WO2016125245A1

WO2016125245A1 - Supplied component transfer device

Info

Publication number: WO2016125245A1
Application number: PCT/JP2015/052934
Authority: WO
Inventors: 弘健江嵜
Original assignee: 富士機械製造株式会社
Priority date: 2015-02-03
Filing date: 2015-02-03
Publication date: 2016-08-11
Also published as: JP6461205B2; JPWO2016125245A1

Abstract

A supplied component transfer device (20) comprises: a plurality of temporary placement tables (21); a table movement device (22) for moving each of the temporary placement tables (21) in the order from a transfer position, a recognition position, and then a supply position; a transfer nozzle (23) for placing a component supplied from a component supply device (10) onto the temporary placement table (21) at the transfer position; a nozzle movement device (24) for moving the transfer nozzle (23); a camera (25) for imaging a component on the temporary placement table (21) at the recognition position from thereabove; and a camera movement device (26) for moving the camera (25) along the array of components on the temporary placement table (21) at the recognition position. The supplied component transfer device (20) concurrently carries out actions for: placing a component supplied from the component supply device (10) onto the temporary placement table (21) at the transfer position by suctioning the component with the transfer nozzle (23); recognizing the position of each component by individually imaging a plurality of components on the temporary placement table (21) at the recognition position with the camera (25); and mounting a component on the temporary placement table (21) at the supply position onto a circuit board by suctioning the component with a suction nozzle (31) of a component mounting apparatus.

Description

Supply parts transfer device

The present invention is an invention relating to a supply component transfer device for supplying a component supplied from a component supply device to a temporary mounting table and supplying the component to a component mounting machine.

In general, in a component mounting machine, a component supplied from a component supply device is sucked from above by a suction nozzle, the component is picked up by a camera from below, and the position of the component is detected by image processing, and the detection is performed. Based on the result, the positional deviation of the component is corrected and the component is mounted on the circuit board.

However, in recent years, there has been a demand for correcting the positional deviation of the component on the basis of the electrodes, positioning marks, patterns, etc. existing on the upper surface of the component and mounting them on the circuit board.

In order to meet such a demand, a component mark supply camera equipped on a component mounter is used to capture an image of a component supplied from a component supply device from above, and image processing of the component is performed. An electrode on the upper surface, a positioning mark, a pattern, or the like is recognized, and the positional deviation of the component is corrected based on the recognition result and mounted on a circuit board.

In this case, since the component is adsorbed by the adsorption nozzle after detecting the position of the component, the position of the component may be shifted during the adsorption operation. For example, when using a soft tray or a soft component supply tape, the tray or tape is deformed when the component is sucked by the suction nozzle, and the posture of the component is changed by the deformation and the position of the component is shifted. Sometimes. If the position of the component is shifted during the suction operation, a difference occurs between the position of the component detected before suction and the position of the component after suction, which adversely affects the mounting accuracy of the component.

In order to solve this problem, as described in Patent Document 1 (Japanese Patent Laid-Open No. 2001-113421) and Patent Document 2 (Japanese Patent Laid-Open No. 2004-221130), the suction is performed on the suction nozzle of the component mounting machine. A hard temporary table for mounting the mounted parts is provided, and the components sucked by the suction nozzle are placed on the temporary table and positioned, and then the components on the temporary table are re-sucked by the suction nozzle and mounted on the circuit board. Things have been done.

JP 2001-113421 A JP 2004-221130 A

However, in the above method, since the operation of placing the component supplied from the component supply device on the temporary mounting table is performed by the suction nozzle of the component mounting machine, the component on the temporary mounting table is suctioned by the suction nozzle of the component mounting machine. There has been a drawback that the cycle time of the operation of mounting on the substrate is extended and the productivity is lowered.

Therefore, the problem to be solved by the present invention is to provide a supply component transfer device that can shorten the cycle time of the operation of mounting the component on the temporary mounting table on the circuit board and improve the productivity. is there.

In order to solve the above-described problems, the present invention has a temporary placement table on which a component supplied from a component supply device is placed in a horizontal posture, and a supply component transfer for supplying the component placed on the temporary placement table to a component mounting machine. In the mounting apparatus, the apparatus includes a transfer means for mounting the component supplied from the component supply device on the temporary table, and a camera for imaging the component mounted on the temporary table from above, and an image captured by the camera is provided. The position of the component processed and placed on the temporary placement table is recognized, and the recognition result or the positional deviation correction amount of the component is transmitted to the component mounter.

Since the supply component transfer device of the present invention includes transfer means for placing the component supplied from the component supply device on the temporary placement table, and a camera for imaging the component placed on the temporary placement table from above, The operation of placing the parts supplied from the component supply device on the temporary placement table and the operation of taking images of the parts on the temporary placement table with the camera, pick up the components on the temporary placement table with the suction nozzle of the component mounting machine Can be performed in parallel with the operation implemented in Thereby, the cycle time of the operation | movement which mounts the components on a temporary mounting base in a circuit board can be shortened, and productivity can be improved.

In this case, the transfer means may include a camera moving device that places a plurality of parts on the temporary table and moves the camera along the arrangement of the parts on the temporary table. In this way, it is possible to sequentially recognize the position of each component by sequentially imaging a plurality of components placed on the temporary placement table with one camera.

The supply component transfer device of the present invention uses a transfer nozzle that sucks a component as the transfer means, and the temporary position of the transfer nozzle that sucks a component supplied from the component supply device. It is good also as a structure provided with the nozzle moving apparatus which moves between the positions mounted on a stand. In this case, the number of transfer nozzles may be one or plural.

The supply component transfer device of the present invention includes a plurality of temporary placement tables and a table moving device that moves each temporary placement table between a plurality of positions, and any of the components supplied from the component supply device. The position on the temporary placement table may be separated from the position at which the component placed on any temporary placement table is supplied to the component mounting machine. In this way, the operation of placing the component supplied from the component supply device on the temporary placement table and the operation of sucking the component on the temporary placement table by the suction nozzle of the component mounting machine and mounting them on the circuit board are performed in parallel. Can be done efficiently.

Furthermore, the supply component transfer device of the present invention is a position where the component supplied from the component supply device is placed on any temporary placement table, and a position where the camera places an image of the component placed on any temporary placement table. And a position at which a component placed on any temporary mounting table is supplied to the component mounter. If it does in this way, the operation which mounts the component supplied from a component supply device on a temporary placement stand, the operation which picturizes the part on a temporary placement stand with a camera, and the component on a temporary placement stand, the adsorption nozzle of a component mounting machine The operation of adsorbing and mounting on the circuit board can be efficiently performed in parallel.

The supply component transfer device of the present invention may be provided as a unit separate from the component supply device or the component mounting machine, or may be provided in the component supply device or in the component mounting machine.

FIG. 1 is a side view showing the configuration of a component supply device and a supply component transfer device according to an embodiment of the present invention. FIG. 2 is a plan view showing configurations of the component supply device and the supply component transfer device. FIG. 3 is a block diagram showing the configuration of the control system of the supply component transfer apparatus. FIG. 4 is a flowchart showing a control program of the supply component transfer apparatus.

Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described.
First, the structure of the component supply apparatus 10 and the supply component transfer apparatus 20 is demonstrated based on FIG.1 and FIG.2.

The component supply apparatus 10 of the present embodiment includes a plurality of types of feeders (the tray feeder 11 and the tape feeder 12), but may be configured to include only one type of feeder.
The supply component transfer device 20 is provided in the component supply device 10 and is located between the tray feeder 11 or the tape feeder 12 and the component mounting station of the component mounting machine.

The supply component transfer device 20 includes a plurality of temporary placement tables 21 formed of a hard material, and each temporary placement table 21 in the order of transfer position → recognition position → supply position in the Y direction (the substrate transport direction of the component mounting machine). And a table moving device 22 (see FIG. 3) that moves in a direction perpendicular to the vertical axis. Each temporary placement table 21 is formed in a flat plate shape extending in the X direction (substrate transport direction of the component mounting machine), and a plurality of components are arranged on the temporary placement table 21 in the X direction. In the present embodiment, a total of six temporary placing tables 21 are arranged in two upper and lower stages, and each temporary placing table 21 is moved by the table moving device 22 to a transfer position → a recognition position → a supply position → a position below the supply position. → The lower position of the recognition position → The lower position of the transfer position → The transfer position →...

In addition, the supply component transfer device 20 moves the components supplied from the component supply device 10 on the temporary placement table 21 at the transfer position, and moves the transfer nozzle 23 in the XY directions. A nozzle moving device 24 (see FIG. 3) for moving the transfer nozzle 23 above the tray feeder 11 and the tape feeder 12 by the nozzle moving device 24 to adsorb the components, and then transferring the transfer nozzle 23. A plurality of parts are placed side by side in the X direction on the temporary placement table 21 by repeating the operation of moving the placement table 21 above the temporary placement table 21 and placing it on the temporary placement table 21. There may be one transfer nozzle 23 or a plurality of transfer nozzles 23.

Further, the supply component transfer device 20 captures the parts on the temporary placement table 21 at the recognition position from above, and the camera 25 in the X direction along the arrangement of the parts on the temporary placement table 21 at the recognition position. A plurality of parts on the temporary placement table 21 at the recognition position and picked up by the camera 25 one by one, such as electrodes existing on the upper surface of each part, positioning marks, patterns, etc. It is designed to recognize the position.

The parts on the temporary placement table 21 at the supply position are sucked by the suction nozzle 31 of the component mounting machine and mounted on the circuit board. The control device 27 (see FIG. 3) of the supply component transfer device 20 temporarily places a component on the temporary placement table 21 at the supply position by a request from the component mounter when the component nozzle suctions the component. The recognition result of the position of the component on the table 21 or the displacement correction amount is transmitted to the component mounting machine. Thereby, the component mounting machine corrects the positional deviation of the component on the basis of the electrodes, positioning marks, patterns, etc. existing on the upper surface of the component and mounts them on the circuit board.

The control device 27 of the supply component transfer device 20 controls the operation of the supply component transfer device 20 as follows by executing the control program of FIG. First, in step 101, a component transfer operation in which components supplied from the component supply device 10 are sucked by the transfer nozzle 23 and placed on the temporary placement table 21 at the transfer position, and a plurality of recognition positions on the temporary placement table 21 are placed. A part recognition operation for recognizing the positions of electrodes, positioning marks, patterns, etc. existing on the upper surface of each part by picking up one part at a time with the camera 25 and parts on the temporary placement table 21 at the supply position The component mounting operation of sucking with the suction nozzle 31 of the mounting machine and mounting on the circuit board is performed in parallel. At this time, in accordance with a request from the component mounting machine, the recognition result of the position of the component on the temporary placement table 21 or the positional deviation correction amount is transmitted to the component mounting machine. Thereby, the component mounting machine corrects the positional deviation of the component on the basis of the electrodes, positioning marks, patterns, etc. existing on the upper surface of the component and mounts them on the circuit board.

In the next step 102, it is determined whether or not the component transfer operation, the component recognition operation, and the component mounting operation are all completed for the temporary placement table 21 at the three positions described above. Repeat the operation until the end. Then, when the component transfer operation, the component recognition operation, and the component mounting operation are all completed for the temporary placement table 21 at the three positions, the process proceeds to step 103, and each temporary placement table 21 is moved to the next position. Then, returning to the step 101, the component transfer operation, the component recognition operation, and the component mounting operation are performed in parallel on the temporary placement table 21 at the three positions. Thereafter, each time the component transfer operation, the component recognition operation, and the component mounting operation are completed for the temporary placement table 21 at the three positions, each temporary placement table 21 is moved to the next position, and again 3 The operation of performing the component transfer operation, the component recognition operation, and the component mounting operation in parallel on the temporary placement table 21 at one position is repeated.

The supply component transfer device 20 of the present embodiment described above picks up the transfer nozzle 23 for placing the component supplied from the component supply device 10 on the temporary placement table 21 and the component placed on the temporary placement table 21 from above. Therefore, the operation of placing the component supplied from the component supply apparatus 10 on the temporary placement table 21 and the operation of imaging the component on the temporary placement table 21 with the camera 25 are adsorbed by the component mounting machine. This can be performed in parallel with the operation of picking up the components on the temporary placement table 21 by the nozzle 31 and mounting them on the circuit board. Thereby, the cycle time of the operation | movement which mounts the components on the temporary mounting base 21 in a circuit board can be shortened, and productivity can be improved.

In addition, since the supply component transfer device 20 according to the present embodiment places a plurality of components on the temporary placement table 21 and moves the camera 25 along the arrangement of the plurality of components on the temporary placement table 21, 1 A plurality of parts placed on the temporary placement table 21 can be sequentially imaged by the camera 25 and the position of each part can be recognized in order. However, in the present invention, only one part may be placed on the temporary table 21.

Furthermore, the supply component transfer device 20 of this embodiment includes a plurality of temporary placement tables 21 and a table moving device 22 that moves each temporary placement table 21 between a plurality of positions, and is supplied from the component supply device 11. A position where a part to be placed is placed on any temporary placement table 21, a position where a part 25 placed on any temporary placement table 21 is imaged by a camera 25, and a part placed on any temporary placement table 21 is mounted on a component mounter. Since the position to be supplied to the device is separated, the operation of placing the component supplied from the component supply device 10 on the temporary table 21, the operation of imaging the component on the temporary table 21 with the camera 25, and the temporary table The operation of sucking the components on 21 by the suction nozzle 31 of the component mounting machine and mounting them on the circuit board can be efficiently performed in parallel.

However, in the present invention, the component transfer operation, the component recognition operation, and the component mounting operation are performed with one temporary table, or the temporary table is moved between two positions. The operation and the component recognition operation may be performed with a temporary placement table at the same position, or the component recognition operation and the component mounting operation may be performed with a temporary placement table at the same position.

In addition, when placing a part on the temporary table, a mechanism for turning the part upside down is provided, or a mechanism for adjusting the horizontal rotation angle of the temporary table is provided, so that the rotational angle of the parts on the temporary table can be shifted. You may make it correct | amend or you may make it laminate | stack components on a temporary placement stand.
Further, the transfer means for placing the components supplied from the component supply apparatus 10 on the temporary placement table 21 is not limited to the transfer nozzle 23, and a chuck or the like may be used.

In addition, the supply component transfer device of the present invention is not limited to the configuration provided in the component supply device, and may be provided in a component mounter, or provided as a unit separate from the component supply device and the component mounter. Needless to say, various modifications can be made without departing from the scope of the invention.

DESCRIPTION OF SYMBOLS 10 ... Parts supply apparatus, 11 ... Tray feeder, 12 ... Tape feeder, 20 ... Supply part transfer apparatus, 21 ... Temporary placing stand, 22 ... Stand moving apparatus, 23 ... Transfer nozzle (transfer means), 24 ... Nozzle Moving device, 25 ... Camera, 26 ... Camera moving device, 27 ... Control device, 31 ... Suction nozzle

Claims

In the supply component transfer device that has a temporary placement table for placing the components supplied from the component supply device in a horizontal posture, and supplies the components placed on the temporary placement table to the component mounting machine,
Transfer means for placing the components supplied from the component supply device on the temporary table;
A camera for imaging the part placed on the temporary table from above,
A supply component that processes a captured image of the camera, recognizes a position of a component placed on the temporary placement table, and transmits a recognition result or a positional deviation correction amount of the component to the component mounter. Transfer device.
The transfer means places a plurality of parts on the temporary table,
The supply component transfer apparatus according to claim 1, further comprising a camera moving device that moves the camera along an arrangement of a plurality of components on the temporary table.
The transfer means is a transfer nozzle that adsorbs components,
3. The apparatus according to claim 1, further comprising a nozzle moving device that moves the transfer nozzle between a position where the component supplied from the component supply device is adsorbed and a position where the component is placed on the temporary table. The supply component transfer device described.
A plurality of temporary placement tables, and a table moving device that moves each temporary placement table between a plurality of positions, and a position where a component supplied from the component supply device is placed on any temporary placement table; 4. The supply component transfer apparatus according to claim 1, wherein a position where a component placed on a temporary placement table is supplied to the component mounter is separated.
A position where the parts supplied from the parts supply device are placed on any temporary placement table, a position where the part placed on any temporary placement table is imaged by the camera, and a component placed on any temporary placement table The supply component transfer device according to claim 4, wherein the supply component transfer device is separated from a position where the component supply device is supplied to the component mounting machine.
The supply component transfer device according to any one of claims 1 to 5, wherein the supply component transfer device is provided in the component supply device.