CN107452643A - Substrate flattening equipment and the semiconductor making method using the substrate flattening equipment - Google Patents
Substrate flattening equipment and the semiconductor making method using the substrate flattening equipment Download PDFInfo
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- CN107452643A CN107452643A CN201610378204.8A CN201610378204A CN107452643A CN 107452643 A CN107452643 A CN 107452643A CN 201610378204 A CN201610378204 A CN 201610378204A CN 107452643 A CN107452643 A CN 107452643A
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- type component
- turning arm
- rotary chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of substrate flattening equipment and the semiconductor making method using the substrate flattening equipment.The substrate flattening equipment, comprising：One pedestal；One turning arm, its one end are rotatably coupled with the pedestal；An and dish-type component, it is connected with the other end of the turning arm, wherein described dish-type component moves down with rotation of the turning arm on a vertical plane, so that a card of the dish-type component is stacked and placed on the substrate for being carried on a rotary chuck, and a pressure vertically downward is imposed to the substrate, so as to which the substrate is entirely pressed on the rotary chuck.
Description
Technical field
The present invention relates to a kind of substrate flattening equipment, more particularly to a kind of substrate pressure for semiconductor technology
Flat equipment.
Background technology
With the development of science and technology electronic installation develops towards miniaturization and precise treatment so that the technique of semiconductor
Also tend to numerous and diverse.For example, the substrate of semiconductor need to add by grinding, machining, etching, high temperature
The multiple tracks such as heat technique is just able to the integrated circuit to be formed in electronic installation.In addition, when substrate being cleaned or
During the techniques such as etching, substrate is usually fixed on rotation by the way of vacuum suction either edge clamping
On chuck (spin chuck), and substrate is subjected to high speed rotation and the liquid for cleaning or etching in uppermost spray
Body.
However, when substrate is after by the grinding of above-mentioned multiple tracks, machining and high-temperature technology, substrate can be because of machine
The influence of tool power or thermal stress and produce deformation.Especially for slim substrate (such as Silicon Wafer or glass
Substrate etc.) for, after by various processing and high-temperature technology, more easily cause substrate and occur seriously
Deformation and cause substrate irregular warpage is integrally presented.Therefore, when the substrate that buckling deformation occurs is being carried out
During the technique such as cleaning or etching, substrate is not entirely placed on rotary chuck, thus causes rotary chuck
Vacuum cup can not be smoothly through by substrate and then vacuum suction to be fixed thereon.Also or due to substrate
The edge of warpage and the clamping jaw recurring structure of rotary chuck on interference, cause clamping jaw can not be successfully by base
Plate is clamped and is fixed on rotary chuck.
In view of this, it is necessary to propose a kind of equipment be used for aid in improvement substrate and rotary chuck between contact
Face, to cause substrate entirely can be placed on rotary chuck, and then make rotary chuck can be by its fixation machine
Substrate is successfully fixed thereon by structure.
The content of the invention
To solve above-mentioned problem of the prior art, it is an object of the invention to provide a kind of substrate flattening equipment,
One appropriate pressure is applied to the substrate being positioned on rotary chuck by particular organization, by buckling deformation
Press substrates into intimate and be attached on rotary chuck, and then make rotary chuck can be by its fixed mechanism (such as vacuum
Sucker or clamping jaw etc.) substrate is successfully fixed thereon.
To reach above-mentioned purpose, the present invention provides a kind of substrate flattening equipment, comprising：One pedestal；One rotation
Arm, its one end are rotatably coupled with the pedestal；And a dish-type component, it is another with the turning arm
End connection, wherein the dish-type component with the turning arm towards one first direction of rotation rotate and to moving down
It is dynamic so that a card of the dish-type component is stacked and placed on the substrate for being carried on a rotary chuck, and right
The substrate imposes a pressure vertically downward, thereby so that the substrate is entirely pressed on into the rotating clamp
On head.
Among one of present invention preferred embodiment, wherein the dish-type component includes：One terminal pad,
Its one side is connected by a universal joint with the other end of the turning arm, and passes through the Universal connector
Head adjusts the link angle between the terminal pad and the turning arm, so that the proper dish-type component is stacked
When on the substrate, the dish-type component is maintained at a horizontal level of relatively described substrate；And one mao
Brush, the another side of the terminal pad is fixed on by multiple gim pegs.
Among one of present invention preferred embodiment, it is slow that one is arranged with the multiple gim peg of part
Spring is rushed, for buffering the pressure described in the dish-type component application on the substrate vertically downward.
Among one of present invention preferred embodiment, the brush plate includes annular array and set at least
One row brush hair, the dish-type component are contacted with to the substrate by an at least row brush hair with the substrate
Pressure described in applying vertically downward.
Among one of present invention preferred embodiment, the brush plate is included in annular array is set one
Row brush hair and an outer row brush hair, and the outer row brush hair is located relative to the outer peripheral position of the substrate.
Among one of present invention preferred embodiment, the turning arm passes through a rotary power unit and institute
State pedestal to be rotatably coupled, the rotary power unit includes rotation pneumatic cylinder or rotation motor.
Among one of present invention preferred embodiment, the rotary chuck is the rotation of a vacuum adsorption type
Chuck.
Among one of present invention preferred embodiment, the rotary chuck is the clipping rotation in an edge
Chuck.
The present invention also provides a kind of semiconductor making method, comprising：A substrate is placed on a rotary chuck；
A substrate flattening equipment is provided, comprising a pedestal, a turning arm and a dish-type component, wherein the rotation
One end of arm is rotatably coupled with the pedestal, and the other end of the dish-type component and the turning arm
Connection；The turning arm of the substrate flattening equipment is controlled to be rotated towards one first direction of rotation, to cause
Dish-type component is stated jointly to move down；And a card of the control dish-type component is stacked and placed on the substrate
On, and a pressure vertically downward is imposed to the substrate, thereby so that the substrate to be entirely pressed on
On the rotary chuck.
Among one of present invention preferred embodiment, the substrate is with vacuum suction in the rotary chuck
On；And wherein controlling the dish-type component to be stacked and placed on the substrate, and one is imposed to the substrate
After pressure vertically downward, methods described also includes：Judge between the substrate and the dish-type component
Whether vacuum suction value reaches a preset value, in this way, controls the turning arm court of the substrate flattening equipment
One second direction of rotation rotates, to cause the dish-type component jointly to move up and then leave the substrate
Surface, it is such as no, control the dish-type component to continue to impose the substrate pressure vertically downward straight
The preset value is reached to the vacuum suction value between the substrate and the dish-type component.
Among one of present invention preferred embodiment, the rotary chuck is the clipping rotation in an edge
Chuck；And wherein controlling the dish-type component to be stacked and placed on the substrate, and the substrate is imposed
After one pressure vertically downward, methods described also includes：Judge that the substrate is pressed on whether being flattened
On the clipping rotary chuck in the edge, in this way, the clamping jaw of the clipping rotary chuck in the edge is controlled
The edge of the substrate is gripped, and controls the turning arm of the substrate flattening equipment towards one second
Direction of rotation rotates, to cause the dish-type component jointly to move up and then leave the table of the substrate
Face, it is such as no, control the dish-type component to continue to impose the substrate pressure vertically downward until institute
State substrate be pressed on the clipping rotary chuck in the edge with being flattened.
Brief description of the drawings
Fig. 1 shows a kind of solid for showing substrate flattening equipment according to the first advantageous embodiment of the invention
Schematic diagram；
Fig. 2 shows the illustrative view of Fig. 1 substrate flattening equipment laminated on a substrate；
Fig. 3 shows the part explosive view of the dish-type component of Fig. 1 substrate flattening equipment；
Fig. 4 shows that Fig. 1 substrate flattening equipment is used for showing for the substrate that pressing is carried on another load carrier
It is intended to；And
Fig. 5, which is shown, to be used to Fig. 1 substrate flattening equipment manufacture method for semiconductor flow chart.
Embodiment
, hereafter will be especially exemplified by order to which the above-mentioned and other purpose of the present invention, feature, advantage can be become apparent
The preferred embodiment of the present invention, and coordinate accompanying drawing, it is described in detail below.
Fig. 1 is refer to, it shows the vertical of substrate flattening equipment 100 according to the first advantageous embodiment of the invention
Body schematic diagram.The substrate flattening equipment 100 includes a pedestal 110, a turning arm 120 and a dish-type component
130.One end of the pedestal 110 can fix on the ground or be erected in a transport mechanism, and lead to
Cross the transport mechanism and the substrate flattening equipment 100 is sent to an operating position.It is as shown in figure 1, described
" L " type is substantially presented in turning arm 120, and has a first end 121 and one second end 122.The rotation
The first end 121 of pivoted arm 120 is rotationally connected by a rotary power unit 150 and the pedestal 110
Connect, and second end 122 of the turning arm 120 is connected with the dish-type component 130, wherein described
Rotary power unit 150 can be a rotation pneumatic cylinder (as shown in Figure 1) or rotation motor.Also, as schemed
Shown in 1, the rotary power unit 150 can be covered in the inner by a lid 160, to avoid personnel from missing
Touch or avoid rotary power unit 150 described in dust fall pollution.To clearly show that the rotary power dress
150 are put, in Fig. 1, the lid 160 is transparent/translucent, seems by a transparent/translucent plastic cement
Made by material.Can be to practise being known in this skill taxi, the lid 160 also can be it is opaque,
Seem as made by opaque plastic material or metal.
Referring to Fig.1 and 2, wherein Fig. 2 shows Fig. 1 laminated of substrate flattening equipment 100 on a substrate 300
Illustrative view.The substrate 300 preferably one is used for the thin base of semiconductor technology, such as silicon wafer
Circle, glass substrate etc..In general, the substrate 300 is by grinding, being machined, being heated at high temperature
After multiple tracks technique, the substrate 300 easily produces buckling deformation.Therefore, incited somebody to action when by a robotic arm
After the substrate 300 is placed on rotary chuck (spin chuck) 200, the substrate 300 is not smooth
It is attached on the rotary chuck 200.In view of this, in the present invention, when the substrate 300 is placed on rotation
After turning on chuck 200, the substrate flattening equipment 100 can correspondingly start.It is also, dynamic by the rotation
Power apparatus 150 controls the turning arm 120 to be rotated on a vertical plane towards one first direction of rotation R1, related
So that the dish-type component 130 moves down, and then a card of the dish-type component 130 is stacked and placed on described
On substrate 300, and a pressure F vertically downward is imposed to the substrate 300.Made by above-mentioned operation
Can effectively flatten the substrate 300 buckling deformation position to reach the substrate 300 entirely
The effect of being attached on the rotary chuck 200.Then, the rotary chuck 200 can by with the vacuum
Multiple vacuum cups (not shown in the figures) that suction pipe 210 connects carry out vacuum suction to the substrate 300
It is attached, the substrate 300 is effectively fixed on the rotary chuck 200.
Fig. 3 is refer to, it shows the part explosive view of the dish-type component 130 of Fig. 1 substrate flattening equipment 100.
The dish-type component 130 includes a terminal pad 131, a brush plate 132 and a telophragma 133.The terminal pad
131 are connected with second end 122 of the turning arm 120.More particularly, the one of the terminal pad 131
Face is connected by a universal joint 140 with second end 122 of the turning arm 120.It is understood that
By the setting of the universal joint 140 can effectively adjust the terminal pad 131 and the turning arm 120 it
Between link angle so that (such as Fig. 2 institutes when the proper dish-type component 130 is stacked on the substrate 300
Show), the dish-type component 130 is generally held in a horizontal level of relatively described substrate 300, and then causes
The dish-type component 130 can be applied by the card of the brush plate 132 to the ensemble average of the substrate 300
With the pressure F vertically downward, fragmentation is produced to avoid the substrate 300 that unilateral discontinuity occurs
Situation.
As shown in figures 1 and 3, the brush plate 132 of the dish-type component 130 includes what annular array was set
1324 and one outer row brush hair 1322 of row brush hair in one.The dish-type component 130 passes through the interior row brush hair 1324
Contacted with the outer row brush hair 1322 with the substrate 300 with the substrate 300 is applied it is described vertically downward
Pressure F.In a preferred embodiment of the invention, by from flexible bristle and the substrate 300
Contact, it can effectively absorb the buckling deformation amount of the substrate 300.That is, described interior row brush hair 1324 and institute
The bristle of outer row brush hair 1322 is stated when being contacted with the substrate 300, can be according to the corresponding positions of the substrate 300
The buckling deformation amount put and elastic deformation, and then the dish-type component 130 is effectively buffered to the substrate 300
The pressure F vertically downward applied, and then avoid the substrate 300 from being ruptured because single-point stress is too high.
It is understood that the quantity of the bristle shown in Fig. 1 is intended only as illustrating, in different embodiments may be used
The quantity of bristle is changed according to the size of corresponding substrate, such as the single row for only setting annular array to set
Bristle, or the bristle for setting annular arrays more than three rows to set.Preferably, it is arranged on outermost
Bristle (such as outer row brush hair 1322) its be relative to the 300 outer peripheral position of substrate.
As shown in figure 3, the dish-type component 130 passes through multiple first gim pegs 171 and multiple second gim pegs
The terminal pad 131, the brush plate 132 and the telophragma 133 are assembled fixation by 172.Specifically,
The terminal pad 131 is fixed on the one side of the telophragma 133 by the multiple first gim peg 171, and
And a buffer spring 173 is arranged with each first gim peg 171, for buffering the dish-type component
130 are applied to the pressure F vertically downward on the substrate 300.Secondly, the brush plate 132 passes through
The multiple second gim peg 172 is fixed on the another side of the telophragma 133.
Fig. 4 is refer to, it shows that Fig. 1 substrate flattening equipment 100 is carried on another load carrier for pressing
On substrate 300 schematic diagram.In this embodiment, the load carrier is the clipping rotating clamp in edge
First 400, it includes multiple clamping jaws 410.When the substrate 300 is placed on into the side by a robotic arm
When on the clipping rotary chuck 400 of edge, the multiple clamping jaw 410 is in the position away from the substrate 300.
Then, when flattening the substrate 300 by the substrate flattening equipment 100, the multiple clamping jaw 410 is then
It can be rotated towards the direction of the substrate 300, and then the substrate 300 is clamped to the edge and clamped
On the rotary chuck 400 of formula.
Fig. 5 is refer to, it, which shows, is used to Fig. 1 substrate flattening equipment 100 manufacture method for semiconductor flow
Figure.First, step S11, substrate 300 is placed on rotary chuck 200 by a robotic arm, it is described
Substrate 300 preferably one is used for the thin base of semiconductor technology, such as Silicon Wafer, glass substrate etc..Connect
, carry out step S12, there is provided the substrate flattening equipment 100, and the substrate flattening equipment 100 is set
In the operating position corresponding to the rotary chuck 200.Also, set as described above, the substrate flattens
Standby 100 include pedestal 110, turning arm 120 and dish-type component 130, and one end of the turning arm 120 and
The pedestal 110 is rotatably coupled, and the other end of the dish-type component 130 and the turning arm 120
Connection.Then, step S13 is carried out, controls the turning arm 120 of the substrate flattening equipment 100 one
Rotated on vertical plane towards one first direction of rotation R1 is (as shown in Figure 2), to cause the dish-type component 130 to connect
Move down band.Then, step S14 is carried out, is controlled the brush plate 132 of the dish-type component 130
Card is stacked and placed on the substrate 300, and pressure F vertically downward is imposed to the substrate 300, and then
Effectively the part of the buckling deformation of the substrate 300 is flattened.
Furthermore the rotary chuck 200 is a kind of rotary chuck 200 of vacuum adsorption type in the present embodiment.
It is understood that in general, vacuum suction is commonly configured with the rotary chuck 200 of vacuum adsorption type
Disk, vacsorb pipeline 210 (as shown in Figure 2) and the vacuum values sensor for detecting vacuum values.Therefore,
It can also be wrapped after controlling the dish-type component 130 to impose the pressure F vertically downward to the substrate 300
S15 containing step, by with multiple vacuum cups that the vacsorb pipeline 210 connects to the substrate 300
Enter vacuum adsorbed, the substrate 300 is effectively fixed on the rotary chuck 200.And pass through
The numerical value that vacuum values sensor measures judges the vacuum between the substrate 300 and the dish-type component 130
Whether adsorptive value reaches a preset value, in this way, controls the turning arm 120 of the substrate flattening equipment 100
(that is, the direction rotated in contrast to the first direction of rotation R1) is rotated towards one second direction of rotation, to cause
The dish-type component 130 jointly moves up and then leaves the surface of the substrate 300.As no, control institute
State dish-type component 130 and continue to impose the substrate 300 the pressure F vertically downward until the substrate
Vacuum suction value between 300 and the dish-type component 130 reaches the preset value.In addition, when the present invention's
The substrate flattening equipment 100 is carried on the clipping rotary chuck 400 (as shown in Figure 4) in edge using pressing
Substrate 300 when, can by setting appropriate sensor on the clipping rotary chuck 400 in the edge,
For judging whether the substrate 300 has entirely been pressed on the edge by the substrate flattening equipment 100
On clipping rotary chuck 400, in this way, clamping jaw 410 is then controlled again towards the direction of the substrate 300
Rotate, and then the edge of the substrate 300 is clamped to the clipping rotary chuck 400 in the edge
On, and control the turning arm 120 of the substrate flattening equipment 100 to be rotated towards one second direction of rotation,
To cause the dish-type component 130 jointly to move up and then leave the surface of the substrate 300.As no,
The dish-type component 130 is then controlled to continue to impose the substrate 300 the pressure F vertically downward until institute
Substrate 300 is stated to be pressed on being flattened on the clipping rotary chuck 400 in the edge.
It the above is only the preferred embodiment of the present invention, it is noted that for one of ordinary skill in the art,
Without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (16)
1. a kind of substrate flattening equipment, it is characterised in that include：
One pedestal；
One turning arm, its one end are rotatably coupled with the pedestal；And
One dish-type component, is connected with the other end of the turning arm, wherein the dish-type component is with institute
State turning arm to rotate and move down towards one first direction of rotation so that a card of the dish-type component
It is stacked and placed on the substrate for being carried on a rotary chuck, and imposes to the substrate one vertically downward
Pressure, thereby so that the substrate is entirely pressed on the rotary chuck.
2. the substrate flattening equipment as described in claim the 1, it is characterised in that the dish-type component includes：
One terminal pad, its one side are connected by a universal joint with the other end of the turning arm,
And the link angle between the terminal pad and the turning arm is adjusted by the universal joint, with
So that when the dish-type component is stacked on the substrate, the dish-type component is maintained at relatively described
One horizontal level of substrate；And
One brush plate, the another side of the terminal pad is fixed on by multiple gim pegs.
3. the substrate flattening equipment as described in claim the 2, it is characterised in that part it is the multiple solid
Determine to be arranged with a buffer spring on bolt, for buffering the institute of the dish-type component application on the substrate
State pressure vertically downward.
4. the substrate flattening equipment as described in claim the 2, it is characterised in that the brush plate includes ring
Shape array set an at least row brush hair, the dish-type component by an at least row brush hair with it is described
Substrate contact is with to the pressure described in substrate application vertically downward.
5. the substrate flattening equipment as described in claim the 4, it is characterised in that the brush plate includes ring
Shape array set one in row brush hair and an outer row brush hair, and described in the outer row brush hair is located relative to
The outer peripheral position of substrate.
6. the substrate flattening equipment as described in claim the 1, it is characterised in that the turning arm passes through one
Rotary power unit is rotatably coupled with the pedestal, and the rotary power unit includes rotation air pressure
Cylinder or rotation motor.
7. the substrate flattening equipment as described in claim the 1, it is characterised in that the rotary chuck is one
The rotary chuck of vacuum adsorption type.
8. the substrate flattening equipment as described in claim the 1, it is characterised in that the rotary chuck is one
The clipping rotary chuck in edge.
9. a kind of semiconductor making method, it is characterised in that include：
A substrate is placed on a rotary chuck；
One substrate flattening equipment is provided, comprising a pedestal, a turning arm and a dish-type component, wherein
One end of the turning arm is rotatably coupled with the pedestal, and the dish-type component and the rotation
The other end connection of pivoted arm；
The turning arm of the substrate flattening equipment is controlled to be rotated towards one first direction of rotation, to cause
The dish-type component jointly moves down；And
Control a card of the dish-type component to be stacked and placed on the substrate, and the substrate is imposed
One pressure vertically downward, thereby so that the substrate is entirely pressed on the rotary chuck.
10. the semiconductor making method as described in claim the 9, it is characterised in that the dish-type component bag
Contain：
One terminal pad, its one side are connected by a universal joint with the other end of the turning arm,
And the link angle between the terminal pad and the turning arm is adjusted by the universal joint, with
So that when the dish-type component is stacked on the substrate, the dish-type component is maintained at relatively described
One horizontal level of substrate；And
One brush plate, the another side of the terminal pad is fixed on by multiple gim pegs.
11. the semiconductor making method as described in claim the 10, it is characterised in that part it is the multiple
A buffer spring is arranged with gim peg, is applied on the substrate for buffering the dish-type component
The pressure vertically downward.
12. the semiconductor making method as described in claim the 10, it is characterised in that the brush plate includes
At least row brush hair that annular array is set, the dish-type component pass through at least a row brush hair and the institute
Substrate contact is stated with to the pressure described in substrate application vertically downward.
13. the semiconductor making method as described in claim the 12, it is characterised in that the brush plate includes
Row brush hair and an outer row brush hair in the one of annular array setting, and the outer row brush hair is located relative to institute
State the outer peripheral position of substrate.
14. the semiconductor making method as described in claim the 9, it is characterised in that the turning arm passes through
One rotary power unit is rotatably coupled with the pedestal, and the rotary power unit includes rotary pneumatic
Cylinder pressure or rotation motor.
15. the semiconductor making method as described in claim the 9, it is characterised in that the substrate is with vacuum
Absorption is on the rotary chuck；And wherein controlling the dish-type component to be stacked and placed on the substrate,
And after a pressure vertically downward is imposed to the substrate, methods described also includes：
Judge whether the vacuum suction value between the substrate and the dish-type component reaches a preset value,
In this way, the turning arm of the substrate flattening equipment is controlled to be rotated towards one second direction of rotation, so that
The dish-type component is obtained jointly to move up and then leave the surface of the substrate, it is such as no, control institute
State dish-type component and continue to impose the substrate pressure vertically downward until the substrate and institute
The vacuum suction value stated between dish-type component reaches the preset value.
16. the semiconductor making method as described in claim the 9, it is characterised in that the rotary chuck is
The clipping rotary chuck in one edge；And wherein the dish-type component is being controlled to be stacked and placed on the substrate
On, and after imposing a pressure vertically downward to the substrate, methods described also includes：
Judge that the substrate is pressed on the clipping rotary chuck in the edge with whether being flattened, such as
It is that the clamping jaw of the rotary chuck for controlling the edge clipping grips the edge of the substrate,
And control the turning arm of the substrate flattening equipment to be rotated towards one second direction of rotation, to cause
The surface that dish-type component jointly moves up and then leaves the substrate is stated, it is such as no, control the disk
Type component continues to impose the substrate pressure vertically downward until the substrate is pressed with being flattened
Together in the rotary chuck that the edge is clipping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610378204.8A CN107452643B (en) | 2016-05-31 | 2016-05-31 | Substrate flattening apparatus and semiconductor manufacturing method using the same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610378204.8A CN107452643B (en) | 2016-05-31 | 2016-05-31 | Substrate flattening apparatus and semiconductor manufacturing method using the same |
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| CN107452643A true CN107452643A (en) | 2017-12-08 |
| CN107452643B CN107452643B (en) | 2020-11-13 |
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| CN111319967A (en) * | 2018-12-13 | 2020-06-23 | 北京华文永康科技有限公司 | Bowl taking machine |
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