JP3420073B2 - Component supply apparatus and method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for supplying parts, for example, after picking up an IC chip on a tray or an expanded sheet with a suction nozzle,
The present invention relates to an apparatus and method for reversing and supplying the front and back of a component by rotating a suction nozzle by 180 degrees, and a component mounting method for mounting a component on a circuit board using the above-described supply apparatus and method.

[0002]

2. Description of the Related Art In recent years, flip chip mounting has been carried out by MCM.
Since the circuit board can be miniaturized as represented by (multi-chip module) and CSP (chip size package), it is becoming the mainstream in the field of semiconductor mounting.

A device as shown in FIG. 3 is used for mounting the flip chip, and the IC chip 102 positioned on the tray 101 with the circuit surface facing upward is attached to the suction nozzle 103.
After picking up by picking up at
The C chip 102 is supplied to the mounting nozzle 104a of the bonding head (mounting head) 104 for mounting on the circuit board 119 in a state where the suction nozzle 103 is turned 180 degrees to turn the surface over.

Alternatively, using a similar device as shown in FIG. 4, the chips 112 on the expanding sheet 111 are picked up by the suction nozzle 103, and then the suction nozzle 10 is used.
By turning 3, the chip 112 is transferred to the mounting nozzle 104a by reversing the front and back.

As a result, the mounting nozzle 104a of the bonding head 104 adsorbs the IC chips 102 and 112 whose circuit surfaces face downward by reversing the supplied front and back and carries them to the mounting position, and a predetermined position on the circuit board 119. The IC chip 102, 112 is mounted on the circuit board 119 by soldering the circuit surface downward at the position of, and by soldering the terminal provided on the circuit surface and the terminal portion of the conductor pattern on the circuit board 119. Implement.

In the apparatus shown in FIGS. 3 and 4, the tray 101 or the expanding sheet 111 is moved in the Y direction by the mobile robot 1 in order to reversely supply the IC chips 102 and 112.
In addition to the positioning of the suction nozzle 103 at the required position in the Y direction by means of 05, the suction robot 103 can be positioned at the required position in the X direction by the mobile robot 106 in the X direction which moves in the X direction perpendicular to the Y direction. This allows
The IC chips 102 and 112 at any position on the tray 101 or the expanded sheet 111 can be adsorbed and picked up by facing a predetermined adsorption nozzle 103. The suction nozzle 103 of the IC chips 102 and 112 at this time
Positioning in the X and Y directions with respect to is performed based on the recognition by the recognition camera 107. The IC chips 102 and 112 are picked up by vertical movement of the suction nozzle 103 by a vertical movement mechanism 108 provided in the mobile robot 106.

Further, the suction nozzle 103 has a vertical movement mechanism 108 for reversing the front and back of the IC chips 102 and 112.
On the other hand, the downward suction nozzle 103 that holds the IC chips 102 and 112 by holding it by the swivel mechanism 117 having a swivel centerline Q that is perpendicular to the axis P of the suction nozzle 103 at any swivel position. Is turned 180 degrees around the turning center line Q so that the arrow turns upward.

[0008]

In the above-described component supply device, the IC chip 102 at a predetermined position on the tray 101 as shown in FIG. As shown in FIG. 5B, the tray 1 may be displaced from a predetermined position on the tray.
The position on 01 is recognized by the recognition camera 107, the position correction amount is obtained from the relative position between the center axis of the camera and the center point of the IC chip 102, and the position of the suction nozzle 103 is adjusted in the XY direction. The IC chip is picked up after correcting the displacement of the IC chip.

However, at this time, when the IC chip 102 is deviated by a certain angle in the rotation direction, even if the positional deviation in the XY directions is corrected as described above, the IC chip 102 still has the IC position as shown in FIG. The tip 102 remains displaced in the direction of rotation,
When trying to adsorb the IC chip 102 in this state,
Depending on the type of the IC chip 102, the suction nozzle 103 may not hit a predetermined position, and may hit a troubled part such as a circuit surface of the IC chip 102.
The circuit surface of 02 may be chipped or scratched.

Further, in the component supplying apparatus shown in FIG.
When the wafer 113 after dicing is placed on the stretched expanded sheet 111 and the individual chips 112 are separated from each other due to the expansion of the expanded sheet 111, the entire wafer 11 with respect to the expanded sheet 111 is provided.
In addition to the positional deviation of No. 3, the individual chips 112 also have positional deviations and rotational deviations as described above due to non-uniformity in the expansion of the expanding sheet 111, and therefore these must also be position-corrected.

Further, when the IC chips 102 and 112 are transferred from the suction nozzle 103 to the mounting nozzle 104a of the bonding head 104 and conveyed, the bump portion 1 on the IC chips 102 and 112 is again detected by the recognition camera 127.
20 and the circuit position are recognized and position correction for mounting is performed, but in order to more accurately recognize the circuit surface, which tends to become more and more complicated due to the recent miniaturization of circuit boards, it is possible to achieve high accuracy in a narrow field of view. The recognition is performed. Therefore, if the IC chips 102 and 112 sucked by the mounting nozzle 104a are displaced from a predetermined position, there is a problem that they are out of the field of view of the recognition camera 127. When the IC chips 102 and 112 are picked up by the suction nozzle 103 from 101 or the expanded sheet 111, there is an increasing need for suction at a more accurate position.

An object of the present invention is to provide a component supply device capable of picking up a component to be picked up and mounting it without any problem even if the component to be picked up is deviated in the rotation direction around the axis of the suction nozzle for picking it up. It is to provide the method and the component mounting method.

[0013]

In order to achieve the above object, the component supply device of the present invention is configured such that components arranged in parallel are picked up by a suction nozzle from above and picked up, and the component is picked up downward. In the case where the nozzle is turned 180 degrees so as to be directed upwards and thereby the parts whose front and back are reversed are used for various uses, the rotation of the suction nozzle about the axis of the suction nozzle is turned on the turning mechanism that turns the suction nozzle. A moving mechanism, a detection means for detecting a rotational deviation amount of a component to be picked up next with respect to the suction nozzle that picks up this component, and a component corresponding to the suction nozzle according to the detection result of the detection means. And a control means for controlling the rotating mechanism so as to rotate about the required angle axis before the suction.

In order to achieve the above object, in the component supplying method of the present invention, the components arranged in parallel are picked up from the upper side by the suction nozzle and picked up, and the downward suction nozzle picking up the component is set upward. To be 1
In a method of reversing the front and back of a component that is rotated by 80 degrees and thereby the component whose front and back are reversed is used for various uses, the amount of rotational deviation of the component to be picked up next about the axis of the suction nozzle that picks up this component is detected, According to this detection result, after the suction nozzle sucks the component, the suction nozzle is rotated around the axis by a required angle, and after the position is corrected so that the component is located at the predetermined position with respect to the predetermined posture of the suction nozzle. The component is picked up by the suction nozzle, the suction nozzle is returned to the predetermined posture, and then the suction nozzle is rotated to reverse the front and back of the component for various uses. In such a configuration, the amount of rotational deviation of the component to be picked up and picked up next, around the axis of the suction nozzle that picks up and picks up this component is detected by the detection means, and the control means, depending on the detection result, Before the suction nozzle picks up the component related to the detection, the rotation mechanism is activated to rotate the suction nozzle about the axis by the required angle, so that the suction nozzle always moves to the predetermined position where the angle around the axis coincides. It is possible to adsorb and pick up the component, and it is possible to eliminate the concern that the adsorption nozzle may hit the circuit surface of the component and cause chipping or damage.

Further, the swivel mechanism is provided with a plurality of suction nozzles around the swivel center line in a radial manner, and the plurality of suction nozzles are sequentially used to pick up the component with less idle time, or a plurality of suction nozzles are used. It is also possible to properly use various parts according to the kind of parts so that various parts can be optimally handled and supplied.

In order to achieve the above object, the component mounting method of the present invention is such that components arranged in parallel are picked up by a suction nozzle, picked up, and then transferred to a mounting nozzle, and the circuit board is mounted by the mounting nozzle. In the component mounting method to be mounted on the above, before sucking the components arranged in parallel by the suction nozzle, the amount of rotation deviation of the component around the axis of the suction nozzle is detected, and the suction nozzle is determined according to the detection result. Before sucking the component, the suction nozzle is rotated around the axis of the suction nozzle at a required angle, and after the position is corrected so that the component is located at a predetermined position with respect to the suction nozzle, the component is picked up by the suction nozzle, The suction nozzle is turned to reverse the front and back of the component, the component is suction-transferred to the mounting nozzle, and the mounting nozzle is conveyed to the mounting position of the component on the circuit board. It was recognized by the recognition means the position of the part being adsorbed again mounted nozzle, characterized by mounting components on a circuit board after the position correction component in accordance with the recognition result.

According to the above method, before the component is sucked, the rotational deviation of the component around the axis of the suction nozzle that is trying to suck the component is detected, and the suction nozzle is rotated by the required amount to suck the component. Therefore, the component can be accurately sucked at a predetermined position of the suction nozzle, and it is possible to prevent the component from being out of the visual field of the recognition means when the component position is re-recognized after being transferred from the suction nozzle to the mounting nozzle. As a result, the component suction position is more surely recognized, so that a mounting error in the mounting operation can be prevented and the work efficiency can be improved.

Further, according to the component mounting method of the present invention, after the components arranged in parallel are picked up by the suction nozzle and picked up and then transferred to the intermediate station, the components on the intermediate station are picked up by the mounting nozzle and picked up. In the component mounting method for mounting on a circuit board, before sucking the components arranged in parallel by the suction nozzle,
The amount of rotation deviation around the axis of the suction nozzle is detected, and the suction nozzle is rotated about a required angle around the axis of the suction nozzle before the suction nozzle picks up the component according to the detection result. After the component is position-corrected to the posture, the component is picked up by the suction nozzle, the component is transferred to the intermediate station, and the component on the intermediate station is suctioned by the mounting nozzle. Recognize the position of the component, which is picked up and again adsorbed by the mounting nozzle when the mounting nozzle is conveyed to the mounting position on the circuit board of the component,
After the position of the component is corrected according to the recognition result, the component is mounted on the circuit board.

According to the above method, the components picked up by the suction nozzles are once transferred to the intermediate station, and the components on the intermediate station are picked up by the mounting nozzles and mounted on the circuit board. The present invention can be applied to Then, as a result of being able to accurately pick up the component at the predetermined position of the suction nozzle, the component can be transferred to the correct position on the intermediate station, and along with this, the component can be accurately sucked at the predetermined position of the mounting nozzle. When re-recognizing the position of the mounted component, it is possible to prevent it from being out of the visual field of the recognition means, and to more accurately recognize the component suction position, thereby preventing mounting mistakes during mounting operation and improving work efficiency. Can be made.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to FIGS. 1, 2 and 3.

The component supply device of the embodiment described below is used in a component mounting device similar to the conventional one shown in FIGS. 3 and 4, but its operation is almost the same as that described in the prior art. Therefore, redundant description will be omitted. Since the suction nozzle 103 and the recognition camera 107 in the conventional example have different functions from those of the present invention,
When the present invention is described with reference to FIG. 3, the suction nozzles and the recognition camera will be described with reference numerals 3 and 7.

In this embodiment, similarly to the conventional apparatus shown in FIGS. 3 and 4, the IC chips (components) 102 are arranged in parallel on the tray 101 or the expanding sheet and are positioned with the circuit surface facing upward. After picking up by picking up by picking up by the suction nozzle 3, the picked-up IC chip 102 of the bonding head (mounting head) 104 which mounts on the circuit board 119 in the state which turned the suction nozzle 3 180 degrees and turned over. It is supplied to the mounting nozzle 104a.

As shown in FIGS. 1 (a) and 1 (b), the schematic construction of the mobile robot 105 is such that the tray 101 is moved in the Y direction.
In addition to the positioning at the required position in the Y direction, the mobile robot 106 in the X direction, which moves the suction nozzle 3 in the X direction perpendicular to the Y direction, can be positioned at the required position in the X direction. Each mobile robot 10
Reference numerals 5 and 106 denote, for example, a Y-direction moving body 11 and an X-direction moving body 12 that support the tray 101 and the suction nozzle 3 so as to move in predetermined Y and X directions, and the Y-direction moving body 11 and the X-direction moving body. It is composed of a screw shaft (not shown) driven by a servo motor that moves the lens 12 to a predetermined position in the predetermined Y and X directions. As a result, the IC chip 102 at any position on the tray 101 can be attached to the predetermined suction nozzle 3
Can be adsorbed and picked up opposite to. The positioning state at this time is performed based on the image recognition by the recognition camera 7.

However, these positioning mechanisms are not limited to those described above, and various other mechanisms can be adopted as appropriate.

The IC chip 102 is picked up by the vertical movement of the suction nozzle 3 by the vertical movement mechanism 8 provided on the X-direction moving body 12 of the mobile robot 106. The up-and-down moving mechanism 8 is supported by the X-direction moving body 12 via an up-and-down guide 13 so as to be able to move up and down, a cam 15 driven by a servo motor 14 provided in the X-direction moving body 12, A cam follower 16 is provided on the vertical moving body 9 so as to follow the cam 15. As a result, the cam 15 of the vertical moving body 9 is moved to the servo motor 1
4 is driven by the cam 15 via the cam follower 16 and moved up and down with the suction nozzle 3, and when it is moved down onto the corresponding IC chip 102, it is sucked.
The IC chip 102 adsorbed by the upward movement after adsorption is picked up from the tray 101.

Further, in order to reverse the front and back of the IC chip 2 of the suction nozzle 3, the suction nozzle 3 is attached to the vertical moving body 9.
A swivel mechanism 1 having a swivel centerline Q perpendicular to the axis P of
17, the IC chip 102 is picked up, and the downward suction nozzle 3 shown in FIG. 1 is turned 180 degrees around the turning center line Q so as to face upward. The revolving mechanism 117 is a revolving structure 2 supported by the vertical moving body 9 so as to be rotatable around a revolving center line Q.
1 holds the suction nozzle 3 and rotates a pulley 23 rotatably driven by a servo motor 22 provided on the vertical moving body 9, and a pulley concentric with a swing center line B integrally provided on the swing body 21 by a belt 24. 25, the revolving unit 21 is reciprocated around the revolving center line Q by 180 degrees, or reciprocally or in one direction. The IC chip 102 is turned upside down.

For example, when a servomotor that rotates in one direction is used, an actuator that stops each time it rotates 180 degrees may be used. Therefore, a disk with a slit cut every 180 degrees and a sensor for detecting the disk are provided. It may be composed of an induction motor or a rotary actuator.

In particular, in the present embodiment, a rotating mechanism 31 for rotating the suction nozzle 3 around its axis P on the revolving structure 21 of the revolving mechanism 117 for revolving the suction nozzle 3, and the rotating mechanism 31. The control means 32 includes a control CPU and other various control circuits, and the control means 32 detects the recognition camera 7 by sharing it with the detection means. This IC chip 1 of the IC chip 102 to be picked up next
In accordance with the amount of rotation deviation around the axis P with respect to the suction nozzle 3 that picks up 02, the suction nozzle 3 corresponds to I.
The rotating mechanism 31 is controlled so as to rotate around the required angle axis before the C chip 102 is sucked.

As shown in FIG. 1B, the rotating mechanism 31 has a ball nut 34 whose rotational movement is restricted by a linear guide 33 on the revolving structure 21, and the ball nut 34.
The ball screw 35 that is fitted to the suction nozzle 3 and is integrally connected to the suction nozzle 3, and the cam 36 that rotates on the swivel body 21 about a swing center line Q that is orthogonal to the axis P of the suction nozzle 3.
And a servo motor 37 that rotationally drives the cam 36,
The cam follower 38 is provided on the ball nut 34 so as to follow the cam 36.

In the operation of reversing and supplying the IC chip 102, the IC chip 102 to be picked up next time
The amount of deviation of the suction nozzle 3 for sucking and picking up the IC chip 102 in the rotation direction about the axis P is X, Y.
It is detected by the image recognition by the recognition camera 7 together with the deviation amount in the direction. If the detection result does not match with the desired suction position determined by the shape of the suction nozzle 3, the control unit 32 causes the servo motor 37 to suck the IC chip 102 related to the detection by the servo motor 37 before the suction nozzle 3 sucks the IC chip 102.
The cam 36 is rotated by the required amount in the rotation direction.

When the cam 36 is rotated, the ball nut 34
The rotational movement is restricted by the linear guide 33, so that the ball screw 35 is moved up and down through the cam follower 38 while the ball screw 35 is rotated clockwise or counterclockwise with the suction nozzle 3 by an amount corresponding to the vertical movement amount. The suction nozzle 3 picks up I
The rotation angle position of the C chip 102 coincides with the desired suction position of the suction nozzle 3. This gives X,
Along with the coincidence in the Y direction, the suction nozzle 3 can always pick up and pick up the IC chip 102 whose angle around the axis P is the same, and the suction nozzle 3 hits the circuit surface of the IC chip 2 one-sided to cause chipping or damage. You can eliminate the worry of giving.

The configurations of the vertical movement mechanism, the turning mechanism, and the turning mechanism of the suction nozzle 3 described above are merely specific examples, and needless to say, various configurations other than the above may be employed. Yes.

In FIGS. 2A and 2B, the swivel mechanism 117 is provided with a plurality of suction nozzles 3 around the swivel center line Q in a radial pattern. Thereby, it is possible to sequentially use a plurality of suction nozzles 3 having the same nozzle diameter to pick up the IC chip 102 with less play time. However, if a plurality of suction nozzles 3 having different nozzle diameters are used, the type of component can be changed. Correspondingly, different nozzles can be used and various parts can be optimally handled and supplied. Since other configurations are the same as those shown in FIGS. 1A and 1B and the operational effects obtained are the same, the same members are designated by the same reference numerals, and a duplicate description will be omitted.

Specifically, four suction nozzles 3 having different nozzle diameters are attached to the revolving structure 21, and four types of ICs housed in four trays 101 supplied by the mobile robot 105.
Different types of suction nozzles 3 are used for the chips 102, and the types of IC chips 102 required at each time are used.
Are picked up by the corresponding suction nozzles 3. This allows different types of IC chips 1
02 can be efficiently supplied according to a predetermined mounting program.

As a result, while exhibiting the same characteristics as those shown in FIGS. 1 (a) and 1 (b), it is possible to deal with a wide variety of products.

Next, a component mounting method by the component mounting apparatus having the above-mentioned component supply apparatus will be specifically described.

Before the IC chips 102 arranged in parallel are sucked by the suction nozzle 3 facing downward, the IC chip 10
2 together with the amount of positional deviation in the X and Y directions, the suction nozzle 3
The amount of rotation deviation around the axis P of is detected by the recognition camera 7,
According to this detection result, the suction nozzle 3 is rotated around the axis P of the suction nozzle 3 at a required angle before the suction nozzle 3 sucks the IC chip 102, and the IC chip 102 is rotated with respect to a predetermined posture of the suction nozzle 3. After performing position correction so that is positioned at a predetermined position, position correction in the X and Y directions is also performed,
The picking up of the IC chip 102 by the suction nozzle 3 is as described above.

Next, the suction nozzle 3 is swung 180 degrees around the swivel center line Q, and the IC chip 102 is moved to the intermediate station S where the suction nozzle 3 faces upward and the upper and lower surfaces of the IC chip 102 are inverted. As a result, the front and back of the IC chip 102 are reversed. During turning of the IC chip 102 (may be before turning or after turning).
Then, the rotation position of the suction nozzle 3 about the axis P is returned to the normal position and brought to a predetermined posture position.

At the intermediate station S, the IC chip 102 is suction-transferred to the mounting nozzle 104a of the bonding head 104. When the mounting nozzle 104a is conveyed to the mounting position of the IC chip 102 on the circuit board 119, the I that is adsorbed by the mounting nozzle 104a again.
The position of the C chip 102 is recognized by the second recognition camera 127. At the time of this recognition, the IC chip 102 is mounted on the mounting nozzle 104 at substantially the correct X and Y positions and the correct rotational posture position.
Since the second recognition camera 127 is attached to a, the second recognition camera 127 can perform accurate recognition even if the second recognition camera 127 has a narrow field of view. This second recognition camera 1
Reference numeral 27 detects the amount of deviation in the X and Y directions and the amount of rotational deviation about the nozzle axis, as in the conventional case.

Based on the recognition result of the second recognition camera 127, the mounting nozzle 104a is corrected on the circuit board 119 in a state in which the displacement amounts in the X and Y directions and the rotational displacement amount around the nozzle axis are corrected in the same manner as the conventional one. The IC chip 102 is mounted in the correct position at the correct position. In addition, as the correction operation of the displacement amount, X of the bonding head 104,
Correction movement in the Y direction and correction rotation around the axis of the mounting nozzle 104a can be given as an example.

The component mounting method of the present invention is the IC shown in FIG.
The present invention can be applied not only to a component mounting apparatus of the type in which the chip 102 is turned upside down, but also to a general component mounting apparatus in which the suction surface of the component always faces upward (the circuit surface always faces downward). In this case, the component picked up by the suction nozzle is transferred to a separately provided intermediate station S, and the component on the intermediate station S is picked up by the mounting nozzle and picked up. Will be implemented on top.

[0042]

According to the present invention, when a component picked up by a suction nozzle is picked up and turned upside down, the suction nozzle always picks up a component in a state where the angular positions around its axis match. Therefore, it is possible to eliminate the fear that the suction nozzle hits the circuit surface of the component on one side and is damaged or chipped.

In addition, a plurality of suction nozzles are sequentially used to pick up a component with less play time, or a plurality of suction nozzles are selectively used according to the type of the component so that various components can be optimally handled and supplied. Therefore, it is possible to deal with a wide variety of parts.

Further, since the suction nozzle always sucks the component in a state where the angular positions around the axis thereof are matched, the component is recognized by the recognition camera when the component position is re-recognized after being transferred from the suction nozzle to the mounting nozzle. It is possible to avoid the inconvenience of being out of the field of view of the component, and the component is surely adsorbed to the predetermined position of the mounting nozzle, so that a mounting error in the mounting operation can be prevented and the work efficiency can be improved.

[Brief description of drawings]

1A and 1B are overall configuration diagrams of a component reversal supply device according to an embodiment of the present invention, in which FIG. 1A is a front view and FIG.

2A and 2B are overall configuration diagrams showing a modified example of the component reversal supply device according to the embodiment of the present invention, FIG. 2A is a front view, and FIG.

FIG. 3 is a perspective view showing an overall configuration of a component mounting apparatus.

FIG. 4 is a perspective view showing an overall configuration of a component mounting apparatus.

FIG. 5 shows various positions of the IC chip on the tray (a),
It is explanatory drawing shown to (b) and (c).

[Explanation of symbols]

101 tray 102 IC chips (parts) 3 suction nozzle 104 bonding head 104a mounting nozzle 105, 106 mobile robots 7 recognition camera 8 Vertical movement mechanism 31 rotation mechanism 32 control means 34 ball nut 35 ball screw 36 cam 37 Servo motor 38 Cam Follower 117 Turning mechanism 119 circuit board 127 Second recognition camera P axis Q Turn center line S Intermediate station

─────────────────────────────────────────────────── --- Continuation of the front page (72) Kenji Takahashi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Hiroshi Nasu, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (56) References JP-A-56-40253 (JP, A) JP-A-3-29334 (JP, A) JP-A-10-190294 (JP, A) JP-A-9-92664 (JP, A) JP-A-3-131100 (JP, A) JP-A-6-244245 (JP, A) JP-A-8-306764 (JP, A) JP-A-2-226737 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60 H01L 21/52 H01L 21/68 B23P 19/00 B23P 21/00 H05K 13/04

Claims (5)

(57) [Claims] 1. A component arranged in parallel is picked up by suction from an upper side by a suction nozzle, and a downward suction nozzle picking up the component is turned 180 degrees so as to face upward, whereby various parts whose front and back are reversed are formed. In the component supply device used, the rotation mechanism that rotates the suction nozzle around its axis on the rotation mechanism that rotates the suction nozzle, and the rotation of the axis of the next picked-up component with respect to the suction nozzle that picks up this component. Detecting means for detecting the amount of rotational deviation of the rotating body, and control means for controlling the rotating mechanism so as to rotate the suction nozzle around the required angle axis before sucking the corresponding component according to the detection result of the detecting means. And a parts supply device. 2. The component supply device according to claim 1, wherein the swivel mechanism is provided with a plurality of suction nozzles radially around the swivel center line. 3. The parts arranged in parallel are picked up by picking up the picked-up parts by a pick-up nozzle, and the downward pick-up nozzle picking up the part is turned 180 degrees so as to face upward, whereby various parts whose front and back are reversed are variously picked up. In the component supply method to be used, the amount of rotation deviation of the component to be picked up next, about the axis of the suction nozzle that picks up this component, is detected, and according to the detection result, before the suction nozzle sucks the component. Rotate the suction nozzle about the required angle around the axis,
After correcting the position so that the component is located at the predetermined position with respect to the suction nozzle, pick up the component with the suction nozzle,
A component supplying method, characterized in that the suction nozzle is swung to reverse the front and back of the component and used for various uses. 4. A component mounting method in which components arranged in parallel are picked up by a suction nozzle, picked up, and then transferred to a mounting nozzle, and mounted on a circuit board by the mounting nozzle. Components arranged in parallel by a suction nozzle. Before adsorbing
The amount of rotation deviation of the component about the axis of the suction nozzle is detected, and the suction nozzle is rotated about the axis of the suction nozzle by the required angle before the suction nozzle sucks the component according to the detection result. After the position is corrected so that the component is located at the predetermined position with respect to the predetermined posture of the nozzle, the component is picked up by the suction nozzle, and then the suction nozzle is swung to reverse the front and back of the component, and the component is used as a mounting nozzle. Recognizing the position of the component sucked by the mounting nozzle again when the mounting nozzle is conveyed to the mounting position of the component on the circuit board, and the position of the component is corrected according to the recognition result. A component mounting method comprising: mounting a component on a circuit board after performing the above. 5. A component mounted on a circuit board after the components arranged in parallel are picked up by a suction nozzle and picked up and then transferred to an intermediate station, and the component on this intermediate station is picked up by a mounting nozzle and picked up. In the mounting method, before picking up the components arranged in parallel by the suction nozzle,
The amount of rotation deviation of the component about the axis of the suction nozzle is detected, and the suction nozzle is rotated about the axis of the suction nozzle by the required angle before the suction nozzle sucks the component according to the detection result. After the position is corrected so that the part is located at the predetermined position with respect to the predetermined posture of the nozzle, the part is picked up by the suction nozzle, the part is transferred to the intermediate station, and the part on the intermediate station is mounted by the mounting nozzle. When picking up and picking up, and when the mounting nozzle is conveyed to the mounting position on the circuit board of the component, the position of the component that is sucked by the mounting nozzle is again recognized by the recognition means, and the position of the component is detected according to the recognition result. A component mounting method comprising mounting a component on a circuit board after correction.