JPS59186334A - Bonding apparatus - Google Patents

Abstract

PURPOSE:To position a pad accurately by a method wherein a pellet, transferred onto a pellet positioning table, is attracted by an attractive collet of a position detector and transferred to an attractive collet of a bonding arm, which can be turned 180 deg., by way of an intermedite position determining stage and dropped onto a substrate placed beneath the arm by turning the arm while being detected by a pattern recognition equipment. CONSTITUTION:A semiconductor pellet 22 is transferred onto a pellet positioning table 20 and attracted by an attractive collet 24 provided to the tip of a moving arm 23 which composes a position detector 21 and transferred onto an intermediate position determining stage 25 and its position is determined by the nails 26 and 27. Then, by the same collet 24, the pellet 22 is transferred to an attractive collet 34 provided to the tip of a bonding arm 30 of a turning over mechanism 31 which can be turned 180 deg.. A pad of the pellet 22 and a lead of a substrate 29 placed beneath the collet 34 are detected by a pattern recognition equipment provided to a camera rotating table 38 and their positions are adjusted. After that, the pellet is dropped onto the substrate 29 by turning the arm 30.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a bonding apparatus for bonding semiconductor chips or other electronic component chips onto a substrate or lead frame made of ceramic, aluminum, glass evo, etc.

Conventional configurations and their problems In general, the method for connecting the band portion of a semiconductor chip and the lead frame portion on a substrate made of ceramics, aluminum, glass epoxy, etc. is 7υ due to the relationship between the time required for connection and the area of the retoed portion. A bonding method called knob chip bonding has been put into practical use. The conventional flip-step bonding device has a 1X-
Pellets 2 are placed on the Y table. Three connection pads are formed on the pellet.

4a and ab are suction collets, and it is possible to evacuate the space in the suction collets 6 through the vacuum tape 6. Reference numeral 7 denotes an arm to which the suction collet is slidably attached, and is movable in directions A, 8 degrees C, and D. 8 is a pressure spring, and 9 is a collar provided to prevent the suction collet from falling off the arm. Reference numeral 10 denotes an intermediate position regulating stay, and 11.12 indicates a regulating claw for regulating the position of the pellet on the intermediate position/actual regulating stage. Reference numeral 13 denotes a mounting throat, which is supported by a bearing 14 and is movable in the direction of arrow E-F.

This is an X-Y table on which 15 and 160 boards are attached, and is arranged parallel to the 17 surface of the mounting head. Reference numeral 18 denotes a lead portion to the substrate, which can be connected to the notch of the pellet. The operation of the conventional bonding apparatus configured as described above will be explained below with reference to the drawings.

As shown in FIG. 1, a pellet 2 placed on an X-'Y table 1'' is provided with a groove 3 for connection to a lead frame portion of a substrate. This pellet 2 is positioned so as to surround the center of the adsorbed kelp 4a. Next, go down in the direction of A-1, 7 or arrow G and suction with suction kelp) 4a. At the same time, the pellet 2 whose position has been regulated by the regulating claws 11 and 12 on the intermediate position regulating stage is sucked by the suction collet 4b, and when the suction is completed, the position regulating claws are released. Next, the arm 7 moves in the six directions indicated by the arrow, and the suction collet 4a is moved.

The arm 7 moves in the direction of the arrow C at the point where the center of each of the arms 4b moves by an amount A. At the position where the pellet 2 touches the intermediate position regulating stage 10 and the mounting head 13, the adsorption is released, and the adsorbing combinations 4a and 4b move in the direction of the arrow and the direction of the arrow B, and return to their original positions on the intermediate position regulating stage. The position of the pellet is regulated by the position regulating jaws 11 and 12. Further, the pellet 2 placed on the mounting head 13 is lifted in the direction of arrow F as the mounting head 13 is supported by a bearing 14. At this time, the board 16 has already been placed on the board X-Y table 1.
5 is positioned at a predetermined position. When the raised pad of the pellet 2 comes into contact with the lead portion 18 of the substrate and bonding is completed, the mounting head 13 descends to complete the process. Thereafter, this operation is repeated to perform bonding.

However, in the above configuration, it is necessary to make the distance between the suction collets 4a and 4b attached to the arm 7 equal to the A''B8 dimensions, but it is very difficult to make adjustments to this extent. In this method, in order to improve the reliability of bonding, it is necessary to position the adhesive part of the substrate-1 and the pad part of the pellet with high precision, but in the conventional method, there is a problem with variations in the position of the pad part with respect to the outer periphery of the pellet. Also, due to variations in the position of the lead parts on the board, highly accurate positioning and bonding are impossible.

OBJECTS OF THE INVENTION In view of the above-mentioned drawbacks, the present invention provides a punch ink device that connects the pad portion of a pellet and the substrate glue 15 with high precision and productivity.

Structure of the Invention The present invention provides a transport means capable of sucking and transporting one pellet at a time, which is positioned by a pellet positioning table and a recognition device for detecting the position; an intermediate position adjustment section that adjusts the position of the pellets transferred by the pellets at an intermediate position provided at a position different from the pellet positioning table; 18 means
00 rotatable rotation mechanism; a suction means positioning table capable of positioning the suction means and rotation mechanism in two orthogonal directions; a substrate positioning table that holds the substrate and positions the substrate in two orthogonal directions and in the rotational direction; The device is equipped with a recognition device that can detect the position of the lead portion of the pellet and the pad of the pellet.The recognition device directly determines the position of the pellet and the lead portion of the substrate, making it possible to perform highly accurate bonding. Furthermore, by providing the intermediate position regulating section, it becomes possible to move the transfer arm and the bonding arm independently, which has the unique effect of improving productivity.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In Figures 2 to 5, 19 is a wafer and 2
The pellet is held on the zero pellet positioning table and can be positioned at any position. Reference numeral 21 denotes a position detecting device, which is a position detecting device for the table and the pellets 22. 23
is a movable arm, which has a suction column 1-24f at its tip for suctioning the pellets, and is movable up and down and back and forth.

26 is an intermediate position regulating stage and has a regulating depth of 26.27.

Reference numeral 28 holds the substrate 29 and is capable of rotation and arbitrary positioning in the X-Y directions. 30 is the bonding arm and 1
8CF' is attached to a reversing mechanism 31 capable of reversing, and has a suction collet 34 capable of suctioning pellets 32 at its tip.

33 is a boding arm Z table that can move the bonding arm in the vertical direction, and is used for positioning the bonding arm in 36.
I'm being kicked. 36 is a lead portion on the substrate. 37 detects the position of the lead part on the board and the pellet;
This is a turn recognition device, and the recognition device is mounted on 38 camera Z-axis tables that can be positioned at any vertical position. The operation of the bonding apparatus configured as described above will be described below. , <tar/
Recognition device 'lvi, 21 and pellet positioning table 20
Accordingly, the pellet 22 is positioned at an arbitrary position.

Next, the suction collet 24 is used to
After adsorption, the transfer arm 23 moves along a trajectory using a cam, a nolinder, etc. (not shown), stops on the intermediate position regulating part, and then regulates and holds the side surface of the pellet 22 using the position regulating jaws 26° and 27. .

Next, 24 releases the suction, and the transfer arm 23 returns to its original position along the trajectory H. Adsorption collet 34 at the tip
The bonding arm 30 having a bonding arm positioning table 35 moves along a trajectory M,
Vacuum adsorb the ITI below the pellet 22.

When the suction is completed, the position regulating claws 26 and 27 move in the direction of the arrow and L, respectively, and release the position regulation. The bonding arm then moves along the G trajectory. At this time, the lead portion 36 on the substrate 29 is positioned at a predetermined position by a pattern recognition device 37 and a substrate positioning table 280. Next, the pattern recognition device 37 is moved by the Z-axis table, after which the bonding arm 30 enters the recognition range of 37, focuses by 38, and performs position detection. The positional deviation of the pellet 33 detected by the pattern recognition device 3 is corrected by the amount of deviation detected by the positioning table 35, and the pellet 33 is positioned at a regular position.

Then, the amount of positional deviation between the center position of the pellet 32 and the rotation center 39 of the reversing mechanism 31 is calculated.

Next, the pellet is 1800800 by the reversing mechanism 31.
It faces the substrate 29 and further corrects its position by the amount of positional deviation using a substrate positioning table 28. When the position correction is completed, the table 33 moves in the direction of arrow J, and the lead portion 36 and the pellet 32 are connected by thermocompression bonding or the like. When the connection is completed, the vacuum suction of the suction collet is released and the arm 3° rises to complete the bonding. Also, if there is an angular misalignment between the pad and the lead portion, the position of the board is corrected using the positioning table 28.

In this example, a pellet positioning table that holds pellets and can be moved in orthogonal directions, a recognition device that detects the pellet position, and a pellet positioning table that picks up the positioned pellets one by one. A punch ink arm and a bonding arm, which are capable of adsorbing pellets transferred by the intermediate position regulating part and the transfer arm, are arranged in a direction perpendicular to the transfer arm and the arm. By providing a movable positioning table, a positioning table that holds the substrate and is movable in two orthogonal directions and a rotational direction, and a recognition device 4 that can detect the positions of the lead portion on the substrate and the pad of the pellet, the pellets can be detected. By regulating the position in the middle, it becomes possible to simultaneously transport the pellet to the intermediate regulating part and from the intermediate regulating part to the bonding position. In addition, conventional position adjustment was all performed based on the outer periphery of the pellet, but the recognition device can directly detect the pellet and lead portion, making it possible to perform highly accurate bonding. Furthermore, highly accurate bonding can be performed even when there is an angular misalignment of the pad take-up portion.

Although the heating means is provided on the bonding arm 30, it may also be provided on the positioning table that holds the substrate 29, and the same effect can be expected.

If an ultrasonic horn is used for the droplet fv and pop ink arm 30, bonding can be performed at a low temperature or at room temperature.

Effects of the Invention As described above, the present invention provides a positioning table capable of detecting the pad position of a pellet transferred from a pellet positioning table and the position of a lead part of a substrate, an intermediate position regulating section for regulating the position at an intermediate position, 10 pellets whose position was detected
By providing a bonding arm that rotates 00 degrees and bonds to the substrate, it is possible to simultaneously transfer the pellet from the X-Y table to the intermediate position regulating section and from the intermediate regulating section to the 14-fufu position. It becomes possible to improve Bongai/ge speed. Also, by directly detecting the leads of the pellet and the substrate, highly accurate bonding is possible.

Furthermore, since all position detection can be performed from above, the configuration of the machine becomes easy.

Furthermore, since the positions of the pellet and the lead portion on the substrate are finally detected and corrected at the bonding ink position, the position of the entire machine can be easily adjusted. .

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional bonding device, FIG. 2 is a perspective view of a bonding device according to an embodiment of the present invention, FIGS. 3 and 4 are front views of a recognition device and a positioning table, and FIG. 5 is a front view of a recognition device and a positioning table. FIG. 2 is a cross-sectional view of the bonding ink device. 22...--pellet, 21...- recognition device,
20...Positioning table, 25...Intermediate regulating section, 28...Positioning table for board, 30...
-・Moon binding arm, 31...Reversing mechanism, 37...Recognition device O Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 38 Figure 3 Figure 4

Claims (1)

[Claims] A pellet positioning table that holds pellets and is movable in two orthogonal directions; a recognition device that detects the position of the pellet; a transfer means that picks up and transfers the positioned pellets one by one; An intermediate position regulating part provided at a position different from that of the pellet positioning table, a suction means for suctioning and transferring the lower surface of the pellet on the intermediate position (the 6th position part), and a rotation mechanism for rotating this suction means by 1800 rotations. an arm positioning table that can move the suction means in two orthogonal directions, a substrate positioning table that holds the substrate and can move in two orthogonal directions and a rotational direction, and positions of the lead part and pellet on the substrate. A bonding device equipped with a recognition device capable of detecting the fit.