JP5360323B1 - Viscosity agent thickness adjusting device, mounting device, and manufacturing method of substrate device - Google Patents

Abstract

An object of the present invention is to suppress non-uniform thickness of a viscous agent on a rotating part due to foreign matter in the viscous agent and to reduce the amount of the viscous agent that flows to the inner peripheral side or outer peripheral side of the rotating part.
A rotating part on which a viscous agent is placed and an inclined part with respect to the rotation direction of the rotating part, the thickness of the viscous agent being made constant, and foreign matter in the viscous agent inside the rotating part It is connected to the guide part that guides to the peripheral side or the outer peripheral side, and the downstream end part of the guide part in the rotational direction, and the inclination of the guide part restricts the flow of the viscous agent to the inner peripheral side or the outer peripheral side. A restricting portion, and an opening provided at a connecting portion between the guide portion and the restricting portion and allowing the foreign matter to pass therethrough.
[Selection] Figure 3

Description

  The present invention relates to a method for manufacturing a viscosity agent thickness adjusting device, a mounting device, and a substrate device.

  Patent Document 1 discloses a configuration in which a squeegee for making a conductive resin paste with a certain thickness is provided to be inclined in the direction opposite to the rotation direction of the table with respect to the radial direction of the table.

JP-A-6-112242

  The present invention suppresses the non-uniform thickness of the viscous agent on the rotating part due to foreign matter in the viscous agent, and reduces the amount of the viscous agent that flows to the inner peripheral side or outer peripheral side of the rotating part. Let it be an issue.

  The invention of claim 1 is provided with a rotating part on which a viscous agent is placed, and an inclination with respect to the rotation direction of the rotating part, the thickness of the viscous agent is made constant, and foreign matter in the viscous agent is rotated. Connected to the inner peripheral side or the outer peripheral side of the part and the downstream end of the guide part in the rotational direction, and the viscous agent flows to the inner peripheral side or the outer peripheral side due to the inclination of the guide part. A restricting portion that restricts the amount of the foreign matter, and an opening that is provided at a connecting portion between the guide portion and the restricting portion and allows the foreign matter to pass therethrough.

  According to a second aspect of the present invention, the guide portion guides the foreign matter to the outer peripheral side of the rotating portion, and the restricting portion restricts the viscous agent from flowing to the outer peripheral side due to the inclination of the guide portion.

  According to a third aspect of the present invention, there is provided a component positioning unit for positioning a component, a substrate positioning unit for positioning a substrate, the viscous agent thickness adjusting device according to claim 1 or 2, and a rotating unit of the viscous agent thickness adjusting device. A transfer unit that transfers the adhesive as a viscous agent placed on the substrate positioned on the substrate positioning unit; and the component positioned by the component positioning unit on the bonding agent transferred by the transfer unit. A transfer mechanism for transferring.

  According to a fourth aspect of the present invention, there is provided a component positioning step of positioning the component by the component positioning portion of the mounting apparatus according to claim 3, a substrate positioning step of positioning the substrate by the substrate positioning portion, and the viscosity agent thickness. A bonding agent transfer step of transferring the bonding agent placed on the rotating portion of the adjusting device to the substrate positioned on the substrate positioning portion by the transfer portion; and the component on the bonding agent transferred by the transfer portion. A transfer step of transferring the parts positioned in the positioning step by the transfer mechanism.

  According to the configuration of the first aspect of the present invention, compared with the case where the opening and the limiting portion in the present configuration are not provided, it is possible to prevent the thickness of the viscous agent on the rotating portion from becoming uneven due to the foreign matter in the viscous agent. In addition, the amount of the viscous agent that flows to the inner peripheral side or the outer peripheral side of the rotating part can be reduced.

  According to the structure of Claim 2 of this invention, a foreign material can be moved effectively using the centrifugal force in a rotation part.

  According to the structure of Claim 3 of this invention, compared with the case where the viscosity agent thickness adjustment apparatus in this structure is not provided, the joining defect of the components with respect to a board | substrate can be suppressed.

  According to the manufacturing method of Claim 4 of this invention, compared with the case where it does not have the bonding agent transcription | transfer process in this manufacturing method, the joining defect of the components with respect to a board | substrate can be suppressed.

It is a perspective view which shows the structure of the manufacturing apparatus which concerns on this embodiment. It is the sectional view on the AA line of FIG. 3 (A) which shows the structure of the bonding agent supply apparatus which concerns on this embodiment. It is a figure which shows the structure of the bonding agent supply apparatus which concerns on this embodiment. (A) is a plan view and (B) is a side view. It is a perspective view which shows the structure of the adjustment member which concerns on this embodiment. It is a figure which shows the structure of the head member of the adjustment member shown in FIG. (A) is a front view, (B) is a side view, and (C) is a bottom view. It is a perspective view which shows the structure of the collet used for mounting to the printed wiring board of the semiconductor element based on this embodiment. It is a sectional side view of the collet shown in FIG. It is a top view which shows the state by which the semiconductor element was mounted in the printed wiring board. It is a figure which shows the structure of the bonding agent supply apparatus which concerns on a comparative example. (A) is a plan view and (B) is a side view. It is a top view which shows the structure of the adjustment member which concerns on a modification. It is a bottom view which shows the structure of the head member of the adjustment member which concerns on a modification.

  Below, an example of an embodiment concerning the present invention is described based on a drawing.

(Manufacturing apparatus 10)
First, the configuration of the manufacturing apparatus 10 according to the present embodiment will be described. FIG. 1 is a perspective view showing the configuration of the manufacturing apparatus 10. In addition, the following X direction, -X direction, Y direction, -Y direction, Z direction (upward) and -Z direction (downward) are arrow directions shown in the figure. Unless otherwise specified, “X direction” is “X direction or −X direction”, “Y direction” is “Y direction or −Y direction”, and “Z direction” is “Z direction or −Z direction”. I mean. In addition, “x” in “○” in the figure means an arrow from the front to the back of the page, and “•” in “○” in the figure. Means an arrow heading from the back of the page to the front.

  The manufacturing apparatus 10 is a manufacturing apparatus that manufactures a printed wiring board device (an example of a board device). As illustrated in FIG. 1, a supply unit 13 that supplies a semiconductor element 12 (an example of a component), and the semiconductor element 12. Element positioning unit 20 (an example of a component positioning unit) and a board positioning unit 40 that positions a printed wiring board 44 (an example of a board).

  The manufacturing apparatus 10 further includes a bonding agent supply device 110 that supplies a bonding agent G (an example of a viscous agent) for bonding the semiconductor elements 12 to the printed wiring board 44, and a semiconductor element from the supply unit 13 to the element positioning unit 20. And a transfer device 60 (an example of a transfer mechanism) for transferring the semiconductor element 12 positioned by the element positioning unit 20 to the printed wiring board 44 positioned by the substrate positioning unit 40. Yes.

  Further, the manufacturing apparatus 10 controls the operation (drive) of each component of the manufacturing apparatus 10 (the supply unit 13, the element positioning unit 20, the substrate positioning unit 40, the bonding agent supply device 110, the transfer device 50, and the transfer device 60). A control unit 90 is provided.

  In the manufacturing apparatus 10, the mounting apparatus 100 for mounting the semiconductor element 12 on the printed wiring board 44 includes the element positioning unit 20, the board positioning unit 40, the bonding agent supply device 110, and the transfer device 60. Has been.

(Semiconductor element 12)
As the semiconductor element 12 mounted (mounted) on the printed wiring board 44 by the mounting apparatus 100 (manufacturing apparatus 10), for example, an elongated semiconductor element (for example, an LED chip) having a rectangular cross section is used (for example, LED chip). (See FIG. 6). Specifically, the semiconductor element 12 has, for example, a width (Y direction length) of 125 μm, a length (X direction length) of 6 mm, and a height (Z direction length) of 300 μm. Furthermore, the semiconductor element 12 has a parallelogram cross-sectional shape (see FIG. 7). Further, a functional part 11 (see FIG. 8) such as a circuit pattern or a light emitting element is provided on the surface (upper surface) of the semiconductor element 12.

(Supply unit 13)
As shown in FIG. 1, the supply unit 13 includes a holding unit 15 that holds the wafer 14 and a moving mechanism 17 that moves the holding unit 15 in the X direction and the Y direction. In the supply unit 13, a plurality of semiconductor elements 12 are cut out from the wafer 14 by cutting the wafer 14 held by the holding unit 15. Further, in the supply unit 13, the moving mechanism 17 moves the holding unit 15 in the X direction and the Y direction, so that the semiconductor element 12 to be mounted is positioned at a predetermined pickup position by the transfer device 50. Yes.

  The supply unit 13 further includes a tray on which the semiconductor element 12 is placed, a moving mechanism that moves the tray in the X direction and the Y direction, and a transfer mechanism that transfers the semiconductor element 12 from the wafer 14 to the tray. The structure which has these. In this configuration, the transfer mechanism transfers the semiconductor element 12 from the wafer 14 to the tray, and the moving mechanism moves the tray in the X direction and the Y direction, so that the semiconductor element 12 placed on the tray is predetermined by the transfer device 50. It is designed to be located at the picked-up position.

(Transfer device 50)
As shown in FIG. 1, the transfer device 50 includes a suction device 52 that sucks the semiconductor element 12 with the suction nozzle 54, and a moving mechanism 53 that moves the suction device 52. In the transfer device 50, the suction device 52 holds the semiconductor element 12 in the suction nozzle 54 by sucking the semiconductor element 12 located at the pickup position in the supply unit 13 with the suction nozzle 54. In the transfer device 50, the semiconductor element 12 is held on the plate 34 of the positioning table 30 to be described later by moving the suction device 52 in the arrow A direction by the moving mechanism 53 while the semiconductor element 12 is held by the suction nozzle 54. The semiconductor element 12 is temporarily placed at a temporary placement position on the plate 34. As the moving mechanism 53 of the transfer device 50, for example, a three-axis robot that can move in the X direction, the Y direction, and the Z direction is used.

(Element positioning unit 20)
As shown in FIG. 1, the element positioning unit 20 positions a positioning table 30 as a table on which the semiconductor element 12 is placed and the semiconductor element 12 temporarily placed on the positioning table 30 at a predetermined positioning position. The positioning member 22 and a moving mechanism 29 that moves the positioning member 22 in the X direction and the Y direction are provided.

  The positioning table 30 sucks the air in the internal space of the cylindrical portion 32 by sucking the internal space of the cylindrical portion 32 having the opening portion 33 in the upper portion, the plate 34 provided in the opening portion 33 of the cylindrical portion 32, and negative pressure in the internal space. A suction device 36. A plurality of suction holes 38 are formed in the plate 34. The plurality of suction holes 38 pass through the plate 34 and communicate with the internal space of the cylindrical portion 32.

  As shown in FIG. 1, the positioning member 22 has a plate shape and includes a main body portion 22A and a pair of claw portions 22B extending from the main body portion 22A in the X direction. The pair of claw portions 22B are provided apart in the Y direction so that the semiconductor element 12 can be disposed therebetween. By the pair of claw portions 22B and the main body portion 22A, the positioning member 22 is configured in a U shape (U shape) in plan view (viewed in the −Z direction). The positioning member 22 is moved while maintaining a non-contact state with respect to the plate 34 so that the positioning member 22 is not attracted to the plate 34 and receives movement resistance.

  In the positioning member 22, the claw portion 22B is abutted against one of the side surfaces 12A (see FIG. 6) of the semiconductor element 12 to move the semiconductor element 12, and the semiconductor element 12 is positioned (positioned) at a predetermined position. Out).

  In the present embodiment, the semiconductor element 12 is positioned by selecting one of the pair of claw portions 22B. Therefore, the positioning member 22 may have a configuration without one of the pair of claw portions 22B.

(Substrate positioning part 40)
As shown in FIG. 1, the board positioning unit 40 includes a pair of transport members (for example, conveyors) 42 that transport the printed wiring board 44 in the X direction. The pair of transport members 42 are arranged apart in the Y direction so that the printed wiring board 44 can be introduced therebetween.

  In the board positioning unit 40, the printed wiring board 44 introduced between the pair of transport members 42 is positioned in the X direction, the Y direction, and the Z direction with respect to the pair of transport members 42. Then, the pair of conveying members 42 conveys the printed wiring board 44 in the X direction, so that the printed wiring board 44 is positioned in the Y direction in the X direction with respect to the collet 70 and the transfer pin 142 described later. It is designed to move relative.

(Bonding agent supply device 110)
The bonding agent supply device 110 is a device that supplies a bonding agent G for bonding the semiconductor elements 12 to the printed wiring board 44. As shown in FIGS. 2 and 3A, the bonding agent supply device 110 includes a bonding agent thickness adjustment device 120 (an example of a viscosity agent thickness adjustment device) that adjusts the thickness of the bonding agent G, and a bonding agent. A transfer unit 140 that transfers the bonding agent G whose thickness is adjusted by the thickness adjusting device 120 to the printed wiring board 44. 2 is a cross-sectional view taken along the line AA in FIG. 3A, and the rotating plate 122 in FIG. 2 shows a configuration when cut along the line BB in FIG. 3A.

  As shown in FIGS. 3 (A) and 3 (B), the bonding agent thickness adjusting device 120 adjusts the thickness of the rotating plate (rotary plate) 122 as an example of the rotating unit on which the bonding agent G is placed, and the thickness of the bonding agent G. And an adjusting member 130 to be adjusted. In addition, as the bonding agent G whose thickness is adjusted by the bonding agent thickness adjusting device 120, for example, an epoxy adhesive containing silver (Ag) is used. In addition, the bonding agent G is configured, for example, in a paste form (a liquid having a relatively high viscosity).

  As shown in FIG. 2, the rotating plate 122 is configured in a disk shape (columnar shape) having a groove portion 124 on the upper surface side. As shown in FIG. 3A, the groove 124 is formed in an annular shape (ring shape) in plan view. An accommodation space (accommodating portion) in which the bonding agent G is accommodated is formed by the annular groove portion 124. As shown in FIG. 2, the housing space includes a bottom wall 124A of the groove 124, a groove wall 124B on the outer peripheral side of the groove 124 (hereinafter referred to as an outer peripheral wall 124B), and a groove wall 124C on the inner peripheral side of the groove 124. (Hereinafter referred to as the inner peripheral wall 124C). The bonding agent G stored in the storage space is in a state of being placed on the bottom wall 124A of the groove 124 between the outer peripheral wall 124B and the inner peripheral wall 124C. The rotating plate 122 is rotated in one direction (clockwise direction in FIG. 3A (arrow A direction)) by the drive unit 128.

  The transfer unit 140 includes a transfer pin 142 as a transfer member for transferring the bonding agent G, a transfer pin 142 between the printed wiring board 44 positioned by the substrate positioning unit 40 and the rotating plate 122 of the bonding agent thickness adjusting device 120. And a moving mechanism 144 for moving the. The transfer pin 142 is formed in a block shape (cuboid shape) having a length in the horizontal direction. In addition, the transfer pin 142 has a bottom surface 142A for adhering the bonding agent G.

  The moving mechanism 144 moves the transfer pin 142 in the Y direction and the vertical direction (Z direction). When the moving mechanism 144 moves the transfer pin 142 downward (−Z direction), the transfer pin 142 descends into the groove 124 from the opening above the groove 124, and the bonding agent placed on the rotating dish 122. G is attached to the bottom surface 142A. Specifically, the transfer pin 142 is set so as to descend to a predetermined transfer region in the central portion in the radial direction of the groove portion 124.

  In addition, the transfer mechanism 142 moves the transfer pin 142 in the Y direction, so that the transfer pin 142 moves relative to the printed wiring board 44 in the Y direction. That is, in this embodiment, the transfer pin 142 is moved in the Y direction by the moving mechanism 144, and the printed wiring board 44 is moved in the X direction by the transport member 42 of the board positioning unit 40, so that the transfer pin 142 is moved to the printed wiring board. 44 is moved relative to 44 in the X and Y directions.

  The moving mechanism 144 moves the transfer pin 142 relative to the printed wiring board 44 in the X direction and the Y direction, and then lowers the transfer pin 142 downward (−Z direction). The bonding agent G adhered to 142A is applied to the printed wiring board 44. That is, the transfer pin 142 transfers the bonding agent G accommodated in the rotating dish 122 to the printed wiring board 44. As the moving mechanism 144, for example, a biaxial robot that can move in the Y direction and the Z direction is used.

  The adjustment member 130 that adjusts the thickness of the bonding agent G includes a head member 131 and an arm member 133 coupled to the head member 131, as shown in FIGS. doing.

  As shown in FIG. 3A, the head member 131 is an inclined plate that is inclined with respect to the rotation direction (arrow A direction) and the radial direction (arrow Y direction) of the rotating plate 122 in plan view. 132 (an example of a guide portion) and a limiting plate 134 (restricted) that is connected to the downstream end portion of the inclined plate 132 in the rotation direction and restricts the bonding agent G from flowing to the outer peripheral side of the rotating plate 122 due to the inclination of the inclined plate 132. An example).

  Specifically, the inclined plate 132 and the limiting plate 134 are connected by a connecting plate 136 as shown in FIGS. 4 and 5A, 5B, and 5C. The connecting plate 136 connects the downstream end of the inclined plate 132 in the rotational direction and the downstream end of the limiting plate 134 in the rotational direction. That is, the limiting plate 134 is connected to the downstream end portion of the inclined plate 132 in the rotation direction via the connecting plate 136, and the connecting plate 136 forms a connection portion that connects the inclined plate 132 and the limiting plate 134. ing.

  The head member 131 further includes an upper plate 138 connected to the upper end of the inclined plate 132, the upper end of the limiting plate 134 and the upper end of the connecting plate 136, and a side plate 139 connected to the upstream end of the inclined plate 132 in the rotational direction. And a connecting portion 137 provided on the arm member 133 side with respect to the upper plate 138 in a plan view and connected to the arm member 133. The head member 131 is fixed to the arm member 133 by screwing a screw (not shown) inserted into the through hole 137 </ b> A formed in the connecting portion 137 to the arm member 133.

  The inclined plate 132 blocks the excess bonding agent G, and the bottom surface 132A of the inclined plate 132 comes into contact with the upper surface of the bonding agent G of the rotating plate 122, so that the bonding agent G is leveled and the bonding plate G It has a function of keeping the thickness of the agent G constant. The distance (gap) between the bottom surface 132 </ b> A of the inclined plate 132 and the top surface of the rotating dish 122 is, for example, 50 μm, and is shorter than the length of any side of the semiconductor element 12.

  In addition, the inclined plate 132 is inclined so as to gradually shift toward the outer peripheral side of the rotating dish 122 toward the downstream side in the rotation direction of the rotating dish 122, and by this inclination, the foreign matter in the bonding agent G is removed. Has a function of moving (guidance) to the outer peripheral side (outside of the transfer region of the transfer pin 142). Note that, due to the inclination of the inclined plate 132, not only the foreign matter in the bonding agent G but also the excess bonding agent G tends to flow toward the outer peripheral side of the rotating dish 122. Further, the “foreign matter in the bonding agent G” means a foreign matter mixed in the bonding agent G, that is, a foreign matter existing together with the bonding agent G, and exists in a state where it is sunk inside the bonding agent G. Not only foreign substances but also foreign substances that exist on the bonding agent G (for example, adhere to the surface of the bonding agent G) are included.

  The limiting plate 134 is opposed to the inclined plate 132 on the outer peripheral side of the rotating plate 122 with respect to the inclined plate 132, and is arranged in a direction perpendicular to the radial direction (arrow Y direction) of the rotating plate 122.

  In addition, the connecting plate 136 is formed with an opening 135 through which the foreign material moving to the outer peripheral side of the rotating dish 122 is passed by the inclined plate 132. The opening 135 opens to the downstream side in the rotation direction. The opening 135 allows foreign substances that move to the outer peripheral side of the rotating dish 122 due to the inclination of the inclined plate 132 to pass therethrough. In addition, due to the inclination of the inclined plate 132, the excessive bonding agent G flowing to the outer peripheral side of the rotating dish 122 also passes through the opening 135.

  The length of the opening 135 in the Y direction (the length along the radial direction of the rotating dish 122) and the length in the Z direction (height) are the width (the Y direction length) and the height (the Z direction length) of the semiconductor element 12, respectively. ), Preferably longer than the length of the diagonal line d in the cross-sectional view (see FIG. 7). Specifically, the length in the Y direction and the length in the Z direction of the opening 135 are such lengths that the semiconductor element 12 as a foreign object that has accidentally dropped onto the rotating dish 122 can pass through the opening 135. The length is set so that the agent G does not unnecessarily flow to the outer peripheral side of the rotating dish 122. Specifically, the Y-direction length and the Z-direction length of the opening 135 are preferably about twice the length of the diagonal line d, for example.

(Transfer device 60)
As shown in FIG. 1, the transfer device 60 includes a collet 70 as a holder for holding the semiconductor element 12, and an aspirator that is attached with the collet 70 and generates a suction force for the collet 70 to hold the semiconductor element 12. 62 and a moving mechanism 63 for moving the suction device 62 (collet 70) relative to the printed wiring board 44.

  Specifically, the suction device 62 has a suction nozzle 64 to which the collet 70 is attached. As shown in FIG. 6, the collet 70 includes a collet main body 72, a connection portion 74 connected to the suction nozzle 64, and an abutting portion 76 having a first surface 81 that abuts against the first ridge line 12 </ b> E of the semiconductor element 12. And an abutting portion 86 having a second surface 82 that abuts against the second ridge line 12B of the semiconductor element 12.

  At the end of the collet body 72 in the X direction, an abutting claw 80 is provided as an abutting portion that abuts against the ridge line on the X direction side of the semiconductor element 12. The abutting claw 80 abuts against the ridge line on the X direction side of the semiconductor element 12 so that the semiconductor element 12 is positioned in the X direction. The abutting claw 80 may abut against the end surface of the semiconductor element 12 on the X direction side.

  As shown in FIG. 6, the connecting portion 74 is formed in a cylindrical shape, and is connected by being inserted into a cylindrical suction nozzle 64. A connection port 74 </ b> A that communicates with the suction nozzle 64 is formed in the connection portion 74. As shown in FIG. 7, a suction port 78 that communicates with the connection port 74 </ b> A is formed between the second surface 82 and the first surface 81.

  In the collet 70, the second ridge line 12B on the upper surface of the semiconductor element 12 hits the second surface 82, and the first ridge line 12E on the upper surface of the semiconductor element 12 hits the first surface 81, so that the semiconductor element 12 moves in the Y direction. And positioning in the Z direction.

  In the collet 70, the semiconductor element 12 is sucked by the suction device 62 through the suction port 78, and the semiconductor element 12 positioned in the Y direction, the Z direction, and the X direction is held.

  The moving mechanism 63 moves the collet 70 relative to the printed wiring board 44 in the Y direction by moving the suction device 62 in the Y direction. In other words, in the present embodiment, the suction device 62 is moved in the Y direction by the moving mechanism 63, and the printed wiring board 44 is moved in the X direction by the transport member 42 of the board positioning unit 40, whereby the collet 70 is moved to the printed wiring board 44. Is moved relative to the X and Y directions.

  Further, the moving mechanism 63 moves the collet 70 in the vertical direction (Z direction) relative to the printed wiring board 44 by moving the suction device 62 in the vertical direction (Z direction). In the present embodiment, the collet 70 is moved relative to the printed wiring board 44 in the X direction and the Y direction, and then the collet 70 is lowered downward (−Z direction), whereby the semiconductor element 12 is moved to the printed wiring board. 44 is placed (mounted) on the bonding agent G transferred to 44.

  As the moving mechanism 63, for example, a biaxial robot that can move in the Y direction and the Z direction is used.

(Method for manufacturing printed wiring board device)
In the method for manufacturing a printed wiring board device according to the present embodiment, as shown in FIG. 1, first, in the supply unit 13, the moving mechanism 17 moves the holding unit 15 in the X direction and the Y direction, thereby mounting objects. The semiconductor element 12 is positioned at a predetermined pickup position (position adjustment step).

  Next, the semiconductor device 12 positioned at the pickup position of the supply unit 13 is transferred to the plate 34 of the positioning table 30 by the transfer device 50, and the semiconductor device 12 is temporarily placed at the temporary placement position on the plate 34 (temporary placement). Placing step).

  Next, the semiconductor element 12 temporarily placed at the temporary placement position on the plate 34 is moved and positioned (positioned) by the positioning member 22 to a predetermined positioning position on the plate 34 (in the component positioning step). Element positioning step as an example).

  Next, in the board positioning unit 40, the pair of transport members 42 positions the printed wiring board 44 (board positioning process). This substrate positioning step does not have to be performed after the element positioning step, and may be performed before or simultaneously with the element positioning step.

  Next, the bonding agent G placed on the rotating plate 122 of the bonding agent thickness adjusting device 120 is transferred to the printed wiring board 44 positioned by the substrate positioning unit 40 by the transfer pin 142 (bonding agent transfer step).

  Next, the semiconductor element 12 positioned in the element positioning step is transferred onto the bonding agent G transferred by the transfer pin 142 by the transfer device 60 (transfer step).

In this transfer step, the plurality of semiconductor elements 12 are arranged in a staggered manner with respect to the printed wiring board 44 as shown in FIG. That is, the position adjustment process, temporary placement process, element positioning process, coating process, holding process, and mounting process are performed according to the number of semiconductor elements 12. In this embodiment, for example, after arranging a plurality of semiconductor elements 12 in a line at intervals on one side in the Y direction (lower side in FIG. 8), the plurality of semiconductor elements 12 are arranged on the other side in the Y direction (FIG. 8). Are arranged in a row at intervals. That is, in this embodiment, for example,
After being arranged at odd mounting positions T1, T3, T5... Counted from one longitudinal end 44A of the printed wiring board 44, it is arranged at even mounting positions T2, T4. So, arrange them in a staggered pattern.

  Next, the bonding agent G is solidified (solidification step). Specifically, for example, the bonding agent G is solidified by heating the bonding agent G at 110 to 120 ° C. for 1 to 2 hours, for example. Thereby, a printed wiring board device is manufactured.

(Operation according to this embodiment)
Next, the operation according to this embodiment will be described.

  In the present embodiment, as described above, the longitudinal ends of the semiconductor elements 12 are arranged in a zigzag shape approaching in the Y direction. Therefore, in the bonding agent transfer step, the bonding pins 142 are bonded to the printed wiring board 44 by the transfer pins 142. When transferring G, the transfer pin 142 approaches the longitudinal end of the semiconductor element 12 already mounted.

  For this reason, for example, when the already mounted semiconductor element 12 is mounted at a position shifted from the normal position, or when the bonding agent G is transferred to the printed wiring board 44 at a position where the transfer pin 142 is shifted from the normal position. The transfer pin 142 may come into contact with the semiconductor element 12 already mounted. When the transfer pin 142 comes into contact with the already mounted semiconductor element 12, the element scrap (damaged semiconductor element 12) of the semiconductor element 12 or the semiconductor element 12 itself (hereinafter referred to as element scrap 112) adheres to the transfer pin 142. Then, the transfer pin 142 may carry the element waste 112 to the bonding agent G of the rotating dish 122. Thus, element scraps 112 may be mixed into the bonding agent G as foreign matter. The foreign matters mixed in the bonding agent G of the rotating dish 122 include not only the element scraps 112 and the like, but also, for example, component parts of the manufacturing apparatus, component scraps (damaged component parts) of the component parts, and other bonding agents. Something different from G is included.

  Here, in the comparative example (see FIGS. 9A and 9B) in which the bonding agent G is leveled by the orthogonal plate 230 orthogonal to the radial direction (arrow Y direction) of the rotating dish 122, the element scraps 112 are the rotating dish. If mixed in the bonding agent G 122, the element scraps 112 and the like are easily caught on the orthogonal plate 230, or are easily caught between the orthogonal plate 230 and the bottom wall 124 </ b> A of the rotating dish 122.

  When the element waste 112 is caught on the orthogonal plate 230 or is sandwiched between the orthogonal plate 230 and the bottom wall 124A of the rotating dish 122, a gap between the orthogonal plate 230 and the bottom wall 124A of the rotating dish 122 is formed. It becomes small and the thickness of the bonding agent G becomes thinner than the normal thickness, and the blur H is generated. Thereby, the amount of the bonding agent G attached to the transfer pin 142 is reduced, and the amount of the bonding agent G transferred to the semiconductor element 12 is reduced. For this reason, it becomes a cause of bonding failure of the semiconductor element 12.

  On the other hand, in the present embodiment, the element waste 112 in the bonding agent G of the rotating dish 122 moves to the outer peripheral side of the rotating dish 122 due to the inclination of the inclined plate 132 of the adjusting member 130. Element scraps 112 and the like 112 that move to the outer peripheral side of the rotating plate 122 by the inclined plate 132 pass through the opening 135, and the outer peripheral side of the rotating plate 122 relative to the adjustment member 130 (inclined plate 132). Move to the outside. As a result, it is possible to suppress the element scraps 112 and the like from being caught by the adjusting member 130 (inclined plate 132) or being sandwiched between the adjusting member 130 (inclined plate 132) and the bottom wall 124A of the rotating dish 122.

  For this reason, it is suppressed that the thickness of the bonding agent G on the rotating dish 122 becomes non-uniform by the element waste 112 or the like in the bonding agent G. As a result, the bonding agent G attached to the transfer pin 142 and the bonding agent G transferred to the printed wiring board 44 are prevented from having non-uniform thickness, and the semiconductor element 12 is bonded to the printed wiring board 44. Defects are suppressed.

  Further, the element scraps 112 moved to the outer peripheral side of the rotating plate 122 with respect to the adjustment member 130 (inclined plate 132) are located outside the transfer region of the transfer pin 142. For this reason, it is suppressed that the element waste etc. 112 in the bonding agent G does not contact the transfer pin 142 and the element waste etc. 112 in the bonding agent G reattaches to the transfer pin 142 and is carried to the printed wiring board 44. Is done.

  Moreover, in this embodiment, since the element waste etc. 112 are moved to the outer peripheral side of the rotating rotating dish 122, the element waste etc. 112 is effectively moved to the outer peripheral side of the rotating dish 122 using the centrifugal force of the rotating dish 122. Moved to. Further, the element waste 112 after moving to the outer peripheral side of the rotating dish 122 is suppressed from moving to the inner peripheral side (transfer area of the transfer pin 142) by the centrifugal force of the rotating dish 122.

  In this embodiment, the bonding agent G also flows to the outer peripheral side of the rotating dish 122 due to the inclination of the inclined plate 132, but the limiting plate 134 of the adjusting member 130 moves the outer periphery of the rotating dish 122 to the bonding agent G. Flow is limited. Thereby, the amount of the bonding agent flowing toward the outer peripheral side of the rotating dish 122 is reduced. That is, the amount of bonding agent that is not used for bonding the semiconductor element 12 is reduced.

(Modification)
In the above-described embodiment, the inclined plate 132 of the adjustment member 130 is configured to move the foreign matter toward the outer peripheral side of the rotating dish 122. The structure moved to the inner peripheral side of the rotating tray 122 may be sufficient. In the configuration shown in FIG. 10, the inclined plate 132 is inclined so as to gradually shift toward the inner peripheral side of the rotating plate 122 toward the downstream side in the rotation direction of the rotating plate 122. The foreign matter is moved to the inner peripheral side of the rotating dish 122. Further, the limiting plate 134 is opposed to the inclined plate 132 on the inner peripheral side of the rotating plate 122 with respect to the inclined plate 132, and is disposed in a direction perpendicular to the radial direction (orthogonal direction) of the rotating plate 122.

  In the above-described embodiment, the opening 135 of the adjustment member 130 is open on the downstream side in the rotation direction. However, the present invention is not limited to this, and as shown in FIG. It may be configured to open to the wall 124B side (perpendicular to the rotation direction (arrow A direction)). As shown in FIG. 11B, the opening 135 may be open on both the downstream side in the rotational direction (arrow A direction side) and the outer peripheral wall 124 </ b> B of the rotating dish 122. In other words, the opening 135 only needs to open to at least one of the downstream side in the rotation direction and the outer peripheral wall 124 </ b> B of the rotating dish 122. In the configuration in which the inclined plate 132 moves the foreign matter to the inner peripheral side of the rotating dish 122, the opening 135 is opened on at least one of the downstream side in the rotation direction and the inner peripheral wall 124 </ b> C of the rotating dish 122.

  Moreover, in the said embodiment, although the inclination board 132 was used as an example of a guide part and the structure which used the restriction | limiting board 134 as a restriction | limiting part was demonstrated, as a guide part and a restriction | limiting part, it does not need to be plate-shaped and various. It can be made into the shape.

  Moreover, although the said embodiment demonstrated the structure using the rotation tray 122 as an example of a rotation part, as a rotation part, it is not restricted to the rotation dish 122, The shape and structure can employ | adopt various structures. it can.

  Furthermore, in the above embodiment, the configuration of the head member 131 in which the inclined plate 132 and the limiting plate 134 are connected via the connecting plate 136 has been described. However, the head member 131 of the adjustment member 130 is connected via the connecting plate 136. Instead, the inclined plate 132 and the limiting plate 134 may be directly connected.

  Moreover, although the structure using the bonding agent G as an example of the viscous agent having viscosity has been described in the above embodiment, the viscosity agent is not limited to the bonding agent G, and may not be used for bonding. That is, the viscosity agent may be a material having viscosity, and may be other than a bonding agent such as an adhesive.

  The present invention is not limited to the above-described embodiment, and various modifications, changes, and improvements can be made. For example, the modification examples described above may be appropriately combined.

12 Semiconductor elements (examples of parts)
20 Element positioning part (an example of part positioning part)
40 Substrate positioning unit 60 Transfer device (an example of a transfer mechanism)
100 mounting device 112 element scrap, etc. (an example of foreign matter)
120 Bonding agent thickness adjusting device (an example of viscosity agent adjusting device)
122 Rotating dish (an example of rotating part)
132 Inclined plate (example of guide)
134 Restriction plate (an example of restriction part)
135 Opening part 140 Transfer part G Bonding agent (an example of a viscous agent)

Claims (4)

A rotating part on which a viscous agent is placed;
A guide part that is provided to be inclined with respect to the rotation direction of the rotating part, makes the thickness of the viscous agent constant, and guides foreign matter in the viscous agent to the inner peripheral side or the outer peripheral side of the rotating part;
A restricting portion connected to a downstream end portion of the guide portion in the rotation direction and restricting the flow of the viscous agent to the inner peripheral side or the outer peripheral side by an inclination of the guide portion;
An opening provided at a connecting portion between the guide portion and the restricting portion and allowing the foreign matter to pass therethrough;
Viscosity agent thickness adjusting device. The guide portion guides the foreign matter to the outer peripheral side of the rotating portion,
The said restriction | limiting part is a viscous agent thickness adjustment apparatus of Claim 1 which restrict | limits that the said viscous agent flows into an outer peripheral side by the inclination of the said guide part. A component positioning part for positioning the component;
A substrate positioning unit for positioning the substrate;
The viscosity agent thickness adjusting device according to claim 1 or 2,
A transfer unit that transfers a bonding agent as a viscous agent placed on the rotating unit of the viscosity agent thickness adjusting device to a substrate positioned in the substrate positioning unit;
A transfer mechanism for transferring the component positioned by the component positioning unit onto the bonding agent transferred by the transfer unit;
Mounting device equipped with. A component positioning step of positioning the component by the component positioning unit of the mounting device according to claim 3;
A substrate positioning step of positioning the substrate by the substrate positioning unit;
A bonding agent transfer step of transferring the bonding agent placed on the rotating part of the viscosity agent thickness adjusting device to the substrate positioned on the substrate positioning unit by the transfer unit;
A transfer step of transferring the component positioned in the component positioning step by the transfer mechanism onto the bonding agent transferred by the transfer unit;
Manufacturing method of substrate device having

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