the pickup operation.

[0006]

Problems with the conventional pickup method described above will be described with reference to FIG. FIG. 17 is a cross-sectional view illustrating a state in which the semiconductor pellet and the dicing tape are peeled off, and FIG.
Represents the initial state of pushing up. The semiconductor pellet 1a is a target pellet to be picked up, and the semiconductor pellets 1b and 1c are semiconductor pellets at positions adjacent thereto. Generally, when the dicing tape and the semiconductor pellet are peeled off, the edge of the pellet is most difficult to peel off, and once the edge is peeled off, the peeling proceeds with a load smaller than the load required for peeling the end. In this conventional example as well, the P-point portion 11 at the end of the semiconductor pellet 1c is the portion that is most difficult to peel off. The pellets 1b and 1c are lifted (FIG. 17A). However, in such a state, a vacuum suction force acts on the semiconductor pellets 1b and 1c by the backup holder 4, and a sufficient load F12 that can trigger tape peeling is generated.
Therefore, peeling occurs at the point P11, and the peeling gradually increases toward the inside of the semiconductor pellet 1 at the same time as the push-up amount increases, and finally, the semiconductor pellet 1a is completely removed in the process shown in FIGS. Peel off from dicing tape.

However, when picking up a thin semiconductor pellet having a thickness of about 50 μm to 100 μm, which has been actively developed in recent years, the state shown in FIG. 17B is obtained. The load configuration applied to the pickup target pellet 1a is the same as that of FIG.
Since a is thin, it is elastically deformed by the load F13. When the push-up proceeds further, the bending stress exceeds the strength of the semiconductor pellet 1a before the point P11 comes off, and the semiconductor pellet 1a breaks from the point Q14 of the semiconductor pellet 1a where the tip of the push-up pin 5 hits. In order to avoid such a problem, the distance from the point Q to the point F may be shortened. However, in order to efficiently peel the entire semiconductor pellet, the ratio of the size B of the semiconductor pellet 1a to the distance A between the push-up pins 5 is required. (A / B) is 1 /
2 to 1/3 is appropriate, and it is substantially impossible to reduce the distance between the point Q and the point F with a large pellet of 10 mm square or more. As a measure for preventing the destruction of the semiconductor pellets, measures have been taken to reduce the adhesive strength of the dicing tape. However, when the thickness of the semiconductor pellets is 50 μm or less and the size exceeds 10 mm square, the adhesive strength of the dicing tape is reduced. Must be controlled very weakly, and a delicate speed control is required so as not to give an impact as much as possible with the push-up pin, and it is difficult to stably realize it at an actual production site.

As described above, the current pickup apparatus has a problem that a thin semiconductor pellet is broken. Known techniques (JP-A-7-45558 and JP-A-6-318636) show a method of peeling a semiconductor pellet from a dicing tape by sucking the dicing tape. In this method, dicing is performed. The tape is peeled off at once, and an extremely thin semiconductor pellet having a thickness of 100 μm or less breaks immediately and is not an effective method. The present invention has been made in view of such circumstances, and it is possible to reliably peel off a semiconductor pellet from a dicing tape, and it is possible to pick up an ultra-thin semiconductor pellet that cannot be picked up by a conventional push-up pin. And a method of manufacturing a semiconductor device using the pickup device.

[0009]

According to the present invention, there is provided a pellet pickup device having an outer shape having a size larger than a predetermined semiconductor pellet to be picked up at the upper center of the backup holder (immediately below the predetermined semiconductor pellet to be picked up). When a predetermined semiconductor pellet to be picked up is placed on a backup holder, a groove is formed along the outer periphery of the predetermined semiconductor pellet on which the outer peripheral end of the predetermined semiconductor pellet is disposed. The method is characterized in that the predetermined semiconductor pellet is peeled off from the dicing tape by evacuating the inside, and the semiconductor pellet is peeled off from the peripheral end thereof. In order to promote peeling, a method of providing a depression in the center of the backup holder to warp the semiconductor pellet, a method of blowing air from the center of the backup holder to warp the semiconductor pellet, and a method of raising the center of the backup holder are appropriately used. By doing
Further, it is possible to reliably peel off the semiconductor pellet from the dicing tape. Ultra-thin semiconductor pellets that cannot be picked up by the conventional push-up method using push-up pins can be picked up.

That is, a pellet pickup device of the present invention supports a dicing tape supporting a plurality of semiconductor pellets and has a flat tape mounting surface, and the dicing tape on the tape mounting surface of the backup holder. It is arranged so that the peripheral end of the predetermined semiconductor pellet stuck on it projects above it,
And a groove formed on the tape mounting surface along the outer periphery of the predetermined semiconductor pellet, means for sucking the dicing tape on the groove by evacuating the groove, and the predetermined semiconductor pellet. A collet for adsorbing, wherein the collet adsorbs the predetermined semiconductor pellet and peels off the dicing tape when the groove adsorbs the dicing tape. An adsorbing hole for adsorbing the dicing tape may be formed near the center of an area surrounded by the groove and on which the predetermined semiconductor pellet is placed on the tape mounting surface. The region may be depressed near its center. A device for moving the area up and down may be further provided. The apparatus may further include a device for blowing high-pressure gas toward the predetermined semiconductor pellet near the center of the region.

In a region other than the region surrounded by the groove on the tape mounting surface, a groove for adsorbing and fixing a portion of the dicing tape to which a semiconductor pellet other than the predetermined semiconductor pellet is adhered by vacuum evacuation is formed. It may be done. Further, in the method of manufacturing a semiconductor device according to the present invention, a dicing tape supporting a plurality of semiconductor pellets is provided on a flat tape mounting surface of a backup holder, and a predetermined semiconductor pellet is provided on a groove formed on the tape mounting surface. As the peripheral end of the pellet protrudes, the mounting step, and the groove is evacuated to suck the dicing tape on the groove, and the predetermined semiconductor pellet is sucked by a collet from the dicing tape. Peeling off the semiconductor pellet.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. First, referring to FIG. 1 and FIG.
An example will be described. FIG. 1 is a sectional perspective view of the pellet pickup device, and FIG. 2 is a plan view showing a tape mounting surface of the pellet pickup device in which the positions of semiconductor pellets are indicated by dotted lines. FIG. 1B is a cross-sectional view showing a peeled state of the dicing tape when a semiconductor pellet is picked up. A groove 20 having an outer size larger than that of the semiconductor pellet 21 is provided in the center of the backup holder 24 which is a jig for fixing the dicing tape to which the semiconductor pellet is adhered and fixed. The width C of the groove 20 is
The thickness is determined in consideration of the thickness of the semiconductor pellet 21 (50 μm in this embodiment) so that the semiconductor pellet 21 is not broken. The relationship between the outer dimension D of the groove 20 and the outer dimension E of the semiconductor pellet 21 is determined by the characteristics of the dicing tape 22 and the dimension of the semiconductor pellet 21, and can be any of D> E and D = E. That is,
In the present invention, the outer shape of the groove is substantially the same size as the semiconductor pellet.

FIG. 2 is a plan view showing a tape mounting surface of the backup holder 24 of this embodiment. As shown in this figure, the peripheral end of the predetermined semiconductor pellet 21 to be picked up, which is stuck to the dicing tape 22 on the tape mounting surface of the backup holder 24, is arranged so as to protrude upward. The groove 20 is formed on the tape mounting surface along the outer periphery of the predetermined semiconductor pellet 21. The protruding portion (Δt) where the peripheral end of the semiconductor pellet 21 placed on the pickup pellet support 25 surrounded by the groove 20 on the tape mounting surface protrudes from the support 25 onto the groove 20 is peeled off. 1 mm or less is appropriate in consideration of the above effect. A hole 23 is formed in the lower part of the groove 20, and the groove 2 is formed through the hole 23.
0 and the inside of the backup holder 24 are connected. Further, grooves 29 are formed concentrically on the tape mounting surface on the upper part of the backup holder 24, and the grooves 29 are connected at several places on the circumference. The groove 29 is also connected to the inside of the backup holder 24 by several holes 26 formed in the bottom.

At the beginning of the pickup operation, FIG.
The state is as shown in FIG. The semiconductor pellet 21 and the backup holder 24 are aligned with each other by means (not shown) in advance, and the inside of the backup holder 24 is evacuated to about 430 mmHg. At the same time, the collet 28 is moved so as to come into contact with the upper part of the semiconductor pellet 21, and at the same time, the inside of the collet 28 is evacuated.
The collet 28 which is a portion which comes into contact with the semiconductor pellet 21
Is formed of a porous body 27. Even if the semiconductor pellet 21 is sucked by vacuum suction, the semiconductor pellet 21 is not deformed. However, backup holder 2
When the inside of the groove 4 is evacuated, the inside of the groove 20 is also evacuated, the dicing tape 22 is pulled down, and finally the semiconductor pellet 21 is peeled off from the peripheral portion (FIG. 1B). After partial peeling, collet 2
The semiconductor pellet 21 is peeled off from the dicing tape 22 by the suction force of the collet 28 by moving the upper side 8. The groove 29 allows the dicing tape 22 to be sucked to the backup holder 24 by a vacuum suction force. Then, the semiconductor pellet 21 is supported so as not to be peeled off by the vacuum suction force generated in the groove 29. Naturally, the adhesive force of the dicing tape 22 is controlled to an appropriate value so that the pickup can be sufficiently performed in the above steps. In this embodiment, the semiconductor pellet is reliably peeled off from the dicing tape, and cannot be picked up by a conventional push-up pin, for example, 100 μm.
The following ultra-thin semiconductor pellets can be picked up.

Next, a second embodiment will be described with reference to FIGS. FIGS. 3 and 4 are cross-sectional views of a pellet pick-up device illustrating a peeling state of a dicing tape when picking up a semiconductor pellet, and explain a principle of peeling a semiconductor pellet from a dicing tape. FIG. 3 shows an initial state in which the target semiconductor pellet 31 is adsorbed by the collet 38. The groove 30 is a feature of the present invention, and is formed on the tape mounting surface of the backup holder 34 so as to surround the semiconductor pellet 31 to be picked up. And
A region surrounded by the groove 30 on the tape mounting surface serves as a pickup pellet supporting portion for supporting a predetermined semiconductor pellet 31 to be picked up, and this portion has a depression 37. The peripheral edge of the predetermined semiconductor pellet 31 to be picked up, which is stuck to the dicing tape 32 on the pickup pellet supporting portion on the tape mounting surface of the backup holder 34, is arranged so as to protrude above the groove 30. Similarly, a groove 39 for adsorbing the dicing tape 32 on the tape mounting surface of the backup holder 34.
Is provided, and has a function of suppressing the dicing tape 32 so that other regions are not lifted when the collet 38 picks up a predetermined semiconductor pellet 31.

A recess 37 is formed in the pickup pellet support at the center of the backup holder 34.
A groove 35 and a hole 36 connected to the groove 35 are provided in the center of the recess 37, and these are connected to the inside of the backup holder 34 and used for vacuum suction of the semiconductor pellet 31. When the semiconductor pellet 31 is picked up, the semiconductor pellet 31 is vacuum-adsorbed through the groove 35, so that the semiconductor pellet 3
1 is deformed along the depression 37. The peripheral end portion (P point 33) of the semiconductor pellet 31 accompanying the deformation is flipped up to obtain a peeling force from the dicing tape 32. The depression 37 is formed to have a curve radius of approximately 20 mm in order to increase the amount of jumping up of the P point 33 as much as possible and to reduce the load on the semiconductor pellet 31 sufficiently to the breaking stress or less. In this embodiment, the semiconductor pellet is reliably peeled off from the dicing tape, and cannot be picked up by a conventional push-up pin.
It is possible to pick up an ultra-thin semiconductor pellet of not more than 00 μm. In particular, since the depression is provided, the amount of jumping up of the edge of the semiconductor pellet is large, and the peeling force is large.

Next, a third embodiment will be described with reference to FIG. FIG. 4A is a cross-sectional view showing a peeled state of the dicing tape when a semiconductor pellet is picked up. A groove 40 having an outer size larger than that of the semiconductor pellet 41 is provided at the center of the backup holder 44 which is a fixing jig for the dicing tape to which the semiconductor pellet is adhered and fixed. The width of the groove 40 is determined in consideration of the thickness of the semiconductor pellet 41 (50 μm in this embodiment) so that the semiconductor pellet 41 is not broken. External dimensions of groove 40 and semiconductor pellet 41
Is determined by the characteristics of the dicing tape 42 and the dimensions of the semiconductor pellet 41. The external dimension of the groove 40 ≧ the external dimension of the semiconductor pellet 41. That is, the outer shape of the groove 40 is substantially the same size as the semiconductor pellet 41. A hole 47 is formed in the center of the tape mounting surface that supports a predetermined semiconductor pellet to be picked up. A hole 43 is formed below the groove 40, and the groove 40 and the inside of the backup holder 44 are connected via the hole 43. Grooves 49 are formed concentrically on the tape mounting surface above the backup holder 44, and the grooves 49 are connected at several places on the circumference. The groove 49 is also connected to the inside of the backup holder 44 by several holes 46 formed in the bottom.

After positioning the semiconductor pellet 41 and the backup holder 44 in advance, the inside of the backup holder 44 is evacuated to about 430 mmHg. At the same time, the collet 48 is moved so as to contact the upper portion of the semiconductor pellet 41, and at the same time, the inside of the collet 48 is evacuated. When the inside of the backup holder 44 is evacuated, the inside of the groove 40 is also evacuated, the dicing tape 42 is pulled down, and finally the semiconductor pellet 41 is peeled off from the peripheral portion. After the pickup operation is advanced to this state, the high pressure air is blown out from the hole 47, so that the dicing tape 42 swells and the peeling of the semiconductor pellet 41 is promoted. The pressure of the applied air is determined from the size of the semiconductor pellet so that the entire dicing tape does not float. In this embodiment, the semiconductor pellet is reliably peeled off from the dicing tape, and it is possible to pick up an ultra-thin semiconductor pellet of, for example, 100 μm or less, which cannot be picked up by a conventional push-up pin. In particular, since high-pressure air is added, the semiconductor pellets are more easily peeled off.

Next, a fourth embodiment will be described with reference to FIG. FIG. 4B is a cross-sectional view showing a peeled state of the dicing tape when picking up a semiconductor pellet. A groove 50 having an outer shape larger than the semiconductor pellet 51 is provided at the center of the backup holder 54 which is a jig for fixing the dicing tape to which the semiconductor pellet is adhered and fixed. The width of the groove 50 is determined in consideration of the thickness of the semiconductor pellet 51 (50 μm in this embodiment) so that the semiconductor pellet 51 is not broken. External dimensions of groove 50 and semiconductor pellet 51
Is determined by the characteristics of the dicing tape and the dimensions of the semiconductor pellet, and the following formula is satisfied. The pickup pellet supporting portion on the tape mounting surface that supports a predetermined semiconductor pellet to be picked up is connected to the movable shaft 57.
A hole 53 is formed in the lower portion of the groove 50, and the hole 5
3, the groove 50 and the inside of the backup holder 54 are connected. Grooves 59 are formed concentrically on the tape mounting surface above the backup holder 54, and the grooves 59 are connected at several locations on the circumference. The groove 59 is also connected to the inside of the backup holder 54 by several holes 56 formed in the bottom.

The semiconductor pellet 51 and the backup holder 54 are aligned in advance, and the end of the pickup pellet supporting portion on the upper surface of the movable shaft 57 is adjusted to the same plane as the tape mounting surface.
Vacuum at about 30 mmHg. Collet 58 at the same time
Is moved so as to contact the upper portion of the semiconductor pellet 51,
At the same time, the inside of the collet 58 is evacuated. When the inside of the backup holder 54 is evacuated, the inside of the groove 50 is also evacuated, and the dicing tape 52 is pulled down.
Eventually, the semiconductor pellet 51 is peeled off from the peripheral portion. After the pickup operation is advanced to this state, the movable shaft 57 is raised to promote the peeling of the dicing sheet 52. In this embodiment, the semiconductor pellet is reliably peeled off from the dicing tape, and it is possible to pick up an ultra-thin semiconductor pellet of, for example, 100 μm or less, which cannot be picked up by a conventional push-up pin. In particular, the use of a movable shaft facilitates peeling of the semiconductor pellet.

Next, a fifth embodiment will be described with reference to FIGS. FIG. 5A is a perspective view showing a cross section of the backup holder, and FIGS. 5B and 6 are cross-sectional views of a pellet pickup device for explaining a peeling state of a dicing tape when picking up semiconductor pellets. At the center of the backup holder 64, a groove 60 having an outer size larger than the semiconductor pellet 61 is provided. The width of the groove 60 is determined in consideration of the thickness of the semiconductor pellet 61 (50 μm in this embodiment) so that the semiconductor pellet 61 is not broken. The center of the pickup pellet supporting portion of the tape mounting surface supporting the predetermined semiconductor pellet to be picked up is a movable shaft 6
7. A hole 63 is formed below the groove 60, and the groove 60 and the inside of the backup holder 64 are connected through the hole 63. Grooves 69 are formed concentrically on the tape mounting surface above the backup holder 64, and the grooves 69 are connected at several locations on the circumference. The groove 69 is also connected to the inside of the backup holder 64 by several holes 66 formed at the bottom.

After positioning the semiconductor pellet 61 and the backup holder 64 in advance and adjusting the end of the pickup pellet support on the upper surface of the movable shaft 67 to the same plane as the tape mounting surface (FIG. 5B), the backup holder 6
4 is evacuated to about 430 mmHg. At the same time, the collet 68 is moved so as to contact the upper portion of the semiconductor pellet 61, and at the same time, the inside of the collet 68 is evacuated. When the inside of the backup holder 64 is evacuated, the inside of the groove portion 60 is also evacuated, and the dicing tape 62 is pulled down, and finally the semiconductor pellet 61 is peeled off from the peripheral portion. After the pickup operation is advanced to this state, the movable shaft 67 is raised to promote the peeling of the dicing sheet 62. The central portion of the backup holder 64 of this embodiment is a pickup pellet support portion, and a central portion of the support portion is a movable portion that can move up and down. The movable part is connected to the movable shaft 67 and is moved by the movable shaft. A depression 65 is provided in the pickup pellet support at the center of the backup holder 64. The recess 65 is configured to be vertically movable inside as described above, and is divided into a movable portion supported by the movable shaft 67 and a fixed portion around the movable portion. A hole 70 is provided at the center of the movable shaft 67.
And a groove 72 and a hole 70 connected to the groove 72 are formed, and a groove 71 is formed in the movable portion.

FIG. 5B is a diagram showing an initial state of the pickup. An end of the semiconductor pellet 61 to be picked up is peeled off from the dicing tape 62. Next, when the movable shaft 67 is raised, the semiconductor pellet 61 is further peeled off from the dicing tape (FIG. 6A). Further, a hole 72 connected to the groove 71
When high-pressure air is blown from the substrate, the peeling is further promoted and the pickup is finally completed (see FIG. 5A). In this embodiment, the semiconductor pellet is reliably peeled off from the dicing tape, and cannot be picked up by a conventional push-up pin, for example, 100 μm.
The following ultra-thin semiconductor pellets can be picked up. In particular, the movement of the movable shaft causes the semiconductor pellet to be gradually peeled off from the end, which makes it easier to peel off. In this embodiment, one movable shaft is used. However, two or more movable shafts can be installed. Also, they may be installed coaxially. In particular, when the size of the semiconductor pellet is large, the movable shaft is divided coaxially, and if the amount of the dicing tape peeled off by one movable shaft is reduced, the possibility of breakage of the semiconductor pellet can be reduced.

Next, a sixth embodiment will be described with reference to FIGS. FIG. 7A is a perspective view showing a cross section of the backup holder, and FIGS. 7B to 8 are cross-sectional views of a pellet pickup device for explaining a peeling state of a dicing tape when picking up semiconductor pellets. As shown in FIG. 7A, the backup holder 81
A groove 80 having an outer size larger than that of the semiconductor pellet 90 is provided at the center of the groove. The width of the groove 80 is
The thickness is determined in consideration of the thickness of the semiconductor pellet 90 (50 μm in this embodiment) so that the semiconductor pellet 90 is not broken. The central portion of the pickup pellet supporting portion on the tape mounting surface that supports a predetermined semiconductor pellet to be picked up is movable axes 1, 2, 3 (82, 83,
84). The movable axis is the movable axis 1 at the center.
The movable shaft 2 (83) and the movable shaft 3 (84) are formed and arranged concentrically so as to surround the movable shaft 2 (83). The groove 80 and the inside of the backup holder 81 are connected. That is, the groove 80 points to a gap between the inner wall of the backup holder 81 and the movable shaft 84. Grooves 87 are formed concentrically on the tape mounting surface above the backup holder 81, and each groove 87 is formed at several places on the circumference.
Are connected. The groove 87 is also connected to the inside of the backup holder 64 by several holes 86 formed in the bottom.

First, the entire movable shafts 82, 83, 84 protrude from the tape mounting surface of the backup holder 81 and are raised. In this embodiment, the upper surfaces of these movable shafts are set at 0.5 mm from the tape mounting surface so that peeling easily occurs.
Raise to a position higher by 〜1 mm. Since the inside of the backup holder 81 is evacuated, the peripheral portion of a predetermined semiconductor pellet 90 to be picked up is peeled off (FIG. 7).
(B)). Next, when the outermost movable shaft 84 is lowered, peeling proceeds. At this time, in this embodiment, the movable shaft 84 may be lowered to a position lower than the adjacent movable shaft 83 by 1 mm or more to ensure that the peeling proceeds (FIG. 8A). Next, the movable shaft 83 is moved down to the lowering position of the movable shaft 84 to further progress the peeling. Thereafter, the semiconductor pellet 90 is suctioned by the vacuum suction force of the collet 89 to raise the collet 89, thereby removing the remaining suction portion and completing the operation.

Of course, as shown in FIG.
, High pressure air can be blown out to accelerate the peeling of the semiconductor pellets from the dicing tape. Also, the number of movable axes may be more than three, and the more the number of movable axes, the easier the work proceeds. This number is determined by the size of the semiconductor pellet. In this embodiment, the semiconductor pellet is reliably peeled off from the dicing tape, and it is possible to pick up an ultra-thin semiconductor pellet of, for example, 100 μm or less, which cannot be picked up by a conventional push-up pin. In particular, increase the number of movable axes,
Due to the movement, the semiconductor pellet is gradually peeled off from the end, which makes it easier to peel off than before.

Next, a sixth embodiment will be described with reference to FIGS. FIG. 9A is a perspective view showing a cross section of the backup holder, and FIGS. 9B and 10 are cross-sectional views of a pellet pickup device for explaining a peeling state of a dicing tape when picking up a semiconductor pellet. At the center of the backup holder 101, a groove 100 having a size larger than that of the semiconductor pellet 110 is formed.
Is provided. The width of the groove 100 is determined in consideration of the thickness of the semiconductor pellet 110 so that the semiconductor pellet 110 is not broken. A recess is formed in the pickup pellet supporting portion of the tape mounting surface that supports a predetermined semiconductor pellet to be picked up, unlike other flat regions on the tape mounting surface. The support is driven by the movable shafts 1, 2, 3 (102, 103, 104). That is, the upper surface of the movable shaft is recessed. The movable shaft is a pair of movable shafts 2 and 3 (103 and 104) with the central movable shaft 1 (102) being centered and being line-symmetric.
Are arranged. Groove 10
The lower part of 0 is connected to the inside of the backup holder 101. Grooves 107 are formed concentrically on the tape mounting surface above the backup holder 101, and the grooves 107 are connected at several locations on the circumference. The groove 107 is connected to the inside of the backup holder 101 by several holes 108 formed in the bottom.

The semiconductor pellet 110 and the backup holder 101 are aligned in advance, and the ends of the pickup pellet support portions on the upper surfaces of the plurality of movable shafts are adjusted to the same plane as the tape mounting surface (FIG. 9A). The inside of 101 is evacuated to about 430 mmHg. First, the entire movable shafts 102, 103, and 104 protrude from the tape mounting surface of the backup holder 101 and are raised. In this embodiment, the upper surfaces of these movable shafts are set at a distance of 0.1 mm from the tape mounting surface so that peeling can easily occur.
Raise to a position higher by 5 mm to 1 mm. Since the inside of the backup holder 101 is evacuated, the periphery of a predetermined semiconductor pellet 110 to be picked up is peeled off. Since the upper surface of the movable shaft is recessed, the semiconductor pellet mounted thereon is warped upward at the peripheral portion, and is easily peeled off (FIG. 9B).

Next, the outermost movable shaft 104 is lowered. However, since the upper surfaces of the movable shafts 102, 103, and 104 are curved, the movable shaft
Since the height of 03 is low, sufficient peeling force is not generated. To prevent this, when the movable shafts 102 and 103 are raised together to the height where the movable shaft was originally located, the peeling proceeds. At this time, in this embodiment, in order to ensure that the peeling proceeds, the movable shaft 104 is
It is better to lower to a position lower than 1 mm by 1 mm or more.
0 (a)). Next, the movable shaft 103 is lowered, and the movable shaft 1 is moved.
02 is further raised to further progress the peeling. After this,
The semiconductor pellet 11 is formed by the vacuum suction force of the collet 109.
By raising the collet 109 by sucking 0, the remaining sucked portion is peeled off and the operation is completed. Of course, the movable shaft is not limited to three stages, but is determined by the size of the semiconductor pellet (FIG. 10B). In this embodiment, the semiconductor pellet is reliably peeled off from the dicing tape, and it is possible to pick up an ultra-thin semiconductor pellet of, for example, 100 μm or less, which cannot be picked up by a conventional push-up pin. In particular, the number of movable shafts is increased, and the movement causes the semiconductor pellet to be gradually peeled off from the end, making it easier to peel off than before.

Next, referring to FIG. 11 and FIG.
An example will be described. The pellet pickup device of this embodiment uses a plurality of movable shafts concentrically, as in the fifth embodiment (see FIG. 7A). FIG. 11 is a schematic cross-sectional view illustrating the operation of the movable shaft, and FIG. 12 is a cross-sectional view of the pellet pickup device illustrating the first stage of the pick-up operation. The pickup pellet supporting portion on the tape mounting surface of the backup holder is configured from the upper surface of the movable shaft. As for the movable shaft, the movable shafts 122, 123, 124, and 125 are sequentially formed concentrically around the movable shaft 121, and the movable shaft 125 is disposed on the outer periphery again. First, the pellet pickup device is in an initial state. Next, the entire movable shafts 121, 122, 123, 124, and 125 are raised (FIG. 11A). Next, the outermost movable shaft is lowered. And then, the outer movable shaft 12
4, 123, and 122 are sequentially lowered, and the central movable shaft 12
Only 1 is raised (FIG. 11B). The movable shaft is operated in this way. Next, referring to FIG.
The operation of picking up a relatively large semiconductor pellet using this movable shaft will be described.

In FIG. 12A, the dicing tape can be suction-fixed by suctioning the inside of the backup holder 131 by vacuum as in the other embodiments.
In this backup holder 131, the movable shafts 132, 133, 134, 135, which are formed and arranged on concentric circles,
136 is in the state of the latter stage of FIG. But,
Since the opening dimension of the central portion of the backup holder 131 is small, the movable shaft 136 cannot move up. Therefore, since the movable shaft 136 cannot be actually used, the movable shaft apparently becomes a four-stage pickup mechanism. In FIG. 12B, in the backup holder 131, the movable shafts 132, 13 formed concentrically are arranged.
Reference numerals 3, 134, 135, and 136 are in the state of the latter stage of FIG. However, since the opening dimension of the central portion of the backup holder 131 is small, the movable shafts 134, 135, 1
36 cannot climb. Therefore, this movable shaft 13
4, 135 and 136 cannot be used in practice, so that the pickup mechanism has a two-stage movable shaft. By providing a large number of movable shafts in this way, it is possible to cope with pickup operations of semiconductor pellets of various sizes.

[0032]

According to the present invention, with the above-described structure, pickup can be performed without using the push-up pins, and a thin semiconductor pellet can be picked up without breaking the pellet.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a cross-section of a backup holder constituting a pellet pickup device of the present invention, and a cross-sectional view of a pellet pickup device illustrating pickup.

FIG. 2 is a plan view of the backup holder of FIG. 1;

FIG. 3 is a sectional view of a pellet pickup device for explaining the pickup of the present invention.

FIG. 4 is a sectional view of a pellet pickup device for explaining the pickup of the present invention.

FIG. 5 is a perspective view showing a cross section of a backup holder constituting the pellet pickup device of the present invention, and a cross-sectional view of the pellet pickup device illustrating the pickup.

FIG. 6 is a sectional view of a pellet pickup device for explaining the pickup of the present invention.

FIG. 7 is a perspective view showing a cross-section of a backup holder constituting the pellet pickup device of the present invention, and a cross-sectional view of the pellet pickup device illustrating the pickup.

FIG. 8 is a sectional view of a pellet pickup device for explaining the pickup of the present invention.

FIG. 9 is a perspective view showing a cross section of a backup holder constituting the pellet pickup device of the present invention, and a cross-sectional view of the pellet pickup device illustrating the pickup.

FIG. 10 is a sectional view of a pellet pickup device for explaining a pickup of the present invention.

FIG. 11 is a schematic sectional view for explaining the operation of the movable shaft of the pellet pickup device of the present invention.

FIG. 12 is a sectional view of a pellet pickup device illustrating a pickup of the present invention.

FIG. 13 is a perspective view showing a cross section of a conventional pellet pickup device.

FIG. 14 is a sectional view of a pellet pickup device illustrating a conventional pickup.

FIG. 15 is a sectional view of a pellet pickup device illustrating a conventional pickup.

FIG. 16 is a sectional view of a pellet pickup device illustrating a conventional pickup.

FIG. 17 is a sectional view of a pellet pickup device illustrating a conventional pickup.

[Explanation of symbols]

1, 1a, 1b, 1c, 21, 31, 41, 51, 6
1, 90, 110, 138 ... semiconductor pellets, 2,
22, 32, 42, 52, 62, 91, 111, 139
... Dicing tape, 3 ... Ring frame,
4, 24, 34, 44, 54, 64, 81, 101, 1
31: backup holder, 5: push-up pin, 6: push-up pin holder, 7: push-up shaft, 8, 28, 38, 48, 58, 68, 89, 1
09 ... Collet, 9, 23, 26, 36, 43, 4
6, 47, 53, 56, 63, 66, 72, 88, 10
8, 141 ... holes, 10, 29, 39, 49, 59,
69, 70, 71, 86, 87, 106, 107, 14
0 ... groove, 11, 33 ... point P, 12, 13,
..Force F, 14 ... Points Q, 20, 30, 40, 5
0, 60, 80, 100,..., Groove, 25, pellet pickup support, 27, collet porous body, 37, 50, 65, depression, 57, 67, 8
2, 83, 84, 102, 103, 104, 121, 1,
22, 123, 124, 125, 132, 133, 13
4, 135, 136 ... movable shaft.

Claims (9)

[Claims] 1. A backup holder that supports a dicing tape that supports a plurality of semiconductor pellets and has a flat tape mounting surface, and a predetermined semiconductor attached to the dicing tape on the tape mounting surface of the backup holder. A groove is formed on the tape mounting surface so that the peripheral end of the pellet protrudes therefrom, and is formed along the outer periphery of the predetermined semiconductor pellet, and the groove is formed by evacuating the groove. Means for adsorbing the dicing tape, and a collet for adsorbing the predetermined semiconductor pellet, wherein after the groove portion adsorbs the dicing tape and peels off the peripheral portion of the semiconductor pellet, the collet holds the predetermined semiconductor pellet. A pellet pickup device, wherein the pellet is adsorbed and peeled off from the dicing tape. . 2. The method according to claim 1, wherein the predetermined semiconductor pellets on the tape mounting surface are mounted, and suction holes for sucking the dicing tape are formed near a center of a region surrounded by the groove. The pellet pickup device according to claim 1, wherein 3. The pellet pickup device according to claim 2, wherein the region is depressed near its center. 4. The pellet pickup device according to claim 2, further comprising a movable shaft for moving the region up and down. 5. The moving shaft according to claim 4, wherein said plurality of moving shafts are arranged concentrically.
A pellet pickup device according to item 1. 6. The pellet pickup device according to claim 2, further comprising a device for blowing a high-pressure gas toward the predetermined semiconductor pellet near a center of the region. . 7. A groove for adsorbing and fixing a portion of the dicing tape to which a semiconductor pellet other than the predetermined semiconductor pellet is adhered by vacuuming in a region other than a region surrounded by the groove on the tape mounting surface. The pellet pickup device according to any one of claims 1 to 6, wherein a pellet is formed. 8. A dicing tape supporting a plurality of semiconductor pellets is projected on a flat tape mounting surface of a backup holder, and a predetermined semiconductor pellet is projected on a groove formed on the tape mounting surface so that a peripheral end of the semiconductor pellet projects. So that the mounting step and the groove portion are evacuated and the dicing tape on the groove portion is sucked,
Removing the semiconductor pellets from the dicing tape by adsorbing the predetermined semiconductor pellets with a collet. 9. In the step of peeling the semiconductor pellet from the dicing tape, the predetermined semiconductor pellet on the tape mounting surface is placed and moved up and down in a region surrounded by the groove. 9. The method of manufacturing a semiconductor device according to claim 8, wherein a plurality of movable shafts are arranged concentrically and then sequentially lowered from an outer movable shaft and peeled off.