JPH0236597A - Electronic component packaging device - Google Patents

Abstract

PURPOSE:To easily correct the positional deviation of an electronic component in the directions of X and Y so as to improve a working efficiency by a method wherein the positional deviation in the directions of X and Y of the electronic component inside a pocket is detected by a camera, and a nozzle is driven along directions of X and Y to be coincident with the center of the electronic component and made to descend to take up the electronic component. CONSTITUTION:Shifting devices 10 and 11 movable in directions of X and Y are driven to position a camera 17 above a substrate 4 to detect the positional deviation of the printed pattern of a substrate 6. An electronic component P inside a pocket 8a is monitored by a camera 9 to obtain the positional deviation of the component P. A nozzle 16 is made to move just above the component P, the shifting devices 10 and 11 and a theta direction drive device 18 are driven considering the correction based on these positional deviations to make the nozzle 16 descend and suck the component P. The devices 10 and 11 are driven again to make a transferring head 15 move toward the substrate 6, and on the way of the transferring head 15 to the substrate 6, a motor 18a is driven to drive the devices 10 and 11 to correct a positional deviation 2 and to mount the component P on the substrate 6.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an electronic component mounting apparatus, in which a camera detects the positional shift in the XY force direction of an electronic component stored in a pocket of a tray, and the center of a nozzle is electronically detected. This positional deviation is corrected by landing the part so that it aligns with the center of the part, and the part is then transferred and mounted on the board.

(Prior Art) Conventionally, as an electronic component mounting apparatus, as shown in FIG.
a supply section 101 for electronic components P on which a tray 100 is placed;
The positioning parts 103 of the substrates 102 are arranged in parallel, and the tray 100
It is known that an electronic component P is attracted to a nozzle 104 of a transfer head and transferred and mounted on a substrate 102.

However, as shown in FIG. 10, since the pocket 105 of the tray 100 in which the electronic component P is stored is considerably larger than the electronic component P, the postures of the electronic component P in the pocket 105 vary, and therefore, the conventional means Substrate 102
Before mounting the electronic component P stored in the pocket 105 of the tray 100, it is sucked by the nozzle 104 and transferred to the positional deviation correction stage 106, where the positional correction chuck 107 is pressed against the corner of the electronic component P. After the positional deviation is mechanically corrected using the nozzle 104, the substrate is again picked up by the nozzle 104 and transferred and mounted on the substrate 102.

(Problems to be Solved by the Invention) However, the above conventional means requires the correction stage 106 equipped with the chuck 107, which makes the device large and complicated. Since the position must be corrected, work efficiency does not improve, and furthermore, since the chuck 107 is pressed against the electronic component P to correct positional deviation, the electronic component P
There was a problem that easily caused pain.

In addition, these types of electronic components generally tend to be made to be fragile due to demands for miniaturization, so when picking up electronic components or landing them at their destination, the lower end of the nozzle If you press strongly against the top surface of electronic component P,
Electronic components are likely to be damaged by cracking or chipping due to the impact, but in the above conventional means, the electronic component P is ticked up by the nozzle 104 twice in total at the supply section 101 and the correction stage 106, In addition, landing at the destination is also possible with a total of two
Since it is necessary to do this several times, the nozzle 1
There was a high probability that the lower end of 04 would hit the top surface of the electronic component and break it.

Therefore, it is an object of the present invention to provide a means for easily correcting the positional deviation of electronic components in the XY force directions in the pockets of a tray, and transferring and mounting them onto a board with high work efficiency.

(Means for Solving the Problems) To this end, the present invention includes a supply section for electronic components in which a tray is arranged, a positioning section for the board, and a positioning section for positioning the electronic components in the supply section driven by an XY direction moving device. In the electronic component mounting apparatus, the electronic component mounting apparatus is equipped with a transfer head that transfers and mounts the electronic component on a board positioned in the tray. a control device that controls the drive of the XY direction moving device by adding correction based on the positional deviation detected by the camera so that the nozzle lands with its center aligned with the center of the electronic component in the pocket; It was established.

(Function) In the above configuration, the camera detects the positional shift in the XY force direction of the electronic component stored in the pocket of the tray, and based on the result, drives the XY direction moving device to align the center of the nozzle with the center of the electronic component. By landing the electronic component on the ground, the positional deviation of the electronic component in the XY force direction is corrected, and the electronic component is transferred and mounted on the board.

(Example 1) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus, in which 1 is a table, 2 is a main body box installed on the table 1, and 3 is a perspective view of an electronic component mounting apparatus.
carries the board 6 on which electronic components are mounted onto the table 1,
Further, the conveyor 5 from which the substrate is carried out is a positioning section for the substrate 6 provided on the conveyor 3. Reference numeral 4 denotes an electronic component supply section provided in front of the positioning section 5. A tray 8 is disposed on the stand section 7, and the electronic components P are stored in the pockets of the tray 8. Reference numeral 9 denotes a camera provided above the supply section 4 to observe the positional shift of the electronic component P in the pocket.

10.11 is an XY direction moving device provided in the main body box 2, and 12.13 is a driving motor thereof. 15
is a transfer head vertically installed on the Y-direction moving device 11, and as shown in FIGS. 2 and 3, a die-throat nozzle 16 with a box-shaped suction portion 16a at the lower end protrudes. The electronic component P is sucked into the lower surface concave portion 16b of the suction portion 16a. N and AI are the centers of the nozzles 16. Reference numeral 17 denotes a camera with a built-in light source that is integrally attached to the transfer throat 15 and moves together with the transfer head 15 in the XY force directions to detect positional deviation of the printed pattern on the substrate 6 of the positioning section 5. Reference numeral 18 denotes a θ direction driving device for the nozzle 16, which is composed of a motor 18a and a belt 18b, and drives the motor 18a to rotate the nozzle 16 in the θ direction about its axis. FIG. 7 is a block diagram for control, and 30 is a control device such as a computer, which is connected to each camera 9, 17 and each motor 12, 13, 18.
Controls a, etc.

Next, detection of positional deviation of the electronic component P by the camera 9 will be described with reference to FIGS. 4 and 5.

In Fig. 4, x and y are pocket 8a of tray 8.
The xy axis has the center O as the origin, Pa is the ideal position of the electronic component whose center coincides with the center O of the pocket 8a, P
is a real electronic component, and 0° is its center. Note that the center position 0 of the pocket 8a is stored in the control device 30 by a teaching means or the like. As shown, this electronic component P is displaced in the XYθ directions by Δx 1 +Δyl, θ1. Next, a method for detecting these values will be described with reference to FIG. 5.

Since the brightness of electronic component P is quite different from the brightness of tray 8 (
Since the electronic components P housed in this type of tray are generally made of metal, the brightness is considerably higher than that of the black tray 8), and the electronic components P are observed by the camera 9 as a bright silhouette. Therefore, four points XL, XR, yu, and yd on the xy wheel axis where the brightness fails to change from bright to dark are detected, and the above center coordinate O is determined by the following formula.

Find (XP, YP).

XP= ・ ・ ・ ・(11 By calculating the center coordinate 0′ (XP, YP) in this way, the above positional deviations ΔX1 and Δy1 can be easily obtained. In addition to this method, detection can also be performed by a center of gravity detection method, that is, a method of detecting the intersection of line segments that bisect the area of a brightly bright part (that is, an electronic component) into two equal parts in the x and y force directions.

Next, a method for calculating the positional deviation θ1 in the θ direction will be described. First, a line segment W parallel to the X-axis that is bisected at the center coordinate 0" is set. The length of this line segment W is arbitrary, and is set to 70% of the width of the electronic component P, for example. Next, by scanning in the -y force direction from both ends A and B of the line segment W and detecting the position where the brightness switches from bright to dark, the distance YR, from the points A and B to the bottom surface of the electronic component P, is determined. Once YL is determined, the above θl can be calculated using the following equation.

Next, the mounting work of electronic components will be explained with reference to FIG.

First, as shown by the solid line in the figure, the XY direction moving device 10.
11 is driven to position the camera 17 above the substrate 4, and the positional shift of the print pattern printed on the substrate 6 is detected. FIG. 6 shows the detection method, where 6 is the above substrate, 6' is the reference master substrate, A, B, A'
.

B' is the reference point of each board 6.6'. Reference point A,
From the deviation of A', the positional deviation of the printing pattern in the xy force direction △x
2. Detect △y2, and also θ from the line 1.1" connecting each point
The positional deviation θ2 in the direction is detected. At this time, the electronic component P inside the pocket 8a was observed using the other camera 9, as shown in FIG.

As explained with reference to FIG.
Positional deviation Δx1. Find △yl and θl.

Next, as shown by the chain line in FIG. 2, the nozzle 16 is moved directly above the electronic component P, and by means not shown, the nozzle 16 is lowered, and the suction part 16a lands on the electronic component P to be ticked up. In this case, the positional deviation Δx1. detected as described above. The XY direction moving device 10.11 and the θ direction driving device 1 are used to correct Δyl θ1.
8 with correction based on these positional deviations Δxl, Δy1°θ1, and lowering the nozzle 16, the third
As shown in the figure, the centers N and AI of the nozzle 6 are aligned with the center 0'' of the electronic component P, and the four sides of the recessed part 16b of the suction part 16a are aligned with the four sides of the electronic component P, as shown by the chain line in FIG. It can be perfectly matched and adsorbed. After ticking up the electronic component P in this way, the XY direction moving device 10.11 is driven again to move the transfer head 15 toward the substrate 6, but in the middle of this, the motor 18a is driven to perform the above-mentioned process. While correcting the positional deviation θ2 in the θ direction, the positional deviation Δx2 in the XY force direction is corrected.
The electronic component P is mounted on the board 6 by driving the XY direction moving device 10.11 to correct Δy2. Each device for positional deviation correction 10°11.18 i! IJ control is performed by the control device 30 described above. As described above, according to the present means, the misalignment of the electronic component P in the pocket 8a and the misalignment of the printed pattern on the board 6 can be easily corrected.

(Example 2) FIG. 8 shows how an electronic component P is picked up by a transfer head 25 equipped with a flat nozzle 2G without a box-shaped suction part 16a. When ticking up using this nozzle 26, only the positional deviation in the XY force direction is corrected, and the positional deviation in the θ direction is not corrected.

Therefore, the center N and A2 of the nozzle 26 are connected to the electronic component P.
The positional deviation in the x and y force directions can be corrected by landing on the center O" of the This is done by driving the direction drive device 18.

This is because, in the case of the dicolent type nozzle of the first embodiment, unless the recessed part 16b is landed on the four sides of the electronic component by correcting in the θ direction, the corner of the electronic component will not fit into the recessed part 16b. There is a risk of damage due to hitting the inner wall surface,
This is because in the case of a flat nozzle, there is no directionality in all four directions, and it is only necessary to land the nozzle on the center of the electronic component, so this problem does not occur.

(Effects of the Invention) As explained above, the present invention detects the positional deviation of the electronic component in the pocket in the XY force direction using a camera, and drives the XY direction moving device to align the center of the nozzle with the center of the electronic component. By landing the electronic component on the ground and ticking it up, the positional deviation of the electronic component in the XY force direction is corrected. This eliminates the need for a correction stage equipped with a chuck means as in conventional equipment, simplifying the equipment. Since the electronic component only needs to be pinked up and landed once each, the chance or probability that the electronic component will be damaged is halved compared to the above-mentioned conventional means, and work efficiency can be increased.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which FIG. 1 is an overall side view of an electronic component mounting apparatus, and FIG. 2 is a side view of the entire electronic component mounting apparatus. Figure 3 is a side view of the main part during work, Figures 4 and 5. Figure 6 is a camera observation diagram, Figure 7 is a block diagram,
FIG. 8 is a side view of a main part of another embodiment, and FIGS. 9 and 10 are a side view and a plan view of a conventional device. 4... Supply unit 5... Positioning unit 6... Board 8... Tray 8a... Pocket 9... Camera 10... X direction moving device 11... Y direction moving device 15. 25...Transfer head 16.26...Nozzle 30...Control device N, AI, N, A2...Nozzle center P...Electronic component O...Name of electronic component center representative Patent attorney Shigetaka Kurino (1 person figure)

Claims (1)

[Claims] A supply section for electronic components in which a tray is arranged, a positioning section for substrates, and a transfer head driven by an XY direction moving device to transfer and mount the electronic components in the supply section onto the substrate positioned on the positioning section. In the electronic component mounting equipment equipped with
A camera detects a positional shift in the X and Y directions of an electronic component stored in a pocket of the tray, and a camera is installed so that the nozzle of the transfer head lands with its center aligned with the center of the electronic component in the pocket. An electronic component mounting apparatus comprising: a control device that controls driving of the XY direction moving device by adding correction based on the positional deviation detected by the method.