JP2019176028A - Electronic component mounting device - Google Patents

Abstract

To provide an electronic component mounting device capable of favorably mounting on a display panel a film-like electronic component supplied via die cutting and a chip-like electronic component supplied from a tray.SOLUTION: An electronic component mounting device includes a delivery device 40 including: a mounting unit on which a first holding head H1 for holding a film-like electronic component supplied from a die cutting supply device 10 or a second holding head H2 for holding a tray T supplied from a tray supply device 20 is mounted; a transfer device 430 for receiving the film-like electronic component held by the first holding head H1 or a chip-like electronic component on the tray held by the second holding head H2 from a common direction to transfer the received component to a mounting device 30; and a movement mechanism 420 for moving the mounting unit on which the first holding head H1 is mounted between the die cutting supply device 10 and the transfer device 430 or moving the mounting unit on which the second holding head H1 is mounted between the tray supply device 20 and the transfer device 430.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component mounting apparatus.

  Liquid crystal displays and organic EL displays are widely used as displays for televisions and personal computers. In the manufacturing process of such a display, there is a panel assembling process in which driving electronic components are mounted on the display panel.

  In this assembly process, a driving driver IC is directly mounted on the display panel, and a film-like electronic component called COF (Chip on Film) in which the driver IC is mounted on a film-like circuit board is displayed on the display panel. Two methods are known, which are implemented in the above.

  The former is called COG (Chip on Glass) mounting because a chip-shaped electronic component such as a driver IC is mounted on a glass substrate constituting a display panel, and the latter is mounted on a glass substrate. For this reason, it is called FOG (Film on Glass) mounting. In addition, a mounting device called a COG mounting device is used for COG mounting, and a mounting device called an OLB (Outer Lead Bonding) device or an FOG mounting device is used for FOG mounting.

  In the process of assembling such a panel, for example, FOG mounting is used for a large liquid crystal panel exceeding 10 inches, and COG mounting is used for a small liquid crystal panel of 10 inches or less. It was done. Therefore, even in a mounting device for mounting electronic components on a liquid crystal panel, an OLB device is used for a large liquid crystal panel, and a COG mounting device is used for a small liquid crystal panel, depending on the size of the liquid crystal panel. Mounting devices were segregated.

JP 2006-60041 A

  By the way, displays such as a liquid crystal display and an organic EL display have been extended to portable terminals such as smartphones and tablet PCs. In recent years, such portable terminals have been improved in functionality, and the display used for these has become higher in resolution and the screen size with respect to the outer size has increased. As the resolution increases, the driver IC used for the resolution must be enlarged. However, on the other hand, the width of the mounting area that can be secured on the outer periphery of the display panel is narrowed by increasing the screen size.

  As a result, it may be difficult to secure an area larger than the outer dimensions of the driver IC as a mounting area on the outer periphery of the display panel. In this case, the driver IC cannot be directly mounted on the display panel. Therefore, FOG mounting, which can be mounted as long as a region for joining electrode portions as a mounting region can be secured, has been adopted in an assembly process of a panel used for a display of a portable terminal.

  For this reason, there is a demand for a mounting apparatus that can selectively perform COG mounting and FOG mounting in the manufacturing process of a display of a portable terminal because the display panel is not the same small size. Here, the COF is punched and supplied from a tape-like member. The driver IC is supplied from the tray. Therefore, such a mounting apparatus needs to be provided with two types of supply devices, that is, a supply device by punching and a supply device by tray.

  Here, as a mounting apparatus provided with a supply device by punching and a supply device by a tray, there is one described in JP-A-2006-060041 (Patent Document 1). According to this mounting apparatus, a tape carrier package (TCP) corresponding to COF is punched and supplied from a tape-like member by a punching supply device. Further, an FPC (Flexible Printed Circuit) that has been molded in a predetermined shape is supplied from a tray supply device. That is, a film-like electronic component is supplied from any supply device.

  However, when the driver IC is supplied from the supply device using the tray of the mounting device having such a configuration and mounted on the display panel, the driver IC mounted on the display panel has a defect such as a crack or a chip. There was a bug that existed.

  An object of the present invention is to provide an electronic component mounting apparatus capable of satisfactorily mounting a film-shaped electronic component supplied by punching and a chip-shaped electronic component supplied from a tray on a display panel. .

  In order to achieve the above object, an electronic component mounting apparatus according to the present invention includes a punching supply device for supplying a film-like electronic component punched from a thin plate-like member, and a tray for supplying a tray in which chip-like electronic components are accommodated. A feeding device, a mounting device for mounting the film-like electronic component or the chip-like electronic component on a display panel, and receiving the film-like electronic component from the punching and feeding device or receiving a chip-like electronic component from the tray feeding device A delivery device that receives and delivers to the mounting device, and the delivery device is supplied from the first holding head or the tray supply device that holds the film-like electronic component supplied from the punching supply device A mounting portion on which a second holding head for holding the tray to be mounted is mounted, the film-like electronic component held by the first holding head, or the second holding head. A transfer device that receives chip-shaped electronic components on a tray held by a head from a common direction and passes them to the mounting device; a mounting portion to which the first holding head is mounted; Or a moving mechanism for moving the mounting portion on which the second holding head is mounted between the tray supply device and the transfer device.

  The mounting portion may be configured such that the first holding head and the second holding head can be exchanged. You may have the detection part which detects whether the member with which the said mounting part was mounted | worn is a said 1st holding head or a said 2nd holding head.

  The first holding head holds the film-like electronic component punched by the punching and feeding device from below, and the second holding head holds the tray from the tray feeding device and the chip-like electronic component. You may hold | maintain from the downward direction opposite to the surface which accommodated components. The transfer device may include a rotary head that receives and inverts the chip-shaped electronic component.

  The transfer device includes: a first arm that transfers the film-like electronic component received from the first holding head; and a cleaning device that cleans the film-like electronic component during transfer by the first arm. You may have.

  The transfer device receives the film-shaped electronic component cleaned by the cleaning device from the first arm and passes it to the mounting device, or the chip from above the tray held by the second holding head. A second arm that receives the electronic component and passes it to the mounting apparatus. The second arm has a rotary head that reverses the chip-like electronic component, and the film-like electronic component received from the first arm is transferred to the mounting apparatus without being inverted, and the second holding The chip-shaped electronic component received from the tray held by the head may be reversed before being delivered to the mounting apparatus.

  The present invention can satisfactorily mount a film-like electronic component supplied by punching and a chip-like electronic component supplied from a tray on a display panel.

It is a perspective view which shows the film-form electronic component (A) and chip-shaped electronic component (B) crimped | bonded by embodiment. It is a simplified top view which shows the whole structure of the electronic component mounting apparatus of embodiment. It is explanatory drawing (A) which shows the process of mounting the film-shaped electronic component of the electronic component mounting apparatus of embodiment, and explanatory drawing (B) which shows the process of mounting a chip-shaped electronic component. It is explanatory drawing which shows before punching (A) and after punching (B) of a punch supply apparatus. It is explanatory drawing which shows the tray reception process of a tray supply apparatus. It is a top view which shows the moving mechanism of embodiment. It is a side view which shows the moving mechanism of embodiment. It is a perspective view which shows a 1st holding head and a 2nd holding head. It is a side view which shows the detection part of embodiment. It is a block diagram which shows the control apparatus of embodiment. It is a flowchart which shows the mounting procedure of a film-form electronic component. It is a flowchart which shows the mounting procedure of a chip-shaped electronic component.

  Embodiments of the present invention (hereinafter referred to as the present embodiments) will be specifically described with reference to the drawings. The drawings schematically show each member and each component, and do not accurately show the dimensions, intervals, and the like.

[Mounted parts and mounting objects]
The mounting target according to the present embodiment is a film-like electronic component F as shown in FIG. 1A and a chip-like electronic component C as shown in FIG. The film-like electronic component F is a component in which an electrode is exposed while the electronic component is sealed in a flexible resin film. This film-like electronic component F is prepared as a component to be mounted by individually punching a plurality of sheet-like or tape-like thin plate-like members.

  The chip-shaped electronic component C is a driver IC. The chip-shaped electronic component C is prepared by being mounted on a tray T (see FIG. 3) in a state where it is individually separated into products.

  The mounting target of the film-like electronic component F and the chip-like electronic component C is a component that is electrically connected to the electrodes of the film-like electronic component F and the chip-like electronic component C. In the present embodiment, the mounting target is the display panel D constituting the display device. That is, a member having a display function and electrodes.

[Electronic component mounting equipment]
[overall structure]
The overall configuration of the electronic component mounting apparatus according to the present embodiment will be described with reference to FIGS. As shown in FIG. 2, the electronic component mounting apparatus includes a punching supply device 10, a tray supply device 20, a mounting device 30, a delivery device 40, and a control device 80. As shown in FIG. 2, the punching and supplying device 10 is a device that punches the film-like electronic component F from the thin plate member ST and supplies the film-like electronic component F. The tray supply device 20 is a device that supplies a tray T in which chip-shaped electronic components C are accommodated.

  The mounting device 30 is a device that crimps the film-shaped electronic component F or the chip-shaped electronic component C to the display panel D to be mounted. The delivery device 40 is a device that receives the film-shaped electronic component F from the punching supply device 10 or receives the chip-shaped electronic component C from the tray supply device 20 and passes it to the mounting device 30. The first holding head H <b> 1 is used for delivery of the film-like electronic component F from the punching supply device 10 to the mounting device 30. The second holding head H <b> 2 is used for transferring the chip-shaped electronic component C from the tray supply device 20 to the mounting device 30. The 1st holding head H1 and the 2nd holding head H2 are provided in the delivery apparatus 40 so that attachment or detachment is possible.

  The control device 80 is a device that controls the punching supply device 10, the tray supply device 20, the mounting device 30, and the delivery device 40. The control device 80 is configured by, for example, a dedicated electronic circuit or a computer that operates with a predetermined program. The control device 80 is programmed with the control content of each part, and the program is executed by a processing device such as a PLC or a CPU.

  In the plane parallel to the installation surface of the electronic component mounting apparatus, the straight line from the punching supply apparatus 10 and the tray supply apparatus 20 to the mounting apparatus 30 is defined as the Y direction, and one direction orthogonal thereto is defined as the X direction. An axis along the Y axis is an X axis along the X direction. The XY plane formed by the Y-axis and the X-axis is parallel to the film-like electronic component F, the chip-like electronic component C, the display panel D, and each plane that supports this. In the following description, the XY plane may be referred to as a horizontal plane.

  Further, a direction orthogonal to the XY plane and upward from the installation surface is defined as a Z direction, and an axis along the Z direction is defined as a Z axis. When the installation surface is horizontal, the Z axis is the vertical direction. The Z-axis is perpendicular to the film-like electronic component F, the chip-like electronic component C, the display panel D, and each plane that supports it. In the following description, the Z direction is upward and the opposite direction is downward. Further, the rotation direction parallel to the XY plane with the Z axis as the center is defined as the θ direction, and the rotation direction perpendicular to the XY plane with the Y axis as the center is defined as the α direction. These directions are expressions for describing the positional relationship of each component of the electronic component mounting apparatus, and do not limit the positional relationship and direction when installed on the installation surface.

[Causes of defective electronic components]
The inventor tried an experiment in which a driver IC, which is a chip-shaped electronic component C, was supplied from a tray supply device using a mounting device having a configuration similar to that of Patent Document 1 and mounted on a display panel. As a result, it has been discovered that among driver ICs mounted on a display panel, there are driver ICs in which defects such as cracks and chips have occurred.

  Therefore, the inventor closely observed the process from when the driver IC was taken out of the tray and mounted on the display panel. As a result, it was found out that the defect of the driver IC occurred not during the mounting of the driver IC on the display panel but during the transfer to the position where the mounting was performed.

  That is, in the mounting apparatus having the configuration of Patent Document 1, the driver IC is transferred from the transport tray to the reverse tray by the transfer robot, and is disposed on the transfer tray by the reverse of the reverse tray. Thereafter, the film is delivered by the first pickup to the first turntable which is also used for transferring the punched film-like component.

  Furthermore, it is transported to the delivery position for the second turntable provided with the mounting head and delivered to the mounting head. In this way, the driver IC reaches the mounting head after many passes.

  On the other hand, even though the driver IC is larger, silicon is a brittle material having a thickness of several tens to several hundreds of μm, a width of several mm, and a length of ten to several tens of mm. Since it is mainly composed of crystals, it is vulnerable to impact. As described above, when the delivery is repeated several times, the driver IC is sandwiched between the held member and the delivered member. At this time, the driver IC receives a considerable impact. In this way, it is presumed that the fatigue caused by this impact is accumulated and the defect is caused by the repeated delivery.

  As described above, in a conventional apparatus in which TCP and FPC are mounted on a display panel using a common apparatus, there is a possibility that inconvenience may occur in a product simply by replacing the FPC with a chip-shaped electronic component. Therefore, the inventor came up with the present invention as a result of intensive studies. Details of the electronic component mounting apparatus will be described below.

[Punching supply device]
As shown in FIGS. 2 and 4, the punching supply device 10 includes a supply unit 110, a table 120, a mold 130, and a lifting mechanism 140. The supply unit 110 includes a reel around which the thin plate member ST on which the electronic component is formed, and is a mechanism that sequentially feeds out the punched portions of the electronic component (see FIG. 2). For this reason, the supply unit 110 is provided with a rotation center of the reel, a shaft that bears the rotation axis of the reel, and a feed roller that feeds the thin plate member ST.

  The table 120 is a table that supports the surface of the mold 130. The mold 130 has a die 131 and a punch 132. The die 131 is a flat plate member having a flat surface on which the thin plate member ST sent out from the supply unit 110 is placed and having a punched hole 131a. The punch hole 131a is a through hole that substantially matches the outer shape of the film-like electronic component F. The die 131 is fixed to the upper surface of the table 120, and the table 120 is provided with an opening 120a which is a through hole larger than the punch hole 131a at a position corresponding to the punch hole 131a.

  The punch 132 is a substantially rectangular parallelepiped die having an outer edge substantially coinciding with the inner edge of the punch hole 131a. The bottom surface of the punch 132 moves toward the thin plate member ST placed on the die 131 and moves along the Z axis until it is inserted into the punched hole 131a, so that the film-like electronic component F is removed from the thin plate member ST. Punch out. Although not shown, a suction hole connected to a pneumatic circuit is formed on the bottom surface of the punch 132, and the cut-out film-shaped electronic component F is sucked and held by a negative pressure.

  The lifting mechanism 140 is a mechanism for punching the film-like electronic component F by moving the punch 132 along the Z axis. The elevating mechanism 140 has a support part 141 and a drive part 142. The support part 141 is a structural part that supports the punch 132 so as to be movable up and down. The support part 141 includes a support post 141a and a support plate 141b. The support post 141 a is four rod-like members raised on the die 131. The support plate 141b is a plate-like body attached to the upper end of the support post 141a in parallel to the upper surface of the die 131.

  The drive unit 142 is a device that is connected to the punch 132 and drives the punch 132 in a direction in which the punch 132 contacts and separates from the die 131. An air cylinder or the like can be used as a drive source of the drive unit 142. The drive unit 142 has a shaft 142a. The shaft 142a is connected to the drive source and is connected to the punch 132 through the support plate 141b. As the shaft 142a is moved up and down by the drive source, the punch 132 punches out the film-like electronic component F.

  The moving end below the punch 132 is a receiving position for the first holding head H1. That is, the punch 132 reaches the position where the first holding head H1 can receive and stops, while sucking and holding the film-like electronic component F that has been punched down and punched.

  As shown in FIG. 2, the punching supply device 10 as described above is provided in a pair on the left and right along the X axis in a plan view. One punching supply device 10a and the other punching supply device 10b are disposed at positions sandwiching a transfer device 430, which will be described later, in plan view. Hereinafter, when the punching supply devices 10a and 10b are not distinguished, the punching supply device 10 is used.

[Tray supply device]
As shown in FIG. 5, the tray supply device 20 includes a frame 210 and a gripping part 220. The frame 210 is a pair of parallel long members. The distance between the pair of frames 210 approximates the width of the tray T, but the tray T can pass up and down. The gripping part 220 is provided on the opposite side surface of the frame 210, and is provided so as to be able to advance and retreat in a direction in which it is in contact with and away from the side surface of the tray T by a driving mechanism (not shown).

  In the tray supply device 20, one tray T is gripped by the gripping section 220, and a plurality of trays T are stacked on the tray T (FIG. 5A). The lower surface of the lowermost tray T is a surface opposite to the surface in which the chip-shaped electronic component C is accommodated, and serves as a receiving position for a second holding head H2, which will be described later (FIG. 5B).

  The tray supply device 20 as described above is provided in a pair on the left and right along the X axis in a plan view. One tray supply device 20a and the other tray supply device 20b are provided at positions sandwiching a transfer device 430 described later in plan view. Hereinafter, when the tray supply devices 20a and 20b are not distinguished, the tray supply device 20 is used.

[Mounting equipment]
As shown in FIGS. 2 and 3, the mounting device 30 is a device that heat-presses the electrode of the film-like electronic component F or the electrode of the chip-like electronic component C to the electrode of the display panel D via the ACF. is there. An ACF (Anisotropic Conductive Film) is a sheet-like member in which a large number of small conductive particles are contained in a resin serving as a base material.

  The mounting apparatus 30 includes a table 310 and a pressure bonding part 320. The table 310 is a horizontal plate-like body on which the display panel D is placed. Although not shown, a suction hole connected to a pneumatic circuit is formed on the upper surface of the table 310, and the display panel D is sucked and held by a negative pressure. The table 310 is provided so as to be movable in the direction along the X axis and the Y axis and in the θ direction by a drive mechanism (not shown).

  As shown in FIG. 3, the crimping part 320 includes a pressure member 321 and a backup 322. The pressurizing member 321 superimposes the film-like electronic component F or the chip-like electronic component C on the display panel D supported by the table 310 by a driving mechanism (not shown), and heats and pressurizes. The pressing member 321 sucks and holds the film-like electronic component F or the chip-like electronic component C by a holding unit (not shown) and is heated by a heating device (not shown). The backup 322 is a member that sandwiches the display panel D and the film-like electronic component F or the chip-like electronic component C via the ACF (not shown) between the pressure member 321.

  The crimping part 320 is an apparatus for performing temporary crimping before performing final crimping. Although not shown in the figure after the temporary press-bonding by the press-bonding section 320, the main press-bonding by the main press-bonding section arranged in the downstream process is performed.

[Delivery device]
2 and 3, the delivery device 40 receives the film-like electronic component F from the punching and feeding device 10 or receives the tray T from the tray feeding device 20 and receives the chip-like electronic component C from the tray T. It is a device that receives and passes it to the mounting device 30. As shown in FIGS. 3 and 6, the delivery device 40 includes a mounting unit 410, a moving mechanism 420, a transfer device 430, and a detection unit 440.

(Mounting part)
The first holding head H1 or the second holding head H2 is attached to and detached from the mounting portion 410. The mounting portion 410 includes a placement portion 411 and a locking portion 412. The mounting portion 411 is a columnar member on which the first holding head H1 or the second holding head H2 is mounted. The locking portion 412 is a plurality of pins erected from the upper surface of the placement portion 411.

  The first holding head H1 and the second holding head H2 that are attached to and detached from the mounting portion 410 will be described with reference to FIG. The first holding head H1 holds the film-like electronic component F supplied from the punching supply device 10 (see FIG. 3). The first holding head H <b> 1 includes a holding part 51, a connection part 52, and a support part 53. The holding part 51 is a substantially rectangular parallelepiped member whose longitudinal direction corresponds to the side where the electrodes of the film-like electronic component F are arranged. Although not shown, a suction hole connected to a pneumatic circuit is formed on the upper surface of the holding part 51, and the punched film electronic component F is sucked and held by a negative pressure.

  The connection part 52 is a substantially rectangular parallelepiped member placed on the mounting part 410. Although not shown, a hole into which the locking portion 412 is inserted is provided on the bottom surface of the connection portion 52. The column portion 53 is a substantially rectangular parallelepiped member that rises from the upper surface of the connection portion 52 and supports the bottom portion of the holding portion 51.

  The second holding head H2 holds the tray T supplied from the tray supply device 20 (see FIG. 3). The second holding head H <b> 2 includes a holding part 61, a connection part 62, and a support part 63. The holding portion 61 has a substantially rectangular parallelepiped shape in which the outer edge of the upper surface is larger than the outer edge of the tray T. Although not shown, a suction hole connected to a pneumatic circuit is formed on the upper surface of the holding portion 61, and the tray T is sucked and held by a negative pressure.

  Note that the bottom surface of the tray T may be provided with an uneven shape from the viewpoint of preventing static electricity. In this case, since there is a possibility that a sufficient suction force cannot be obtained at the concavo-convex part, it is preferable to avoid the concavo-convex part and form the suction hole at a position corresponding to the flat surface. For example, suction holes are provided at positions corresponding to the edge of the bottom surface of the tray T to ensure stable suction.

  The connection part 62 is a substantially rectangular parallelepiped member placed on the mounting part 410. Although not shown, a hole into which the locking portion 412 is inserted is provided on the bottom surface of the connection portion 62. That is, the connection parts 52 and 62 of the first holding head H1 and the second holding head H2 have a common configuration so that they can be attached to and detached from the common mounting part 410. The support column 63 is a substantially rectangular parallelepiped member that rises from the upper surface of the connection unit 62 and supports the bottom of the holding unit 61.

(Movement mechanism)
The moving mechanism 420 moves the mounting portion 410 on which the first holding head H1 is mounted between the punching supply device 10 and a transfer device 430 described later. Alternatively, the moving mechanism 420 moves the mounting portion 410 to which the second holding head H2 is mounted between the tray supply device 20 and the transfer device 430.

  The moving mechanism 420 drives the mounting portion 410 to which the first holding head H1 or the second holding head H2 is mounted in a direction parallel to the X axis, the Y axis, and the Z axis, and the θ direction. For this reason, the moving mechanism 420 includes driving units 421, 422, 423, and 424 as shown in FIGS. The drive unit 421 is a mechanism for driving a slider 421b that moves along a pair of linear guides 421a in the X-axis direction by a ball screw 421d that is rotated by a motor 421c. That is, the nut body 421e integral with the slider 421b is assembled to the ball screw 421d, and the slider 421b integral with the nut body 421e moves integrally according to the rotation of the ball screw 421d by the motor 421c. The drive unit 422 is provided so as to overlap the slider 421b of the drive unit 421, and moves along a linear guide in the Y-axis direction (not shown), and a ball screw 422c that is rotated by a motor 422b. Is a driving mechanism.

  The drive unit 423 is provided integrally with the slider 422a of the drive unit 422, and a slider 423a (see FIG. 9) that moves along a linear guide in the Z-axis direction (not shown) is rotated by a motor (not shown). The screw is driven. The drive unit 424 is provided integrally with the slider 423a of the drive unit 423, and rotates the mounting unit 410 in the θ direction by a drive shaft that is rotated by the motor 424a.

  A pair of the moving mechanisms 420 as described above are provided below the transfer device 430 described later and in the X-axis direction with the transfer device 430 interposed therebetween. That is, the moving mechanism 420a is provided corresponding to one punching supply device 10a and the tray supply device 20a, and the moving mechanism 420b is provided corresponding to the other punching supply device 10b and the tray supply device 20b. A pair of the first holding head H1 and the second holding head H2 are prepared corresponding to the moving mechanisms 420a and 420b, respectively. That is, the first holding head H1a or the second holding head H2a is attached to and detached from the mounting portion 410 of the moving mechanism 420a, and the first holding head H1b or the second holding head H2b is attached to the mounting portion 410 of the moving mechanism 420b. Is removed.

  The movable range A1 of the moving mechanism 420a is a region below the punching supply device 10a, the tray supply device 20a, the transfer device 430, and the mounting device 30, as shown by a one-dot chain line in FIG. The movable area A2 of the moving mechanism 420b is an area below the punching supply device 10b, the tray supply device 20b, the transfer device 430, and the mounting device 30. Hereinafter, when the movement mechanisms 420a and 420b are not distinguished, they are referred to as the movement mechanism 420.

(Transfer device)
As shown in FIG. 2, the transfer device 430 receives the chip-like electronic component C from the film-like electronic component F held by the first holding head H1 or the tray T held by the second holding head H2, and mounts it. 30. The transfer device 430 receives the film-like electronic component F from the first holding head H <b> 1, passes it to the mounting device 30, and the film-like electronic component F is mounted on the display panel D in the mounting device 30.

  Further, the transfer device 430 receives the chip-shaped electronic component C from the tray T held by the second holding head H <b> 2, passes it to the mounting device 30, and the chip-shaped electronic component C is mounted on the display panel D in the mounting device 30. Is done.

  As illustrated in FIGS. 2 and 3, the transfer device 430 includes a first arm 431, a cleaning device 432, and a second arm 433. The first arm 431 is a long member provided to be rotatable on a plane parallel to the XY plane by a drive source such as a motor (not shown). One end of the first arm 431 is fixed to a rotation shaft of a drive source (not shown). At the tip of the first arm 431, a suction nozzle 431a connected to a pneumatic circuit is provided. The suction nozzle 431a sucks and holds the film-like electronic component F held by the first holding head H1 from above by the negative pressure generated by the vacuum source of the pneumatic circuit.

  The first arm 431 rotates intermittently by 90 °. More specifically, when viewed from the rotation axis of the first arm 431, when the Y direction side where the punching supply device 10 is located is set to the 12 o'clock direction of the watch, the 12 o'clock position, the 3 o'clock position, Intermittent rotation is performed clockwise or counterclockwise so as to stop at the 6 o'clock position and the 9 o'clock position. When the film-like electronic component F is supplied by the first holding head H1a attached to the moving mechanism 420a, the first arm 431 receives the film-like electronic component F at the 9 o'clock position, , Intermittent rotation in the order of 6 o'clock. On the other hand, when the film-like electronic component F is supplied by the first holding head H1b attached to the moving mechanism 420b, the film-like electronic component F is received at the 3 o'clock position, and the time is 12:00, 9 o'clock, 6 o'clock It rotates intermittently in order.

  The cleaning device 432 is disposed below the first arm 431 at the aforementioned 12 o'clock position. The cleaning device 432 is a device that removes dust and the like attached to the electrode portions of the punched film-like electronic component F. The cleaning device 432 includes a brush 432a. The brush 432a is provided to be rotatable about a shaft in the X-axis direction by a drive source such as a motor (not shown). The brush 432a is provided so as to be movable in an approaching and separating direction with respect to a passing point of an electrode portion of the film-like electronic component F held by the first arm 431 by a driving mechanism (not shown).

  The second arm 433 is disposed between the first arm 431 and the mounting apparatus 30. The second arm 433 is a long member provided to be rotatable on a plane parallel to the XY plane by a drive source such as a motor. One end of the second arm 433 is fixed to a rotation shaft of a drive source (not shown). A rotary head 433 a is provided at the tip of the second arm 433. The rotary head 433a is provided so as to be rotatable in the α direction with the longitudinal direction of the second arm 433 as an axis. The second arm 433 performs intermittent rotation by 180 °. More specifically, intermittent rotation is performed clockwise or counterclockwise so as to stop at the 12 o'clock position and the 6 o'clock position.

  The rotary head 433a is provided with a suction nozzle 433b extending along the radial direction of the rotary circle. Although not shown, the suction nozzle 433b is connected to a pneumatic circuit, and sucks and holds the film-like electronic component F or the chip-like electronic component C by a negative pressure from a vacuum source. The direction of the tip of the suction nozzle 433b is converted by 180 ° by the rotary head 433a. That is, the second arm 433 is configured as a reverse transfer device that can reverse the received component.

  For this reason, the suction nozzle 433b sucks and holds the electrode portion from below so that the electrode portion of the film-like electronic component F held by the suction nozzle 431a of the first arm 431 faces downward. Further, the suction nozzle 433b sucks and holds the non-electrode portions one by one with the electrode portion of the chip-shaped electronic component C facing upward from above the tray T held by the second holding head H2. Pick up. That is, the punching supply device 10 punches the film-like electronic component F so that the electrode portion faces downward, and the first holding head H1 has the electrode portion below the film-like electronic component F punched by the punching supply device 10. With the posture facing the direction, it is held from below and transferred to the first arm 431. The suction nozzle 431a of the first arm 431 sucks and holds the film-like electronic component F held from below by the first holding head H1. Therefore, when the suction nozzle 433b receives the film-like electronic component F from the suction nozzle 431a, the film-like electronic component F is held from above by the suction nozzle 431a with the electrode portion facing downward. 433b sucks and holds the electrode portion from below. Further, since the chip-like electronic component C is accommodated in the tray T held by the second holding head H2, the suction nozzle 433b serves as a non-electrode of the chip-like electronic component C. Adsorb and hold the part from above.

  When the suction nozzle 433b sucks and holds the film-like electronic component F, the rotary head 433a turns the electrode portion of the film-like electronic component F downward until it reaches the mounting device 30. That is, in this case, the rotary head 433a is not reversed. When the suction nozzle 433b sucks and holds the chip-shaped electronic component C, the rotary head 433a turns the electrode portion of the chip-shaped electronic component C downward until it reaches the mounting device 30. That is, in this case, the rotary head 433a is reversed.

(Detection unit)
The detection unit 440 is a component that detects whether the first holding head H1 is mounted on the mounting unit 410 or whether the second holding head H2 is mounted. The detection unit 440 of the present embodiment uses a beam sensor 441 arranged at a height position corresponding to the connection units 52 and 62 attached to the attachment unit 410. The beam sensor 441 is a sensor that detects the presence or absence of a target based on the presence or absence of reception of reflected light of emitted light such as a laser.

  The beam sensor 441 is provided on a support column 442 (see FIG. 9) disposed in the movable range A1 and A2 and at a position between the punching supply device 10 and the tray supply device 20. In other words, the mounting unit 410 detects which of the first holding head H1 and the second holding head H2 is mounted by moving to a detection position set in advance with respect to the detection unit 440. . The position of the beam sensor 441 is such that reflected light cannot be received when the first holding head H1 is mounted on the mounting portion 410, but is reflected from the holding portion 61 when the second holding head H2 is mounted. The position where light can be received. Thereby, it can be detected that the second holding head H2 is mounted, and otherwise it can be detected that the first holding head H1 is mounted. For example, in the present embodiment, a sensor dog (not shown) that reflects the emitted light of the beam sensor 441 only at the connection portion 62 of the second holding head H2 that faces the beam sensor 441 at the detection position. Is provided. That is, the sensor dog is not provided in the connection portion 52 of the first holding head H1. With this configuration, since the beam sensor 441 receives reflected light only when the mounting portion 410 to which the second holding head H2 is mounted is positioned at the detection position, the first holding head H1, It is possible to determine which of the two holding heads H2 is mounted. The attachment position of the beam sensor 441 and the attachment method of the sensor dog are not limited to this. The beam sensor 441 may be arranged according to the heights of the holding portions 51 and 61 and the column portions 53 and 63, and sensor dogs are provided at different positions in the first holding head H1 and the second holding head H2. Based on the difference in position of the mounting portion 410 when the beam sensor 441 receives the reflected light, it is possible to determine whether the mounting is the first holding head H1 or the second holding head H2. good.

[Control device]
As shown in FIG. 10, the control device 80 includes a mechanism control unit 81, a mode switching unit 82, a storage unit 83, and an input / output control unit 84. The mechanism control unit 81 controls the operation of each unit of the punching supply device 10, the tray supply device 20, the mounting device 30, and the delivery device 40. The mode switching unit 82 switches between a mode for mounting the film-like electronic component F and a mode for mounting the chip-like electronic component C according to the detection signal from the detection unit 440. The storage unit 83 stores information necessary for the control of the present embodiment, such as a program and data for realizing each unit described above. The input / output control unit 84 is an interface for controlling signal conversion and input / output with each unit to be controlled.

Further, an input device 91 and an output device 92 are connected to the control device 80. The input device 91 is input means such as a switch, a touch panel, a keyboard, and a mouse for an operator to operate the electronic component mounting apparatus via the control device 80. The output device 92 is output means such as a display device that makes information for confirming the state of the electronic component mounting apparatus visible to the operator.

[Operation]
The operation of the present embodiment as described above will be described separately for the case where the film-like electronic component F is mounted and the case where the chip-like electronic component C is mounted.

(Mounting of film-like electronic components)
First, the procedure for mounting the film-like electronic component F will be described with reference to the flowcharts of FIGS. The first holding head H1 is attached to the attachment unit 410 (step S101). The mounting unit 410 moves to a preset detection position. Then, the detection unit 440 detects that the first holding head H1 is attached, that is, the second holding head H2 is not attached (step S102). The mode switching unit 82 switches the control by the control device 80 to the mode for mounting the film-like electronic component F (step S103).

  The moving mechanism 420 moves the first holding head H1 mounted on the mounting unit 410 so as to come directly under the punching supply device 10 (step S104). In the punching supply device 10, the film-like electronic component F is punched (step S105). The punched film-like electronic component F is lowered while being sucked by the punch 132, and is sucked by the holding portion 51 of the first holding head H1 while releasing the suction. Thereby, the first holding head H1 receives the film-shaped electronic component F (step S106).

  The moving mechanism 420 moves the first holding head H1 that has received the film-like electronic component F to the lower part of the suction nozzle 431a at the end of the first arm 431 (step S107). That is, the moving mechanism 420 moves the first holding head H1 so that the film-like electronic component F is located immediately below the suction nozzle 431a of the first arm 431 positioned at the above-mentioned 9 o'clock position. The film-shaped electronic component F is transferred to the first arm 431 by releasing the suction of the holding portion 51 of the first holding head H1 and performing suction by the suction nozzle 431a (step S108).

  The first arm 431 rotates to the 12 o'clock position to clean the edge of the electrode portion of the film-like electronic component F by bringing it into contact with the raised brush 432a (step S109). Further, by rotating the first arm 431, it is positioned at the 6 o'clock position, and the film-like electronic component F is moved to the upper part of the suction nozzle 433b of the second arm 433 waiting at the 12 o'clock position ( Step S110).

  Then, the suction of the first arm 431 by the suction nozzle 431a is canceled and the suction by the suction nozzle 433b is performed, so that the film-shaped electronic component F is transferred to the second arm 433 (step S111).

  The second arm 433 rotates the XY plane by 180 ° to move the film-like electronic component F to the crimping part 320 of the mounting apparatus 30 (step S112). While releasing the suction by the suction nozzle 433 b of the second arm 433 and performing suction by the pressure member 321, the film-like electronic component F is held on the pressure member 321. Then, the electrode of the film-like electronic component F is heat-bonded to the electrode of the display panel D via the ACF (Step S113). The display panel D on which the suction by the pressurizing member 321 is released and the film-like electronic component F is temporarily press-bonded is transported to the main press-bonding section and subjected to the main press-bonding.

  The supply of the film-shaped electronic component F is first performed by one punching supply device 10a and the moving mechanism 420a. Then, when the thin plate-like member ST of the supply unit 110 of the punching supply device 10a disappears, the film-like electronic component F is continuously supplied by switching to the other punching supply device 10b and the moving mechanism 420b. In the meantime, when the reel of the thin plate member ST of the punching supply device 10a is exchanged and the thin plate member ST of the other punching supply device 10b is removed, the film-like electronic component by the punching supply device 10a and the moving mechanism 420a again. Switch to F supply. As a result, the mounting can be continued without stopping the electronic component mounting apparatus.

(Mounting chip electronic components)
Next, a procedure for mounting the chip-shaped electronic component C will be described with reference to the flowcharts of FIGS. 3B, 5 and 12. First, the first holding head H1 is removed from the mounting portion 410, and the second holding head H2 is mounted (step S201). The mounting unit 410 moves to a preset detection position. Then, it is detected by the detection unit 440 that the second holding head H2 is attached (step S202). The mode switching unit 82 switches the control by the control device 80 to the mode for mounting the chip-shaped electronic component C (step S203).

  As shown in FIG. 5A, the moving mechanism 420 moves the second holding head H2 mounted on the mounting unit 410 so as to come directly below the tray supply device 20 (step S204). In the tray supply device 20, as shown in FIG. 5B, the holding unit 61 of the second holding head H2 contacts and holds the bottom surface of the lowermost tray T (step S205). Then, the holding unit 61 of the second holding head H2 receives the tray T by the following procedure (step S206).

  As shown in FIG. 5C, the tray supply device 20 releases the grip by the grip portion 220. Then, as shown in FIG. 5D, the second holding head H2 is lowered by one tray T. As shown in FIG. 5E, the gripping unit 220 grips the tray T that is one level above the lowest layer by the gripping unit 220. As shown in FIG. 5F, the second holding head H <b> 2 is lowered and the tray T is transferred to the holding unit 61.

  The moving mechanism 420 moves the second holding head H2 that has received the tray T to the lower part of the suction nozzle 433b of the second arm 433 (step S207). That is, the moving mechanism 420 moves the second holding head H2 so that the tray T is positioned below the suction nozzle 433b of the second arm 433 positioned at the above-mentioned 12 o'clock position. The suction nozzle 433b of the second arm 433 faces the tray T held by the second holding head H2 by the rotation of the rotary head 433a (step S208). At this time, the first arm 431 stands by at a position other than the 6 o'clock position, for example, at the 12 o'clock position.

  The moving mechanism 420 scans the tray T held by the second holding head H <b> 2, so that each chip-like electronic component C on the tray T is sequentially placed at a position facing the suction nozzle 433 b of the second arm 433. Positioning is performed (step S209). More specifically, the tray T is provided with each accommodating portion partitioned in a lattice shape, and the chip-shaped electronic component C is accommodated in these accommodating portions. Therefore, each housing portion is located at a position where the suction nozzle 433b of the second arm 433 receives the chip-shaped electronic component C, that is, a position immediately below the suction nozzle 433b when the second arm 433 stops at the 12 o'clock position. Are sequentially positioned. And if one accommodating part on the tray T is positioned, the chip | tip electronic component C will be handed over to the 2nd arm 433 by starting the adsorption | suction by the adsorption | suction nozzle 433b (step S210).

  The second arm 433 rotates the XY plane by 180 ° to move the chip-shaped electronic component C to the crimping part 320 of the mounting apparatus 30 (step S211). In the middle of this movement, the rotary head 433a rotates in the α direction and reverses so that the electrode of the chip-like electronic component C faces downward (step S212). The pressure member 321 holds the chip-shaped electronic component C by releasing the suction by the suction nozzle 433 b of the second arm 433 and performing suction by the pressure member 321 of the crimping part 320. Then, the electrode of the chip-shaped electronic component C is heat-pressed to the electrode of the display panel D via the ACF (Step S213). The display panel D on which the suction by the pressing member 321 is released and the chip-shaped electronic component C is temporarily bonded is conveyed to the main pressing portion and subjected to the main pressing.

  When the chip-shaped electronic component C is removed from one tray T, the moving mechanism 420 accommodates the second holding head H2 holding the empty tray T in the empty tray prepared in the tray supply device 20. The tray T is delivered. Then, as described above, the moving mechanism 420 causes the second holding head H2 to receive the tray T containing the chip-shaped electronic component C and mounts the chip-shaped electronic component C. The empty tray T accommodating portion can be provided, for example, at a position adjacent to the tray supply device 20 with the same configuration as the tray supply device 20. By configuring in this way, the procedure is the same as that of the tray supply device 20, that is, the steps (F), (E), (D), (C), (B), and (A) in FIG. The trays T can be stacked and accommodated.

  Such supply of the tray T is first performed by the one tray supply device 20a and the moving mechanism 420a. When the tray T containing the chip-shaped electronic component C is removed from the tray supply device 20a, the tray T is continuously supplied by switching to the other tray supply device 20b and the moving mechanism 420b. In the meantime, when the tray T of the tray supply device 20a is replaced and the tray T of the other tray supply device 20b runs out, the tray T is again switched to supply of the tray T by the tray supply device 20a and the moving mechanism 420a. As a result, the mounting can be continued without stopping the electronic component mounting apparatus.

[Function and effect]
The operational effects of the present embodiment as described above are as follows.
(1) In the present embodiment, a punching supply device 10 that supplies a film-like electronic component F punched from a thin plate member ST, a tray supply device 20 that supplies a tray T in which chip-like electronic components C are accommodated, The mounting device 30 for mounting the film-like electronic component F or the chip-like electronic component C on the display panel D to be mounted, and the film-like electronic component F received from the punching supply device 10 or the chip-like electronic from the tray supply device 20 And a delivery device 40 that receives the component C and delivers it to the mounting device 30.

  Then, the delivery device 40 has a first holding head H1 that holds the film-shaped electronic component F supplied from the punching supply device 10 or a second holding head H2 that holds the tray T supplied from the tray supply device 20. The chip-like electronic component C on the tray T held by the mounting portion 410 and the film-like electronic component F held by the first holding head H1 or the second holding head H2 from a common direction, The transfer device 430 to be transferred to the mounting device 30 and the mounting portion 410 to which the first holding head H1 is mounted are moved between the punching supply device 10 and the transfer device 430, or the second holding head H2 is mounted. And a moving mechanism 420 that moves the mounting portion 410 between the tray supply device 20 and the transfer device 430.

  Thus, the transfer device 430 receives the film-like electronic component F held by the first holding head H1 and the chip-like electronic component C on the tray T held by the second holding head H2 from a common direction. The second holding head H2 that has received the tray containing the chip-shaped electronic component C from the tray supply device 20 does not need a mechanism for reversing the entire tray T. Thereafter, the chip-shaped electronic component C is transferred from the transfer device 430 to the mounting device 30. For this reason, there is no impact due to the reversal of the tray T, and the number of times of delivery can be reduced, so that the chip-shaped electronic component C can be reduced in number and good mounting can be achieved.

  Further, in order to receive the film-like electronic component F held by the first holding head H1 and the chip-like electronic component C held by the second holding head H2 from a common direction, the mounting of the film-like electronic component F and the chip The electronic device C can be mounted with a common device. For this reason, the enlargement and cost increase of the apparatus can be suppressed.

(2) The mounting portion 410 is configured to be able to exchange the first holding head H1 and the second holding head H2. For this reason, one electronic component mounting apparatus can be easily changed to a mounting apparatus for film-shaped electronic components F and a mounting apparatus for chip-shaped electronic components C. Thereby, compared with the case where a plurality of apparatuses are prepared, installation space and cost can be suppressed. In particular, since only the relatively small members of the first holding head H1 and the second holding head H2 are to be replaced, the labor and time for the replacement work can be very small.

(3) It has the detection part 440 which detects whether the member with which the mounting part 410 was mounted | worn is the 1st holding head H1 or the 2nd holding head H2. For this reason, according to the detection of the detection part 440, the transfer apparatus 430 and the moving mechanism 420 can be switched to the operation | movement according to mounting of the film-shaped electronic component F, and the operation | movement according to mounting of the chip-shaped electronic component C.

(4) The first holding head H1 holds the film-shaped electronic component F punched by the punching supply device 10 from below, and the second holding head H2 holds the tray T from the tray supply device 20 on the chip. It is held from the lower side opposite to the surface containing the electronic component C. For this reason, the receiving direction of the film-like electronic component F of the first holding head H1 and the receiving direction of the tray T of the second holding head H2 are common, and a common apparatus for receiving different types of components with a simple configuration is used. Can be Further, since the second holding head H2 receives the tray T from below, it is not necessary to reverse the tray T.

(5) The transfer device 430 includes a rotating head 433a that receives and inverts the chip-shaped electronic component C. For this reason, since only the individual chip-shaped electronic components C can be reversed in the middle of the transfer, the impact on the chip-shaped electronic components C is less than that when the tray T is reversed with a large apparatus.

(6) The transfer device 430 cleans the film-like electronic component F in the middle of the transfer by the first arm 431 for transferring the film-like electronic component F received from the first holding head H1 and the first arm 431. A cleaning device 432 is provided. For this reason, it can clean in the middle of the transfer by the transfer apparatus 430, without conveying to an independent cleaning location.

(7) The transfer device 430 receives the film-shaped electronic component F cleaned by the cleaning device 432 from the first arm 431 and passes it to the mounting device 30, or transfers the chip-shaped electronic component C from the second holding head H2. A second arm 433 is provided that receives and passes it to the mounting apparatus 30. For this reason, only the film-shaped electronic component F that needs to be cleaned is cleaned by the cleaning device 432 through a path different from the chip-shaped electronic component C, and the chip-shaped electronic component C is transferred only by the second arm 433. To do. For this reason, the frequency | count of delivery of the chip-shaped electronic component C can be decreased, and the influence which it has on the chip-shaped electronic component C can be suppressed.

[Modification]
(1) Height between the supply position in the punching direction of the film-like electronic component F of the punching supply device 10 and the supply position in the stacking direction of the tray T of the chip-like electronic component C in the tray supply device 20, that is, the Z axis The positions along the line may substantially coincide with each other. More specifically, the receiving position of the film-like electronic component F of the first holding head H1 and the height of the receiving position of the tray T of the second holding head H2 may coincide. In this case, if the height of the upper surface of the holding unit 51 of the first holding head H1 mounted on the mounting unit 410 and the upper surface of the holding unit 61 of the second holding head H2 are set to coincide, Since the amount of elevation of both is common, the control becomes easy.

(2) It is preferable that the suction hole and the suction nozzle suppress the impact given to the film-like electronic component F and the chip-like electronic component C. For example, it is preferable that the suction hole and the suction nozzle on the passing side change from the release of the negative pressure to the positive pressure. In addition, the suction nozzle is preferably provided so as to be able to absorb an impact by including a buffer structure such as an elastic member so as to be able to advance and retreat.

(3) The electronic component mounting apparatus only needs to have the mounting portion 410 for the first holding head H1 and the second holding head H2, and is not limited to a configuration in which both can be replaced. For example, the apparatus may have a plurality of mounting portions 410, and the first holding head H1 is fixed on one side and the second holding head H2 is fixed on the other side. Thereby, the mounting of the film-like electronic component F and the mounting of the chip-like electronic component C can be switched without exchanging the first holding head H1 and the second holding head H2.

(4) Since the movement paths of the film-like electronic component F and the chip-like electronic component C are shared by the second arm 433, two stop positions of the second arm 433 (the position at 12 o'clock) At the 6 o'clock position), a camera for imaging the film-like electronic component F and the chip-like electronic component C is installed, so that positioning or the like can be performed by a common camera. For example, at the 12:00 position, one pre-alignment camera is disposed at a position above the suction nozzle 433b. When the film-like electronic component F is held by the suction nozzle 433b using this camera, the alignment marks provided at both ends of the electrode portion of the film-like electronic component F are imaged, and the film-like electronic device is based on the alignment mark. The position of the part F is recognized. The recognition may be performed by the control device 80 using a known image recognition technique. Based on this recognition position, when the film-like electronic component F is transferred to the pressure member 321, the relative position between the suction nozzle 433 b and the pressure member 321 is adjusted. By doing in this way, the delivery position accuracy of the film-like electronic component F to the pressurization member 321 is securable.

  When taking out the chip-shaped electronic component C from the tray T, an image of an alignment mark provided on the electrode surface of the chip-shaped electronic component C is taken, and the position of the chip-shaped electronic component C is recognized based on the alignment mark. Based on this recognition position, the relative position between the suction nozzle 433b and the chip-shaped electronic component C when the chip-shaped electronic component C is removed is adjusted. By doing in this way, the delivery position accuracy of the film-like electronic component F to the pressurization member 321 is securable.

  On the other hand, at the 6 o'clock position, a pair of simultaneous recognition cameras for temporary pressure bonding are arranged. The simultaneous recognition camera simultaneously captures the alignment mark provided at one end of the electrode portions of the film-like electronic component F and the chip-like electronic component C and the corresponding alignment mark of the display panel D in the field of view. The image is taken. A pair of simultaneous recognition cameras is arranged corresponding to the alignment marks at both ends of the film-like electronic component F and the chip-like electronic component C. Thereby, even when the film-like electronic component F is temporarily pressure-bonded or when the chip-shaped electronic component C is temporarily pressure-bonded, the accuracy can be ensured.

(5) A camera may be used as the detection unit 440. That is, the mode switching unit 82 may switch the mode by determining the first holding head H1 and the second holding head H2 based on the image captured by the camera. In this case, it may be determined by recognizing the outer shape of the first holding head H1 and the second holding head H2, or may be determined by recognizing the identification mark attached to each. Further, since the tray T has a size difference of, for example, 3 inches and 4 inches, it is necessary to prepare a plurality of types of second holding heads H2 having different sizes of the holding portions 61 according to the size differences. In this case, the detection unit 440 may be configured to detect the type of the second holding head H2. Also in this case, a beam sensor 441, a camera, or the like can be used.

[Other Embodiments]
As mentioned above, although embodiment of this invention and the modification of each part were demonstrated, this embodiment and the modification of each part are shown as an example, and are not intending limiting the range of invention. These novel embodiments described above can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention and included in the invention described in the claims.

10, 10a, 10b Punching supply device 110 Supply unit 120 Table 120a Opening 130 Die 131 Die 131a Punching hole 132 Punch 140 Lifting mechanism 141 Support unit 141a Support column 141b Support plate 142 Drive unit 20, 20a, 20b Tray supply device 210 Frame 220 Grasping part 30 Mounting device 310 Table 320 Crimping part 321 Pressure member 322 Backup 40 Delivery device 410 Mounting part 411 Mounting part 412 Locking part 420, 420a, 420b Moving mechanism 421, 422, 423, 424 Driving part 421a Linear guide 421b, 422d, 423a Slider 421c, 422b 424a Motor 421d, 422c Ball screw 421e 422a Nut body 430 Transfer device 431 First arm 431a Adsorption nozzle 432 Cleaning device 432a Lash 433 Second arm 433a Rotating head 433b Adsorption nozzle 440 Detection unit 441 Beam sensor 442 Support column 51 Holding unit 52 Connection unit 53 Support column unit 61 Holding unit 62 Connection unit 63 Support column unit 80 Control device 81 Mechanism control unit 82 Mode switching unit 83 Storage unit 84 Input / output control unit 91 Input device 92 Output device C Chip-shaped electronic component F Film-shaped electronic component T Tray H1 First holding head H2 Second holding head ST Thin plate member

Claims (8)

A punching supply device for supplying a film-like electronic component punched from a thin plate member,
A tray supply device for supplying a tray containing chip-shaped electronic components;
A mounting apparatus for mounting the film-like electronic component or the chip-like electronic component on a display panel;
A delivery device that receives the film-like electronic component from the punching supply device or receives the chip-like electronic component from the tray supply device and passes it to the mounting device;
Have
The delivery device is
A mounting portion on which a first holding head for holding the film-like electronic component supplied from the punching supply device or a second holding head for holding a tray supplied from the tray supply device is mounted;
A transfer device for receiving the film-like electronic component held by the first holding head or the chip-like electronic component on the tray held by the second holding head from a common direction, and passing it to the mounting device;
The mounting portion on which the first holding head is mounted is moved between the punching supply device and the transfer device, or the mounting portion on which the second holding head is mounted is moved between the tray supply device and the transfer. A moving mechanism for moving between the device,
An electronic component mounting apparatus comprising:   The electronic component mounting apparatus according to claim 1, wherein the mounting unit is configured to be able to exchange the first holding head and the second holding head.   3. The electronic component mounting apparatus according to claim 1, further comprising: a detection unit configured to detect whether the member mounted on the mounting unit is the first holding head or the second holding head. . The first holding head holds the film-like electronic component punched by the punching supply device from below,
The said 2nd holding head hold | maintains the said tray from the said tray supply apparatus from the downward direction opposite to the surface in which the said chip-shaped electronic component was accommodated. Electronic component mounting equipment.   5. The electronic component mounting apparatus according to claim 1, wherein the transfer device includes a rotary head that receives and inverts the chip-shaped electronic component. The transfer device is
A first arm for transferring the film-like electronic component received from the first holding head;
6. The electronic component mounting apparatus according to claim 1, further comprising a cleaning device that cleans the film-shaped electronic component during transfer by the first arm. The transfer device is
The film-like electronic component cleaned by the cleaning device is received from the first arm and delivered to the mounting device, or the chip-like electronic component is received from the tray held by the second holding head. The electronic component mounting apparatus according to claim 6, further comprising a second arm that passes to the mounting apparatus. The second arm has a rotary head that reverses the chip-like electronic component, and the film-like electronic component received from the first arm is transferred to the mounting apparatus without being inverted, and the second holding 8. The electronic component mounting apparatus according to claim 7, wherein the chip-shaped electronic component received from the tray held by the head is reversed and then transferred to the mounting apparatus.

Images