JP2002093857A - Mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To precisely mount an element on a substrate. SOLUTION: A plate spring 1 is deformed by applying a force. A head 3 adsorbs the element via the plate spring 1. A voice coil motor 4 is constituted of a magnet 41, a magnetic circuit 42, and a coil 43. The magnet 41 and the magnetic circuit 42 are disposed, so as to sandwich the coil 43. the magnetic circuit 42 generates a magnetic field, which penetrates the coil 43 by being supplied with a current. The coil 43 is made to move in the vertical directions by a force generated due to interaction of the supplied current and the penetrating magnetic field, which is generated by the magnetic circuit 42, so as to move the head 3 vertically. Also, the coil 43 is not brought into direct contact with the magnet 41 or with the magnetic circuit 42. A control section 6 changes the current applied to the coil 43 and presses the plate spring 1 by moving the coil 43 (head 3), so as to dispose the element in parallel with the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a mounting apparatus for mounting an element on a substrate.

[0002]

2. Description of the Related Art When manufacturing electronic components (semiconductor devices and the like), various elements must be positioned and mounted with high precision at predetermined positions on a substrate. Thus, for example,
If the lower surface of the element and the upper surface of the substrate are not parallel, one surface must be aligned with the other surface so that they are parallel to each other.

A mounting apparatus provided with the above-described sliding control mechanism is disclosed in Japanese Patent Application Laid-Open No. 57-37842. As shown in FIG. 4, the mounting apparatus (bonding apparatus) disclosed in Japanese Patent Application Laid-Open No. 57-37842 includes a hemispherical ball 101 and a ball receiver 102 combined with the ball 101. A mechanism 110 is provided.

[0004] The copying mechanism 110 slides the ball 101 along the receiving surface 103 of the ball receiver 102 in accordance with the pressure applied by the head (bonding tool) 105, thereby changing the mounting surface 121 on which the element is mounted. It is arranged on the tool surface 122 for sucking the substrate.

In addition to the above, there are mounting apparatuses as disclosed in JP-A-63-89230 and JP-A-2-62059.

[0006] The mounting apparatus disclosed in Japanese Patent Application Laid-Open No. 63-89230 has a copying mechanism composed of a spherical rotor and a casing for holding the rotor. The rotor is rotatable in all directions of 360 ° in a horizontal plane along the spherical surface in the casing, and can be tilted slightly along the spherical surface in the casing. A guide groove for moving a slider connected to a hand holding the element in a horizontal direction is formed in the rotor.

When a component (element) held by the hand is combined (mounted) with a component arranged at a predetermined position, the position and inclination of the component held by the hand are moved to a predetermined position by moving a slider and a rotor. The parts have been adapted.

The mounting apparatus disclosed in Japanese Patent Application Laid-Open No. 2-62059 is provided with a copying mechanism composed of a spherical sliding portion and a spherical sliding portion support for supporting the spherical sliding portion. The spherical sliding part has an IC chip mounted thereon and moves along the spherical surface of the spherical sliding part support, thereby providing an IC.
Tilt the tip surface. As a result, the surface of the IC chip is leveled with the lower surface of the tool descending on the IC chip. However, the spherical sliding portion does not rotate in the horizontal plane.

[0009]

However, Japanese Patent Laid-Open No.
Since the ball 101 of the copying mechanism disclosed in Japanese Patent No. 37842 is freely moved along the receiving surface 103 of the ball receiver 102, while the element and the substrate are aligned,
There is a case where the mounting surface 121 and the tool surface 122 are not parallel. Also, when the mounting surface 121 and the tool surface 122 are made parallel after the element and the substrate are aligned, the position of the element and the substrate is changed while the mounting surface 121 is aligned with the tool surface 122. It may be off.

Further, the ball 101 is connected to a ball receiver 102.
, The friction between the ball 101 and the ball receiver 102 occurs. For this reason, it is difficult to perform high-precision parallel alignment using the copying mechanism disclosed in this publication. In particular, when the radius of curvature of the ball 101 is small and the frictional force between the ball 101 and the ball receiver 102 is larger than the rotational force of the ball 101, the ball 101 does not slide even when receiving the pressure from the head 105.

In other words, the ball 101 is
In order to slide under the pressure from
Must be at least a certain size and weight,
The ball receiver 102 associated therewith must be configured larger than that. However, as a result, the size of the entire mounting apparatus becomes large and heavy.
If the mounting device is large and heavy, it becomes impossible to arrange a plurality of mounting devices on one substrate, and it is difficult to improve the production efficiency. Furthermore, an increase in the size and weight of the mounting apparatus leads to an increase in the cost of the semiconductor device and a decrease in the production amount.

Further, since the ball 101 and the ball receiver 102 are in contact with each other, it is impossible to absorb an impact when the element and the substrate come into contact with each other. For this reason, the element may be damaged by the impact at the time of contact.

Similarly, in the copying mechanism disclosed in Japanese Patent Application Laid-Open No. 63-89230, the rotor is configured to rotate freely with respect to the casing.
Since the slider is configured to freely move in the rotor in the horizontal direction, misalignment between the element and the substrate is likely to occur. Further, since friction occurs between the rotor and the casing and between the rotor and the slider, it is difficult to perform parallel alignment with high precision.

In the copying mechanism disclosed in Japanese Patent Application Laid-Open No. 2-62059, the spherical sliding portion is in contact with the spherical surface of the spherical sliding portion support, as described above. Friction occurs with the moving part support. For this reason, it is difficult to perform parallel alignment with high accuracy.

As described above, when the spherical sliding portion is formed to have a certain size and weight or more to reduce the influence of friction, the entire mounting apparatus becomes large, so that a single board can be mounted. It becomes impossible to arrange a plurality of mounting devices in the same. For this reason, it is difficult to improve the production efficiency.

Accordingly, an object of the present invention is to provide a mounting apparatus for mounting an element on a substrate with high accuracy. Another object of the present invention is to provide a mounting device capable of reducing the cost of a semiconductor device and mass-producing it.

[0017]

In order to achieve the above object, a mounting apparatus of the present invention comprises a leaf spring that is deformed by applying a force and an element mounted at a predetermined position on a substrate. Suction means for suctioning via a spring, and pressing the leaf spring by moving the suction means, the surface of the element which the suction means contacts with the substrate is parallel to the surface of the substrate. Driving means to make it become
It is characterized by being comprised from. According to the present invention, the element can be mounted on the substrate with high accuracy.

[0018] The driving means may move the suction means without contacting the suction means.

The attracting means includes a coil to which a current is supplied, and the driving means generates a magnetic field penetrating the coil and moves the attracting means by changing the magnitude of the current flowing through the coil. May be.

The leaf spring is disposed outside the center area so as to surround the center area and a disk-shaped center area swingable with respect to the first rotation axis, and is orthogonal to the first rotation axis. A ring-shaped outer edge region swingable with respect to the second rotation axis;
May be provided.

[0021]

Next, a semiconductor device mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a semiconductor element mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view of the semiconductor element mounting apparatus taken along line AA of FIG.

FIGS. 1 and 2 show the semiconductor device mounting apparatus.
As shown in FIG. 1, the leaf spring 1, the ring 2, the head 3,
It comprises a voice coil motor 4, an arm 5, and a control unit 6.

The leaf spring 1 functions as a mechanism for eliminating the displacement between the bottom surface of the semiconductor element 8 and the top surface of the substrate 9 by being deformed. Specifically, the leaf spring 1 is deformed by the force applied by the voice coil motor 4 to make the bottom surface of the semiconductor element 8 and the top surface of the substrate 9 parallel. This leaf spring 1 is formed by processing a single leaf spring material, and as shown in FIG. 3, a center portion 11, an outer edge portion 12, and a connection portion 13
And deformation parts 14a and 14b. The leaf spring material is preferably made of a material having sufficient elasticity to function as a tracing mechanism and easily processed, for example, phosphor bronze for a spring.

The central portion 11 is a portion for adsorbing the semiconductor element 8, and is formed in a disk shape. The head 3 is mounted on one surface of the central portion 11, and the semiconductor element 8 is sucked on the other surface.

The outer edge portion 12 is formed in a ring shape so as to surround the center portion 11 and be concentric with the center portion 11. Further, the outer edge portion 12 is connected to the center portion 11 by two deformed portions 14a. Two deformation parts 14a
Are formed so as to face each other with respect to the center of the center portion 11. Thus, the center portion 11 and the outer edge portion 12 swing with each other about the two deformed portions 14a as rotation axes.

The connecting portion 13 is formed outside the outer edge portion 12 on a line orthogonal to a line connecting the two deformed portions 14a. The connecting portion 13 is connected to the outer edge portion 12 by two deformed portions 14b. The two deformed portions 14b are 2
It is arranged on a line orthogonal to a line connecting the two deformed portions 14a. Thus, the outer edge 12 and the connecting portion 13 swing with each other about the two deformed portions 14b as rotation axes.

The ring 2 is mounted on the outer edge 12 of the leaf spring 1 and suppresses deformation of the outer edge 12. Head 3
Is mounted on the center 11 of the leaf spring 1 and
The semiconductor element 8 is adsorbed through 1.

The voice coil motor 4 raises and lowers the head 3 according to a change in the supplied current, and applies a force to the leaf spring 1. As shown in FIG. 2, the voice coil motor 4 includes a magnet section 41, a magnetic circuit 42, and a coil 43.

The magnet section 41 includes a permanent magnet and the like, and is connected to the arm 5. The magnetic circuit 42 is arranged so as to sandwich the coil 43 together with the magnet unit 41, and is connected to the arm 5. The magnetic circuit 42 generates a magnetic field penetrating the coil 43 by being supplied with a predetermined current.

The coil 43 is connected to the head 3. The coil 43 moves up and down by the force generated by the interaction between the supplied current and the penetrating magnetic field generated by the magnetic circuit 42, and moves the head 3 up and down. Since the coil 43 is not in direct contact with the magnet unit 41 and the magnetic circuit 42,
The impact when the semiconductor element 8 and the substrate 9 come into contact can be absorbed.

The arm 5 is connected to the connection part 13 of the leaf spring 1 and the magnet part 41 and the magnetic circuit 42 of the voice coil motor 4. As a result, the connection portion 13 of the leaf spring 1 is fixed, and the center portion 11 and the outer edge portion 12 swing due to the force applied by raising and lowering the coil 43.

The control section 6 controls the operation of the head 3, the magnitude of the current supplied to the voice coil motor 4, the direction in which the current flows, and the like, and controls the operation of the entire semiconductor device mounting apparatus.

Next, a method for mounting the semiconductor element 8 on the substrate 9 using the semiconductor element mounting apparatus configured as described above will be described. The operations of the head 3 and the voice coil motor 4 are controlled by the control unit 6.

First, the control unit 6 controls the voice coil motor 4 to attract the semiconductor element 8 prepared at a predetermined position.
The magnitude of the current supplied to the coil 43 is changed, and the coil 43 is lowered. The magnitude of the supplied current and the direction in which the current flows are determined in advance so that the force applied to the coil 43 (leaf spring 1) of the coil 43 has a predetermined magnitude.

When the coil 43 descends, the head 3 pushes down the central portion 11 of the leaf spring 1 to make contact with the semiconductor element 8. At this time, since the leaf spring 1 has elasticity, it is curved. Thereafter, the head 3 sucks the semiconductor element 8.

After the head 3 attracts the semiconductor element 8, the control unit 6 changes the magnitude of the current supplied to the coil 43 and the direction of the current to return the head 3 to the original position, as described above. . Thereby, the leaf spring 1 is restored.

Next, the position of the semiconductor element 8 sucked by the head 3 is adjusted to a mounting position set on the substrate 9 in advance by a not-shown transfer device or the like. Subsequently, the control unit 6 changes the current supplied to the coil 43 of the voice coil motor 4 and lowers the coil 43 again as described above. Thereby, the head 3 descends and pushes down the central part 11 of the leaf spring 1. Then, the semiconductor element 8 and the substrate 9 come into contact with each other.

At this time, the deformed portions 14a and 14a of the leaf spring 1
When b is deformed and the center portion 11 and the outer edge portion 12 swing, the bias force applied to the surface of the semiconductor element 8 is absorbed. Thereby, the force applied to the surface of the semiconductor element 8 becomes uniform. Then, the angle of each connection surface between the semiconductor element 8 and the substrate 9 is corrected, and the semiconductor element 8 is mounted parallel to the substrate 9.

As described above, when the leaf spring 1 is deformed, the semiconductor element 8 can be pressed onto the substrate 9 with a constant pressure.

Since the magnet 43 and the magnetic circuit 42 constituting the voice coil motor 4 are not in contact with the coil 43, the semiconductor element 8 is not affected by frictional force when the semiconductor element 8 is pressed. In addition, it is possible to absorb an impact when the semiconductor element 8 comes into contact with the substrate 9. Therefore, damage to the semiconductor element 8 can be prevented.

Further, since the bias force applied to the semiconductor element 8 can be absorbed by both the leaf spring 1 and the voice coil motor 4, the semiconductor element 8 can be more accurately mounted in parallel with the substrate 9. it can. Also, at the time of alignment, the parallelism between the semiconductor element 8 and the substrate 9 is not sufficient,
Even when the shape of the semiconductor element 8 or the substrate 9 is defective, the semiconductor element 8 can be made to conform to the surface of the substrate 9.

Further, since the tracing mechanism can be constituted only by the leaf spring 1, the size and weight of the semiconductor device mounting apparatus can be reduced. As a result, the cost of the semiconductor device can be reduced.

Further, by realizing the miniaturization and weight reduction of the semiconductor element mounting device, a plurality of devices can be arranged. Therefore, a plurality of semiconductor elements can be mounted at the same time, and the production amount can be improved.

In the above-described embodiment, phosphor bronze for the spring is used as the material of the leaf spring 1. However, any material can be used as long as it can be easily processed and has sufficient elasticity.

In the above embodiment, the semiconductor element is pressurized by using the voice coil motor. However, if the semiconductor element can be moved up and down in a non-contact manner with the head holding the semiconductor element, the pressurization is performed. The method does not matter. For example, a linear motor or the like can be used.

The semiconductor device mounting apparatus of the present invention is not limited to the above embodiment, but includes various modifications and changes from the above embodiment.

[0047]

As described above, by using the mounting apparatus of the present invention, elements can be mounted on a substrate with high accuracy. Further, the cost of the semiconductor device can be reduced and mass production can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor device mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the semiconductor mounting device shown in FIG.

FIG. 3 is a plan view of a leaf spring included in the semiconductor device mounting apparatus shown in FIGS. 1 and 2;

FIG. 4 is a schematic diagram of a semiconductor manufacturing apparatus provided with a conventional copying mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Leaf spring 2 Ring 3 Head 4 Voice coil motor 5 Arm 6 Control part 11 Central part 12 Outer edge part 13 Connection part 14a Deformation part 14b Deformation part 41 Magnet part 42 Magnetic circuit 43 Coil

Claims (4)

[Claims] 1. A leaf spring which is deformed by applying a force, an adsorbing means for adsorbing an element mounted at a predetermined position on a substrate via the leaf spring, and a moving means for moving the adsorbing means. A driving means for pressing a leaf spring, and arranging the surface of the element on which the suction means is in contact with the substrate so as to be parallel to the surface of the substrate. Mounting equipment. 2. The apparatus according to claim 1, wherein said driving means moves said suction means without contacting said suction means.
4. The mounting device according to claim 1. 3. The attracting means includes a coil to which a current is supplied, and the driving means generates a magnetic field penetrating the coil and changes the magnitude of the current flowing through the coil, thereby causing the attracting means to change the magnitude of the current. The mounting device according to claim 2, wherein 4. A plate-shaped center region swingable with respect to a first rotation axis, said plate spring being disposed outside said center region so as to surround said center region. And a ring-shaped outer edge region swingable with respect to the second rotation axis orthogonal to the first rotation axis.
The mounting device according to the item.