CN202183365U - Wafer flatting device - Google Patents
Wafer flatting device Download PDFInfo
- Publication number
- CN202183365U CN202183365U CN2011203080955U CN201120308095U CN202183365U CN 202183365 U CN202183365 U CN 202183365U CN 2011203080955 U CN2011203080955 U CN 2011203080955U CN 201120308095 U CN201120308095 U CN 201120308095U CN 202183365 U CN202183365 U CN 202183365U
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- CN
- China
- Prior art keywords
- wafer
- smooth device
- vacuum pumping
- contact jaw
- displacement bar
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a wafer flatting device including absorbing mechanism, a vacuumizing platform and a lifting slide table. The absorbing mechanism is provided with at least one displacement rod capable of moving axially. A soft flexible body is arranged on an end of the displacement rod to absorb a wafer in buckling deformation. The lifting slide table equipped with a motor controls the lifting of the vacuumizing platform and presses the wafer to flat the wafer in buckling deformation. Then the vacuumizing platform vacuumizes the wafer and lets the wafer stick onto the vacuumizing platform flatly. By using the wafer flatting device in the utility model, conditions that the wafer breaks or can not be flatted in a vacuumizing process do not appear.
Description
Technical field
The utility model relates to a kind of in the automation equipment of processing wafer, is used for the smooth device of the smooth wafer in work top of wafer.Be meant a kind of smooth device of using to distortion warpage wafer especially, can in smooth process, avoid the wafer fragmentation.
Background technology
In existing processing wafer automation equipment, need be smooth on a vacuum platform when the hard crisp wafer of thinning, normally directly wafer is vacuumized with the vacuum platform.But because the easy buckling deformation of wafer after the thinning, so often cause in vacuum suction wafer process, because of gapped between wafer and the vacuum platform, and it is smooth on platform to cause wafer to be adsorbed uniformly.In addition, in the time of sometimes also can be because of the vacuum suction wafer, absorption strength be inhomogeneous, or the vacuum design of Platform is improper, and causes wafer fragmentation phenomenon.
The utility model content
Therefore the main purpose of the utility model is the smooth device of using at a kind of wafer of design; This device has the wafer that sucker adsorbs buckling deformation; And the vacuum absorbing platform with an adjustable speed presses wafer; After by sucker and vacuum platform wafer being flattened, vacuumize by vacuum absorbing platform again, wafer is smooth on platform.This kind mode is the wafer pressing of elder generation with warpage, and the vacuum platform vacuumizes wafer again, can avoid gapped between wafer and the vacuum platform, and in vacuum, cause the absorption bad phenomenon.
Another purpose of the utility model is at the smooth device used of a kind of wafer of design, has the vacuum absorbing platform of an adjustable speed in this device, can be mild press wafer, avoid in pressing the wafer process causing fragmentation because of the application of force is improper.
The smooth device that the wafer that the utility model provided is used mainly comprises an adsorbing mechanism, a vacuum pumping platform and a up-down slide unit.This adsorbing mechanism have at least one can axially movable displacement bar, an end of this displacement bar is provided with a soft elastomer, is used for adsorbing the wafer of a buckling deformation.Control this vacuum pumping platform rising and press wafer by the up-down slide unit that is provided with a motor again, the wafer of script warpage is driven plain, by vacuum pumping platform wafer is vacuumized again, make wafer smooth on vacuum pumping platform.
Owing to be to utilize the motor that to locate really to control the stroke that vacuum suction cup rises; Therefore, the each rising of vacuum pumping platform all is to adopt preset distance, behind the vacuum pumping platform contact wafer; Especially slowly press wafer, so it is excessive and cause the problem of fragmentation not have the application of force.
With directly the prior art that the warpage wafer vacuumizes is compared with vacuum pumping platform; The utility model is owing to flatten wafer by vacuum pumping platform in advance; When so wafer is placed on the vacuum pumping platform; Very close to each other and the application of force is average, can not cause wafer fragmentation and not smooth phenomenon in the vacuum.And Digital Control is all adopted in moving between the utility model facility, and not having suddenly, powerful strength causes compressing to wafer.Therefore, the smooth device used of the utility model wafer can significantly promote the yield of wafer.
Description of drawings
The smooth device preferred embodiment sketch map that Fig. 1 uses for the utility model wafer;
Fig. 2 is the sketch map of the soft elastomer absorption of the utility model wafer;
Fig. 3 is the fragmentary detail view of Fig. 2;
Fig. 4 is the exploded view of the utility model up-down slide unit and vacuum pumping platform;
Fig. 5 upwards presses the sketch map of wafer for the utility model vacuum pumping platform;
Fig. 6 is the utility model vacuum pumping platform profile.
Embodiment
Following conjunction with figs. is done more detailed explanation to the execution mode of the utility model, so that the skilled personnel can implement after studying this specification carefully according to this.
Please refer to the smooth device preferred embodiment sketch map that Fig. 1 uses for the utility model wafer.Mainly comprise an adsorbing mechanism 1, a vacuum pumping platform 2 and a up-down slide unit 3.This adsorbing mechanism 1 have at least one can axially movable displacement bar 11, an end of this displacement bar 11 is provided with a soft elastomer 12, is used for adsorbing the wafer (holding the back discloses) of a buckling deformation.(it is inner to be located at servo slide unit by being provided with a servo motor again; Not shown in the figures) this vacuum pumping platform 2 of this up-down slide unit 3 controls rise and press wafer; The wafer of script warpage is driven plain, vacuumizes by 2 pairs of wafers of vacuum pumping platform again, make wafer smooth on vacuum pumping platform 2.Since in advance wafer is flattened, thus very close to each other between wafer and the vacuum pumping platform 2, can not cause wafer fragmentation and not smooth phenomenon in the vacuum.Wherein, said displacement bar 11 is to receive deadweight control.
In the utility model embodiment, said adsorbing mechanism 1 further comprises a pedestal 13, and this pedestal 13 is to be used for being provided with said displacement bar 11.Displacement bar 11 can be provided with four, and an end of each root displacement bar 11 all is provided with this soft elastomer 12, by four firm absorption wafers of soft elastomers 12 abilities.Between displacement bar 11 and pedestal 13, be provided with a bearing 14; Displacement bar 11 is axially to be arranged in this bearing 14; The other end of displacement bar 11 links a vacuum line 15, receives its deadweight control, and displacement bar 11 is moved axially with respect to this bearing 14; To adjust the height of soft elastomer 12, make it can touch wafer; And this wafer is to deliver to adsorbing mechanism 1 below by a mechanical arm (not shown).
Please refer to Fig. 2 and Fig. 3, be respectively the sketch map and the fragmentary detail view of said soft elastomer absorption wafer.Receive its deadweight control, displacement bar 11 is moved down and soft elastomer 12 contact absorption wafers 4.Soft elastomer 12 comprises a contact jaw 121, a neck 122 and a base portion 123 that is integrative-structure; This base portion 123 is connected with said displacement bar 11; This neck 122 is positioned at this base portion 123 belows; This contact jaw 121 is positioned at this neck 122 belows, and the radial dimension of this neck 122 is less than the radial dimension of this base portion 123 and this contact jaw 121, and this contact jaw 121 is used for adsorbing said wafer 4.Contact jaw 121 is plate-like, and preferable adsorption capacity is arranged.Receive the absorption of vacuum source, form one tight strength that contacts between wafer 4 surface and the contact jaw 121, at this moment; Contact jaw 121 can be out of shape along with the wafer that is contacted 4 surperficial amplitudes, and be obedient to wafer 4 surfaces because of the tool elastic deformability; Visible by Fig. 3; If the warpage forms on wafer 4 surface be gradually on wafer 4 mediads arc curved, contact jaw 121 surfaces that are in contact with it just form the state that a side direction neck 122 feedbacks are contracted, and make soft elastomer 12 adsorbable wafers 4.This shows that soft elastomer 4 has when neck 122 more tool elasticity, the angle that contact jaw 121 can the beats big characteristic that heals makes contact jaw 121 can adapt to the wafer of various different surfaces amplitudes.
Please refer to the exploded view of Fig. 4 for the utility model up-down slide unit and vacuum pumping platform.Have a slide 31 and a symmetrical chute 32 on the up-down slide unit 3; This chute 32 is that symmetry is opened in up-down slide unit 3 both sides; This slide 31 is snug fit at this chute 32, slide 31 receive said motor (it is inner to be located at the up-down slide unit, and figure does not show) driving and can be along chute 32 axial slips; Said vacuum pumping platform 2 is set on the slide 31, therefore can adjusts the height of vacuum pumping platform 2 with respect to adsorbing mechanism 1 (with reference to figure 1) by endwisely slipping of slide 31.
Please cooperate Fig. 3 and please refer to Fig. 5, Fig. 5 upwards presses the sketch map of wafer for vacuum pumping platform.Because the wafer 4 of warpage receives the absorption of soft elastomer 12; Therefore when vacuum pumping platform 2 presses wafer 4; The contact jaw 121 of soft elastomer 12 can be presented and contract along with the warpage form of wafer 4, and wafer 4 can not confronted the tough with toughnees with vacuum pumping platform 2 and break, and wafer 4 can be driven plain simultaneously.
Please refer to Fig. 6 is the utility model vacuum pumping platform profile.Vacuum pumping platform 2 has an air flue 21, and a plurality of conduit 22 that communicates with this air flue 21, and this air flue 21 is linked to a vacuum source (not shown).Brought forward is stated, and after wafer 4 was driven plain, this vacuum source vacuumized this vacuum pumping platform 2, and wafer 4 breaks away from soft elastomers 12 and smooth on vacuum pumping platform 2; Because wafer 4 flattens in advance, therefore wafer does not have fragmentation and not smooth phenomenon in vacuum.
The above is merely the preferred embodiment of explaining the utility model; Be not that attempt is done any pro forma restriction to the utility model according to this; Therefore; All have in following any modification or change of making relevant the utility model of identical creation spirit, all must be included in the category of the utility model claim.
Claims (9)
1. the smooth device that wafer is used is characterized in that, the smooth device that this wafer is used comprises:
One adsorbing mechanism, its have at least one can axially movable displacement bar, an end of this displacement bar is provided with a soft elastomer, is used for adsorbing a wafer;
One vacuum pumping platform is positioned at this adsorbing mechanism below, and this vacuum pumping platform is used for pressing this wafer, and accepts this wafer and this wafer is vacuumized;
One up-down slide unit is provided with a motor in it, this up-down slide unit supplies this vacuum pumping platform to be slidingly matched, in order to control the landing of this vacuum pumping platform.
2. the smooth device that wafer as claimed in claim 1 is used is characterized in that, said displacement bar receives deadweight control.
3. the smooth device that wafer as claimed in claim 2 is used is characterized in that said adsorbing mechanism has a pedestal, and at least one bearing is set on this pedestal, and said displacement bar axially is arranged in this bearing, and the other end of said displacement bar links a vacuum source.
4. the smooth device that wafer as claimed in claim 1 is used; It is characterized in that said soft elastomer comprises a contact jaw, a neck and a base portion that is integrative-structure, this base portion is connected with said displacement bar; This neck is positioned at this base portion below; This contact jaw is positioned at this neck below, and the radial dimension of this neck is less than the radial dimension of this base portion and this contact jaw, and this contact jaw is used for adsorbing said wafer.
5. the smooth device that wafer as claimed in claim 4 is used is characterized in that said contact jaw is plate-like.
6. the smooth device that wafer as claimed in claim 4 is used is characterized in that, said soft elastomer has when the said neck tool elasticity that heals, and the angle that said contact jaw can the beat big characteristic that heals makes said contact jaw can adapt to the wafer of various different surfaces amplitudes.
7. the smooth device that wafer as claimed in claim 1 is used is characterized in that said vacuum pumping platform has an air flue, and a plurality of conduit that communicates with this air flue, and this air flue links to each other with a vacuum source.
8. the smooth device of using like claim 1 or 7 described wafers is characterized in that having a slide and a symmetrical chute on the said up-down slide unit, and this slide supplies said vacuum pumping platform is set, and this slide receives the driving of said motor and is snug fit at this chute.
9. the smooth device that wafer as claimed in claim 1 is used is characterized in that, said displacement bar has four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203080955U CN202183365U (en) | 2011-08-23 | 2011-08-23 | Wafer flatting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203080955U CN202183365U (en) | 2011-08-23 | 2011-08-23 | Wafer flatting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202183365U true CN202183365U (en) | 2012-04-04 |
Family
ID=46176393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203080955U Expired - Fee Related CN202183365U (en) | 2011-08-23 | 2011-08-23 | Wafer flatting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202183365U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103465198A (en) * | 2013-09-25 | 2013-12-25 | 深圳市华星光电技术有限公司 | Glass processing platform and method for processing glass |
| CN107452643A (en) * | 2016-05-31 | 2017-12-08 | 弘塑科技股份有限公司 | Substrate flattening equipment and the semiconductor making method using the substrate flattening equipment |
| CN109244029A (en) * | 2018-09-28 | 2019-01-18 | 上海理工大学 | A kind of smooth fixed device of wafer |
| CN113003185A (en) * | 2021-02-23 | 2021-06-22 | 胡慧红 | Flat pasting equipment for wafer photoetching development |
-
2011
- 2011-08-23 CN CN2011203080955U patent/CN202183365U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103465198A (en) * | 2013-09-25 | 2013-12-25 | 深圳市华星光电技术有限公司 | Glass processing platform and method for processing glass |
| WO2015043025A1 (en) * | 2013-09-25 | 2015-04-02 | 深圳市华星光电技术有限公司 | Glass processing platform and method for processing glass |
| CN103465198B (en) * | 2013-09-25 | 2015-04-22 | 深圳市华星光电技术有限公司 | Glass processing platform and method for processing glass |
| CN107452643A (en) * | 2016-05-31 | 2017-12-08 | 弘塑科技股份有限公司 | Substrate flattening equipment and the semiconductor making method using the substrate flattening equipment |
| CN109244029A (en) * | 2018-09-28 | 2019-01-18 | 上海理工大学 | A kind of smooth fixed device of wafer |
| CN113003185A (en) * | 2021-02-23 | 2021-06-22 | 胡慧红 | Flat pasting equipment for wafer photoetching development |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120404 Termination date: 20130823 |