JP5662839B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting a component supplied from an electronic component supply device on a substrate.

As a conventional electronic component mounting apparatus, by using a mounting head having a plurality of suction nozzles that can operate in the X, Y, Z, and θ axis directions, a plurality of electronic components are sucked and held at a time. Some are mounted sequentially on the substrate.
As such an electronic component mounting apparatus, there is an apparatus in which rotation axes in the θ direction of a plurality of suction nozzles are simultaneously controlled by a single motor (see, for example, Patent Document 1). However, in this case, if one θ rotation shaft is rotated, the other θ rotation shaft is also rotated at the same time, so that unnecessary θ rotation occurs during the mounting operation of the electronic component.

  Therefore, by determining the suction order and mounting order of the electronic components based on the suction angle of the electronic component by the suction nozzle and the mounting angle on the substrate, it is possible to reduce the extra rotation operation when picking up and mounting the electronic components. (For example, refer to Patent Document 2). This technology sorts electronic components in order of increasing or decreasing suction angle to determine the suction order of each electronic component, and the determined suction order is mounted from the mounting angle that is the same as or closest to the suction angle of the last electronic component. The electronic components are sorted in order from the closest angle to determine the mounting order of each electronic component. Here, after each electronic component is sucked in the above-mentioned picking order, component recognition is performed by simultaneous rotation of 360 ° using a laser sensor, and then the electronic components are sequentially mounted in the above-mentioned mounting order.

JP 2000-259250 A JP 2009-188028 A

  By the way, in the electronic component mounting apparatus, the electronic component is picked up by the suction nozzle and then the component recognition is performed to detect the electronic component suction position shift, and then the suction position shift is corrected and the electronic component is placed on the board. In this case, in order to mount the component with higher accuracy, it is desirable to perform the mounting operation without moving the θ direction as much as possible from the posture at the time of component recognition.

However, in the conventional device described in Patent Document 2, after the electronic component is recognized, θ rotation is required to place the component in the mounting posture before mounting the component. Therefore, it is not possible to mount components with higher accuracy.
Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of efficiently and accurately performing component recognition and component mounting.

In order to solve the above-described problem, an electronic component mounting apparatus according to claim 1 sequentially sucks electronic components by suction nozzles respectively attached to a plurality of nozzle shafts that are simultaneously rotated in the same direction by the same motor, An electronic component mounting apparatus that sequentially mounts the electronic components at predetermined mounting positions in order to change the electronic component from the initial suction posture where the electronic component is sucked by the suction nozzle to the mounting posture on the substrate. A suction order determining means for determining the suction order of electronic components in descending order of the necessary rotation angle, a component suction means for sequentially sucking electronic components according to the suction order determined by the suction order determining means, and the suction order As a result of sequentially picking up all the electronic components to be picked up according to the picking order determined by the determining means, the picking posture of all the electronic components becomes the mounting posture, respectively. , A component rotating unit that rotates the nozzle shaft every time the electronic component is adsorbed by the component adsorbing unit, and the mounting posture that is adsorbed by the adsorbing nozzle after adsorbing all the electronic components to be adsorbed by the component adsorbing unit Component recognition means for sequentially recognizing electronic components, and component mounting means for sequentially mounting electronic components at the mounting position based on the recognition result by the component recognition means , wherein the component rotation means comprises the suction nozzle The rotation angle of the nozzle shaft after suction of the electronic component sucked in is set to an angle obtained by subtracting the total rotation angle from suction to mounting of the electronic component sucked immediately after the required rotation angle of the electronic component. It is a feature.

In this way, when all the electronic components have been picked up, the picking posture of all the electronic components is set to the mounting posture on the board, so that the component recognition can be performed without requiring extra θ rotation. Can do. Further, even after the component recognition, the component can be mounted as it is without requiring an extra θ rotation. Therefore, when a component is mounted, the component mounting operation can be performed only by mounting position correction based on the component recognition result.
In addition, the component rotating means determines the rotation angle of the nozzle shaft after the electronic component sucked by the suction nozzle is the total rotation angle from the suction to mounting of the electronic component sucked immediately after the required rotation angle of the electronic component. Set to the subtracted angle. For this reason, the θ rotation amount can be minimized from component adsorption to component recognition and component mounting, and the adsorption posture when all electronic components have been absorbed can be efficiently changed to the respective mounting postures. it can.

According to a second aspect of the present invention, in the electronic component mounting apparatus according to the first aspect of the present invention, when the required rotation angle is the same as the supply angle from the component supply device of all the electronic components to be picked up, It is characterized by the mounting angle of the parts.
In this way, taking into account that the amount of rotation of the electronic components previously picked up is large, the picking order is set to the order sorted in descending order of the mounting angle, so that the total amount of rotation can be minimized.

Furthermore, in the electronic component mounting apparatus according to claim 3, in the invention according to claim 1 or 2, when the required rotation angles are different from the supply angles from the component supply apparatuses of all electronic components to be sucked, It is an angle obtained by subtracting the supply angle of the electronic component from the mounting angle of the electronic component.
Thereby, when the component supply angle is given (in the case other than 0 °), the suction order can be appropriately determined in consideration of the component supply angle.

According to a fourth aspect of the present invention, in the electronic component mounting apparatus according to any one of the first to third aspects, the suction order determining means sucks with a suction nozzle in which a suctionable angle of the electronic component is limited. The sucking order is determined so that the electronic component is sucked first.
As a result, even when a suction nozzle whose suctionable angle is determined is used in combination, it is possible to appropriately determine the suction order and perform component suction.

According to a fifth aspect of the present invention, there is provided an electronic component mounting method in which electronic components are sequentially sucked by suction nozzles respectively mounted on a plurality of nozzle shafts that are simultaneously rotated in the same direction by the same motor, and are placed at predetermined mounting positions on the substrate. An electronic component mounting method for sequentially mounting the electronic components, the minimum necessary rotation for changing the electronic component from the initial suction posture sucked by the suction nozzle from the component supply device to the mounting posture on the substrate The order of picking up electronic components is determined in descending order of angle, and when picking up electronic components sequentially according to the decided picking order, all electronic components to be picked up in accordance with the picking order are picked up as a result. After each electronic component is picked up, the nozzle shaft is rotated to pick up all the electronic components to be picked up so that the posture becomes the mounting posture. The electronic components in the mounting posture adsorbed by the suction nozzle are sequentially recognized, and the electronic components are sequentially mounted on the mounting position based on the recognition result , and when rotating the nozzle shaft, The rotation angle of the nozzle shaft after sucking the electronic component sucked by the suction nozzle is set to an angle obtained by subtracting the total rotation angle from the suction to mounting of the electronic component sucked immediately after the required rotation angle of the electronic component. The nozzle shaft is rotated .
Thereby, it is possible to provide an electronic component mounting method capable of performing component recognition operation and component mounting operation with high accuracy without requiring extra θ rotation.

  According to the present invention, when electronic components are sequentially picked up by a plurality of suction nozzles that are rotated simultaneously, then component recognition is performed, and then when all the electronic components are picked up, The suction order and the rotation amount of the suction nozzle after the suction are determined so that the suction posture of the electronic component becomes the mounting posture on the substrate. Therefore, the component recognition operation and the component mounting operation can be performed with high accuracy. In addition, since extra rotational motion can be reduced, it is possible to reduce the load on the electronic component and the motor that is the rotational drive source.

It is a top view which shows the electronic component mounting apparatus in this invention. It is a top view which shows the outline | summary of a mounting head. It is a block diagram which shows the structure of the control system of an electronic component mounting apparatus. It is a flowchart which shows the component mounting process sequence performed with a controller. It is a flowchart which shows the adsorption | suction order determination processing procedure. It is a flowchart which shows the rotation amount determination processing procedure. It is a figure which shows the image of rotation operation | movement of components. It is a figure which shows the image of the rotation operation | movement of the components by the mounting operation | movement which considered the supply angle of components. It is a figure which shows an angled nozzle. It is a figure which shows the image of the rotation operation | movement of the components by the mounting operation using an angled nozzle.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
(Constitution)
FIG. 1 is a plan view showing an electronic component mounting apparatus according to the present invention.
In the figure, reference numeral 1 denotes an electronic component mounting apparatus. The electronic component mounting apparatus 1 includes a pair of transport rails 11 extending in the X direction on the upper surface of the base 10. The transport rail 11 supports both sides of the circuit board 5 and is driven by a transport motor (not shown) to transport the circuit board 5 in the X direction.

The electronic component mounting apparatus 1 includes a mounting head 12. The mounting head 12 includes a plurality of suction nozzles that suck electronic components at the bottom, and is configured to be horizontally movable on the base 10 in the XY directions by the X-axis gantry 13 and the Y-axis gantry 14.
In this electronic component mounting apparatus 1, electronic component supply devices 15 that supply electronic components by a tape feeder or the like are mounted on both sides of the transport rail 11 in the Y direction. The electronic component supplied from the electronic component supply device 15 is vacuum-sucked by the suction nozzle of the mounting head 12 and mounted on the circuit board 5.

In addition, a recognition camera 21 including a CCD camera is disposed between the component supply device 15 and the circuit board 5. The recognition camera 21 detects the electronic component suction position deviation (deviation between the center position of the suction nozzle and the center position of the suctioned component) and the suction angle deviation (tilt) of the electronic component. Is taken.
A distance sensor 22 is attached to the mounting head 12. The distance sensor 22 measures the distance (height) in the Z direction between the suction nozzle and the circuit board 5 using sensor light.
Furthermore, the electronic component mounting apparatus 1 is provided with a nozzle changer 16 for exchanging the suction nozzle according to the size and shape of the component to be sucked. A plurality of types of nozzles are stored and managed in the nozzle changer 16.

FIG. 2 is a plan view showing an outline of the mounting head 12. As shown in FIG. 2, the mounting head 12 includes a plurality (here, two) of motors 12a whose base portions are fixed to the support member 12b. When each motor 12a is driven, two rotation shafts (nozzle shafts) 12f are simultaneously rotated by a pulley 12c rotated for each motor 12a via a timing belt 12d, and are coaxially fixed to a central rotation shaft 12f. Through the timing belt 12e rotated by the pulley, the third shaft 12f is also rotated simultaneously.
That is, the three rotation shafts 12f are set as one set, and the three rotation shafts 12f belonging to the same set can be simultaneously rotated in the same direction by one motor 12a. A suction nozzle (not shown) is attached to the lower end portion of each rotating shaft 12f so that electronic components can be sucked.

  In the present embodiment, three types of electronic components A, B, and C are sequentially sucked in a predetermined suction order by suction nozzles mounted on a set of three rotary shafts 12f that can rotate simultaneously. At this time, every time the electronic components A to C are sucked, each time the electronic components A to C are sucked so that the suction postures of the electronic components A to C are mounted on the respective circuit boards 5. The rotary shaft 12f is simultaneously rotated by a predetermined rotation amount. Then, after the vision recognition by the recognition camera 21 is sequentially performed on the electronic components A to C in the respective mounting postures, the electronic components A to C are sequentially mounted only by performing the mounting position correction based on the recognition result. To do.

FIG. 3 is a block diagram showing the configuration of the control system of the electronic component mounting apparatus 1.
The electronic component mounting apparatus 1 includes a controller 30 including a microcomputer including a CPU, a RAM, a ROM, and the like that control the entire apparatus. The controller 30 controls each of the components 31 to 35 shown below.
The vacuum mechanism 31 generates a vacuum, and generates a negative vacuum pressure at each suction nozzle via a vacuum switch (not shown).

The X-axis motor 32 is a drive source for moving the mounting head 12 in the X-axis direction along the X-axis gantry 13, and the Y-axis motor 33 is the Y-axis gantry 13 along the Y-axis gantry 14. It is a drive source for moving in the direction. When the controller 30 drives and controls the X-axis motor 32 and the Y-axis motor 33, the mounting head 12 can move in the XY directions.
The Z-axis motor 34 is a drive source for raising and lowering each suction nozzle in the Z direction. Although only one Z-axis motor 34 is shown here, the number of suction nozzles is actually provided. The θ-axis motor 35 is a driving source for simultaneously rotating the one set of suction nozzles around the rotation shafts 12f, and corresponds to the motor 12a described above.

Further, the controller 30 executes the component mounting process shown in FIG. 4 to perform the electronic component suction operation and mounting operation. This component mounting process is executed for each set of electronic components that are sucked and mounted using one set of suction nozzles of the mounting head 12.
First, in step S1, the controller 30 performs a suction order determination process for determining the suction order of electronic components by the suction nozzle.
FIG. 5 is a flowchart showing a suction order determination processing procedure performed in step S1.
In step S11, the controller 30 acquires the mounting angles of the electronic components to be mounted on the circuit board 5, and proceeds to step S12.
In step S12, the controller 30 acquires the number n of target components that is the number of electronic components to be mounted. In the present embodiment, the number n of the target parts is 3 at the maximum because three suction nozzles are used as one set.

In step S13, the controller 30 sorts the mounting angles acquired in step S11 in descending order and stores them as p [1], p [2],..., P [n].
In step S14, the controller 30 determines the suction order based on the sorting result in step S13, and ends the suction order determination process. Here, the suction order is the order of electronic components of mounting angle p [1] → electronic components of mounting angle p [2] → ... → electronic components of mounting angle p [n] in descending order of mounting angle. That is, the suction order of the electronic components is determined in descending order of the minimum rotation angle required to make the mounting posture on the circuit board 5 from the initial suction posture in which the electronic components are sucked from the component supply device 15 by the suction nozzle.

Returning to FIG. 4, in step S <b> 2, the controller 30 performs a rotation amount determination process for determining the rotation amount of the suction nozzle after the component suction.
FIG. 6 is a flowchart showing the rotation amount determination processing procedure performed in step S2.
In step S21, the controller 30 performs acquisition and initial setting of various data. Here, the target component number n determined in step S1 and the mounting angles p [1], p [2],..., P [n] are acquired, and the count value N is the initial target component number. The rotation amount θ [1], θ [2],..., θ [n] and the total rotation amount S of the electronic components after the suction of each electronic component are set to 0 which is an initial value. Here, the rotation amount θ [m] (m = 1, 2,..., N) is the rotation amount after the electronic component at the mounting angle p [m] is attracted.

Next, in step S22, the controller 30 determines whether or not N> 0. If N> 0, the controller 30 proceeds to step S23. If N ≦ 0, the controller 30 proceeds to step S26 described later. To do.
In step S23, the controller 30 calculates the rotation amount θ [N] based on the following equation based on the mounting angle p [N] and the total rotation amount S at this time, and proceeds to step S24.
θ [N] = p [N] −S (1)
In step S24, the controller 30 updates the total rotation amount S based on the following equation, and proceeds to step S25.
S = S + θ [N] (2)

In step S25, the controller 30 decrements the count value N and proceeds to step S22.
That is, the rotation amount θ [m] after the electronic component with the mounting angle p [m] is attracted from the component adsorption of the electronic component that is attracted immediately after the electronic component from the mounting angle p [m] of the electronic component. This is a value obtained by subtracting the total amount of rotation S until component mounting.

In step S26, the controller 30 stores the rotation amounts θ [1], θ [2],..., Θ [n] of each component determined in step S23, and ends the rotation amount determination process.
Returning to FIG. 4, in step S <b> 3, the controller 30 drives and controls the vacuum mechanism 31, the X-axis motor 32, the Y-axis motor 33, and the Z-axis motor 34, and the electronic component designated for suction is controlled by the component supply device 15. Are sucked from the predetermined component supply position, and the process proceeds to step S4. In the initial state, the electronic component with the earliest suction order determined in step S1 is designated for suction.

In step S4, the controller 30 controls the drive of the θ-axis motor 35, rotates the suction nozzle by the rotation amount θ [m] corresponding to the component sucked in step S3, and proceeds to step S5.
In step S5, the controller 30 determines whether or not all the electronic components that should be simultaneously sucked by the suction nozzle have been sucked, and if not all the electronic components have been picked up, the process proceeds to step S6 and picks up. The electronic component with the earliest picking order among the electronic components that are not picked up is designated as the electronic component to be picked up next, and then the process proceeds to step S3.
On the other hand, if it is determined in step S5 that all the electronic components have been picked up, the process proceeds to step S7 and the vision recognition by the recognition camera 21 is performed. Here, each electronic component is sequentially imaged by the recognition camera 21, and each picked-up image is processed to detect a suction position shift of each electronic component. Then, a correction amount at the time of component mounting is determined according to the detected suction position deviation.

Next, in step S8, the controller 30 sequentially mounts each electronic component on the circuit board 5 based on the vision recognition result in step S7, and ends the component mounting process. The mounting order at this time may be a fixed order determined in advance, or an electronic component suction order.
4 corresponds to the suction order determining means, the motor 12a (θ-axis motor 35) and steps S2 and S4 correspond to the component rotating means, and the suction nozzle and step S3 correspond to the component suction means. The recognition camera 21 and step S7 correspond to the component recognition means, and step S8 corresponds to the component mounting means.

(Operation)
Next, the operation of this embodiment will be described. Here, a case where three types of electronic components A, B, and C are mounted at the following mounting angles will be described.
Part A: Mounting angle 180 °
Part B: Mounting angle 0 °
Part C: Mounting angle 90 °
First, the controller 30 determines the order of suction of each component (step S1). Here, the mounting angles are sorted in descending order (step S13), and the suction order is determined in descending order of the mounting angle (step S14). That is, in the above example, the suction order is A → C → B, and the mounting angles p [1] = 180, p [2] = 90, and p [3] = 0.

Next, the controller 30 performs a rotation amount determination process to obtain a rotation amount after each component is sucked (step S2). Since the suction order is A → C → B, the rotation amount after suction of the component A is θ [1], the rotation amount after suction of the component B is θ [3], and the rotation amount after suction of the component C. Is θ [2].
Since N = n = 3 in the initial state (step S21), first, the rotation amount θ [3] of the component B having the latest suction order is obtained. θ [3] is calculated based on the above equation (1) based on the mounting angle p [3] = 0 of the component B and the total rotation amount S = 0 (initial value) (step S23). That is, θ [3] = 0. Next, N = 2 (step S25), and the rotation amount θ [2] of the component C with the second lowest suction order is obtained. θ [2] is calculated based on the above equation (1) based on the mounting angle p [2] = 90 of the component C and the total rotation amount S = 0 (= θ [3]) (step S1). S23). That is, θ [2] = 90. Finally, N = 1 (step S25), and the rotation amount θ [1] of the part A having the earliest suction order is obtained. θ [1] is based on the above formula (1) based on the mounting angle p [1] = 180 of the component A and the total rotation amount S = 90 (= θ [3] + θ [2]). Calculate (step S23). That is, θ [1] = 90.

The total rotation amount of the part A immediately before vision recognition is θ [1] + θ [2] + θ [3], the total rotation amount of the part C is θ [2] + θ [3], and the total rotation amount of the part B is θ [3]. Therefore, after the parts A to C are attracted and rotated, the following formulas are established in order for the parts A to C to finally have the respective mounting angles.
θ [1] + θ [2] + θ [3] = 180 (3)
θ [2] + θ [3} = 90 (4)
θ [3] = 0 (5)
From the equations (3) to (5), θ [1] = 90, θ [2] = 90, and θ [3] = 0 are obtained. As described above, the rotation amount determination processing corresponds to processing for obtaining the rotation amounts θ [1] to θ [3] that satisfy the expressions (3) to (5).

  When the suction order of the components A to C and the rotation amounts after the component suction are determined, the controller 30 performs the suction / rotation operation of the electronic component. Since the suction order is A → C → B, as shown in FIG. 7, the part A is first picked up in phase 1, and then the suction nozzle (heads 1 to 3) is rotated by controlling the drive of the θ-axis motor 35. The amount θ [1] = 90 ° is rotated. Next, as part 2, the part C is picked up, and then the θ-axis motor 35 is driven and controlled to rotate the suction nozzle by the rotation amount θ [2] = 90 °. Next, component B is adsorbed as phase 3. Here, since the rotation amount θ [3] = 0 °, the rotation operation of the suction nozzle after the component B is sucked is not performed. By performing the above operation, all the parts A to C are attracted to the suction nozzle in a state where the respective mounting angles are formed.

  In this way, as a result of sequentially sucking all electronic components to be picked up according to the determined picking order, the mounting head 12 is picked up each time each electronic component is picked up so that the picking posture of all the electronic components becomes the respective mounting posture. The rotating shaft 12f is rotated. As a result, in phase 4, the controller 30 recognizes the vision of each component without extra rotation in this suction state, and finally in phase 5, mounts each component only by correction based on the component recognition result. The action can be performed.

  By the way, in general, in the electronic component mounting apparatus, after the electronic component is sucked by the suction nozzle, the suction posture is centered by vision recognition, and thereafter, the electronic component is mounted on the substrate by correcting the centering result. At this time, in order to mount components with higher accuracy, it is desirable to perform the component mounting operation without extra θ rotational movement from the posture at the time of vision recognition. However, when mounting electronic components after sequentially picking up electronic components using a mounting head having a plurality of nozzle shafts that simultaneously rotate the θ-axis and recognizing vision of each electronic component, the mounting angle of each electronic component is different. If they are different, in order to mount each electronic component at each mounting angle, it is necessary to rotate the electronic component by θ after vision recognition.

  For example, the operation of recognizing and mounting two types of parts A and B is to pick up parts A and B in sequence → rotate the nozzle shaft to the mounting angle of part A → rotate part A to vision → rotate to the mounting angle of part B → Vision recognition of part B → Rotation to mounting angle of part A → Mounting of part A → Rotation to mounting angle of part B → Mounting of part B Thus, an extra θ rotation occurs after the part is recognized. Even if the mounting order is reversed A and B, in order to mount the component A, the θ axis must be rotated, and an unnecessary θ rotation cannot be excluded.

Therefore, as a method of eliminating extra θ rotation at the time of component mounting, it is conceivable to perform a series of recognition and mounting operations on each component. However, in this case, since the reciprocating motion between the recognition position for performing vision recognition and the component mounting position increases, the efficiency is poor.
On the other hand, in the present embodiment, a predetermined θ rotation is performed every time each component is sucked so that all the components finally have their respective mounting postures. Therefore, after all the components are sucked, an extra θ rotation is performed. Component recognition and component mounting can be performed without performing the above. Therefore, highly accurate component recognition and component mounting can be performed. In addition, the vision of each part is sequentially recognized at a predetermined recognition position, and then moved to the component mounting position to mount each part, eliminating unnecessary reciprocating movement between the recognition position and the component mounting position. Can be efficient.

(effect)
As described above, in the above-described embodiment, as a result of sequentially sucking and rotating all the electronic components, the sucking order and the rotation amount after sucking are determined so that the sucking postures of all the electronic components become the respective mounting postures. Therefore, after all the electronic components have been picked up, the component recognition operation can be performed without requiring extra θ rotation. In addition, after the component recognition, the component mounting operation can be performed only by the mounting position correction based on the component recognition result without requiring extra θ rotation.
Therefore, the component recognition operation and the component mounting operation can be performed with higher accuracy. Furthermore, since extra rotation operation can be reduced, it is possible to reduce the load on the electronic component and the motor that is the rotation drive source.

At this time, taking into consideration that the electronic component that has been sucked earlier has a larger total rotation amount from suction to mounting, the order of suction is sorted in descending order of mounting angle, so the total amount of rotation is minimized. Can be limited.
Furthermore, since the rotation amount after suction of the electronic component sucked by the suction nozzle is set to a value obtained by subtracting the total rotation angle from the suction of the electronic component sucked immediately after mounting to the mounting angle of the electronic component. The suction posture when the electronic components are sucked can be efficiently changed to the respective mounting postures.

(Application examples)
In the above embodiment, the case where the supply angles of all the components are all 0 ° has been described. However, when the supply angles of the components are given (other than 0 °), the supply angles are considered. To determine the order of adsorption. That is, for a component to which a supply angle is given, a temporary mounting angle = (actual mounting angle−supply angle) is set, and the suction order is determined using the temporary mounting angle. This temporary mounting angle is a minimum required rotation angle required to change the electronic component from the initial suction posture in which the electronic component is sucked by the suction nozzle to the mounting posture on the circuit board 5. Hereinafter, a specific example will be described.

Here, the case where three types of electronic components A, B, and C are sequentially mounted at the following supply angles and mounting angles will be described.
Part A: Supply angle 0 °, mounting angle 180 °
Component B: Supply angle 90 °, mounting angle 0 °
Part C: Supply angle 0 °, mounting angle 90 °

In this case, the temporary mounting angle of the component B is 0 ° −90 ° = −90 ° = 270 °. Therefore, the adsorption order is B → A → C. In addition, after the components A to C are attracted and rotated, the following formulas are established in order for the components A to C to finally have respective mounting angles.
θ [1] + θ [2] + θ [3] = 270 (6)
θ [2] + θ [3} = 180 (7)
θ [3] = 90 (8)
From the above equations (6) to (8), θ [1] = 90, θ [2] = 90, and θ [3] = 90.

  Therefore, in this case, as shown in FIG. 8, in phase 1, the component B whose supply angle is 90 ° is sucked, and then each suction nozzle is rotated by the rotation amount θ [1] = 90 °. Next, the component A is adsorbed as phase 2, and then each adsorption nozzle is rotated by a rotation amount θ [2] = 90 °. Next, as part 3, the component C is sucked, and then each suction nozzle is rotated by a rotation amount θ [3] = 90 °. Thereby, components A-C will be in the state which comprised the mounting angle, respectively.

As described above, when the supply angle is given (in the case other than 0 °), the suction order is determined in consideration of the supply angle. Therefore, when the above-described supply angle is not given (0 °) In the same manner as in the case), the component recognition operation and the component mounting operation can be performed with high accuracy without requiring extra θ rotation.
In the above embodiment, the case where the nozzle capable of sucking the electronic component at any angle is used as the suction nozzle. However, as shown in FIG. When using a vacuum cleaner nozzle, gripper nozzle, T-type nozzle, etc.), the suction order is determined in consideration of this. That is, the suction order is determined so that the parts to be picked up are picked up first using an angled nozzle. Hereinafter, a specific example will be described.

Here, a case where three types of electronic components A, B, and C are sequentially mounted at the following mounting angles will be described. Note that the component B is a component that is sucked using an angled nozzle, and the supply angle is 0 °.
Part A: Mounting angle 180 °
Component B: Mounting angle 0 ° (angled nozzle)
Part C: Mounting angle 90 °

In this case, the component B is the component that is first picked up, and the picking order of the remaining parts A and C is the order in which the mounting angle is large. That is, the adsorption order is B → A → C. In addition, after the components A to C are attracted and rotated, the following formulas are established in order for the components A to C to finally have respective mounting angles.
θ [1] + θ [2] + θ [3] = 0 (9)
θ [2] + θ [3} = 180 (10)
θ [3] = 90 (11)
From the above equations (9) to (11), θ [1] = 180, θ [2] = 90, and θ [3] = 90.

  Therefore, in this case, as shown in FIG. 10, in the phase 1, the part B is sucked, and thereafter, each sucking nozzle is rotated by a rotation amount θ [1] = 180 °. Next, the component A is adsorbed as phase 2, and then each adsorption nozzle is rotated by a rotation amount θ [2] = 90 °. Next, the component C is adsorbed as phase 3, and then each adsorption nozzle is rotated by a rotation amount θ [3] = 90 °. Thereby, components A-C will be in the state which comprised the mounting angle, respectively.

As described above, when using a suction nozzle in which the suctionable angle of the electronic component is limited, the suction order is determined in consideration of this, and therefore, the suction nozzle having no restriction on the suctionable angle described above is used. As in the case, the component recognition operation and the component mounting operation can be performed with high accuracy without requiring extra θ rotation.
Further, in the above embodiment, the suction order may be determined according to the difference in the rotation speed after the electronic component is sucked. For relatively large parts and heavy parts, the rotation speed may be set to be slow in order to prevent the parts from falling from the suction nozzle due to the rotation operation during suction. In this way, when the rotational speed differs for each component, for example, a set of components having the same or the closest rotational speed is created, and the suction / rotation operation is performed for each set. Thereby, the tact time of the component mounting process can be shortened.

  DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus, 5 ... Circuit board, 11 ... Conveying rail, 12 ... Mounting head, 12a ... Motor, 12f ... Rotating shaft (nozzle shaft) 13 ... X-axis gantry, 14 ... Y-axis gantry, 15 ... Component supply apparatus , 16 ... Nozzle changer, 21 ... Recognition camera, 30 ... Controller, 31 ... Vacuum mechanism, 32 ... X-axis motor, 33 ... Y-axis motor, 34 ... Z-axis motor, 35 ... θ-axis motor

Claims (5)

An electronic component mounting apparatus that sequentially sucks electronic components by suction nozzles mounted on a plurality of nozzle shafts that are simultaneously rotated in the same direction by the same motor, and sequentially mounts the electronic components at predetermined mounting positions on the board. And
The suction order for determining the suction order of the electronic components from the initial suction posture in which the electronic components are sucked from the component supply device by the suction nozzle to the mounting posture on the substrate in ascending order of the minimum required rotation angle. A determination means;
Component adsorption means for sequentially adsorbing electronic components in accordance with the adsorption order determined by the adsorption order determination means;
The electronic component is adsorbed by the electronic component adsorbing unit so that the adsorbing posture of all the electronic components becomes the mounting posture as a result of sequentially adsorbing all the electronic components to be adsorbed according to the adsorbing order determined by the adsorbing order determining unit. Component rotating means for rotating the nozzle shaft each time;
After all the electronic components to be sucked by the component sucking means are picked up, the component recognition means for sequentially recognizing the electronic components in the mounting posture sucked by the suction nozzle;
Based on the recognition result by the component recognition means, comprising component mounting means for sequentially mounting electronic components at the mounting position ,
The component rotation means determines the rotation angle of the nozzle shaft after the electronic component sucked by the suction nozzle from the required rotation angle of the electronic component and the total rotation angle from the suction of the electronic component to the mounting immediately thereafter An electronic component mounting apparatus, characterized in that the angle is set to a subtracted angle .   2. The electronic component mounting apparatus according to claim 1, wherein the required rotation angle is a mounting angle of the electronic component when the supply angles of all electronic components to be picked up from the component supply device are the same. .   The required rotation angle is an angle obtained by subtracting the supply angle of the electronic component from the mounting angle of the electronic component when supply angles from the component supply devices of all electronic components to be picked up are different from each other. The electronic component mounting apparatus according to claim 1 or 2.   The said adsorption | suction order determination means determines the said adsorption | suction order so that the electronic component attracted | sucked first with the nozzle by which the suction | attainable angle of the said electronic component is restrict | limited is characterized by the above-mentioned. The electronic component mounting apparatus according to any one of the above. An electronic component mounting method in which electronic components are sequentially picked up by suction nozzles mounted on a plurality of nozzle shafts that are simultaneously rotated in the same direction by the same motor, and the electronic components are sequentially mounted at predetermined mounting positions on a substrate. And
From the initial suction posture in which the electronic component is sucked by the suction nozzle from the component supply device, the order of suction of the electronic components is determined in descending order of the minimum necessary rotation angle for setting the mounting posture on the substrate,
When the electronic components are sequentially picked up according to the determined picking order, all the electronic components are picked up according to the picking order so that the picking postures of all the electronic components become the mounting postures. Rotate the nozzle shaft each time
After all the electronic components to be sucked are sucked, the electronic components in the mounting posture sucked by the suction nozzle are sequentially recognized, and the electronic components are sequentially mounted at the mounting position based on the recognition result ,
When rotating the nozzle shaft, the rotation angle of the nozzle shaft after suction of the electronic component sucked by the suction nozzle is changed from the suction of the electronic component sucked immediately after the required rotation angle of the electronic component to mounting. An electronic component mounting method, wherein the nozzle shaft is rotated by setting an angle obtained by subtracting a total rotation angle .

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