JP4257072B2 - Substrate fixing device and fixing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate fixing apparatus and a fixing method for fixing a substrate used for manufacturing an electronic component to a holding jig.
[0002]
[Prior art]
Hereinafter, fixing of a substrate used when manufacturing an electronic component, which is conventionally performed, will be described. Here, the fixing of the substrate when the sealed substrate as the substrate is cut will be described as an example. A plurality of semiconductor chips (hereinafter referred to as chips) mounted on a circuit board such as a printed circuit board or a lead frame are sealed with resin, and then the sealed substrate is cut to form a package including chips. To be done. At the time of this cutting, it is necessary to fix the sealed substrate to a holding jig such as a stage. Conventionally, a method of fixing a sealed substrate and a holding jig through a double-sided tape, or a method of adsorbing a sealed substrate by an adsorption port provided in the holding jig is used.
[0003]
[Problems to be solved by the invention]
However, in recent years, there has been an increasing trend toward an increase in the number of electronic components that can be obtained based on a request for cost reduction, an increase in the size of a circuit board, and a reduction in the thickness of a package based on a request for a lighter, thinner, and smaller electronic device. As a result, the following problems occur. First, the increase in the size of the circuit board acts to increase the amount of warpage. Secondly, the thinning of the package causes the thinning of the sealed substrate, which reduces the rigidity of the sealed substrate. Therefore, warpage is likely to occur in the sealed substrate. For these reasons, there is a possibility that the warped sealed substrate cannot be stably fixed to the holding jig in the conventional fixing of the sealed substrate by double-sided tape or suction. If the sealed substrate is cut in this state, chattering occurs on the sealed substrate due to the vibration of the cutting blade, so that the dimensional accuracy of the package is lowered and chipping may occur at the end of the package. . In the worst case, the blade may be damaged.
[0004]
Similarly, the diameter of a wafer as a substrate is being increased from the viewpoint of increasing the number of electronic components to be taken. Therefore, even when the wafer on which the circuit pattern is formed is cut, a problem due to warping may occur. Furthermore, a so-called wafer level package method is also used in which after wiring and protruding electrodes are formed on a wafer, resin sealing is performed collectively and the wafer in that state, that is, a sealed substrate is cut. Even in this case, when the sealed substrate is cut, a problem due to warpage may occur.
[0005]
Similarly, based on the viewpoint of increasing the number of electronic components that can be obtained, the size of a circuit board that is a target to which a chip is mounted, that is, a target that is die-bonded or flip-chip bonded, has been increased. Yes. In this case, there is a possibility that problems due to warpage may occur in the step of mounting the chip, the step of wire bonding to the mounted chip, the step of cutting the sealed substrate, and the like.
[0006]
Also, based on the viewpoint of improving the efficiency of the inspection process, a sealed substrate in a wafer level package or a sealed substrate in which a plurality of chips are encapsulated in a large circuit board at once are packed together by a prober. Inspection methods are also used. In this case, the electrical connection becomes unstable due to the warp, and there is a possibility that the problem that the reliability of the inspection is lowered may occur.
[0007]
The present invention has been made to solve the above-described problems, and corrects the warpage of a substrate used when manufacturing an electronic component, and stably fixes the substrate to a holding jig. An object of the present invention is to provide a substrate fixing device and a fixing method.
[0008]
[Means for Solving the Problems]
In order to solve the above technical problem, a substrate fixing device according to the present invention is a substrate used in the manufacture of electronic components, each of which corresponds to an electronic component and is divided by a plurality of virtual lines. A substrate fixing device for fixing a substrate to a holding jig while correcting the warp of the substrate when processing is performed on the substrate having a region of the substrate. holding means for holding and pressing means for fixing the substrate with correcting warp in one or more regions of interest of the process by pressing the edge portion of the substrate held, the end portion of the substrate in pressing hand stage A plurality of pressing members provided so as to be independently movable along the edge, and the pressing means is moved forward and backward toward the end of the substrate, and the pressing means is moved along the edge of the substrate. Moving hand The plurality of pressing members include two pressing members that press the end portions of the substrate on both sides of one or more regions to be processed, and the substrate against the two pressing members. And another two pressing members that are opposed to each other and press the end portion of the substrate .
[0009]
According to this, when the substrate is warped, the warp is corrected by pressing the end portion of the substrate. Therefore, the substrate is processed in a state where the warp is corrected and fixed. Further, when processing is performed on one substrate, the end of the substrate can be pressed at a desired position where the processing is not hindered. Therefore, the substrate is processed in a state where the warp is corrected by pressing the end of the substrate.
[0010]
The substrate fixing apparatus according to the present invention is characterized in that, in the above-described fixing device, the process is a process of cutting the substrate at one virtual line among a plurality of virtual lines .
[0011]
According to this, when the substrate is warped, the warp is corrected by pressing the end of the substrate. Therefore, the substrate is cut in a state where the warp is corrected and stably fixed.
[0012]
Further, for the purpose of solving the above technical problem, a substrate fixing method according to the present invention is a substrate used in the manufacture of electronic components, each corresponding to an electronic component and separated by a plurality of virtual lines. When fixing a substrate having a plurality of regions, the substrate is fixed to the holding jig while correcting the warp of the substrate, and the substrate is held by the holding jig. a step of a first step of fixing the substrate with correcting warp in one or more regions of interest of the process by pressing the edge of the substrate with a pressing means in the desired position on the substrate, is pressed A step of releasing the pressing after performing predetermined processing on the substrate, a step of moving the pressing means to another position on the substrate, and pressing the end of the substrate by the pressing means at the other position And a second step of fixing the substrate while correcting warpage in one or a plurality of regions to be processed, and in both of the first step and the second step of fixing the substrate, It is characterized in that the edge of the substrate is pressed at two places on both sides of one or a plurality of regions to be processed and at two other places facing the two places with the substrate sandwiched therebetween .
[0013]
According to this, when the substrate is warped, the warp is corrected by pressing the end portion of the substrate. Therefore, it is possible to perform processing on a substrate in which the warp is corrected and fixed. In addition, when processing a substrate, it is possible to press the end of the substrate at a desired position where the processing is not hindered. Accordingly, the substrate can be processed in a state where the warp is corrected by pressing the end of the substrate. Even when the position where the processing is not hindered differs depending on the type of the substrate, the pressing means is moved to these different positions. Therefore, even when the types of the substrates are different, the substrate can be processed in a state where the warpage of the substrate is corrected.
[0014]
The substrate fixing method according to the present invention is characterized in that, in the above-described fixing method, the process is a process of cutting the substrate at one virtual line among a plurality of virtual lines .
[0015]
According to this, when the substrate is warped, the warp is corrected by pressing the end of the substrate. Therefore, the substrate can be cut in a state where the warp is corrected and stably fixed.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a substrate fixing apparatus according to the present invention will be described with reference to FIG. Here, the fixing of the substrate when performing the cutting as the process on the sealed substrate as the substrate will be described as an example. FIG. 1 is a perspective view schematically showing a situation when a sealed substrate as a substrate is cut, omitting a substrate fixing device according to the present invention.
[0017]
As shown in FIG. 1, a sealed substrate 1 to be cut as a process includes a circuit board 2 made of a printed board or a lead frame on which a plurality of chips (not shown) are mounted, and a sealing resin. 3. The circuit board 2 is virtually provided with a dicing line 4 indicating a scheduled cutting position. A portion surrounded by each dicing line 4 is a package region 5 corresponding to each package after cutting.
[0018]
A jig for transporting a package, that is, the nest 6 includes a side wall 7 provided in a lattice shape, and a storage space 8 that is a quadrilateral space surrounded by the side wall 7 and that stores a package (not shown). Have. In FIG. 1, a part of the nest 6 is omitted in order to avoid a complicated drawing.
[0019]
The platform 9 is used in combination with the nest 6 and is a holding jig that sucks and holds the package, and is fixed to a quadrilateral table 10 that is rotatably provided. Moreover, in the platform 9, the adsorption | suction part 11 is a convex part which adsorb | sucks and hold | maintains each package. The recess 12 is a suction space provided on the upper surface of the suction portion 11. The suction port 13 is an opening provided in the recess 12 and is a holding means that sucks and holds the package connected to the vacuum pump 15 via the suction pipe 14. Between the adsorbing portions 11, a gap 16 in which each side wall 7 of the nest 6 is disposed is provided.
[0020]
The cutting mechanism 17 is a cutting means including a rotating shaft 18 and a blade 19 fixed to the rotating shaft 18. The cutting mechanism 17 cuts the sealed substrate 1 by moving toward the sealed substrate 1 attracted to the platform 9 by a drive mechanism (not shown) while the blade 19 rotates.
[0021]
A substrate fixing device and a fixing method according to the present invention used when cutting the sealed substrate 1 of FIG. 1 will be described with reference to FIGS. FIGS. 2A and 2B are cross-sectional views respectively showing a state before and after fixing a sealed substrate when the substrate fixing device according to the present invention is used. is there. 3A and 3B show a state in which the sealed substrate is fixed and cut when the substrate fixing device according to the present invention is used, and the state in which the cutting of the sealed substrate is completed. FIG.
[0022]
As shown in FIG. 2A, a slide rail 20 is provided in the board fixing device according to the present invention. Although omitted in order to avoid complication of the drawing, the slide rail 20 is attached to a table 10 that is rotatably provided so as to be parallel to each side of the table 10. Two slide members 21 are respectively attached to one slide rail 20. Further, a pressing member 22 is attached to each sliding member 21. The head 23 of each pressing member 22 protrudes toward the table 10. The lower surface of the head 23 is parallel to the ideal sealed substrate 1 adsorbed by the platform 9, that is, the upper surface of the sealed substrate 1 without warping.
Here, each sliding member 21 is configured to be movable along the slide rail 20 by a drive mechanism (not shown). Further, in each sliding member 21, each pressing member 22 can be moved forward and backward toward the table 10 by another driving mechanism (not shown), and can be raised and lowered by another driving mechanism (not shown). It is configured.
[0023]
The operation of the substrate fixing apparatus according to the present invention will be described with reference to FIGS. First, as shown in FIG. 2A, the warped sealed substrate 1 is placed on a platform 9 which is a holding jig.
[0024]
Next, as shown in FIG. 2A, the sliding member 21 is moved along the slide rail 20 so that the head 23 presses away from the portion of the dicing line 4 to be cut. Thereby, each pressing member 22 is horizontally moved to a position where the head 23 is pressed by avoiding a portion to be cut in the sealed substrate 1. Here, the part nearest to the center part among the dicing lines 4 in the sealed substrate 1 is first cut.
Thereafter, each pressing member 22 is lowered and the warped sealed substrate 1 is pressed against the platform 9 by the respective heads 23. Thereby, the curvature of the sealed substrate 1 is corrected. Further, the rotating blade 19 is horizontally moved to a position just above the portion of the dicing line 4 to be cut.
[0025]
Next, as shown in FIG. 2B, the sealed substrate 1 is sucked and held by each suction port 13 through the suction pipe 14 using the vacuum pump 15. Thereby, the sealed substrate 1 is fixed to the platform 9 in a state where the warp is corrected. Thereafter, the sealed substrate 1 is cut along the dicing line 4 by lowering the blade 19.
[0026]
Next, as shown in FIG. 3A, the blade 19 is raised, horizontally moved to a position just above another dicing line 4 near the center, and lowered. Then, the dicing line 4 is sequentially cut from the portion closest to the center portion without moving the pressing member 22. In FIG. 3A, the sealed substrate 1 is cut at the two dicing lines 4 without moving the pressing member 22.
[0027]
Next, as necessary, the blade 19 is raised and the pressing member 22 is raised while adsorbing and holding the sealed substrate 1. Then, the pressing member 22 is horizontally moved to a position where it is pressed while avoiding a portion to be cut next in the sealed substrate 1 and lowered. Thereby, the sealed substrate 1 is fixed to the platform 9 in a state where the warpage is corrected again.
Thereafter, the blade 19 is horizontally moved to a position immediately above the portion of the uncut dicing line 4 that is closest to the center portion, and is lowered. Then, the pressing member 22 is not moved, and the dicing line 4 that is not cut is sequentially cut from the portion near the center. Hereinafter, in a state where the sealed substrate 1 is attracted and held, the pressing by the pressing member 22, the cutting by the blade 19, the release of the pressing, and the movement of the pressing member 22 are repeated. Finally, the sealed substrate 1 is cut at the dicing line 4 closest to the end of the sealed substrate 1. Thereby, in the sealed substrate 1, the cutting of all the dicing lines 4 is completed along the direction from the front side to the back side in FIG.
[0028]
Next, the blade 19 is raised while adsorbing and holding the sealed substrate 1. In this state, the table 10 of FIG. 1 is rotated by 90 °. Thus, preparations for cutting the dicing line 4 orthogonal to the cut dicing line 4 are made.
[0029]
Thereafter, similarly to the case shown in FIGS. 2B and 3A, the sealed substrate 1 is sequentially cut from the portion of each dicing line 4 closest to the central portion. As a result, the sealed substrate 1 is cut and separated into packages each of which includes the package regions 5, so that the cutting of the sealed substrate 1 is completed.
[0030]
Next, as shown in FIG. 3 (B), each package 24 constituted by cutting each package region 5 in FIG. While raising, the pressing member 22 is raised. In this state, the outermost end portion of the sealed substrate 1 that has been pressed by the pressing member 22 is dropped by being cut off.
After that, as shown in FIG. 3B, the suction to the sealed substrate 1 is released and the nest 6 is raised. As a result, each package 24 is held in the accommodating portion 8 of the nest 6 shown in FIG. 3A and is transported to the next process, for example, a cleaning process.
[0031]
Here, when the sealed substrate 1 is cut, it is preferable to first cut a portion close to the center portion of each dicing line 4 and sequentially cut toward the end portion. The reason is as follows. First, the stress generated by correcting the warpage of the sealed substrate 1 by first cutting the dicing line 4 at the center is reduced in the sealed substrate 1 after cutting. . As a result, the influence of stress on the electrical connection between the chip (not shown) and the circuit board 2 can be reduced. Secondly, by cutting the dicing line 4 close to the end portion lastly, the effect of correcting the warp of the sealed substrate 1 can be maintained until the end.
[0032]
As described above, according to the present invention, when the sealed substrate 1 is warped, the warp is corrected by pressing the end of the sealed substrate 1. Therefore, the sealed substrate 1 is cut in a state where the warp is corrected and stably fixed.
Further, even when the position of the dicing line 4 varies depending on the type of the substrate 1 that has been sealed, that is, when the position that does not interfere with cutting is different, the pressing member 22 that is the pressing means is moved to these different positions. . Therefore, even when the type of the sealed substrate 1 is different, the warped warp is corrected and the sealed substrate 1 is cut in a state of being stably fixed.
[0033]
In the above description, the structure for adsorbing the sealed substrate 1 as the holding means and the pressing member 22 as the pressing means are combined. Not only this but the structure which adhere | attaches and hold | maintains the sealed board | substrate 1 with a double-sided tape as a holding means, and you may combine the pressing member 22. FIG. In this case, when the warp is corrected by pressing the sealed substrate 1, the sealed substrate 1 moves so as to shift in the adhesive layer portion of the double-sided tape. Then, the pressed sealed substrate 1 is stably fixed in a state where the warp is corrected.
[0034]
Moreover, after correcting the curvature by pressing the sealed substrate 1, the sealed substrate 1 was adsorbed. Not limited to this, by appropriately determining the suction force at the time of suction, first, the aligned sealed substrate 1 is sucked and held on the platform 9 which is a holding jig, and then, The warp may be corrected by pressing the sealed substrate 1 using the pressing member 22.
[0035]
In addition, the nest 6 as a transfer jig is used for transferring the package 24. Instead of this, each package 24 may be sucked individually or collectively and transferred to a separately provided tray without providing the nest 6.
[0036]
Further, as the processing for the substrate, the processing for cutting the sealed substrate 1 constituted by the circuit substrate 2 made of a printed circuit board, a lead frame or the like and the sealing resin 3 has been described as an example. The present invention is not limited to this, and the substrate, that is, the silicon wafer, can be fixed by applying the present invention when performing the process of cutting the silicon wafer. In addition, when the wiring and protruding electrodes are formed on the silicon wafer and then the resin is sealed together and the sealed substrate is cut, the present invention is applied to the sealed substrate. Can also be fixed. That is, the present invention can also be applied to so-called wafer level packages.
[0037]
Further, as a process for the substrate, when performing a process of die bonding or flip chip bonding of the chip to the circuit board, the present invention can be applied to fix the circuit board. In addition, when performing the process of wire bonding in a state where the chip is mounted on the circuit board, the circuit board can be fixed by applying the present invention.
[0038]
Furthermore, when a silicon wafer, a sealed substrate or the like is electrically inspected using a prober, the present invention can be applied to fix the substrates.
[0039]
Further, the present invention is not limited to the above-described embodiment, and can be arbitrarily changed and selected as necessary within a range not departing from the gist of the present invention.
[0040]
【The invention's effect】
According to the present invention, the end portion of the held substrate is pressed. Thereby, when the substrate is warped, the warp is corrected. Therefore, the substrate is processed in a state where the warp is corrected and fixed.
Even when the position where the processing is not hindered differs depending on the type of the substrate, the pressing means is moved to these different positions. Therefore, even if the types of the substrates are different, when the substrate is warped, the substrate is processed in a state where the warp is corrected and fixed.
Therefore, the present invention provides a substrate fixing device and a fixing method for correcting warpage of a substrate used when manufacturing an electronic component and stably fixing the substrate to a holding jig. It has an excellent practical effect.
[Brief description of the drawings]
FIG. 1 is a perspective view schematically showing a state when cutting a sealed means as a substrate, omitting a substrate fixing device according to the present invention.
2 (A) and 2 (B) show a state before fixing a sealed substrate and a state after fixing when a substrate fixing device according to the present invention is used. It is sectional drawing shown, respectively.
FIGS. 3A and 3B show a state in which a sealed substrate is fixed and cut when a substrate fixing device according to the present invention is used, and It is sectional drawing which shows the state which complete | finished cutting | disconnection, respectively.
[Explanation of symbols]
1 Sealed substrate (substrate)
2 Circuit board 3 Sealing resin 4 Dicing line 5 Package area 6 Nest 7 Side wall 8 Receiving part 9 Platform (holding jig)
10 Table 11 Adsorption part 12 Concave part 13 Suction port (holding means)
14 Piping for suction 15 Vacuum pump 16 Gap 17 Cutting mechanism 18 Rotating shaft 19 Blade 20 Slide rail (moving means)
21 Sliding member (moving means)
22 Pressing member (pressing means)
23 Head 24 Package (electronic component)

Claims (4)

When processing is performed on a substrate used in the manufacture of an electronic component and having a plurality of regions each corresponding to the electronic component and separated by a plurality of virtual lines, the warp of the substrate is corrected. A substrate fixing device for fixing the substrate to the holding jig,
Holding means provided in the holding jig for holding the substrate;
A pressing means for correcting the warp in one or a plurality of the areas to be processed by pressing an end of the held substrate and fixing the substrate ;
A plurality of pressing members provided so as to be independently movable along the edge of the substrate in the pressing means;
A moving means for moving the pressing means toward the end of the substrate so as to be movable forward and backward, and moving the pressing means along the end of the substrate;
The plurality of pressing members include two pressing members that press the end portions of the substrate on both sides of the one or more regions to be processed, and the substrate against the two pressing members. A substrate fixing device comprising two other pressing members that are opposed to each other and press an end of the substrate. The board fixing device according to claim 1,
The substrate fixing apparatus , wherein the process is a process of cutting the substrate along one virtual line of the plurality of virtual lines . While processing a substrate used in the manufacture of an electronic component and having a plurality of regions corresponding to the electronic component and separated by a plurality of virtual lines, while correcting the warp of the substrate A substrate fixing method for fixing the substrate to a holding jig,
Holding the substrate in the holding jig;
A first step of correcting a warp in one or a plurality of the regions to be processed and fixing the substrate by pressing an end of the substrate by a pressing unit at a desired position on the substrate ;
Releasing the pressing after performing a predetermined process on the pressed substrate;
Moving the pressing means to another position on the substrate;
And a second step of fixing the substrate while correcting a warp in one or a plurality of the regions to be processed by pressing an end portion of the substrate by the pressing means at the other position. ,
In both of the first step and the second step of fixing the substrate, two positions on both sides sandwiching one or a plurality of the regions to be processed and opposite the two positions with the substrate interposed therebetween A method for fixing a substrate , comprising pressing the end of the substrate at two other locations . In the fixing method of the board | substrate of Claim 3,
The substrate fixing method according to claim 1, wherein the process is a process of cutting the substrate along one virtual line of the plurality of virtual lines .

Images