JP7184006B2 - Semiconductor chip pick-up jig, semiconductor chip pick-up device, and pick-up jig adjustment method - Google Patents

Description

The present invention relates to a semiconductor chip pick-up jig, a semiconductor chip pick-up apparatus, and a pick-up jig adjustment method.

Patent Document 1 discloses a jig for picking up a semiconductor element. In this pickup jig, a first push-up pin group and a second push-up pin group are attached to a pin holder. The first push-up pin group is arranged corresponding to each corner portion of the semiconductor element. The second push-up pin group corresponds to the vicinity of the central portion of the semiconductor element, and the tip is lower than the tip of the first push-up pin group. After each corner portion of the semiconductor element is peeled off by the first push-up pin group, the vicinity of the central portion of the semiconductor element is peeled off by the second push-up pin group. As a result, it is possible to prevent stress from penetrating through the semiconductor element due to concentration of stress on the tip of the push-up pin. Also, cracks caused by warpage of the semiconductor element can be suppressed.

JP-A-2002-184836

In general, semiconductor chips have various shapes. In the pickup jig disclosed in Patent Document 1, it is necessary to adjust the tip height of the needle during pickup according to the thickness and size of the semiconductor chip. However, it may be difficult to adjust tip heights of a plurality of needles for each needle.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor chip pick-up jig, a semiconductor chip pick-up apparatus, and a pick-up jig adjustment method that can easily suppress damage to semiconductor chips. and

A semiconductor chip pick-up jig according to the present invention includes a needle holder having a top surface and a back surface facing the top surface, and having a plurality of needle holes penetrating from the top surface to the back surface; a plurality of needles inserted into a plurality of needle holes and protruding upward from the upper surface of the needle holder; a first surface facing the rear surface of the needle holder; and a second surface facing the first surface. and an adjusting portion holder having an adjusting portion hole penetrating from the first surface to the second surface and communicating with the first needle hole among the plurality of needle holes; an elastic member provided between the adjustment unit holder and a first needle among the plurality of needles inserted into the first needle hole in a vertically movable state, and exerting an elastic force on the first needle; and an adjusting member inserted into the adjusting portion hole, protruding into the first needle hole from the first surface of the adjusting portion holder, and provided immediately below the first needle.

A pick-up jig adjusting method according to the present invention includes a needle holder having a top surface formed with a plurality of needle holes, and a plurality of needles inserted into the plurality of needle holes and protruding upward from the top surface of the needle holder. and a needle adjuster having a first portion and a second portion protruding below the first portion is brought into contact with the pick-up jig from above, and the upper end of the first needle among the plurality of needles contact with the first portion, and the upper end of the second needle among the plurality of needles and the second portion contact each other, so that the length of the portion of the second needle protruding from the upper surface of the needle holder length is shorter than the length of the portion of the first needle protruding from the upper surface of the needle holder.

In the semiconductor chip pick-up jig according to the present invention, the first needle moves downward while receiving elastic force from the elastic member due to the semiconductor chip being mounted thereon. Further, the tip position of the first needle is restricted by contact between the first needle and the adjusting member. Therefore, damage to the semiconductor chip can be easily suppressed.
In the pick-up jig adjusting method according to the present invention, the tip positions of a plurality of needles can be easily adjusted by the needle adjuster. Therefore, damage to the semiconductor chip can be easily suppressed.

1 is a side view of a manufacturing apparatus according to Embodiment 1; FIG. 2 is a cross-sectional view illustrating the structure of the pickup device according to Embodiment 1; FIG. 2 is a plan view of the pick-up jig according to Embodiment 1; FIG. FIG. 2 is a side view of the pick-up jig according to Embodiment 1; 4A and 4B are diagrams for explaining the structure of the pickup jig according to the first embodiment; FIG. 4A and 4B are diagrams illustrating a method of adjusting the pickup jig according to the first embodiment; FIG. 4A and 4B are diagrams illustrating a method of fixing the needle according to the first embodiment; FIG. 4A to 4C are diagrams for explaining the method for manufacturing the semiconductor chip according to the first embodiment; FIG. FIG. 4 is a side view of a needle adjuster according to a modification of Embodiment 1; FIG. 10 is a diagram for explaining the structure of a pick-up jig according to Embodiment 2; It is a figure explaining the state where the needle descended. FIG. 11 is a side view of a pick-up jig according to Embodiment 2; FIG. 10 is a diagram illustrating the structure of a pick-up jig according to a first modified example of the second embodiment; FIG. 10 is a diagram illustrating the structure of a pick-up jig according to a second modification of the second embodiment; FIG. 10 is a diagram illustrating the structure of a pick-up jig according to a third modified example of the second embodiment; FIG. 11 is a diagram for explaining the structure of a pick-up jig according to Embodiment 3;

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor chip pick-up jig, a semiconductor chip pick-up device, and a pick-up jig adjustment method according to an embodiment of the present invention will be described with reference to the drawings. The same reference numerals are given to the same or corresponding components, and repetition of description may be omitted.

Embodiment 1.
FIG. 1 is a side view of manufacturing apparatus 100 according to Embodiment 1. FIG. The manufacturing apparatus 100 has a table 5 . A pickup device 1 is provided on the table 5 . A semiconductor wafer 2 having an adhesive sheet 4 attached to its back surface is mounted on a table 5. - 特許庁The semiconductor wafer 2 is separated into a plurality of semiconductor chips by dicing. A plurality of semiconductor chips are placed on a table 5 after dicing and picked up from an adhesive sheet 4 using a pick-up device 1 .

FIG. 2 is a cross-sectional view for explaining the structure of the pickup device 1 according to the first embodiment. A pickup device 1 includes a pickup jig 9 and a positioning holder 10 . An opening 10 a is formed in the top surface of the positioning holder 10 . The positioning holder 10 holds the pickup jig 9 inside the opening 10a. A positioning holder 10 determines the position of the pickup jig 9 .

A plurality of semiconductor chips 3 are attached to the upper surface of the adhesive sheet 4 . The adhesive sheet 4 is mounted on the upper surface of the positioning holder 10 so as to cover the opening 10a. Positioning holder 10 holds semiconductor chip 3 provided on the upper surface of adhesive sheet 4 .

A pickup jig 9 has a needle holder 8 and a plurality of needles 6 . The needle holder 8 has a plurality of needle holes formed on its upper surface. A plurality of needles 6 are inserted into a plurality of needle holes, respectively. A plurality of needles 6 each protrude upward from the upper surface of the needle holder 8 . The needle holder 8 supports the needle 6 upright in the needle hole. In this embodiment, the plurality of needles 6 includes needles 6a to 6c, which will be described later.

The positioning holder 10 holds the pick-up jig 9 with the plurality of needles 6 facing upward. One of the plurality of semiconductor chips 3 is provided directly above the opening 10a. At this time, the semiconductor chip 3 is arranged so as to face the plurality of needles 6 .

The pickup device 1 has a driving section 40 . The drive unit 40 moves the pickup jig 9 up and down. The drive unit 40 moves the pick-up jig 9 in the direction of arrow 61 . Further, as will be described later, the pickup device 1 includes a suction unit that sucks the space in which the pickup jig 9 moves.

FIG. 3 is a plan view of the pickup jig 9 according to Embodiment 1. FIG. A pickup jig 9 has nine needles 6 . The number of needles 6 that the pickup jig 9 has may be plural. Further, in this embodiment, the plurality of needles 6 are arranged in a cross shape. The arrangement of the plurality of needles 6 is not limited to this.

FIG. 4 is a side view of the pickup jig 9 according to Embodiment 1. FIG. FIG. 5 is a diagram illustrating the structure of the pickup jig 9 according to the first embodiment. The pick-up jig 9 includes needle tip position adjusting means, which will be described later. The needle tip position adjusting means individually adjusts the height of the tip position of the needle 6 projecting from the needle holder 8 .

In this embodiment, the height of the tip position of the needle 6a provided in the central portion of the needle holder 8 among the plurality of needles 6 is the lowest. Further, the tip position of the needle 6c provided on the outer peripheral portion of the needle holder 8 is the highest. Further, the height of the tip position of the needle 6b provided between the needles 6a and 6c is higher than the needle 6a and lower than the needle 6c. The height of the tips of the needles 6 is adjusted lower toward the center.

The needle holder 8 has a top surface and a back surface facing the top surface. A plurality of needle holes 7 pass through the needle holder 8 from the upper surface to the rear surface. A plurality of needles 6 are inserted into a plurality of needle holes 7, respectively. A plurality of needles 6 each protrude upward from the upper surface of the needle holder 8 .

Also, the pickup jig 9 includes an adjusting portion holder 12 . The adjuster holder 12 has a first surface facing the rear surface of the needle holder 8 and a second surface facing the first surface. The adjusting portion holder 12 is formed with a plurality of adjusting portion holes 20 penetrating from the first surface to the second surface. The plurality of adjusting portion holes 20 are connected to the plurality of needle holes 7 respectively.

The adjustment member 13 is inserted into each adjustment portion hole 20 from the second surface side. The adjusting member 13 has an upper end protruding from the first surface of the adjusting part holder 12 into the needle hole 7 communicating with the adjusting part hole 20 . A lower end portion of the adjusting member 13 protrudes downward from the second surface of the adjusting portion holder 12 . The length of the portion of the adjusting member 13 protruding into the needle hole 7 can be changed from the second surface side of the adjusting portion holder 12 . In this embodiment, the adjusting member 13 is a screw.

In this embodiment, the adjusting portion holder 12 and the adjusting member 13 provided on the adjusting portion holder 12 in communication with the needle hole 7 correspond to the needle tip position adjusting means. The lower end of the needle 6 and the upper end of the adjusting member 13 are in contact with each other. The adjusting member 13 rotates in the direction indicated by the arrow 62 while being pressed against the bottom surface 14 of the needle 6 . Thereby, the length of the portion of the adjusting member 13 inside the needle hole 7 is adjusted. Accordingly, the height of the tip position of the needle 6 is adjusted in the direction indicated by the arrow 63. FIG.

6A and 6B are diagrams for explaining a method for adjusting the pickup jig 9 according to the first embodiment. A method for adjusting the height of the tip position of the needle 6 will be described with reference to FIG. First, the needle adjuster 15 is brought into contact with the pick-up jig 9 . The needle adjuster 15 contacts the pick-up jig 9 from above.

The needle adjuster 15 has a facing portion that faces the tips of the needles 6 . Specifically, the needle adjuster 15 has a main portion 15a and a first portion 16b and a second portion 16a projecting downward from the main portion 15a. The second portion 16a protrudes downward from the first portion 16b.

Next, the needle tip position adjusting means is used to adjust the height of the needles 6 so that the tips of the plurality of needles 6 are all in contact with the needle adjuster 15 . That is, the adjusting member 13 is used to adjust the heights of the tip positions of the plurality of needles 6 . As a result, the upper end of the needle 6a and the second portion 16a of the plurality of needles 6 are brought into contact with each other, and the upper end of the needle 6b and the first portion 16b are brought into contact with each other. Also, the upper end of the needle 6c and the rear surface of the main portion 15a are in contact with each other.

As a result, the length of the portion of the needle 6a that protrudes from the upper surface of the needle holder 8 can be made shorter than the length of the portion that protrudes from the upper surface of the needle holder 8 of the needle 6b. Also, the length of the portion of the needle 6b that protrudes from the upper surface of the needle holder 8 can be made shorter than the length of the portion that protrudes from the upper surface of the needle holder 8 of the needle 6c.

Next, the needle 6 is fixed to the needle holder 8 . 7A and 7B are diagrams illustrating a method of fixing the needle 6 according to Embodiment 1. FIG. Each needle 6 is provided with a needle fixing screw 24 . A needle fixing screw 24 is provided on the side surface of the needle holder 8 . The needle 6 is fixed to the needle holder 8 by turning the needle fixing screw 24 in the direction indicated by the arrow 65 .

FIG. 8 is a diagram for explaining the method of manufacturing the semiconductor chip 3 according to the first embodiment. The semiconductor wafer 2 is separated into a plurality of semiconductor chips 3 by dicing. After dicing, each semiconductor chip 3 is picked up from the adhesive sheet 4 by the pickup device 1 . After that, the process shifts to the mounting process, and the semiconductor chip 3 is commercialized.

The pickup device 1 includes a suction unit 41 that sucks the inside of the opening 10a. The pressure-sensitive adhesive sheet 4 is attracted to the pickup jig 9 and the positioning holder 10 by sucking the inside of the opening 10 a with the suction portion 41 as indicated by an arrow 64 . The pickup device 1 lifts the pickup jig 9 by the driving section 40 while sucking the adhesive sheet 4 . At this time, the pickup jig 9 moves to a position where the needle 6 lifts the adhesive sheet 4 and the semiconductor chip 3 . In this state, the semiconductor chip 3 is separated from the adhesive sheet 4 by an adsorption section (not shown) and transferred.

In this embodiment, the needles 6b and 6c holding the outer peripheral portion of the semiconductor chip 3 are higher than the needle 6a holding the central portion. Therefore, the corner portions of the semiconductor chip 3 attached to the adhesive sheet 4 are peeled off by the needles 6b and 6c. Next, the central portion of the semiconductor chip 3 is peeled off by the needle 6a. As a result, the semiconductor chip 3 can be picked up from the adhesive sheet 4 .

Consider a case in which a plurality of needles have the same height in a pickup device. In this case, the semiconductor chip may be pushed up by the needle arranged in the central portion of the semiconductor chip before the corner portion of the semiconductor chip is peeled off. At this time, there is a risk that the stress due to the push-up of the needle will concentrate on the central portion of the semiconductor chip. Therefore, penetration or cracks may occur in the center of the semiconductor chip. Such damage tends to become a problem especially in a semiconductor chip thinned to, for example, 100 μm or less.

In contrast, in the present embodiment, the needle 6 provided inside is lower than the needle 6 provided outside. Therefore, the adhesive sheet 4 can be peeled off from the corners of the semiconductor chip 3 toward the center. Therefore, damage to the semiconductor chip 3 can be suppressed.

In this way, when picking up a thinned semiconductor chip, it is important to manage the height of the needles arranged in the outer peripheral portion and the central portion of the semiconductor chip. Here, the needle height is preferably adjusted according to the thickness and size of the semiconductor chip. However, it is generally difficult to adjust the height of a plurality of needles for each needle.

On the other hand, the pickup jig 9 of the present embodiment includes needle tip position adjusting means capable of individually adjusting the height of the tip position of the needle 6 . Therefore, the height of each needle 6 can be easily adjusted according to the shape of the semiconductor chip 3 . Therefore, it is not necessary to prepare a plurality of pickup jigs 9 for each shape of the semiconductor chip 3 . Therefore, convenience can be improved.

Moreover, since the screw is provided as the adjustment member 13, the tip position of the needle 6 can be easily adjusted by moving the screw up and down.

Moreover, by using the needle adjuster 15, the height of the plurality of needles 6 can be adjusted collectively with high accuracy. Therefore, highly accurate height adjustment can be easily performed. Therefore, damage to the semiconductor chip 3 can be easily suppressed.

FIG. 9 is a side view of needle adjuster 215 according to a modification of Embodiment 1. FIG. FIG. 9 is an enlarged view of the needle adjuster 215 around the second portion 16a. The needle adjuster 215 includes a sensor 217 that detects contact between the plurality of needles 6 and the needle adjuster 215 . A plurality of sensors 217 are provided at portions of the needle adjuster 215 that come into contact with the plurality of needles 6 . That is, the sensors 217 are provided on the portions of the first portion 16b, the second portion 16a, and the back surfaces of the main portion 15a that face the needle 6, respectively.

Thereby, the contact between the needle adjuster 215 and the needle 6 can be clarified. Therefore, adjustment of the height of the needle 6 can be facilitated. Also, the height adjustment of the needle 6 can be made with high accuracy.

Also, in this embodiment, the height of the needle 6 is adjusted in three steps. Not limited to this, the plurality of needles 6 may include needles 6 having different heights. For example, the height of the needle 6 may be adjusted in two steps or four steps or more. Further, the shape of the needle adjuster 15 is determined according to the target height of the plurality of needles 6 .

These modifications can be appropriately applied to a semiconductor chip pick-up jig, a semiconductor chip pick-up device, and a pick-up jig adjusting method according to the following embodiments. It should be noted that the semiconductor chip pick-up jig, the semiconductor chip pick-up apparatus, and the method for adjusting the pick-up jig according to the following embodiments have many points in common with the first embodiment. will be mainly explained.

Embodiment 2.
10A and 10B are diagrams for explaining the structure of the pickup jig 309 according to the second embodiment. In this embodiment, at least one of the needle holes 7 is provided with an elastic member 319 . The elastic member 319 is, for example, a spring. The elastic member 319 is provided between the adjusting portion holder 12 and the needle 306 inside the needle hole 7 . A lower end of the elastic member 319 is provided on the first surface of the adjuster holder 12 . Also, the upper end of the elastic member 319 contacts the bottom surface of the needle 306 . The elastic member 319 connects the needle 306 and the adjuster holder 12 . Elastic member 319 exerts an elastic force on needle 306 .

The needle 306 has a wide portion 351 provided inside the needle hole 7 and a needle portion 352 that is narrower than the wide portion 351 and protrudes upward from the upper surface of the needle holder 8 . The needle 306 is inserted into the needle hole 7 so as to be vertically movable.

An adjusting member 313 is provided directly below the needle 306 . The adjusting member 313 is inserted into an elastic member 319, for example.

FIG. 11 is a diagram illustrating a state in which the needle 306 is lowered. The needle 306 moves downward while receiving an elastic force from the elastic member 319 due to the semiconductor chip 3 being mounted thereon. At this time, as shown in FIG. 11, needle 306 can be lowered to a position where it contacts adjusting member 313 . Therefore, the height of the tip position of the needle 306 is determined by the contact between the bottom surface of the needle 306 and the adjusting member 313 to limit the stroke of the needle 306 .

FIG. 12 is a side view of pickup jig 309 according to the second embodiment. A plurality of adjusting members 313 are inserted into the plurality of adjusting portion holes 20 respectively. A first needle hole in which the elastic member 319 is provided among the plurality of needle holes 7 is provided in the central portion of the plurality of needle holes 7 . The elastic member 319 is not provided in the second needle holes other than the first needle holes among the plurality of needle holes. In the second needle hole, the adjustment member 313 and the needle 306 inserted into the second needle hole are in contact.

12, the first needle 306a provided in the central portion of the needle holder 8 is supported by the elastic member 319. As shown in FIG. Further, the elastic member 319 is not provided on the second needle 306b provided on the outer peripheral portion of the needle holder 8. As shown in FIG. The second needle 306b is in contact with the adjusting member 313 as in the first embodiment.

In addition, when the semiconductor chip 3 is not mounted, the tips of the plurality of needles 306 are aligned. Without being limited to this, in a state where the semiconductor chip 3 is not mounted, the tip of the needle 306 in the central portion of the needle holder 8 may be lower than the tip of the needle 306 in the outer peripheral portion. Moreover, the heights of the plurality of adjusting members 313 from the first surface of the adjusting portion holder 12 may be different from each other.

In this embodiment, the needle tip position adjusting means is provided with an adjusting member 313 and an elastic member 319 . When the semiconductor chip 3 is mounted on the plurality of needles 306 , the needles 306 are pressed against the central portion of the semiconductor chip 3 with elastic force. At this time, the central needle 306 descends while receiving elastic force from the elastic member 319 according to the shape of the semiconductor chip 3 . As a result, the stress applied to the central portion of the semiconductor chip 3 due to the push-up of the needle 306 can be suppressed. Therefore, damage such as cracking of the semiconductor chip 3 at the start of pickup can be suppressed.

Also, the lower limit of the tip position of the needle 306 is restricted by the contact between the needle 306 and the adjusting member 313 . Therefore, it is possible to prevent the needle 306 from excessively descending and damaging the semiconductor chip 3 . Therefore, damage to the semiconductor chip 3 can be further suppressed.

It should be noted that the needle 306 may or may not be in contact with the adjusting member 313 when the semiconductor chip 3 is mounted on the pickup jig 309 .

Further, in the present embodiment, by mounting the semiconductor chip 3 on the pickup jig 309, the needle 306 is supported by the elastic member 319 and the height of the needle 306 changes. Therefore, it is not necessary to strictly adjust the height of the needle 306 as compared with the configuration in which the height of the needle 306 is fixed. Also, the stroke of the needle 306 can be easily adjusted by the adjusting member 313 . Therefore, damage to the semiconductor chip 3 can be easily suppressed.

Further, the height of the needle 306 on the outer peripheral portion is fixed. As a result, the adhesive sheet 4 can be peeled off from the corners of the semiconductor chip 3 toward the center, as in the first embodiment. As a modification of this, the elastic members 319 may be provided in all the needle holes 7 . In this case also, the adhesive sheet 4 can be peeled off from the corners of the semiconductor chip 3 toward the center by lowering the needles 306 along the curve of the semiconductor chip 3 as shown in FIG.

Moreover, in this embodiment, the elastic member 319 and the adjusting member 313 are independent. Therefore, even if the length of the portion of the adjusting member 313 protruding into the needle hole 7 changes, the elastic force of the elastic member 319 does not change. Therefore, the stroke of the needle 306 and the elastic force of the elastic member 319 can be adjusted separately, and the pick-up jig 309 can be easily adjusted.

Also, the adjusting member 313 is, for example, a screw. As a result, the lower limit of the tip position of the needle 306 can be easily defined by moving the screw up and down. Also, the lower limit of the tip position of the needle 306 can be easily finely adjusted. The adjustment member 313 is not limited to a screw, and any member that protrudes into the needle hole 7 and can limit the stroke of the needle 306 may be used.

In this embodiment, the adjusting member 313 is inserted into the elastic member 319 . Alternatively, the elastic member 319 may be provided beside the adjusting member 313 .

13A and 13B are diagrams illustrating the structure of a pickup jig 409 according to the first modification of the second embodiment. A projection prevention mechanism 425 is provided on the upper surface of the needle holder 8 . The pop-out prevention mechanism 425 has an opening narrower than the wide portion 351 of the needle 306 at a position overlapping the opening 10a. In this embodiment, the wide portion 351 of the needle 306 and the jump-out prevention mechanism 425 serve as stoppers. Therefore, it is possible to prevent the needle 306 from coming off. Therefore, it is possible to prevent the semiconductor chip 3 from being damaged by starting pickup without noticing that the needle 306 has come off.

FIG. 14 is a diagram illustrating the structure of a pickup jig 509 according to a second modification of the second embodiment. The needle holder 508 may be integrated with the pop-out prevention mechanism. The needle holder 508 may be formed such that the width of the needle hole 7 on the upper surface is narrower than the wide portion 351 of the needle 306 .

Further, as the material of the needle 306, it is preferable to select a cemented carbide that is resistant to deterioration or breakage even when the semiconductor chip 3 is pushed up repeatedly. Moreover, the wide portion 351 of the needle 306 may be formed by cutting the needle 306 itself.

FIG. 15 is a diagram illustrating the structure of a pickup jig 609 according to the third modification of the second embodiment. The pickup jig 609 has a height adjusting portion 613 . The height adjuster 613 adjusts the height of the lower end of the elastic member 319 from the first surface of the adjuster holder 12 . The height adjustment part 613 is, for example, a screw. The elastic member 319 is attached to the height adjustment portion 613 .

The height adjustment part 613 is inserted into the adjustment part holder 12 from the second surface side of the adjustment part holder 12 . The length of the portion of the height adjusting portion 613 protruding inside the needle hole 7 can be adjusted from the second surface side of the adjusting portion holder 12 . The height of the elastic member 319 from the first surface of the adjusting portion holder 12 can be adjusted by adjusting the length of the portion of the height adjusting portion 613 that protrudes into the needle hole 7 . Thereby, the height of the needle 306 can be adjusted.

Embodiment 3.
16A and 16B are diagrams for explaining the structure of the pickup jig 709 according to the third embodiment. In this embodiment, a stroke adjuster 723 is provided instead of the plurality of adjusters 313 . The stroke adjuster 723 has a plurality of adjusting members 713 a and 713 b and a connecting portion 726 . The plurality of adjusting members 713 a and 713 b are connected to each other by a connecting portion 726 on the second surface side of the adjusting portion holder 12 . The plurality of adjustment members 713 a and 713 b are fitted with the plurality of adjustment portion holes 20 .

The plurality of adjustment members 713a and 713b include a first adjustment member and a second adjustment member whose height from the first surface of the adjustment portion holder 12 is different from that of the first adjustment member. Thereby, the stroke range can be adjusted for each needle 306 .

In this embodiment, a stroke adjuster 723 is provided in the needle tip position adjusting means. Therefore, it is possible to collectively adjust the lowering range of the plurality of needles 306 . Therefore, adjustment time can be shortened. Further, by exchanging the stroke adjuster 723 according to the thickness and size of the semiconductor chip 3, various semiconductor chips 3 can be easily handled.

Various exemplary embodiments and examples have been described in the foregoing embodiments. Various features, aspects, and functions described in one or more embodiments are not limited to apply to any particular embodiment, but can be applied to embodiments singly or in various combinations. is. Accordingly, numerous variations not illustrated are envisioned within the scope of the technology disclosed herein. For example, when at least one component is modified, added, or omitted, and at least one component is extracted and combined with the components of other embodiments. do.

1 pickup device, 2 semiconductor wafer, 3 semiconductor chip, 4 adhesive sheet, 5 table, 6, 6a to 6c needle, 7 needle hole, 8 needle holder, 9 pickup jig, 10 holder, 10a opening, 12 adjustment unit holder, 13 adjustment member 14 bottom surface 15 needle adjuster 15a main part 16a second part 16b first part 20 adjustment part hole 24 needle fixing screw 40 drive part 41 suction part 100 manufacturing device 215 needle Adjustment Tool 217 Sensor 306 Needle 306a First Needle 306b Second Needle 309 Pickup Jig 313 Adjusting Member 319 Elastic Member 351 Wide Part 352 Needle Part 409 Pickup Jig 425 Jumping Prevention Mechanism , 508 needle holder, 509, 609 pickup jig, 613 height adjuster, 709 pickup jig, 713a, 713b adjustment member, 723 stroke adjuster, 726 connecting portion

Claims (15)

a needle holder having a top surface and a back surface facing the top surface, and having a plurality of needle holes penetrating from the top surface to the back surface;
a plurality of needles inserted into the plurality of needle holes and projecting upward from the upper surface of the needle holder;
It has a first surface facing the back surface of the needle holder and a second surface facing the first surface. an adjuster holder having an adjuster hole connected to the needle hole;
inside the first needle hole and between the adjustment unit holder and a first needle among the plurality of needles inserted into the first needle hole in a vertically movable state; an elastic member that exerts an elastic force on the needle;
an adjusting member inserted into the adjusting portion hole, protruding into the first needle hole from the first surface of the adjusting portion holder, and provided immediately below the first needle;
A pickup jig for a semiconductor chip, comprising: 2. The jig for picking up a semiconductor chip according to claim 1, wherein said first needle can be lowered to a position contacting said adjusting member. 3. The jig for picking up a semiconductor chip according to claim 1, wherein a lower end of said elastic member is provided on said first surface of said adjusting portion holder. 3. The semiconductor chip pick-up jig according to claim 1, further comprising a height adjusting portion for adjusting the height of the lower end of the elastic member from the first surface. a lower end portion of the adjusting member protrudes downward from the second surface of the adjusting portion holder;
5. The length of the portion of the adjusting member protruding into the first needle hole can be changed from the second surface side of the adjusting portion holder. semiconductor chip pick-up jig. 6. The jig for picking up a semiconductor chip according to claim 1, wherein said adjusting member is a screw. The first needle has a wide portion provided inside the first needle hole, and a needle portion narrower than the wide portion and protruding upward from the upper surface of the needle holder,
7. The jig for picking up a semiconductor chip according to claim 1, wherein the width of said first needle hole on said upper surface of said needle holder is narrower than said wide portion. 8. The jig for picking up a semiconductor chip according to claim 1, wherein the first needle hole is provided in a central portion of the plurality of needle holes. A plurality of the adjusting portion holes are formed in the adjusting portion holder,
9. The semiconductor chip pick-up jig according to claim 1, wherein a plurality of said adjusting members are inserted into said plurality of adjusting portion holes respectively. 10. The semiconductor chip pickup jig of claim 9, wherein the plurality of adjustment members are connected to each other on the second surface side of the adjustment portion holder. 10. The plurality of adjustment members include a first adjustment member and a second adjustment member whose height from the first surface of the adjustment portion holder is different from that of the first adjustment member. 11. A jig for picking up semiconductor chips according to 10 above. the plurality of adjusting portion holes are connected to the plurality of needle holes, respectively;
12. The adjusting member and the needle inserted into the second needle hole are in contact with each other in a second needle hole other than the first needle hole among the plurality of needle holes. 1. A semiconductor chip pick-up jig according to claim 1. a pickup jig according to any one of claims 1 to 12;
a positioning holder having an opening formed in its upper surface and holding the pick-up jig inside the opening with the plurality of needles facing upward;
a driving unit for moving the pickup jig up and down;
a suction unit that sucks the inside of the opening;
with
A pickup device, wherein an adhesive sheet having a plurality of semiconductor chips attached thereto is mounted on the upper surface of the positioning holder so as to cover the opening. A pickup jig comprising a needle holder having a top surface formed with a plurality of needle holes, and a plurality of needles inserted into the plurality of needle holes and protruding upward from the top surface of the needle holder. A needle adjuster having a portion and a second portion projecting downward from the first portion is brought into contact from above, the upper end of the first needle of the plurality of needles is brought into contact with the first portion, and the plurality of needles is in contact with the first portion. contacting the upper end of the second needle with the second portion, the length of the portion of the second needle protruding from the upper surface of the needle holder is reduced to the length of the portion of the needle holder of the first needle A method for adjusting a pickup jig, characterized in that the length of the portion protruding from the upper surface is made shorter than that of the portion. 15. The pick-up jig adjustment method according to claim 14, wherein the needle adjuster comprises a sensor for detecting contact between the plurality of needles and the needle adjuster.

Images