JP2002158240A - Method for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component capable of correctly carrying a long component without overturning. SOLUTION: The method for mounting the electronic component comprises the steps of taking out a long chip 4 from a supply unit, and mounting the component on the board. The method further comprises the steps of holding the chip 4 placed on a preset stage 17 at a height position to become a gap between a lower surface of the chip 4 sucked to and held by a pickup nozzle 9 of a prescribed size C2 and an upper surface of the stage 17, when the chip 4 is centered to be positioned by a positioning pawl 20; vacuum sucking the chip 4 from a suction hole 21 of a contact part 20a in a state in which the chip 4 is held at a position, where a gap between the part 20a of the pawl 20 and a side face of the chip 4 becomes a prescribed size C3; and sucking and holding the chip 4 to and at the part 20a. Thus, the chip 4 can be correctly carried without overturning the chip 4 without generating an overturning moment due to the simultaneous contact of the upper and lower parts of the chip 4 with another object.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art In mounting electronic components such as semiconductor chips, the electronic components are taken out of a state of being housed in a container such as a tray and are transferred and mounted on a substrate. In this mounting operation, the electronic component is held by a transfer head such as an extraction head or a mounting head by vacuum suction. In the vacuum suction method, the electronic component is sucked and held by bringing the suction nozzle into contact with the electronic component and sucking the electronic component.

[0003]

In recent years, as a kind of electronic component, a so-called vertically long component having a larger height than a width of a chip in a mounting posture, such as a chip component used in an image sensor, has been used. It is supposed to be. Since the posture of such an electronic component is unstable in shape, the electronic component is removed during a transfer operation involving the delivery of the electronic component, such as a pick-up operation or a mounting operation, until the electronic component is taken out of the supply unit and mounted on a substrate. There has been a problem that a fall is likely to occur and a transfer error frequently occurs.

Accordingly, an object of the present invention is to provide an electronic component mounting method capable of correctly transferring electronic components having a vertically long shape without causing the electronic components to overturn. .

[0005]

According to a first aspect of the present invention, there is provided an electronic component mounting method, wherein an electronic component mounted on a mounting stage is positioned at a predetermined position by a take-out head, and the positioned electronic component is mounted on a substrate. An electronic component mounting method for mounting the electronic component on a mounting stage, wherein a take-out head holding the electronic component by suction is lowered with respect to a mounting stage so that a gap between a lower surface of the electronic component and an upper surface of the mounting stage has a predetermined size. And a position where the gap between a contact portion provided on the positioning member and a side surface of the electronic component has a predetermined size by horizontally moving the positioning member with respect to the electronic component held at the height position. Stopping the electronic component on the contacting portion of the positioning member by vacuum suction from a suction hole provided in the contacting portion of the positioning member; and Moving the positioning member holding comprises a step of positioning the electronic parts.

According to the electronic component mounting method of the present invention, after the electronic component mounted on the mounting stage is positioned at a predetermined position by the positioning member, the positioned electronic component is moved by the suction nozzle provided on the mounting head. An electronic component mounting method of taking out and mounting the electronic component on a substrate, wherein the mounting head is lowered and a gap between a lower surface of a suction nozzle and an upper surface of an electronic component whose side surface is suction-held by the positioning member has a predetermined size. And a step of sucking and holding the electronic component by suctioning the electronic component from the suction nozzle by vacuum suction from the suction nozzle, and a step of lifting the mounting head to take out the electronic component from the mounting stage.

According to the present invention, in the centering operation of positioning the electronic component taken out of the supply unit and mounted on the mounting stage at a predetermined position by the positioning member,
In a suction operation in which a vacuum is sucked from the positioning member while keeping a gap between the positioning member and the electronic component, and the electronic component is positioned at a predetermined position by the positioning member, and is taken out by a suction nozzle provided in the mounting head, Vacuum suction from the suction nozzle while maintaining a gap between the component and the suction nozzle prevents the electronic component from overturning due to the fact that the top and bottom of the electronic component are in contact with other objects at the same time. It can be correctly transferred without falling down.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, and FIG. 2A is a block diagram illustrating a configuration of a chip supply unit of the electronic component mounting apparatus according to one embodiment of the present invention. 4B is a partial cross-sectional view of a chip supply unit of the electronic component mounting apparatus according to the embodiment of the present invention, FIG. 3 is an explanatory diagram of a pickup operation in the electronic component mounting method according to the embodiment of the present invention, and FIG. FIG. 4A is a perspective view of a pre-center portion of one embodiment of the present invention, FIG. 4B is a partial perspective view of a positioning claw of the pre-center portion of one embodiment of the present invention, and FIG. FIG. 6 is an explanatory diagram of a centering operation in an electronic component mounting method according to an embodiment, FIG. 6 is an explanatory diagram of a suction operation in an electronic component mounting method according to an embodiment of the present invention, and FIG. 7 is an electronic component mounting method according to an embodiment of the present invention. FIG. 8 and FIG. 9 are explanatory views of the placing operation in FIG. Illustration of the bonding operation in the electronic component mounting method of the facilities in the form, Fig. 1
FIGS. 0 and 11 are explanatory views of the structure of the bonding tool of the electronic component mounting apparatus according to one embodiment of the present invention.

First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, the electronic component mounting apparatus includes a chip supply unit 1 (supply unit), a pre-center unit 15, a bonding unit 30, and a paste supply unit 42. A chip 4 (see FIGS. 2 and 3) having a vertically long cross-section, which is an electronic component to be mounted, is taken out of the chip supply unit 1 by a take-out head 12, and the pre-center unit 15
Pre-center stage 17 (mounting stage)
After being placed on the center and centered, it is sucked by the mounting head 32 and transferred to the bonding section 30. Then, the chip 4 is bonded by the paste application head 46 on the substrate 34 on which the paste 37 has been applied in advance.

Hereinafter, each unit will be described. The chip supply unit 1 has a configuration in which a tray 3 provided with a concave portion 3a which is a container for accommodating the chip 4 is placed on a support base 2, and as shown in FIG. The chip 4 is accommodated. Through holes 3b are provided in the bottom surface of the concave portion 3a so as to penetrate the tray 3, and each through hole 3b communicates with a suction space 2a formed in the support base. As shown in FIG. 2, the suction space 2a is connected to a valve 6 via a suction path 2b and a suction pipe 5. Valve 6 is a regulator 7
Is connected to the vacuum suction source 11 via the. By adjusting the setting of the regulator 7, the vacuum suction force from the through hole 3b can be set to a desired value.

By controlling the valve 6 by the control unit 10, vacuum suction is performed through the through hole 3b of the concave portion 3a, and the chip 4 accommodated in the concave portion 3a is suction-held. At this time, as shown in FIG. 2 (b), even if the chip 4 is inclined in the recess 3a, the chip 4 is sucked in vacuum from the through hole 3b with an appropriate suction force, so that the chip 4 is in a normal posture (upright posture).
Can be corrected and held.

The pick-up head 12 has a pick-up nozzle 9 for picking up chips, and the pick-up nozzle 9 is connected to a vacuum suction source 11 via a valve 8. By controlling the valve 8 by the control unit 10, vacuum suction is performed from the pickup nozzle 9. By performing vacuum suction on the suction surface of the pickup nozzle 9, the chip 4 can be suction-held by the pickup nozzle 9.

The chip 4 formed by the pickup nozzle 9
Will be described with reference to FIG. First, the chips 4 accommodated in the recesses 3a of the tray 3
Is held in a normal posture by vacuum suction through the suction hole 3b. Next, as shown in FIG. 3A, the take-out head 12 is lowered to position the pickup nozzle 9 immediately above the chip 4 sucked and held in the recess 3a. At this time, the lowering of the take-out head 12 is stopped at a height position where the gap between the suction surface of the pickup nozzle 9 and the upper surface of the chip 4 has a predetermined dimension C1.

Next, by controlling the valve 8 and sucking the vacuum from the pickup nozzle 9, the chip 4 is brought into contact with the suction surface of the pickup nozzle 9 and held by suction as shown in FIG. Then, the chip 4 is picked up by raising the take-out head 12. In this pickup operation, as described above, by stopping the suction surface of the pickup nozzle 9 at a position where the suction surface does not come into contact with the upper surface of the chip 4, the vertical and easily falling tip of the chip 4 simultaneously hits another object. No overturning moment is generated by the contact, and it is possible to prevent a pickup error due to the tip 4 falling over during the pickup operation.

At the time of this pickup operation, the timing for releasing the suction holding of the chip 4 by the vacuum suction from the through-hole 3b, the timing for starting the vacuum suction by the pickup nozzle 9, and the vacuum suction force from the through-hole 3b are: If the adjustment is made according to the relationship with the characteristics of the chip 4, a more stable pickup operation can be ensured.

For example, a chip 4 having a shape that is extremely easy to fall down
In the case of the target, the chip 4 is sucked downward by the vacuum suction from the through hole 3b and the vacuum suction is simultaneously performed from the pickup nozzle 9 at a predetermined time at the start of the pickup operation. Accordingly, the chip 4 is pulled from both the upper and lower directions, and the posture of the chip at the start of the pickup operation can be stabilized. After the posture of the chip 4 is stabilized, the through hole 3b
By releasing the vacuum suction from, the chip 4 is reliably picked up by the pickup nozzle 9 in the upright posture. At this time, by adjusting the vacuum suction force from the through hole 3b by the regulator 7, a more stable pickup operation becomes possible.

Next, the pre-center unit 15 will be described with reference to FIG. In FIG. 4A, a pre-center stage 17 having a substantially semicircular shape is provided on a mounting table 16.
The inside of the dashed line frame 22 of the pre-center stage 17 is a suction area for the chips 4, and a large number of suction holes 23 (see FIG. 5) are provided in a grid in the suction area. By driving a vacuum suction source (not shown), vacuum suction is performed from the suction hole 23, and the chip 4 mounted on the pre-center stage 17 can be suction-held by the suction hole 23 in a vertical posture.

A positioning claw 20 (positioning member) extends from the side on the pre-center stage 17, and by driving a positioning claw driving unit 19 (see FIG. 1), the positioning claw 20 moves in the direction of arrow a. Reciprocate. Positioning claw 2
0 has a contact portion 2 in a direction orthogonal to the direction of arrow a.
0 a is provided, and the contact portion 20 a contacts the side surface of the chip 4 placed on the pre-center stage 17 in a vertical posture. The contact portion 20a is provided with a suction groove 21.
The suction groove 21 is formed in the concave portion 2 formed on the lower surface of the positioning claw 20.
0b.

As shown in FIG. 5, the positioning claw 20 is positioned above the suction area on the upper surface of the pre-center stage 17 where the suction hole 23 is provided. Is sucked in vacuum from the recess 20b located in the contact portion 20a, and is thus sucked from the suction groove 21 opened in the contact portion 20a. Thereby, the positioning claw 20
Can suck and hold the chip 4 placed on the pre-center stage 17 in an upright posture with the side surface in contact with the contact portion 20a.

A chip detection sensor 24 is provided in front of the pre-center stage 17, and the chip detection sensor 24 detects the chip 4 placed on the pre-center stage 17 in an upright posture. Here, even when the chip 4 is placed on the pre-center stage 17, the chip 4 is not detected if the posture is in the overturned state.
In this case, it is determined that the chip 4 has a poor posture, and this determination result is transmitted to the control unit 10. Upon receiving this signal, the control unit 10 sends the positioning claw 20 to the positioning claw driving unit 19.
Command. As a result, the positioning claw 20 moves to the near side, and the chip 4 that has been overturned on the pre-center stage 17 falls into the collecting section 18 disposed on the near side.

Next, referring to FIG. 5 and FIG.
The centering operation of the chip 4 and the suction operation after the centering performed in the step 5 will be described. First, FIG.
The pickup nozzle 9 of the take-out head 12 with reference to
The centering operation for positioning the chip 4 taken out of the chip supply unit 1 and placed on the pre-center stage 17 at a predetermined position by the positioning claw 20 will be described.

In FIG. 5A, the chip 4 taken out from the chip supply unit 1 by the take-out head 12 is
While being sucked and held by the pick-up nozzle 9 (see FIG. 3), it moves to the mounting position on the pre-center stage 17. Then, the pickup nozzle 9 of the take-out head 12 is lowered with respect to the pre-center stage 17 (arrow b). At this time, the lowering of the take-out head 12 is stopped at a height position where the gap between the lower surface of the chip 4 and the upper surface of the pre-center stage 17 has a predetermined dimension C2.

Next, the positioning claw 20 is moved horizontally with respect to the chip 4 held by the pickup nozzle 9 (arrow c). At this time, the movement of the positioning claw 20 is stopped at a position where the gap between the contact portion 20a and the side surface of the chip 4 has a predetermined dimension C3.

After the vacuum suction from the suction hole 23 is started, the vacuum suction from the pickup nozzle 9 is stopped. As a result, as shown in FIG. 5B, the chip 4 is captured by the lateral suction force generated by the suction groove 21 sucked through the recess 20b and the downward suction force by the suction hole 23, and is picked up. Abutting portion 20 which is detached from nozzle 9
a is held by suction in the upright posture. Thereafter, the pickup nozzle 9 retreats upward, and drives the positioning claw 20 to move the contact portion 20a to the alignment position PA for positioning as shown in FIG. 5C (arrow d). Thus, the centering of the chip 4 is completed.

As shown in FIG. 7, the pick-up nozzle mounted on the pick-up head 12 for picking up the chip 4 is partially replaced with the pick-up nozzle 9 having a flat lower end as shown in FIG. A pickup nozzle 9 'provided with a contact end 9'a projecting downward may be used.

In the placing operation of placing the chip 4 on the pre-center stage 17 using the pickup nozzle 9 ', first, as shown in FIG. Center stage 1
Lower to 7. Then, the contact end 9 ′ a contacts the upper surface of the pre-center stage 17. At this time, the height of the contact end 9′a is set so that the gap between the lower surface of the chip 4 and the upper surface of the pre-center stage 17 has a predetermined size C2. Then, from this state, the vacuum suction by the pickup nozzle 9 ′ is released, whereby the chip 4 is sucked by the suction hole 23 of the pre-center stage 17, and the mounting operation is completed.

A pickup nozzle 9 'having such a shape.
Is advantageous in that the gap between the lower surface of the chip 4 and the upper surface of the pre-center stage 17 is always kept at the predetermined dimension C2 during the mounting operation. However, when the pickup nozzle 9'a having such a contact end 9'a is used, the shape of the tray 3 of the chip supply unit 1 is changed.
It is necessary to set the shape so that the contact end 9′a does not interfere during the pickup operation.

Next, with reference to FIG. 6, a description will be given of a suction operation in which the chip 4 positioned at a predetermined position by the above-described centering is taken out by the suction nozzle 29 provided in the mounting head 32. As shown in FIGS. 9 and 10, the suction nozzle 29 used here has a contact surface 53 that contacts the side surface of the chip 4 and a contact surface 54 that contacts the upper surface of the chip 4.

In FIG. 6 (a), the chip 4 is
3 and the positioning claw 20, the side surface is sucked and held at the alignment position PA (see FIG. 5C). In this state, the suction nozzle 29 is lowered by the mounting head 32 (arrow e). At this time, the aforementioned 2
The movement of the suction nozzle 29 is stopped at a position where the gaps between the two contact surfaces 53 and 54 and the side surface and the upper surface of the chip 4 become predetermined gaps C4 and C5, respectively.

Thereafter, as shown in FIG. 6B, after the vacuum suction from the suction nozzle 29 is started, the vacuum suction from the suction hole 23 is stopped. As a result, the chip 4 is captured by the suction force of the suction nozzle 29, detaches from the positioning claw 20 and the pre-center stage 17, comes into contact with the contact surfaces 53 and 54, and is held by suction. Then, the positioning claw 20 retreats to the side (arrow g), and the mounting head 32 holding the chip 4 by suction is lifted to move the suction nozzle 29 upward (arrow f), thereby the pre-center stage 1
7. Take out the chip 4 from the chip 7.

Next, the bonding section 30 will be described. In FIG. 1, a substrate holder 33 is provided on a moving table 31, and the substrate holder 33 holds a substrate 34 to which the chip 4 is bonded. The substrate 34 includes
Prior to mounting the chip 4, the paste 37 is applied by the paste application head 46. Paste supply unit 42
The surface of the paste 37 in the paste storage container 43 disposed in the
By lowering the application pin 47 of the paste application head 46 to 7, the paste 37 is pasted on the application pin 47. Then, the paste 37 is applied to the bonding position of the substrate 34 by moving the paste application head 46 to the bonding section 30 and lowering the application pin 47 with respect to the substrate 34.

Above the substrate holding section 33, the imaging optical system 3
The movable table 6 is horizontally movable by a movable table 35. As shown in FIG. 8, by moving the imaging optical system 36 above the chip 4 sucked and held by the suction nozzle 29 to position the recognition target site in the imaging visual field, the imaging element 38 recognizes the chip 4 An image of the part can be acquired.

The position of the chip 4 is detected by recognizing the image obtained by the image pickup device 38 with the recognition section 39. The position detection result is transmitted to the control unit 10, and by controlling the moving table 31 based on the position detection result of the chip 4, the held substrate 34 is horizontally moved, and the chip 4 held by the suction nozzle 29 is moved. It can be positioned relatively to the mounting position of the substrate 34. Imaging optical system 36, imaging device 38, and recognition unit 3
Reference numeral 9 denotes recognition means for recognizing the chip 4.

Next, the bonding operation will be described with reference to FIG. In this bonding operation, the chip 4 held by the mounting head 32 is landed on a paste 37 previously applied to a predetermined bonding position of the substrate 34 and bonded. In FIG. 9A, the substrate 3
4 is coated with a paste 37.
Chips 4 are mounted in a row on the top. The chip 4 'is already mounted on the paste 37, and a new chip 4 is mounted on the right side of the already mounted chip 4' in the following procedure. At this time, the imaging optical system 36 has been moved in advance so that the right side of the chip 4 'is included in the imaging field of view.

First, the suction nozzle 29 of the mounting head 32 holding the chip 4 is moved, and a position reference point such as an end of the held chip 4 is positioned in the field of view of the imaging optical system 36. At this time, the chip 4 is moved horizontally in FIG.
As shown in (a), the chip 4 is moved from the normal mounting position in the direction opposite to the chip moving direction by the suction nozzle 29 (chip 4).
(In the direction in which the contact surface 53 is provided to contact the side surface of the target), the position is provisionally positioned at a position offset by a predetermined dimension D.
At the same time, the paste 4 applied on the substrate 34 when the chip 4 is moved horizontally is held in a vertical position H at which the movement of the chip 4 is not hindered.

The height position H is determined by properties such as the viscosity of the paste 37. In other words, if the viscosity is so low that the paste 4 does not hinder the movement of the chip 4 even if the paste 37 slightly contacts the lower surface of the chip 4, the height position H should be set as low as possible within a range where the posture of the chip 4 is not unstable. However, when the viscosity of the paste 37 is high, the height position H is set so that the lower surface of the chip 4 does not contact the paste 37.

Next, the image pickup device 3 via the image pickup optical system 36
The chip 4 is imaged by 8, and the position of the chip 4 is recognized by the recognition unit 39. Then, by moving the moving table 31 based on the recognition result, the chip 4 held by the suction nozzle 29 is moved to the substrate 3 as shown in FIG.
The chip 4 moves horizontally relative to the chip 4 (arrow h), whereby the chip 4 is aligned with the normal mounting position. Next, as shown in FIG. 9C, the suction nozzle 29 of the mounting head 32
Is lowered (arrow i), and the chip 4 lands on the paste 37. Thereafter, the chip 4 is pressed against the substrate 34 by the suction nozzle 29 for a predetermined time, whereby the chip 4 is fixed to the substrate 34 by the paste 37 and bonded.

As described above, the pick-up operation from the chip supply unit 1, the mounting operation on the pre-center stage 17, the suction operation after centering, and the mounting operation on the substrate 34 in the mounting process of the chip 4 shown in this embodiment. In each bonding operation, when the chip 4 having a vertically long shape and easily falling over is delivered, the operation of simultaneously contacting the upper part and the lower part of the chip 4 with another object is avoided. Thus, in a transfer operation such as at the time of pickup, a tipping moment does not act on the chip 4, and the vertically long chip 4 can be bonded in a good posture without tipping or tilting of the chip 4.

Next, the suction nozzle 29 for the mounting head 32 used in the present embodiment will be described with reference to FIGS. The four types of suction nozzles 29 </ b> A to 29 </ b> D shown here are provided with shaft portions 50 provided with suction holes 50 a.
Suction blocks 51A, 51B,
51C and 51D are combined respectively.
The suction blocks 51A and 51B shown in FIG.
10 illustrates an example in which the suction blocks 51C and 51D suction and hold the chip 4 using the suction holes 57.

In FIG. 10, an inner hole 5 provided inside suction blocks 51A, 51B connected to a shaft 50 is provided.
The suction hole 50a of the shaft part 50 communicates with 2. The suction block 51 </ b> A is provided with contact surfaces 53 and 54 that contact the side surface and the top surface of the chip 4, respectively. The suction groove 56 provided on the contact surface 53 communicates with the inner hole 52. The chip 4 is suction-held on the contact surface 53 by the suction groove 56 by vacuum suction through the suction hole 50 a in a state where the contact surfaces 53 and 54 are in contact with the chip 4. At this time,
Since the position of the upper surface of the chip 4 is fixed by the contact surface 54, the vertically long chip 4 can be held in a stable posture.

The suction nozzle 29B shown in FIG.
Is provided with a tapered surface 54 ′ opened in a “C” shape below instead of providing the contact surface 54 shown in FIG. 10 (a), and the two corner portions on the upper surface of the chip 4 are attached to the suction nozzle 29 </ b> B. It is configured to be held by two contact lines 55 provided on the tapered surface 54 '. This suction nozzle 29
B can also hold the side and top surfaces of the chip 4 and hold the vertically elongated chip 4 by suction in a stable posture.

Further, the suction nozzles 29C and 29D shown in FIGS. 11A and 11B correspond to the suction grooves 56 of the suction nozzles 29A and 29B shown in FIGS.
This is replaced with suction holes 57 provided in 1C and 51D. Even with such a configuration, FIG.
A suction nozzle having the same function as (b) is realized.

[0043]

According to the present invention, in the centering operation in which the electronic component taken out of the supply unit and mounted on the mounting stage is positioned at a predetermined position by the positioning member, a gap is provided between the positioning member and the electronic component. In the suction operation in which the vacuum suction is performed from the positioning member while the electronic component is positioned at the predetermined position by the positioning member and the electronic component is taken out by the suction nozzle provided in the mounting head, a gap is maintained between the electronic component and the suction nozzle. Vacuum suction from the suction nozzle in a state where the electronic component is welded on the top and bottom of other electronic components at the same time as other objects does not generate a overturning moment, and the electronic component is correctly transferred without overturning be able to.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2A is a block diagram illustrating a configuration of a chip supply unit of the electronic component mounting apparatus according to one embodiment of the present invention; FIG. Sectional view

FIG. 3 is an explanatory diagram of a pickup operation in the electronic component mounting method according to one embodiment of the present invention.

FIG. 4A is a perspective view of a pre-center portion according to an embodiment of the present invention. FIG. 4B is a partial perspective view of a positioning claw of the pre-center portion according to an embodiment of the present invention.

FIG. 5 is an explanatory diagram of a centering operation in the electronic component mounting method according to one embodiment of the present invention;

FIG. 6 is an explanatory diagram of a suction operation in the electronic component mounting method according to one embodiment of the present invention;

FIG. 7 is an explanatory diagram of a mounting operation in the electronic component mounting method according to one embodiment of the present invention;

FIG. 8 is an explanatory diagram of a bonding operation in the electronic component mounting method according to one embodiment of the present invention;

FIG. 9 is an explanatory diagram of a bonding operation in the electronic component mounting method according to one embodiment of the present invention;

FIG. 10 is a structural explanatory view of a bonding tool of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 11 is a structural explanatory view of a bonding tool of the electronic component mounting apparatus according to one embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip supply part 3 Tray 4 Chip 9 Pickup nozzle 12 Pickup head 17 Precenter stage 20 Positioning claw 29 Suction nozzle 32 Mounting head 33 Substrate holding part 34 Substrate 37 Paste 42 Paste supply part

Claims (2)

[Claims] An electronic component mounting method for positioning an electronic component mounted on a mounting stage by a take-out head at a predetermined position by a positioning member and mounting the positioned electronic component on a substrate. A step of lowering the suction head held by suction with respect to the mounting stage and stopping at a height position where a gap between the lower surface of the electronic component and the upper surface of the mounting stage has a predetermined dimension, and moving the positioning member to the height position. Moving the electronic component horizontally with respect to the held electronic component and stopping the electronic component at a position where a gap between a contact portion provided on the positioning member and a side surface of the electronic component has a predetermined dimension; and providing the electronic component at the contact portion of the positioning member. Suctioning and holding the electronic component on the contact portion by vacuum suction from the suction hole provided; and moving the positioning member holding the electronic component to position the electronic component. Electronic component mounting method which comprises the step of determining. 2. An electronic component mounting method comprising: positioning an electronic component mounted on a mounting stage at a predetermined position by a positioning member; extracting the positioned electronic component by a suction nozzle provided on a mounting head; and mounting the electronic component on a substrate. A method of lowering the mounting head and stopping at a height position where a gap between the lower surface of the suction nozzle and the upper surface of the electronic component whose side surface is suction-held by the positioning member has a predetermined dimension; and An electronic component mounting method, comprising: a step of bringing an electronic component into contact with a suction nozzle by vacuum suction to suck and hold the electronic component; and a step of lifting a mounting head to take out the electronic component from a mounting stage.