KR101165034B1 - Pick up head and flip chip bonder having the same - Google Patents
Pick up head and flip chip bonder having the same Download PDFInfo
- Publication number
- KR101165034B1 KR101165034B1 KR20070119233A KR20070119233A KR101165034B1 KR 101165034 B1 KR101165034 B1 KR 101165034B1 KR 20070119233 A KR20070119233 A KR 20070119233A KR 20070119233 A KR20070119233 A KR 20070119233A KR 101165034 B1 KR101165034 B1 KR 101165034B1
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- chip
- support
- pick
- unit
- magnet
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The present invention provides a pickup head and a flip chip bonder having the same. The pick-up head is installed on the support, the support is movable in a direction away from or close to the chip pick-up unit for picking up the semiconductor chip, and the magnetic force against the external force applied when the external force is applied to the chip pick-up unit And first and second magnets respectively provided in the support and the chip pick-up unit so as to exert an elastic force. Therefore, according to the present invention, since the first magnet and the second magnet are installed to be spaced apart from each other in the pickup head and are provided to face the same polarity, even when a minute external force is applied to the chip pickup part for picking up the semiconductor chip, It is possible to exert elastic force by magnetic force against external force. Therefore, according to the present invention, it is possible to mitigate and absorb the shock applied to the semiconductor chips during the pickup of the semiconductor chips by the elastic force exerted as described above.
Flip chip, bonder
Description
The present invention relates to a pickup head and a flip chip bonder having the same, and more particularly, to a pickup head for picking up and transferring a semiconductor chip separated into a predetermined size and a flip chip bonder having the same.
In general, a semiconductor manufacturing process includes a Fab (FAB) process for forming a plurality of semiconductor chips on a semiconductor wafer, and a plurality of semiconductor chips formed in the fab process separately, and the separated semiconductor chips are individually packaged ( package) assembly process.
In addition, the assembly process includes a wafer mounting process in which an adhesive tape is attached to the back side of the wafer to prevent the semiconductor chips from being separated when the wafer is sawed, and a plurality of semiconductors in the wafer mounted using a diamond cutter. A wafer sawing process of separating the chips into individual pieces, and a chip bonding process of picking up the separated semiconductor chips and bonding them to a printed circuit board.
Among the above processes, the chip bonding process is performed by bonders. The bonders include die bonders, wire bonders, and flip chip bonders. Typically, die bonders and wire bonders are used continuously, and flip chip bonders are used separately.
Here, the die bonder refers to a device for picking up a semiconductor chip (also referred to as a 'die') manufactured by a semiconductor chip manufacturing process and bonding the printed circuit board to the printed circuit board. The wire bonder refers to an electrode and a semiconductor chip bonded by the die bonder. Refers to a device for bonding leads formed on a circuit board to each other with wires such as gold wires. In addition, the flip chip bonder forms a separate solder bump on a pad, which is an input / output terminal of the semiconductor chip, and then flips the semiconductor chip to turn a circuit pattern such as a carrier substrate or a circuit tape. A device that bonds directly to (Pattern).
Meanwhile, in order for the bonding operations of the semiconductor chips to be smoothly performed by the bonders, the picking operations of the semiconductor chips should be performed smoothly.
However, the pick-up operation of the semiconductor chips bonded to the adhesive tape may not be smooth due to the adhesive force of the adhesive tape.
Therefore, the semiconductor chip pick-up apparatus which picks up the semiconductor chips smoothly from the adhesive tape and picks up these semiconductor chips is used. .
1 shows an example of a conventional semiconductor chip pickup device.
Referring to FIG. 1, a conventional semiconductor chip pick-
Accordingly, a portion of the
On the other hand, the thickness of the semiconductor chips formed on the semiconductor wafer by the fab process according to the development of the process technology is getting thinner and thinner, it is fixed to the
Therefore, the
However, in the coil spring as described above, it is very difficult to adjust the elastic force to the
In addition, in the case of the air cylinder, a regulator is required to adjust the elastic force, and thus, the mechanism is complicated and expensive. In addition, the initial slip is unnatural, that is, a stick slip phenomenon occurs. There is a problem that it is very difficult to control to exert the elastic force against the external force.
Accordingly, the present invention has been made in view of the above problems, and a problem to be solved by the present invention is a pickup head capable of exerting elastic force against fine external forces in order to alleviate and absorb shocks applied to semiconductor chips and the same. It is to provide a flip chip bonder provided.
In addition, another problem to be solved by the present invention is to provide a pickup head and a flip chip bonder having the same easy to adjust the size of the elastic force.
According to the first aspect of the present invention for solving the above problems, a pickup head is provided. The pickup head includes a support; A chip pick-up unit installed on the support, the chip pick-up unit being installed to be movable in a direction away from or close to the support; And first and second magnets respectively provided to the support and the chip pick-up unit so as to exert an elastic force by magnetic force with respect to the applied external force when an external force is applied to the chip pick-up unit.
In another embodiment, the first magnet and the second magnet may be installed to be spaced apart at regular intervals facing each other, the polarities may be installed to face the same polarity.
In another embodiment, the support may be provided with a set screw for adjusting the distance between the first magnet and the second magnet.
In another embodiment, a vacuum hole may be formed at one end of the chip pick-up unit to suck the semiconductor chip by vacuum, and a vacuum line may be connected to a side of the chip pick-up unit to provide a vacuum to the vacuum hole. have.
In another embodiment, the pickup head may further include a rotary motor connected to the support to rotate the support so that the semiconductor chip picked up by the chip pick-up unit is flipped.
On the other hand, according to the second aspect of the present invention for solving the above problems, there is provided a flip chip bonder. The flip chip bonder may include a wafer stage on which a wafer having a plurality of separated semiconductor chips is seated; A bonding head for bonding the semiconductor chips to a substrate or a circuit tape; And a flip head which picks up the semiconductor chip provided on the wafer on the wafer stage and flips the picked up semiconductor chip to the bonding head. The flip head is installed on the support, the support is movable in a direction away from or close to the chip pick-up unit for picking up the semiconductor chip, and the magnetic force against the external force applied when the external force is applied to the chip pick-up unit And first and second magnets respectively provided in the support and the chip pick-up unit so as to exert an elastic force.
According to the present invention, since the first magnet and the second magnet, which are installed to be spaced apart from each other on the pickup head and are provided to face the same polarity, are provided with a chip pick-up part for picking up the semiconductor chip, even when a minute external force is applied, the external force is applied to the external force. The elastic force by the magnetic force can be exerted. Therefore, according to the present invention, by the elastic force exerted as described above it is possible to mitigate and absorb the shock applied to the semiconductor chips during the pickup of the semiconductor chips it is possible to prevent the breakage of the semiconductor chips.
In addition, the pickup head according to the present invention is provided with a set screw to adjust the distance between the magnets spaced apart from each other, that is, the distance between the first magnet and the second magnet. Therefore, the worker or the like can very easily adjust the magnitude of the elastic force exerted by the magnetic force through the set screw or the like.
Hereinafter, with reference to the accompanying Figures 2 to 5 will be described in detail preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments disclosed herein are being provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Like numbers refer to like elements throughout.
2 is a perspective view showing an embodiment of a flip chip bonder according to the present invention.
2, a
The
In addition, the
The
In addition, a
The
In addition, a
The
In other words, the pick-up
The
Hereinafter, the
3 is an enlarged view of portion A of FIG. 2, FIG. 4 is an exploded perspective view of the pickup head shown in FIG. 3, and FIG. 5 is a side view of the pickup head shown in FIG. 4.
3 to 5, the
Specifically, the
In addition, a
In one embodiment, the
In addition, when an external force is applied to the chip pick-up
The
Therefore, when an external force is applied to the chip pick-up
At this time, the
That is, the
On the other hand, a
Accordingly, the installation position of the
As a result, the distance between the
In other words, the distance G between the
In addition, a
Accordingly, a vacuum is provided to the
Hereinafter, the bonding method of the
First, when a
Next, when the
Subsequently, when the alignment of the
In this case, when the
However, the pick-up
As mentioned above, although the present invention has been described with reference to the illustrated embodiments, it is only an example, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. For example, the present invention has been described using a flip chip bonder as an equipment having a pickup head as an example, but this is only an example, and the pickup head according to the present invention may be applied and mounted to various equipment in addition to the flip chip bonder. . Therefore, the scope of the present invention should be defined by the appended claims and their equivalents.
1 is a cross-sectional view showing an example of a conventional semiconductor chip pickup device.
2 is a perspective view showing an embodiment of a flip chip bonder according to the present invention.
FIG. 3 is an enlarged view of a portion A of FIG. 2.
4 is an exploded perspective view of the pickup head shown in FIG. 3.
5 is a side view of the pickup head shown in FIG. 4.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070119233A KR101165034B1 (en) | 2007-11-21 | 2007-11-21 | Pick up head and flip chip bonder having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070119233A KR101165034B1 (en) | 2007-11-21 | 2007-11-21 | Pick up head and flip chip bonder having the same |
Publications (2)
Publication Number | Publication Date |
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KR20090052627A KR20090052627A (en) | 2009-05-26 |
KR101165034B1 true KR101165034B1 (en) | 2012-07-13 |
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KR20070119233A KR101165034B1 (en) | 2007-11-21 | 2007-11-21 | Pick up head and flip chip bonder having the same |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US9196521B2 (en) * | 2012-11-05 | 2015-11-24 | Infineon Technologies Ag | Adjustable pick-up head and method for manufacturing a device |
CN107507789A (en) * | 2017-08-03 | 2017-12-22 | 宁波尚进自动化科技有限公司 | One kind rotation grain-clamping table |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003264207A (en) * | 2002-03-11 | 2003-09-19 | Matsushita Electric Ind Co Ltd | Weighting method by voice coil motor, component mounting device thereby, and voice coil motor used therefor |
JP2003347389A (en) | 2002-05-23 | 2003-12-05 | Hitachi High-Tech Instruments Co Ltd | Moving apparatus for semiconductor chip |
JP2007142332A (en) * | 2005-11-22 | 2007-06-07 | Shibaura Mechatronics Corp | Apparatus and method for mounting electronic component |
-
2007
- 2007-11-21 KR KR20070119233A patent/KR101165034B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003264207A (en) * | 2002-03-11 | 2003-09-19 | Matsushita Electric Ind Co Ltd | Weighting method by voice coil motor, component mounting device thereby, and voice coil motor used therefor |
JP2003347389A (en) | 2002-05-23 | 2003-12-05 | Hitachi High-Tech Instruments Co Ltd | Moving apparatus for semiconductor chip |
JP2007142332A (en) * | 2005-11-22 | 2007-06-07 | Shibaura Mechatronics Corp | Apparatus and method for mounting electronic component |
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KR20090052627A (en) | 2009-05-26 |
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