JP2010108960A - Electronic component mounting apparatus - Google Patents

Electronic component mounting apparatus Download PDF

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JP2010108960A
JP2010108960A JP2008276395A JP2008276395A JP2010108960A JP 2010108960 A JP2010108960 A JP 2010108960A JP 2008276395 A JP2008276395 A JP 2008276395A JP 2008276395 A JP2008276395 A JP 2008276395A JP 2010108960 A JP2010108960 A JP 2010108960A
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relay table
electronic component
cleaning
head
component mounting
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JP4992881B2 (en
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Tsutomu Hiraki
勉 平木
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Panasonic Corp
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Panasonic Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus capable of cleaning relay table and collecting faulty components in a single operation. <P>SOLUTION: The electronic component mounting apparatus 1 includes: a waste collecting section 41 arranged at the side of the relay table 14 in a second direction; a second horizontal moving device 24 for horizontally moving the relay table 14 and the waste collecting section 41 in the second direction; and a cleaning brush 36 arranged at the travel route of the relay table 14 and the waste collecting section 41. When the relay table 14 is moved horizontally in the second direction at a lower portion of the cleaning brush 36, foreign matters and faulty components on the relay table 14 are swept off to the waste collecting section 41 by the cleaning brush 36. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明はピックアップした電子部品を一旦仮置きした後に基板に搭載する電子部品実装装置に関する。   The present invention relates to an electronic component mounting apparatus in which picked-up electronic components are temporarily placed and then mounted on a substrate.

電子部品の実装装置において、一つのヘッドで電子部品のピックアップから基板への搭載までの全ての工程を実施するのではなく、電子部品をピックアップして中継テーブルに一旦仮置きするピックアップヘッドと、これを基板に搭載するボンディングヘッドという機能の異なる二つのヘッドを備えたものがある（特許文献１参照）。また破損がある不良部品を基板に搭載する前段階で排除するため、ヘッドに吸着したままで電子部品の外観検査を行い、不良が確認されたらそのまま廃棄場所まで移送して廃棄する装置がある（特許文献２参照）。
特開２００１−１５５３３号公報 特開平５−１２１４６６号公報 In an electronic component mounting apparatus, a pickup head that picks up an electronic component and temporarily places it on a relay table, rather than performing all the steps from picking up the electronic component to mounting on the substrate with a single head, and this There is a thing provided with two heads with different functions called a bonding head which mounts on a substrate (refer to patent documents 1). In addition, in order to eliminate defective parts with damage in the stage before mounting on the board, there is a device that inspects the appearance of electronic parts while adsorbing to the head, and if defects are confirmed, it is transferred to a disposal place and discarded ( Patent Document 2).
Japanese Patent Laid-Open No. 2001-15533 JP-A-5-121466

しかし、電子部品を一旦仮置きするための中継テーブルは電子部品の授受が頻繁に行われるために汚れやすく、汚れたまま放置しておくと電子部品に汚れが付着し、通電不良等の品質悪化を招くという問題がある。また、中継テーブル上の電子部品の外観検査の結果、不良部品であることが判明した場合、従来の装置では不良部品の回収をヘッドで行うことができなかった。   However, the relay table for temporarily placing the electronic components is easily contaminated because the electronic components are frequently exchanged, and if left unclean, the electronic components become dirty and the quality deteriorates due to poor conduction. There is a problem of inviting. Further, when it is found that the electronic component on the relay table is defective as a result of the visual inspection, the conventional apparatus cannot collect the defective component with the head.

本発明は、中継テーブルの清掃と不良部品の回収を一つの動作で行うことができる電子部品実装装置を提供することを目的とする。   An object of the present invention is to provide an electronic component mounting apparatus capable of cleaning a relay table and collecting defective components in one operation.

請求項１に記載の電子部品実装装置は、電子部品を吸着して取り出すピックアップヘッドと、取り出された電子部品を仮置きする中継テーブルと、仮置きされた電子部品を基板に搭載する実装ヘッドと、前記ピックアップヘッドと前記実装ヘッドを第１の方向において水平移動させる第１の水平移動装置と、前記第１の方向と直交する第２の方向において前記中継テーブルの側方に配置された廃棄物回収部と、前記中継テーブルと前記廃棄物回収部を前記第２の方向において水平移動させる第２の水平移動装置と、前記中継テーブルと前記廃棄物回収部の移動経路に配置されたクリーニングヘッドと、前記クリーニングヘッドの下部に装着された清掃具とを備え、前記クリーニングヘッドの下方で前記中継テーブルを水平移動させ、前記中継テーブル上の異物または不良部品を前記清掃具で前記廃棄物回収部に掃き落とす。   An electronic component mounting apparatus according to claim 1 is a pickup head that picks up and takes out an electronic component, a relay table that temporarily places the taken out electronic component, a mounting head that mounts the temporarily placed electronic component on a substrate, and A first horizontal movement device that horizontally moves the pickup head and the mounting head in a first direction; and waste disposed on a side of the relay table in a second direction orthogonal to the first direction. A collection unit; a second horizontal movement device that horizontally moves the relay table and the waste collection unit in the second direction; and a cleaning head disposed on a movement path of the relay table and the waste collection unit; A cleaning tool mounted at a lower portion of the cleaning head, and horizontally moving the relay table below the cleaning head, Foreign matter or faulty components on Buru dropping sweep the waste collection unit in the cleaning tool.

請求項２に記載の電子部品実装装置は、請求項１に記載の電子部品実装装置であって、前記クリーニングヘッドを鉛直方向において移動させる鉛直移動機構をさらに備え、クリーニング時に前記クリーニングヘッドを下降させ、前記清掃具を前記中継テーブル上に接触させる。   The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, further comprising a vertical movement mechanism that moves the cleaning head in a vertical direction, and lowers the cleaning head during cleaning. The cleaning tool is brought into contact with the relay table.

請求項３に記載の電子部品実装装置は、請求項１または２に記載の電子部品実装装置であって、前記クリーニングヘッド側から前記中継テーブル上の異物を吸引して回収する。   An electronic component mounting apparatus according to a third aspect is the electronic component mounting apparatus according to the first or second aspect, wherein the foreign matter on the relay table is sucked and collected from the cleaning head side.

請求項４に記載の電子部品実装装置は、請求項１乃至３の何れかに記載の電子部品実装
装置であって、前記中継テーブル上の電子部品を認識するカメラをさらに備え、前記カメラの認識結果から前記中継テーブル上の電子部品が不良部品であることが認識された場合、もしくは前記中継テーブル上に異物が確認された場合に前記中継テーブル上のクリーニングを行う。 The electronic component mounting apparatus according to claim 4 is the electronic component mounting apparatus according to any one of claims 1 to 3, further comprising a camera for recognizing the electronic component on the relay table, and recognition of the camera. When it is recognized from the result that the electronic component on the relay table is a defective component, or when a foreign object is confirmed on the relay table, cleaning on the relay table is performed.

移動テーブルの移動経路に配置されたクリーニングヘッドに対して中継テーブルおよび廃棄物回収部が移動し、中継テーブル上の異物や不良部品がクリーニングヘッドに接触して廃棄物回収部に掃き落とされるので、不良部品の回収と中継テーブルのクリーニング作業を同一の機構を用いて一つの動作で行うことができる。   Since the relay table and the waste collection unit move relative to the cleaning head arranged in the moving path of the moving table, foreign matters and defective parts on the relay table come into contact with the cleaning head and are swept away by the waste collection unit. The collection of defective parts and the cleaning operation of the relay table can be performed in one operation using the same mechanism.

本発明の実施の形態について図面を参照して説明する。図１は本発明の実施の形態の電子部品実装装置の斜視図、図２は本発明の実施の形態のクリーニング装置の側面図、図３は本発明の実施の形態の不良チップの廃棄方法の説明図、図４は本発明の実施の形態のクリーニング方法の説明図である。   Embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of a cleaning apparatus according to an embodiment of the present invention, and FIG. 3 is a diagram illustrating a method for discarding defective chips according to an embodiment of the present invention. FIG. 4 is an explanatory diagram of the cleaning method according to the embodiment of the present invention.

最初に電子部品実装装置について図１、図２を参照して説明する。電子部品実装装置１はチップ２を基板３に実装する装置である。チップ２はシリコンウェハを個片化したものであり、ウェハシート４の上面に貼り付けられている。ウェハシート４はウェハシートホルダ５によって外縁に掛けられた張力によって延展した状態にあり、これにより隣り合うチップ２の間には適当な間隔が形成されている。基板３は回路形成面を上向きにした姿勢で基板テーブル６に載置されている。ディスペンサ７はノズル８を備えており、ノズル８から射出したペースト接着剤を回路形成面の所定の箇所に塗布する。ディスペンサ７は昇降装置９の駆動によって鉛直方向において移動し、ノズル８と回路形成面との距離を調節する。ペースト接着剤の塗布位置の調整は、ディスペンサ７を第１の方向に水平移動させる水平移動装置１０と、基板テーブル６を第１の方向と水平面内で直交する第２の方向に水平移動させる水平移動装置１１の駆動制御によって行う。   First, an electronic component mounting apparatus will be described with reference to FIGS. The electronic component mounting apparatus 1 is an apparatus for mounting a chip 2 on a substrate 3. The chip 2 is obtained by dividing a silicon wafer into pieces, and is attached to the upper surface of the wafer sheet 4. The wafer sheet 4 is in a state of being extended by the tension applied to the outer edge by the wafer sheet holder 5, whereby an appropriate interval is formed between the adjacent chips 2. The substrate 3 is placed on the substrate table 6 with the circuit forming surface facing upward. The dispenser 7 includes a nozzle 8 and applies the paste adhesive injected from the nozzle 8 to a predetermined portion of the circuit forming surface. The dispenser 7 moves in the vertical direction by driving the lifting device 9 and adjusts the distance between the nozzle 8 and the circuit forming surface. The application position of the paste adhesive is adjusted by a horizontal movement device 10 that horizontally moves the dispenser 7 in the first direction, and a horizontal movement that horizontally moves the substrate table 6 in a second direction orthogonal to the first direction in the horizontal plane. This is performed by driving control of the moving device 11.

ピックアップヘッド１２はウェハシート４に貼り付けられているチップ２をノズル１３で吸着し、ウェハシート４から剥ぎ取って中継テーブル１４に移送する。ピックアップヘッド１２は昇降装置１５の駆動によって鉛直方向に移動し、水平移動装置１６の駆動によって第１の方向に水平移動する。   The pickup head 12 sucks the chip 2 attached to the wafer sheet 4 with the nozzle 13, peels it off from the wafer sheet 4, and transfers it to the relay table 14. The pickup head 12 moves in the vertical direction by driving the lifting device 15 and horizontally moves in the first direction by driving the horizontal moving device 16.

実装ヘッド１７はピックアップヘッド１２によって中継テーブル１４上に置かれたチップ２をノズル１８で吸着し、ペースト接着剤が塗布された基板３に実装する。実装ヘッド１７は昇降装置１９の駆動によって鉛直方向に移動し、水平移動装置２０の駆動によって第１の方向に水平移動する。チップ２の実装位置の調整は、この水平移動装置２０と、基板テーブル６を第２の方向に水平移動させる水平移動装置１１の駆動制御によって行う。   The mounting head 17 adsorbs the chip 2 placed on the relay table 14 by the pickup head 12 with the nozzle 18 and mounts the chip 2 on the substrate 3 to which the paste adhesive is applied. The mounting head 17 moves in the vertical direction by driving the lifting device 19, and horizontally moves in the first direction by driving the horizontal moving device 20. The mounting position of the chip 2 is adjusted by drive control of the horizontal movement device 20 and the horizontal movement device 11 that horizontally moves the substrate table 6 in the second direction.

中継テーブル１４はノズル交換装置２１とともに移動テーブル２２上に配置されている。移動テーブル２２は第１の方向においてウェハシートホルダ５と基板テーブル６の間に配置され、水平移動装置２４の駆動によって第２の方向に水平移動する。ノズル交換装置２１には交換用のノズル１３、１８が収納されている。   The relay table 14 is arranged on the moving table 22 together with the nozzle changing device 21. The moving table 22 is disposed between the wafer sheet holder 5 and the substrate table 6 in the first direction, and horizontally moves in the second direction by driving the horizontal moving device 24. The nozzle replacement device 21 accommodates replacement nozzles 13 and 18.

電子部品実装装置１にはチップ２の位置や形状を認識するためのカメラ２６、２７、２８、２９が備えられている。第１のカメラ２６はウェハシート４に貼り付けられたチップ２を認識する。第１のカメラ２６による認識結果はピックアップヘッド１２の駆動制御に反映され、ピックアップヘッド１２はチップ２の位置や向きに応じてノズル１３の位置および角度を補正して吸着を行う。   The electronic component mounting apparatus 1 includes cameras 26, 27, 28, and 29 for recognizing the position and shape of the chip 2. The first camera 26 recognizes the chip 2 attached to the wafer sheet 4. The recognition result by the first camera 26 is reflected in the drive control of the pickup head 12, and the pickup head 12 performs suction by correcting the position and angle of the nozzle 13 according to the position and orientation of the chip 2.

第２のカメラ２７は中継テーブル１４に置かれたチップ２を認識する。第２のカメラ２７による認識結果は実装ヘッド１７の駆動制御に反映され、実装ヘッド１７はチップ２の位置や向きに応じてノズル１８の位置および角度を補正して吸着を行う。   The second camera 27 recognizes the chip 2 placed on the relay table 14. The recognition result by the second camera 27 is reflected in the drive control of the mounting head 17, and the mounting head 17 performs suction by correcting the position and angle of the nozzle 18 according to the position and orientation of the chip 2.

第３のカメラ２８は基板３の回路形成面のペースト接着剤の塗布箇所を認識する。第３のカメラ２８による認識結果はディスペンサ７の駆動制御に反映される。第４のカメラ２９は実装ヘッド１７のノズル１８に吸着されているチップ２を認識する。第４のカメラ２９による認識結果は実装ヘッド１７の駆動制御に反映され、実装ヘッド１７はチップ２の位置や向きに応じてノズル１８の位置および角度を補正して実装を行う。   The third camera 28 recognizes the paste adhesive application location on the circuit forming surface of the substrate 3. The recognition result by the third camera 28 is reflected in the drive control of the dispenser 7. The fourth camera 29 recognizes the chip 2 sucked by the nozzle 18 of the mounting head 17. The recognition result by the fourth camera 29 is reflected in the drive control of the mounting head 17, and the mounting head 17 performs mounting by correcting the position and angle of the nozzle 18 according to the position and orientation of the chip 2.

水平移動装置２４は、基台３０によって送りねじ３１を水平に固定し、モータ３２を駆動源とする送りねじ３１の回転によってナット３３が第２の方向に水平移動するように構成されている。移動テーブル２２はナット３３に連結されている。基台３０にはクリーニング装置３４が固定されている。クリーニング装置３４はクリーニングヘッド３５の下部に取り付けられたクリーニングブラシ３６によって中継テーブル１４上の異物や不良チップを廃棄物回収部４１に掃き落とす装置である。クリーニングヘッド３５はピストンロッド３７の先端部（上端部）に連結され、空圧シリンダ３８の駆動によって高さの調整が可能である。クリーニングヘッド３５には集塵室３９が備わっており、外部からの真空吸引によりクリーニングヘッド３５の下方から吸引した異物を捕集する。   The horizontal movement device 24 is configured such that the feed screw 31 is horizontally fixed by the base 30 and the nut 33 is horizontally moved in the second direction by the rotation of the feed screw 31 using the motor 32 as a drive source. The moving table 22 is connected to a nut 33. A cleaning device 34 is fixed to the base 30. The cleaning device 34 is a device that sweeps foreign matter and defective chips on the relay table 14 to the waste collection unit 41 by the cleaning brush 36 attached to the lower part of the cleaning head 35. The cleaning head 35 is connected to the tip portion (upper end portion) of the piston rod 37, and the height can be adjusted by driving the pneumatic cylinder 38. The cleaning head 35 is provided with a dust collection chamber 39 for collecting foreign matter sucked from below the cleaning head 35 by vacuum suction from the outside.

中継テーブル１４とノズル交換装置２１は移動テーブル２２上で第２の方向に並んで配置されており、中継テーブル１４は第２のカメラ２７の真下の位置にあるときにクリーニング装置３４に近い方に位置している。中継テーブル１４には第２の方向において隣接する位置に連結具４０廃棄物回収部４１が取り付けられている。廃棄物回収部４１は中継テーブル１４が第２のカメラ２７の真下の位置にあるときにクリーニング装置３４に近い方に位置している。連結具４０は中継テーブル１４の上面と段差なく連続し、廃棄物回収部４１を中継テーブル１４の上面より低い位置で連結している。廃棄物回収部４１は上部が開放された箱であり、中継テーブル１４の上面から落下してきた物体を内側に捕集する。   The relay table 14 and the nozzle changing device 21 are arranged side by side in the second direction on the moving table 22, and the relay table 14 is closer to the cleaning device 34 when it is directly below the second camera 27. positioned. A connector 40 waste collection unit 41 is attached to the relay table 14 at a position adjacent to the relay table 14 in the second direction. The waste collection unit 41 is located closer to the cleaning device 34 when the relay table 14 is located immediately below the second camera 27. The connector 40 is continuous with the upper surface of the relay table 14 without a step, and connects the waste collection unit 41 at a position lower than the upper surface of the relay table 14. The waste collection unit 41 is a box whose upper part is opened, and collects an object falling from the upper surface of the relay table 14 inside.

次に不良チップの廃棄方法について図３を参照して説明する。第２のカメラ２７による中継テーブル１４上のチップ２の認識結果は実装ヘッドの駆動制御に反映されるだけではなく、チップ２の品質確認にも用いられる。チップ２に破損が確認された場合はこれを除去し、基板３に実装されないようにしなければならない。認識の結果、中継テーブル１４上のチップ２が破損の生じた不良チップであると確認されたら、中継テーブル１４上のチップ２とクリーニングブラシ３６が干渉しない高さまでクリーニングヘッド３５を上昇させ（図３ａ）、次に移動テーブル２２を水平移動させ、チップ２を載せたままの中継テーブル１４と廃棄物回収部４１をクリーニングヘッド３５の下を通過させる（図３ｂ）。中継テーブル１４がクリーニングヘッド３５の下を通過したら、中継テーブル１４の上面にクリーニングブラシ３６が接触する高さまでクリーニングヘッド３５を下降させ（図３ｃ）、移動テーブル２２を逆方向に移動させる（図３ｄ）。このとき中継テーブル１４上のチップ２はクリーニングブラシ３６によって堰き止められ、チップ２の下を中継テーブル１４と連結具４０が通過し、チップ２は廃棄物回収部４１に落下する。   Next, a method for discarding defective chips will be described with reference to FIG. The recognition result of the chip 2 on the relay table 14 by the second camera 27 is not only reflected in the drive control of the mounting head, but also used for quality confirmation of the chip 2. If damage is confirmed in the chip 2, it must be removed so that it is not mounted on the substrate 3. As a result of the recognition, if it is confirmed that the chip 2 on the relay table 14 is a defective chip that has been damaged, the cleaning head 35 is raised to a height at which the chip 2 on the relay table 14 and the cleaning brush 36 do not interfere (FIG. 3a). Next, the moving table 22 is moved horizontally, and the relay table 14 and the waste collection unit 41 with the chip 2 placed thereon are passed under the cleaning head 35 (FIG. 3b). When the relay table 14 passes under the cleaning head 35, the cleaning head 35 is lowered to a height at which the cleaning brush 36 contacts the upper surface of the relay table 14 (FIG. 3c), and the moving table 22 is moved in the reverse direction (FIG. 3d). ). At this time, the chip 2 on the relay table 14 is blocked by the cleaning brush 36, the relay table 14 and the connector 40 pass under the chip 2, and the chip 2 falls to the waste collection unit 41.

次に中継テーブル１４のクリーニング方法について図４を参照して説明する。第２のカメラ２７によるチップ２の認識の結果、チップ２以外の異物４２が中継テーブル１４上に確認された場合は、異物４２がチップ２に付着したり、装置内に紛れ込んだりしないように速やかにこれを除去しなければならない。中継テーブル１４上に異物４２が確認されたら、異物４２とクリーニングブラシ３６が干渉しない高さまでクリーニングヘッド３５を上昇させてから移動テーブル２２を水平移動させ、異物４２を載せたままの中継テーブル
１４と廃棄物回収部４１をクリーニングヘッド３５の下を通過させる（図４ａ）。次に中継テーブル１４の上面にクリーニングブラシ３６が接触する高さまでクリーニングヘッド３５を下降させ、移動テーブル２２を逆方向に移動させる（図４ｂ）。中継テーブル１４上の比較的大きい異物４２ａはクリーニングブラシ３６と干渉して廃棄物回収部４１に掃き落とされるが、微小な異物４２ｂはクリーニングブラシ３６の間を抜けてしまう。このような異物４２ｂは真空吸引により吸い上げて集塵室３９に捕集する（図４ｄ）。また中継テーブル１４の上面に粘着しているような異物については、移動テーブル２２を小刻みに往復移動させ、中継テーブル１４の上面を摺動するクリーニングブラシ３６によって剥ぎ取る（図４ｃ）。剥ぎ取られた異物は集塵室３９もしくは廃棄物回収部４１の何れかに捕集される。 Next, a method for cleaning the relay table 14 will be described with reference to FIG. As a result of the recognition of the chip 2 by the second camera 27, when a foreign object 42 other than the chip 2 is confirmed on the relay table 14, the foreign object 42 is promptly prevented from adhering to the chip 2 or being mixed into the apparatus. This must be removed. When the foreign matter 42 is confirmed on the relay table 14, the cleaning head 35 is raised to a height at which the foreign matter 42 and the cleaning brush 36 do not interfere with each other, and then the moving table 22 is moved horizontally, and the relay table 14 with the foreign matter 42 still placed on the relay table 14. The waste collection unit 41 is passed under the cleaning head 35 (FIG. 4a). Next, the cleaning head 35 is lowered to a height at which the cleaning brush 36 contacts the upper surface of the relay table 14, and the moving table 22 is moved in the reverse direction (FIG. 4b). The relatively large foreign matter 42 a on the relay table 14 interferes with the cleaning brush 36 and is swept away by the waste collection unit 41, but the minute foreign matter 42 b passes through the cleaning brush 36. Such foreign matter 42b is sucked up by vacuum suction and collected in the dust collecting chamber 39 (FIG. 4d). Further, foreign substances that adhere to the upper surface of the relay table 14 are moved back and forth in small increments, and are peeled off by the cleaning brush 36 that slides on the upper surface of the relay table 14 (FIG. 4c). The removed foreign matter is collected in either the dust collection chamber 39 or the waste collection unit 41.

クリーニング装置３４は昇降機能を有するだけで水平移動機能を持たないが、移動テーブル２２の移動経路に配置することで、第２の方向において中継テーブル１４および廃棄物回収部４１と相対的に移動し、中継テーブル１４上の異物４２や不良チップを廃棄物回収部４１に掃き落とすことができる。また微小な異物４２ｂについては吸引によって回収することも可能である。これらはクリーニング装置３４と水平移動装置２４の駆動によって行われ、この間ピックアップヘッド１２と実装ヘッド１７はそれぞれ本来の動作を継続して行うことができる。また、不良チップの廃棄と中継テーブル１４のクリーニングという全く異なる作業を同一の機構を用いて行うことができ、それぞれに別の機構を用意する場合に比べコストやスペースの面で有利である。   The cleaning device 34 has only a lifting / lowering function but not a horizontal movement function. However, when the cleaning device 34 is arranged on the movement path of the movement table 22, it moves relative to the relay table 14 and the waste collection unit 41 in the second direction. The foreign matter 42 and defective chips on the relay table 14 can be swept off to the waste collection unit 41. The minute foreign matter 42b can be collected by suction. These operations are performed by driving the cleaning device 34 and the horizontal movement device 24. During this time, the pickup head 12 and the mounting head 17 can continue their original operations. Also, completely different operations such as discarding of defective chips and cleaning of the relay table 14 can be performed using the same mechanism, which is advantageous in terms of cost and space as compared with the case where different mechanisms are prepared for each.

本発明はペースト接着剤を塗布した基板に電子部品を実装する分野で有用である。   The present invention is useful in the field of mounting electronic components on a substrate coated with a paste adhesive.

本発明の実施の形態の電子部品実装装置の斜視図The perspective view of the electronic component mounting apparatus of embodiment of this invention 本発明の実施の形態のクリーニング装置の側面図The side view of the cleaning apparatus of embodiment of this invention 本発明の実施の形態の不良チップの廃棄方法の説明図Explanatory drawing of the disposal method of the defective chip of embodiment of this invention 本発明の実施の形態のクリーニング方法の説明図Explanatory drawing of the cleaning method of embodiment of this invention

符号の説明Explanation of symbols

１ 電子部品実装装置
２ チップ
３ 基板
１２ ピックアップヘッド
１４ 中継テーブル
１７ 実装ヘッド
２０ （第１の）水平移動装置
２４ （第２の）水平移動装置
２７ 第２のカメラ
３４ クリーニング装置
３５ クリーニングヘッド
３６ クリーニングブラシ
３８ 空圧シリンダ
４１ 廃棄物回収部 DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Chip 3 Board | substrate 12 Pickup head 14 Relay table 17 Mounting head 20 (1st) Horizontal movement apparatus 24 (2nd) Horizontal movement apparatus 27 2nd camera 34 Cleaning apparatus 35 Cleaning head 36 Cleaning brush 36 38 Pneumatic cylinder 41 Waste recovery section

Claims (4)

電子部品を吸着して取り出すピックアップヘッドと、
取り出された電子部品を仮置きする中継テーブルと、
仮置きされた電子部品を基板に搭載する実装ヘッドと、
前記ピックアップヘッドと前記実装ヘッドを第１の方向において水平移動させる第１の水平移動装置と、
前記第１の方向と直交する第２の方向において前記中継テーブルの側方に配置された廃棄物回収部と、
前記中継テーブルと前記廃棄物回収部を前記第２の方向において水平移動させる第２の水平移動装置と、
前記中継テーブルと前記廃棄物回収部の移動経路に配置されたクリーニングヘッドと、
前記クリーニングヘッドの下部に装着された清掃具と、
を備え、
前記クリーニングヘッドの下方で前記中継テーブルを水平移動させ、前記中継テーブル上の異物または不良部品を前記清掃具で前記廃棄物回収部に掃き落とすことを特徴とする電子部品実装装置。 A pickup head that picks up and picks up electronic components;
A relay table for temporarily placing the electronic components taken out;
A mounting head for mounting the temporarily placed electronic components on the substrate;
A first horizontal movement device that horizontally moves the pickup head and the mounting head in a first direction;
A waste collection unit disposed on a side of the relay table in a second direction orthogonal to the first direction;
A second horizontal movement device that horizontally moves the relay table and the waste collection unit in the second direction;
A cleaning head disposed in a moving path of the relay table and the waste recovery unit;
A cleaning tool attached to a lower portion of the cleaning head;
With
An electronic component mounting apparatus, wherein the relay table is moved horizontally below the cleaning head, and foreign matters or defective parts on the relay table are swept off to the waste collection unit by the cleaning tool. 前記クリーニングヘッドを鉛直方向において移動させる鉛直移動機構をさらに備え、クリーニング時に前記クリーニングヘッドを下降させ、前記清掃具を前記中継テーブル上に接触させることを特徴とする請求項１に記載の電子部品実装装置。   2. The electronic component mounting according to claim 1, further comprising a vertical movement mechanism that moves the cleaning head in a vertical direction, wherein the cleaning head is lowered during cleaning to bring the cleaning tool into contact with the relay table. apparatus. 前記クリーニングヘッド側から前記中継テーブル上の異物を吸引して回収することを特徴とする請求項１または２に記載の電子部品実装装置。   The electronic component mounting apparatus according to claim 1, wherein the foreign matter on the relay table is sucked and collected from the cleaning head side. 前記中継テーブル上の電子部品を認識するカメラをさらに備え、前記カメラの認識結果から前記中継テーブル上の電子部品が不良部品であることが認識された場合、もしくは前記中継テーブル上に異物が確認された場合に前記中継テーブル上のクリーニングを行うことを特徴とする請求項１乃至３の何れかに記載の電子部品実装装置。   The camera further comprises a camera for recognizing the electronic component on the relay table, and when a recognition result of the camera recognizes that the electronic component on the relay table is a defective component, or a foreign object is confirmed on the relay table. 4. The electronic component mounting apparatus according to claim 1, wherein the relay table is cleaned in the event of a failure.
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WO2016125245A1 (en) * 2015-02-03 2016-08-11 富士機械製造株式会社 Supplied component transfer device
WO2019180953A1 (en) * 2018-03-23 2019-09-26 株式会社Ｆｕｊｉ Component-mounting device
WO2019180954A1 (en) * 2018-03-23 2019-09-26 株式会社Ｆｕｊｉ Component-mounting device

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Publication number Priority date Publication date Assignee Title
WO2016125245A1 (en) * 2015-02-03 2016-08-11 富士機械製造株式会社 Supplied component transfer device
JPWO2016125245A1 (en) * 2015-02-03 2017-11-09 富士機械製造株式会社 Supply parts transfer device
WO2019180953A1 (en) * 2018-03-23 2019-09-26 株式会社Ｆｕｊｉ Component-mounting device
WO2019180954A1 (en) * 2018-03-23 2019-09-26 株式会社Ｆｕｊｉ Component-mounting device
CN111869342A (en) * 2018-03-23 2020-10-30 株式会社富士 Component mounting apparatus
JPWO2019180953A1 (en) * 2018-03-23 2021-01-14 株式会社Ｆｕｊｉ Parts mounting device
JPWO2019180954A1 (en) * 2018-03-23 2021-03-11 株式会社Ｆｕｊｉ Parts mounting device

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