JPH0213934B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a bonding apparatus for bonding a semiconductor chip or other electronic component chip onto a substrate or lead frame made of ceramic, aluminum, glass epoxy, etc.

Conventional configurations and their problems In general, as a method for connecting the pad portion of a semiconductor chip to a lead frame portion on a substrate made of ceramic, aluminum, glass epoxy, etc., flip A bonding method called chip bonding has been put into practical use. As shown in FIG. 1, a conventional flip-chip bonding apparatus has two pellets placed on one X-Y table. Three connection pads are formed on the pellet. Reference numerals 4a and 4b are suction collets, and it is possible to evacuate the space in the suction collets 6 through the vacuum tube 5. 7 is an arm to which the suction collet is slidably attached;
It is movable in A, B, C, and D directions. 8 is a pressure spring, and 9 is a collar provided to prevent the suction collet from falling off from the arm. Reference numeral 10 designates an intermediate position adjustment stage, and reference numerals 11 and 12 refer to adjustment claws for adjusting the position of the pellet on the intermediate position adjustment stage. 13 is a mounting head; 14
It is supported by a bearing and is movable in the directions of arrows E and F. Reference numeral 15 denotes an X-Y table to which 16 substrates are attached, and is arranged parallel to the surface 17 of the mounting head. Reference numeral 18 denotes a lead portion on the substrate, which can be connected to a pad of the pellet. The operation of the conventional bonding apparatus constructed as described above will be explained below with reference to the drawings. As shown in FIG. 1, a pellet 2 placed on an X-Y table 1 has a pad 3 formed thereon for connection to a lead frame portion of a board. The pellet 2 is positioned in the center of the suction collet 4a. Next, the arm 7 descends in the direction of arrow G and is attracted by the suction collet 4a. At the same time, the pellet 2 whose position has been regulated by the regulating claws 11 and 12 on the intermediate position regulating stage is sucked by the suction collet 4b, and when the suction is completed, the position regulating claws are released.
Next, the arm 7 moves in the directions of arrows D and A, and at the point where the centers of the suction collectors 4a and 4b have moved by the amount A, the arm 7 moves in the direction of the arrow C. The pellet 2 is connected to the intermediate position adjustment stage 10 and the mounting head 1.
Release the suction at the position touching 3 and remove the suction collect 4.
a and 4b move in the direction of arrow D and the direction of arrow B and return to their original positions. The position of the pellet on the intermediate positioning stage is regulated by positioning jaws 11 and 12. The pellet 2 placed on the mounting head 13 is supported by a bearing 14 and moves upward in the direction of arrow E. At this time, the substrate 16 has already been positioned at a predetermined position by the substrate XY table 15. When the raised pad of the pellet 2 comes into contact with the lead portion 18 of the substrate and bonding is completed, the mounting head 13 descends to complete the process. Thereafter, this operation is repeated to perform bonding.

However, in the above configuration, it is necessary to make the distance between the suction collets 4a and 4b attached to the arm 7 and the dimensions A and B the same, but this position adjustment is very difficult. In addition, in such a bonding method, in order to improve the reliability of the bonding equipment, it is necessary to position the lead part on the substrate and the pad part of the pellet with high precision, but in the conventional method, the position of the pad part with respect to the outer periphery of the pellet is required. Due to the variation in position and the variation in the position of the lead portion on the board, highly accurate positioning and bonding were impossible.

OBJECTS OF THE INVENTION In view of the above-mentioned drawbacks, the present invention provides a bonding device that connects the pad portion of a pellet and the lead portion of a substrate with high precision and productivity.

Structure of the Invention The present invention includes a transport means capable of sucking and transporting pellets one by one, which have been positioned by a pellet positioning table and a recognition device that detects the position, and a transport means capable of sucking and transporting pellets one by one, which have been positioned by a pellet positioning table and a recognition device that detects the position, An intermediate position regulating part that regulates the position at an intermediate position provided at a position different from the positioning table, a bonding arm that sucks and transfers the pellets regulated by the regulating part from the lower surface, and a rotation mechanism that can rotate the suction means by 180 degrees. a suction means positioning table that can position the suction means and the rotation mechanism in two orthogonal directions; a substrate positioning table that holds the substrate and positions it in two orthogonal directions and the rotational direction; It is equipped with a recognition device that can detect the position of the pad, and since the position of the pellet and the lead portion of the board are directly determined by the recognition device, highly accurate bonding is possible. Furthermore, by providing the intermediate position regulating section, it becomes possible to move the transfer arm and the bonding arm independently, which has the unique effect of improving productivity.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIGS. 2 to 5, a wafer 19 is held on a pellet positioning table 20 and can be positioned at any desired position. 2
Reference numeral 1 denotes a position detecting device for detecting the position of the pellets on the table and 22. Reference numeral 23 denotes a movable arm, which has a suction collet 24 at its tip for suctioning the pellets, and is movable up and down and back and forth. 25 is an intermediate position adjustment stage 26,2
It has a standard size of 7.

Reference numeral 28 holds the substrate 29 and is capable of rotation and arbitrary positioning in the X and Y directions. A bonding arm 30 has a suction collet 34 capable of suctioning pellets 32 at its tip end attached to a reversing mechanism 31 rotatable through 180 degrees.

Reference numeral 33 denotes a bonding arm Z table that can move the bonding arm in the vertical direction, and is mounted on the bonding arm positioning table 35. 36 is a lead portion on the substrate. 37 is a pattern recognition device that detects the position of the lead part on the board and the pellet;
The recognition device is mounted on 38 camera Z-axis tables that can be positioned in any vertical position. The operation of the bonding apparatus configured as described above will be explained below. The pellet 22 is positioned at an arbitrary position by the pattern recognition device 21 and the pellet positioning table 20. Next, the pellet 22 is collected by the suction collet 24.
The transfer arm 23 moves along a trajectory by a cam, cylinder, etc. (not shown), stops on the intermediate position regulating part, and then moves to the position regulating part 26,
27 holds the side surface of the pellet 22 properly. Next, 24 releases the adsorption, and the transfer arm 23
Return to the original position along the trajectory of H. Bonding arm 3 having a suction collet 34 at the tip
0 is the bonding arm positioning table 35
As a result, it moves along a trajectory M and vacuum-adsorbs the lower surface of the pellet 22.

When suction is completed, the position adjustment pieces 26, 27
move in the directions of arrows K and L, respectively, and release the position regulation. After that, the bonding arm is
move along the trajectory of At this time, the lead portion 36 on the substrate 29 is positioned at a predetermined position by a pattern recognition device 37 and a substrate positioning table 28. Next, the pattern recognition device 37 is moved by the Z-axis table, and then the bonding arm 30 enters the recognition range of 37, focuses by 38, and performs position detection. The positional deviation of the pellet 33 detected by the pattern recognition device 37 is corrected by the amount of deviation detected by the positioning table 35, and the pellet 33 is positioned at a regular position.

Then, the positional deviation I between the center position of the pellet 32 and the rotation center 39 of the reversing mechanism 31 is calculated. Next, the pellet is reversed 180 degrees by the reversing mechanism 31 to face the substrate 29, and its position is further corrected by the positional deviation I by the substrate positioning table 28. When the position correction is completed, the table 33 moves in the direction of arrow J, and the lead portion 36 and the pellet 32 are connected by thermocompression bonding or the like. When the connection is completed, the vacuum suction of the suction collet is released and the arm 30
rises to complete the bonding. Also, if there is an angular misalignment between the pad and the lead, the position of the board is corrected using the positioning table 28.

As described above, according to this embodiment, there is provided a pellet positioning table that holds pellets and is movable in orthogonal directions, a recognition device that detects the position of pellets,
A transfer arm that picks up and transfers positioned pellets one by one; a bonding arm that adjusts the position at the intermediate section; and a bonding arm that can pick up pellets transferred by the transfer arm; and a rotation that reverses the bonding arm by 180 degrees. A positioning table that can move the mechanism and the arm in orthogonal directions, a positioning table that holds the substrate and can move in two orthogonal directions and a rotational direction, and recognition that can detect the positions of the lead part and pellet pad on the substrate. By positionally regulating the pellet at the intermediate position by providing a device, it becomes possible to simultaneously transport the pellet to the intermediate regulating part and from the intermediate regulating part to the bonding position. Furthermore, although all conventional positional adjustments were made based on the outer periphery of the pellet, the recognition device can directly detect the pellet and the lead portion, making it possible to perform bonding with high precision. Also, highly accurate bonding can be performed even when there is an angular misalignment between the pad and the lead.

Although the heating means is provided on the bonding arm 30, it may also be provided on the positioning table that holds the substrate 29, and the same effect can be expected.
Further, if an ultrasonic horn is used for the bonding arm 30, bonding at low temperature or room temperature is also possible.

Effects of the Invention As described above, the present invention provides a positioning table capable of detecting the pad position of pellets transferred from the pellet positioning table and the position of the lead portion of the board, an intermediate position regulating section for regulating the position at an intermediate position,
By providing a bonding arm that rotates the pellet whose position has been detected by 180 degrees and bonds it to the substrate, the pellet can be transferred from the X/Y table to the intermediate position adjustment and from the intermediate adjustment section to the bonding position at the same time. This makes it possible to improve bonding speed. Furthermore, by directly detecting the lead portion of the pellet and the substrate, highly accurate bonding is possible. Furthermore, since all position detection can be performed from above, the configuration of the machine becomes easy.

Furthermore, since the positions of the pellet and the leads on the substrate are finally detected and corrected at the bonding position, the position of the entire machine can be easily adjusted.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a conventional bonding device, FIG. 2 is a perspective view of a bonding device according to an embodiment of the present invention, FIGS. 3 and 4 are front views of a recognition device and a positioning table, and FIG. 5 is a front view of a recognition device and a positioning table. FIG. 3 is a cross-sectional view of the bonding device. 22... pellet, 21... recognition device, 20...
...Positioning table, 25...Intermediate regulating section, 28
... Board positioning table, 30... Bonding arm, 31... Reversing mechanism, 37... Recognition device.

Claims (1)

[Claims] 1. A pellet positioning table that holds pellets and is movable in two orthogonal directions, a recognition device that detects the position of the pellets, a transfer means that picks up and transfers the positioned pellets one by one, and the pellet positioning table. an intermediate position regulating part for the pellet provided at a different position from the pellet, a suction means for sucking and transferring the lower surface of the pellet on the intermediate position regulating part, a rotation mechanism for rotating the suction means by 180 degrees, and a An arm positioning table that can move the means in two orthogonal directions, a substrate positioning table that holds the board and can move in two orthogonal directions and a rotational direction, and can detect the positions of the lead part and pellet on the board. A bonding device equipped with a recognition device.