JP2020057750A - Component mounting system, component supply device and component mounting method - Google Patents

Abstract

To provide a component mounting system, a component supply device and a component mounting method, preventing foreign substances from adhering to the joint surface of components and preventing the joint surface of components from being damaged.SOLUTION: A chip mounting system 1 includes: a chip supply section 11 supplying a chip CP; a head 33H provided with a chip support 432a at a chip thereof; a first chip carrying section 51 carrying the chip CP to a transfer position Pos1 while a first chip holding section 512 holds the chip CP; and a support drive section 432b transferring the chip CP from the first chip holding section 512 to the head 33H by moving the chip support 432a to a vertically upper side than the first chip holding section 512 while the first chip holding section 512 holding the chip CP is located at the transfer position Pos1 and the central part of the chip CP is supported by the chip support 432a.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a component mounting system, a component supply device, and a component mounting method.

  A method has been proposed which includes a stage for holding a substrate, and a bonding portion disposed above the stage, and lowers the bonding portion while holding the chip on the head of the bonding portion to bond the chip to the substrate. (See, for example, Patent Document 1). In addition, a method has been proposed in which a plasma treatment is performed on a bonding surface of two workpieces, and then the bonding surfaces of the two workpieces are brought into contact with each other to perform bonding (for example, see Patent Document 2). After a plasma treatment is performed on a bonding surface of a chip to be bonded to a substrate, a method of bonding the chip to the substrate by bringing the bonding surface of the chip into contact with the substrate is being provided.

JP 2012-238775 A JP-T-2003-523627

  In the above-described method, when a foreign substance is attached to the bonding surface of the chip when the chip is bonded to the substrate or the surface of the chip is damaged, defective bonding between the chip and the substrate occurs. Therefore, when the chip having the bonding surface subjected to the plasma treatment is transferred to the head of the bonding portion, adhesion of foreign matter to the bonding surface of the chip and damage to the bonding surface of the chip due to, for example, contact of the transfer jig are suppressed. In addition, there is a demand for particle cleaning of the chip bonding surface. In addition, since the activated bonding surface of the chip cannot be touched, a method of transporting the chip without touching the bonding surface is required.

  The present invention has been made in view of the above circumstances, and provides a component mounting system, a component supply device, and a component mounting method in which adhesion of foreign matter to a bonding surface of a component and damage to the bonding surface of the component are suppressed. With the goal.

In order to achieve the above object, a component mounting system according to the present invention includes:
A component mounting system for mounting components on a board,
A component supply unit that supplies the component,
A head that holds a side opposite to a bonding surface side of the component that is bonded to the mounting surface of the board at the tip end;
A first component holding unit configured to hold the joining surface side of the component supplied from the component supply unit in a non-contact manner, wherein the first component holding unit holds the component in a state where the first component holding unit holds the component; A first component transport unit that transports the product to a transfer position;
A substrate holding unit that holds the substrate,
In a state where the component transferred from the first component transport unit is held at the tip of the head, the head is relatively moved in a first direction from the head toward the substrate holding unit, and the substrate is moved. And a head drive unit for mounting the component on the mounting surface by contacting the bonding surface of the component with the mounting surface.

The component mounting method according to the present invention viewed from another point of view,
A component mounting method for mounting components on a board,
Providing the part;
In a state where the component is held by a first component holding unit that non-contactly holds a joining surface side of the supplied component that is joined to a mounting surface of the substrate, the first component holding unit is attached to the head by the first component holding unit. Transporting to a transfer position for transferring
In a state in which the component transferred to the head is held at the tip of the head, the head is relatively moved in a first direction from the head to a substrate holding unit that holds the substrate, and the substrate is moved. Mounting the component on the mounting surface by bringing a bonding surface of the component into contact with the mounting surface.

  ADVANTAGE OF THE INVENTION According to the component mounting system and the component mounting method which concern on this invention, the transfer which transfers a component to a head in the state which hold | maintained the component by the 1st component holding part which hold | maintains the joining surface side of the supplied component in non-contact. Parts are transported to the position. As a result, the component can be transported without touching the joint surface of the surface-activated component, and adhesion of foreign matter to the joint surface of the component and damage to the joint surface of the component due to touching the joint surface of the component are suppressed. Therefore, occurrence of defective bonding between the component and the substrate is suppressed.

1 is a schematic configuration diagram of a chip mounting system according to a first embodiment of the present invention. FIG. 4 is a schematic plan view of a first chip holding unit of the chip transport unit according to the first embodiment. 2A is a schematic front view of the head according to the first embodiment, and FIG. 2B is a schematic plan view of the head according to the first embodiment. FIG. 7A is a diagram illustrating a state in which a chip is supplied from a chip supply unit in the chip mounting system according to the first embodiment, and FIG. FIG. 7 is a diagram illustrating a state in which a chip is received from a unit. FIG. 4A is a diagram illustrating a state where a chip transport unit transports a chip to a transfer position in the chip mounting system according to the first embodiment, and FIG. 4B is a diagram illustrating a state where the chip is transported from the chip transport unit to the head according to the first embodiment; It is a figure which shows a mode that is transferred. 6A is a diagram illustrating a state where chips are transferred from a chip transport unit to a head according to the first embodiment, and FIG. 6B is a diagram illustrating a state where the chips are held by the head according to the first embodiment; It is. FIG. 5 is a diagram showing a state of a chip mounting process in the bonding apparatus according to the first embodiment. FIG. 7 is a schematic configuration diagram of a chip mounting system according to a second embodiment of the present invention. FIG. 10 is a schematic diagram of a reversing unit according to the second embodiment. (A) is a diagram showing a state in which the second chip transport unit receives a chip in the chip supply unit according to the second embodiment, (B) is a diagram in which the second chip transport unit in the chip supply unit according to the second embodiment is It is a figure showing signs that a chip is conveyed. FIG. 7A is a diagram showing a state where a chip is inverted by an inverting unit in the chip mounting system according to the second embodiment, and FIG. It is a figure showing signs that a chip is transferred to a conveyance part. (A) is a diagram showing a state in which the first chip transport unit holds a chip in the chip mounting system according to the second embodiment, (B) is a first chip transport unit in the chip mounting system according to the second embodiment FIG. 3 is a diagram showing a state in which the chip is transported to a transfer position. FIG. 7 is a schematic configuration diagram of a chip mounting system according to a third embodiment of the present invention. FIG. 13 is a schematic diagram of a second chip transport unit according to the third embodiment. (A) is a diagram showing a state in which the second chip transport unit receives a chip in the chip supply unit according to the third embodiment, (B) is a diagram in which the second chip transport unit in the chip supply unit according to the third embodiment is It is a figure showing signs that a chip is conveyed. (A) is a diagram showing a state where chips are transferred from a chip supply unit to a first chip transport unit in the chip mounting system according to the third embodiment, and (B) is a chip mounting system according to the third embodiment. FIG. 6 is a diagram showing a state where chips are transferred to a second chip transport unit in FIG. FIG. 14 is a diagram illustrating a state in which a first chip transport unit transports a chip in the chip mounting system according to the third embodiment; It is a schematic structure figure of a chip mounting system concerning a modification. FIG. 11 is a schematic view of a head according to a modification. (A) is a schematic front view showing a part of a chip supply unit according to a modification, (B) is a diagram showing a state in which the chip is held on the adhesive sheet in the chip supply unit according to the modification, ( (C) is a diagram showing a state in which a chip is detached from an adhesive sheet in a chip supply section according to a modification. (A) is a schematic front view showing a part of a chip supply unit according to a modification, and (B) is a diagram showing a state where chips are detached from the adhesive sheet in the chip supply unit according to the modification. (A) is a schematic front view showing a part of the head of the bonding apparatus according to the modification, and (B) is a view for explaining the operation of the head of the bonding apparatus according to the modification. (A) is a perspective view of a sheet according to a modification, and (B) is a diagram for explaining the operation of the chip mounting system when using the sheet according to the modification. (A) is a schematic sectional view showing a part of a tray according to a modification, and (B) is a diagram showing a state where chips are detached from the tray according to the modification. (A) is a schematic sectional view showing a part of a tray according to a modification, and (B) is a diagram showing a state where chips are detached from the tray according to the modification. It is a schematic plan view of the chip mounting system concerning a modification. It is a sectional view of a part of the 1st tip conveyance part concerning a modification. It is a schematic side view of a chip mounting system concerning a modification. It is a figure which shows a mode that a chip is supplied from a chip supply part in the chip mounting system which concerns on a modification, (A) is a schematic plan view, (B) is a schematic side view. (A) is a schematic plan view showing a state in which a chip holding unit is moved vertically above a cleaning unit in a chip mounting system according to a modification, and (B) is a chip stage cleaning in the chip mounting system according to the modification. FIG. 4 is a schematic plan view showing a state where the head is moved vertically downward. It is a figure which shows a mode that a chip is delivered from a chip conveyance part to a head in the chip mounting system which concerns on a modification, (A) is a schematic plan view, (B) is a schematic side view. FIG. 13 is a schematic plan view showing a state where chips are delivered from a chip transport unit to a chip collection unit in a chip mounting system according to a modification. It is a schematic structure figure of a part of chip supply part concerning a modification. (A) is a schematic perspective view of a part of a chip supply unit according to a modification, (B) is a schematic perspective view of a part of a chip supply unit according to another modification, and (C) is (B). 3 is a schematic plan view of a part of a chip supply unit shown in FIG. FIG. 6A is a schematic cross-sectional view illustrating a part of a chip supply unit according to a modified example, in which FIG. 7A illustrates a state in which the tip end of a chip support plate of a pickup mechanism is pressed against a sheet to which chips are attached. It is a schematic sectional drawing which shows a mode that the sheet | seat to which the chip | tip was stuck is rubbed with the front-end | tip part of the chip support plate of a pickup mechanism. FIG. 7A is a schematic cross-sectional view illustrating a part of a chip supply unit according to a modified example, in which FIG. 7A is a schematic cross-sectional view illustrating a state in which a pickup mechanism sucks a sheet to which a chip is attached, and FIG. FIG. 3 is a schematic cross-sectional view showing a state in which a document is transferred. FIG. 7A is a schematic cross-sectional view illustrating a part of a chip supply unit according to a modified example, in which FIG. 7A illustrates a state in which a tip end of a chip support pin of a pickup mechanism is pressed against a sheet to which a chip is attached; It is a schematic sectional drawing which shows the mode that the pickup mechanism pressed the front-end | tip part of the peeling pin against the sheet | seat to which the chip | tip was stuck. FIG. 7A is a schematic cross-sectional view illustrating a part of a chip supply unit according to a modified example, in which FIG. 7A is a schematic cross-sectional view illustrating a state in which a pickup mechanism sucks a sheet to which a chip is attached, and FIG. FIG. 3 is a schematic cross-sectional view showing a state in which a document is transferred. (A) is a schematic perspective view of a part of a chip supply unit according to a modification, (B) is a schematic plan view of a head portion of a chip support plate according to a modification, and (C) is a chip according to a modification. It is a schematic plan view of the head part in the state where the support plates approached each other. (A) is a schematic sectional view showing a state in which the sheet to which the chip is adhered is rubbed by the tip of the chip support plate of the pickup mechanism according to the modified example, and (B) is a view of the tip of the chip support plate in (A). It is an enlarged view. FIG. 7A is a schematic cross-sectional view illustrating a part of a chip supply unit according to a modified example, in which FIG. 7A is a schematic cross-sectional view illustrating a state in which a tip of a peeling member of a pickup mechanism is brought closer to a sheet to which a chip is attached; FIG. 4 is a schematic cross-sectional view showing a state in which a sheet on which a chip is adhered is rubbed by a release member. FIG. 7A is a schematic cross-sectional view illustrating a part of a chip supply unit according to a modified example, in which FIG. 7A is a schematic cross-sectional view illustrating a state in which a peeling member of a pickup mechanism is moved away from a sheet to which a chip is attached, and FIG. FIG. 4 is a schematic cross-sectional view showing a state in which a chip is transferred. (A) is a plan view showing a Bernoulli chuck and a guide section according to a modification, and (B) is a plan view showing a Bernoulli chuck and a guide section according to another modification. It is a schematic sectional drawing which shows some Bernoulli chucks and chip supply parts concerning a modification. FIG. 9 is a schematic side view of a non-contact chuck according to a modified example, partially cut away.

(Embodiment 1)
Hereinafter, a chip mounting system which is a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.

  The chip mounting system according to the present embodiment is a system for mounting components on a substrate. The component is, for example, a semiconductor chip (hereinafter, simply referred to as “chip”) supplied from a diced substrate. Conventionally, it has been difficult to prevent particles from entering the bonding interface when bonding the chip and the substrate. Therefore, it is difficult to bond the entire surface of the chip to the substrate, and the influence of the particles on the bonding is reduced by forming a gap using solder bumps or taking particles into the solder. However, in the method using the solder bumps, there is a limit in reducing the size of the solder bumps, and the pitch of the electrodes formed on the substrate needs to be about 50 μm. On the other hand, for example, a method in which an electrode formed on a bonding surface and an insulator layer are surface-bonded on the same surface without using a bump is preferable because the above-described electrode pitch can be reduced to several μm. As described above, in the case where no bump is provided on the side where the chip is bonded and the bonding surface is brought into surface contact with the mounting surface of the substrate and bonded, the chip mounting system according to the present embodiment is particularly effective. is there. By the way, in the method of bonding by activating at least the bonding surface of the chip, the bonding surface of the chip cannot be touched, and since bonding is performed in a solid phase, voids occur when particles are placed on the bonding surface. Can be the cause. In the surface activation bonding method, for example, Au or Cu existing on the bonding surface of the chip is activated by Ar irradiation and then bonded at room temperature to low temperature in the air. Further, in the hydrophilic bonding method, the bonding surface of the chip is made hydrophilic by performing a plasma treatment, and then the mounting surface of the substrate and the bonding surface of the chip are brought into temporary bonding by being brought into contact with each other, and then subjected to a heat treatment. Change to a solid covalent bond and join. For example, when an insulator and a Cu electrode are present on the bonding surface of the chip, the present invention is also suitable for the case where the bonding surface is planarized by CMP polishing and then surface bonded. In the chip mounting system according to the present embodiment, the chip can be transported to the head of the bonding apparatus without touching the bonding surface of the chip, and adhesion of particles to the bonding surface of the chip and the mounting surface of the substrate can be prevented. it can. Here, the “substrate mounting surface” indicates a surface on which a chip is mounted.

  As shown in FIG. 1, the chip mounting system 1 according to the present embodiment includes a chip supply device 10, a bonding device 30, and a control unit 90. In the following description, the ± Z direction in FIG. 1 will be appropriately described as a vertical direction, and the XY direction as a horizontal direction. The chip supply device 10 is a component supply device that acquires one chip CP from a plurality of chips CP attached to the sheet TE held by the sheet holding frame 112 and supplies the chip CP to the bonding device 30. Here, as the sheet TE, for example, an adhesive sheet holding a plurality of chips CP on one side having adhesiveness can be adopted. The chip supply device 10 includes a chip supply unit 11 and a first chip transfer unit 51 that transfers a chip CP supplied from the chip supply unit 11 to a head 33H of a bonding device 30 described below.

  The chip supply unit 11 is a component supply unit including a frame holding unit 119 that holds the sheet holding frame 112, a pickup mechanism 111 that picks up one chip CP from a plurality of chips CP, and a cover 114. In addition, the chip supply unit 11 includes a holding frame driving unit 113 that drives the sheet holding frame 112 in the XY direction or the direction that rotates around the Z axis. The frame holding unit 119 holds the sheet holding frame 112 in a posture in which the surface of the sheet TE to which the plurality of chips CP are attached is vertically upward (+ Z direction). From the sheet holding frame 112 and the frame holding portion 119, the sheet TE stuck on the side opposite to the bonding surface CPf side of each of the plurality of chips CP is oriented vertically upward with the bonding surface CPf being the first direction side. And a sheet holding unit configured to hold the sheet.

  The pickup mechanism 111 cuts out (projects) one of the plurality of chips CP from the side of the sheet TE opposite to the plurality of chip CPs, so that the one chip CP is separated from the sheet TE. . Here, the pickup mechanism 111 holds a peripheral portion, which is a third portion, which is different from a central portion, which is a first portion, which is held by a later-described head 33H, on a side opposite to the bonding surface CPf side of the chip CP, Cut out the chip CP. The third part may be the same as the first part. The pickup mechanism 111 has a needle 111a, and is movable in the vertical direction as indicated by an arrow AR15 in FIG. The cover 114 is arranged so as to cover vertically above the plurality of chips CP, and has a hole 114 a at a portion facing the pickup mechanism 111. For example, there are four needles 111a. However, the number of the needles 111a may be three, or may be five or more. The pickup mechanism 111 supplies the chips CP by piercing the needles TE with the needles 111a from below vertically (−Z direction) in the sheet TE and lifting the chips CP vertically upward (+ Z direction). Each of the chips CP adhered to the sheet TE is projected one by one above the cover 114 by the needle 111a through the hole 114a of the cover 114, and delivered to the first chip transport unit 51. The holding frame driving unit 113 changes the position of the chip CP located vertically below the needle 111a by driving the sheet holding frame 112 in the XY direction or the direction rotating around the Z axis.

  The first chip transfer unit 51 is a first component transfer unit that transfers the chip CP supplied from the chip supply unit 11 to a transfer position Pos1 where the chip CP is transferred to the head 33H. The first chip transport section 51 has a main body section 511, a first chip holding section 512 as a first component holding section, and a chip cover 513. The main unit 511 moves the first chip holding unit 512 between a preset standby position and a transfer position Pos1, as indicated by an arrow AR14 in FIG. For example, as shown in FIG. 2, the first chip holding portion 512 has a main piece 512b and two leg pieces 512a extending in the same direction from the main piece 512b. Here, the interval between the two leg pieces 512a is set to be shorter than the minimum width of the chip CP in plan view. And the 1st chip holding part 512 holds the circumference which is the 2nd part of chip CP in the state where chip CP was suspended between two leg pieces 512a. Returning to FIG. 1, the chip cover 513 is a component cover provided on the first chip holding unit 512 and covering the bonding surface CPf side of the chip CP in a state where the first chip holding unit 512 holds the chip CP.

  The bonding apparatus 30 includes a stage 31, a bonding unit 33 having a head 33H, and a head driving unit 36 that drives the head 33H. The head 33H includes, for example, a chip tool 411, a head main body 413, a chip support 432a, and a support drive 432b as shown in FIG. The chip tool 411 is formed from, for example, silicon (Si). The head main body 413 has a holding mechanism 440 having a suction unit for suction-holding the chip CP on the chip tool 411, and a pressing mechanism 431 pressing the center of the chip CP. The holding mechanism 440 holds the periphery of the chip CP via the chip tool 411. The pressing mechanism 431 is vertically movable at the center of the tip end surface of the head main body 413, and presses the center of the chip CP vertically upward, and presses the driving unit 431a. 431b. The head main body 413 also has a suction unit (not shown) for fixing the chip tool 411 to the head main body 413 by vacuum suction. When the pressing drive unit 431b moves the pressing unit 431a vertically upward while the peripheral portion of the chip CP is held by the chip tool 411, the central portion of the chip CP is pressed vertically upward (+ Z direction), The central portion of the CP is bent vertically upward compared to its peripheral portion. The tip tool 411 has a through hole 411a formed at a position corresponding to the holding mechanism 440 of the head main body 413, a through hole 411b into which the pressing portion 431a is inserted inside, and a chip support portion 432a inserted inside. And a through hole 411c.

  The chip support portion 432a has a pin-like shape, for example, and is a component support portion provided at the tip of the head 33H and movable in the vertical direction. The chip supporting portion 432a supports a central portion, which is a first portion, on a side opposite to the bonding surface CPf side of the chip CP. For example, as shown in FIG. 3B, four chip support portions 432a are provided so as to surround the pressing portion 431a.

  The support drive unit 432b drives the chip support 432a in the vertical direction. The support driving unit 432b moves the chip support 432a to the first position in a state where the first chip holding unit 512 holding the chip CP is located at the transfer position Pos1, and the center of the chip CP is supported by the chip support 432a. It is moved vertically above the chip holder 512. Thus, the chip CP is transferred from the first chip holding unit 512 of the first chip transport unit 51 to the head 33H.

  Returning to FIG. 1, the head driving unit 36 drives the bonding unit 33 in the Z-axis direction (see the arrow AR11 in FIG. 1), and also drives the bonding unit 33 to rotate around the rotation axis along the Z-axis direction ( (See arrow AR12 in FIG. 1). The head driving unit 36 moves the head 33H, which holds the chip CP received from the first chip transport unit 51, vertically upward (in the + Z direction) to bring the head 33H close to the stage 31 and insert the chip onto the mounting surface WTf of the substrate WT. Implement CP. Here, the mounting surface WTf of the substrate WT and the bonding surface CPf of the chip CP are made hydrophilic by performing the plasma processing as described above. Thus, by bringing the bonding surface CPf of the chip CP into contact with the mounting surface WTf of the substrate WT, the chip CP is so-called hydrophilically bonded to the substrate WT.

  The stage 31 is a substrate holding unit that holds the substrate WT in a posture in which the mounting surface WTf of the substrate WT on which the chip CP is mounted faces vertically downward (−Z direction). The stage 31 is driven in the X direction and the Y direction by the stage drive unit 32 (see the arrow AR13 in FIG. 1). Thereby, the relative positional relationship between the bonding unit 33 and the stage 31 can be changed, and the mounting position of each chip CP on the substrate WT can be adjusted.

  The control unit 90 includes, for example, an MPU (Micro Processing Unit), a main storage unit, an auxiliary storage unit, an interface, and a bus that connects each unit, and the head drive unit 36, the stage drive unit 32, and the holding mechanism 440 of the bonding apparatus 30. And the pressing mechanism 431, the chip supply unit 11 of the chip supply device 10, and the first chip transport unit 51. The MPU of the control unit 90 reads the program stored in the auxiliary storage unit into the main storage unit and executes the read program, so that the head drive unit 36, the stage drive unit 32, the holding mechanism 440, the pressing mechanism 431, the chip A control signal is output to each of the supply unit 11 and the first chip transport unit 51.

  Next, the operation of the chip mounting system 1 according to the present embodiment will be described with reference to FIGS. First, in the chip mounting system 1, as shown by the arrow AR31 in FIG. 4A, the pickup mechanism 111 moves vertically upward, so that one chip CP is on the opposite side to the plurality of chip CP sides in the sheet TE. From the sheet TE. Next, as shown by an arrow AR32 in FIG. 4A, the first chip transport section 51 approaches the chip CP from the side of the chip CP protruded in the vertical direction by the pickup mechanism 111. Then, the needle 111a of the pickup mechanism 111 is placed between the two leg pieces 512a (see FIG. 2) of the first chip holding portion 512.

  Subsequently, as shown by an arrow AR33 in FIG. 4B, when the pickup mechanism 111 moves vertically to the standby position, as shown in FIG. 4B, the chip CP is stored in the first chip holder 512. Is held. After that, the first chip transport unit 51 moves the first chip holding unit 512 to a transfer position Pos1 where the chip CP is transferred to the head 33H, as indicated by an arrow AR34 in FIG. After the first chip holding unit 512 is moved to the transfer position Pos1, the head driving unit 36 moves the bonding unit 33 vertically upward as indicated by an arrow AR35 in FIG. Closer to the first chip holder 512.

  Next, the support drive unit 432b moves the chip support 432a vertically upward as indicated by an arrow AR36 in FIG. 5B. Accordingly, the chip CP held by the first chip holding unit 512 is disposed vertically above the first chip holding unit 512 while being supported by the upper end of the chip supporting unit 432a. Subsequently, the first chip transport unit 51 moves the first chip holding unit 512 to the side of the chip CP, as indicated by an arrow AR37 in FIG. Thereafter, the support driving unit 432b moves the chip support 432a vertically downward as indicated by an arrow AR38 in FIG. 6B. Then, the holding mechanism 440 causes the chip tool 411 to suck the peripheral portion of the chip CP. Thus, the tip CP is held at the tip of the head 33H. After the chip CP is transferred to the tip of the head 33H in this manner, the chip CP is held by the head 33H also in a portion other than the central portion which is the first portion on the side opposite to the joint surface CPf side. State.

  Next, the chip mounting system 1 drives the stage 31 and rotates the bonding unit 33 to execute an alignment for correcting a relative displacement between the chip CP and the substrate WT. Subsequently, the chip mounting system 1 mounts the chip CP on the substrate WT by raising the head 33H. At this time, as shown by an arrow AR41 in FIG. 7, the bonding apparatus 30 holds the peripheral portion of the chip CP by suction by the holding mechanism 440 with the chip tool 411, as shown by an arrow AR42 in FIG. By driving the pressing portion 431a vertically upward, the central portion of the chip CP is pressed. As a result, as shown by an arrow AR43 in FIG. 7, the chip CP is deflected such that its central portion protrudes toward the mounting surface WTf of the substrate WT as compared with its peripheral portion. Then, the head driving unit 36 brings the head 33H close to the substrate WT in a state where the chip CP is bent as shown in FIG. 7, thereby bringing the central portion of the chip CP into contact with the mounting surface WTf of the substrate WT. Thereafter, the bonding device 30 extends the contact area between the substrate WT and the chip CP by further moving the head 33H closer to the substrate WT while the pressing portion 431a is immersed vertically downward. Then, the head driving unit 36 brings the head 33H closer to the mounting surface WTf of the substrate WT, thereby bringing the peripheral portion of the chip CP into contact with the mounting surface of the substrate WT, and then pressing the head 33H toward the substrate WT. Thus, the entire bonding surface CPf of the chip CP is bonded to the mounting surface WTf of the substrate WT. The bonding apparatus 30 moves the head 33H in the vertical direction to approach the substrate WT to a predetermined distance, and then bends the chip CP to bring the center of the chip CP into contact with the mounting surface WTf of the substrate WT. May be. Also in this case, after that, the bonding device 30 further moves the head 33H closer to the substrate WT while immersing the pressing portion 431a vertically downward, thereby increasing the contact area between the substrate WT and the chip CP, and After bringing the portion into contact with the mounting surface of the substrate WT, the entire bonding surface CPf of the chip CP may be bonded to the mounting surface WTf of the substrate WT by pressing the head 33H toward the substrate WT. Thus, by proceeding with the bonding from the center of the bonding surface CPf of the chip CP, it is possible to suppress the generation of voids due to the entrainment of air between the substrate WT and the chip CP in the atmosphere.

  As described above, according to the chip mounting system 1 according to the present embodiment, the chip CP is held by the first chip holding unit 512 that holds the peripheral portion of the supplied chip CP on the side opposite to the bonding surface CPf side. The chip CP is transported to the transfer position Pos1 while being held. Accordingly, the chip CP can be transported without touching the bonding surface CPf of the chip CP, so that adhesion of foreign matter to the bonding surface CPf of the chip CP and damage to the bonding surface CPf of the chip CP are suppressed. In addition, since the first chip transfer unit 51 transfers the chip CP with the bonding surface CPf of the chip CP facing vertically downward, foreign matter (for example, particles) may be placed on the bonding surface CPf of the chip CP. Is suppressed. Therefore, the occurrence of poor bonding between the chip CP and the substrate WT is suppressed.

  By the way, when the so-called bump bonding in which the chip CP is bonded to the substrate WT via the bump is performed, it is possible to handle a portion other than the bump on the side of the chip CP where the vap is formed. On the other hand, a so-called hydrophilic bonding in which the bonding surface CPf of the chip CP is subjected to a hydrophilic treatment and then the bonding surface CPf of the chip CP is brought into contact with the mounting surface WTf of the substrate WT to bond the chip CP to the substrate WT. In this case, the bonding surface CPf side of the chip CP cannot be handled. On the other hand, in the chip mounting system 1 according to the present embodiment, as described above, the chip CP can be transported without touching the bonding surface CPf of the chip CP. This is advantageous when joining by chemical bonding.

  Further, the first chip transport unit 51 according to the present embodiment has a chip cover 513 that covers the bonding surface CPf side of the chip CP held by the first chip holding unit 512. This suppresses the adhesion of foreign matter on the bonding surface CPf of the chip CP during the transfer of the chip CP by the first chip transfer unit 51, thereby suppressing the occurrence of poor bonding between the chip CP and the substrate WT. The cover 114 according to the present embodiment is arranged to cover vertically above the plurality of chips CP. Therefore, adhesion of particles to the bonding surfaces CPf of the plurality of chips CP held on the sheet TE is suppressed.

  Furthermore, according to the chip mounting system 1 according to the present embodiment, the sheet holding frame 112 and the frame holding unit 119 are attached to the sheet TE on the side opposite to the bonding surface CPf of each of the plurality of chips CP. The joint surface CPf is held in a posture facing vertically upward. This eliminates the need for the chip supply unit 11 to have a mechanism for reversing the direction of the bonding surface CPf of the chip CP, and accordingly has the advantage that the configuration of the chip supply unit 11 is simplified.

  Also, the head 33H according to the present embodiment presses the central portion of the chip CP so that the central portion of the bonding surface CPf of the chip CP is closer to the mounting surface WTf side of the substrate WT than the peripheral portion of the bonding surface CPf. A pressing mechanism 431 for bending the chip CP so as to protrude is provided. Thereby, the entrapment of air between the chip CP and the substrate WT is suppressed, so that the chip CP can be favorably joined to the substrate WT.

  Further, in the chip supply section 11 according to the present embodiment, an adhesive sheet can be employed as the sheet TE holding the chips CP. In this case, even when an external force is applied to the sheet TE, the chips CP are less likely to move relative to the sheet TE, so that contact between adjacent chips CP held on the sheet TE is suppressed. Therefore, there is an advantage that damage to the chip CP and generation of particles from the chip CP when an external force is applied to the sheet TE are suppressed.

  Further, according to chip mounting system 1 according to the present embodiment, stage 31 holds substrate WT in a posture in which the mounting surface of substrate WT on which chip CP is mounted faces vertically downward. Accordingly, it is possible to reduce the adhesion of particles to the mounting surface of the substrate WT, so that it is possible to suppress the occurrence of poor bonding between the chip CP and the substrate WT.

(Embodiment 2)
In the chip mounting system 2 according to the present embodiment, in the chip supply unit, the chip supply unit attaches the sheet TE to which the side opposite to the bonding surface CPf side of each of the plurality of chips CP to the vertically lower side where the bonding surface CPf is in the second direction. This embodiment is different from the first embodiment in that it is held in a posture facing.

  As shown in FIG. 8, the chip mounting system 2 according to the present embodiment includes a chip supply device 2010, a bonding device 30, and a control unit 2090. In FIG. 8, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIG. The chip supply device 2010 includes a chip supply unit 2011 and a first chip transport unit 51. The chip supply unit 2011 includes a frame holding unit 119 that holds the sheet holding frame 112, a pickup mechanism 2111 that picks up one chip CP from a plurality of chips CP, a second chip transport unit 2114, and a reversing unit 2115. And In addition, the chip supply unit 2011 includes a holding frame driving unit 113 that drives the sheet holding frame 112 in the XY direction or the direction that rotates around the Z axis. The frame holding unit 119 holds the sheet holding frame 112 in a posture in which the surface of the sheet TE to which the plurality of chips CP are attached is vertically downward (−Z direction). From the sheet holding frame 112 and the frame holding portion 119, the sheet TE stuck on the side opposite to the bonding surface CPf of each of the plurality of chips CP is oriented vertically downward with the bonding surface CPf being the second direction side. And a sheet holding unit configured to hold the sheet.

  The pickup mechanism 2111 has a needle 2111a, and is movable in the vertical direction as indicated by an arrow AR15 in FIG. For example, there are four needles 2111a. However, the number of the needles 2111a may be three, or may be five or more. The pickup mechanism 2111 supplies the chip CP by piercing the needle 2111a into the sheet TE from above vertically (+ Z direction) of the sheet TE and cutting out (projecting) the chip CP vertically below (−Z direction). Then, each chip CP stuck on the sheet TE is pushed vertically downward by the needle 2111a and delivered to the second chip transport unit 2114.

  The second chip transfer unit 2114 includes a second chip holding unit 2114a, a guide rail 2114c, and a slide unit 2114b to which the second chip holding unit 2114a is fixed and slides on the guide rail 2114c. It is. The second chip holding unit 2114a is a second component holding unit that is a Bernoulli check that holds one chip CP protruded by the pickup mechanism 2111 in a state where the chip CP is not in contact with the joint surface CPf. The Bernoulli chuck generates a negative pressure inside and discharges gas to the outside, thereby holding the chip CP in a non-contact state with a gas layer formed between the chip CP and the chip CP. In addition, as shown by an arrow AR2016 in FIG. 8, the second chip transport section 2114 has a slide body drive section (not shown) for moving the slide body 2114b along the guide rail 2114c. The second chip transfer unit 2114 transfers the second chip holding unit 2114a to the receiving position Pos2 of the first chip transfer unit 51 in a state where the second chip holding unit 2114a holds the chip CP.

  The reversing unit 2115 holds the chip CP held by the second chip holding unit 2114a on the side opposite to the bonding surface CPf, and turns the chip CP so that the bonding surface CPf is oriented vertically upward. The reversing unit 2115 has a suction head 2115a, an arm 2115b to which the suction head 2115a is fixed at a distal end, and an arm driving unit 2115c for rotating the arm 2115b or moving the arm 2115b in the vertical direction. Further, as shown in FIG. 9, for example, the reversing unit 2115 includes a chip support unit 2115g, a support unit driving unit 2115i, and a suction unit 2115e for suction-holding the chip CP. In a portion of the suction head 2115a corresponding to each chip support 2115g, a through hole 2115f into which the chip support 2115g is inserted is provided. Each chip supporting portion 2115g has, for example, a pin shape and is movable in the vertical direction. For example, there are four chip support portions 2115g. However, the number of the chip supporting portions 2115g may be three, or may be five or more. The support driving unit 2115i drives the chip support 2115g in the vertical direction.

  The first chip transfer unit 51 transfers the chip CP supplied from the chip supply unit 2011 at the receiving position Pos2 to a transfer position Pos1 where the chip CP is transferred to the head 33H. The control unit 2090 is the same as the control unit 90 described in the first embodiment, and controls the chip supply unit 2011 and the first chip transport unit 51 of the chip supply device 2010.

  Next, the operation of the chip mounting system 2 according to the present embodiment will be described with reference to FIGS. First, in the chip mounting system 2, as shown by an arrow AR51 in FIG. 10A, the pickup mechanism 2111 moves vertically downward, so that one chip CP is on the opposite side to the plurality of chip CP sides in the sheet TE. From the sheet TE, and transfers the chip CP to the second chip transport unit 2114. At this time, the second chip transport unit 2114 holds the chip CP delivered by the second chip holding unit 2114a in a state where the chip CP is not in contact with the bonding surface CPf.

  Next, as shown by an arrow AR52 in FIG. 10B, the second chip transport unit 2114 transports the second chip holding unit 2114a holding the chip CP to a position facing the reversing unit 2115 in the vertical direction. . Subsequently, when the second chip holding unit 2114a is transported to a position facing the reversing unit 2115, the arm driving unit 2115c of the reversing unit 2115 moves the arm 2115b vertically, as indicated by an arrow AR53 in FIG. Move down. Then, the suction head 2115a suction-holds the chip CP held by the second chip holding portion 2114a on the side opposite to the bonding surface CPf side.

  Thereafter, with the chip CP being suction-held by the suction head 2115a, the arm driving unit 2115c moves the arm 2115b vertically upward. Next, the arm driving unit 2115c rotates the arm 2115b as indicated by an arrow AR54 in FIG. As a result, the reversing unit 2115 is in a state where the chip CP is held in a posture in which the bonding surface CPf faces vertically upward. Subsequently, the reversing unit 2115 stops the suction of the chip CP by the suction head 2115a. Thereafter, as indicated by an arrow AR55 in FIG. 11B, the support driving unit 2115i moves the chip support 2115g vertically upward, so that the chip CP projects vertically upward from the suction head 2115a. Next, as shown by an arrow AR56 in FIG. 11B, the first chip transport unit 51 approaches the chip CP from the side of the chip CP protruded vertically upward by the chip support unit 2115g. Then, the chip supporting portion 2115g is arranged between the two leg pieces 512a (see FIG. 2) of the first chip holding portion 512.

  Subsequently, when the support driving unit 2115i moves the chip support 2115g vertically downward to the standby position, the first chip holding unit 512 holds the chip CP as shown in FIG. Becomes Thereafter, the first chip transport unit 51 moves the first chip holding unit 512 to a transfer position Pos1 where the chips CP are transferred to the head 33H, as indicated by an arrow AR57 in FIG. The subsequent operation of the chip mounting system 2 is the same as that of the first embodiment.

  As described above, according to the chip mounting system 2 according to the present embodiment, similarly to the chip mounting system 1 according to the first embodiment, the chip CP can be transported without touching the bonding surface CPf of the chip CP. Therefore, adhesion of foreign matter to the bonding surface CPf of the chip CP and damage to the bonding surface CPf of the chip CP are suppressed. In addition, since the first chip transfer unit 51 transfers the chip CP with the bonding surface CPf of the chip CP facing vertically downward, it is possible to suppress foreign matter from being placed on the bonding surface CPf of the chip CP. Therefore, the occurrence of poor bonding between the chip CP and the substrate WT is suppressed. Further, according to the chip mounting system 2 according to the present embodiment, the sheet holding frame 112 and the frame holding unit 119 are attached to the sheet TE on the side opposite to the bonding surface CPf of each of the plurality of chips CP. The joint surface CPf is held in such a posture that it faces vertically downward. Accordingly, in a state in which the plurality of chips CP are held on the sheet TE, adhesion of foreign matter to the bonding surface CPf of the chips CP is suppressed, so that occurrence of poor bonding between the chips CP and the substrate WT is suppressed.

(Embodiment 3)
In the chip mounting system 3 according to the present embodiment, the chip supply unit holds the sheet TE to which the bonding surface CPf side of each of the plurality of chips CP is adhered in a posture in which the bonding surface CPf of the chip CP faces vertically upward. This is different from the first embodiment.

  As shown in FIG. 13, the chip mounting system 3 according to the present embodiment includes a chip supply device 3010, a bonding device 3030, and a control unit 3090. In FIG. 13, the same components as those in the first and second embodiments are denoted by the same reference numerals as those in FIGS. The chip supply device 3010 includes a chip supply unit 3011 and a first chip transport unit 51. The chip supply unit 3011 includes a frame holding unit 119 that holds the sheet holding frame 112, a pickup mechanism 3111 that picks up one chip CP from a plurality of chips CP, and a third chip transport unit 3114. In addition, the chip supply unit 3011 includes a holding frame driving unit 113 that drives the sheet holding frame 112 in the XY direction or the direction that rotates around the Z axis. The frame holding unit 119 holds the sheet holding frame 112 in a posture in which the surface of the sheet TE to which the plurality of chips CP are attached is vertically downward (−Z direction). From the sheet holding frame 112 and the frame holding portion 119, the sheet TE to which the bonding surfaces CPf of the respective chips CP are adhered is held in a posture in which the bonding surface CPf of the chips CP is directed vertically upward, which is the first direction side. The sheet holding unit is configured. When the sheet TE is a pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet is preferably such that when the chip CP is peeled off from the pressure-sensitive adhesive sheet, no impurities remain in the portion of the chip CP that was adhered to the pressure-sensitive adhesive sheet.

  The pickup mechanism 3111 has a needle 3111a, and is movable in the vertical direction as indicated by an arrow AR3015 in FIG. The pickup mechanism 3111 supplies a chip by projecting the needle 3111a vertically downward (−Z direction) from vertically above (+ Z direction) of the sheet TE and pushing the chip CP vertically downward (−Z direction). Each of the chips CP affixed to the sheet TE is projected downward one by one by the needle 3111a and delivered to the third chip transport unit 3114.

  The third chip transport unit 3114 includes a third chip holding unit 3114a, an arm 3114b, a guide rail 3114d, and a slide body 3114c that supports the arm 3114b in a rotatable manner and slides on the guide rail 3114d. This is a component transport unit. The third chip holding portion 3114a is a third component holding portion provided at one end of the arm 3114b to suck and hold one chip CP protruded by the pickup mechanism 3111 on the side opposite to the joint surface CPf side. . As shown in FIG. 14, the third chip holding unit 3114a and the arm 3114b include a chip supporting unit 3114g, a supporting unit driving unit 3114i, and a suction unit 3114e for sucking and holding the chip CP. The third chip holding portion 3114a is provided with a through hole 3114f into which the chip supporting portion 3114g is inserted. The chip supporting portion 3114g has, for example, a pin shape and is movable in the vertical direction. For example, there are four chip support portions 3114g. However, the number of the chip supporting portions 3114g may be three, or may be five or more. The support driving unit 3114i drives the chip support 3114g in the vertical direction. The slide body 3114c has an arm drive unit (not shown) that turns one end of the arm 3114b on which the third chip holding unit 3114a is provided with the other end of the arm 3114b as a base point. In addition, the third chip transport unit 3114 has a slide body driving unit (not shown) for moving the slide body 3114c along the guide rail 3114d as indicated by an arrow AR3016 in FIG. The third chip transfer unit 3114 moves the third chip holding unit 3114a to the receiving position Pos2 of the first chip transfer unit 51 with the third chip holding unit 3114a holding the chip CP.

  The first chip transport unit 51 transports the chip CP supplied from the chip supply unit 3011 at the receiving position Pos2 to a transfer position Pos1 where the chip CP is transferred to the head 33H. The control unit 3090 is the same as the control unit 90 described in the first embodiment, and controls the chip supply unit 3011 and the first chip transport unit 51 of the chip supply device 3010.

  Next, the operation of the chip mounting system 3 according to the present embodiment will be described with reference to FIGS. First, in the chip mounting system 3, as shown by an arrow AR61 in FIG. 15A, the pickup mechanism 3111 moves vertically downward, so that one chip CP is on the opposite side to the plurality of chip CP sides in the sheet TE. Cut out (project). At this time, the third chip holding unit 3114a of the third chip transport unit 3114 sucks and holds the chip CP in a state where the side opposite to the bonding surface CPf side of the protruded chip CP is sucked. Next, after the pickup mechanism 3111 has moved to the standby position, the arm 3114b pivots in a state where the chip CP is sucked and held by the third chip holding unit 3114a as shown by an arrow AR62 in FIG.

  Next, the third chip transport unit 3114 moves the third chip holding unit 3114a holding the chip CP to the receiving position Pos2, as indicated by an arrow AR63 in FIG. 15B. Subsequently, when the third chip holding unit 3114a is transported to the receiving position Pos2, the arm 3114b turns as indicated by an arrow AR64 in FIG. 15B.

  After that, the third chip transport unit 3114 stops the suction of the chips CP by the third chip holding unit 3114a. Next, as indicated by an arrow AR65 in FIG. 16A, the support driving unit 3114i projects the chip CP vertically above the third chip holding unit 3114a by moving the chip support 3114g vertically above. . Subsequently, as shown by an arrow AR66 in FIG. 16A, the first chip transport unit 51 approaches the chip CP from the side of the chip CP protruded vertically upward by the chip support unit 3114g. Then, the chip supporting portion 2115g is arranged between the two leg pieces 512a (see FIG. 2) of the first chip holding portion 512.

  Thereafter, when the support driving unit 3114i moves the chip support 2115g vertically downward to the standby position, as shown in FIG. 16B, the state where the chip CP is held by the first chip holder 512 is reached. Become. Thereafter, the first chip transport unit 51 moves the first chip holding unit 512 to a transfer position Pos1 where the chip CP is transferred to the head 33H, as indicated by an arrow AR67 in FIG. The subsequent operation of the chip mounting system 3 is the same as that of the first embodiment.

  As described above, according to the chip mounting system 3 according to the present embodiment, similarly to the chip mounting system 1 according to the first embodiment, the chip CP is transported without touching the bonding surface CPf of the chip CP. Therefore, adhesion of foreign matter to the bonding surface CPf of the chip CP and damage to the bonding surface CPf of the chip CP are suppressed. In addition, since the first chip transfer unit 51 transfers the chip CP with the bonding surface CPf of the chip CP facing vertically downward, it is possible to suppress foreign matter from being placed on the bonding surface CPf of the chip CP. Therefore, the occurrence of poor bonding between the chip CP and the substrate WT is suppressed. Further, according to the chip mounting system 2 according to the present embodiment, the sheet holding frame 112 and the frame holding unit 119 move the sheet on which the bonding surface CPf side of each of the plurality of chips CP is stuck to the bonding surface CPf vertically upward. Hold in a position facing the side. Accordingly, in a state in which the plurality of chips CP are held on the sheet TE, adhesion of foreign matter to the bonding surface CPf of the chips CP is suppressed, so that occurrence of poor bonding between the chips CP and the substrate WT is suppressed.

  The embodiments of the present invention have been described above, but the present invention is not limited to the configurations of the above-described embodiments. For example, as in the chip mounting system 4 shown in FIG. 18, a Bernoulli chuck in which the first chip transfer unit 4051 of the chip supply device 4010 holds the bonding surface CPf side of the chip CP supplied from the chip supply unit 3011 in a non-contact manner. The first chip holding portion 4512 may be provided. The first chip transport section 4051 has a main body section 4511 and a first chip holding section 4512. The first chip holder 4512 holds the chip CP vertically below. In addition, the main body 4511 moves the first chip holder 4512 between a preset standby position and a transfer position Pos1, as indicated by an arrow AR74 in FIG.

  The bonding apparatus 4030 according to the present modification includes the stage 31, a bonding section 4033 having a head 4033H, and a head driving section 36 for driving the head 4033H. The head 4033H has, for example, a tip tool 4411 and a head main body 4413 as shown in FIG. Note that in FIG. 19, the same components as those in Embodiment 1 are denoted by the same reference numerals as in FIG. Returning to FIG. 18, the control unit 4090 is the same as the control unit 90 described in the first embodiment, and includes a head driving unit 36, a stage driving unit 32, a holding mechanism 440, a pressing mechanism 431, and a chip The chip supply unit 11 and the first chip transport unit 4051 of the supply device 4010 are controlled.

  In the chip mounting system 4 according to the present modification, the first chip transport unit 4051 moves the first chip holding unit 4512 holding the chip CP to the transfer position Pos1 where the chip CP is transferred to the head 33H. Then, the head driving unit 36 moves the bonding unit 4033 vertically upward to bring the head 4033H closer to the chip CP held by the first chip holding unit 4512. Next, the head driving unit 36 moves the head 4033H vertically upward to a position where the tip of the head 4033H contacts the side opposite to the bonding surface CPf side of the chip CP. Then, the holding mechanism 440 causes the chip tool 411 to suck the peripheral portion of the chip CP. Thus, the tip CP is held at the tip of the head 33H. The subsequent operation of the chip mounting system 4 is the same as that of the first embodiment. In the chip mounting system 4 according to the present modification, the posture of the chip CP held by the first chip holder 4512, which is a Bernoulli chuck, is not fixed. For this reason, it is preferable that the chip mounting system 4 according to the present modification includes an alignment mechanism (not shown) for aligning the posture of the chip CP before transferring the chip CP to the head 4033H.

  According to this configuration, the chip CP is transferred to the head 4033H in a state where the chip CP is held by the first chip holding unit 4512, which is a Bernoulli chuck that holds the bonding surface CPf side of the supplied chip CP in a non-contact manner. The chip CP is transported to the mounting position Pos1. Accordingly, the chip CP can be transported without touching the bonding surface CPf of the chip CP, so that adhesion of foreign matter to the bonding surface CPf of the chip CP and damage to the bonding surface CPf of the chip CP are suppressed. In addition, since the first chip transfer unit 51 transfers the chip CP with the bonding surface CPf of the chip CP facing vertically downward, it is possible to suppress foreign matter from being placed on the bonding surface CPf of the chip CP. Therefore, the occurrence of poor bonding between the chip CP and the substrate WT is suppressed. In addition, since the head 4033H can have a configuration that does not include the chip supporting portion 432a and the supporting portion driving portion 432b of the head 33H according to the first embodiment, there is an advantage that the configuration of the head 4033H is simplified. is there.

  In each embodiment, the chip supply unit may include a tray 6116 and a suction unit 6117, for example, as illustrated in FIG. Here, the tray 6116 includes a tray body 6116a provided with a plurality of concave portions 6116b in which the chips CP are arranged, a support portion 6116c having a pin-like shape protruding from the bottom of the concave portion 6116b, and a concave portion. 6116b and an adhesive sheet ATE1 stretched at a position separated from the bottom. There are four support portions 6116c, for example, for each concave portion 6116b. However, the number of the support portions 6116c may be three for each concave portion 6116b, or may be five or more for each concave portion 6116b. The adhesive sheet ATE1 holds the chip CP on an adhesive surface opposite to the bottom side of the concave portion 6116b of the tray main body 6116a. Here, the chip CP may be bonded to the adhesive sheet ATE1 on the side opposite to the bonding surface CPf, or may be bonded to the bonding sheet ATE1 on the bonding surface CPf side. Further, a communication hole 6116d communicating with the area S1 between the bottom of the recess 6116b and the adhesive sheet ATE1 is formed in the bottom of the recess 6116b of the tray body 6116a. The suction unit 6117 has a vacuum pump (not shown), and exists in the above-described area S1 through the communication hole 6116d of the tray 6116 when supplying the chip CP in a state where the chip CP is held on the adhesive sheet ATE1. Aspirate air.

  As shown in FIG. 20B, for example, as shown in FIG. 20B, the chip supply unit according to the present modified example supplies the chip CP to the area S1 through the communication hole 6116d of the tray 6116 by the suction unit 6117 with the chip CP held on the adhesive sheet ATE1. Aspirate any air present. Thereby, the contact area which is the area of the contact portion P61 between the adhesive sheet ATE1 and the chip CP decreases. Then, when the chip supply unit according to the present modification further suctions the air existing in the above-described region S1 by the suction unit 6117, as shown in FIG. 20C, the contact portion between the adhesive sheet ATE and the chip CP The area of P62 is further reduced, and the chip is detached from the adhesive sheet ATE1.

  According to this configuration, there is an advantage that the chip CP can be supplied to the bonding apparatuses 30 and 4030 even when the chip CP is not attached to the sheet TE. The tray 6116 is attached to the adhesive sheet ATE1 at a position where the peripheral portion of the chip CP does not contact the inner wall of the concave portion 6116b inside the concave portion 6116b. Thus, even when vibration is applied to the tray 6116, the chips CP do not contact the inner wall of the concave portion 6116b, so that generation of particles from the chip CP due to the contact of the chip CP with the inner wall of the concave portion 6116b is suppressed.

  In each embodiment, the chip supply unit may include a chip supply head 7116 and a suction unit 7117, for example, as shown in FIG. The chip supply head 7116 has a head main body 7116a provided with a concave portion 7116b, and a support portion 7116c having a pin shape, for example, protruding from the bottom of the concave portion 7116b. There are, for example, four support portions 7116c. However, the number of the support portions 7116c may be three, or may be five or more. Further, a suction hole 7116d for sucking gas existing inside the recess 7116b is provided at the bottom of the recess 7116b of the head main body 7116a. The suction unit 7117 has a vacuum pump (not shown), and suctions gas existing inside the concave portion 7116b through the suction hole 7116d.

  When supplying the chip CP, the chip supply unit according to the present modification applies the chip supply head 7116 to the plurality of chips CP attached to the adhesive sheet ATE2, for example, as indicated by an arrow AR91 in FIG. One of the chips CP is brought close to a portion corresponding to the chip CP and is brought into contact with the adhesive sheet ATE2. Here, the pressure-sensitive adhesive sheet ATE2 holds the plurality of chips CP on a surface having a pressure-sensitive adhesive property. The chip CP may be attached to the adhesive sheet ATE2 on the side opposite to the bonding surface CPf, or may be attached to the adhesive sheet ATE2 on the bonding surface CPf side. Then, the chip supply unit brings the chip supply head 7116 closer to the surface of the adhesive sheet ATE2 opposite to the surface holding the plurality of chips CP.

  Next, as shown in FIG. 21B, in a state where the chip supply head 7116 is in contact with the adhesive sheet ATE2, the chip supply section sucks air existing in the area S2 inside the concave portion 7116b through the suction holes 7116d. I do. Thereby, the area of the contact portion P72 between the adhesive sheet ATE2 and the chip CP decreases, and the chip CP separates from the adhesive sheet ATE2.

  According to this configuration, since the chips CP can be supplied without damaging the adhesive sheet ATE2, there is an advantage that adhesion of foreign matter generated from the adhesive sheet ATE2 to the chips CP is suppressed.

  In each embodiment, the plurality of chips CP may be held on an adhesive sheet whose adhesive strength is reduced by, for example, irradiation of ultraviolet rays. In this case, the chip supply unit has a chip supply head having an ultraviolet irradiation unit (not shown), and when supplying the chip CP, the chip CP to be supplied on the adhesive sheet is adhered by the ultraviolet irradiation unit. The part may be irradiated with ultraviolet rays. Note that, as the pressure-sensitive adhesive sheets ATE1 and ATE2 described with reference to FIGS. 20 and 21 described above, pressure-sensitive adhesive sheets whose adhesive strength is reduced by being irradiated with ultraviolet rays may be employed. In this case, when supplying the chip CP, the chip supply unit may be configured to suction the adhesive sheets ATE1 and ATE2 by the suction units 6117 and 7117 and to irradiate the ultraviolet rays.

  In each embodiment, an example has been described in which the stage 31 in the bonding apparatus 30 holds the substrate WT with the mounting surface WTf of the substrate WT facing vertically downward, but the held substrate WT is not limited to this. Not done. For example, the stage may hold the substrate WT in a posture in which the mounting surface WTf of the substrate WT faces vertically upward.

  In each embodiment, the bonding apparatus 30 may include a head having a suction post. For example, as shown in FIG. 22A, the head 8033H may include a tip tool 8411, a head main body 8413, a suction post 8432a, and a suction post driving unit 8432b. Note that in FIG. 22A, the same components as those in the embodiments are denoted by the same reference numerals as in FIG. 3A. Here, the head main body 8413 has a pressing mechanism 431 for pressing the center of the chip CP, similarly to the head main body 413 according to each embodiment. The pressing mechanism 431 has a pressing portion 431a and a pressing drive portion 431b that drives the pressing portion 431a. The tip tool 8411 has a through-hole 8411c formed at a position corresponding to the suction post 8432a of the head main body 8413, and a through-hole 8411b into which the pressing part 431a is inserted.

  The suction post 8432a is, for example, a component supporting portion that has a long cylindrical shape with a suction hole 8440 provided on the inner side, is provided at the tip of the head 4033H, and is movable in the vertical direction. For example, there are four suction posts 8432a. However, the number of the suction posts 8432a may be three, or may be five or more. The suction post 8432a supports the chip CP in a state where the suction post 8432a sucks the side opposite to the bonding surface CPf side of the chip CP. The suction post driving section 8432b drives the suction post 8432a in the vertical direction as indicated by an arrow AR8036 in FIG. The suction post driving section 8432b has a vacuum pump (not shown), and suctions the chip CP by reducing the pressure in the suction hole 8440 in a state where the chip CP is placed on the tip of the suction post 8432a. . The suction post driving unit 8432b is in a state where the first chip holding unit 512 holding the chip CP is located at the transfer position (for example, Pos1 in FIG. 1), and the tip of the suction post 8432a supports the center of the chip CP. Then, the suction post 8432a is moved vertically above the first chip holding portion 512. Thus, the chip CP is transferred from the first chip holding section 512 of the first chip transport section 51 to the head 8033H. In addition. The suction post is not limited to a pin shape, and may have a cylindrical shape arranged to surround the pressing mechanism 431.

  In each embodiment, in a state where the first chip holding unit 512 holding the chip CP is located at the transfer position Pos1, the chip supporting unit 432a that supports the central portion of the chip CP is set to be smaller than the first chip holding unit 512. The example in which the chip CP is transferred from the first chip holding unit 512 to the head 33H by moving vertically upward has been described. However, the present invention is not limited to this. For example, in a state where the first chip holding unit 512 holding the chip CP is located at the transfer position Pos1 and the center of the chip CP is supported by the chip supporting unit 432a, The chip CP may be transferred from the first chip holding unit 512 to the head 33H by moving the 512 vertically downward.

  In each embodiment, an example has been described in which the bonding apparatuses 30 and 4030 move the head 33H in the direction toward the stage 31 to mount the chip CP on the substrate WT. However, the present invention is not limited to this, and the bonding apparatuses 30 and 4030 may mount the chip CP on the substrate WT by, for example, moving the stage 31 in a direction approaching the head 33H.

  In Embodiment 1, the sheet holding frame 112 is an adhesive sheet that holds a plurality of chips CP on an adhesive surface, for example, as illustrated in FIG. The sheet TE10 in which the holes HA10 are formed in the respective regions may be held. Then, as shown in FIG. 23B, the pickup mechanism 8111 may have a suction post 8111a and a suction post driving unit 8111b. The suction post 8111a is, for example, a chip support pin (component support pin) having a long cylindrical shape provided with a suction hole (not shown) inside. For example, there are four suction posts 8111a. However, the number of the suction posts 8111a may be three, or may be five or more. The suction post 8111a is a chip support pin that supports the chip CP in a state where the opposite side to the bonding surface CPf side of the chip CP is suctioned. The suction post driving unit 8111b has a vacuum pump (not shown), and sucks the chip CP by reducing the pressure in the suction hole while the chip CP is placed on the tip of the suction post 8111a. The pickup mechanism 8111 inserts the chip CP by inserting the suction post 8111a into the hole HA10 from below vertically (−Z direction) of the sheet TE10 as shown by an arrow AR10 in FIG. It may be in a state of being detached from the seat TE10. Here, when the pickup mechanism 111 moves vertically upward (+ Z direction), the suction post 8111a is inserted into the hole HA10. Note that the chip support pins of the pickup mechanism 8111 are not limited to the suction posts 8111a, but may be the needles 111a described in the first embodiment. In the chip mounting system according to this modification, the sheet TE10 in which the holes HA10 are formed by piercing the holes HA10 in a sheet (not shown) held in a state where the holes are not pierced in the sheet holding frame 112. May be provided with a perforated portion (not shown) for producing the same.

  According to this configuration, there is an advantage that the possibility that foreign matter is generated from the sheet TE10 is lower than that in a configuration in which the sheet TE is pierced by the needle 111a, for example. In addition, in the case of a configuration including the pickup mechanism 8111 having the suction post 8111a, the chip CP is suction-held at the tip of the suction post 8111a, so that there is an advantage that the displacement of the chip CP is suppressed.

  In each embodiment, the chip supply section may have a tray 8516 as shown in FIG. Here, the tray 8516 has a tray body 8516a provided with a concave portion 8516b in which the chips CP are arranged inside, and an adhesive member 8517 provided at the bottom of the concave portion 8516b. The adhesive member 8517 is, for example, a gel adhesive sheet. A through hole 8516c that penetrates the tray body 8516b in the thickness direction is formed at the bottom of the concave portion 8516b of the tray body 8516a. The through hole 8516c has a cross-sectional area into which the suction post 8111a of the above-described pickup mechanism 8111 can be inserted, for example. Here, the tray 8516 is arranged such that, for example, the concave portion 8516b side of the tray main body 8516a faces vertically upward. Then, as shown in FIG. 24 (B), the pickup mechanism 8111 inserts the suction post 8111a into the through hole 8516c from vertically below the tray 8516 and lifts the chip CP vertically upward, thereby moving the chip CP vertically upward. (See arrow AR85 in FIG. 24B).

  Alternatively, the chip supply unit may include a tray 8616 and a suction unit (not shown) having a vacuum pump (not shown), for example, as shown in FIG. Here, the tray 8616 includes a tray body 8616a provided with a concave portion 8616b in which the chip CP is disposed, a partition 8618 protruding from the bottom of the concave portion 8616b, and an adhesive stretched over the tip of the partition 8618. And a sheet 8617. At the bottom of the concave portion 8616b of the tray main body 8616a, a through hole 8616c penetrating the tray main body 8616b in the thickness direction is formed. This through hole 8616c also has a cross-sectional area into which the suction post 8111a of the above-described pickup mechanism 8111 can be inserted, for example, as described above. The partition 8618 is provided so as to surround the through hole 8616c at the bottom of the concave portion 8616b. The adhesive sheet 8617 holds the chip CP on the adhesive surface opposite to the bottom of the recess 8616b of the tray main body 8616a. Here, the chip CP may be attached to the adhesive sheet 8617 on the side opposite to the joining surface CPf, or may be attached to the adhesive sheet 8617 on the joining surface CPf side. In addition, a communication hole 8616d communicating with a region S86 between the bottom of the recess 8616b and the adhesive sheet 8617 is formed in the bottom of the recess 8616b of the tray main body 8616a.

  Here, the tray 8616 is arranged such that, for example, the concave portion 8616b side of the tray main body 8616a faces vertically upward. Then, as shown in FIG. 25 (B), the pickup mechanism 8111 inserts the suction post 8111a into the through hole 8616c from vertically below the tray 8616 and lifts the chip CP vertically upward, thereby moving the chip CP vertically upward. (See arrow AR861 in FIG. 25B). At this time, when supplying the chip CP in a state where the chip CP is held by the adhesive sheet 8617, the suction unit suctions the air existing in the above-described region S86 through the communication hole 8616d of the tray 8616 (see FIG. 25B ) Arrow AR862). This reduces the area of the contact portion between the adhesive sheet 8617 and the chip CP, so that when the chip CP is lifted vertically upward by the pickup mechanism 8111, the chip CP can be smoothly separated from the adhesive sheet 8617. .

  According to this configuration, there is an advantage that the chip CP can be supplied to the bonding apparatuses 30 and 4030 even when the chip CP is not attached to the sheet TE.

  In the first embodiment, the first chip transfer unit that transfers the chips CP may be, for example, a first chip transfer unit (also referred to as a turret) 5039 as illustrated in FIG. In FIG. 26, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIG. The first chip transfer unit 5039 transfers the chip CP supplied from the chip supply unit 11 to a transfer position Pos1 where the chip CP is transferred to the head 33H of the bonding unit 33. The first chip transport unit 5039 includes, for example, two plates 5391, an arm 5394, a first chip holding unit 5393 provided at a distal end of the arm 5394, and a plate driving unit 5392 that rotates the plate 5391 simultaneously. And The plate 5391 is in the shape of a long rectangular box, and one end of the plate 5391 turns around the other end (axis AX) located between the chip supply unit 5011 and the head 33H. The number of plates 5391 is not limited to two, and may be three or more. The arm 5394 is long and protrudes or retracts along the longitudinal direction of the plate 5391. The first chip holding portion 5393 is provided at the tip of the arm 5394, and has two leg pieces 5393a for holding the chip CP. Here, as shown in FIG. 27, the plate 5391 can house the first chip holding portion 5393 at the distal end of the arm 5394 inside. When rotating the plate 5391, the first chip transport section 5039 retracts the arm 5394 into the plate 5391 as shown by an arrow AR508 in FIG. 27, thereby storing the first chip holding section 5393 inside the plate 5391. I do. This suppresses particles from adhering to the chip CP during transport. The two leg pieces 5393a may be provided with suction grooves (not shown). In this case, since the chip CP is sucked and held by the leg piece 5392a, the chip CP can be transported without displacement. Further, in order to prevent the tip CP from jumping out due to centrifugal force generated when the plate 5391 turns, a projection (not shown) may be provided at the tip of the leg piece 5393a.

  Here, the pickup mechanism 8111 and the head 33H of the bonding unit 33 are arranged at positions overlapping the locus OB1 drawn by the tip of the arm 5394 when the sheet rate 391 rotates in the Z-axis direction. When receiving the chip CP from the chip supply unit 5011 in the chip supply device 5010, the chip transfer unit 5039 transfers the chip CP by a rotation operation around the central axis AX as shown by an arrow AR501 in FIG. The sheet is conveyed to a transfer position Pos1 overlapping with 33H.

  As shown in FIG. 28, the chip supply unit 5011 has a frame holding unit 119 that holds the sheet holding frame 112, a pickup mechanism 111, and a cover 114. In FIG. 28, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIG. The bonding apparatus 5030 includes the stage 31, a bonding unit 33 having a head 33H, and a head driving unit 36 that drives the head 33H. The head 33H has a chip support section 432a and a support section drive section 432b.

  Further, as shown in FIG. 26, the chip mounting system 5 according to this modification includes, in addition to the chip supply unit 11 and the bonding unit 33, a cleaning unit 5037 for cleaning the chip CP, and a chip collection unit 5038. Have. The cleaning unit 5037 includes a chip stage 5036 that supports the chip CP, an XY direction driving unit (not shown) that drives the chip stage 5036 in two directions (XY directions) perpendicular to each other in the vertical direction and orthogonal to each other, and an ultrasonic wave. Or a cleaning head 5037a that discharges water subjected to megasonic vibration or a cleaning liquid that reduces the electrode surface. The cleaning unit 5037 has a rotation drive unit (not shown) that rotates the chip stage 5036 in a plane perpendicular to the vertical direction. Here, the cleaning unit 5037 first scans the chip stage 5036 supporting the chip CP in the X and Y directions while spraying water to which the ultrasonic head has been applied by the cleaning head 5037a in the XY direction, so that the entire bonding surface CPf of the chip CP is exposed. Wash. Then, the cleaning unit 5037 stops the discharge of water by the cleaning head 5037a, and then spin-drys the chip CP by rotating the chip stage 5036.

  By the way, since the tip CP has a rectangular plate shape, there is a possibility that the edge portion of the tip CP may be damaged if the tip CP is rotated while spraying water. On the other hand, the cleaning unit 5037 according to the present modification reciprocates the chip stage supporting the chip CP in the XY directions while spraying water to which the ultrasonic wave is applied by the water discharging unit onto the chip CP. Thereby, damage to the edge portion of the chip CP is suppressed. Note that the cleaning unit 5037 may remove particles adhering to the chip CP by spraying an inert gas such as N2 instead of water onto the chip CP.

  The chip stage 5036 adjusts the posture of the chip CP held in the chip holding unit 5393 after the cleaning of the chip CP by the cleaning unit 5037. Thus, even when the chip CP is displaced when the chip CP is cut out by the chip supply unit 11, alignment can be performed by the chip stage 5036. Therefore, the chip CP can be transferred to the head 33H of the bonding section 33 without displacement. In particular, when the chip TE is cut out by pushing the sheet TE with the needle 111a, it is effective because the positional deviation easily occurs. Note that, even in the case where a chip supply unit that transports the chip CP by the Bernoulli chuck is provided instead of the chip supply unit 11, the chip CP is likely to be displaced because the chip CP is held in the Bernoulli chuck in a non-contact manner. Therefore, it is effective to provide a mechanism for adjusting the attitude of the chip CP immediately before the chip CP is transferred to the head 33H, as in the chip stage 5036.

  The chip collecting unit 5038 is a component collecting unit arranged at a position next to the head 33H in the turning direction of the sheet rate 5391 when viewed from the axis AX (base point) of the plate 5391.

  The control unit 5090 includes, for example, an MPU (Micro Processing Unit), a main storage unit, an auxiliary storage unit, an interface, and a bus that connects each unit, and the head driving unit 36, the stage driving unit 32, and the holding mechanism 440 of the bonding apparatus 30. And the pressing mechanism 431, the chip supply unit 11 of the chip supply device 10, and the chip transport unit 5039. The MPU of the control unit 90 reads the program stored in the auxiliary storage unit into the main storage unit and executes the read program, so that the head drive unit 36, the stage drive unit 32, the holding mechanism 440, the pressing mechanism 431, the chip A control signal is output to each of the supply unit 11 and the chip transport unit 5039.

  Next, the operation of the chip mounting system 5 according to the present modification will be described with reference to FIGS. First, the chip mounting system 5 is in a state where one plate 5391 faces the direction of the chip supply unit 11. Next, by moving the pickup mechanism 111 vertically upward, one chip CP is protruded from the side opposite to the plurality of chip CPs in the sheet TE, and one chip CP is separated from the sheet TE. In this state, the chip transfer section 5039 causes the arm 5394 to protrude from the plate 5391. At this time, the needle 111a of the pickup mechanism 111 is arranged between the two leg pieces 5393a of the first chip holding portion 5393. In this way, as shown in FIGS. 29A and 29B, the chip CP can be transferred to the first chip holding portion 5393. When the pickup mechanism 111 is moved vertically downward from this state, the chip CP is transferred to the first chip holding portion 5393.

  Subsequently, when the chip mounting system 5 rotates the plate 5391 by 90 degrees in the direction of the arrow AR501 in FIG. 29A, the plate 5391 is disposed at the cleaning unit transfer position Pos10 illustrated in FIG. . That is, the first chip transfer unit 5039 transfers the first chip holding unit 5393 holding the chip CP supplied from the chip supply unit 11 to the cleaning unit transfer position Pos10 for transferring the chip CP to the cleaning unit 5037. In this state, the first chip transport unit 5039 transfers the chip CP from the first chip holding unit 5393 to the chip stage 5036 of the cleaning unit 5037. Then, the cleaning unit 5037 moves the chip stage 5036 supporting the chip CP below the cleaning head 5037a of the cleaning unit 5037, as indicated by an arrow AR502 in FIG. Then, the cleaning unit 5037 cleans the chip CP with water discharged from the cleaning head 5037. Thereafter, the cleaning unit 5037 moves the chip stage 5036 supporting the chip CP to the cleaning unit delivery position Pos10 again. Next, the chip stage 5036 adjusts the posture of the chip CP. Subsequently, the chip is transferred from the chip stage 5036 to the first chip holder 5393 again.

  Thereafter, when the chip mounting system 5 rotates the plate 5391 by 90 degrees in the direction of the arrow AR501 in FIG. 30A, the plate 5391 is arranged at the position shown in FIG. At this time, the first chip holding portion 5393 at the tip of the arm 5394 of the first chip transfer portion 5039 is arranged at the transfer position Pos1 vertically above the head 33H of the bonding portion 33. That is, the first chip transfer unit 5039 transfers the first chip holding unit 5393 holding the chip CP received at the cleaning unit transfer position Pos10 to the transfer position Pos1 where the chip CP is transferred to the head 33H. Then, the head driving unit 36 moves the bonding unit 33 vertically upward to bring the head 33H closer to the first chip holding unit 5393. Next, the support drive unit 432b moves the chip support 432a vertically upward. As a result, the chip CP held by the first chip holding portion 5393 is more vertical than the first chip holding portion 5393 in a state of being supported by the upper end portion of the chip supporting portion 432a as shown in FIG. It is arranged on the upper side. Subsequently, the first chip transfer unit 5039 causes the arm 5394 to enter the plate 5391. Thereafter, the support driving unit 432b moves the chip support 432a vertically downward. Thus, the tip CP is held at the tip of the head 33H.

  Next, the chip mounting system 5 executes alignment for correcting the relative positional shift between the chip CP and the substrate WT by driving the stage 31 and rotating the bonding unit 33. Subsequently, the chip mounting system 5 mounts the chip CP on the substrate WT by raising the head 33H.

  Here, the chip mounting system 5 attempts to join the chip CP to the substrate WT but fails to join the chip CP to the substrate WT. Hold the chip CP. Thereafter, when the chip mounting system 5 rotates the plate 5391 by 90 degrees in the direction of the arrow AR501 in FIG. 31A, the plate 5391 is disposed at the position shown in FIG. At this time, the first chip holding section 5393 at the tip of the arm 5394 of the first chip transport section 5039 is disposed vertically above the chip collection section 5038. Then, the chip CP held in the first chip holding unit 5393 is delivered to the chip collecting unit 5038. Here, whether or not the chip CP could not be bonded to the substrate WT depends on whether or not the chip CP is present when measuring the position shift of the chip CP by an infrared transmission camera (not shown) on the substrate WT side. Can be determined. Whether or not the chip CP remains on the head 33H side can be determined based on whether or not the chip CP can be recognized by an infrared transmission camera (not shown) on the bonding unit 33 side. When the chips CP remain in the head 33H, the chips CP may be discharged to a collection box (not shown) provided in the bonding apparatus 30.

  In this modification, the example in which the first chip holding portion 5393 has the two leg pieces 5393a for holding the chip CP at the front end has been described. However, the present invention is not limited to this. For example, a Bernoulli chuck is provided at the front end. May be provided.

  According to this configuration, since the chip CP can be cleaned in the cleaning unit 5037 while the chip CP is being transported from the chip supply unit 11 to the bonding unit 33, the bonding surface CPf of the chip CP is maintained in a clean state. It will be easier. Therefore, poor bonding of the chip CP to the substrate WT is suppressed.

  By the way, conventionally, cleaning is generally performed in a state of a substrate before being cut into chips CP. In this case, adhesion of particles generated from the sheet TE to the chips CP when cutting the chips CP from the substrate cannot be suppressed. Was. When the chips CP are transported by the tray, particles generated when the chips CP stored in the tray come into contact with the inner wall of the tray during transportation may adhere to the chips CP. For this reason, it is difficult to bond the entire bonding surface CPf of the chip CP to the substrate WT, and a gap is formed between the chip CP and the substrate WT using solder bumps, or particles are taken into the solder by using solder bumps. The effect of the particles adhering to the CP on the bonding was reduced. However, since there is a limit to reducing the size of the solder bump, it is necessary to increase the electrode pitch of the substrate WT to which the chip CP is bonded to about 50 μm. Therefore, it is required to bond the chip CP to the substrate WT by a bumpless press in order to reduce the electrode pitch. In this case, it is necessary to clean the chip CP to remove particles between the time when the chip CP is supplied from the chip supply unit 11 and the time when the chip CP is bonded to the substrate WT.

  On the other hand, according to this configuration, a series of processes from supply of the chip CP, cleaning of the chip CP, and bonding of the chip CP to the substrate WT are performed in one chip mounting system 5. Thereby, adhesion of particles to the chip CP is suppressed, so that the chip CP can be satisfactorily bonded to the substrate WT.

  Further, according to this configuration, the first chip transport section 5039 has two first chip holding sections 5393. Thereby, since the cleaning of the chip CP and the joining of the chip CP to the substrate WT can be performed in parallel, there is an advantage that loss of tact is reduced.

  Note that, in the first chip transport unit 5039 described above, the first chip holding unit 5393 may have a Bernoulli chuck.

  Alternatively, in the above-described chip mounting system 5, a second chip transport unit that has a second chip holding unit that is a Bernoulli chuck and that transfers the chip CP supplied from the chip supply unit 11 to the first chip transport unit 5039 is provided. It may be something. In this case, the first chip transfer unit 5039 receives the chip CP before transferring the chip CP received from the second chip transfer unit to the head 33H to an alignment unit (not shown) that performs alignment of the chip CP. hand over. Then, the first chip transfer unit 5039 receives the chip CP aligned by the alignment unit, and transfers the chip CP to the head 33H. Thereby, the first chip transport unit 5039 can transfer the chip CP to the head 33H in an aligned state.

  In the above-described chip mounting system 5, the head 33H may receive the chip CP after aligning its position before receiving the chip CP from the first chip transport unit 5039. This configuration is particularly preferable when the first chip holding unit 5393 in the first chip transport unit 5039 is a Bernoulli chuck.

  In each embodiment, a cleaning unit that cleans the chip CP may be provided. In this case, the first chip transfer units 51 and 4051 transfer the first chip holding units 512 and 4512 holding the chips CP supplied from the chip supply units 11, 2011 and 3011 to the cleaning unit. It may be transported to a position. Then, the first chip transfer units 51 and 4051 transfer the first chip holding units 512 and 4512 holding the chips CP received at the above-described cleaning unit transfer position to a transfer position where the chips CP are transferred to the head 33H. It may be something. Further, the chip cleaning unit may be provided in the bonding apparatuses 30 and 4030, and may clean the chip CP with the chip CP placed on the head 33H.

  In each embodiment, before the chip CP is transferred to the head 33H, the bonding surface CPf of the chip CP is subjected to sheet plasma treatment or an activation process of irradiating a particle beam to activate the bonding surface CPf of the chip CP. A unit (not shown) may be provided. When the metal electrode and the insulator layer are formed on the bonding surface CPf of the chip CP, all ions contained in the plasma collide with the bonding surface CPf when the plasma treatment is performed. Particles may adhere. Therefore, it is preferable to activate the bonding surface CPf by irradiating the bonding surface CPf with a particle beam using FAB (atomic beam) or IG (ion gun) because reattachment of particles is suppressed.

  According to this configuration, the bonding surface CPf of the chip CP is activated by the sheet plasma treatment or the irradiation of the particle beam to the bonding surface CPf, and water molecules are easily attached to generate an OH group. And the bonding strength with the metal can be improved.

  In the first embodiment, as shown in FIG. 33, the chip supply unit moves in synchronization with the vertical movement of the pickup mechanism 111, and the Bernoulli chuck 8711 disposed vertically above the chip CP pushed up by the needle 111a. May be provided. Alternatively, in the above-described modified example, the pickup mechanism 8111 may be provided with a Bernoulli chuck 8711 that moves in synchronization with the vertical movement and is disposed vertically above the chip CP pushed up by the suction post 8111a. According to this configuration, it is possible to prevent the chip CP from being scattered or displaced when the chip CP is pushed up by the pickup mechanism 111. In addition, when there is no hole in the sheet TE, it is necessary to push the chip CP upward by pushing the sheet TE with the needle 111a, which is particularly effective for preventing the chips from scattering.

  In the first embodiment, the chip supply unit has a pickup mechanism that detaches the chip CP attached to the sheet TE from the sheet TE by using the suction force of the Bernoulli chuck and transfers the chip CP to the first chip transport unit 51. It may be something.

  In the first embodiment, when the chip supply unit has a Bernoulli chuck disposed vertically above the chip CP, the pickup mechanism is configured such that the tip end portion is in contact with the chip CP and the joining surface of the chip CP is in contact with the chip CP. The CPf may have a plurality of long plate-like chip support plates (component support plates) that are supported in a horizontal posture on a plane perpendicular to the vertical direction. For example, as shown in FIG. 34A, the pickup mechanism 9111 may have two long chip support plates 9111a1 and 9111a2. Here, the pickup mechanism 9111 includes a support plate drive unit 9111g that moves the two chip support plates 9111a1 and 9111a2 in a direction orthogonal to their extending direction to bring the two chip support plates 9111a1 and 9111a2 closer to each other. Further, the pickup mechanism 9111 has a suction unit (not shown) that suctions a portion between the chip support plates 9111a1 and 9111a2 in a state where the sheet is stretched over the tip portions of the chip support plates 9111a1 and 9111a2.

  Further, as shown in FIG. 35A, for example, the chip supply unit according to the present modification includes a suction unit that suctions a portion of the sheet TE1 on which the chip CP facing the Bernoulli chuck 9711 and the chip CP adjacent thereto are stuck. It has an adsorption unit 9115 having 9115a. Here, the Bernoulli chuck 9711 is included in, for example, a first chip transfer unit that transfers the chip CP to a transfer position where the chip CP is transferred to the head 33H. Note that the Bernoulli chuck 9711 may be included in the second chip transport unit that transports the chip CP to the receiving position of the first chip transport unit. In the Bernoulli chuck 9711, the horizontal position of the chip CP is not specified. Thus, the Bernoulli chuck 9711 is provided with a guide portion 9711a for preventing the position of the chip CP from shifting. The guide portion 9711a is, for example, a rectangular frame-shaped member provided at a portion of the Bernoulli chuck 9711 surrounding the chip CP in a state where the chip CP is held by the Bernoulli chuck 9711. Further, the chip CP facing the Bernoulli chuck 9711 corresponds to the chip CP cut out by the pickup mechanism 9111. Further, a chip CP adjacent to the chip CP facing the Bernoulli chuck 9711 corresponds to a chip CP other than the chip CP cut out by the pickup mechanism 9111. The suction unit 9115 guides a portion of the sheet TE1 to which the chip CP adjacent to the chip CP facing the Bernoulli chuck 9711 is attached from the side opposite to the side of the sheet TE1 to which the chip CP is attached. The chip CP can be lifted to a position where the suction force of the Bernoulli chuck 9711 acts without the part 9711a contacting the chip CP adjacent to the chip CP facing the Bernoulli chuck 9711.

  Here, the operation of the chip supply unit according to this modification will be described with reference to FIGS. 35 and 36. First, when delivering the chip CP to the Bernoulli chuck 9711 by the pickup mechanism 9111, the chip supply unit attaches the chip CP adjacent to the chip CP facing the Bernoulli chuck 9711 as shown by an arrow AR901 in FIG. The attached portion is sucked by the suction unit 9115. Then, the pickup mechanism 9111 presses the distal ends of the chip support plates 9111a1 and 9111a2 to a portion of the sheet TE1 to which the chip CP facing the Bernoulli chuck 9711 is attached. Next, as shown by an arrow AR903 in FIG. 35 (B), the support driving unit 9111g moves the chip support plates 9111a1 and 9111a2 toward each other so that the Bernoulli chucks on the sheet TE1 at their leading ends. The part to which the chip CP facing 9711 is attached is rubbed. At this time, since the sheet TE1 is slightly lifted and an angle is formed between the sheet TE1 and the contact surface of the chip CP with the sheet TE1, the front ends of the chip support plates 9111a1 and 9111a2 are moved from the outside to the inside of the chip CP. By moving the sheet, the sheet TE1 is peeled off from the chip CP. Subsequently, the pickup mechanism 9111 returns the positions of the chip support plates 9111a1 and 9111a2 to the original positions, as indicated by an arrow AR904 in FIG. Thereafter, as shown by an arrow AR905 in FIG. 36A, the suction unit suctions a portion between the chip support plates 9111a1 and 9111a2 on the sheet TE1. Here, the pickup mechanism 9111 may return the positions of the chip support plates 9111a1 and 9111a2 to the original positions while the suction unit sucks the portion between the chip support plates 9111a1 and 9111a2 in the sheet TE1. As a result, the chip CP facing the Bernoulli chuck 9711 is easily peeled from the sheet TE1. Next, as shown by an arrow AR906 in FIG. 36B, the pickup mechanism 9111 vertically moves the chip support plates 9111a1 and 9111a2 to attach the chip CP facing the Bernoulli chuck 9711 in the sheet TE1. Push the raised part vertically upward. At this time, since the portion where the chip CP adjacent to the chip CP facing the Bernoulli chuck 9711 is attached is sucked by the suction unit 9115, the chip CP adjacent to the pushed-up chip CP contacts the Bernoulli chuck 9711. Is prevented. Further, the Bernoulli chuck 9711 cannot generate a suction force for sucking the chip CP unless the chip CP is in a horizontal position and does not approach the vicinity of the Bernoulli chuck 9711 to some extent. On the other hand, the Bernoulli chuck 9711 requires a guide 9711a to regulate the horizontal position of the chip CP. On the other hand, in the present modification, only the chip CP to be sucked by the Bernoulli chuck 9711 can be brought close to the Bernoulli chuck 9711 from the inside of the guide 9711a in a horizontal posture. Therefore, even if the guide portion 9711a is provided, the chip CP can be sucked by the Bernoulli chuck 9711. Then, the pushed-up chip CP is delivered to the Bernoulli chuck 9711. That is, the pickup mechanism 9111 does not support the chip CP from vertically above the chip CP, and uses only the chip support plates 9111a1 and 9111a2 to move the portion of the sheet TE1 where the chip CP is stuck to the bonding surface of the chip CP. The CPf is pushed up so as to be in a horizontal posture on a plane perpendicular to the vertical direction. This suppresses the contact of the chip CP with the guide portion 9711a of the Bernoulli chuck 9711 when pushing up the portion of the sheet TE1 on which the chip CP is stuck. Note that the timing of sucking the sheet TE1 by the suction unit may be after pushing up the portion of the sheet TE1 on which the chip CP is stuck by the chip supporting plates 9111a1 and 9111a2, or by moving the chip supporting plates 9111a1 and 9111a2. It may be before or during the movement in the direction to approach each other.

  Further, the pickup mechanism includes three or more chip support pins for supporting the chip CP in a horizontal posture on a plane whose joint surface CPf is perpendicular to the vertical direction, and a separating member for separating the chip CP from the sheet. And a certain peeling pin. For example, as shown in FIG. 34B, the pickup mechanism 10111 has four chip supporting pins 10111a and four peeling pins 10111b. Here, the pickup mechanism 10111 includes a pin driving unit 10111g by independently moving the four chip support pins 10111a and the four peeling pins 10111b in their extending directions. Further, the pickup mechanism 9111 has a suction unit (not shown) that suctions a portion surrounded by the chip support pins 10111a in a state where the sheet is stretched over the tip of the chip support pins 10111a.

  Here, the operation of the chip supply unit according to the present modification will be described with reference to FIGS. 37 and 38, the same components as those in the above-described modified example are denoted by the same reference numerals as in FIGS. 35 and 36. First, when a chip CP is delivered by the pickup mechanism 10111 to the Bernoulli chuck 9711, a chip CP adjacent to the chip CP facing the Bernoulli chuck 9711 is attached as shown by an arrow AR1001 in FIG. The attached portion is sucked by the suction unit 9115. Then, the pick-up mechanism 9111 presses the tip of the chip support pin 10111a against the portion of the sheet TE1 to which the chip CP facing the Bernoulli chuck 9711 is attached. Next, as illustrated by an arrow AR1002 in FIG. 37B, the supporting unit driving unit 10111g attaches the distal end of the peeling pin 10111b to the portion of the sheet TE1 to which the chip CP facing the Bernoulli chuck 9711 is attached. Press. On the other hand, as illustrated by an arrow AR1003 in FIG. 37B, the support driving unit 10111g detaches the tip end of the chip support pin 10111a from the sheet TE1. At this time, of the portion of the sheet TE1 stuck to the chip CP, a portion outside the portion where the tips of the four peeling pins 10111b abut is separated from the chip CP. Subsequently, as shown by an arrow AR1004 in FIG. 38A, the pickup mechanism 10111 again moves the tip end of the chip support pin 10111a to the portion of the sheet TE1 to which the chip CP facing the Bernoulli chuck 9711 is adhered. Press. On the other hand, as illustrated by an arrow AR1005 in FIG. 38A, the supporting unit driving unit 10111g detaches the distal end of the peeling pin 10111b from the sheet TE1. Thereafter, the suction unit sucks a portion between the chip support plates 9111a1 and 9111a2 on the sheet TE1, as indicated by an arrow AR1006 in FIG. Next, as shown by an arrow AR1007 in FIG. 38B, the pickup CP facing the Bernoulli chuck 9711 on the sheet TE1 is attached by moving the chip support pin 10111a vertically upward as indicated by an arrow AR1007 in FIG. Push the part up vertically. Then, the pushed-up chip CP is delivered to the Bernoulli chuck 9711. That is, the pickup mechanism 10111 does not support the chip CP from vertically above the chip CP, and uses only the chip support pins 10111a to move the portion of the sheet TE1 where the chip CP is stuck to the bonding surface CPf of the chip CP. Push up so that it is in a horizontal posture on a plane perpendicular to the vertical direction. This suppresses the contact of the chip CP with the guide portion 9711a of the Bernoulli chuck 9711 when pushing up the portion of the sheet TE1 on which the chip CP is stuck. The timing at which the sheet TE1 is sucked by the suction unit may be after the portion of the sheet TE1 to which the chip CP is stuck is pushed up by the chip support pins 10111a.

  In the first embodiment, for example, as shown in FIG. 39A, the pickup mechanism 12111 may have two chip support plates 12111a1 and 12111a2 having hook-shaped heads 12111c and 12111d at the distal end. . Here, each of the chip support plates 12111a1 and 12111a2 has a long plate-shaped main body 12111b and heads 12111c and 12111d. In addition, the pickup mechanism 12111 includes a support plate driving unit 12111g that moves the two chip support plates 12111a1 and 12111a2 in a direction perpendicular to their extending direction to bring the two chip support plates 12111a1 and 12111a2 closer to each other.

  As shown in FIG. 39 (B), the head portions 12111c and 12111d have long projecting portions 12111e and 12111f, respectively, which project toward the sides facing each other. Here, as shown by an arrow AR1201 in FIG. 39C, when the support plate driving unit 12111g moves the chip support plates 12111a1 and 12111a2 toward each other, one of the protruding portions 12111e and 12111f becomes the other. It is in a state of being inserted between. Note that the shapes of the head portions 12111c and 12111d are not limited to the shapes shown in FIGS. 39A to 39C, and one part of the head portions 12111c and 12111d fits into the other part. Any other shape may be used as long as it has a shape.

  As shown in FIG. 40 (A), the pickup mechanism 12111 according to the present modified example has a chip CP facing the Bernoulli chuck 9711 in the sheet TE1 attached to the head portions 12111c and 12111d at the tip ends of the chip support plates 12111a1 and 12111a2. Press on the part that has been worn. Then, as shown by an arrow AR1201 in FIG. 40A, the supporting unit driving unit 12111g moves the chip supporting plates 12111a1 and 12111a2 in a direction in which the chip supporting plates 12111a1 and 12111a2 approach each other, so that the Bernoulli chuck on the sheet TE1 is moved by the head units 12111c and 12111d. The part to which the chip CP facing 9711 is attached is rubbed. Here, as shown in FIG. 40B, the support driving unit 12111g moves the chip support plates 12111a1 and 12111a2 until the heads 12111c and 12111d overlap each other when viewed from the Y-axis direction. . As a result, the chip CP facing the Bernoulli chuck 9711 is easily peeled from the sheet TE1. Then, the pickup mechanism 12111 returns the positions of the chip support plates 12111a1 and 12111a2 to the original positions, and then moves the chip support plates 12111a1 and 12111a2 vertically upward. As a result, the portion of the sheet TE1 on which the chip CP facing the Bernoulli chuck 9711 is stuck vertically upward, and the pushed chip CP is delivered to the Bernoulli chuck 9711.

  In addition, as shown in FIG. 41A, for example, as shown in FIG. 41A, the chip supply unit rubs the chip TE1 with the chip CP facing the Bernoulli chuck 9711 together with the chip support pins 13111h to remove the chip CP from the sheet TE1. A pickup mechanism 13111 including peeling members 13111a1 and 13111a2 for peeling and a peeling member driving unit 13111g may be provided. For example, four chip support pins 13111h are provided. Note that the number of the chip support pins 13111h may be three, or may be five or more. The chip support pins 13111h support the chip CP in a horizontal posture on a plane where the joint surface CPf is perpendicular to the vertical direction. The peeling members 13111a1 and 13111a2 have the same configuration as the above-described chip supporting plates 12111a1 and 12111a2, and have a long plate-shaped main body 13111b and head portions 13111c and 13111d at the distal ends. Note that the shape of the head portions 13111c and 13111d is not limited to the shape shown in FIG. 41A, but may be any shape as long as one of the head portions 13111c and 13111d fits into the other. Other shapes may be used.

  Here, the operation of the chip supply unit according to the present modification will be described with reference to FIGS. First, as shown by an arrow AR1302 in FIG. 41A, the pickup mechanism 13111 affixes the heads 13111c and 13111d of the peeling members 13111a1 and 13111a2 to the chip CP facing the Bernoulli chuck 9711 on the sheet TE1 from the standby position. Approach the part that was done. Next, as shown by an arrow AR1303 in FIG. 41B, the pickup mechanism 13111 moves the peeling members 13111a1 and 13111a2 toward each other in a state where the heads 13111c and 13111d are pressed against the sheet TE1. The heads 13111c and 13111d rub the part of the sheet TE1 to which the chip CP facing the Bernoulli chuck 9711 is attached. In the state of FIG. 41B, the tip of the chip support pin 13111h may be arranged near the sheet TE1. Thereby, the posture of the chip CP can be stabilized. Subsequently, the pickup mechanism 13111 returns the positions of the peeling members 13111a1 and 13111a2 to the standby position as shown in FIG. Thereafter, as shown by an arrow AR1304 in FIG. 42A, the chip supply unit moves the chip support pins 13111h vertically upward, thereby bringing the tips of the chip support pins 13111h into contact with the sheet TE1. Thereafter, as indicated by an arrow AR1305 in FIG. 42 (B), the chip supply unit pushes up the portion of the sheet TE1 where the chip CP facing the Bernoulli chuck 9711 is stuck vertically upward by the chip support pin 13111h. Then, the pushed-up chip CP is transferred to the Bernoulli chuck 9711. At this time, the chip supply unit returns the peeling members 13111a1 and 13111a2 to the standby position by moving them vertically downward as indicated by an arrow AR1306 in FIG.

  According to this configuration, the pickup mechanisms 9111 and 12111 support the chip CP with the chip supporting plates 9111a1, 9111a2, 12111a1, and 12111a2 in a horizontal posture on a plane where the bonding surface CPf is orthogonal to the vertical direction. In addition, the pickup mechanisms 10111 and 13111 support the chip CP in a horizontal posture on a plane whose joining surface CPf is perpendicular to the vertical direction by the chip supporting pins 10111a and 13111h. Accordingly, the pickup mechanisms 9111, 10111, 12111, and 13111 can transfer the chip CP to the Bernoulli chuck 9711 in a state in which the bonding surface CPf maintains a horizontal posture on a plane orthogonal to the vertical direction. Therefore, when the pickup mechanisms 9111, 10111, 12111, and 13111 transfer the chip CP to the Bernoulli chuck 9711, it is possible to suppress occurrence of a handling error of the Bernoulli chuck 9711 due to the inclination of the posture of the chip CP.

  Further, according to this configuration, when the pickup mechanism 9111 transfers the chip CP to the Bernoulli chuck 9711, the chip CP opposing the Bernoulli chuck 9711 in the sheet TE1 at the tip of the chip support plates 9111a1, 9111a2, 12111a1, and 12111a2. Rub the area where is adhered. Further, when transferring the chip CP to the Bernoulli chuck 9711, the pickup mechanism 10111 presses the tip of the peeling pin 10111b against a portion of the sheet TE1 to which the chip CP facing the Bernoulli chuck 9711 is attached. Further, when transferring the chip CP to the Bernoulli chuck 9711, the pickup mechanism 13111 rubs the portion of the sheet TE1 to which the chip CP facing the Bernoulli chuck 9711 is adhered by the head portions 13111c and 13111d of the peeling members 13111a1 and 13111a2. . Thereby, the chip CP facing the Bernoulli chuck 9711 is easily peeled off from the sheet TE1, so that there is an advantage that the chip CP is smoothly transferred from the sheet TE1 to the Bernoulli chuck 9711.

  In the above-described modified example, the example in which the rectangular frame-shaped guide 9711a is provided on the Bernoulli chuck 9711 has been described, but the shape of the guide portion is not limited to this. For example, as shown in FIG. 43A, a guide portion 12711a is provided in a Bernoulli chuck 9711 with a chip CP held in a portion surrounding two corners of the chip CP in a Bernoulli chuck 9711 in a plan view L-shape. Shape. Alternatively, as shown in FIG. 43 (B), the guide portions 13711a are pin-shaped guides provided at a plurality of portions of the Bernoulli chuck 9711 surrounding the chip CP in a state where the chip CP is held by the Bernoulli chuck 9711. It may be.

  Further, in the chip mounting system 5 according to the modified example described with reference to FIGS. 26 to 32, the chip CP supplied from the chip supply unit 5011 together with the first chip transport unit 5039 is supplied to the first chip supply unit 5039. A second chip transport unit (not shown) that transports the chip CP to a position where the chip CP is transferred to the first chip holding unit 5393 may be provided. In this case, since the lengths of the plate 5391 and the arm 5394 of the first chip transfer unit 5039 can be reduced, the size of the first chip transfer unit 5039 can be reduced.

  In the first embodiment, the chip supply unit may include the above-described pickup mechanisms 9111, 10111, 12111, and 13111. In this case, the pickup mechanisms 9111, 10111, 12111, and 13111, when transferring the chip CP to the first chip holding unit 512, use the tips of the chip support pins 10111a, 13111h or the chip support plates 9111a1, 9111a2, 12111a1, 12111a2. The chip support pins 10111a, 13111h or the chip support plates 9111a1, 9111a2, 12111a1, 12111a2 may be moved until the distal end is disposed vertically above the first chip holding portion 512. For example, the portion of the chip CP from which the sheet TE1 outside the chip support pins 10111a and 13111h has been peeled off may be held by the first chip holding portion 512.

  In the chip supply unit of each embodiment, a configuration may be used in which the chip CP is cut out upward, or a configuration in which the chip CP is cut down.

  In the second embodiment, even when the chip supply unit holds the sheet TE to which the side opposite to the bonding surface CPf of each of the plurality of chips CP is adhered, the bonding surface CPf is oriented vertically upward. Good. In this case, the second chip transport unit holds one chip CP cut out by the pickup mechanism by the second chip holding unit, which is a Bernoulli chuck, in a state where the chip CP is not in contact with the bonding surface CPf, and does not invert the chip CP. It may be delivered to the first chip transport section as it is. Here, the first chip transport unit may be, for example, the first chip transport unit 5039 which is a turret according to the modification described with reference to FIGS. 26 and 27.

  In each of the embodiments and the modifications described with reference to FIGS. 26 to 43, a plurality of hooks that can take a state of being hooked from the vertically lower side and a state of being detached from the chip CP around the periphery of the chip CP are provided. It may be provided with a first chip transport section having the same. For example, as shown in FIG. 44, the first chip transport unit according to the present modification includes a transport unit main body 16511, a Bernoulli chuck 16711 fixed to the transport unit main body 16511, and a transport unit main body 16511 as shown by an arrow AR1604. And a main body driving unit (not shown) that is driven in the vertical direction. In FIG. 44, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIG. The Bernoulli chuck 16711 is provided with a guide portion 16711a for preventing the position of the chip CP from shifting. Further, the first chip transport section has two arms 16514 each having a hook 16514a provided at a tip end thereof, and a support section 16515 fixed to the transport section main body 16511 and rotatably supporting the two arms 16514, respectively. Further, the first chip transport section has two arms 16514 each having a hook 16514a at the tip, and a support section 16515 fixed to the transport section main body 16511 and rotatably supporting the two arms 16514, respectively. In addition, the first chip transport unit includes a moving member 16517 provided with a pin 16516 at a distal end thereof inserted into a long hole 16514b formed at a base end of each of the two arms 16514 and a moving member 16517 in a vertical direction. And a hook driving unit 16518 that drives the motor.

  The chip supply unit according to the present modification includes the suction unit 16115 having the suction unit 16115a that suctions a portion of the sheet TE1 on which the chip CP facing the Bernoulli chuck 16711 and the adjacent chip CP are stuck. The chip CP facing the Bernoulli chuck 9711 corresponds to the chip CP cut out by the pickup mechanism 111. Further, a chip CP adjacent to the chip CP facing the Bernoulli chuck 16711 corresponds to a chip CP other than the chip CP cut out by the pickup mechanism 111. As shown by an arrow 1605, the suction unit 16115 opposes the part of the sheet TE1 on which the chip CP adjacent to the chip CP facing the Bernoulli chuck 16711 is adhered to the side of the sheet TE1 on which the chip CP is adhered. Adsorb from the side.

  The hook driving unit 16158 moves the hook 16514a by moving the moving member 16517 in the vertical direction as shown by the arrow AR1602 and rotating the arm 16514 with the pin 16516 as the base point as shown by the arrow AR1603. When the pickup mechanism 111 cuts out one chip CP from the plurality of chips CP as indicated by an arrow AR1601, the hook driving unit 16158 rotates the arm 16514 to move the hook 16514a to the vertically lower peripheral portion of the chip CP. Hang it from below vertically. At this time, the hook 16514a of the arm 16514 is inserted between the sheet TE1 side surface of the chip CP and the sheet TE1. As a result, even when the sheet TE1 is stuck to the periphery of the chip CP in a state where the chip CP is lifted vertically upward, the sheet TE1 is peeled off from the periphery of the chip CP by the hooks 16514a. Then, when the chip CP is held by the Bernoulli chuck 16711, the hook driving unit 16158 rotates the arm 16514 to detach the hook 16514a from the chip CP.

  According to this configuration, for example, even if the adhesive force of the sheet TE1 is relatively strong, the sheet TE1 can be peeled from the peripheral portion of the chip CP, so that the occurrence of a chip CP chuck error by the Bernoulli chuck 16711 is suppressed. . Further, according to this configuration, the hook 16514a is hooked from the vertically lower side to the vertically lower peripheral portion of the chip CP in a state where the Bernoulli chuck 16711 is arranged vertically above the chip CP. Accordingly, for example, when cutting out the chip CP, even if the chip CP jumps vertically upward, the chip CP can be received by the Bernoulli chuck 16711, and thus there is an advantage that the scattering of the chip CP is suppressed.

  In the present modification, an example in which the first chip transport unit is used has been described. However, the present invention is not limited to this. Department. Further, in the present modification, a configuration without the Bernoulli chuck 16711 may be employed. In this case, the first chip transfer section may transfer the chip CP while holding the chip CP by the plurality of hooks 16514a.

  By the way, when the guide part 16711a is provided in the Bernoulli chuck 16711 as in this modification, the pickup mechanism 111 cuts the chip to be cut out when the Bernoulli chuck 16711 is brought close to the sheet TE1 on which the chip CP is stuck. It is necessary to lift the chip CP to such a height that the guide portion 16711a does not contact the chip CP adjacent to the CP. At this time, since the sheet TE1 is projected and extended in a direction approaching the Bernoulli chuck 16711, the interval between the adjacent chips CP is such that the chip CP to be cut out when the sheet TE1 is projected and the adjacent chip CP are separated. It is preferable that the length is set so as not to approach the Bernoulli chuck 16711. Also, when the hook 16514a is inserted into the peripheral portion on the vertically lower side of the chip CP, it is advantageous that the interval between the adjacent chips CP is large.

  Further, as the sheet TE1, it is preferable to use a sheet in which the interval between the adjacent chips CP is easily widened when the sheet TE1 is extended. Further, the chips CP may be rearranged on the sheet TE1 such that the interval between the adjacent chips CP is widened. Alternatively, when the chip supply unit lifts and cuts the chip CP vertically upward by the pickup mechanism 111, the chip supply unit may include a heating unit that heats the sheet TE1 from below vertically below the sheet TE1 to make the sheet TE1 easier to extend. . Here, the heating unit may have, for example, a heater and a mechanism for discharging hot air. Further, the chip supply unit may have a light source that irradiates infrared light or ultraviolet light to the sheet TE1 to make the sheet TE1 easier to stretch.

  In the second embodiment, the second chip holding unit 2114a of the second chip transport unit 2114 may be a non-contact check 17711 as shown in FIG. 45, for example. The non-contact chuck 17711 includes a chuck main body 17712, a negative pressure generator 17713, an ultrasonic generator 17714, and a support member 17715 that supports the ultrasonic generator 17714. In the chuck main body 17712, a flow path 17712a communicating with the chip CP side (-Z direction side) held therein is formed. The negative pressure generating unit 17713 suctions the chip CP by generating a negative pressure of 8 kPa to 40 kPa in the channel 17712 a of the chuck main body 17712. The ultrasonic generator 17714 generates ultrasonic waves between the chuck main body 17712 and the chip CP by vibrating the chuck main body 17112 at a high frequency of several MHz, and compresses and diffuses the gas existing there. Thus, a thin gas film, that is, a squeezed film is formed on the −Z direction side of the chuck body 17112. Then, the state in which the chip CP floats on the squeezed film on the −Z direction side of the chuck body 17712 is maintained. That is, the non-contact chuck 17711 holds the chip CP in a non-contact manner by using the suction force of the chip CP by the negative pressure generator 17713 and the repulsion force of the ultrasonic wave generated by the ultrasonic wave generation unit 17714 in combination. I do.

  In this modification, the example in which the second chip holding unit of the second chip transport unit is the non-contact chuck shown in FIG. 45 has been described. However, the present invention is not limited to this. For example, FIG. The first chip holder 4512 of the first chip transporter 4051 described above may be a non-contact chuck shown in FIG.

  By the way, in the case of the above-mentioned Bernoulli chuck, the exhaust flow rate from the Bernoulli chuck is relatively large. For this reason, for example, when an airflow is generated in the bonding apparatuses 30 and 4030 or the chip supply apparatuses 2010 and 4010 in order to remove particles attached to the substrate WT or the chip CP, the airflow is affected. There is a possibility that it will end. Further, particles on the chip CP are scattered.

  On the other hand, according to the present configuration, since there is no exhaust from the non-contact chuck 17711, it is possible to eliminate the influence on the flow of the airflow generated in the bonding devices 30 and 4030 or the chip supply devices 2010 and 4010. . Further, according to this configuration, since the chip CP is sucked by the chuck main body 17712 by the negative pressure generating unit 17713, the occurrence of the displacement of the chip CP is suppressed. Therefore, there is an advantage that it is not necessary to adjust the attitude of the chip CP before transferring the chip CP to the heads 33H and 4033H of the bonding apparatuses 30 and 4030. Further, the particles adhering to the chip CP are sucked, and the particles adhering to the chip CP are removed. Further, the non-contact chuck 17111 according to the present configuration also has an advantage that the suction force is higher than that of the Bernoulli chuck.

  In each of the embodiments, the method of cutting out the chip CP from the sheet includes a method of sticking up with a needle, a method of sucking an uneven surface to reduce a contact area, and a method of cutting a surface of the chip CP opposite to the joining surface CPf into a plate shape. A method of peeling by rubbing with a member, a method of irradiating ultraviolet light to reduce the adhesive force of the sheet, a method of heating the sheet to reduce the adhesive force of the sheet, or any other method may be used. Further, not only the method of cutting out the chips CP from the sheet but also the method of cutting out the chips placed on the tray, the above-described methods are effective. Further, as the sheet, it is also possible to use a sheet coated with an adhesive material that foams and reduces adhesive strength when irradiated with ultraviolet rays, on the adhesive surface of the sheet on which the chip CP is attached. Good. Further, when irradiating the sheet with ultraviolet light to reduce the adhesive strength of the sheet, the pickup mechanism irradiates the sheet with ultraviolet light when the pickup mechanism cuts out at least one component from the plurality of components attached to the sheet. May be provided. The pickup mechanism has a glass tool (not shown) that is transparent to ultraviolet light, and the ultraviolet irradiation unit emits ultraviolet light to the glass tool with the glass tool pushing up the portion of the sheet to which the chip CP is attached. May be incident on the inside. In this case, ultraviolet rays that propagate through the glass tool and radiate from the sheet side of the glass tool are irradiated on the sheet, and the adhesive force of the sheet decreases. The pickup mechanism cuts out the chip CP by irradiating the portion of the sheet TE to which the chip CP is stuck with ultraviolet light and then pushing up the portion with a needle or rubbing the portion with a peeling member. You may do so. Further, after the pickup mechanism irradiates the portion of the sheet TE to which the chip CP is stuck with ultraviolet light, the first chip transfer section or the second chip transfer section transfers the chip CP stuck to the portion to the first chip. The pickup may be held by the holding unit or the second chip holding unit.

  That is, by irradiating ultraviolet rays to the portion of the sheet TE on which the chip CP is stuck, the chip CP is easily peeled off from the sheet TE, and then pushed up with a needle of the pickup mechanism or rubbed on the sheet TE with a peeling member. May be used to cut out the chip CP. Further, the portion where the chip CP is stuck on the sheet TE may be irradiated with ultraviolet rays so that the chip CP is easily separated from the sheet TE, and then picked up by the first chip transport unit or the second chip transport unit as it is. . Further, while pushing up the portion of the sheet TE to which the chip CP is attached with a glass tool transparent to ultraviolet light, the portion may be irradiated with ultraviolet light through the glass tool to peel off the chip CP. Further, a material that is applied with a material that is fired when ultraviolet rays are applied to the side of the sheet TE to which the chip CP is attached is used, and the sheet CP is irradiated with ultraviolet light so that the chip CP is easily peeled from the sheet TE. After that, the pickup may be directly picked up by the first chip transfer unit or the second chip transfer unit.

  Further, in the above-described modified example, the timing of making a hole in the sheet TE1 may not be before the sheet TE1 is put into the chip mounting system. For example, at the timing when the above-described peeling pin 10111b is brought into contact with the sheet TE1 or when the peeling members 13111a1 and 13111a2 are moved inward, the chip supporting pin 10111a outside the peeling pin 10111b or the peeling members 13111a1 and 13111a2 on the sheet TE1. , 13111h may be opened. Further, a configuration may be used in which a hole is formed in the sheet TE1 while peeling off the outer peripheral portion of the chip CP in the sheet TE1 in a similar manner to a position different from the pickup mechanism or a device different from the chip supply device 10.

  By the way, as in Embodiment 1, when the hole is not formed in the sheet TE1 and the needle 111a penetrates the sheet TE1, the adhesive material contained in the sheet TE1 adheres to the tip of the needle, It may adhere to the chip CP. In this case, there is a problem in that the adhesive material adheres to the head 33H, the first chip holder, or the like, or falls in the chip mounting system to become dust when the chip CP is transported. Therefore, in the first embodiment, a recess is provided in a portion corresponding to the contact position of the needle 111a in the head 33H, the first tip holder, or the like, so that the head 33H contacts the portion of the tip CP where the tip of the needle 111a contacts. , The first chip holder, each stage and the like are preferably prevented from coming into contact with each other.

  In the modified example described above, the cleaning unit 5037 has a configuration in which a discharge hole (not shown) for discharging a gas such as water, nitrogen, or the atmosphere is provided in a portion of the chip stage 5036 where the chip CP is mounted. You may. In this case, the cleaning unit may clean the back surface of the chip CP transported to the cleaning unit with a gas such as water, nitrogen, or the atmosphere discharged from the discharge holes.

  In each of the embodiments, the head 33H is configured to protrude the suction post from the center thereof and transfer the chip CP to the head 33H, and when joining the chip CP to the substrate WT inside the suction post. It may have a built-in pressing mechanism for pressing the central portion of the chip CP. This is preferable because both the post pin and the center push mechanism are established.

  In the above-described embodiments and modifications, “cutting out” means supplying the chip CP by protruding with a needle, supplying the chip CP by sucking the adhesive sheet, and irradiating ultraviolet rays. And supplying the chip CP.

  The present invention is suitable for manufacturing, for example, CMOS image sensors, memories, arithmetic elements, and MEMS.

1, 2, 3, 4, 5: chip mounting system, 10, 2010, 3010, 4010, 5010: chip supply device, 11, 2011, 3011, 5011: chip supply unit, 30, 4030: bonding device, 31: stage , 32: Stage drive unit, 33, 4033: Bonding unit, 33H, 4033H: Head, 36: Head drive unit, 51, 4051, 5039: First chip transfer unit, 114: Cover, 114a: Hole, 90, 2090, 3090, 4090: control unit, 1111, 1111, 3111, 9111, 10111, 12111, 13111: pickup mechanism, 111a, 2111a, 3111a: needle, 112: sheet holding frame, 113: holding frame driving unit, 119: frame holding unit 2115: reversing part, 411, 4411, 8411: Tool, 411a, 411b, 411c, 2115f, 3114f, 8411b, 8411c: through hole, 413, 4413, 8413: head body, 431: pressing mechanism, 431a: pressing section, 431b: pressing drive section, 432a: chip supporting section , 432b: support unit drive unit, 440: holding mechanism, 511, 4511: body unit, 512, 4512, 5393: first chip holding unit, 513: chip cover, 2114: second chip transport unit, 2114a: second chip Holding section, 2114b, 3114c: slide body, 2114c, 3114d: guide rail, 2115: reversing section, 2115a: suction head, 2115b, 3114b, 16514: arm, 2115c: arm driving section, 2115e, 3114e, 9115a: suction section, 2115g, 311 g: chip support section, 2115i, 3114i: support section drive section, 3114: third chip transport section, 3114a: third chip holding section, 5036: chip stage, 5037: cleaning section, 5037a: cleaning head, 5038: chip collection Part, 5391: plate, 5392: plate drive unit, 5394: arm, 6116: tray, 6116a: tray body, 6116b, 7116b: concave portion, 6116c, 7116c: support portion, 6116d: communication hole, 6117, 7117: suction portion, 7116: Chip supply head, 7116a: Head body, 7116d: Suction hole, 8111a, 8432a: Suction post, 8111b, 8432b: Suction post drive unit, 8440: Suction hole, 8617, ATE1, ATE2: Adhesive sheet, 8711, 9711, 16711: V Renault chuck, 9111a1, 9111a2, 12111a1, 12111a2: chip support plate, 9111b, 13111b: main body, 9111c, 9111d, 10111c, 10111d: head, 9111e, 9111f: protrusion, 9111g, 10111g, 12111g: support drive Part, 9115: suction unit, 9711a, 14711a, 15711a: guide unit, 10111b: peeling pin, 13111a: peeling member, 13111g: peeling member drive unit, 10111a, 13111h: chip support pin, 16116: suction unit, 16115a: suction , 16511: conveyance unit main body, 16514a: hook, 16514b: long hole, 16516: pin, 16517: moving member, 16518: hook drive unit, 16711a: Id part, 17711: Non-contact chuck, 17712: Chuck body, 17712a: Channel, 17713: Negative pressure generation part, 17714: Ultrasonic wave generation part, 17715: Support member, CP: Chip, CPf: Joint surface, P61, P62 : Contact portion, Pos1: transfer position, Pos2: receiving position, HA10: hole, TE, TE1, TE10: sheet, WT: substrate, WTf: mounting surface

Claims (61)

A component mounting system for mounting components on a board,
A component supply unit that supplies the component,
A head that holds a side opposite to a bonding surface side of the component that is bonded to the mounting surface of the board at the tip end;
A first component holding unit configured to hold the joining surface side of the component supplied from the component supply unit in a non-contact manner, wherein the first component holding unit holds the component in a state where the first component holding unit holds the component; A first component transport unit that transports the product to a transfer position;
A substrate holding unit that holds the substrate,
In a state where the component transferred from the first component transport unit is held at the tip of the head, the head is relatively moved in a first direction from the head toward the substrate holding unit, and the substrate is moved. A head drive unit that mounts the component on the mounting surface by contacting the bonding surface of the component with the mounting surface.
Component mounting system. The head is provided with a component support portion that is movable in the vertical direction in a state in which a tip portion supports a first portion on a side opposite to a bonding surface side of the component that is bonded to the mounting surface of the substrate,
When the first component holding unit holding the component is located at the transfer position and the first portion of the component is supported by the component support unit, the component support unit is moved from the first component holding unit to the first component holding unit. A supporting unit driving unit that transfers the component from the first component holding unit to the head by relatively moving the component in the first direction.
The first component transport unit includes a first component holding unit that holds a second portion different from a first portion on a side opposite to the joining surface side of the component supplied from the component supply unit, In a state where the first component holding unit holds the component, the component is transported to a transfer position where the component is transferred to the head,
The head drive unit moves the head relative to the substrate holding unit in a first direction in a state where the component transferred from the first component transport unit is held at a tip end of the head. To mount the component on the mounting surface by contacting the bonding surface of the component with the mounting surface of the substrate,
The component mounting system according to claim 1. The first component transport unit includes a component cover that covers the joining surface side of the component in a state where the component is held by the first component holding unit.
The component mounting system according to claim 2. The component supply unit is configured to hold a third portion different from a first portion on a side opposite to the bonding surface side of at least one of the plurality of components from among the plurality of components, and Has a pickup mechanism to cut out,
The first component transporter receives the at least one component while holding the second part by the first component holder.
The component mounting system according to claim 2. The component supply unit has a pickup mechanism that cuts out at least one of the plurality of components from a plurality of components,
The first component transfer unit receives the at least one component by the first component holding unit without contacting the joining surface side of the component.
The component mounting system according to claim 1. The first component holding unit is a Bernoulli chuck,
The component mounting system according to claim 1. The first component holding unit includes a chuck body in which a flow path communicating with the component to be held is formed, a negative pressure generating unit that makes the inside of the flow path a negative pressure, and vibrating the chuck body. An ultrasonic generator that generates ultrasonic waves between the chuck body and the component,
The component mounting system according to claim 1. The component supply unit further includes a sheet holding unit that holds a sheet attached to a side opposite to the bonding surface side of each of a plurality of components, and among a plurality of components, at least one of the plurality of components. A pickup mechanism for cutting out one part,
The pickup mechanism may be configured such that the at least one component does not support the joining surface side of the at least one component, and the joining surface of the at least one component is horizontal to a plane perpendicular to the vertical direction. Having three or more component support pins or a plurality of long component support plates for supporting the at least one component in the sheet by the component support pins or the component support plate. Projecting the at least one component to the first component holding portion by protruding toward the first component holding portion;
The component mounting system according to claim 1. The pickup mechanism may be configured such that, when transferring the at least one component to the first component holding unit, the tip ends of the three or more component support pins or the plurality of component support plates are more vertical than the first component holding unit. Moving the three or more component support pins or component support plates until positioned above;
The component mounting system according to claim 8. The component supply unit further includes a sheet holding unit that holds a sheet attached to a side opposite to the bonding surface side of each of a plurality of components,
The pickup mechanism may include three or more component support pins or a plurality of elongate components for supporting the at least one component in a horizontal position on a surface where a joining surface of the at least one component is perpendicular to a vertical direction. The at least one part of the sheet, to which the at least one part is adhered, is protruded toward the first part holding part by the part support pin or the part support plate, thereby forming the at least one part. Is transferred to the first component holder,
The component mounting system according to claim 8. The component supply unit further includes:
A part to which parts other than the at least one part cut out by the pickup mechanism in the sheet are adhered, and a suction unit that suctions the sheet from the side opposite to the plurality of parts side,
The pickup mechanism holds the portion of the sheet to which the at least one component is attached in a state where the component to which the component other than the at least one component is attached is adsorbed by the adsorption unit. Protruding toward the department,
The component mounting system according to any one of claims 8 to 10. The pickup mechanism is configured to support the three or more component support pins in a state where a tip of the three or more component support pins or a plurality of component support plates is pressed against a portion of the sheet to which the at least one component is attached. After the at least one component is peeled off from the sheet by moving a pin or the plurality of component support plates, the at least one component in the sheet is separated by the three or more component support pins or the plurality of component support plates. Protrudes the portion to which the is attached to the first component holding portion side,
The component mounting system according to claim 8. The pickup mechanism includes the plurality of component support plates, and supports the plurality of component support plates in a state where tips of the plurality of component support plates are pressed against a portion of the sheet to which the at least one component is attached. After rubbing the sheet by moving the plates toward each other, the plurality of component support plates are moved in a direction away from each other, and then the at least one component in the sheet is attached by the component support plate. Projecting the part to the first component holding part side,
The component mounting system according to claim 12. The pickup mechanism has, with the three or more component support pins, a plurality of peeling pins for facilitating the separation of the component from the sheet, and the tip of the three or more component support pins to the sheet. After pressing the tip portions of the plurality of peeling pins against the portion of the sheet to which the at least one component is adhered while pressing the at least one component on the portion to which the at least one component is adhered, The tip of the above-mentioned component support pin is detached from the sheet, and then the tip of the three or more component support pins is pressed against the portion of the sheet to which the at least one component is stuck. Projecting a portion of the sheet to which the at least one component is adhered by a component support pin toward the first component holding unit;
The component mounting system according to claim 8. The pick-up mechanism, when protruding a portion of the sheet to which the at least one component is attached toward the first component holding unit, removes the portion of the sheet to which the at least one component is attached by the at least one component. Suction from the side opposite to the component side,
The component mounting system according to claim 13. The pickup mechanism has, with the three or more component support pins, a plurality of peeling members for facilitating the peeling of the component from the sheet. By moving the plurality of peeling members in a direction approaching each other in a state where the at least one component in the sheet is pressed against the part to which the three components are attached, the at least one component in the sheet is rubbed by the component support pins after rubbing the sheet. Projecting the adhered portion toward the first component holding portion;
The component mounting system according to claim 8. The component supply unit or the first component transport unit includes:
A plurality of hooks capable of taking a state of being hooked from a vertically lower side to a periphery of the at least one component and a state of being detached from the at least one component;
When the component supply unit supplies the component, the plurality of hooks are hooked from a vertically lower side to a vertically lower peripheral portion of the at least one component to hold the at least one component on the plurality of hooks. Having a hook driving unit,
The component mounting system according to claim 1. The component supply unit includes:
A sheet holding unit that holds a sheet attached to a side opposite to the bonding surface side of each of a plurality of components,
A pick-up mechanism that cuts off at least one of the plurality of components from a side of the sheet opposite to the plurality of components, thereby bringing the at least one component away from the sheet.
The component mounting system according to claim 1. The component supply unit includes:
A sheet holding unit that holds a sheet to which a side opposite to the joining surface side of each of a plurality of components is attached.
A pickup mechanism configured to cut out at least one of the plurality of components from a side of the sheet opposite to the plurality of components, so that the at least one component is detached from the sheet;
A second component holding portion that is a Bernoulli check that holds the at least one component in a non-contact state with the joining surface; and the second component holding portion holds the component in a state where the second component holding portion holds the component. A second component transport unit that transports the unit to a receiving position of the first component transport unit;
A reversing unit that retains a side of the component held by the second component holding unit opposite to the joining surface side, and inverts the joining surface so that the joining surface faces the first direction.
The component mounting system according to claim 1. The component supply unit includes:
A sheet holding unit that holds the sheet to which the bonding surface side of each of the plurality of components is adhered in a posture in which the bonding surface faces the first direction side;
A third component holding unit configured to hold at least one of the plurality of components from a side of the plurality of components in the sheet from a side opposite to the joining surface side of the component; A third component transfer unit that transfers the third component holding unit to a receiving position of the first component transfer unit in a state where the unit holds the component.
The component mounting system according to claim 1. The sheet is an adhesive sheet that holds the component on an adhesive surface,
The component mounting system according to claim 8. The surface having the adhesiveness is coated with a material having a reduced adhesive strength when irradiated with ultraviolet rays,
The pickup mechanism, when cutting out at least one component from the plurality of components attached to the sheet, has an ultraviolet irradiation unit that irradiates the sheet with ultraviolet light,
The component mounting system according to claim 21. The sheet is an adhesive sheet that holds the component on an adhesive surface, and a hole is formed in each of the regions where the plurality of components are attached,
The pickup mechanism has a component support pin for supporting the component, and at least one component of the plurality of components is connected to the component support pin from a side of the sheet opposite to the plurality of components. By inserting the at least one part from the seat,
The component mounting system according to claim 18. The component support pin is a suction post,
A component mounting system according to claim 23. The component supply unit includes:
A chip supply comprising a head body provided with a recess and provided with a suction hole at the bottom of the recess for sucking a gas present inside the recess, and at least one support protruding from the bottom of the recess. A head, when supplying the component, in a state where the chip supply head is in contact with a position corresponding to the component on the adhesive sheet holding the component on an adhesive surface, the inside of the concave portion through the suction hole. A suction unit that reduces the contact area between the pressure-sensitive adhesive sheet and the component by suctioning a gas present in a region to separate the component from the pressure-sensitive adhesive sheet,
The component mounting system according to claim 1. The component supply unit includes:
A tray body provided with a concave portion in which the component is disposed, at least one support portion protruding from the bottom of the concave portion, and the bottom portion stretched at a position in the concave portion away from the bottom portion; A tray having an adhesive sheet holding the component on the opposite side having adhesiveness, and a communication hole communicating with a region between the bottom of the concave portion and the adhesive sheet,
When supplying the component with the component held on the pressure-sensitive adhesive sheet, the contact area between the pressure-sensitive adhesive sheet and the component is reduced by sucking gas present in the region through the communication hole. Having a suction unit for detaching the component from the pressure-sensitive adhesive sheet,
The component mounting system according to claim 1. The component supply unit includes:
A tray having a tray body provided with a concave portion in which each of the plurality of components is arranged,
A pickup mechanism that cuts out at least one component of the plurality of components from a side of the tray opposite to the plurality of components, so that the at least one component is detached from the tray. ,
A through hole is formed in the tray body from the bottom of the recess in the thickness direction of the tray body,
The pickup mechanism has a component support pin for supporting the component, and at least one component of the plurality of components, the component support pin is inserted into the through hole from a side opposite to the concave side of the tray. Inserting the at least one component into a state of being detached from the tray;
The component mounting system according to claim 1. The component supply unit includes:
A pickup mechanism for cutting out at least one component of the plurality of components;
A second component holding unit configured to hold the at least one component in a non-contact state with the joining surface; wherein the second component holding unit holds the component in a state where the second component holding unit holds the component; And a second component transporter that transports the component to a receiving position of the component transporter.
The component mounting system according to claim 1. The second component holding unit is a Bernoulli chuck,
A component mounting system according to claim 28. The second component holding unit includes a chuck main body in which a flow passage communicating with the component side to be held is formed, a negative pressure generating unit that makes the inside of the flow passage a negative pressure, and the chuck main body vibrated by vibrating the chuck main body. An ultrasonic generator that generates ultrasonic waves between the chuck body and the component,
A component mounting system according to claim 28. The component supply unit further includes:
A sheet holding portion for holding a sheet to which a side opposite to the bonding surface side of each of a plurality of components is attached,
The pickup mechanism may include three or more component support pins or a plurality of elongate components for supporting the at least one component in a horizontal position on a surface where a joining surface of the at least one component is perpendicular to a vertical direction. The at least one part of the sheet, to which the at least one part is adhered, is protruded toward the second part holding part by the part support pin or the part support plate. Is transferred to the second component holding unit,
31. The component mounting system according to claim 29. The component supply unit further includes:
An adsorbing unit is provided for adsorbing a portion of the sheet to which a component other than the at least one component cut out by the pickup mechanism is attached from a side opposite to a side of the sheet to which the at least one component is attached. And
The pickup mechanism is configured to attach the at least one component in the sheet by the component support pin or the component support plate in a state where a portion to which a component other than the at least one component is attached is sucked by the suction unit. Projecting the attached portion toward the second component holding portion,
The component mounting system according to claim 31. The pickup mechanism is configured to support the three or more component support pins in a state where a tip of the three or more component support pins or a plurality of component support plates is pressed against a portion of the sheet to which the at least one component is attached. After the at least one component is peeled off from the sheet by moving a pin or the plurality of component support plates, the at least one component in the sheet is separated by the three or more component support pins or the plurality of component support plates. Protrudes the portion to which is adhered to the second component holding portion side,
The component mounting system according to claim 31 or 32. The pickup mechanism includes the plurality of component support plates, and supports the plurality of component support plates in a state where tips of the plurality of component support plates are pressed against a portion of the sheet to which the at least one component is attached. After rubbing the sheet by moving the plates toward each other, the plurality of component support plates are moved in a direction away from each other, and then the at least one component in the sheet is attached by the component support plate. Projecting the cut portion toward the second component holding portion,
A component mounting system according to claim 33. The pickup mechanism has, with the three or more component support pins, a plurality of peeling pins for facilitating the separation of the component from the sheet, and the tip of the three or more component support pins to the sheet. After pressing the tip portions of the plurality of peeling pins against the portion of the sheet to which the at least one component is adhered while pressing the at least one component on the portion to which the at least one component is adhered, The tip of the above-mentioned component support pin is detached from the sheet, and then the tip of the three or more component support pins is pressed against the portion of the sheet to which the at least one component is stuck. Projecting a portion of the sheet to which the at least one component is adhered by a component support pin toward the first component holding unit;
The component mounting system according to claim 31 or 32. The pick-up mechanism, when protruding a portion of the sheet to which the at least one component is attached toward the first component holding unit, sets the portion of the sheet to which the at least one component is attached to the at least one component. Suction from the side opposite to the one part side,
The component mounting system according to claim 34 or 35. The pickup mechanism has, with the three or more component support pins, a plurality of peeling members for facilitating the peeling of the component from the sheet. By moving the plurality of peeling members in a direction approaching each other in a state where the at least one component in the sheet is pressed against the part to which the three components are attached, the at least one component in the sheet is rubbed by the component support pins after rubbing the sheet. Projecting the adhered portion toward the first component holding portion;
The component mounting system according to claim 31 or 32. The component supply unit or the second component transport unit includes:
A plurality of hooks capable of taking a state of being hooked from a vertically lower side to a periphery of the at least one component and a state of being detached from the at least one component;
When the pickup mechanism cuts out at least one of the plurality of components from among the plurality of components, the plurality of hooks are hooked on a vertically lower peripheral portion of the at least one component from a vertically lower side. A hook driving unit for stopping the plurality of hooks to hold the at least one component.
The component mounting system according to any one of claims 29 to 37. A pressing mechanism that presses a central portion of the component to bend the component such that a central portion of the joining surface of the component protrudes toward the mounting surface compared to a peripheral portion of the joining surface; Further comprising
The component mounting system according to any one of claims 1 to 38. At least one of the mounting surface of the substrate and the bonding surface of the component is surface-activated,
The component mounting system according to any one of claims 1 to 39. A cleaning unit for cleaning the component,
The first component transport unit transports the first component holding unit, which holds the component supplied from the component supply unit, to a cleaning unit delivery position for delivering the component to the cleaning unit, and transfers the cleaning unit. Transporting the first component holding unit that holds the component received at the position to a transfer position where the component is transferred to the head;
The component mounting system according to any one of claims 1 to 40. The first component transporter includes:
A plate that is long and has one end pivoting around the other end located between the component supply unit and the head,
An arm provided on the plate,
The first component holding portion is provided at a tip portion of the arm,
The component mounting system according to any one of claims 1 to 40. A cleaning unit for cleaning the component,
The washing unit is disposed between the component supply unit and the head as viewed from the base point of the plate,
The component mounting system according to claim 42. A component collection unit that collects components that could not be mounted on the mounting surface;
The component collection unit is disposed at a position next to the head in a turning direction of the plate as viewed from the base point of the plate,
The component mounting system according to claim 42 or 43. A component mounting system for mounting components on a board,
A component supply unit that supplies the component,
A cleaning unit for cleaning the component,
A head for holding a side opposite to a bonding surface side of the component to be mounted on the mounting surface of the board at the tip end;
A substrate holding unit that holds the substrate,
While the component cleaned by the cleaning unit is held at the tip of the head, the head is relatively moved in a first direction from the head to the substrate holding unit, and the mounting surface of the substrate is moved. A head drive unit that mounts the component on the mounting surface by contacting the bonding surface of the component with
Component mounting system. A sheet holding unit that holds a sheet attached to a side opposite to a bonding surface side to be bonded to a substrate of each of the plurality of components,
A pickup mechanism for cutting out at least one of the plurality of components from a plurality of components,
The pickup mechanism has three or more component support pins or a plurality of long component support plates, and the tip of the three or more component support pins or the multiple component support plates is attached to the at least one By moving the three or more component support pins or the plurality of component support plates in a state where the component is pressed against the part to which the component is attached, the at least one component is peeled from the sheet, and then the three components are separated. Protruding a portion of the sheet to which the at least one component is adhered by the above component support pins or a plurality of component support plates,
Parts supply equipment. The pickup mechanism includes the plurality of component support plates, and supports the plurality of component support plates in a state where tips of the plurality of component support plates are pressed against a portion of the sheet to which the at least one component is attached. After rubbing the sheet by moving the plates toward each other, the plurality of component support plates are moved in a direction away from each other, and then the at least one component in the sheet is attached by the component support plate. Stick out the part that was
The component supply device according to claim 46. The pickup mechanism has, with the three or more component support pins, a plurality of peeling pins for facilitating the separation of the component from the sheet, and the tip of the three or more component support pins to the sheet. After pressing the tip portions of the plurality of peeling pins against the portion of the sheet to which the at least one component is adhered while pressing the at least one component on the portion to which the at least one component is adhered, The tip of the above-mentioned component support pin is detached from the sheet, and then the tip of the three or more component support pins is pressed against the portion of the sheet to which the at least one component is stuck. Projecting a portion of the sheet to which the at least one component is attached by a component support pin;
The component supply device according to claim 46. The pick-up mechanism, when protruding a portion of the sheet to which the at least one component is attached, moves the portion of the sheet to which the at least one component is attached from a side opposite to the at least one component side. Suction,
The component supply device according to any one of claims 46 to 48. The sheet is an adhesive sheet that holds the component on an adhesive surface,
The surface having the adhesiveness is coated with a material having a reduced adhesive strength when irradiated with ultraviolet rays,
The pickup mechanism, when cutting out at least one component from the plurality of components attached to the sheet, has an ultraviolet irradiation unit that irradiates the sheet with ultraviolet light,
The component supply device according to any one of claims 46 to 49. A component mounting method for mounting components on a board,
Providing the part;
In a state where the component is held by a first component holding unit that holds a second portion different from the first portion on the side opposite to the bonding surface side of the supplied component that is bonded to the mounting surface of the board, Transporting the first component holding unit to a transfer position where the component is transferred to a head;
In a state in which the first component holding unit holding the component is located at the transfer position, a component support unit provided at a tip end of the head and supporting the first portion of the component is connected to the first component. Transferring the component from the first component holding unit to the head by relatively moving the holding unit from the head toward the substrate holding unit holding the substrate in the first direction.
While the component transferred to the head is held at the tip of the head, the head is relatively moved in the first direction to bring the bonding surface of the component into contact with the mounting surface of the substrate. Mounting the component on the mounting surface by causing
Component mounting method. In the step of supplying the component, from among the plurality of components, a third portion different from a first portion on a side opposite to the joining surface side of at least one component of the plurality of components is held. Cut out the parts,
In the step of transporting the first component holding unit to the transfer position, receiving the component while holding the second portion;
A component mounting method according to claim 51. A component mounting method for mounting components on a board,
Providing the part;
In a state where the component is held by a first component holding unit that non-contactly holds a joining surface side of the supplied component that is joined to a mounting surface of the substrate, the first component holding unit is attached to the head by the first component holding unit. Transporting to a transfer position for transferring
In a state in which the component transferred to the head is held at the tip of the head, the head is relatively moved in a first direction from the head to a substrate holding unit that holds the substrate, and the substrate is moved. Mounting the component on the mounting surface by contacting the bonding surface of the component with the mounting surface of
Component mounting method. In the step of supplying the component, at least one component of the plurality of components is cut out from the plurality of components,
The first component holding unit is a Bernoulli chuck that holds the at least one component in a non-contact state with the joining surface.
A component mounting method according to claim 53. In the step of supplying the component, at least one component of the plurality of components is cut out from the plurality of components,
The first component holding unit includes a chuck body in which a flow path communicating with the component to be held is formed, a negative pressure generating unit that makes the inside of the flow path a negative pressure, and vibrating the chuck body. An ultrasonic generator that generates ultrasonic waves between the chuck body and the component; and a non-contact chuck that holds the at least one component in a non-contact state with the joining surface.
A component mounting method according to claim 53. In the step of supplying the component, the second component holding unit holds the first component in a state where the component is held by a second component holding unit that holds the at least one component in a non-contact state with the joining surface. Transporting the component to a position for receiving the component by a component holding unit,
The component mounting method according to any one of claims 53 to 55. The second component holding unit is a Bernoulli chuck that holds the at least one component in a non-contact state with the joining surface.
A component mounting method according to claim 56. The second component holding unit includes a chuck main body in which a flow passage communicating with the component side to be held is formed, a negative pressure generating unit that makes the inside of the flow passage a negative pressure, and the chuck main body vibrated by vibrating the chuck main body. An ultrasonic generator that generates ultrasonic waves between the chuck body and the component; and a non-contact chuck that holds the at least one component in a non-contact state with the joining surface.
A component mounting method according to claim 56. In the step of supplying the component, at least one component of the plurality of components is cut out from the plurality of components,
Before transporting the cut-out at least one component to the transfer position, cleaning the component in a cleaning unit for cleaning the component;
Transporting the component after the cleaning by the cleaning unit to the transfer position,
The component mounting method according to any one of claims 51 to 58. A component mounting method for mounting components on a board,
Providing the part;
Cleaning the component in a cleaning unit for cleaning the component,
While the component cleaned by the cleaning unit is held at the tip of the head, the head is relatively moved in a first direction from the head to a substrate holding unit that holds the substrate, and the substrate is moved. Mounting the component on the mounting surface by contacting the bonding surface of the component with the mounting surface of the
Component mounting method. The plurality of components are attached to a sheet holding the components on an adhesive surface,
The surface having the adhesiveness is coated with a material having a reduced adhesive strength when irradiated with ultraviolet rays,
In the step of supplying the components, when cutting out at least one component from the plurality of components attached to the sheet, irradiating the sheet with ultraviolet light,
The component mounting method according to any one of claims 51 to 60.

Images