JP2019179858A - Film-like electronic component supply stand, punching supply device, and electronic component mounting device - Google Patents

Abstract

To provide a film-like electronic component supply stand which allows a perforated film-like electronic component to be supplied to a punching supply device for reuse, a punching supply device, and an electronic component mounting device.SOLUTION: A punching supply device 10 includes: a film-like electronic component supply stand 20; a holding unit 210 for holding a film-like electronic component F punched from a thin plate-like member ST; and a base unit 220 detachably provided in a mounting area which is formed in the punching supply device 10 supplying the film-like electronic component after punching it with a punching die unit and from which the punching die unit is detached.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a film-like electronic component supply stand, a punching supply device, and an electronic component mounting device.

  In a manufacturing process of a liquid crystal display or an organic EL display that is widely used as a display of a television or a personal computer, there is a process of assembling a panel for mounting driving electronic components on the display panel.

  In this assembly process, a system is known in which a film-like electronic component called COF (Chip on Film) in which a driver IC is mounted on a film-like circuit board is mounted on a display panel. This is called FOG (Film on Glass) mounting because a film-like electronic component is mounted on a glass substrate. A mounting device called an OLB (Outer Lead Bonding) device or an FOG mounting device is used for FOG mounting.

Japanese Unexamined Patent Publication No. 08-031876

  By the way, in the OLB mounting apparatus, a COF punched from a thin plate-like member such as a carrier tape with a die or the like is mounted on a display panel by a punching supply device (see Patent Document 1). At this time, before punching out the product COF, there are cases where several COFs are punched out for trial purposes in order to adjust the apparatus. Also, there is COF that falls during transfer to the final crimping apparatus after temporary crimping. Even if such a COF can be used as a product, it is not a product but is discarded, so it becomes useless.

  However, it is difficult to eliminate such COF completely. Further, the number of punched COFs generated for the reasons described above is overwhelmingly smaller than the number of COFs punched and supplied in the same lot. For this reason, in order to supply punched COF, it is not preferable to provide a large-scale configuration such as a tray supply device in view of an increase in the device price with respect to the use frequency or an increase in the ground contact area of the device.

  An object of the present invention is to provide a film-like electronic component supply base, a punching supply device, and an electronic component mounting device that can supply a punched film-like electronic component to a punching supply device and reuse it.

  In order to achieve the above object, the film-like electronic component supply base of the present invention comprises a holding unit for holding a film-like electronic component that has been punched from a thin plate-like member, and a punching die unit. A mounting region formed in a punching supply device for punching and supplying, and a base portion detachably provided in the mounting region from which the punching die unit is detached.

  The base portion may have a common form with the base portion of the punching die unit. You may have the guide part which guides the said film-form electronic component hold | maintained at the said holding | maintenance part in the supply position where the said punch supply apparatus supplies the said film-form electronic component. The guide portion may have a reversing mechanism that reverses the holding portion.

  The holding portion has a suction hole that sucks the film-like electronic component by negative pressure, and a connection portion is provided that communicates with the suction hole and is connected to a pneumatic circuit for supplying negative pressure. good.

  In the punching supply apparatus of the present invention, the film-like electronic component supply base and the punching die unit may be provided interchangeably. The mounting area may include a positioning portion that selectively positions the base portion of the film-like electronic component and the base portion of the punching die unit.

  A drive mechanism that causes the punching die unit to perform a punching operation when the punching die unit is mounted in the mounting region, and that does not operate when the film-like electronic component is mounted in the mounting region; You may have. You may have a detection part which detects whether the said punching die unit is mounted | worn in the said mounting | wearing area | region, or the said film-like electronic component is mounted | worn.

  Another aspect is an electronic component mounting apparatus having the punch supply device, the mounting device for mounting the film electronic component on a mounting target, and the film electronic component received from the punch supply device, And a delivery device for passing to the mounting device.

  In the present invention, a punched film electronic component can be supplied to a punching supply device and reused.

It is a perspective view which shows the film-shaped electronic component used by embodiment, and the display panel of crimping | compression-bonding object. It is a simplified top view which shows the whole structure of the electronic component mounting apparatus of embodiment. It is explanatory drawing which shows the process of mounting the film-form electronic component of the electronic component mounting apparatus of embodiment. It is explanatory drawing which shows before punching (A) and after punching (B) of a punch supply apparatus. It is a top view which shows removal | desorption of the punching supply apparatus and film-like electronic component supply stand to a mounting area | region. It is a perspective view of a punching supply device. It is a perspective view which shows the punching supply apparatus equipped with the film-like electronic component supply stand. It is a perspective view of a film-form electronic component supply stand. It is explanatory drawing which shows the supply aspect by a film-form electronic component supply stand. It is a block diagram which shows the control apparatus of embodiment. It is a flowchart which shows the mounting procedure of the film-form electronic component supplied by the punching die unit. It is a flowchart which shows the mounting procedure of the film-form electronic component supplied by the film-form electronic component supply stand. It is a flowchart which shows the mounting procedure of the film-like electronic component with respect to a film-like electronic component supply stand. It is a perspective view which shows the modification of embodiment.

  Embodiments of the present invention (hereinafter referred to as the present embodiments) will be specifically described with reference to the drawings. The drawings schematically show each member and each component, and do not accurately show the dimensions, intervals, and the like.

[Mounted parts and mounting objects]
The mounting component according to the present embodiment is a film-like electronic component F as shown in FIG. The film-like electronic component F is a component in which an electrode is exposed while the electronic component is sealed in a flexible resin film. This film-like electronic component F is prepared as a component to be mounted by individually punching a plurality of sheet-like or tape-like thin plate-like members.

  The mounting target of the film-like electronic component F is a component that is electrically connected to the electrode of the film-like electronic component F. In the present embodiment, the mounting target is a display panel D that constitutes a display device such as a liquid crystal or an organic EL. That is, a member having a display function and electrodes. In addition, as a mounting object, it can apply widely to the component which has the part which has the electroconductivity which electrically connects with the electrode of the film-form electronic component F. FIG. For example, a printed wiring board such as a flexible wiring board may be the mounting target.

[Electronic component mounting equipment]
[overall structure]
The overall configuration of the electronic component mounting apparatus to which this embodiment is applied will be described with reference to FIGS. As shown in FIG. 2, the electronic component mounting apparatus includes a punching supply apparatus 10, a mounting apparatus 30, a delivery apparatus 40, and a control apparatus 80. Moreover, the film-like electronic component supply stand (hereinafter referred to as supply stand) 20 of the present embodiment is attached to and detached from the punching supply device 10 (see FIGS. 5 and 7).

  As shown in FIGS. 2 and 3, the punching supply device 10 supplies the film-like electronic component F by punching the film-like electronic component F from the thin plate-like member ST such as a tape by the punching die unit 130. (See FIG. 4). The supply table 20 is mounted on the punching supply device 10 instead of the punching die unit 130, so that the punched film electronic component F is punched by the punching die unit 130. It is supplied in the same manner as the part F (see FIG. 9).

  The mounting device 30 is a device that crimps the film-like electronic component F to the display panel D to be mounted. The delivery device 40 is a device that receives the film-like electronic component F from the punching and feeding device 10 and delivers it to the mounting device 30. A holding head H is used for delivery of the film-like electronic component F from the punching supply device 10 to the mounting device 30.

  The control device 80 is a device that controls the punching supply device 10, the mounting device 30, and the delivery device 40. The control device 80 is configured by, for example, a dedicated electronic circuit or a computer that operates with a predetermined program. The control device 80 is programmed with the control content of each part, and the program is executed by a processing device such as a PLC or a CPU.

  In addition, in a plane parallel to the installation surface of the electronic component mounting apparatus, a straight line from the punching supply apparatus 10 to the mounting apparatus 30 is a Y direction, and one direction orthogonal to the X direction is an X direction, and an axis along the Y direction is a Y axis. The axis along the X direction is taken as the X axis. The XY plane formed by the Y-axis and the X-axis is parallel to the film-like electronic component F, the display panel D, and the planes that support it. In the following description, a direction parallel to the X axis may be referred to as a width direction, a direction parallel to the Y axis as a depth direction, and an XY plane as a horizontal plane.

  Further, a direction orthogonal to the XY plane and upward from the installation surface is defined as a Z direction, and an axis along the Z direction is defined as a Z axis. When the installation surface is horizontal, the Z axis is the height direction and the vertical direction. The Z-axis is perpendicular to the film-like electronic component F, the display panel D, and the planes that support it. In the following description, the Z direction is upward and the opposite direction is downward. Furthermore, the rotation direction parallel to the XY plane centered on the Z axis is defined as the θ direction, and the rotation direction parallel to the YZ plane centered on the X axis is defined as the α direction. These directions are expressions for describing the positional relationship of each component of the electronic component mounting apparatus, and do not limit the positional relationship and direction when installed on the installation surface.

[Punching supply device]
As shown in FIGS. 2 and 4, the punching supply apparatus 10 includes a supply unit 110, a table 120, a punching die unit 130, a drive mechanism 140, and a detection unit 150 (see FIG. 10). The supply unit 110 is a mechanism in which a reel around which a tape-like thin plate member ST such as a carrier tape on which an electronic component is formed is attached and detached, and a punched portion of the electronic component is sequentially sent out (see FIG. 2). For this reason, the supply unit 110 is provided with a rotation center of the reel, a shaft that bears the rotation axis of the reel, and a feed roller that feeds the thin plate member ST.

  The table 120 is a table on which the punching die unit 130 is mounted. However, as shown in FIG. 5, the supply table 20 can also be mounted in the mounting region M in which the punching die unit 130 is mounted. That is, the mounting area M is an area in which the punching die unit 130 and the supply base 20 are selectively detachable. In the present embodiment, the mounting area M is a flat area provided on the upper surface of the table 120.

  A positioning part 121 is provided at a position that defines the mounting area M. The positioning part 121 is a member for positioning the punching die unit 130 and the supply base 20. In the present embodiment, the positioning portions 121 are rectangular parallelepiped blocks 121a, 121b, and 121c that are provided in the width direction in a pair and on the three sides of the back surface and define a substantially rectangular mounting region M.

  As shown in FIGS. 4 and 6, the punching die unit 130 includes a die 131, a punch 132, a support portion 133, and a shaft 134. The die 131 is a flat plate member having a flat surface on which the thin plate member ST sent out from the supply unit 110 is placed and having a punched hole 131a. The punch hole 131a is a through hole that substantially matches the outer shape of the film-like electronic component F. The die 131 is fixed to the upper surface of the table 120, and the table 120 is provided with an opening 120a which is a through hole larger than the punch hole 131a at a position corresponding to the punch hole 131a. The die 131 is inserted into the positioning part 121 to become a base part that defines the position of the punching die unit 130. That is, the die 131 also serves as a base portion.

  The punch 132 is a substantially rectangular parallelepiped die having an outer edge substantially coinciding with the inner edge of the punch hole 131a. The bottom surface of the punch 132 faces the thin plate member ST placed on the die 131 as shown in FIG. 4A, and is inserted into the punched hole 131a along the Z axis as shown in FIG. 4B. The film-like electronic component F is punched from the thin plate member ST by moving until it is done. Although not shown, a suction hole connected to a pneumatic circuit is formed on the bottom surface of the punch 132, and the punched film electronic component F is sucked and held by a negative pressure.

  The support part 133 is a structural part that supports the punch 132 so as to be movable up and down. The support part 133 has a support column 133a and a support plate 133b. The support pillar 133 a is four rod-like members raised on the die 131. The support plate 133b is a plate-like body attached to the upper end of the support pillar 133a in parallel to the upper surface of the die 131.

  The shaft 134 is a rod-shaped member along the Z axis. The shaft 134 is slidably inserted through the support plate 133 b and has a lower end connected to the upper surface of the punch 132. The shaft 134 is biased upward with respect to the support plate 133b by a spring (not shown). The ascent of the shaft 134 is restricted by a stopper (not shown). As a result, the punch 132 is positioned at the rising end (the state shown in FIG. 4A) in a state where no external force is applied to the shaft 134.

  The drive mechanism 140 is a mechanism for punching the film-like electronic component F by moving the punch 132 along the Z axis. The drive mechanism 140 drives the punch 132 in the direction of contacting and separating from the die 131 via the shaft 134. An air cylinder or the like can be used as the drive mechanism 140. Furthermore, the drive mechanism 140 is provided at the upper end of the shaft 134 so as to be able to contact and separate. More specifically, the main body of the air cylinder is fixed to the main body of the punching supply device 10, and the tip of the rod of the air cylinder faces the upper end of the shaft 134 with a slight gap. Then, when the rod descends and hits the shaft 134, the shaft 134 is pushed down. That is, the punching die unit 130 can be detached from the drive mechanism 140 and removed. The tip of the rod and the shaft 134 may be provided in a detachable manner rather than in a form in which the ends of the rod face each other with a gap.

  The moving end below the punch 132 is a supply position S for supplying the film-like electronic component F to the holding head H as shown in FIGS. The supply position S is a horizontal plane through which the punching supply device 10 passes the film-like electronic component F to the outside, and is set so that the height is constant. That is, the punch 132 reaches the supply position S that can be received by the holding head H and stops while sucking and holding the film-like electronic component F that has been punched down and punched. In the present embodiment, the region that demarcates the supply position S in the horizontal direction substantially coincides with the punch 132 and the punch hole 131a.

[Detection device]
The detection unit 150 (see FIG. 10) is a component that detects whether the punching die unit 130 or the supply table 20 is mounted in the mounting region M. The detection unit 150 of the present embodiment uses a beam sensor arranged in the vicinity of the mounting region M. The beam sensor is a sensor that detects the presence / absence of an object based on the presence / absence of receiving reflected light of emitted light such as a laser.

  For example, the beam sensor cannot be reflected when the punching die unit 130 is mounted, but is disposed at a position where the reflected light can be received when the supply base 20 is mounted, or vice versa. To do. Thereby, the case where the punching die unit 130 is mounted can be detected, and it can be detected that the supply base 20 is mounted otherwise, or vice versa. For example, in the state where the punching die unit 130 is mounted in the mounting region M, the reflecting member is disposed at a location where the emitted light of the beam sensor is hit. Thereby, when the punching die unit 130 is mounted in the mounting region M, the beam sensor receives the reflected light, so that it can be detected that the punching die unit 130 is mounted. On the other hand, a non-reflective member is disposed on the supply base 20 at a location where the light emitted from the beam sensor is hit while being mounted in the mounting region M. Thereby, when the supply stand 20 is mounted in the mounting region M, the reflected light of the beam sensor is absorbed by the non-reflective member, and the beam sensor cannot receive the reflected light, or the amount of received light is very small. Thereby, it can be detected that the supply unit 20 is mounted.

  As shown in FIG. 2, the punching supply device 10 as described above is provided in a pair on the left and right along the X axis in a plan view. One punching supply device 10a and the other punching supply device 10b are disposed at positions sandwiching a transfer device 430, which will be described later, in plan view. Hereinafter, when the punching supply devices 10a and 10b are not distinguished, the punching supply device 10 is used.

[Supply stand]
The supply stand 20 of this embodiment has the holding | maintenance part 210, the base part 220, and the guide part 230, as shown in FIGS.
(Holding part)
The holding part 210 is a member that holds the film-shaped electronic component F that has been punched from the thin plate-like member ST. The punched film-shaped electronic component F is a film-shaped electronic component F that has been punched from the thin plate member ST and then once detached from the punching supply device 10. The holding unit 210 includes a base body 211, a holding region 212, a suction hole 213, and a connection unit 214. The substrate 211 is a substantially rectangular parallelepiped plate having a flat surface on one side. This flat surface is a mounting surface 211a on which the film-like electronic component F is mounted.

  The holding area 212 is an area that is provided on the placement surface 211 a and holds the film-like electronic component F. The holding area 212 is provided with a marker 212a that is a frame line that substantially matches the outer edge of the film-like electronic component F so that the operator can identify the holding area 212. The sign part 212a is a display that serves as a guide for placing the film-like electronic component F. For this reason, a frame line is only an example. Various displays such as points indicating four corners and color-coded display are possible. Thereby, positioning of the film-like electronic component F to the holding | maintenance area | region 212 becomes easy. The position of the film-like electronic component F, such as a concave portion having a depth corresponding to the thickness of the film-like electronic component H into which the film-like electronic component F is fitted, or a convex portion with which the outer edge of the film-like electronic component F abuts. A configuration such as a regulating unit for regulating is also included in the labeling unit 212a. In this case, if the film-like electronic component F is placed in accordance with the marking portion 212a, the positioning to the holding region 212 can be performed more accurately.

  The suction hole 213 is a hole that sucks the film-like electronic component F by negative pressure. A plurality of suction holes 213 are formed in the holding region 212. The suction hole 213 is connected to a pneumatic circuit (not shown), and sucks and holds the film-like electronic component F by a negative pressure from a vacuum source. The connection portion 214 is a member that communicates with the suction hole 213 and is connected to the end of the piping of the pneumatic circuit.

  Here, the same pneumatic circuit as that connected to the suction hole provided on the bottom surface of the punch 132 is used. That is, when removing the punching die unit 130 from the punching supply device 10, a pipe for supplying negative pressure to the suction hole of the punch 132 is also removed, but the pipe may be connected to the connection portion 214 as it is. That is, the connection portion 214 is provided with an end portion of a piping of a pneumatic circuit for the punching die unit 130 so as to be connectable.

  The base portion 220 is detachably provided in the mounting area M formed in the punching supply device 10 and the mounting area M from which the punching die unit 130 is detached. A stopper 221 is erected on the upper surface of the edge portion on the back side of the base portion 220. The stopper 221 defines a moving end toward the back side of a frame body 231a described later.

  The base part 220 has a common form with the die 131 of the punching die unit 130. The common form is a form in which the film-like electronic component F punched out by the punch 132 and the film-like electronic component F supplied by the supply base 20 can be in a common position when positioned in the positioning portion 121. Say. The form here includes shape or size.

  That is, as shown in FIG. 5, when the die 131 of the punching die unit 130 is mounted on the mounting region M along the positioning portion 121, the punch 132 and the punch hole 131 a coincide with the supply position S in plan view. . Further, when the base portion 220 of the supply base 20 is attached to the attachment region M along the positioning portion 121, the holding region 212 coincides with the supply position S in plan view. For this reason, in this embodiment, the distance between the outer edge of the die 131 and the outer edge of the punch hole 131a and the distance between the outer edge of the base portion 220 and the outer edge of the holding region 212 have a common part. Such a common part means that the distance between the positioning part 121 and the supply position S is also common.

  More specifically, the distance dpA from the outer edge in contact with the block 121b of the die 131 to the outer edge on the back side of the punch hole 131a, and the outer edge in contact with the block 121b of the base part 220 to the outer edge on the back side of the holding region 212. The distance dpB is substantially the same. In addition, distances wdA1 and wdA2 from the outer edges that contact the blocks 121a and 121c of the die 131 to the left and right outer edges in the width direction of the punch hole 131a, and the width direction of the holding region 212 from the outer edges that contact the blocks 121a and 121c of the base portion 220 The distances wdB1 and wdB2 to the left and right outer edges are substantially the same.

  This is because if the distance between the block 121b and the outer edge on the back side of the supply position S is dpx, and the distance between the blocks 121a and 121c and the left and right outer edges in the width direction of the supply position S is wdx1 and wdx2, the distance dpx and the distance dpA. And the distance dpB substantially coincide with each other, and the distances wdx1 and wdx2 and the distances wdA1 and wdA2 and the distances wdB1 and wdB2 substantially coincide with each other.

  However, in the present embodiment, as will be described later, the position of the holding unit 210 is movable with respect to the base unit 220. For this reason, in order to move the film-like electronic component F held by the holding unit 210 to the supply position S, the movement guided by the guide unit 230 is required.

  In addition, the base part 220 should just have a form common to the die | dye 131 so that such positioning can be performed. For this reason, it is not necessary that the shape and size of both are completely the same. In the above example, the base portion 220 and the die 131 are a common rectangular parallelepiped plate-like body, but may be other polygonal shapes as long as the positioning portion 121 can be positioned as described above. The outer edge may have irregularities.

  As shown in FIGS. 7 and 8, the guide unit 230 is a member that guides the holding unit 210 to the supply position S where the punching and supplying apparatus 10 supplies the film-like electronic component F. The guide unit 230 includes a reversing mechanism 231 and a slide mechanism 232. The reversing mechanism 231 is a mechanism that reverses the holding unit 210. The reversing mechanism 231 includes a frame body 231a and a hinge 231b. The frame body 231a is a substantially rectangular parallelepiped plate-like body, and an opening 231c that is a through hole into which the base body 211 of the holding unit 210 is fitted is formed.

  The hinge 231b is provided in the vicinity of the edge on the near side opposite to the back side of the opening 231c, and attaches the base body 211 to the frame body 231a so as to be rotatable around an axis in the width direction. Thereby, the base body 211 is provided so as to be rotatable in the α direction between a position where the mounting surface 211a faces upward and a position where the mounting surface 211a faces downward while fitting in the opening 231c.

  The slide mechanism 232 is a mechanism that supports the holding unit 210 to be slidable. In the present embodiment, the slide mechanism 232 supports the base body 211 so as to be slidable in the depth direction together with the frame body 231a. The slide mechanism 232 includes a guide rail 232a and a slider 232b. The guide rails 232a are a pair of rails that are fixed to the base portion 220 and extend in the depth direction. The slider 232b is a pair of members on which the frame body 231a is mounted and is slidable along the guide rail 232a. The moving end of the frame body 231a in the depth direction is defined by the stopper 221.

  As shown in FIG. 9, when the holding unit 210 is inverted so that the film-like electronic component F faces downward, the film-like electronic component F comes to the supply position S. That is, the holding unit 210 holds the film-shaped electronic component F at a position that is substantially coincident with the bottom surface of the punch 132 that has been punched and lowered by punching the film-shaped electronic component F shown in FIG.

[Mounting equipment]
As shown in FIGS. 2 and 3, the mounting device 30 is a device that heat-presses the electrode of the film-like electronic component F to the electrode of the display panel D via the ACF. An ACF (Anisotropic Conductive Film) is a sheet-like member in which a large number of small conductive particles are contained in a resin serving as a base material.

  The mounting apparatus 30 includes a table 310 and a pressure bonding part 320. The table 310 is a horizontal plate-like body on which the display panel D is placed. Although not shown, a suction hole connected to a pneumatic circuit is formed on the upper surface of the table 310, and the display panel D is sucked and held by a negative pressure. The table 310 is provided so as to be movable in the direction along the X axis and the Y axis and in the θ direction by a drive mechanism (not shown).

  As shown in FIG. 3, the crimping part 320 includes a pressure member 321 and a backup 322. The pressurizing member 321 heats and pressurizes the film-like electronic component F stacked on the display panel D supported by the table 310 by a driving mechanism (not shown). The pressure member 321 is heated by a heating device (not shown). The backup 322 is a member that sandwiches the display panel D and the film-like electronic component F through the ACF (not shown) with the pressing member 321.

  The crimping part 320 is an apparatus for performing temporary crimping before performing final crimping. Although not shown in the figure after the temporary press-bonding by the press-bonding section 320, the main press-bonding by the main press-bonding section arranged in the downstream process is performed.

[Delivery device]
As shown in FIGS. 2 and 3, the delivery device 40 is a device that receives the film-like electronic component F from the punching and feeding device 10 and delivers it to the mounting device 30. The delivery device 40 includes a moving mechanism 420 and a transfer device 430.

(Movement mechanism)
The moving mechanism 420 is a mechanism that moves the holding head H between the punching and supplying apparatus 10 and a transfer apparatus 430 described later. For example, the moving mechanism 420 drives the holding head H in a direction parallel to the X axis, the Y axis, and the Z axis and in the θ direction. Although not shown, a suction hole connected to a pneumatic circuit is formed on the upper surface of the holding head H, and the punched film electronic component F is sucked and held by a negative pressure.

(Transfer device)
As shown in FIG. 2, the transfer device 430 is a device that receives the film-like electronic component F held by the holding head H and passes it to the mounting device 30. The transfer device 430 receives the film-like electronic component F from the holding head H, passes it to the mounting device 30, and the film-like electronic component F is mounted on the display panel D in the mounting device 30.

  As shown in FIG. 3, the transfer device 430 includes a first arm 431, a cleaning device 432, and a second arm 433. The first arm 431 is a long member provided so as to be rotatable in the θ direction by a drive source such as a motor (not shown) on a plane parallel to the XY plane. At one end of the first arm 431, a suction nozzle 431a connected to a pneumatic circuit is provided. The suction nozzle 431a sucks and holds the film-like electronic component F held on the holding head H from above by the negative pressure generated by the vacuum source of the pneumatic circuit. The first arm 431 is intermittently rotated by 90 ° by a drive source (not shown) as indicated by a solid line and a broken line in FIG.

  The cleaning device 432 is disposed below the first arm 431 corresponding to the stop position of the first arm 431 on the punching supply device 10 side. The cleaning device 432 is a device that removes dust and the like attached to the electrode portions of the punched film-like electronic component F. The cleaning device 432 includes a brush 432a. The brush 432a is provided to be rotatable about a shaft in the X-axis direction by a drive source such as a motor (not shown). The brush 432a is provided so as to be movable in an approaching and separating direction with respect to a passing point of an electrode portion of the film-like electronic component F held by the first arm 431 by a driving mechanism (not shown).

  The second arm 433 is disposed between the first arm 431 and the mounting apparatus 30. The second arm 433 is a long member provided so as to be rotatable in the θ direction by a driving source such as a motor on a plane parallel to the XY plane. At one end of the second arm 433, a suction nozzle 433b is provided. Although not shown, the suction nozzle 433b is connected to a pneumatic circuit, and sucks and holds the film-like electronic component F by a negative pressure from a vacuum source. The suction nozzle 433b sucks and holds the non-electrode portion from below so that the electrode portion of the film-like electronic component F held by the suction nozzle 431a of the first arm 431 faces downward. The second arm 433 is intermittently rotated by 180 ° by a drive source (not shown) as shown by a solid line and a broken line in FIG.

[Control device]
As shown in FIG. 10, the control device 80 includes a mechanism control unit 81, a mode switching unit 82, a storage unit 83, and an input / output control unit 84. The mechanism control unit 81 controls the operation of each part of the punching supply device 10, the mounting device 30, and the delivery device 40. The mode switching unit 82 switches between a mode in which the film-like electronic component F is supplied by the punching die unit 130 and a mode in which the film-like electronic component F is supplied by the supply base 20 in accordance with a detection signal from the detection unit 150. .

  When the mode switching unit 82 switches to the mode in which the film-shaped electronic component F is supplied by the punching die unit 130, the mechanism control unit 81 supplies and drives the thin plate member ST by the supply unit 110. The punching operation by the mechanism 140, the suction operation by the pneumatic circuit, and the delivery operation to the delivery device 40 are controlled.

  In the mode in which the film-like electronic component F is supplied from the supply base 20, the mechanism control unit 81 stops the supply operation of the thin plate member ST by the supply unit 110 and the punching operation by the drive mechanism 140. However, the suction operation by the pneumatic circuit and the delivery operation to the delivery device 40 are controlled in the same manner as the mode in which the film-shaped electronic component F is supplied by the punching die unit 130. Since the supply position S from the supply base 20 to the delivery device 40 and the timing of releasing the negative pressure are the same as those of the punching die unit 130, it is not necessary to change the control.

  The storage unit 83 stores information necessary for the control of the present embodiment, such as a program and data for realizing each unit described above. The input / output control unit 84 is an interface for controlling signal conversion and input / output with each unit to be controlled.

  Further, an input device 91 and an output device 92 are connected to the control device 80. The input device 91 is input means such as a switch, a touch panel, a keyboard, and a mouse for an operator to operate the electronic component mounting apparatus via the control device 80. The output device 92 is output means such as a display device that makes information for confirming the state of the electronic component mounting apparatus visible to the operator.

[Operation]
The operation of the present embodiment as described above is divided into a case where the film-like electronic component F punched by the punching die unit 130 is mounted and a case where the film-like electronic component F supplied from the supply base 20 is mounted. explain.

(When using a punching die unit)
First, the procedure when the punching die unit 130 is used will be described with reference to the flowchart of FIG. 11 in addition to the above drawings. As shown in FIGS. 5 and 6, the punching die unit 130 is mounted on the mounting area M (step S101). That is, the die 131 of the punching die unit 130 is inserted into the positioning part 121 so that the tip of the rod of the air cylinder of the driving mechanism 140 and the top end of the shaft 134 are opposed to each other, and the piping of the pneumatic circuit is punched 132. Connect to the connecting part that communicates with the suction hole.

  Then, the detection unit 150 detects that the punching die unit 130 is mounted (Step S102). The mode switching unit 82 switches the control by the control device 80 to a mode for mounting the film-shaped electronic component F punched by the punching die unit 130 (step S103).

  The moving mechanism 420 moves the holding head H so as to come directly under the punching and supplying apparatus 10 (step S104). In the punching and supplying apparatus 10, as shown in FIG. 4B, the film-like electronic component F is punched (step S105). The punched film-shaped electronic component F is lowered to the supply position S while being sucked by the punch 132, and is sucked by the holding head H along with the release of the suction. Thereby, the holding head H receives the film-shaped electronic component F (step S106).

  As shown in FIG. 3, the moving mechanism 420 moves the holding head H that has received the film-like electronic component F to the suction nozzle 431a at the end of the first arm 431 that has stopped at the position indicated by the solid line in FIG. (Step S107). The film-shaped electronic component F is transferred to the first arm 431 by releasing the suction of the holding head H and performing suction by the suction nozzle 431a (step S108).

  The first arm 431 rotates on the XY plane and cleans the edge of the electrode part of the film-like electronic component F by bringing it into contact with the raised brush 432a (step S109). Further, by rotating the first arm 431, the film-like electronic component F is moved to the upper part of the suction nozzle 433b of the second arm 433 (step S110). Specifically, the suction nozzle 431a of the first arm 431 is positioned directly above the suction nozzle 433b of the second arm 433 stopped at the stop position on the punching supply device 10 side, which is indicated by a broken line in FIG. Then, the first arm 431 is moved to the stop position on the mounting apparatus 30 side indicated by a broken line in FIG.

  Then, the suction of the first arm 431 by the suction nozzle 431a is canceled and the suction by the suction nozzle 433b is performed, so that the film-shaped electronic component F is transferred to the second arm 433 (step S111).

  The second arm 433 rotates the XY plane by 180 ° and passes the film-like electronic component F to the crimping part 320 of the mounting apparatus 30 (step S112). Then, the electrode of the film-like electronic component F is heat-bonded to the electrode of the display panel D via the ACF (Step S113). The display panel D to which the film-like electronic component F has been temporarily press-bonded is conveyed to the main press-bonding portion and subjected to the main press-bonding.

  In addition, supply of said film-like electronic component F is first performed by one punching supply apparatus 10a. Then, when the thin plate-like member ST of the supply unit 110 of the punching supply device 10a disappears, the film-like electronic component F is continuously supplied by switching to the other punching supply device 10b. In the meantime, when the reel of the thin plate member ST of the punching supply device 10a is replaced and the thin plate member ST of the other punching supply device 10b is removed, the film-like electronic component F is again supplied by the punching supply device 10a. Switch. As a result, the mounting can be continued without stopping the electronic component mounting apparatus.

(When using a film-type electronic component supply base)
Next, the procedure in the case of using the supply stand 20 will be described with reference to the flowcharts of FIGS. 12 and 13 in addition to the above drawings. First, the punching die unit 130 is removed from the mounting area M before mounting the supply base 20. That is, the connection between the drive mechanism 140 and the shaft 134 is released, and the piping of the pneumatic circuit is removed from the connection portion communicated with the suction hole of the punch 132. Then, the punching die unit 130 is removed from the positioning portion 121 by removing it.

  As shown in FIG. 7, the supply stand 20 is mounted in the mounting area M (step S201). That is, the base part 220 of the supply base 20 is inserted into the positioning part 121 and the piping of the pneumatic circuit is connected to the connection part 214. Connection with the drive mechanism 140 is not necessary.

  Then, the detection unit 150 detects that the supply base 20 is mounted (step S202). The mode switching unit 82 switches the control by the control device 80 to a mode for mounting the film-like electronic component F supplied from the supply base 20 (step S203).

  The operator mounts the film-like electronic component F on the supply base 20 (step S204). Such a mounting procedure will be described with reference to the flowchart of FIG. First, the film-like electronic component F is placed on the placement surface 211a of the base body 211 (step S301). At this time, the outer edge of the base body 211 is aligned with the area surrounded by the label portion 212a. Then, by supplying negative pressure by the pneumatic circuit to the suction hole 213, the film-like electronic component F placed on the placement surface 211a is sucked (step S302). The negative pressure is supplied to the suction hole 213 by, for example, an operator operating a negative pressure supply switch provided in advance near the punching supply device 10 or a negative pressure supply switch of the input device 91 such as a touch panel. Done.

  Next, the base body 211 is reversed and fitted into the opening 231c of the frame body 231a (step S303). The substrate 211 is inverted manually by an operator. However, a reverse drive mechanism may be provided so that the substrate 211 is automatically reversed by the reverse drive mechanism when the operator operates the input device 91 such as a touch panel. Moreover, when automatically reversing, you may make it reverse in conjunction with operation of the above-mentioned negative pressure supply switch. Then, the frame body 231a is pushed in and slid to the far side until it stops by hitting the stopper 221 (step S304). Thereby, the film-like electronic component F comes to the same position as the film-like electronic component F punched by the punching die unit 130.

  Returning to the flowchart of FIG. 12, the moving mechanism 420 moves the holding head H so as to come directly under the punching and supplying apparatus 10 (step S <b> 205). The suction by the holding head H is performed together with the release of the suction of the suction hole 213 holding the film-like electronic component F. Thereby, the holding head H receives the film-like electronic component F (step S206). Subsequent operations are the same as steps S107 to S113 described above (steps S207 to S213).

[Function and effect]
The effects of the present embodiment as described above are as follows.
(1) The film-like electronic component supply base 20 punches and supplies the film-like electronic component F by the holding part 210 that holds the film-like electronic component F punched from the thin plate member ST and the punching die unit 130. A mounting region M formed in the punching supply apparatus 10 and having a base portion 220 detachably provided in the mounting region M from which the punching die unit 130 is detached.

  For this reason, it can replace with the punching die unit 130 and can mount the supply stand 20 in the punching supply apparatus 10. Thus, the punched film-shaped electronic component F can be easily reused by mounting the base portion 220 in the mounting region M and holding the film-shaped electronic component F in the holding portion 210. Therefore, it is not necessary to provide a large-scale configuration like a supply device using a tray, and an increase in device price, an increase in the grounding area of the device, and a complicated device configuration can be suppressed.

(2) The base part 220 has the same shape as the base part 220 of the punching die unit 130. For this reason, the film-shaped electronic component F can be easily positioned by mounting in the mounting region M in the same manner as the punching die unit 130.

(3) At the supply position S where the punching supply device 10 supplies the film-like electronic component F, the punching supply device 10 has a guide portion 230 that guides the film-like electronic component F held by the holding portion 210. For this reason, the film-like electronic component F can be accurately positioned at the supply position S by holding the film-like electronic component F on the holding portion 210 and using the guide portion 230.

(4) The guide unit 230 includes a reversing mechanism 231 that reverses the holding unit 210. For this reason, the film-shaped electronic component F can be accurately positioned at the supply position S by causing the holding unit 210 to hold the film-shaped electronic component F in a direction in which the operator can easily work and then inverting it.

(5) The holding part 210 has a suction hole 213 that sucks the film-like electronic component F by negative pressure, and a connection part 214 that communicates with the suction hole 213 and is connected to a pneumatic circuit for supplying negative pressure. Is provided. For this reason, a pneumatic circuit for supplying negative pressure to the punching die unit 130 can be shared, and the film-like electronic component F can be supplied under the same control as the punching die unit 130.

(6) The punching and supplying apparatus 10 has a positioning part 121 for selectively positioning the base part 220 of the supply base 20 and the base part (die 131) of the punching die unit 130 in the mounting region M. For this reason, the supply base 20 can be easily mounted on the mounting area M from which the punching die unit 130 has been removed, and the punched film-like electronic component F can be supplied.

(7) When the punching die unit 130 is mounted in the mounting region M, the punching die unit 130 is made to perform a punching operation, and when the supply base 20 is mounted in the mounting region M, a drive mechanism that does not operate. 140. For this reason, the film-like electronic component F which has been punched by the supply base 20 can be supplied by the control more simplified than the punching die unit 130.

(8) It has a detection unit 150 that detects whether the punching die unit 130 is mounted or the film-like electronic component F is mounted in the mounting region M. For this reason, it is possible to automatically detect and control either the punching die unit 130 or the supply base 20.

(9) By using the punching supply device 10 provided so that the supply table 20 and the punching die unit 130 can be exchanged, the film-like electronic component F punched by the common punching supply device 10 and the punching The used film-like electronic component F can be supplied. Furthermore, by forming an electronic component mounting apparatus having such a punching supply device 10, it is possible to mount the punched film-shaped electronic component F without waste. Further, since the supply of the punched film-like electronic component F and the punched film-like electronic component F can be performed by the common punching supply device 10, the delivery device from the punching supply device 10 to the mounting device 30. 40 can be shared. As a result, it is possible to supply both the electronic components F while simplifying the configuration of the electronic component mounting apparatus without requiring a delivery device such as a robot arm dedicated to the punched film-shaped electronic component F.

[Modification]
(1) In the above aspect, the supply base 20 is provided movably with respect to the base part 220 by the guide part 230 including the reversing mechanism 231 and the slide mechanism 232. However, the film-like electronic component F held by the holding unit 210 may be positioned at the supply position S. For this reason, it is not always necessary to adopt such an aspect. For example, the configuration may be such that the film-like electronic component F comes to the supply position S when the slide mechanism 232 is omitted and the holding unit 210 is reversed by the reversing mechanism 231.

  Furthermore, as shown in FIG. 14, the holding part 210 may be a common member with the base part 220. The base body 211 of the holding part 210 is integrated with the base part 220. Then, the film-like electronic component F is sucked and held in the holding area 212 of the base 211 by the suction hole 213, and the operator mounts the base 211 in the mounting area M with the holding area 212 facing downward (FIG. 14 ( B)). Thereby, the punched film-like electronic component F can be supplied with a very simple configuration.

(2) The positioning unit 121 is not limited to the blocks 121a to 121c. The punching die unit 130, the supply base 20, and the mounting region M may be positioned by having an uneven shape that fits together. In addition, in the punching die unit 130 and the supply base 20 as described above, forming a common uneven shape in the base portion is also included in the common form.

(3) As the detection unit 150, a switch that switches when at least one of the punching die unit 130 and the supply base 20 is mounted in the mounting region M may be used. Moreover, you may use the camera which identifies at least one of the punching die unit 130 and the supply stand 20 with the imaged image. The mode switching unit 82 may switch modes in accordance with an input from the input device 91 together with or in place of the detection unit 150. The detection unit 150 may have a function of detecting a state in which neither the punching die unit 130 nor the supply base 20 is mounted in the mounting region M. That is, it may be possible to determine whether the punching die unit 130 is mounted, whether the punching die unit 130 is mounted on the supply base 20, or neither.

(4) It is preferable that the suction hole and the suction nozzle suppress the impact given to the film-like electronic component F. For example, it is preferable that the suction hole and the suction nozzle on the passing side change from the release of the negative pressure to the positive pressure. Further, the suction nozzle is preferably provided so as to be able to absorb an impact by including a buffer structure such as an elastic member so as to be able to advance and retreat.

(5) In the above aspect, when removing the punching die unit 130 from the mounting region M, the pneumatic circuit piping is removed from the punch 132, the supply base 20 is mounted, and the pneumatic circuit connecting portion 214 of the holding unit 210 is mounted. Connect the piping of the removed pneumatic circuit. However, the supply base 20 in which the pneumatic circuit pipe is connected to the connection part 214 of the pneumatic circuit of the holding part 210 is provided in advance, and the negative pressure from the vacuum source is changed to the punching die unit 130 and the supply base 20 by the switching valve. And may be selectively supplied. Switching of the negative pressure may be performed manually or based on detection by the beam sensor described above.

[Other Embodiments]
As mentioned above, although embodiment of this invention and the modification of each part were demonstrated, this embodiment and the modification of each part are shown as an example, and are not intending limiting the range of invention. These novel embodiments described above can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention and included in the invention described in the claims.

10, 10a, 10b Punching supply device 20 Film-like electronic component supply base 30 Mounting device 40 Delivery device 80 Control device 81 Mechanism control unit 82 Mode switching unit 83 Storage unit 84 Input / output control unit 91 Input device 92 Output device 110 Supply unit 120 Table 120a Opening 121 Positioning part 121a Block 121b Block 121c Block 130 Punch die unit 131 Die 131a Punch hole 132 Punch 133 Support part 133a Support column 133b Support plate 134 Shaft 140 Drive mechanism 150 Detection part 210 Holding part 211 Base 211a Mounting Surface 212 Holding region 212a Marking portion 213 Suction hole 214 Connection portion 220 Base portion 221 Stopper 230 Guide portion 231 Reversing mechanism 231a Frame body 231b Hinge 231c Opening 232 Slide mechanism 232a Guide rail 23 b Slider 310 Table 320 Pressure bonding part 321 Pressure member 322 Backup 420 Moving mechanism 430 Transfer device 431 First arm 431a Adsorption nozzle 432 Cleaning device 432a Brush 433 Second arm 433b Adsorption nozzle D Display panel F Film-like electronic component H Holding Head M Mounting area S Supply position ST Thin plate member

Claims (10)

A holding part for holding a film-like electronic component punched from a thin plate-like member;
A mounting region formed in a punching supply device that punches and supplies the film-like electronic component by a punching die unit, and is detachably provided in the mounting region from which the punching die unit is detached. A base part;
A film-like electronic component supply base comprising:   2. The film-type electronic component supply base according to claim 1, wherein the base portion has a form common to the base portion of the punching die unit.   3. The guide unit for guiding the film-like electronic component held by the holding portion at a supply position where the punching and feeding device supplies the film-like electronic component. Film-like electronic component supply stand.   The film-like electronic component supply base according to claim 3, wherein the guide unit has a reversing mechanism for reversing the holding unit. The holding part has a suction hole for sucking the film-like electronic component by negative pressure,
The film-like electronic component supply base according to any one of claims 1 to 4, further comprising a connection portion that communicates with the suction hole and is connected to a pneumatic circuit for supplying a negative pressure.   A punching supply apparatus in which the film-like electronic component supply base according to any one of claims 1 to 5 and the punching die unit are provided to be replaceable.   7. The punching supply according to claim 6, further comprising a positioning portion that selectively positions the base portion of the film-like electronic component supply base and the base portion of the punching die unit in the mounting region. apparatus.   When the punching die unit is mounted in the mounting region, the punching die unit performs a punching operation, and when the film-like electronic component supply base is mounted in the mounting region, the drive that does not operate The punching and feeding apparatus according to claim 6 or 7, further comprising a mechanism.   9. The detection unit according to claim 6, further comprising a detection unit configured to detect whether the punching die unit is mounted or the film-shaped electronic component supply base is mounted in the mounting region. Punching supply device. An electronic component mounting apparatus comprising the punching and supplying apparatus according to any one of claims 6 to 9,
A mounting device for mounting the film-like electronic component on a mounting target;
A delivery device that receives the film-like electronic component from the punching supply device and passes it to the mounting device;
An electronic component mounting apparatus comprising:

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