KR20030024511A - Head part of led die bonder - Google Patents

Abstract

PURPOSE: A head part of an LED die bonder is provided to improve productivity by transferring rapidly an LED chip to an LED lead frame. CONSTITUTION: A head part of an LED die bonder is formed with a rotary driving portion(12), a transferring portion(30), and a housing portion. The rotary driving portion(12) is used for rotating the head part. The transferring portion(30) is located at an end of the rotary driving portion(12) in order to transfer an LED chip to a vacuum shaft(33). The housing portion is installed at an upper portion of the transferring portion(30) in order to shift the vacuum shaft(33) to an upper or a lower direction. The rotary driving portion(12) is formed with a motor fixing plate, a driving motor, a driving pulley, a rotary shaft(19), a rotary pulley, and a belt, A sensing portion(20) is installed at an upper portion of the rotary pulley. The housing portion includes a rotary bearing(51) and a housing(52). A fixing plate(53) is extended to a linear guide(54). A transferring plate(57) is connected wit the linear guide block(54). A motor(58) is fixed to one side of the fixing plate(53). The transferring portion(30) includes a rotary plate(31), a position control liner guide(32), the vacuum shaft(33), a recovery spring(35), and a shaft support(36).

Description

Head of LED Die Bonder {HEAD PART OF LED DIE BONDER}

The present invention relates to a head portion of an LED die bonder, and more particularly, to a head portion of an LED die bonder for bonding an LED chip to a cup of an LED lead frame with excellent workability and high precision in LED manufacturing.

In general, the head portion of the LED die bonder sucks the LED chip 3, and then moves to the LED lead frame 1 to be seated in the cup 2 on the upper surface of the lead frame (1). The cup 2 is easily bonded because epoxy is applied in the whole process.

However, such a process is difficult to check whether the LED chip is small and fine, so that the head portion adsorbed the LED chip, and if the vibration occurs during the movement or the movement distance is not exactly correct, it is treated as poor immediately, there is a problem of low productivity and hard work.

The present invention has been made in order to solve the above problems, specifically, the LED die to accurately detect the adsorption of the LED chip, and prevent the occurrence of work defects due to the vibration or the error of the transfer distance when moving after the chip adsorption. The purpose is to provide a head portion of the bonder.

Another object of the present invention is to provide a head portion of the LED die bonder to improve productivity by transferring the LED chip to the LED lead frame at high speed.

1 is a perspective view showing an LED chip and an LED lead frame;

2 is a perspective view showing a head portion of an LED die bonder according to the present invention;

3 is a front view showing the head portion of the LED die bonder according to the present invention;

4 is a side view showing a head portion of an LED die bonder according to the present invention;

5 is a perspective view showing a sensing dog of the LED die bonder head portion according to the present invention.

* Description of Signs of Main Parts of Drawings *

1: LED lead frame 2: cup

3: LED chip 11: head

12: rotary drive unit 13: housing plate

14: motor fixing plate 15: drive motor

16: driven pulley 17: rotating pulley

18: belt 19: axis of rotation

20: detection dog 21: detection dog body

22: upper plate 23: sensing groove

24: lower plate 25: home sensor

26: first detection sensor 27: second detection sensor

28: limit sensor 30: transfer unit

31: rotating plate 32: positioning linear guide

33: vacuum shaft 35: restoring spring

36: shaft support 38: vacuum hole

40: vacuum line 41: adsorption end

50: housing 51: rotary bearing

52: housing 53: fixed plate

54: Linear Guide 55: Cam Followers

56: rack 57: moving plate

58: Shanghai East Motor 59: Pinion

An object of the present invention is a rotary drive unit for generating a rotational force; Head of the LED die bonder consisting of a transfer unit for transferring the LED chip to at least two or more vacuum shafts while being rotated by the rotational force of the rotary drive unit, and a housing portion formed on the transfer unit to move the vacuum shaft up and down Provide wealth.

According to the present invention, the rotary drive unit includes a driving motor and a driving pulley coupled to the end of the driving motor, a rotating pulley connected to the driving pulley and a belt, and a rotating shaft coupled to the rotating pulley, wherein the rotating pulley is an initial position, Vision camera has a detection dog and a sensor to indicate the signal position, transient rotation.

The transfer unit is coupled to a horizontal rotating plate at the end of the rotating shaft, and the vacuum shaft is connected to at least two end portions of the rotating plate which are movable up and down.

In addition, the shank moving member is coupled to the outer surface of the positioning linear guide and the positioning linear guide coupled to the end of the rotating plate, the hole is formed so that the vacuum shaft can be moved up and down, the shaft is equipped with a restoring spring at the bottom It is composed of supports.

In addition, the vacuum shaft has a hole formed vertically therein, the sensor is mounted on the upper end, and has an adsorption end for adsorbing the LED chip in a vacuum at the end.

Alternatively, the housing part has a housing in which a rotating bearing is mounted at the center of the rotating shaft, and has a shangdong part provided on the outer side of the housing to be positioned above the shank moving member and move downward.

In addition, the Shanghai East is a linear guide coupled to a plurality of fixed plates, the upper and lower cam follower is mounted on the lower side while being connected to the block of the linear guide, the movable plate coupled to the rack on one side, and fixed to one side of the fixing plate The shaft consists of a shangdong motor combined with a rack of moving plates and a pinion engaged.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing an LED chip and an LED lead frame, FIG. 2 is a perspective view showing a head portion of an LED die bonder according to the present invention, FIG. 3 is a front view showing a head portion of an LED die bonder according to the present invention, and FIG. A side view showing the head portion of the LED die bonder according to the invention, and Figure 5 is a perspective view showing a sensing dog of the LED die bonder head portion according to the present invention.

As shown, the head portion 11 of the LED die bonder is located at the end of the rotary drive portion 12 and the rotary drive portion 12 for rotating the head portion 11 to drive the LED chip 3 with the vacuum shaft 33. Conveying unit 30 and the housing portion 50 is formed on the upper portion of the transfer unit 30 to move the vacuum shaft 33 up and down.

The rotary drive unit 12 has the end of the driving motor 15 fixed to the motor fixing plate 14 extending upward from the housing plate 13 extending from the main body of the LED die bonder 10 and the driving motor 15 of the driving motor 15. The drive pulley 16 is connected to the drive shaft. The drive pulley 16 is connected to the rotary pulley 17 and the belt 18 coupled to one end of the rotary shaft 19 so that the rotational force is transmitted to the rotary shaft 19 when the drive motor 15 rotates.

Then, the upper portion of the rotary pulley 17 has a sensing dog 20 for detecting the rotation angle of the rotary shaft 19. The sensing dog 20 is preferably located in the lower portion of the semi-circular upper plate 22 and the upper plate 22 extending from the outer peripheral surface of the cylindrical body 21 and the body 21, the outer peripheral surface of the body 21 It consists of a lower plate 24 formed with a sensing groove 23 on one side as a circular plate extending from.

In addition, a home sensor 25 that detects the upper plate 22 of the sensing dog 20 and finds an initial position is installed in the housing plate 13, and the lower plate 24 detects a vision camera (not shown). The first and second detection sensors 26 and 27 and the limit sensor 28 which provide a signal detect the detection groove 23.

Therefore, when the rotating shaft 19 is rotated by the drive motor 15, it is detected by the motor encoder value that 180 degrees is correctly rotated, and the time read by the vision camera while rotating is the first and second detection sensors 26 and 27. The sensor detects and notifies, and the limit sensor 28 detects whether the rotating shaft 19 rotates excessively over 180 degrees and sends a signal to stop the rotation.

The housing portion 50 of the LED die bonder head portion 11 is formed with a housing 52 connected to the outside of the rotary bearing 51 connected to the central portion of the rotating shaft 19, the housing 52 is a housing extending from the main body Is coupled to the plate 13.

Therefore, even when the rotating shaft 19 is rotated by the drive motor 15, the housing 52 holding the outside of the rotating bearing 51 does not flow.

The fixed plate 53 extends from both the lower surface of the housing plate 13 to both sides of the housing 52 so that the linear guide 54 which moves up and down is coupled. In addition, a cam follower 55 is mounted at a lower portion of the block of the linear guide 54, and a moving plate 57 having a rack 56 coupled to one side thereof is connected thereto.

In addition, the shankdong motor 58 is fixed to one side of the fixing plate 53, and the shaft 59 is engaged with the pinion 59 engaged with the rack 56 of the moving plate.

Accordingly, when the shankdong motor 58 rotates, the pinion 59 rotates, and the rotational force is transmitted to the rack 56 so that the moving plate moves downward through the linear guide 54 and the lower portion of the moving plate. Cam follower 55 is also mounted on the lower.

In the transfer part 30 of the LED die bonder head part 11, the rotation plate 31 is coupled to the end of the rotation shaft 19, and the positioning linear guide 32 is formed at both ends of the rotation plate 31. The positioning linear guide 32 has a spring mounted therein so that the guide body is always moved upward when there is no external force. In another embodiment, the spring may be connected between the body of the positioning linear guide 32 and the rotating plate 31.

A hole is formed in the body of the positioning linear guide 32 so that the vacuum shaft 33 can move up and down, and a shaft support 36 to which the restoring spring 35 is mounted is attached to the bottom thereof.

The vacuum shaft 33 has a stage formed at the top and the bottom thereof to prevent the shaft from being separated from the shaft support 36, a vacuum hole is formed at the end thereof, and the vacuum line 40 of the vacuum generator 39 is connected at one side thereof. It has an adsorption stage 41 which becomes.

In the vacuum shaft 33, the vacuum generator 39 operates to form a vacuum at the adsorption end 41 to adsorb and transfer one LED chip 3 to the vacuum shaft 33 at the shaft support 36 when the vacuum shaft 33 is adsorbed. ) Can be moved up and down, so that the adsorption while moving upwards to prevent excessive force applied to the LED chip (3) to protect the chip (3), and when the adsorption is completed, the vacuum shaft (33) by the restoring spring (35) ) Moves back to its original position.

In addition, the vacuum shaft 33 has a hole formed therein and a light emitting sensor 43 mounted at the upper end thereof, so that the suction end 41 of the vacuum shaft 33 sucks the LED chip 3. 41) The light receiving sensor 44 for confirming whether the light of the light emitting sensor 43 is blocked at the end is installed on the main body can be confirmed.

Accordingly, the transfer unit 30 is a rotary plate 31 is rotatable by the driving force of the rotary shaft 19, the body of the positioning linear guide 32 downward in the housing unit 50 located above the transfer unit 30 When pressed, the vacuum shaft 33 moves downward to be in contact with the LED on the LED substrate, and the vacuum generator 39 operates to adsorb the LED chip 3 at the adsorption end 41, and presses the housing part 50. When the force is removed, the vacuum shaft 33 moves to its original position by the restoring force of the positioning linear guide 32.

Hereinafter, with reference to the accompanying drawings will be described in detail the LED die bonder action according to the present invention.

1 is a perspective view showing an LED chip and an LED lead frame, FIG. 2 is a perspective view showing a head portion of an LED die bonder according to the present invention, FIG. 3 is a front view showing a head portion of an LED die bonder according to the present invention, and FIG. Side view showing the head portion of the LED die bonder according to the invention, and Figure 5 is a perspective view showing a sensing dog of the LED die bonder head portion according to the present invention.

As shown in the drawing, the head portion 11 of the LED die bonder has a vacuum shaft 33 mounted at both ends of the transfer plate 30 rotating plate at one end thereof in the direction of the LED lead frame 2 and the other side of the LED chip ( 3) direction. The home sensor 25 detects the upper plate 22 of the sensing dog 20 and checks whether the rotating shaft 19 is at the initial position.

When the shankdong motor 58 of the housing part 50 rotates to adsorb the LED chip 3, the pinion 59 rotates, and this rotational force is transmitted to the rack 56 to cam the moving plate 57. Follower 55 travels downward in linear guide 54.

When the cam follower 55 presses the body of the positioning linear guide 32 of the transfer part downward, the vacuum shaft 33 moves downward to contact the LED chip 3 on the wafer. The former 39 operates to adsorb the LED chip 3 at the adsorption stage 41. At this time, since the vacuum shaft 33 is movable up and down in the shaft support 36, the vacuum shaft 33 is moved upward so as to be prevented from applying excessive force to the LED chip 3.

When the adsorption is completed, the shangdong motor 58 operates in the opposite direction to move the cam follower 55 upward to remove the force applied to the body of the positioning linear guide 32. Accordingly, as the body of the positioning linear guide 32 rises to the original position, the vacuum shaft 33 also rises, and the upward movement from the shaft support 36 moves to the original position by the restoring spring 35. do.

When the vacuum shaft 33 is raised to its original position, the driving motor 15 is driven to rotate the rotating shaft 19 by 180 degrees. At this time, the first and second detection sensors 26 and 27 detect the detection dog 20 and send a signal to read the vision camera, and the limit sensor 28 detects whether the rotating shaft 19 makes an excessive rotation of more than 180 degrees. do.

In addition, the light receiving sensor 44 mounted on the main body detects whether the light emitting sensor 43 mounted on the upper end of the vacuum shaft 33 emits light while actually rotating the LED chip 3 at the adsorption end 41 while rotating. .

When the rotation shaft 19 completes the rotation, the vacuum shaft 33 in the direction of the LED lead frame 2 is located in the direction of the LED chip 3 and the other vacuum shaft 33 in the direction of the LED chip 3 is the LED chip ( It is located in the direction of LED lead frame 2 in the state which adsorbed 3). In this state, the shangdong motor 58 is driven to move the cam follower 55 downward again, and the vacuum shaft 33 is lowered.

The vacuum shaft 33 adsorbs the LED chip 3, the vacuum generator 39 releases the vacuum while the LED chip 3 is brought into contact with the cup 2 of the LED lead frame 1 fixed to the main body. The LED chip 3 is placed on the cup 2 of the LED lead frame 1. An adhesive is already applied to the cup 2 of the LED lead frame 1 so that the chip 3 is naturally bonded.

The other vacuum shaft 33 is lowered to adsorb the LED chip 3 in the same manner.

When the adsorption and bonding is completed, the Shanghai-dong motor 58 is driven to raise the vacuum shaft 33, and the rotation shaft 19 is rotated again by the driving motor 15 to change the position of the vacuum shaft 33 by 180 degrees. Let's do it.

According to the present invention as described above, the head portion is equipped with a vacuum shaft for transferring at least two or more LED chips, significantly reducing the time to bond the LED chip to the cup (2) of the LED lead frame (2) productivity It has a big effect on improvement.

In addition, since the rotation of the head portion rotates about the rotation axis, the vibration hardly occurs during operation, and thus, there is an advantage of reducing the production cost by reducing work defects.

In addition, there is an advantage that the failure rate of the equipment can be lowered by always attaching a sensor that detects the initial position detection of the head portion and excessive rotation, so that it rotates correctly.

In addition, a sensor that detects whether the vacuum shaft sucks the LED chip correctly and rotates is attached to the inside of the vacuum shaft and the equipment main body to check whether the work is performed correctly.

As the present invention can be variously modified by those skilled in the art without departing from the scope of the claims claimed in the claims, the technical protection scope of the present invention is limited to the specific preferred embodiments described above It is not limited.

Claims (7)

A rotation driving unit generating a rotation force; LED is characterized by consisting of a transfer unit for transferring the LED chip to at least two or more vacuum shafts while receiving the rotational force of the rotary drive unit, and a housing portion formed on the transfer unit to move the vacuum shaft up and down Head part of die bonder. The method of claim 1, wherein the rotary drive unit A drive motor and a drive pulley coupled to the end of the drive motor, a rotation pulley connected to the drive pulley and the belt, and a rotation shaft coupled to the rotation pulley, wherein the rotation pulley includes an initial position, a vision camera detection signal position, and transient rotation. Head of the LED die bonder, characterized in that it has a detection dog and a sensor to tell. The method of claim 2, wherein the transfer unit A horizontal rotating plate is coupled to the end of the rotating shaft, and the vacuum shaft is connected to at least two or more ends of the rotating plate, wherein the vacuum shaft is movable up and down. The method of claim 3, wherein the shandong copper member Positioning the linear guide coupled to the end of the rotating plate and the outer surface of the positioning linear guide and the hole is formed so as to move the vacuum shaft up and down, characterized in that consisting of a shaft support with a restoring spring mounted on the bottom Head part of LED die bonder to say. The method of claim 3, wherein the vacuum shaft The hole of the LED die bonder, characterized in that the hole is formed vertically therein, the sensor is mounted on the upper end, the end having an adsorption end for sucking the LED chip in a vacuum. The method of claim 1, wherein the housing portion The housing of the rotating shaft is formed in the center of the rotating shaft is formed, the head portion of the LED die bonder, characterized in that the outer side of the housing has a shandongdong which is provided on the upper portion of the shandongdong member to move downward . The method of claim 6, wherein the East Shanghai A linear guide coupled to a plurality of fixed plates, a moving plate coupled to the block of the linear guide, the upper and lower cam followers are mounted on the lower side, and a rack coupled to one side, and a moving plate fixed to one side of the fixed plate. Head of the LED die bonder, characterized in that composed of a shanghai motor coupled to the rack and the pinion engaged.