JP5080861B2 - Pickup device and pickup method - Google Patents

Description

  The present invention relates to a pickup device and a pickup method capable of picking up a pickup object such as a semiconductor chip at high speed.

  Conventionally, an ultrasonic method or a thermocompression bonding method has been employed as a method for mounting a semiconductor chip such as an IC chip on a printed circuit board or the like. A large number of semiconductor chips arranged in a state of being cut out from a semiconductor wafer are directly attached to one side of an adhesive sheet and mounted on a ring-shaped gantry that is driven and controlled two-dimensionally. The semiconductor chips mounted on the gantry are picked up one by one by a pickup device and delivered to a crimping device (thermocompression bonding device or other crimping device).

  A general pickup device includes a push-up unit disposed below a gantry on which a semiconductor chip is mounted, and a pickup unit disposed above the gantry so as to face the pickup unit. It is described in Document 1. On the other hand, as a technique for increasing the pickup speed, there is a method in which a plurality of suction portions are provided in the main body of the pickup unit, and semiconductor chips are sucked one after another while rotating the pickup unit so that the plurality of suction portions are sequentially opposed to the frame. It is described in Patent Document 2.

  The push-up unit in the conventional pickup device includes a main body and a push-up pin provided on the main body, and the push-up pin is driven to reciprocate in the direction of the gantry by driving means such as a rotary motor or a cylinder. The pickup unit has a main body that reciprocates in the direction of the gantry by driving means such as a cylinder, and an adsorption part provided on the main body, and the adsorption part has a small-diameter cylinder that adsorbs the semiconductor chip at its tip. Yes. The internal space of the cylinder communicates with the vacuum device, and the semiconductor chip is adsorbed on the tip of the adsorbing portion by the suction force of the vacuum device. The gantry drive control, the push-up pin drive control, the pickup unit drive control, and the suction control are automatically controlled in cooperation with each other by a control means constituted by, for example, a computer device.

  In order to pick up semiconductor chips one by one with the above pickup device, first, a large number of semiconductor chips arranged on an adhesive sheet are aligned and mounted at a predetermined position on the mount, and the semiconductor chip to be picked up is picked up The gantry is driven two-dimensionally in the horizontal direction so as to move to the position. Next, the push-up pin is driven (raised) in the direction of the gantry, and the tip of the push-through pin passes through the adhesive sheet to contact the semiconductor chip.

  Next, the pickup unit is driven (lowered) in the direction of the gantry from above, and the semiconductor chip is adsorbed at the tip of the adsorbing portion. Next, the pickup unit that adsorbs the semiconductor chip is raised and then moved in the horizontal direction, and the adsorbed semiconductor chip is delivered to the crimping apparatus.

  As described above, when the semiconductor chip is sucked by the pickup unit, if there is a minute gap between the tip of the suction portion and the surface of the semiconductor chip, stable vacuum suction cannot be performed, so the tip of the suction portion and the surface of the semiconductor chip And must be brought into close contact with each other at a certain pressure at the time of contact. As a method for achieving such a close contact state, a method is generally employed in which a suction part is movably attached to a main body and a buffing spring is provided to push out the suction part in a direction in which the suction part protrudes from the main body. When the suction part of the pickup unit provided with such a buffing spring is brought into contact with the semiconductor chip, the suction part is pressed against the semiconductor chip with a predetermined pressure due to the repulsive action of the buffing spring.

Japanese Patent Laid-Open No. 2001-196442 JP 2004-172548 A

  The pickup unit that adsorbs the semiconductor chip performs reciprocal movement with respect to the gantry and reciprocal movement with respect to the crimping apparatus, and a plurality of directions are changed during the movement. In order to increase the pick-up speed of the semiconductor chip, it is necessary to speed up the movement of the pick-up unit, but if it is made too fast, the suction part attached to the pick-up unit via the buffing spring becomes unstable due to the spring vibration, The stability of the pick-up operation of the semiconductor chip and the delivery operation to the crimping device is impaired. For this purpose, it is desirable to set the pressing force of the buffing spring within a certain range so that the suction portion does not cause spring vibration.

  However, if the pressing force of the buffing spring is set in a very high range, the semiconductor chip may be damaged by the pressing force. For this reason, the pressing force by the buffing spring must be limited to a range that does not damage the semiconductor chip, so that the pickup speed can be increased only to a range corresponding thereto.

  On the other hand, the thickness of a conventional standard semiconductor chip (or the thickness of a wafer) is about 100 μ to 200 μ, but the thickness is decreasing year by year, and recently, the thickness of 30 μ or less has appeared. . Since such a thin semiconductor chip is low in strength, the pressing force of the buffing spring must be further reduced in order to cope with it, but the conventional technology has a limit in terms of stability.

  Furthermore, since the setting accuracy of the pressing force by the buffing spring cannot generally be so high, the pickup speed must be sacrificed to some extent in consideration of the safety factor at the time of setting. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a new pickup apparatus and pickup method for solving such problems.

The pickup device of the present invention that solves the above problems is
In a pickup apparatus comprising a push-up unit (2) and a pickup unit (3) arranged opposite to each other with a mount (5) on which a pickup object (4) is arranged,
The pickup unit (3) includes a main body (14) reciprocally driven in the direction of the gantry (5) by the position detection means (18) and the driving means (17), and an adsorption portion (15) provided on the main body (14). ,
The push-up unit (2) includes a push-up pin (9) that can be driven back and forth in the direction of the gantry (5) by the pressure detection means (12), the position detection means (13), and the drive means (11). The pressure detection means (12) is configured to detect the contact pressure between the tip and the pickup object (4),
The push-up unit (2) is driven by a drive means (11) by a linear motor so that the push-up pin (9) is driven in a direction approaching the gantry (5), and the encoder (13a) and the encoder glass scale (13b) while detecting the position by the position detecting means (13) by, the tip is contacted to the frame pickup object disposed in the (5) (4), by the contact pressure detection by the pressure detecting means (12), push-up It is detected that the tip of the pin (9) has contacted the pickup object (4), and based on the detection result, the drive operation of the push-up pin (9) is stopped or further moved by a predetermined distance before being driven. Stop the operation,
Then, in that state, the pickup unit (3) performs the position control by the position detection means (18) by the encoder (18a) and the encoder glass scale (18b) and the drive means (17) by the linear motor. Drive operation in the direction approaching the gantry (5) to bring the suction part (15) into contact with the pickup object (4), the contact pressure is detected by the pressure detection means (12), and based on the detection , Switch to pressure control (or torque control), adjust the driving force of the main body (14) so that the detected pressure becomes a preset value, and then pick up the pickup object (4) with the suction part (15) After the suction, the main body (14) is driven to move away from the gantry (5) (Claim 1).

In the above-described pickup device, the pickup unit includes a main body that is rotated by rotation driving means and two suction portions provided on the main body, and each time the main body rotates 180 degrees, the two suction portions alternately face the gantry. ( Claim 2 ).

Further, in any one of the above-described pickup devices, the pressure detection means (12) includes the Z direction contact pressure in the moving direction of the push-up unit (2), and two X direction contact pressures and Y direction contact pressures orthogonal to the moving direction. By detecting the three-component contact pressure, the presence of the X-direction contact pressure, the Y-direction contact pressure, or the value below the reference value of the Z-direction contact pressure can detect an abnormality in the push-up state of the push-up pin (9). It is comprised as follows ( Claim 3 ).

Furthermore, in any one of the pickup devices described above, when the pickup object is a semiconductor chip arranged on an adhesive sheet, the gantry includes a two-dimensional drive means for moving the semiconductor chip to be picked up to a pickup position, Position detection means for detecting the position of the gantry moved, and storage means for storing the contact pressure between the tip of the push-up pin and the semiconductor chip detected by the pressure detection means in association with the gantry position detected by the position detection means for each pickup ( Claim 4 ).

The pick-up method of the present invention that solves the above problems includes a pick-up device that includes a push-up unit (2) and a pick-up unit (3) that are arranged to face each other across a gantry (5) on which a pick-up object (4) is arranged. In the method of picking up the pickup object (4) using,
The pickup unit (3) includes a main body (14) reciprocally driven in the direction of the gantry (5) by the position detection means (18) and the driving means (17), and an adsorption portion (15) provided on the main body (14). ,
The push-up unit (2) has a pressure detection means (12), a position detection means (13), and a drive means (11), and includes a push-up pin (9) that can be driven back and forth in the direction of the gantry (5),
The push pin (9) approaches the gantry (5) while detecting the position by the drive means (11) by the linear motor and the position detection means (13) by the encoder (13a) and the encoder glass scale (13b). The tip of the push-up pin (9) is picked up by detecting the contact pressure by the pressure detection means (12) by bringing the tip into contact with the pickup object (4) placed on the gantry (5). Detecting contact with the object (4), and stopping the driving operation of the push-up pin (9) based on the detection result, or further stopping the driving operation after additional movement by a predetermined distance,
Next, in this state, the pickup unit (3) detects the position by position control of the position detection means (18) by the encoder (18a) and the encoder glass scale (18b) and the drive means (17) by the linear motor. The adhering portion (15) is brought into contact with the pickup object (4) in the direction approaching the gantry (5), and the contact pressure is detected by the pressure detecting means (12). Based on this, the control is switched to pressure control (or torque control), the driving force of the main body (14) is adjusted so that the detected pressure becomes a preset value, and then the pickup object (4) is picked up by the suction part (15). A pick-up method characterized by driving the main body (14) in a direction away from the gantry (5) after adsorbing the water (Claim 5).

6. The pick-up method according to claim 5, wherein, when the pick-up target is a semiconductor chip arranged on an adhesive sheet, the semiconductor chip to be picked up is moved to the pick-up position by driving the mount with a two-dimensional driving means. After that, the driving operation of the push-up pin is performed, and the contact pressure between the tip of the push-up pin detected by the pressure detection means and the semiconductor chip is stored in the storage means in association with the moved gantry position, and each stored contact pressure is displayed. The display is two-dimensionally by means (claim 6).

In the pickup device of the present invention, as described in claim 1, the pickup unit is provided with a suction portion in the main body that is reciprocated in the direction of the gantry by the position detection means and the drive means, and the push-up unit includes the pressure detection means , A detection means and a push-up pin that is reciprocated in the direction of the gantry by the drive means, and the pressure detection means detects the contact pressure between the tip of the push-up pin and the pickup object while detecting its position. Yes.

When configured as described above, the presence or absence of contact between the tip of the push-up pin and the pickup object (the presence or absence of contact pressure) can be detected by the pressure detection means, so that the drive of the push-up pin is stopped using the detection signal, and the pickup unit Can be controlled. Further, since the contact pressure between the suction portion and the pickup object can be detected by the same pressure detecting means, the pickup unit can be switched from position control to pressure control (or torque control) using the detection signal, and the device configuration is also improved. Simplify.
Further, the push-up unit and the pickup unit can be moved quickly and accurately moved to the final position, thereby preventing the pickup object from being damaged. That is, both units are driven by the linear motor driving means 11 and 17 and the position detecting means 13 and 18 by the encoders 13a and 18a and the encoder glass scales 13b and 18b. Is driven in the direction of approaching the gantry 5 and can be quickly moved to the vicinity of the target value. Next, the pressure detection means 12 can switch the pickup unit from position control to pressure control (or torque control) using the detection signal and accurately move to the target position.

  Furthermore, when such a pressure control method for the pickup unit is adopted, the pressing force from the suction portion to the pickup object can be set finely and with high accuracy without using a buffing spring that has been conventionally employed. . Therefore, the optimal pressing force suitable for the strength of the pickup object can be easily set.

In addition, the pressure detecting means that is relatively heavy compared to other peripheral members is not provided on the pickup unit side that adsorbs the pickup object and performs reciprocating movement to the gantry or the crimping device, but has a small moving distance and since provided with good push-up unit side without the transport of the pickup object can reduce the weight of the pick-up unit comprising a bottleneck in high-speed pickup, it is possible to achieve high speed of the pickup as a result.

Further, since the drive means for the main body and the drive means for the push-up pins are constituted by linear motors , the apparatus can be made more compact and lighter. In particular, the weight reduction of the pickup unit can greatly contribute to the speedup of the pickup.

In any one of the above-described pickup devices, as described in claim 2 , the pickup unit includes a main body that is rotated by a rotation driving unit and two suction portions provided on the main body, and each time the main body rotates 180 degrees. Two adsorption | suction parts can be comprised so that it may oppose a mount frame alternately. With this configuration, the pickup can be further speeded up. In the present invention, since the pressure detection means is provided on the push-up unit side as described above, the pickup unit can be rotated at a high speed, and the pickup speed can also be increased from that surface.

Furthermore, in any one of the above-described pickup devices, as described in claim 3 , the pressure detection means includes a Z direction contact pressure in the moving direction of the push-up unit, two X direction contact pressures orthogonal to the moving direction, and a Y direction contact. The three-component contact pressure consisting of the pressure can be detected. For example, if the adjustment of the alignment of the pickup object with respect to the gantry is defective, the push-up pin may not coincide with the center of the pickup object, and the picked-up pickup object may be inclined. However, if the pressure detecting means can detect the contact pressure of the three components, such an inclination can be detected from the contact pressure of the three components, so that the problem of the alignment adjustment can be easily corrected based on the detection result. .

In addition any of the above pickup device as claimed in claim 4, the pickup object when a semiconductor chip arranged on the adhesive sheet, the gantry moves the semiconductor chip to be picked up in the pickup position A position detecting means for detecting a position of the moved gantry, and a contact between the tip of the push-up pin detected by the pressure detecting means in association with the gantry position detected by the position detecting means and the semiconductor chip Storage means for storing the pressure for each pickup can be provided.

  A large number of semiconductor chips cut out from the disk-shaped semiconductor wafer are arranged on the adhesive sheet in the state of being cut out and mounted on the pedestal. For example, if the leveling adjustment of the pedestal is slightly shifted The contact pressure between the push-up pin and the semiconductor chip varies depending on the arrangement position of the semiconductor chips. However, if the storage means for storing the contact pressure between the tip of the push-up pin and the semiconductor chip detected by the pressure detection means in association with the gantry position as described above is stored for each pickup, the adjustment deviation is stored from the stored contact pressure distribution. You can check and fix it.

According to the pickup method of the present invention, as described in claim 5, the position detection means 13 and the drive means 11 are used to drive the push-up pin in a direction approaching the gantry and the pickup object is arranged on the gantry. By detecting the contact pressure by the pressure detection means, it is detected that the tip of the push-up pin has contacted the pickup object, and the drive operation of the push-up pin is stopped or further moved by a predetermined distance based on the detection result. Then stop the driving operation,
In this state, the pickup unit is driven in the direction approaching the gantry while the position is detected by the drive means 17 by the linear motor and the position detection means 18 by the encoder 18a and the encoder glass scale 18b. After the contact pressure is detected by the pressure detection means, the driving force of the main body is adjusted so that the detected pressure becomes a preset value, and then the pickup object is sucked by the suction portion It is characterized by driving the main body in a direction away from the gantry.

  By adopting such a pressure control method for the pickup unit, it is possible to set the pressing force from the suction portion to the pickup object with high accuracy without using a buffing spring that has been conventionally used. Therefore, it is possible to easily set an optimum pressing force suitable for the strength of the pickup object, and to speed up the pickup.

In the pickup method, as claimed in claim 6, when the pickup object is a semiconductor chip that is arranged on the adhesive sheet, by driving the frame in a two-dimensional drive unit, a semiconductor chip to be picked up Is moved to the pickup position to drive the push-up pin, and the contact pressure between the tip of the push-up pin and the semiconductor chip detected by the pressure detecting means is associated with the moved gantry position and stored in the storage means. Each contact pressure can be displayed two-dimensionally on the display means. If it does in this way, the adjustment shift | offset | difference etc. of the horizontal degree of a mount frame etc. can be confirmed from the memorize | stored contact pressure distribution, and it can correct.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings. FIG. 1 is an overall view schematically showing main parts of a pickup device according to the present invention, and FIG. 2 is a side view of a pickup portion in FIG. The pickup device 1 includes a push-up unit 2 and a pickup unit 3. The push-up unit 2 and the pickup unit 3 are arranged so as to face each other with the gantry 5 sandwiched between them when attached to a device base or a frame (not shown). The gantry 5 can detachably mount the pickup object 4, and FIG. 1 shows a state in which the semiconductor chips 4 a arranged on the adhesive sheet 6 are detachably mounted as an example of the pickup object 4. ing.

  The gantry 5 can be moved two-dimensionally in the XY directions by the two-dimensional driving means 7, and any of the pickup objects 4 attached to the gantry 5 by moving the gantry 5 two-dimensionally. Moved to the pickup position. The moving position of the gantry 5 is detected by position detecting means 8 such as an optical encoder, and the detection signal is transmitted to a control device described later.

  The push-up unit 2 has a shaft body 10 provided with a push-up pin 9 at the tip, and drive means 11 that reciprocates the shaft body 10 in the direction of the gantry. The drive means 11 is a linear motor (or voice coil motor (VCM)). It is configured. In the middle of the shaft body 10, a pressure detection means 12 for detecting the pressure applied to the push-up unit 2 and a position detection means 13 for detecting the moving position of the shaft body 10 are arranged. The position detecting means 13 has an optical encoder 13a and an encoder glass scale 13b, and detects the moving position of the shaft body 10 by detecting the scale of the encoder glass scale 13b with the encoder 13a. The signal is transmitted to a control device described later.

  In this embodiment, the pressure detecting means 12 is a quartz crystal capable of detecting a three-component pressure comprising a Z-direction contact pressure in the moving direction of the push-up unit 2 and two X-direction contact pressures and Y-direction contact pressures orthogonal to the moving direction. A piezoelectric pressure sensor is used. Commercially available products (for example, types 9251A and 9252A sold by Nippon Kistler Co., Ltd.) can be used as such a piezoelectric piezoelectric pressure sensor. The detection signal of the pressure detection means 12 is also transmitted to the control device described later.

  The push-up pin 9 has a truncated cone-shaped base portion 9a and a pin portion 9b extending from the base portion 9a in the axial direction. The cross-sectional shape of the A portion of the push-up pin 9 is shown in FIG. The push-up pin 9 is provided with a pin portion 9b at the center thereof, and a plurality of (six in this embodiment) suction holes 9c are arranged around the pin portion 9b. As shown in FIG. 1, these suction holes 9c communicate with a vacuum device (not shown) through a pipe 9d provided with a suction control valve 9e. As will be described later, when the semiconductor chip 4a supported on the adhesive sheet 6 as the pickup object 4 is pushed up from below by the push-up pin 9, the pin portion 9b penetrates the adhesive sheet 6 and the upper semiconductor chip 4a. At this time, the pressure-sensitive adhesive sheet 6 is sucked from below by the vacuum suction action of the suction holes 9c and is gripped.

  1 and 2, the pickup unit 3 includes a main body 14 and two suction portions 15 provided on the main body 14. The main body 14 is rotated by the rotation driving means 16, and the main body 14 attached to the rotation driving means 16 is reciprocated in the direction of the gantry 5 by the driving means 17 constituted by a linear motor (or voice coil motor). The two adsorbing portions 15 protrude from the opposite sides of the main body 14 and alternately face the gantry 5 every time the main body 14 rotates 180 degrees.

  The two adsorbing units 15 communicate with a vacuum device (not shown) via a pipe 15a provided with an adsorbing control valve 15b, respectively, and adsorb the pickup object 4 by an adsorbing action by vacuum. The rotation driving means 16 is provided with other driving means 19, and the rotation driving means 16 is driven by the driving means 19 so that the pickup object adsorbed on the adsorption portion 15 is delivered to a crimping device (not shown). . Note that FIG. 2 is shown with the upper suction portion 15 of FIG. 1 omitted.

  As shown in FIG. 2, the main body 14 is provided with position detecting means 18 including an optical encoder 18a and an encoder glass scale 18b, and the encoder 18a detects the scale of the encoder glass scale 18b to detect the scale of the main body 14. The movement position in the direction of the gantry 5 is detected, and the detection signal is transmitted to a control device described later. Although not shown in FIG. 2, angle detection means for detecting the rotation angle of the main body 14 can also be provided, and the detection signal is transmitted to a control device described later, and the rotation of the main body 14 is performed based on the detected value. Control can also be performed.

  FIG. 4 is a block diagram of a control device that controls the main part of the pickup device 1, and each detection means and drive means connected thereto. The control device 20 includes a computer device such as a personal computer, and includes a control unit 21, a storage unit 22, a display unit 23, an input unit 24, and interfaces 25 and 26.

  The control unit 21 controls each drive unit based on the control program and the detection signal from each detection unit. The storage unit 22 stores a control program and also stores a detection value by each detection unit, a control status of each drive unit, and the like. The display unit 23 is composed of a liquid crystal display, and displays detection values of each detection means stored in the storage unit 22, input information from the input unit 24, and the like. The input unit 24 includes a keyboard and a mouse, and inputs a start-stop command for the pickup device 1, initial conditions for control, necessary control parameters, and the like.

  The interface 25 is a signal between the control unit 21 and each detection means such as the pressure detection means 12 of the push-up unit 2, the position detection means 13 of the push-up unit 2, the position detection means 18 of the pickup unit 3, and the position detection means 8 of the mount 5. Provided to perform the conversion. The interface 26 includes a two-dimensional drive means 7 for the gantry 5, a drive means 11 for the push-up unit 2, a drive means 17 for the pickup unit 3, a rotation drive means 16 and a drive means 19, an adsorption control valve 9e for the push-up pin 9, and a pickup unit. 3 is provided to perform signal conversion between each drive means such as the adsorption control valve 15b of the adsorption unit 15 and the control valve 21 and the control unit 21.

Next, a method for picking up the semiconductor chip 4a, which is an object to be picked up, using the pickup device 1 will be described. First, a structure in which a large number of semiconductor chips 4a are arranged on a pressure-sensitive adhesive sheet 6 (semiconductor wafer) is aligned and mounted on the gantry 5 shown in FIG. Next, two-dimensional movement control of the gantry 5 for moving the semiconductor chip 4a to be picked up to the pickup position, movement control of the push-up unit 2, movement and suction control of the pickup unit 3 , etc. are sequentially performed. These controls are automatically performed according to a control program incorporated in the control device 20, and are repeatedly performed until all the pickups of the semiconductor chip 4a are completed.

  FIG. 5 is a diagram specifically showing the pick-up process of the semiconductor chip 4a. First, in step (a), the control device 20 controls the driving means 11 to move the push-up pin 9 of the push-up unit 2 in the direction of the gantry 5. When the push-up unit 2 moves and the tip of the push-up pin 9 (specifically, the tip of the pin portion 9b) penetrates the adhesive sheet 6 and comes into contact with the lower side of the semiconductor chip 4a, the contact pressure of the pressure detecting means 12 is increased. A detection signal is transmitted to the control device 20. Upon receiving the detection signal, the control device 20 performs a control to stop after further driving the driving means 11 for a preset minute distance.

  By this minute movement, the tip of the push-up pin 9 (tip of the pin portion 9b) comes into contact with the lower side of the semiconductor chip 4a with a preset contact pressure. At that time, the control device 20 opens the suction control valve 9e to control the suction hole 9c to be in a vacuum suction state, and grips the adhesive sheet 6 with the push-up pin 9 by the vacuum suction action, and the adhesive sheet of the semiconductor chip 4a. Helps peel from 6.

  Next, in step (b), the control device 20 controls the driving means 19 to move the pickup unit 3 in the direction of the gantry 5 and bring the tip of the suction portion 15 into contact with the upper side of the semiconductor chip 4a. Since the contact pressure due to this contact is also transmitted to the push pin 9 side, the contact pressure is indirectly detected by the pressure detecting means 12 and the detection signal is transmitted to the control device 20. Upon receiving the detection signal, the control device 20 opens the suction control valve 15b and controls the suction unit 15 to be in a vacuum suction state, and the semiconductor chip 4a is securely sucked to the suction unit 15 by the vacuum suction action.

  Next, in step (c), the control device 20 performs switching control of the drive means 19 from position control to pressure control (or torque control), and further drives the drive means 19 until a preset contact pressure is reached. Stop from.

  Next, in step (d), the control device 20 drives and controls the drive means 19 while maintaining the pressure control, that is, maintaining the contact pressure between the suction portion 15 and the semiconductor chip 4a at a preset value. Then, the pickup unit 3 is moved (raised) in a direction away from the gantry 5, and the driving means 11 is driven and controlled so as to follow the pickup unit 3 to move (raise) the push-up pin 9 in the gantry direction.

Next, in step (e), when the semiconductor chip 4a is separated from the adhesive sheet 6 due to the movement of the pickup unit 3, the control device 20 returns the drive control of the pickup unit 3 from pressure control to position control, and rises to a predetermined position. Then, the drive unit 19 is controlled to move the pickup unit 3 to the crimping device side. On the other hand, the control device 20 controls the driving means 11 to move (lower) the push-up pin 9 in the direction away from the gantry 5 to prepare for the next pickup operation.

  FIG. 6 is a diagram showing the movement of each part and the change in contact pressure in each step of FIG. 5, where the vertical axis represents the movement position or contact pressure, and the horizontal axis represents the elapsed time of the step (cycle). 6a shows the movement of the push-up pin 9, b shows the movement of the pickup unit 3, c shows the contact pressure detected by the pressure detecting means 12, and d part of the contact pressure corresponds to the push-up pin 9 in the step (a). The contact pressure when the semiconductor chip 4a comes into contact and the e part are the contact pressure when the suction part 15 and the semiconductor chip 4a come into contact in the steps (c) and (d).

  FIG. 7 shows the thrusting by the pressure detection means 12 for detecting the three-component pressure composed of the Z-direction contact pressure in the moving direction of the push-up unit 2 and the two X-direction contact pressure and Y-direction contact pressure orthogonal to the moving direction. It is a figure explaining the example which detects the normality / abnormality of the pushing-up state of the pin. FIG. 7A shows a state in which the push-up pin 9 has pushed up the semiconductor chip 4a normally. In this case, only the Z-direction contact pressure is detected among the three components, and the X-direction contact pressure and the Y-direction contact pressure are detected. Not.

  FIG. 7B shows a case where the pin portion 9b of the push-up pin 9 is bent and comes into contact with the semiconductor chip 4a. The Z-direction contact pressure is reduced, and the X-direction contact pressure and the Y-direction contact pressure are detected. . FIG. 7C shows a case where the semiconductor chip 4a to be picked up is slightly deviated from the pick-up position. The Z-direction contact pressure is reduced, and the X-direction contact pressure and the Y-direction contact pressure are detected. FIG. 7D shows a case where the height adjustment of the gantry 5 is deviated and becomes higher than the specified level. The Z-direction contact pressure is extremely small or zero, and the X-direction contact pressure and the Y-direction contact pressure are not detected. .

  Each of the detection signals is transmitted to the control device 20, where it is compared with the normal pressure stored in advance in the storage unit 22, and the pressure deviation of the corresponding part (the difference between the set pressure and the detected pressure) is displayed on the display unit 23. . Therefore, the device can be adjusted from the display content and corrected to a normal push-up state.

  FIG. 8 is a diagram for explaining an example in which the pressure detection means 12 for detecting the pressure of three components detects the upward tendency of each part in a semiconductor wafer in which a large number of semiconductor chips 4a are two-dimensionally arranged on the adhesive sheet 6. FIG. 8A shows a state in which the contact pressures of the three components at the time of pushing up are sequentially detected for each semiconductor chip 4a.

  FIG. 8B shows a case where the contact pressure (push-up force) in the peripheral region of the circular semiconductor wafer is lower than the specified value, and the contact pressure in the other region near the center is normal. FIG. 8C shows the case where the contact pressure (push-up force) in the upper half area of the circular semiconductor wafer is larger than the specified value and the contact pressure in the lower half area is lower than the specified value. Each of these detection signals is transmitted to the control device 20, and the control device 20 stores these detection values in the storage unit 22 in association with the detection position.

  Since the contact pressure of each part of the semiconductor wafer is stored in the storage unit 22 in association with the detection position as described above, the position of the semiconductor wafer is detected by the position detection means 8 of the gantry 5 for each pickup, and the detection signal is controlled. Is transmitted to the device 20. The contact pressure of each part of the semiconductor wafer stored in the storage unit 22 can be displayed on the display unit 23, and the position adjustment of the gantry 5 and the adjustment of the push-up pin 9 can be performed by the displayed contact pressure distribution or the like. .

  FIGS. 9A to 9D are diagrams illustrating an operation in which the pickup unit 3 is rotationally driven to switch between the two suction portions 15 in a plurality of steps. (A) is the first state in which the side facing the gantry 5 is switched from the lower suction part 15 to the upper suction part 15, and (B) and (C) are in the middle of the pickup unit 3 being driven to rotate. (D) is a state in which the upper suction part 15 and the lower suction part 15 are completely switched. If a switching method in which two suction units are switched and used in this way, the pickup speed can be doubled with respect to the pickup unit 3 having only one suction unit 15.

  The pickup device and the pickup method of the present invention can be used for picking up an object to be picked up such as a semiconductor chip and delivering it to a crimping device or the like.

1 is an overall view schematically showing a main part of a pickup device according to the present invention. The side view of the pick-up part in FIG. Sectional drawing of A part of the push-up pin 9 in FIG. FIG. 3 is a block diagram of a control device that controls the main part of the pickup device 1 and each detection means and drive means connected thereto. The figure which shows the pick-up process of the semiconductor chip 4a.

The figure which shows the movement of each part in each process of FIG. 5, and the change of a contact pressure. The figure explaining the example which detects the normality / abnormality of the pushing-up state of the pushing-up pin 9 by the pressure detection means 12 which detects the pressure of 3 components. The figure explaining the example which detects the pushing-up tendency of each part in the semiconductor wafer which arranged the many semiconductor chips 4a on the adhesive tape 6 by the pressure detection means 12 which detects the pressure of 3 components. The figure explaining operation which drives the pick-up unit 3 and switches two adsorption | suction parts 15. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pickup apparatus 2 Push-up unit 3 Pickup unit 4 Pickup target object 4a Semiconductor chip 5 Base 6 Adhesive sheet 7 Two-dimensional drive means 8 Position detection means

DESCRIPTION OF SYMBOLS 9 Push-up pin 9a Base 9b Pin part 9c Adsorption hole 9d Piping 9e Adsorption control valve 10 Shaft body 11 Drive means 12 Pressure detection means

13 Position detection means 13a Encoder 13b Encoder glass scale 14 Main body 15 Adsorption part 15a Piping 15b Adsorption control valve 16 Rotation drive means

DESCRIPTION OF SYMBOLS 17 Drive means 18 Position detection means 18a Encoder 18b Encoder glass scale 19 Drive means 20 Control apparatus 21 Control part 22 Memory | storage part 23 Display part 24 Input part 25,26 Interface

Claims (6)

In a pickup apparatus comprising a push-up unit (2) and a pickup unit (3) arranged opposite to each other with a mount (5) on which a pickup object (4) is arranged,
The pickup unit (3) includes a main body (14) reciprocally driven in the direction of the gantry (5) by the position detection means (18) and the driving means (17), and an adsorption portion (15) provided on the main body (14). ,
The push-up unit (2) includes a push-up pin (9) that can be driven back and forth in the direction of the gantry (5) by the pressure detection means (12), the position detection means (13), and the drive means (11). The pressure detection means (12) is configured to detect the contact pressure between the tip and the pickup object (4),
The push-up unit (2) is driven by a drive means (11) by a linear motor so that the push-up pin (9) is driven in a direction approaching the gantry (5), and the encoder (13a) and the encoder glass scale (13b) While detecting the position by the position detection means (13), the tip is brought into contact with the pickup object (4) arranged on the gantry (5), and the contact pressure detection by the pressure detection means (12) detects the push-up pin. It is detected that the tip of (9) has contacted the pickup object (4), and the drive operation of the push-up pin (9) is stopped based on the detection result, or the drive operation is further performed after an additional movement by a predetermined distance. Stop
Next, in that state, the pickup unit (3) mounts it on the frame by position control of the position detection means (18) by the encoder (18a) and the encoder glass scale (18b) and the drive means (17) by the linear motor. In the direction approaching (5), the suction part (15) is brought into contact with the pickup object (4) by driving, the contact pressure is detected by the pressure detection means (12), and based on the detection, Switch to pressure control (or torque control), adjust the driving force of the main body (14) so that the detected pressure becomes a preset value, and then pick up the pickup object (4) with the suction part (15) Then, the main body (14) is driven and operated in a direction away from the gantry (5). In claim 1,
The pickup unit (3) includes a main body (14) that is rotated by a rotation driving means (16), and two adsorption portions (15) provided on the main body (14), and each time the main body (14) rotates 180 degrees. The pickup device is characterized in that the two suction portions (15) are alternately opposed to the gantry (5). In claim 1 or claim 2 ,
Detecting the Z-direction contact pressure in the moving direction of the pressure detection means (12) is push-up unit (2), the contact pressure of three components consisting of two X-direction contact pressure and the Y-direction contact pressure perpendicular to the moving direction The presence of the X-direction contact pressure, the Y-direction contact pressure, or the value below the reference value of the Z-direction contact pressure is configured to detect an abnormality in the push-up state of the push-up pin (9). Pickup device. 4. The pick-up object (4) according to any one of claims 1 to 3 , wherein the pickup object (4) is a semiconductor chip (4a) arranged on an adhesive sheet (6), and the mount (5) is a semiconductor chip (4a) to be picked up. ) Is moved to the pickup position, the position detection means (8) for detecting the position of the moved gantry, and the gantry position detected by the position detection means (8). A pickup device comprising a storage means (22) for storing the contact pressure between the tip of the push-up pin (9) and the semiconductor chip (4a) detected by the pressure detection means (12) for each pickup. The pickup object (4) is picked up using a pickup device having a push-up unit (2) and a pickup unit (3) arranged opposite to each other with a mount (5) on which the pickup object (4) is arranged. In the method
The pickup unit (3) includes a main body (14) reciprocally driven in the direction of the gantry (5) by the position detection means (18) and the driving means (17), and an adsorption portion (15) provided on the main body (14). ,
The push-up unit (2) has a pressure detection means (12), a position detection means (13), and a drive means (11), and includes a push-up pin (9) that can be driven back and forth in the direction of the gantry (5),
By the drive means by the linear motor (11) and encoder position detector according to (13a) and the encoder glass scale (13b) (13), while detecting a position, approaching the push-up pin (9) to the frame (5) The tip of the push-up pin (9) is picked up by the contact pressure detected by the pressure detection means (12) by bringing the tip into contact with the pickup object (4) placed on the gantry (5). Detecting contact with the object (4), and stopping the driving operation of the push-up pin (9) based on the detection result, or further stopping the driving operation after additional movement by a predetermined distance,
Next, in this state, the pickup unit (3) detects the position by position control of the position detection means (18) by the encoder (18a) and the encoder glass scale (18b) and the drive means (17) by the linear motor. The adhering portion (15) is brought into contact with the pickup object (4) by driving in the direction approaching the gantry (5), and the contact pressure is detected by the pressure detecting means (12). , Switch to pressure control (or torque control), adjust the driving force of the main body (14) so that the detected pressure becomes a preset value, and then pick up the pickup object (4) with the suction part (15) A pick-up method comprising: driving the main body (14) in a direction away from the gantry (5) after the suction. 6. The pickup according to claim 5, wherein when the pickup object is a semiconductor chip (4a) arranged on the adhesive sheet (6) , the platform (5) is driven by a two-dimensional drive means (7). After the semiconductor chip (4a) to be moved is moved to the pickup position, the drive operation of the push-up pin (9) is performed, and each of the tip of the push-up pin (9) detected by the pressure detection means (12) and the semiconductor chip (4a) A pick-up method characterized in that the contact pressure is stored in the storage means (22) in association with the moved gantry position, and each stored contact pressure is two-dimensionally displayed on the display means (23).

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