JP4943352B2 - Electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting method, and more particularly to an electronic component mounting method that is suitable for application when reducing a load on a suction component and a motor that rotates the suction component in an electronic component mounting apparatus.

  In general, in an electronic component mounting apparatus, a target electronic component is sucked and held from a component supply unit by an XY movable mounting head and then mounted on a printed circuit board that is positioned and fixed.

  As such a mounting head, a plurality of θ axes (nozzle shafts) that are simultaneously rotated in the same direction by the same motor are provided, and each electronic component is adsorbed by an adsorbing nozzle attached to each θ axis. For example, Patent Document 1 discloses a device that can be mounted on a computer.

  Patent Document 2 discloses the same type of mounting head 31 as schematically shown in the plan view of FIG. A plurality of θ axes (six here) 35 on which suction nozzles (not shown) are mounted are simultaneously rotated by the single θ axis motor 32 in the mounting head 31 so that the mounting head 31 can be positioned at the same rotation angle.

  In this figure, the timing belt 34A rotationally drives the first, third, and fifth pulleys 35a from the left in the figure, and the timing belt 34B rotationally drives the second, fourth, and sixth pulleys 35a from the left in the figure. By rotating the θ-axis 35 on which is mounted, an electronic component (not shown) that is attracted is positioned in the rotational direction.

  These timing belts 34 </ b> A and 34 </ b> B are all driven by a pulley 33 attached to a θ-axis motor 32. Further, the pulley 36 is not fixed to the suction nozzle 35 and serves to apply tension to the timing belts 34A and 34B.

  When a plurality of suction nozzles are rotationally driven by one θ-axis motor 32, the suction shafts 35 are required to be positioned for each electronic component that is sucked by each suction nozzle and mounted.

Japanese Patent No. 3462621 JP 2007-103458 A

  However, when the electronic components are picked up at the specified pick-up angle by the pick-up nozzles that are mounted by rotating a plurality of θ axes with a single motor, from the pick-up to the pick-up There is a drawback in that the rotational operation of the component is more than necessary in the mounting process, and the component is rotated excessively.

  For example, consider the case where parts A and B are attracted and mounted under the following conditions. There is a process for recognizing a suction component between suction and mounting, but this is omitted here.

Part A: Adsorption angle 0 °, mounting angle 0 °
Part B: Adsorption angle 180 °, mounting angle 90 °

  Now, if the parts are picked up and mounted in the order of A and B, the part A will rotate 180 ° extra when picking up the component B, and will need to be rotated 180 ° to return to 0 ° when mounted. In other words, when the component A is mounted, the component B must be rotated 180 degrees more than the component B.

  The present invention has been made to solve the above-described conventional problems, and sucks and mounts components sequentially by suction nozzles respectively attached to a plurality of nozzle shafts (θ-axis) that are simultaneously rotated by the same motor. At the same time, it is an object to provide an electronic component mounting method capable of reducing the excessive rotation operation as much as possible and reducing the load applied to the component and the motor by the rotation operation.

  The present invention uses a mounting head having suction nozzles mounted on a plurality of nozzle shafts that are simultaneously rotated in the same direction by the same motor, and sequentially sucks electronic components by each suction nozzle and then sequentially on the substrate. In the electronic component mounting method to be mounted, the electronic components are sorted in descending order of the suction angle to determine the suction order of each electronic component, and the determined suction order is the same as or closest to the suction angle of the last electronic component. The electronic components are sorted in order from the mounting angle to the mounting angle, and the mounting order of each electronic component is determined, and the corresponding electronic components are sequentially sucked by the respective suction nozzles according to the determined suction order. According to the mounting order, corresponding problems are solved by sequentially mounting corresponding electronic components.

  According to the present invention, when components are sequentially sucked by a plurality of suction nozzles that are rotated at the same time and then mounted, the components are picked up in order of increasing or decreasing suction angle, and the same or most equal to the suction angle of the final suction component. Since parts can be mounted in order from the closest mounting angle, unnecessary rotations such as reverse rotation can be eliminated as much as possible, reducing unnecessary rotational movements and reducing the load on parts and motors by rotational movements. Can do.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view showing an outline of an electronic component mounting apparatus applied to an electronic component mounting method according to an embodiment of the present invention.

  In this mounting apparatus, the mounting head 1 can move in the X direction by the X-axis frame 2 and in the Y direction integrally with the X-axis frame 2 by the left and right Y-axis frames 3, and the mounting head 1 can be moved through the nozzle shaft. A predetermined component is sucked from the component supply unit 4 by the mounted suction nozzle, and is transported by the transport device 5 and can be mounted on the positioned substrate S.

  FIG. 2 is an enlarged plan view showing an outline of the mounting head 1. Two motors 10 are fixed to a base portion by a support member 12, and are rotated for each motor 10 via a timing belt 16 </ b> A by a pulley 14. Two rotary shafts (nozzle shafts) 18 are rotated, and the third rotary shaft is also rotated simultaneously via a timing belt 16B rotated by a coaxial pulley fixed to the central rotary shaft. Yes.

  Each of the two sets of the three rotating shafts 18 can be simultaneously rotated in the same direction by a single motor 10, and suction nozzles (not shown) are respectively attached to the lower ends of the rotating shafts 18 to suck the electronic components. It is possible.

  Using a set of rotating shafts 18 provided in the mounting head 1 and capable of simultaneous rotation, the three types of electronic components A, B, and C are sequentially sucked at the following suction angles by the attached suction nozzle. Then, after performing component recognition by 360 ° simultaneous rotation, when the components are sequentially mounted at the following mounting angles, the total absolute value of the rotation amount when each component is rotated forward and reverse is calculated.

Component A: Suction angle 0 °, mounting angle 90 ° Component B: Suction angle 90 °, mounting angle 0 ° Component C: Suction angle 180 °, mounting angle 90 °

  First, as in the conventional case, consider the case where the suction operation and the mounting operation are performed in the order of electronic components A, B, and C, respectively. In FIG. 3, electronic components are sequentially picked up by the suction nozzles indicated by the heads 1 to 3 in phases 1 to 3, and all components are simultaneously recognized by rotating 360 ° in phase 4, and then sequentially mounted in phases 5 to 7. The corresponding rotation amount is shown in the figure. In addition, simultaneous recognition of all components is performed by the laser sensor installed in the mounting head corresponding to each suction nozzle.

  When the rotation amount of each part is summarized for each phase, it becomes as shown in the table of FIG. 4. The total of parts A to C is all 630 ° and the total angle of all parts is 1890 °.

  On the other hand, in this embodiment, in accordance with the algorithm shown in the flowchart of FIG. 5, the order of component suction and the order of mounting are determined, and the component mounting operation by each suction nozzle is performed.

  That is, first, the suction angle of each part is acquired in Step 1, paired if there is a part having the same suction angle in Step 2, and sorted in descending order of the suction angle in Step 3. This is because the slower the adsorption order, the more the extra rotation has to be done, so there are many cases where it is less burdensome to adsorb after rotating to a larger angle first.

  On the other hand, the mounting angle of each component is acquired in step 4 separately, and if there is a component having the same mounting angle in step 5, pairing is performed.

  Next, in step 6, the mounting angles are sorted. At that time, the top of the mounting angle is set to the final angle when the suction angle is sorted, and sorting is performed so that the rotation amount is minimized from the angle. This is because when the final suction angle is equal to the head mounting angle, it is not necessary to rotate after the suction. However, if they are not equal, the mounting angle closest to the final suction angle is set.

  When the mounting order of electronic components is optimized using the “load reduction method” of the algorithm shown in the flowchart above, the picking order of the components is C → B → A, and the mounting order is B → A → C, and for each phase. The rotation angles of these parts are as shown in FIG. 6 when corresponding to FIG. 3, and as shown in FIG. As a result, the sum of the parts becomes part A = 450 °, part B = 450 °, part C = 630 °, and the total angle becomes 1530 °.

  As described above, the total angle according to the conventional method is 1890 °, but when the “load reduction method” according to the present invention is used, the total angle becomes 1530 °, and the rotation angle can be reduced. The load on the motor can be reduced.

  As described above in detail, according to the present embodiment, the following effects can be obtained.

  (1) The load on the component is reduced, and damage to the component itself can be prevented.

  (2) Since the rotational operation is reduced, the shift in the rotational direction can be prevented, so that the component mounting accuracy is improved.

  (3) The motor life can be extended by reducing the number of rotations of the motor.

  In the above-described embodiment, the case where the sorting of the suction angles is performed in the descending order has been described.

The top view which shows the outline | summary of the electronic component mounting apparatus applied to one Embodiment which concerns on this invention The top view which shows the outline | summary of the mounting head employ | adopted as this embodiment Explanatory drawing which shows the image of the rotation operation of the component by the conventional mounting operation Chart showing the amount of rotation of parts by conventional mounting operation The flowchart which shows the algorithm which determines the order of adsorption | suction of components, and mounting by this embodiment Explanatory drawing which shows the image of the rotation operation | movement of the components by the mounting operation of this embodiment Chart showing the amount of rotation of parts by the mounting operation of this embodiment Plan view showing the characteristics of a conventional mounting head

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mounting head 10 ... Motor 16A, 16B ... Timing belt 18 ... Nozzle shaft ((theta) axis)

Claims (1)

Electronic components that are sequentially mounted on a substrate after using the mounting heads equipped with suction nozzles mounted on multiple nozzle shafts that are simultaneously rotated in the same direction by the same motor, to pick up electronic components sequentially by each suction nozzle In the implementation method,
Sort the electronic components in order of increasing or decreasing suction angle to determine the suction order of each electronic component,
Sort the electronic components from the mounting angle that is the same or closest to the suction angle of the last electronic component and determine the mounting order of each electronic component,
An electronic component mounting method comprising: sequentially adsorbing corresponding electronic components by the respective suction nozzles according to a determined suction order; and sequentially mounting corresponding electronic components according to the determined mounting order.

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