JPS6245146A - Jig and alignment feeder with said jig - Google Patents

Abstract

PURPOSE:To supply materials to be treated with high precision by compensating the attitudes of the materials to be treated and positioning them and feeding the materials to be treated to predetermined positions in succession. CONSTITUTION:With a supply mechanism 14, an arm 16 is prejected from a device proper 15 incorporating a control system controlling the whole device, a chip 3 positioned on a stage 11 is sucked under a vacuum by a bonding tool 13 fitted at the nose of the arm 16, and the chip 3 is superposed and fed to a substrate 2 fixed to a stem 1 on a table 17 turned and controlled by a series of operation of the forward movement, lowering and the like of the arm 16. The position of the chip 3 by the bonding tool 13 is detected by monitoring by a TV camera 12 of electrodes 4, 5, an XY table 9 is shifted on the basis of the detecting informations, and the chip 3 is positioned to the bonding tool 13.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a jig and an alignment and supply device having this jig, and is effective when applied to, for example, a technology for overlapping and supplying dome-shaped chips onto a substrate in light emitting diode assembly. Regarding technology.

[Background technology]

2. Description of the Related Art Face-down bonding technology is known as one of the mounting technologies for semiconductor elements (referred to as chips) in the manufacture of semiconductor devices. One of the devices that performs this face-down bonding is, for example, "Monthly Semiconductor World" published by Press Journal Co., Ltd.
emicon-ductor World) Separate volume '8
4Hire's Guide and Directory ([3uye
rs-Guide & Directory) J Published October 20, 1982, as introduced on page 197,
A flip chip bonder is known that uses two monitor televisions (ITVs) to position a substrate pattern and a chip pattern, and then fixes the chip to the substrate.

By the way, in such face-down bonding, it is necessary to supply chips with high precision.

The present invention is a technology developed based on such a request.

[Purpose of the invention]

An object of the present invention is to provide an alignment and feeding device that can achieve highly accurate feeding of objects to be processed.

Another object of the present invention is to provide a jig that can achieve highly accurate feeding of objects to be processed.

Another object of the present invention is to improve the throughput of face-down bonding.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

(Summary of the Invention) A brief overview of typical inventions disclosed in this application is as follows.

That is, in the present invention, dome-shaped chips are placed one by one into the housing holes of a jig with a transparent bottom, and then vibrated (1) by the vibration of the stage that supports this jig. The surface faces the bottom of the accommodation hole.On the other hand, a television camera is provided below the stage, and a collet for picking up chips is provided above the stage. Prior to the pink amplifier, the television camera detects the electrode pattern on the flat surface of the chip.

Further, based on this detection information, the movement of the stage is controlled to correct the position of the chip with respect to the collet. Therefore, the collet can pick-amplify chips that are always in a constant state with high precision, and highly accurate chip supply can be achieved.

〔Example〕

FIG. 1 is a schematic diagram showing an outline of a jig according to an embodiment of the present invention and an alignment and supply device having this jig, FIG. 2 is a plan view showing a stage on which the jig is placed, and FIG. FIG. 4 is a plan view showing the same jig.

5 is an enlarged sectional view similarly showing a part of the jig, FIG. 6 is a perspective view similarly showing a superposed state of a substrate and a chip in a light emitting diode, FIG. 7 is a perspective view similarly showing a state in which chips are stacked on a substrate.

As shown in FIGS. 6 and 7, the alignment and supply device of this embodiment has near-infrared light emitting diode elements (chips) 3 on the top surface of a substrate 2 fixed to the main surface of a To-shaped stem 1. Applies to technology that connects by face-down bonding. The chip 3 has a hemispherical (dome) shape at the top and a circular and horseshoe-shaped electrode 4.5 at the bottom, as shown by the broken line in FIG. 6.

Furthermore, wiring layers 6 and 7 having portions corresponding to the electrodes 4.5 are provided on the main surface of the substrate 2. After the chip 3 is held by a bonding tool such as a collet, the electrodes 4 and 5 of the chip 3 are connected to the wiring layers 6 and 7 of the substrate 2 so that they overlap, as shown in FIG. Ru. Note that 8 in the figure is a lead.

As shown in FIG. 1, the alignment and supply device includes an XY table 9 whose movement is controlled in the plane XY direction, a vibration mechanism 10 disposed on the XY table 9, and a stage supported by the vibration mechanism 10. 11, a television camera 12 disposed below this stage 11, and this television camera 12.
and a supply mechanism 14 that faces the stage 11 and allows a bonding tool 13 made of a collet to face the stage 11. The supply mechanism 14 has an arm 16 protruding from an apparatus main body 15 containing a control system for controlling the entire apparatus, and uses a bonding tool 13 attached to the tip of the arm 16 to release the chips 3 on the stage 11.
The chips 3 are vacuum-adsorbed, and the adsorbed chips 3 are superimposed and supplied onto a substrate 2 fixed to a stem 1 on a table 17 whose rotation is controlled by a series of operations such as the advancement and descent of the arm 16. Furthermore, prior to the vacuum suction of the chip 3 by the bonding tool 13, the position of the chip 3 on the stage 11 is adjusted to the position of the television camera 1 of the electrode 4.5.
2, and based on this detection information, the XY table 9 moves, and the bonding tool 1
The chip 3 is positioned relative to the chip 3.

The chip 3 is placed in a jig 18 and placed on the stage 11, as shown in FIGS. 3 to 5. That is, the jig 18 is a glass plate 1 that is a transparent plate and has a rectangular shape.
9 and a perforated plate 20 attached to the main surface of the glass plate 19. In addition, in this embodiment, as shown in FIG. be done. Also, on the stage 11, a rectangular frame 2 of a jig 18 placed on the stage 11 is provided.
The jig 18 is always held at a constant position on the stage 11 because a positioning lever 25 is attached that presses the reference surface 21 of the stage 2 by the elastic force of the torsion coil spring 24. In addition, when taking out the jig 18 from the stage 11 with the rectangular frame 22 intact, push the positioning lever 25 as shown by the broken line arrow.
After releasing the fixation of the jig 18 by 5, the jig 18 is taken out.

On the other hand, in the perforated plate 20 of the jig 18, as shown in FIG. 4, the accommodation holes 26 are regularly arranged vertically and horizontally. The accommodation holes 26 are arranged so that the pitch interval on one axis side is half that of the other axis side, and the three adjacent accommodation holes 26 are arranged corresponding to each vertex of an equilateral triangle. Efforts are being made to improve layout efficiency. Such accommodation hole 26 has a size that can accommodate one dome-shaped chip 3 of, for example, 0.4 mm or 0.6 mm. Also, as shown in Figure 5,
The thickness of the perforated plate 20 is thin so that only one chip 3 can fit into the accommodation hole 26. Further, one method for making sure that only one chip 3 enters each accommodation hole 26 is, for example, placing a large number of chips 3 on the main surface of the jig 18, and then using a brush to remove the chips. There is a method in which the chips 3 are dropped into each accommodation hole 26 by brushing the chips 3, and the excess chips 3 are removed from the main surface of the jig 18 by sweeping them out with a brush. Therefore, the jig 18 in which one chip 3 is accommodated in each accommodation hole 26 is attached to the support frame portion 23.
placed on top.

Next, a description will be given of an operation in which the chips 3 are automatically aligned and fed by such an alignment and feeding device.

First, the jig 18 is attached to the coil spring 24 of the stage 11. This jig 18 is connected to each accommodation hole 26 as described above.
One chip 3 is housed in each. Therefore, when the operator presses a start button (not shown) on the main body 15 of the apparatus, automatic supply of chips is started. First, the vibration mechanism 10 of the alignment and supply device is driven, and the stage 11 is vibrated. Since the jig 18 supported by the stage 11 also vibrates due to this vibration, the chip 3 in the accommodation hole 26 moves within the accommodation hole 26 because it has a dome shape.

cause a transfer. After a certain vibration operation, the 1000 tubes 3 housed in each housing hole 26, as shown in FIG.
All are in a posture with the dome facing upwards and the flat surface where the electrodes 4.5 are located facing downwards. In other words, the depth, diameter, vibration conditions, etc. of the accommodation hole 26 are set so that the flat surface of the chip 3 is always at the bottom due to vibration for a certain period of time, and the flat surface of the chip 3 overlaps the flat bottom surface of the accommodation hole. be done.

Next, the XY table 9 is operated to move the jig 18 so that the accommodation hole 26 containing the first chip 3 to be supplied is positioned below the bonding tool 13 of the supply mechanism 14. In this state, since the glass plate 19 of the jig 18 is transparent, the electrode 4.5 on the flat surface located on the lower surface of the chip 3 is detected by the TV camera 12, and the position of the chip 3 relative to the bonding tool 13 is detected. and directionality is detected. Furthermore, based on this detection information, the movement of the XY table 9 is controlled again so that the chip 3 is located at a preset position within the bonding tool 13. In addition, the positional information of the directionality (rotation direction) of the chip 3 is obtained from the table 1 on which the stem 1 is placed.
7 control system. This control system is designed to control the table 17 so that the directionality of the wiring layers 6 and 7 of the substrate 2 on the table 17 coincides with the directionality of the chip 3. .

Next, the bonding tool 13 is lowered so that its lower end faces the chip 3, and the chip 3 is held by vacuum suction. Thereafter, the bonding tool 13 moves upward, moves horizontally, descends, and releases the vacuum suction holding, thereby superimposing and supplying the positioned chip 3 onto the positioned substrate 2. Further, this chip 3 is bonded to the substrate 2 by temporarily melting the electrodes 4.5 of the chip 3 and the wiring layers 6, 7 using a heating system (not shown). This bonding is performed with high accuracy because the chip 3 and the substrate 2 are positioned respectively as described above.

In this way, the chips 3 accommodated in the accommodation holes 26 of the jig 18 are sequentially supplied to the substrate 2.

〔effect〕

(1) The aligning and supplying device of the present invention corrects the posture of the object to be processed.
After positioning, the objects to be processed are sequentially fed to predetermined positions, resulting in the effect that highly accurate feeding can be performed.

(2) The aligning and supplying device of the present invention corrects the posture of the object to be processed.
After the positioning is automatically performed, the objects to be processed are automatically supplied to predetermined positions one after another, thereby achieving the effect that the throughput of the objects to be processed can be improved.

(3) According to the above (2), in the aligning and supplying apparatus of the present invention, each operation is automated, so that it is possible to reduce the number of workers.

(4) Due to the above (2), the alignment and feeding apparatus of the present invention can achieve the effect that productivity can be improved by improving feeding accuracy and feeding speed.

(5) According to the above (11 to (4)), by using the alignment supply device of the present invention for mounting work of dome-shaped chips of light emitting diodes, high-quality assembly can be performed at high speed without requiring much manpower. Therefore, a synergistic effect can be obtained in that the manufacturing cost of the light emitting diode device can be reduced.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. For example, even if the jig is an integral structure with a receiving hole formed on the main surface of a transparent glass plate, the same effect as in the above embodiment can be obtained.

[Application field]

In the above description, the invention made by the present inventor is mainly applied to the chip supply technology in the face-down bonding technology, which is the field of application in which the invention is based, but the present invention is not limited thereto.

The present invention can be applied to automatic feeding technology for articles that have a flat structure on at least one side and that tend to roll.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an outline of a jig according to an embodiment of the present invention and an alignment and supply device having this jig, FIG. 2 is a plan view showing a stage on which the jig is placed, and FIG. FIG. 4 is an enlarged plan view showing a part of the jig, FIG. 5 is an enlarged cross-sectional view of a part of the jig, and FIG. FIG. 7 is a perspective view showing a state in which chips are stacked on a substrate. FIG. 7 is a perspective view showing a state in which chips are stacked on a substrate. 1... Stem, 2... Substrate, 3... Chip, 4.
5... Electrode, 6, 7... Wiring layer, 8... Lead,
9...XY table, 10...vibration mechanism, 11...
- Stage, 12... TV camera, 13... Bonding tool, 14... Supply mechanism, 15... Device body, 16... Arm, 17... Table, 18...
... Jig, 19... Glass plate, 20... Perforated plate, 2
DESCRIPTION OF SYMBOLS 1... Reference plane, 22... Rectangular frame, 23... Support frame part, 24... Coil spring, 25... Position 1
Figure 2 Figure 3 Cause and Effect 6
figure

Claims (1)

[Scope of Claims] 1. A jig characterized by being made of a transparent body having a housing hole in its main surface for housing a workpiece. 2. The jig according to claim 1, comprising a transparent plate and a perforated plate fixed to the main surface of the transparent plate and having accommodation holes for accommodating the object to be processed. . 3. A stage that supports a jig made of a transparent body having a housing hole for accommodating a workpiece on its main surface, a vibration mechanism that vibrates this stage, and an XY table that controls the movement of the stage in the direction of the plane XY. , a television camera disposed below the stage to monitor the workpiece housed in the jig, and a supply mechanism that allows a tool for holding the workpiece to be exposed above the stage. Characteristic alignment and feeding device.