JP5071601B1 - Positioning device, mounting device, and manufacturing method of substrate device - Google Patents

Abstract

A component positioned at a predetermined positioning position on a table is prevented from falling on the table.
A platform having a first region on which a component is placed in an upright position and a second region on which the component is not placed, a plurality of first suction holes formed in the first region, and the second region, The component having a plurality of second suction holes formed at a lower density than the plurality of first suction holes in the first region, and an abutting portion, and temporarily placed at a temporary placement position on the first region A positioning member that moves and positions the component to a predetermined positioning position on the first region in a state in which the abutting portion is abutted against the side surface of the first side, and an opening that opens to the abutting portion. A suction path that passes through the opening and the second suction hole, and sucks the bottom surface of the component placed on the first region through the first suction hole, and the side surface of the component is A suction device for sucking through the second suction hole and the suction path; Positioning device.
[Selection] Figure 3

Description

  The present invention relates to a positioning device, a mounting device, and a method for manufacturing a substrate device.

  In Patent Document 1, in an electronic component mounting method in which a vertically long chip is taken out from a supply unit and mounted on a substrate, the chip mounted on the pre-center stage is attracted and held by a pickup nozzle during a centering operation for positioning by a positioning claw. Stopped at a height position where the gap between the lower surface of the chip and the upper surface of the pre-center stage has a predetermined dimension, and stopped at a position where the gap between the contact portion of the positioning claw and the side surface of the chip has a predetermined dimension Thus, an electronic component mounting method is disclosed in which a chip is sucked and held on the contact portion by vacuum suction from the suction hole of the contact portion.

Japanese Patent No. 4140190

  This invention makes it a subject to suppress that the components positioned in the predetermined positioning position on a stand fall down on this stand.

  The invention according to claim 1 is a platform having a first region on which a component is placed in an upright posture and a second region on which the component is not placed, a plurality of first suction holes formed in the first region, and the second region. And a plurality of second suction holes formed at a lower density than the plurality of first suction holes in the first region, and abutment portions, and are temporarily placed at a temporary placement position on the first region. A positioning member that moves the component to a predetermined positioning position on the first region in a state where the abutting portion abuts against a side surface of the component, and an opening in the abutting portion. A suction passage that has an opening, the suction path passing through the opening and the second suction hole, and the bottom surface of the component placed on the first region is sucked through the first suction hole; A suction device for sucking a side surface through the second suction hole and the suction path; A positioning device comprising.

  The invention of claim 2 is the positioning device according to claim 1, wherein the positioning member moves from a state in which the abutting portion is retracted to the second region and abuts against a side surface of the component.

  According to a third aspect of the present invention, the component has a length, and the positioning member is closed by two or more of the plurality of first suction holes at respective longitudinal portions of the bottom surface of the component. The component is moved and positioned at the positioning position set to a position, and further, two or more of the plurality of first suction holes are set at positions where the longitudinal portions of the bottom surface of the component are blocked. The positioning device according to claim 1, further comprising a temporary placement unit that temporarily places the component at the temporary placement position.

  A fourth aspect of the present invention is the positioning device according to any one of the first to third aspects for positioning a component, a substrate positioning portion for positioning a substrate, and a holding for holding the component positioned by the positioning device. And a moving mechanism for moving the holding tool and mounting the component on the board positioned by the board positioning unit.

  According to a fifth aspect of the present invention, there is provided a component positioning step of positioning the component by the positioning device of the mounting device according to claim 4, a substrate positioning step of positioning the substrate on the substrate positioning portion, and the component positioning step. And a mounting step of mounting the component on the substrate positioned in the substrate positioning step by holding the component positioned by the holder.

  According to the configuration of the first aspect of the present invention, compared with the case where the bottom surface and the side surface of the component are sucked through the suction holes of the same density, the component positioned at the predetermined positioning position on the table is on the table. It can suppress falling down.

  According to the configuration of the second aspect of the present invention, compared with the case where the abutting portion is retracted in the first region where the component is placed, the component positioned at the predetermined positioning position on the table is the table. It can be suppressed from falling down.

  According to the structure of Claim 3 of this invention, compared with the case where it does not have this structure, it can suppress that the components positioned in the predetermined positioning position on a stand fall on this stand.

  According to the configuration of the fourth aspect of the present invention, it is possible to suppress the components mounted on the board from falling on the table as compared with the case where the positioning device in the present configuration is not provided.

  According to the manufacturing method of the fifth aspect of the present invention, the yield of the manufactured board device is improved as compared with the case where the component positioning step in the manufacturing method is not provided.

It is a perspective view which shows the structure of the manufacturing apparatus which concerns on this embodiment. It is a top view which shows the structure of the plate of the positioning base and positioning member which concern on this embodiment. FIG. 3 is a plan view showing a state in which an abutting portion is abutted against a semiconductor element temporarily placed at a temporary placement position in the configuration shown in FIG. 2. FIG. 3 is a plan view showing a state where the semiconductor element is positioned at a positioning position by a positioning member in the configuration shown in FIG. 2. It is a top view which shows the structure of the suction hole which concerns on this embodiment. It is a perspective view which expands and partially shows the structure of the positioning member which concerns on this embodiment. It is a perspective view which shows the structure of the collet which concerns on this embodiment. It is an operation | movement figure which shows the temporary placement process which concerns on this embodiment. It is an operation figure showing an element positioning process concerning this embodiment. It is an operation | movement figure which shows the holding process which concerns on this embodiment.

  Below, an example of an embodiment concerning the present invention is described based on a drawing.

(Manufacturing apparatus 10)
First, the configuration of the manufacturing apparatus 10 according to the present embodiment will be described. FIG. 1 is a perspective view showing the configuration of the manufacturing apparatus 10. The following X (−X) direction, Y (−Y) direction, and Z (−Z) direction indicate coordinate systems orthogonal to each other, and the X direction, −X direction, Y direction, −Y direction, The Z direction (upward) and the -Z direction (downward) are arrow directions shown in the figure. Unless otherwise specified, “X direction” is “X direction or −X direction”, “Y direction” is “Y direction or −Y direction”, and “Z direction” is “Z direction or −Z direction”. I mean. In addition, “x” in “○” in the figure means an arrow from the front to the back of the page, and “•” in “○” in the figure. Means an arrow heading from the back of the page to the front.

  The manufacturing apparatus 10 is a manufacturing apparatus that manufactures a printed wiring board device as an example of a substrate device. As shown in FIG. 1, a supply unit 13 that supplies a semiconductor element 12 as an example of a component, and a semiconductor element 12 An element positioning device 20 as an example of a positioning device for positioning the substrate, a substrate positioning unit 40 for positioning a printed wiring board 44 as an example of a substrate, and a transfer device for transferring the semiconductor element 12 from the supply unit 13 to the element positioning device 20 50 and a transfer device 60 that transfers the semiconductor element 12 positioned by the element positioning device 20 to the printed wiring board 44 positioned by the substrate positioning unit 40.

  Furthermore, the manufacturing apparatus 10 is an example of a control unit that controls the operation (drive) of each component of the manufacturing apparatus 10 (the supply unit 13, the element positioning device 20, the substrate positioning unit 40, the transfer device 50, and the transfer device 60). The control unit 90 is provided.

  In the manufacturing apparatus 10, the mounting apparatus 100 that mounts the semiconductor element 12 on the printed wiring board 44 includes the element positioning apparatus 20, the board positioning section 40, and the transfer apparatus 60.

(Semiconductor element 12)
As the semiconductor element 12 mounted (mounted) on the printed wiring board 44, for example, an elongated semiconductor element (for example, an LED chip) having a rectangular cross section is used (see FIG. 7). Specifically, the semiconductor element 12 has, for example, a width (Y direction length) of 125 μm, a length (X direction length) of 6 mm, and a height (Z direction length) of 300 μm. In addition, a functional portion such as a circuit pattern or a light emitting element is provided on the surface (upper surface) of the semiconductor element 12. Further, the semiconductor element 12 has a parallelogram shape in cross section (see FIG. 8).

(Supply unit 13)
As shown in FIG. 1, the supply unit 13 includes a holding unit 15 that holds the wafer 14 and a moving mechanism 17 that moves the holding unit 15 in the X direction and the Y direction. In the supply unit 13, a plurality of semiconductor elements 12 are cut out from the wafer 14 by cutting the wafer 14 held by the holding unit 15. Further, in the supply unit 13, the moving mechanism 17 moves the holding unit 15 in the X direction and the Y direction, so that the semiconductor element 12 to be mounted is positioned at a predetermined pickup position by the transfer device 50. Yes.

  The supply unit 13 further includes a tray on which the semiconductor element 12 is placed, a moving mechanism that moves the tray in the X direction and the Y direction, and a transfer mechanism that transfers the semiconductor element 12 from the wafer 14 to the tray. The structure which has these. In this configuration, the transfer mechanism transfers the semiconductor element 12 from the wafer 14 to the tray, and the moving mechanism moves the tray in the X direction and the Y direction, so that the semiconductor element 12 placed on the tray is predetermined by the transfer device 50. It is designed to be located at the picked-up position.

(Transfer device 50)
As shown in FIG. 1, the transfer device 50 includes a suction device 52 that sucks the semiconductor element 12 with the suction nozzle 54, and a moving mechanism 53 that moves the suction device 52. In the transfer device 50, the suction device 52 holds the semiconductor element 12 in the suction nozzle 54 by sucking the semiconductor element 12 located at the pickup position in the supply unit 13 with the suction nozzle 54. In the transfer device 50, the semiconductor element 12 is held on the plate 34 of the positioning table 30 to be described later by moving the suction device 52 in the arrow A direction by the moving mechanism 53 while the semiconductor element 12 is held by the suction nozzle 54. The semiconductor element 12 is temporarily placed in an upright posture at a temporary placement position on the mounting area 34A of the plate 34. That is, the transfer device 50 functions as an example of a temporary placement unit that temporarily places the semiconductor element 12 at the temporary placement position.

  The upright posture of the semiconductor element 12 is a posture in which the semiconductor element 12 can fall down. In this embodiment, the height of the semiconductor element 12 (Z direction) is longer than the length in the Y direction of grounding the plate 34 of the semiconductor element 12. (Length) will be higher.

  The temporary placement position is set to a position where two or more of a plurality of first suction holes 38A described later are blocked by each longitudinal portion of the bottom surface 12D of the semiconductor element 12. Specifically, the temporary placement positions are at least two first suction holes arranged in a line along the X direction at each portion from one end portion to the other end portion in the longitudinal direction of the bottom surface 12D of the semiconductor element 12. It is set at a position where the entire hole of each of 38A is closed. Further, the temporary placement position is set at an end portion on the Y direction side (non-mounting area 34B side) in a mounting area 34A described later.

  As the moving mechanism 53 of the transfer device 50, for example, a three-axis robot that can move in the X direction, the Y direction, and the Z direction is used.

(Element positioning device 20)
As shown in FIG. 1, the element positioning device 20 includes a positioning table 30 as an example of a table on which the semiconductor element 12 is placed in an upright posture, and a predetermined positioning position of the semiconductor element 12 mounted on the positioning table 30. And a moving mechanism 29 for moving the positioning member 22 in the X direction and the Y direction.

  The positioning table 30 sucks the air in the internal space of the cylindrical portion 32 by sucking the internal space of the cylindrical portion 32 having the opening portion 33 in the upper portion, the plate 34 provided in the opening portion 33 of the cylindrical portion 32, and negative pressure in the internal space. A suction device 36. A plurality of suction holes 38 are formed in the plate 34. The plurality of suction holes 38 pass through the plate 34 and communicate with the internal space of the cylindrical portion 32.

  Specifically, as shown in FIG. 2, the plurality of suction holes 38 are a plurality of first holes formed in a mounting region 34 </ b> A as an example of a region (first region) on which the semiconductor element 12 is placed on the positioning table 30. One suction hole 38 </ b> A and a plurality of second suction holes 38 </ b> B formed in a non-mounting region 34 </ b> B as an example of a region (second region) on the positioning table 30 where the semiconductor element 12 is not placed.

  The second suction holes 38B are formed in the non-mounting area 34B at a lower density than the plurality of first suction holes 38A in the mounting area 34A. That is, the mounting area 34A is a high-density area where the suction holes are formed with high density, and the non-mounting area 34B is a low-density area where the suction holes are formed with low density. In addition, the density here means the opening area of the whole suction hole per unit area. Therefore, the low density region refers to a case where the opening area of the entire suction hole per unit area is smaller than that of the high density region. For example, even when the number of suction holes per unit area is the same or larger than that of a high-density region, if the opening area (hole diameter) of one suction hole is small and the entire suction hole per unit area is small It becomes a low density region.

  Further, the non-mounting area 34B is disposed outside the mounting area 34A. Specifically, the non-mounting area 34B is arranged on the Y direction and −Y direction sides of the mounting area 34A so as to sandwich the mounting area 34A therebetween. Furthermore, the non-mounting region 34B is a region where the semiconductor element 12 is not placed and is a region where the positioning member 22 moves. The positioning member 22 is moved while maintaining a non-contact state with respect to the plate 34 so that the positioning member 22 is not attracted to the plate 34 and receives movement resistance. On the other hand, in the mounting region 34A, the bottom surface 12D (see FIG. 8) of the semiconductor element 12 placed on the mounting region 34A is sucked through the plurality of first suction holes 38A.

  As shown in FIG. 5, the first suction holes 38A are arranged in a staggered manner in the mounting region 34A, and the second suction holes 38B are arranged in a lattice shape in the non-mounting region 34B. Further, the diameter D1 of the first suction hole 38A, the distance L1A in the Y direction of the first suction hole 38A, the width W of the semiconductor element 12, and the diameter D1 of the first suction hole 38A + the distance in the Y direction of the first suction hole 38A. The relationship of L1A is that the diameter D1 of the first suction hole 38A (for example, 0.07 mm) <the interval L1A in the Y direction of the first suction hole 38A (for example, 0.10 mm) <the width W of the semiconductor element 12 (for example, 0 125 mm) <diameter D1 of the first suction hole 38A + interval L1A in the Y direction of the first suction hole 38A (for example, 0.17 mm). Further, the interval L1A in the Y direction of the first suction holes 38A and the interval L1B in the X direction of the first suction holes 38A are the same. The interval L1A in the Y direction of the first suction holes 38A is the distance between the centers of the adjacent first suction holes 38A among the plurality of first suction holes 38A arranged in a row in the Y direction. Further, the interval L1B in the X direction of the first suction holes 38A is a distance between the centers when projected in the X direction of the first suction holes 38A adjacent in the X direction among the plurality of first suction holes 38A.

  The diameter D2 of the second suction hole 38B is the same as the diameter D1 of the first suction hole 38A. Further, the interval L2B (for example, 0.4 mm) along the X direction of the second suction hole 38B is set larger than the interval L2A (for example, 0.3 mm) along the Y direction of the second suction hole 38B. . The interval between the second suction holes 38B is the distance between the centers of the adjacent second suction holes 38B.

  As shown in FIG. 1, the positioning member 22 has a plate shape, a main body portion 22A, a pair of claw portions 22B extending from the main body portion 22A in the X direction (opposite to the −X direction), It is configured with. The pair of claw portions 22B are provided apart in the Y direction so that the semiconductor element 12 can be disposed therebetween. By the pair of claw portions 22B and the main body portion 22A, the positioning member 22 is configured in a U shape (U shape) in plan view (viewed in the −Z direction).

  As shown in FIG. 3, the main body portion 22 </ b> A of the positioning member 22 is formed with an abutting surface 22 </ b> D that abuts against the end surface of the semiconductor element 12 on the −X direction side. The abutting surface 22 </ b> D abuts against the end surface on the −X direction side of the semiconductor element 12, so that the semiconductor element 12 is positioned in the X direction with respect to the positioning member 22.

  Further, on the opposite side of each claw portion 22B that faces the other claw portion 22B, an abutting portion 22C that is convex toward the other claw portion 22B and abuts against the side surface 12A of the semiconductor element 12 is formed. . The abutting portion 22C is composed of a pair arranged separately in the X direction in each claw portion 22B. The pair of abutting portions 22 </ b> C abut against the side surface 12 </ b> A of the semiconductor element 12, whereby the semiconductor element 12 is positioned in the Y direction with respect to the positioning member 22.

  In the present embodiment, as shown in FIG. 8A, since the cross-sectional shape of the semiconductor element 12 is a parallelogram, the semiconductor element 12 is placed in a state where the semiconductor element 12 is placed on the plate 34. The side surface (surface against which the abutting portion 22C abuts) 12A is inclined with respect to the plate 34 so as to face the plate 34 side. Corresponding to the inclined side surface 12A, the tip of the abutting portion 22C is also an inclined surface.

  As shown in FIG. 3, each claw portion 22 </ b> B is formed with a suction path 23 configured in a U shape (U shape) in a plan view (−Z direction view). Each suction path 23 has a suction port 23A as an example of an opening that is opened at each of the tip portions of the pair of abutting portions 22C, and the suction port 23A and the second suction hole 38B are passed through. It has become.

  As shown in FIG. 6, each suction path 23 specifically has a pair of abutting portions 22 </ b> C and claw portions 22 </ b> B facing surfaces (surfaces on the −Z direction side) facing the non-mounting region 34 </ b> B of the plate 34. Each suction path 23 is open to the plate 34 side (−Z direction side).

  Thereby, in the positioning member 22, the suction force through the second suction hole 38B in the non-mounting area 34B acts on the upper side (Z direction) of the mounting area 34A via the suction path 23, and the pair of abutting portions 22C. The side surface 12A of the semiconductor element 12 abutted against the front end is sucked to the front end of the pair of abutting portions 22C.

  In the element positioning device 20, the abutting portion 22C of the positioning member 22 is separated from the side surface 12A of the semiconductor element 12 temporarily placed at the temporary placement position on the mounting region 34A by the transfer device 50 (see FIG. 2). 3), the positioning member 22 moves in the direction of the arrow C so that the abutting portion 22C abuts against the side surface 12A of the semiconductor element 12 and the abutting surface 22D is −X of the semiconductor element 12. It hits the end face on the direction side. Note that, in the separated state (the state shown in FIG. 2) in which the abutting portion 22C is separated from the side surface 12A of the semiconductor element 12, the abutting portion 22C is retracted to the outside of the non-mounting region 34B (the right side in FIG. 2). It has become.

  In the element positioning device 20, when the abutting portion 22C is in contact with the side surface 12A, the suction device 36 causes the bottom surface 12D of the semiconductor element 12 placed on the mounting region 34A to pass through the first suction holes 38A. The side surface 12A of the semiconductor element 12 is sucked through the second suction hole 38B and the suction path 23 with a suction force weaker than the suction force with respect to the bottom surface 12D.

  Furthermore, in the element positioning device 20, as shown in FIG. 4, the semiconductor element 12 is moved to a predetermined positioning position on the mounting region 34A in a state where the abutting portion 22C and the abutting surface 22D are abutted against the semiconductor element 12. And positioning (positioning). The positioning position is set to a position where two or more of the plurality of first suction holes 38 </ b> A are blocked by the longitudinal portions of the bottom surface 12 </ b> D of the semiconductor element 12. Specifically, the positioning positions are at least two first suction holes 38A arranged in a line along the X direction in each part from one end portion to the other end portion of the bottom surface 12D of the semiconductor element 12 in the longitudinal direction. Each of the holes is set at a position where the entire hole is closed. In the present embodiment, the positioning position is set on the −Y direction side with respect to the temporary placement position. The positioning position may be set on the −Y direction side and the X direction side (the opposite side to the −X direction) with respect to the temporary placement position.

  In the present embodiment, by moving the semiconductor element 12 to the positioning position, the abutting portion 22C (a part of the suction path 23) enters the mounting region 34A, and the side surface 12A of the semiconductor element 12 is the first suction hole. The suction path 23 is located in the non-mounting region 34B, so that the suction force for the side surface 12A of the semiconductor element 12 is kept weaker than the suction force for the bottom surface 12D. It has become so.

  In the present embodiment, the semiconductor element 12 is positioned by selecting one of the pair of claw portions 22B. Therefore, the positioning member 22 may have a configuration without one of the pair of claw portions 22B.

(Substrate positioning part 40)
As shown in FIG. 1, the board positioning unit 40 includes a pair of transport members (for example, conveyors) 42 that transport the printed wiring board 44 in the X direction. The pair of transport members 42 are arranged apart in the Y direction so that the printed wiring board 44 can be introduced therebetween.

  In the board positioning unit 40, the printed wiring board 44 introduced between the pair of transport members 42 is positioned in the X direction, the Y direction, and the Z direction with respect to the pair of transport members 42. The pair of transport members 42 transport the printed wiring board 44 in the X direction, so that the printed wiring board 44 moves relative to the collet 70 (described later) in the X direction while being positioned in the Y direction. It has become.

  The substrate positioning unit 40 has a coating device (not shown) such as a dispenser for applying an adhesive to a mounting position where the semiconductor element 12 is mounted on the printed wiring board 44.

(Transfer device 60)
As shown in FIG. 1, the transfer device 60 generates a collet 70 as an example of a holding tool for holding the semiconductor element 12 and a suction force for mounting the collet 70 to hold the semiconductor element 12. A suction device 62 and a moving mechanism 63 for moving the suction device 62 (collet 70) relative to the printed wiring board 44 are provided.

  Specifically, the suction device 62 has a suction nozzle 64 to which the collet 70 is attached. As shown in FIG. 7, the collet 70 includes a collet main body 72 and an abutting member 86 that is provided on the collet main body 72 and abuts against at least one of the side surface 12A and the ridgeline 12B of the semiconductor element 12.

  The collet main body 72 has a connection portion 74 connected to the suction nozzle 64, a contact portion 76 to which the contact member 86 is attached and contacts the ridge line 12E of the semiconductor element 12, and a connection portion 74 formed in a substantially rectangular parallelepiped shape. A connecting portion 78 that connects the portion 76. The collet main body 72 is composed of one part, and the connecting portion 74, the abutting portion 76, and the connecting portion 78 are integrally formed.

  The connection part 74 of the collet body 72 is formed in a cylindrical shape, and is connected by being inserted into a cylindrical suction nozzle 64. A connection port 74 </ b> A communicating with the suction nozzle 64 is formed in the connection portion 74 of the collet body 72. A suction port (not shown) that communicates with the connection port 74 </ b> A is formed between the distal end portion (lower end portion) of the abutting member 86 and the distal end portion (lower end portion) of the abutting portion 76.

  An abutting claw 80 that abuts against at least one of the end surface 12F on the X direction side of the semiconductor element 12 and the ridgeline 12G is provided below the connecting portion 78 of the collet body 72.

  In the collet 70, at least one of the side surface 12 </ b> A and the ridge line 12 </ b> B of the semiconductor element 12 abuts against the abutting member 86, and the ridge line 12 </ b> E of the semiconductor element 12 abuts against the abutting part 76 of the collet body 72. 12 is positioned in the Y direction and the Z direction.

  Further, in the collet 70, the semiconductor element 12 is positioned in the X direction when at least one of the one end surface 12F and the ridge line 12G on the X direction side of the semiconductor element 12 abuts against the abutment claw 80.

  Further, in the collet 70, the semiconductor element 12 is sucked by the suction device 62 through a suction port (not shown), and the semiconductor element 12 positioned in the Y direction, the Z direction, and the X direction is held. ing. Further, in the collet 70, the holding state of the semiconductor element 12 by the collet 70 is released by stopping the suction by the suction device 62.

  The moving mechanism 63 moves the collet 70 relative to the printed wiring board 44 in the Y direction by moving the suction device 62 in the Y direction. In other words, in the present embodiment, the suction device 62 is moved in the Y direction by the moving mechanism 63, and the printed wiring board 44 is moved in the X direction by the transport member 42 of the board positioning unit 40, whereby the collet 70 is moved to the printed wiring board 44. Is moved relative to the X and Y directions.

  Further, the moving mechanism 63 moves the collet 70 in the vertical direction (Z direction) relative to the printed wiring board 44 by moving the suction device 62 in the vertical direction (Z direction). In the present embodiment, the collet 70 is moved relative to the printed wiring board 44 in the X direction and the Y direction, and then the collet 70 is lowered downward (−Z direction), whereby the semiconductor element 12 is moved to the printed wiring board. 44 is placed (mounted).

  As the moving mechanism 63, for example, a biaxial robot that can move in the Y direction and the Z direction is used.

(Method for manufacturing printed wiring board device)
In the method for manufacturing a printed wiring board device according to the present embodiment, as shown in FIG. 1, first, in the supply unit 13, the moving mechanism 17 moves the holding unit 15 in the X direction and the Y direction, thereby mounting objects. The semiconductor element 12 is positioned at a predetermined pickup position (position adjustment step).

  Next, the semiconductor device 12 positioned at the pickup position of the supply unit 13 is transferred to the plate 34 of the positioning table 30 by the transfer device 50, and the semiconductor device 12 is erected at the temporary placement position on the mounting region 34 </ b> A in the plate 34. Temporary placement in a posture (temporary placement step).

  Specifically, the temporary placement step is performed as follows. That is, first, the semiconductor element 12 positioned at the pickup position of the supply unit 13 is held by the suction nozzle 54 by the suction of the suction device 52, and the suction nozzle 54 (suction device 52) is mounted on the plate 34 in the held state. It moves to the temporary placement position on the area 34A. At this time, the semiconductor element 12 held by the suction nozzle 54 is positioned above the plate 34.

  Next, as shown in FIG. 8A, the suction nozzle 54 (suction unit 52) is lowered with respect to the mounting region 34A. At this time, the lowering of the suction nozzle 54 stops so that a predetermined gap is formed between the bottom surface 12D of the semiconductor element 12 and the upper surface of the mounting region 34A in the plate 34.

  Then, the suction device 36 starts suction through the plurality of suction holes 38 (first suction hole 38A and second suction hole 38B) and stops suction by the suction device 52. As a result, a downward suction force by the first suction hole 38A acts on the semiconductor element 12, so that the semiconductor element 12 is detached from the suction nozzle 54 and is in an upright posture as shown in FIG. 8B. It is temporarily placed at the temporary placement position on the mounting area 34A. In the present embodiment, since the temporary placement position is set at the end of the mounting area 34A on the Y direction side (non-mounting area 34B side), the semiconductor element 12 is mounted so as to be adjacent to the non-mounting area 34B. It is temporarily placed in the area 34A (see FIG. 2).

  The semiconductor element 12 temporarily placed in the temporary placement position has at least two first suction holes arranged in a line along the X direction at each portion from one end to the other end in the longitudinal direction on the bottom surface 12D. Close the entire hole of each of 38A. At this time, the abutting portion 22C of the positioning member 22 is retracted to the outside of the non-mounting area 34B (the right side in FIGS. 2 and 8B) as shown in FIGS. 2 and 8B. ing.

  Next, with respect to the side surface 12A of the semiconductor element 12 temporarily placed at the temporary placement position on the mounting region 34A, the retracted state is retracted to the outside of the non-mounting region 34B (the right side in FIGS. 2 and 8B). 2 and FIG. 8B), the positioning member 22 moves in the direction of arrow C as shown in FIG. 3 and FIG. 9A, and the abutting portion 22C is moved to the side surface of the semiconductor element 12. The abutting surface 22D is abutted against the end surface of the semiconductor element 12 on the −X direction side.

  In the abutting state of the abutting portion 22C, the suction device 36 sucks the bottom surface 12D of the semiconductor element 12 placed on the mounting region 34A through the plurality of first suction holes 38A, and the side surface 12A of the semiconductor element 12 Is sucked through the low-density second suction holes 38B and the suction path 23 with a suction force weaker than the suction force with respect to the bottom surface 12D.

  Then, as shown in FIGS. 4 and 9B, the semiconductor element 12 is moved to a predetermined positioning position on the mounting region 34A in the abutting state of the abutting portion 22C and the abutting surface 22D. (Positioning) (element positioning step (an example of a component positioning step)).

  The semiconductor element 12 positioned at the positioning position has at least two first suction holes 38A arranged in a line along the X direction at each portion from one end portion to the other end portion in the longitudinal direction on the bottom surface 12D. Close the whole of each hole. In the element positioning step, since the semiconductor element 12 moved by the positioning member 22 is sucked through the plurality of suction holes 38 of the plate 34, an appropriate movement resistance is given.

  Next, in the board positioning unit 40, the pair of transport members 42 positions the printed wiring board 44 (board positioning process). This substrate positioning step does not have to be performed after the element positioning step, and may be performed before or simultaneously with the element positioning step.

  Next, the semiconductor element 12 positioned in the element positioning process is held by the collet 70 of the transfer device 60 (holding process). Specifically, the holding step is performed as follows. That is, first, as shown in FIG. 10A, the collet 70 is lowered with respect to the semiconductor element 12 located at the positioning position, and the abutting member 86, the abutting portion 76, and the abutting claw in the collet 70. 80 is abutted against the semiconductor element 12, and the semiconductor element 12 is positioned with respect to the collet 70 in the Y direction, the Z direction, and the X direction. At this time, the abutting portion 22C of the positioning member 22 abuts against the side surface 12A of the semiconductor element 12, and the side surface 12A of the semiconductor element 12 is sucked through the second suction hole 38B and the suction path 23, The bottom surface 12D is in a state of being sucked through the plurality of first suction holes 38A.

  Then, suction by the suction device 62 of the transfer device 60 is started, and suction at the positioning table 30 through the plurality of suction holes 38 (first suction hole 38A and second suction hole 38B) is stopped. As a result, as shown in FIG. 10B, the semiconductor element 12 positioned in the Y direction, the Z direction, and the X direction by the abutting member 86, the abutting portion 76, and the abutting claw 80 is moved to the collet 70. Retained.

  Next, the semiconductor element 12 held by the collet 70 is mounted on the printed wiring board 44 positioned in the substrate positioning process (mounting process). Thereby, a printed wiring board device is manufactured.

  As described above, in the present embodiment, the semiconductor elements 12 temporarily placed in the temporary placement position are arranged in a line along the X direction at each portion from one end portion to the other end portion in the longitudinal direction on the bottom surface 12D. The whole of each of the arranged at least two first suction holes 38A is closed. As a result, the suction force with respect to the semiconductor element 12 is increased as compared with the case where the whole of each of the at least two first suction holes 38A arranged in a line along the X direction is not blocked, and the semiconductor element 12 becomes a plate. It is suppressed that it falls on 34.

  In the present embodiment, the abutting portion 22C of the positioning member 22 with respect to the semiconductor element 12 temporarily placed in the temporary placement position is not mounted as shown in FIGS. 2 and 8B. Is retracted to the outside (the right side in FIGS. 2 and 8B). For this reason, compared with the case where the abutting portion 22C is retracted in the mounting region 34A, the side surface 12A of the semiconductor element 12 is less likely to be attracted to the collapse direction side (Y direction) side by the suction port 23A of the abutting portion 22C. The semiconductor element 12 is prevented from falling on the plate 34.

  Further, in the present embodiment, the semiconductor element 12 temporarily placed in the temporary placement position is retracted from the outside of the non-mounting region 34B (on the right side in FIGS. 2 and 8B), as shown in FIGS. As shown in FIG. 9 (A), the positioning member 22 moves in the direction of arrow C, and the abutting portion 22C abuts against the side surface 12A. For this reason, compared with the case where the abutting portion 22C is retracted in the mounting region 34A, the moving distance (running distance) of the positioning member 22 is ensured, and the positioning member 22 is accelerated when moved. As a result, the positioning member 22 is not easily affected by suction, and the positioning member 22 moves smoothly, so that the abutting portion 22C abuts against the side surface 12A of the semiconductor element 12 and the abutting surface 22D of the semiconductor element 12 The abutment to the end surface on the −X direction side is performed satisfactorily.

  In this embodiment, the side surface 12A of the semiconductor element 12 is sucked through the second suction hole 38B and the suction path 23 with a suction force weaker than the suction force with respect to the bottom surface 12D. The semiconductor element 12 is prevented from falling on the plate 34 as compared with the case where the bottom surface 12D and the side surface 12A are sucked. In particular, when the semiconductor element 12 is transferred from the suction nozzle 54 to the positioning member 22 and when the semiconductor element 12 is transferred from the positioning member 22 to the collet 70, the semiconductor element 12 that is likely to fall is suppressed. That is, when the positioning member 22 approaches the semiconductor element 12 positioned at the temporary placement position, the semiconductor element 12 is not easily affected by the intake air (airflow) at the suction port 23A of the abutting portion 22C, and the plate It is suppressed that it falls on 34. Further, when the positioning member 22 moves away from the semiconductor element 12 located at the positioning position, the semiconductor element 12 is not easily affected by the intake air (airflow) at the suction port 23A of the abutting portion 22C and falls on the plate 34. Is suppressed.

  Further, in the present embodiment, the semiconductor elements 12 positioned at the positioning positions are at least arranged in one row along the X direction at each portion from one end portion to the other end portion in the longitudinal direction on the bottom surface 12D. The whole of each of the two first suction holes 38A is closed. As a result, the suction force with respect to the semiconductor element 12 is increased as compared with the case where the whole of each of the at least two first suction holes 38A arranged in a line along the X direction is not blocked, and the semiconductor element 12 becomes a plate. It is suppressed that it falls on 34.

  Moreover, in this embodiment, since the semiconductor element 12 is suppressed from falling on the plate 34, the yield of the manufactured substrate device is improved.

(Modification)
In the present embodiment, the abutting portion 22C is retracted to the outside (right side in FIG. 2) of the non-mounting region 34B with respect to the side surface 12A of the semiconductor element 12 temporarily placed in the temporarily placing position. The configuration may be such that 22C is retracted to the non-mounting area 34B. Further, the abutting portion 22C may be retracted to the mounting area 34A.

  Further, in the present embodiment, at the temporary placement position and the positioning position, two or more whole holes of the plurality of first suction holes 38 </ b> A are blocked by the longitudinal portions of the bottom surface 12 </ b> D of the semiconductor element 12. However, it may be configured to cover each first suction hole 38A so that a part of each first suction hole 38A is exposed at at least one of the temporary placement position and the positioning position.

  The present invention is not limited to the above-described embodiment, and various modifications, changes, and improvements can be made. For example, the modification examples described above may be appropriately combined.

DESCRIPTION OF SYMBOLS 10 Manufacturing apparatus 12 Semiconductor element (an example of components)
12A Side surface 12D Bottom surface 20 Positioning device 22 Positioning member 22C Abutting portion 23 Suction path 23A Suction port (an example of an opening)
30 Positioning stand (an example of a stand)
34A Mounting area (an example of area)
36 Suction Device 38A First Suction Hole 38B Second Suction Hole 40 Substrate Positioning Unit 63 Moving Mechanism 70 Collet (Example of Holder)
100 On-board equipment

Claims (5)

A platform having a first region for placing the component in an upright position and a second region for not placing the component;
A plurality of first suction holes formed in the first region;
A plurality of second suction holes formed in the second region at a lower density than the plurality of first suction holes in the first region;
The part is predetermined on the first area in a state of having an abutting part and abutting the abutting part against a side surface of the part temporarily placed at the temporary placement position on the first area. A positioning member that moves and positions the selected positioning position;
A suction path having an opening opening in the abutting portion, and passing through the opening and the second suction hole;
A suction device that sucks the bottom surface of the component placed on the first region through the first suction hole and sucks the side surface of the component through the second suction hole and the suction path;
A positioning device comprising:   The positioning device according to claim 1, wherein the positioning member moves from a state in which the abutting portion is retracted to the second region and abuts against a side surface of the component. The part has a length;
The positioning member is positioned by moving the component to the positioning position set at a position where two or more of the plurality of first suction holes are blocked by the longitudinal portions of the bottom surface of the component. And
Furthermore, a temporary placement portion for temporarily placing the component is provided at the temporary placement position set at a position where two or more of the plurality of first suction holes are blocked by each longitudinal portion of the bottom surface of the component. The positioning device according to claim 1 or 2. The positioning device according to any one of claims 1 to 3, wherein the component is positioned;
A substrate positioning unit for positioning the substrate;
A holder for holding the component positioned by the positioning device;
A moving mechanism for moving the holder and mounting the component on the substrate positioned by the substrate positioning unit;
Mounting device equipped with. A component positioning step of positioning the component by the positioning device of the mounting device according to claim 4;
A substrate positioning step of positioning the substrate on the substrate positioning portion;
A mounting step of holding the component positioned in the component positioning step with the holder and mounting the component on the substrate positioned in the substrate positioning step;
Manufacturing method of substrate device having