TWI640371B - Bonding apparatus and bonding method - Google Patents

Abstract

Provided is a bonding apparatus including a support having at least a portion of a surface on which a substrate is fixed, a bonding tool for attaching components to the substrate, and a cleaning method for cleaning the surface of the support mounted on the support Components.

Description

Joining device and joining method

The invention relates to a joining device and a joining method.

The manufacturing process of display elements, semiconductors, and solar cells mainly includes a bonding process. For example, most components including liquid crystal displays, field emission displays, plasma displays, or electroluminescent displays, for example, driver ICs or flexible printed circuit substrates are fixed on the substrate through a bonding process.

In general, the bonding process is performed by placing the component on one surface of the substrate fixed on the support, and then using a bonding tool to attach the component to the substrate. In particular, the bonding head of the bonding tool is lowered from the top of the component and presses the component against the substrate. At this time, if the dust-collecting substance exists on the support, excessive pressure is applied to a part of the substrate relative to the part where the dust-collecting substance exists, and this may cause deterioration, such as damage to the substrate, component Damaged or incompletely fixed components.

Before performing the continuous process, the degraded components must be discarded, which results in a waste of time and cost. If the continuous process is executed without finding inferior products, the degraded products may be sent out.

Therefore, it may be necessary to clean one surface of the support on which the substrate is mounted. That is, before performing the joining process, it may be necessary to confirm whether the dust-collecting substance is present on one surface of the bracket, and clean a surface of the support if the dust-collecting substance is present thereon.

According to one method of cleaning one surface of the support, the operation of the joining device can be stopped after performing a predetermined number of joining processes, and one surface of the support can be manually cleaned by the worker. However, in this example, the work may be lost due to the interruption of work, and workers may be required to perform cleaning work.

Therefore, the problem solved by the present invention is to provide a bonding device that can prevent the occurrence of deterioration such as damage to the substrate, damage to the component, or incomplete component fixing. Due to the automatic cleaning, one of the supports for mounting at least a part of the substrate The dust collecting material on the surface can be immediately connected to the joining process.

Another problem solved by the present invention is to provide a bonding method that can prevent the occurrence of deterioration such as damage to the substrate, damage to the component, or incomplete component fixation, due to the automatic cleaning of one surface of the support mounting at least a part of the substrate The dust collection material can be immediately connected to the joining process.

Additional advantages, themes, and features of the present invention will be described in some of the following descriptions, and some of those who have ordinary knowledge in the art may change from reviewing the following descriptions or knowing from the implementation of the invention Obvious.

In one aspect of the present invention, there is provided a bonding apparatus including a support having at least a portion of a fixed substrate on a surface thereon, a bonding tool for attaching components to the substrate, and a mounting on the support A cleaning assembly for cleaning the surface of the support.

In another aspect of the present invention, there is provided a bonding apparatus including a support having at least a portion of a substrate on a surface thereon, and a bonding tool for attaching components to the substrate, wherein the one The surface contains a plurality of holes, and the support sucks air and dust-collecting substances on the one surface through the holes.

In another aspect of the present invention, a bonding method is provided, which includes fixing at least a portion of a substrate on a surface of a support, using a bonding tool to attach components to the substrate, and making the substrate and the support One surface is separated and use the cleaning unit to clean one surface of the support.

According to an embodiment of the present invention, at least one of the following effects can be achieved.

That is, since a continuous connection process immediately cleans one surface of the support on which at least a part of the substrate is mounted, work loss due to interruption of the continuous bonding process can be prevented.

Furthermore, the automatic cleaning of a surface of the support allows an automated process to be achieved.

Furthermore, since the floating dust-collecting material on one surface of the support is removed, it can not only prevent the dust-collecting material from attaching to the upper part of one surface of the support, but also prevent the dust-collecting material from attaching to the contact with the support The lower part of the substrate and the upper part of the element in contact with the bonding head.

Furthermore, it is possible to prevent deterioration such as damage to the substrate, damage to the element, or incomplete fixing of the element due to the dust-collecting substance on one surface of the support.

Furthermore, because deterioration such as substrate damage, component damage, or incomplete component fixing can be prevented before the next bonding process is performed, waste of time and cost and delivery of degraded products can be prevented.

The effect according to the present invention is not limited to the content of the above embodiment, and more effects are described in the description of the present invention.

100, 101‧‧‧ support

101a‧‧‧Support main body

101b‧‧‧Suction port

200, 201, 202, 203‧‧‧ cleaning components

210‧‧‧Conveying track

220、221‧‧‧Conveyor plate

230, 231, 232‧‧‧ cleaning unit

230a, 231a, 232a ‧‧‧ first cleaning unit

230b, 231b, 232b ‧‧‧ second cleaning unit

240‧‧‧dust collector

241‧‧‧Dust collector body

242‧‧‧ Dust collector

300、301‧‧‧sensor

301a‧‧‧Lighting part

301b‧‧‧Light receiving part

400‧‧‧bonding tool

410‧‧‧ joint head

420‧‧‧joint arm

500‧‧‧Transport robot arm

510‧‧‧Adsorption plate

520‧‧‧Robot

600‧‧‧Substrate assembly

610‧‧‧ substrate

620‧‧‧component

The above and other objects, features, or advantages of the disclosed technology will become more apparent through the following detailed description in conjunction with the accompanying drawings, where: FIG. 1 is a perspective view of a joining device according to an embodiment of the present invention; Figure 2 is a plan view of the support and cleaning assembly of the joint device according to an embodiment of the present invention; Figure 3 is a side view of the support and cleaning assembly of the joint device according to an embodiment of the present invention; Figure 4 Is a front view of the support and cleaning assembly of the bonding device according to an embodiment of the present invention; FIG. 5 is a side view depicting attachment of the component to the substrate by the bonding device according to an embodiment of the present invention; 6 is a front view of the support device and the cleaning assembly of the joint device according to another embodiment of the present invention; FIG. 7 is a front view of the support device and the cleaning assembly of the joint device according to yet another embodiment of the present invention; Figure 8 is a front view of a support, cleaning assembly, and sensor of a bonding device according to yet another embodiment of the present invention; and Figure 9 is a support of a bonding device according to yet another embodiment of the present invention Perspective view of the seat and cleaning assembly.

The aspects and features of the present invention and methods for achieving them will become apparent by referring to the embodiments described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms. The contents defined in the description, such as detailed architecture or components, are provided only to assist those with ordinary knowledge in the technical field to fully understand the specific details of the present invention, and the present invention is only defined in the scope of the additional patent application. Inside.

The term "on" used to indicate that a component is on another component or on a different layer or layer includes examples where a component is directly on another component or one layer and a component is located through another layer or another component Examples of other components. In the overall description of the present invention, the same drawing reference symbols are used for the same components in all the various drawings.

Although the terms "first", "second", etc. are used to describe different constituent components, these constituent components are not limited by these terms. These words are only used to distinguish a component from other components. Therefore, in the following description, the first constituent member may be the second constituent member.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

Fig. 1 is a perspective view of a joining device according to an embodiment of the present invention. FIG. 2 is a plan view of the support 100 and the cleaning assembly 200 of the joining device according to an embodiment of the present invention, and FIG. 3 is a side view of the support 100 and the cleaning assembly 200 of the joining device according to an embodiment of the present invention And, FIG. 4 is a front view of the support 100 and the cleaning assembly 200 of the joining device according to an embodiment of the present invention. Referring to FIGS. 1 to 4, the bonding device includes a holder 100, a bonding tool 400, and a cleaning assembly 200. Furthermore, the bonding device may further include a sensor 300 and a controller (not shown).

The bonding device may be a device for fixing the auxiliary member on the substrate, which is mainly used in the process of manufacturing display elements, semiconductors, and solar cells. In this description, for example, the bonding device is used to fix the element 620 to the substrate 610, an example of the process of manufacturing a liquid crystal display, a field effect display, a plasma display, or an electroluminescent display, but not The above example is limited.

The substrate 610 may be a simple substrate formed without a structure or a substrate formed to have a structure. The structure formed on the substrate 610 may be a complete structure or an incomplete structure at an intermediate level. Furthermore, the substrate 610 may independently constitute one display panel, or may be a mother substrate divided into a plurality of display panels. Furthermore, the substrate 610 may be a single substrate, or may include a plurality of laminated substrates. If the substrate 610 includes a plurality of laminated substrates, the plurality of substrates may completely overlap each other, or at least one substrate may partially protrude from other substrates. Here, the element 620 may be fixed on the part protruding.

The element 620 may be driver ICs or flexible printed circuit substrates on which at least one chip is fixed, and may be located on the substrate 610. According to the first drawing depicted in the exemplary embodiment, the element 620 may be located on one end of the substrate 610. In particular, at least a part of the element 620 may overlap with the substrate 610, and at least a part of the overlap with the substrate 610 may be attached to the substrate 610.

The element 620 can be delivered to the joining device in a pre-pressed state. Here, the preloading may mean that the element 620 placed on the substrate 610 is used to fix the substrate 610 by applying a weak pressure in the direction from the upper part of the element 620 to the substrate 610. In other words, before conveying the substrate 610 having the surface 620 on which the device 620 is disposed, a fixing process with constant force may be preferentially performed so that the device 620 will not separate from the substrate 610. Here, an anisotropic conductive film (lead-free anisotropic conductive film) for electrically and physically connecting the element 620 to the substrate 610 in manufacturing the display element may be interposed between the element 620 and the substrate 610.

If the substrate 610 and the element 620 on the substrate 610 are defined as the substrate assembly 600 as a whole, the substrate assembly 600 can be transported to the bonding apparatus by the transport robot 500. The transport robot 500 may include an adsorption plate 510 and a robot 520. The adsorption plate 510 may have a porous surface for adsorbing and fixing at least a part of the substrate 610. In the first drawing depicted in the exemplary embodiment, a part of the substrate 610 adsorbed by the adsorption plate 510 may be a part of the substrate 610 that does not overlap the element 620. The remaining portion of the substrate 610 that is not adsorbed by the adsorption plate 510 may overlap the element 620, and this portion may be contacted and installed on the support 100. FIG. 1 depicts that an adsorption plate 510 adsorbs and fixes a substrate 610, but it is not limited thereto. One adsorption plate 510 can adsorb and fix a plurality of substrates 610, or a plurality of adsorption plates 510 can adsorb and fix a substrate 610. The robot arm 520 is connected to one side surface of the suction plate 510 for moving the suction plate 510 to the joining device.

The support 100 can support the substrate 610 during the bonding process. The support 100 may have a rectangular parallelepiped shape, and may be made of quartz or stainless steel (SUS). The support 100 may include a surface on which at least a portion of the mounting substrate 610 is mounted. Here, at least a part of the substrate 610 may be represented as a part of the substrate 610 overlapping with the element 620. One surface of the support 100 may contact at least a part of the substrate 610 to stabilize the support Support substrate 610. In an exemplary embodiment, one surface of the support 100 that is in contact with at least a portion of the substrate 610 may be coated with fluorine or may be treated with fluoride ions to prevent scratches and damage that may occur on one surface of the support 100 Occurrence of dust absorption.

The bonding tool 400 may be located on an upper portion of one surface of the support 100 on which at least a part of the substrate 610 is mounted. The bonding tool 400 may include a bonding head 410 and a bonding arm 420. The bonding head 410 may mainly press the component 620 on the substrate 610. In particular, the bonding head 410 can be vertically lowered from an upper portion of one surface of the support 100 to contact the element 620, and the element 620 can be attached to the substrate 610 by thermally pressing the element 620 in the direction of the substrate 610. If the anisotropic conductive film is interposed between the element 620 and the substrate 610, the element 620 is hot-pressed by the bonding head 410, so that charge can flow between the element 620 and the substrate 610 through the anisotropic conductive film. If the charge flows between the element 620 and the substrate 610, it can be regarded that the element 620 is fixed on the substrate 610. The joint arm 420 is connected to the joint head 410 to move the joint head 410.

The cleaning assembly 200 can be installed on the support 100. The cleaning assembly 200 may be formed integrally with the stand 100. The cleaning assembly 200 can clean a surface of the support 100 on which at least a part of the substrate 610 is mounted. The cleaning assembly 200 may include a conveying rail 210, a conveying plate 220, a cleaning unit 230, and a dust collector 240.

The transport rail 210 that can be formed on one side surface of the support 100 is in contact with one surface of the support 100 on which at least a part of the substrate 610 is mounted. The transport rail 210 connected to a part of the transport board 220 is used to move the transport board 220. The transport rail 210 of the mobile transport board 220 may include a driving part, such as a linear motor. In FIGS. 1 and 2 depicted in the exemplary embodiment, the transport rail 210 may move the transport plate 220 in the first direction or in a direction opposite to the first direction. Here, the first direction may be the x direction, and the direction opposite to the first direction may be the -x direction. That is, the conveying rail 210 can cause the conveying plate 220 to perform linear reciprocating motion.

The conveying plate 220 may be connected to the conveying rail 210 and may move in a first direction or a direction opposite to the first direction. At least a part of the conveying plate 220 can be installed parallel to one of the supports 100 At least a part of the substrate 610 is separated from a surface of the support 100. In FIGS. 1 and 2 depicted in the exemplary embodiment, the conveying plate 220 can move in the x-direction or -x-direction, and scans one surface of the entire support 100.

The cleaning unit 230 may be disposed on a surface of the conveying plate 220 facing at least a part of the surface of the support 100 on which the substrate 610 is mounted. The cleaning unit 230 may substantially perform cleaning on one surface of the support 100. Since the cleaning unit 230 is fixed to a surface of the conveying plate 220, the cleaning unit 230 and the conveying plate 220 can move in a first direction or a direction opposite to the first direction and can clean a surface of the support 100, but not The above form is limited. The cleaning unit 230 may also be separated from a surface of the support 100 by a predetermined distance to clean a surface of the support 100.

A plurality of cleaning units 230 can be provided. The cleaning unit 230 may include a first cleaning unit 230a and a second cleaning unit 230b. The first cleaning unit 230a and the second cleaning unit 230b may be disposed adjacent to each other, and may be disposed side by side and parallel to one surface of the support 100 on which at least a portion of the substrate 610 is mounted. The first cleaning unit 230a and the second cleaning unit 230b may be cleaning units 230 performing the same function, but not limited to the above-mentioned forms. The first cleaning unit 230a and the second cleaning unit 230b may be cleaning units 230 performing different functions. In FIGS. 1 and 4 depicted in the exemplary embodiment, the first cleaning unit 230a may be a roller contacting one surface of the support 100 for removing dust collected on one surface of the support 100 The second cleaning unit 230b may be a vacuum inhaler that sucks the removed dust-collecting substance for keeping the dust-collecting substance on one surface of the support 100 from floating. Here, the roller rotates counterclockwise so that the dust collection material from one surface of the support 100 is naturally sucked into the vacuum inhaler and removed.

The dust collector 240 may be located on the side of the support 100. The dust collector 240 may be in the shape of a rectangular parallelepiped similar to the shape of the support 100. The dust collector 240 may include a dust collector body 241 and a dust collection port 242. The dust collector main body 241 may store the dust collection material collected through the dust collection port 242. The dust collector body 241 may include a gate that discharges the dust collection material of the dust collector body 241 when the dust collector body 241 stores a predetermined amount of dust collection material (Not shown). The dust collector body 241 may further include a dust collection quality display part (not shown) that displays the quality of the stored dust collection. Furthermore, the dust collector body 241 can be connected to the above-mentioned vacuum inhaler via a connecting pipe, and the dust collection material sucked in by the vacuum inhaler can be collected in the dust collector body 241. Here, the connecting pipe that connects the dust collector body 241 and the vacuum inhaler to each other may be located in the conveying rail 210 described above. The dust collection port 242 may be formed on a surface of the dust collector 240 as a path, wherein the dust collection material on the dust collector 250 is sucked into the dust collection port 242. In the first drawing depicted in the exemplary embodiment, the dust collecting port 242 may be formed on the same plane as the one surface of the support 100 on which at least a part of the substrate 610 is mounted, but not in the above-mentioned position Limited. The dust collecting port 242 may be formed on a different plane from one surface of the support 100.

The dust collector 240 may be located at at least one end of the moving path of the conveying plate 220 and the cleaning unit 230. In particular, the dust collector 240 may be located on one side of the support 100 in the first direction, and may be located on the other side of the support 100 in a direction opposite to the first direction. A plurality of supports 100 may be provided, and the two dust collectors may be located on one side and the other side of the support 100 located in the first direction and opposite to the first direction. Here, the dust collecting port 242 may be formed adjacent to the one surface of the support 100 on which at least a part of the substrate 610 is mounted.

Before at least a portion of the substrate 610 is mounted on a surface of the support 100, the cleaning assembly 200 may perform cleaning. In an exemplary embodiment, before the bonding process is performed, the cleaning of the cleaning assembly 200 may be performed according to all the substrates 610 input to the bonding device. In another exemplary embodiment, the cleaning assembly 200 may periodically perform cleaning during a predetermined number of bonding processes. Here, when the cleaning assembly 200 cleans one surface of the support 100 once and there is no dust-collecting substance on the one surface of the support 100, the predetermined number of times may be the number of times the bonding process corresponds to the time.

The sensor 300 can be fixedly installed on the upper part of the support 100. The sensor 300 may be integrally formed with the stand 100 or the cleaning assembly 200. The sensor 300 may be formed to be separated from one surface of the support 100 on which at least a part of the substrate 610 is mounted, but is not limited to the above example. The sensor 300 may also be in contact with a surface of the support 100. The sensor 300 may include a surface on which the support 100 can be confirmed Optical sensor in dust collection material. In the first drawing depicted in the exemplary embodiment, the sensor 300 may be a camera, and the presence/absence of the dust-collecting substance may be confirmed by the image taken by the camera. However, the sensor 300 is not limited to the above-mentioned form, and the sensor 300 may include a pressure sensor or an ultrasonic sensor.

The controller may be connected to the sensor 300, the bonding tool 400, and the transport robot 500 to control the operation of the sensor 300, the bonding tool 400, and the transport robot 500. In the exemplary embodiment, if the sensor 300 confirms that there is a dust-collecting substance on one surface of the support 100 on which at least a part of the substrate 610 is mounted, the controller can interrupt the subsequent bonding process to be fixed The transport robot 500 and the bonding tool 400 are separated from each other on one surface of the support 100, and the cleaning assembly 200 is operated to clean one surface of the support 100. In another exemplary embodiment, if the sensor 300 confirms that there is a dust collecting substance on one surface of the support 100, the controller does not interrupt the continuous bonding process, but at least a part of the mounting substrate 610 reaches the support 100 On one surface, the cleaning assembly 200 is operated to clean one surface of the support 100. In this example, since the continuous joining process is not interrupted, the wasted time and cost can be reduced.

Hereinafter, attaching the element 620 to the substrate 610 by the bonding apparatus according to the above-described embodiment of the present invention will be described with reference to FIG. 5. FIG. 5 depicts a side view of the attachment of the actuator 610 to the substrate 620 by the bonding apparatus according to an embodiment of the present invention.

Referring to FIG. 5, the transport robot 500 may transport the substrate 610 having the surface on which the element 620 is fixed and mount a part of the substrate 610 on one surface of the support 100. Here, a part of the substrate 610 may be a part of the substrate 610 overlapping with the device 620. At this time, since the cleaning assembly 200 cleans one surface of the support 100, there may be no dust-collecting substance, so a part of the substrate 610 may stably contact the support 100. Then, after the bonding tool 400 is vertically lowered to contact the element 620, a predetermined temperature and pressure are applied on the element 620 to attach the element 620 to the substrate 610. If the element 620 is attached to the substrate 610 and current flows between the element 620 and the substrate 610, it can be regarded that the element 620 has been fixed on the substrate 610. As described above, when the bonding tool 400 is vertically lowered and in contact with the element 620 At this time, the conveying plate 220 and the cleaning unit 230 at at least one end of the support 100 do not hinder the process of mounting the component 620 on the substrate 610.

As described above, according to the bonding apparatus according to the embodiment of the present invention, at least a part of the surface of the support 100 on which at least a part of the substrate 610 is mounted during the continuous bonding process is cleaned in real time, thus preventing the interruption of bonding due to Loss of work in the process. Furthermore, the cleaning assembly 200 automatically cleans a surface of the support 100 to realize the automation of the process.

Furthermore, since the dust collector 240 is located at both ends of the moving path of the cleaning unit 230 and the dust collector 240 includes at least one vacuum inhaler, the dust collection material removed by one surface of the support 100 can be removed from the support 100 The vacuum inhaler on one surface is collected by the dust collector 240 on both ends of one surface of the support 100. Therefore, it is prevented that the dust-collecting substance removed by one surface of the support 100 remains in a floating state, and not only prevents contamination of the upper portion of one surface of the support 100, but also prevents contamination of the lower portion of the substrate 610 in contact with the support 100, and The upper part of the element 620 contacted by the bonding head 410 and the element adjacent to the bonding device.

Furthermore, it is possible to prevent deterioration caused by dust-collecting substances on one surface of the support 100, such as damage to the substrate 610, damage to the element 620, or incomplete fixation of the element 620. Furthermore, because deterioration such as damage to the substrate 610, damage to the element 620, or incomplete fixation of the element 620 can be prevented before performing the next bonding process, waste of time and cost and delivery of degraded products can be prevented.

FIG. 6 is a front view of the support 100 and the cleaning assembly 201 of the joining device according to another embodiment of the present invention. For the convenience of explanation, the components that are substantially the same as those depicted in FIG. 4 of the drawings use the same reference symbols, and repeated explanations will be omitted.

Referring to FIG. 6, the bonding apparatus according to another embodiment of the present invention may include three cleaning units 231. The three cleaning units 231 may be arranged side by side and parallel to one surface of the support 100. Among the three cleaning units 231, the first cleaning unit 231a can be located in the middle of the three cleaning units 231, and can be positioned At both ends of the three cleaning units 231 are second cleaning units 231b. As described above, the first cleaning unit 231a may be a blower, and the second cleaning unit 231b may be a vacuum inhaler. The blower can blow high-pressure air to one surface of the support 100, and the air blown by the blower can remove the dust collecting material attached to one surface of the support 100 on one surface of the support 100. Vacuum inhalers at both ends of the blower can inhale the removed dust collection material and collect in the dust collector 240. As described above, if a blower is used, one surface of the support 100 can be cleaned in a state where the blower is separated from one surface of the support 100, and therefore the physical influence applied to one surface of the support 100 can be minimized.

FIG. 7 is a front view of the support 100 and the cleaning assembly 202 of the joining device according to yet another embodiment of the present invention. For the convenience of explanation, the components that are substantially the same as those depicted in FIG. 4 of the drawings use the same reference symbols, and repeated explanations will be omitted.

Referring to FIG. 7, according to yet another embodiment of the present invention, a cleaning unit 232 in an engaging device, a second cleaning unit 232b is the vacuum inhaler described above, and a first cleaning unit 232a may include a blade. The blade with the blade-shaped front end portion can smoothly remove the dust-collecting material attached to one surface of the support 100. The front end portion of the blade may be adjacent to one surface of the support 100 to such an extent that the front end portion of the blade almost contacts one surface of the support 100. The blade can be made of a metal material with excellent durability and abrasion resistance, and by scanning one surface of the support 100 at a time, the dust collection material on one surface of the support 100 can be removed. As described above, if a blade is used, it is possible to easily remove the dust-collecting substance attached to one surface of the attachment support 100 with strong adhesion.

FIG. 8 is a front view of the support 100, the cleaning assembly 200, and the sensor 301 of the coupling device according to yet another embodiment of the present invention. For the convenience of explanation, the components that are substantially the same as those depicted in FIG. 4 of the drawings use the same reference symbols, and repeated explanations will be omitted.

Referring to FIG. 8, the sensor 301 of the bonding apparatus according to yet another embodiment of the present invention may include a light emitting portion 301a and a light receiving portion 301b. The light emitting portion 301a can emit light, such as laser light, and the light receiving portion 301b can receive laser light emitted by the light emitting portion 301a. The light emitting portion 301a may be formed on the support One end of the base 100 or above the dust collector 240 in contact with one end of the base 100, and the light receiving portion 301b may be formed on the other end of the base 100 or the other end of the base 100 An upper portion of the dust collector 240 contacting the end faces the light emitting portion 301a. The light emitting portion 301a and the light receiving portion 301b may be formed on a plane extending from one surface of the support 100, and the light emitting portion 301a may emit laser light parallel to one surface of the support 100 and the light receiving portion 301b may The laser light emitted by the light emitting portion 301a is received. Here, the light emitting path emitted by the light emitting portion may be adjacent to a surface of the support 100 to the extent that the light emitting path may extend almost contacting a surface of the support 100.

As described above, if the light emitted by the light-emitting portion 301a is received by the light-receiving portion 301b facing the light-emitting portion 301a, the controller can confirm that there is no dust collecting substance on the light-emitting path of the light emitted by the light-emitting portion 301a . Furthermore, if the characteristics of the light received by the light-receiving portion 301b are changed by the light-receiving portion 301b, or if the light-receiving portion 301b does not receive the light emitted by the light-emitting portion 301a, the controller can confirm that the light-emitting portion Dust-collecting substances are present on the light-emitting path of the light emitted by the portion 301a. As described above, if the sensor 301 including the light-emitting portion 301a and the light-receiving portion 301b facing each other is used, the confirmation of the dust-collecting substance can be performed more accurately.

FIG. 9 is a perspective view of the support 101 and the cleaning assembly 203 of the coupling device according to yet another embodiment of the present invention. For the convenience of explanation, the components that are substantially the same as those depicted in FIG. 1 of the drawings use the same reference symbols, and repeated explanations will be omitted.

Referring to FIG. 9, the support 101 of the joining device according to yet another embodiment of the present invention may include a support body 101a and a suction port 101b. The holder body 101a performs a similar function to the dust collector body 241 described above, and can store the dust-collecting substance sucked in through the suction port 101b in the holder body 101a. The suction port 101b may be formed on a surface of the support 101 on which at least a part of the substrate 610 is mounted, and may include a plurality of holes. The support 101 can suck in air and dust collection material on one surface of the support 101 through the suction port 101b.

Since the suction port 101b performing the function of the dust collecting port 242 of the dust collector 240 is a surface of the support 101, the dust collector 240 and the vacuum inhaler are not required in the joining device according to still another embodiment of the present invention . That is, since the dust collection material found on one surface of the support 101 can be collected in the support 101 through the suction port 101b on one surface of the support 101, that is, there is no need to install a separate dust collector 240 and vacuum Inhaler. Therefore, the size of the conveying plate 221 of the cleaning assembly 203 can be reduced, and the first cleaning unit 230a alone can sufficiently clean one surface of the support 101.

An engaging device according to an embodiment of the present invention will be described below. FIGS. 1 to 5 of the bonding apparatus according to an embodiment of the present invention are regarded as using a bonding method according to an embodiment of the present invention.

The bonding method according to an embodiment of the present invention includes an installation step, an attachment step, and a cleaning step. The mounting step may be a step of mounting at least a part of the substrate 610 on a surface of the support 100. The attaching step may be a step of attaching the element 620 to the substrate 610 using the bonding tool 400. The cleaning step may be a step of separating the substrate 610 from one surface of the support 100 and using the cleaning unit 230 to clean one surface of the support 100. As described above, the bonding process includes an installation step, a connection step, and a cleaning step that can be performed in sequence.

Here, the cleaning may be performed when the cleaning unit 230 moves in a first direction parallel to a surface of the support or a direction opposite to the first direction, the cleaning unit removes the dust-collecting substance on one surface of the support And, the vacuum inhaler or dust collector 240 collects the removed dust collection material. Further, the cleaning may be performed when the sensor 300 confirms that the dust-collecting substance exists on one surface of the support 100.

Although the preferred embodiments of the present invention have been described for illustrative purposes, it can be understood by those of ordinary skill in the art that without departing from the scope and spirit of the additional patent application scope disclosed by the present invention, It makes various modifications, additions and replacements.

Claims (19)

A bonding device, comprising: a support having a surface on which at least a part of a substrate is fixed; a bonding tool to attach a component to the substrate; and a cleaning assembly mounted on the support For cleaning the surface of the support, wherein the cleaning component at least partially contacts the surface of the support during cleaning, and wherein the cleaning component cleans the surface of the support on the substrate It is fixed in front of the support. The joining device as described in item 1 of the patent application scope, wherein the cleaning assembly includes at least one cleaning unit for cleaning the one surface of the support, which moves in a first direction parallel to the one surface of the support or A direction opposite to the first direction. The joining device as described in item 2 of the patent application scope, wherein the at least one cleaning unit includes a first cleaning unit and a second cleaning unit, and the first cleaning unit and the second cleaning unit are arranged side by side and parallel to The one surface of the support. The joint device as described in item 3 of the patent application scope, wherein the first cleaning unit includes at least one of a rotating shaft, a blower, and a blade, and the second cleaning unit includes a vacuum inhaler. The joining device as described in item 2 of the patent application scope, wherein the cleaning assembly further comprises: a conveying plate disposed parallel to the one surface of the support, which is separated from the one surface of the support; and a conveying A rail that moves the conveyor plate in the first direction or in a direction opposite to the first direction, wherein the at least one cleaning unit is disposed on a surface of the conveyor plate, which faces the one of the support surface. The joint device as described in item 2 of the patent application range, wherein the cleaning assembly further comprises at least one dust collector on a side surface of the support. The joining device as described in item 6 of the patent application scope, wherein a plurality of the dust collectors are provided and are located on the side surface of the support, the side surface is located in the first direction and opposite to the first direction Of that direction. The bonding apparatus as described in item 1 of the patent application range, wherein the bonding tool fixes the component on the substrate by hot pressing of the component on the substrate. The joining device as described in item 1 of the scope of the patent application further includes a sensor for confirming whether a dust collecting substance is present on the one surface of the support. The bonding device as described in item 9 of the patent application scope, wherein the sensor includes a light emitting part and a light receiving part, wherein the light emitting part emits light parallel to the one surface of the support, and The light receiving part receives the emitted light. The joining device as described in item 9 of the patent application scope further includes a controller that operates the cleaning assembly when the sensor confirms that the dust-collecting substance is present on the one surface of the support. A bonding device comprising: a support having a surface on which at least a part of a substrate is fixed; and a bonding tool for attaching a component to the substrate, and a cleaning assembly mounted on the support To clean the one surface of the support, wherein the one surface includes a plurality of holes, and the support sucks air and dust collection substances on the one surface through the plurality of holes, wherein the cleaning component is cleaned At least partially contacting the one surface of the support, and wherein the cleaning component cleans the one surface of the support before the substrate is fixed to the support. The joining device as described in item 12 of the patent application range, wherein the cleaning assembly includes at least one cleaning unit that cleans the one surface of the support, which moves in a first direction parallel to the one surface of the support or A direction opposite to the first direction. The joint device as described in item 13 of the patent application range, wherein the cleaning unit includes at least one of a rotating shaft, a blower, and a blade. The joining device as described in item 13 of the patent application scope, wherein the cleaning unit further comprises: a conveying plate disposed parallel to the one surface of the support to be spaced from the one surface of the support; and a conveying track, The conveying plate is moved in the first direction or the direction opposite to the first direction, wherein the cleaning unit is disposed on a surface of the conveying plate facing the surface of the support. The joint device as described in item 12 of the patent application scope further includes a sensor for confirming whether the dust-collecting substance exists on the one surface of the support. A bonding method includes: fixing at least a part of a substrate on one surface of a support; using a bonding tool to attach a component to the substrate; and cleaning the one surface of the support using a cleaning unit , Wherein the cleaning unit at least partially contacts the surface of the support during cleaning; and wherein the cleaning unit is used to clean the surface of the support to fix at least a portion of the substrate to the support It should be executed before a surface. The joining method as described in item 17 of the patent application scope, wherein the cleaning is performed when the cleaning unit moves in a first direction parallel to the one surface of the support or in a direction opposite to the first direction The unit performs the method of removing the dust collection material on the one surface of the support, and a vacuum inhaler or a dust collector collects the removed dust collection material. The joining method as described in item 17 of the patent application scope, wherein cleaning is performed when a sensor confirms that a dust-collecting substance is present on the one surface of the support.