CN100519059C - Parts assembling device - Google Patents

Parts assembling device Download PDF

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Publication number
CN100519059C
CN100519059C CNB2005800419813A CN200580041981A CN100519059C CN 100519059 C CN100519059 C CN 100519059C CN B2005800419813 A CNB2005800419813 A CN B2005800419813A CN 200580041981 A CN200580041981 A CN 200580041981A CN 100519059 C CN100519059 C CN 100519059C
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CN
China
Prior art keywords
mentioned
parts
circuit substrate
supporting tool
tool
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Active
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CNB2005800419813A
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Chinese (zh)
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CN101072656A (en
Inventor
池田和仁
富坚德和
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication of CN101072656A publication Critical patent/CN101072656A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/02—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for connecting objects by press fit or for detaching same
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • Liquid Crystal (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Automatic Assembly (AREA)

Abstract

A component assembling device positioning one end of a circuit board (203) on a backup tool (12) and connecting one end of an electronic component on the upper surface of the one end of the circuit board. The component assembling device has a conveyance cable (21) that conveys the circuit board to the backup tool and has a reception member (30) and a pressing member (35) that receive the circuit board conveyed by the conveyance table and position and hold the one end on the backup tool.

Description

The apparatus for assembling of parts
Technical field
The present invention relates to circuit substrate is connected to via electronic unit the apparatus for assembling and the assemble method of the parts on the display board.
Background technology
In the assembling procedure of display unit, for example shown in Fig. 5 A, at first engage by outer lead, on the limit of the regulation in 4 limits of the periphery of liquid crystal panel 200, such shown in Fig. 5 C, anisotropic conductive member 204 installations by band shape are equipped with liquid crystal drive with IC's, electronic unit 202 as automatic connector of the belt of second parts (TAB:Tape Automated Bonding) etc., make the liquid crystal panel 200 of charged subassembly, then, part to the electronic unit 202 of the liquid crystal panel 200 that has electronic unit, shown in Fig. 5 B, be electrically connected circuit substrate 203 like that, assemble liquid crystal panel 200 as first parts.Above-mentioned circuit substrate 203 and electronic unit 202, same with electronic unit 202 shown in Fig. 5 C with being connected of liquid crystal panel 200, use anisotropic conductive member 204.
The assembling operation that uses under the situation of carrying out such operation has first objective table of carrying the liquid crystal panel 200 that has electronic unit.The liquid crystal panel 200 that will have electronic unit supplies on this first objective table, and this liquid crystal panel 200 is transported to pressure contact portion.Pressure contact portion has supporting tool and can be located at the pressurizing tool of the top of this supporting tool up and down drivingly.
On the other hand, foregoing circuit substrate 203 is carried by second objective table.On this second objective table, foregoing circuit substrate 203 is positioned, and to be held in an end that makes the above-mentioned electronic unit 202 of being connected with of this circuit substrate outstanding.On the upper surface of this end, be pasted with banded anisotropic conductive member 204.
And above-mentioned second objective table is transported to foregoing circuit substrate 203 on the above-mentioned supporting tool, will be pasted with an end mounting of anisotropic conductive member 204 to the upper surface of supporting tool.Then, by above-mentioned first objective table liquid crystal panel 200 is transported on the supporting tool, what make the end of electronic unit 202 on the one side that is connected this liquid crystal panel 200 and foregoing circuit substrate 203 is provided with partially overlapping of anisotropic conductive member 204.
When electronic unit 202 overlapped a end at circuit substrate 203, the pressurizing tool that is arranged on the top of supporting tool descended, with the intersection pressurized, heated of circuit substrate 203 with electronic unit 202.Thus, above-mentioned anisotropic conductive member 204 fusions sclerosis, thus circuit substrate 203 is connected with above-mentioned electronic unit 202.
When by pressurizing tool anisotropic conductive member 204 being carried out pressurized, heated, being molten to curing from anisotropic conductive member 204, will to spend considerable time be inevitable.On the other hand, circuit substrate 203 is transported to second objective table on the supporting tool, keeps this circuit substrate 203 with state continuance with respect to above-mentioned supporting tool location.Therefore, after circuit substrate 203 and electronic unit 202 were connected and fixed, this circuit substrate 203 till liquid crystal panel 200 transports from supporting tool, can not move on to next operation via electronic unit 202 by first objective table.
That is, can not carry out the operation that circuit substrate 203 and electronic unit 202 are connected and fixed and second objective table abreast retreats from the position of supporting tool and moves to the supply unit of circuit substrate 203 and the operation that will be carried to supporting tool by the new circuit substrate that this supply unit is supplied with.
Therefore, elongated for circuit substrate 203 is connected to cycle time required on the electronic unit 202, become a reason that causes productivity to reduce.
Summary of the invention
The invention provides a kind of during to the pressurization of first parts and second parts, can be with the apparatus for assembling and the assemble method of the parts of next first component feed to the supporting tool.
The apparatus for assembling of parts of the present invention is characterized in that, an end of first parts is positioned on the supporting tool, and an end of second parts is overlapped upper surface in this end, and this intersection is connected with the pressurizing tool pressurization, possesses:
Conveying mechanism, with above-mentioned first component feed to above-mentioned supporting tool; And
Detent mechanism is accepted above-mentioned first parts of being carried by this conveying mechanism, and location, an end is remained on the above-mentioned supporting tool.
The assemble method of parts of the present invention is characterized in that, an end of first parts is positioned on the supporting tool, and an end of second parts is connected on the upper surface of this end, possesses:
Above-mentioned first parts are transported to operation on the above-mentioned supporting tool by conveying mechanism;
The location keeps being transported to above-mentioned first parts on the supporting tool, makes the one end be positioned at operation on the above-mentioned supporting tool;
One end of second parts is overlapped upper surface in an end of first parts that are positioned, the operation that this intersection pressurization is connected; And
If begun the pressurization of an end of first parts and second parts, above-mentioned conveying mechanism is retreated after, supply with the operation of next first parts and standby to this conveying mechanism.
Description of drawings
Fig. 1 is the side view of schematic configuration of the apparatus for assembling of expression one embodiment of the present invention.
Fig. 2 be expression delivery circuit substrate conveying mechanism, with the stereogram that is located at the detent mechanism on the supporting tool.
Fig. 3 A will remain on the circuit substrate that keeps on the workbench key diagram with respect to the state of supporting tool location.
Fig. 3 B stays the substrate behind the location and the key diagram that keeps the state that workbench retreats.
Fig. 3 C is the key diagram by the state of an end of supporting tool support circuit substrate.
Fig. 4 A is the end contact that makes electronic unit at the key diagram by the state of an end upper surface of supporting tool circuit supported substrate.
Fig. 4 B is with by the intersection of supporting tool circuit supported substrate and the electronic unit key diagram with the state of pressurizing tool pressurization.
Fig. 4 C is a key diagram of supplying with the state of next circuit substrate when the liquid crystal panel that is connected with circuit substrate is retreated.
Fig. 5 A is the vertical view that is connected with the state of electronic unit on liquid crystal panel.
Fig. 5 B is the vertical view that is connected with circuit substrate on the electronic unit that is connected on the liquid crystal panel.
Fig. 5 C is the side view that is connected with circuit substrate on the electronic unit that is connected on the liquid crystal panel.
The specific embodiment
Below, with reference to the description of drawings one embodiment of the present invention.
Fig. 1 is the summary construction diagram of apparatus for assembling of the present invention, and this device possesses pedestal 1.On this pedestal 1, be provided with countertop unit 2.This countertop unit 2 has along directions X and is located at X workbench 3 on the said base 1 movably.This X workbench 3 is driven along the directions X shown in the arrow among the figure by the X drive source 4 of an end that is located at said base 1.
On above-mentioned X workbench 3, the edge is provided with Y workbench 5 movably with the Y direction that directions X intersects.This Y workbench 5 is driven along the Y direction by the Y drive source 6 of a side that is located at above-mentioned X workbench 3.
On above-mentioned Y workbench 5, on horizontal plane, rotatably be provided with θ workbench 7 as first objective table.The θ drive source 8 that this θ workbench 7 is located at a side of above-mentioned Y workbench 5 drives along direction of rotation.Thereby above-mentioned θ workbench 7 can drive along X, Y and θ direction.
Shown in Fig. 5 A, Fig. 5 C, at above-mentioned θ workbench 7, be supplied in a side by anisotropic conductive member 204 and be fixedly connected with liquid crystal panel 200 as the electronic unit 202 of second parts, for example the means by vacuum suction etc. immovably are held fixing.In addition, as shown in Figure 1, liquid crystal panel 200 makes the periphery that comprises the one side that is connected with electronic unit 202 outstanding from the outer peripheral face of θ workbench 7.
On above-mentioned electronic unit 202, be connected and fixed circuit substrate 203 by pressure contact portion 11 as described later as first parts.This pressure contact portion 11 has along the elongated tabular supporting tool 12 of Y direction.This supporting tool 12 can be that the Z direction drives by a Z drive source 13 along the vertical direction.Primary heater 14 is housed in the top of this supporting tool 12.
Above supporting tool 12, be provided with the opposed pressurizing tool 15 in the upper surface that makes lower surface and above-mentioned supporting tool 12.This pressurizing tool 15 is provided with secondary heater 16 in the bottom, be that above-below direction drives by the 2nd Z drive source 17 along the Z direction shown in the arrow among the figure.
Thereby, as described later, heat while use above-mentioned pressurizing tool 15 pressurizations to pass through first, second heater 14,16 if circuit substrate 203 and electronic unit 202 are overlapped on the upper surface of above-mentioned supporting tool 12 and with this intersection via anisotropic conductive member 204, then make above-mentioned anisotropic conductive member 204 melting and solidifications and circuit substrate 203 and electronic unit 202 can be connected and fixed.
Foregoing circuit substrate 203 is transported on the above-mentioned supporting tool 12 by the conveying workbench 21 that constitutes conveying mechanism.Above-mentioned supporting tool 12 will be fixedly installed on side view along an end of directions X and be on the upper surface of movable body 22 of L font as depicted in figs. 1 and 2.
Both ends in the Y direction of intersecting with directions X of the lower surface of above-mentioned movable body 22 are provided with a pair of slide block 23, and these slide blocks 23 are fastened on the pair of guide rails 25 movably.This guide rail 25 is arranged on the said base 1 along directions X by pallet 24.
Above-mentioned movable body 22 is come and gone along directions X and is driven.As movable body 22 is come and gone the driving mechanism that drives along directions X, also can use the screw rod or the pump housing that drive by drive source rotation, but in this embodiment by by being configured in a plurality of magnet on the guide rail 25 with predetermined distance and being located at the linear motor driven that the solenoid (all not shown) on the above-mentioned slide block 23 constitutes.
As shown in Figure 2, the width both ends in an end of the above-mentioned conveying workbench 21 outstanding from a side of above-mentioned movable body 22 are opened and are formed with rectangular-shaped a pair of recess 26 to end face.Shown in chain-dotted line among this figure, foregoing circuit substrate 203 is supplied to and is positioned on this conveying workbench 21.Circuit substrate 203 makes an end give prominence to and be supplied to from the end face of conveying workbench 21, flexibly pushes maintenance by 3 retaining members 27 under this state.
In addition, the upper surface in an end of circuit substrate 203 spreads all over the width total length and is pasted with banded anisotropic conductive member 204 in advance.
Above-mentioned retaining member 27 is bent to form by possessing flexible band plate, and leading section flexibly pushes the upper surface of foregoing circuit substrate 203, and the rear end links on the bar 29a of the Z pump housing 29 that the side be fixed on above-mentioned movable body 22 is provided with.
Thereby if drive the bar 29a of an above-mentioned Z pump housing 29 to projected direction, then above-mentioned retaining member 27 rises shown in chain-dotted line among Fig. 1 like that, and leading section leaves from the circuit substrate 203 on the conveying workbench 21, removes the hold mode of this circuit substrate 203.Thus, can be with circuit substrate 203 with respect to above-mentioned conveying workbench 21 dismounting.
Side in above-mentioned movable body 22 sides of above-mentioned supporting tool 12 makes axis normal, to be provided with a pair of the 2nd Z pump housing 31 with a pair of recess 26 corresponding intervals that form on above-mentioned conveying workbench 21.On the bar 31a of the 2nd Z pump housing 31, make upper surface that member to undertake 30 flatly is installed.This member to undertake 30 is rectangular-shaped, and forms the size that enters in the recess 26 that is formed on the above-mentioned conveying workbench 21.
In the side of above-mentioned supporting tool 12, make a pair of Y pump housing 32 of an edge being provided with respectively along the Y direction than a pair of the 2nd Z pump housing 31 both ends in the outer part.Be provided with the Y movable link 33 of L word shape slidably at the upper surface of this Y pump housing 32.One side of this Y movable link 33 is attached on the bar (not shown) of the above-mentioned Y pump housing 32.
At the upper surface of above-mentioned Y movable link 33, be provided with the 3rd Z pump housing 34 with making axis normal.On the bar 34a of the 3rd Z pump housing 34, being mounted with side view is an end of the pushing member 35 of crank-like.Thereby a pair of pushing member 35 can be along driving near the Y direction of separating mutually and driving along the Z direction.
Because the shape of above-mentioned pushing member 35 is crank-like, so, if a pair of pushing member 35 drives to approaching Y direction, then be fed into the two ends of the circuit substrate 203 on the supporting tool 12, circuit substrate 203 is located with respect to the Y direction by the vertical medial side pushing of this a pair of pushing member 35.
In addition, the another side of the level of pushing member 35 is fastened on the upper surface at the both ends of circuit substrate 203.Thus, when the pressurizing tool 15 to circuit substrate 203 and the intersection pressurized, heated of electronic unit 202 rises, electronic unit 202 is attached on the pressurizing tool 15, foregoing circuit substrate 203 will rise with this pressurizing tool 15 via electronic unit 202, then engages with this circuit substrate 203 and stops rising.Thus, peel off above-mentioned electronic unit 202 from pressurizing tool 15.
That is, the medial side of pushing member 35 is with the location division of circuit substrate 203 along Y direction location, the maintaining part of another side for stoping circuit substrate 203 to rise with electronic unit 202.
Then, use the apparatus for assembling of said structure, the action of connecting circuit substrate 203 on the electronic unit 202 that is connected in liquid crystal panel 200 with reference to Fig. 3 A～Fig. 3 C and Fig. 4 A～Fig. 4 C explanation.
At first, with retaining member 27 shown in chain-dotted line among Fig. 1 under the state that ascent direction drives, after supplying with circuit substrate 203 on the conveying workbench 21, holding circuit substrate 203 then drives this conveying workbench 21 to approach supporting tool 12 to directions X as shown in Figure 3A like that if retaining member 27 descends.
If conveying workbench 21 approaches supporting tool 12, a pair of member to undertake 30 that then is located on the side of supporting tool 12 is positioned at and the open a pair of recess 26 opposed positions that form on the end face of conveying workbench 21.That is, a pair of member to undertake 30 is positioned at the position with the lower surface of the part that is positioned at recess 26 of circuit substrate 203.
Thus, circuit substrate 203 is oriented to, from the outstanding end of the end face of conveying workbench 21, promptly the lower surface that upper surface is pasted with the end of anisotropic conductive member 204 be positioned at supporting tool 12 the upper surface above.That is, circuit substrate 203 is positioned on the directions X by conveying workbench 21.
As shown in Figure 3A, ifs circuit substrate 203 is positioned on the directions X with respect to supporting tool 12, and then the 2nd Z pump housing 31 and 34 actions of the 3rd Z pump housing are risen member to undertake 30 and pushing member 35.Thus, the lower surface of member to undertake 30 support circuit substrates 203, the other end of pushing member 35 becomes the height roughly the same with circuit substrate 203.
Then, the Y pump housing 32 action and drive a pair of pushing member 35 to approaching Y direction mutually, pushing keep the both ends along the length direction of Y direction of foregoing circuit substrate 203.Thus, by pushing member 35, circuit substrate 203 is positioned on the Y direction.
Like this, if circuit substrate 203 is located with respect to X, Y direction, then drive the bar 29a of a Z pump housing 29 to projected direction.Thus, retaining member 27 rises shown in chain-dotted line among Fig. 1 like that, the hold mode of relieving circuit substrate 203.
The hold mode of ifs circuit substrate 203 is disengaged, and then shown in Fig. 3 B, conveying workbench 21 retreats and moves to the supply unit of not shown circuit substrate 203, is supplied to new circuit substrate 203 here and is held member 27 and keeps.
On the other hand, if circuit substrate 203 is positioned on X, the Y direction with respect to supporting tool 12, then the 2nd Z pump housing 31 and the action of the 3rd Z pump housing 34 descends a pair of pushing member 35 at a pair of member to undertake 30 and the width two ends of support circuit substrate 203 of the lower surface of support circuit substrate 203 simultaneously.Thus, shown in Fig. 3 C, the lower surface that is bonded with an end of anisotropic conductive member 204 at the upper surface of circuit substrate 203 is supported by the upper surface of supporting tool 12.
Then, the direction that approaches supporting tool 12 to directions X drives countertop unit 2.In the position of the regulation of directions X, made a video recording in an end that is connected with electronic unit 202 of liquid crystal panel 200 by not shown camera.Then, drive X workbench 3, Y workbench 5 and θ workbench 7, an end of electronic unit 202 is positioned to, overlap across small interval on the upper surface of an end that is being positioned at the circuit substrate 203 on the supporting tool 12 according to this image pickup result.
Like this, if electronic unit 202 is located with liquid crystal panel 200, then supporting tool 12 is driven to ascent direction by a Z drive source 13.Thus, the member to undertake 30 and the pushing member 35 that are located at integratedly on the supporting tool 12 rise with above-mentioned supporting tool 12 one under the state of holding circuit substrate 203, so, shown in Fig. 4 A, an end of electronic unit 202 contacts with the anisotropic conductive member 204 of an end that is arranged on circuit substrate 203.
That is, because member to undertake 30 and pushing member 35 be provided with integratedly with supporting tool 12, so, even supporting tool 12 rises, the X of circuit substrate 203 and supporting tool 12, the relative position on the Y direction are not produced deviation.
Then, shown in Fig. 4 B, drive pressurizing tool 15 to descent direction by the 2nd Z drive source 17.Thus, the intersection of circuit substrate 203 and electronic unit 202 is by supporting tool 12 and pressurizing tool 15 pressurized, heated, so anisotropic conductive member 204 melting and solidifications are fastened on circuit substrate 203 on the electronic unit 202.
Pressurizing tool 15 descend and to the intersection pressurized, heated of circuit substrate 203 and electronic unit 202 during, retreat into supply unit and the conveying workbench 21 that is supplied to next circuit substrate 203 carries out standby till advancing near the supporting tool 12.
Then, in the pressurized, heated end of circuit substrate 203 that carries out with pressurizing tool 15 and electronic unit 202, after they were fixed by the anisotropic conductive member 204 of fusion sclerosis, shown in Fig. 4 C, pressurizing tool 15 rose and supporting tool 12 declines.At this moment, pressurizing tool 15 is attached on the electronic unit 202, and circuit substrate 203 might rise with this pressurizing tool 15 via electronic unit 202.
But the both ends of circuit substrate 203 have the another side of the pushing member 35 of crank shape to keep and can not float upward.Therefore, even electronic unit 202 is wanted to rise with pressurizing tool 15, also can electronic unit 202 be peeled off from pressurizing tool 15 by the confining force of pushing member 35.
If pressurizing tool 15 rises, then drive a pair of pushing member 35 to opening direction, the platform unit 2 that proceeds with one's work retreats, and circuit substrate 203 is sent from supporting tool 12 with liquid crystal panel 200 via electronic unit 202.Meanwhile, above-mentioned conveying workbench 21 advances, and new circuit substrate 203 is located at supporting tool 12 upper edge directions Xs and Y direction.
Thereby, apparatus for assembling according to such structure, in crimping one end of the circuit substrate that undertaken by pressurizing tool 15 203, almost do not have stand-by time and next circuit substrate 203 can be supplied with supporting tools 12, so shortening that can time performance period with electronic unit 202.
Promptly, with constitute the conveying mechanism of delivery circuit substrate 203 conveying workbench 21, separate with the detent mechanism that constitutes by member to undertake 30 and pushing member 35, this detent mechanism keeps the circuit substrate 203 carried by this conveying workbench 21 with respect to supporting tool 12 location.
Thus, if conveying workbench 21 is given member to undertake 30 with circuit substrate 203 handing-over, this conveying workbench 21 is freely retreated.Promptly, during with pressurizing tool 15 crimping circuit substrates 203 and electronic unit 202, make the supply unit of above-mentioned conveying workbench 21 return circuit substrates 203 abreast and supply with the operation of new circuit substrate 203 to this conveying workbench 21, can near standby supporting tool 12.
Thereby, can be shortened cycle time by supply unit and supply with new circuit substrate 203 and be transported near required time of supporting tool 12 by this conveying workbench 21 to conveying workbench 21.
In an above-mentioned embodiment, to being illustrated as the circuit substrate of first parts and situation as the electronic unit crimping of second parts, but, first, second parts are not limited to circuit substrate and electronic unit, and for example, first parts can be liquid crystal panels, second parts can be electronic units, main points are, so long as an end of two parts overlapped and to they the intersection pressurization and the situation of crimping just can be used the present invention.
In addition, be located at the side of supporting tool with driving the member to undertake that constitutes detent mechanism and the 2nd z pump housing that pushes member and the Y pump housing and the 3rd Z pump housing, but also can be located on the pedestal.
According to the present invention, because carrying out first parts respectively keeps with respect to the conveying of supporting tool and this first parts location with respect to supporting tool, so first parts are connected on second parts during, can be with next first component feed to supporting tool and standby.

Claims (3)

1, a kind of apparatus for assembling of parts, it is characterized in that, one end of first parts is positioned on the supporting tool, one end of second parts is overlapped upper surface in an end of above-mentioned first parts, this intersection is connected with the pressurizing tool pressurization, and the apparatus for assembling of above-mentioned parts possesses:
Conveying mechanism, with above-mentioned first component feed to above-mentioned supporting tool; And
Detent mechanism is accepted above-mentioned first parts of being carried by this conveying mechanism, an end of above-mentioned first parts is located remain on the above-mentioned supporting tool;
Above-mentioned detent mechanism possesses:
Member to undertake is arranged to and can be driven up and down, and accepts first parts of being carried by above-mentioned conveying mechanism in lifting position; And
A pair of pushing member, be arranged to and drive up and down and horizontal drive, when above-mentioned first parts are handed off on the above-mentioned member to undertake, drive above-mentioned a pair of pushing member in lifting position along mutual approaching horizontal direction, after pushing the both ends that keep above-mentioned first parts, drive above-mentioned a pair of pushing member with above-mentioned member to undertake to descent direction, an end of above-mentioned first parts is positioned on the above-mentioned supporting tool.
2, the apparatus for assembling of parts as claimed in claim 1 is characterized in that,
Above-mentioned conveying mechanism possesses:
Conveying workbench, above-mentioned first parts of mounting;
Retaining member keeps being positioned in first parts on this conveying workbench, so that these first parts can bias motion in conveying.
3, the apparatus for assembling of parts as claimed in claim 1, it is characterized in that, when above-mentioned pressurizing tool rises to the intersection pressurization back of above-mentioned first, second parts, above-mentioned pushing member stops above-mentioned first parts along with above-mentioned pressurizing tool rises, thereby stops above-mentioned second parts that are fixed on above-mentioned first parts to rise along with above-mentioned pressurizing tool.
CNB2005800419813A 2004-12-09 2005-09-13 Parts assembling device Active CN100519059C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004357022A JP4627654B2 (en) 2004-12-09 2004-12-09 Parts assembling apparatus and assembling method
JP357022/2004 2004-12-09

Publications (2)

Publication Number Publication Date
CN101072656A CN101072656A (en) 2007-11-14
CN100519059C true CN100519059C (en) 2009-07-29

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JP (1) JP4627654B2 (en)
KR (1) KR100890925B1 (en)
CN (1) CN100519059C (en)
WO (1) WO2006061933A1 (en)

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JP5386238B2 (en) * 2009-06-04 2014-01-15 株式会社日立ハイテクノロジーズ Panel substrate transfer device and display panel module assembly device
WO2011004544A1 (en) * 2009-07-09 2011-01-13 パナソニック株式会社 Component mounting apparatus and method thereof
JP5360323B1 (en) * 2013-04-26 2013-12-04 富士ゼロックス株式会社 Viscosity agent thickness adjusting device, mounting device, and manufacturing method of substrate device
JP6675357B2 (en) * 2016-08-16 2020-04-01 芝浦メカトロニクス株式会社 Crimping device
CN117620645B (en) * 2024-01-26 2024-03-26 海博瑞电子(江苏)有限公司 Automatic packaging device for display screen

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JP2947491B2 (en) * 1991-04-26 1999-09-13 株式会社アマダ Plate processing equipment
JP3768620B2 (en) * 1996-10-30 2006-04-19 株式会社アマダエンジニアリングセンター Plate processing method
JPH11300440A (en) * 1998-04-17 1999-11-02 Amada Co Ltd Work carry-in and carry-away device and work carrying-in and carrying-away method using its device
JP3722053B2 (en) * 2001-11-27 2005-11-30 松下電工株式会社 Plate material coupling method and plate material coupling device
JP2004004373A (en) * 2002-05-31 2004-01-08 Optrex Corp Flexible board and alignment method for flexible board and liquid crystal panel

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WO2006061933A1 (en) 2006-06-15
JP4627654B2 (en) 2011-02-09
KR20070067243A (en) 2007-06-27
CN101072656A (en) 2007-11-14
JP2006163173A (en) 2006-06-22
KR100890925B1 (en) 2009-04-03

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