JP2006147725A - Chip-mounting machine and chip-mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem caused by the arrangement of an adhesive coating device and a chip-mounting device, in a chip-mounting machine and a chip-mounting method. <P>SOLUTION: The adhesive coating device 44 and the chip-mounting device 48 are arranged in a direction perpendicular to a substrate conveyance direction by a substrate carrying device 40, and are arranged on both sides of a substrate-holding device 42. A coating head 520 and a mounting head 960 are moved alternately onto a stationary substrate 20 held by the substrate holding device 42 for alternately performing the coating of the adhesive and the mounting of a chip for each package substrate of the substrate 20. The mounting head 960 receives the chip from the chip-holding device 46, carries the chip to the substrate 20, and mounts the chip to a portion coated with the adhesive. A portion where the chip is mounted on the substrate 20 is supported and heated by a substrate support/heating device 50, and the adhesive is melted and the chip is adhered. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mounting machine and method for mounting a bare chip on a substrate, and more particularly, to a mounting machine and method for applying an adhesive to a substrate and bonding the bare chip to the application part.

  A mounting machine and a method for mounting a semiconductor chip on a substrate are already known as described in Patent Document 1 below, for example. The chip mounting machine described in Patent Document 1 includes a chip mounting device, a chip supply device, a substrate holding device, a substrate transport device, and a paste-like substance coating device. The paste material application device and the chip mounting device are provided side by side in the substrate transfer direction on one side of the substrate transfer device, and the chip supply device is provided on the opposite side of the chip transfer device with respect to the substrate transfer device. The apparatus is provided at a position between the chip supply device and the substrate transfer device.

On the substrate, semiconductor chips are mounted at a plurality of locations. For this reason, the substrate carried into the paste-like substance coating device is coated with paste-like substances such as flux, anisotropic conductive paste, and solder paste on all chip mounting locations by the paste-like substance coating device. While being sent to the chip mounting apparatus side by the transfer device, it is transferred to the substrate holding apparatus, and the chip mounting apparatus mounts a plurality of semiconductor chips received from the chip supply apparatus on the substrate. The chip mounting apparatus includes a heating device, and when the semiconductor chip is mounted on the substrate, the solder is heated and melted to join the semiconductor chip to the substrate.
JP 2001-68510 A

However, this chip mounting machine has a problem that the paste material application device and the chip mounting device are arranged side by side in the substrate transport direction, and the chip mounting machine becomes large in the substrate transport direction.
In addition, the distance between the paste-form substance applying device and the chip mounting device is equivalent to a plurality of substrates, and between these devices, there are a plurality of substrates on which the semiconductor chip has not yet been mounted although the solder has been applied. In this case, there is a problem that the properties of the solder change while waiting for the mounting of the semiconductor chip, and the semiconductor chip is not mounted properly. Alternatively, if the chip mounting machine is stopped for some reason during the mounting operation, there is a problem that the waiting substrate is wasted.
The present invention has been made against the background of the above circumstances, and an object of the present invention is to solve at least one of the above problems in the prior art.

  In order to solve the above problems, a chip mounting machine according to the present invention manufactures a substrate with a chip by applying an adhesive to a plurality of locations on the substrate and mounting and bonding a bare chip to each of the application portions. (A) a substrate transfer device that carries a substrate into the work area in the substrate transfer direction and unloads the substrate from the work area in the substrate transfer direction; and (b) the substrate in a horizontal posture in the work area. A substrate holding device for holding, (c) an adhesive application device for applying an adhesive to each of a plurality of locations of the substrate held by the substrate holding device, and (d) a chip holding device for holding a plurality of bare chips. (E) a chip mounting device that receives a plurality of bare chips held by the chip holding device one by one, and is mounted and bonded to each of the portions to which the adhesive of the substrate held by the substrate holding device is applied; Seen, the adhesive applying device and the chip mounting apparatus, characterized in that disposed side by side in a direction perpendicular to the substrate conveying direction.

The chip mounting method according to the present invention is a method for manufacturing a chip-attached substrate by applying an adhesive to a plurality of locations on a substrate and mounting and bonding a bare chip to each of the application portions. It is characterized in that the application of the agent and the mounting of the bare chip are repeatedly performed a predetermined number of times alternately.
The number of settings may be one or more. When the set number is 1, every time an adhesive is applied to one point, a bare chip (hereinafter abbreviated as a chip unless otherwise required) is mounted on that point. Application of the adhesive and mounting of the chip are performed alternately. When the set number is plural, after the adhesive is applied to a plurality of points, the mounting of the chip on each of the plurality of points is repeated a plurality of times.
In addition, a plurality of chips may be stacked and mounted on one place on the substrate. In that case, an adhesive may be applied to the surface of the chip already mounted on the substrate. "Applying agent".

  According to the chip mounting machine of the present invention, the size of the chip mounting machine in the substrate transport direction can be reduced. For example, in a chip mounting machine, a plurality of units are arranged adjacent to each other, and these units are often managed by one worker. Conventionally, as described above, an adhesive application area and a chip are used. The mounting area is often set a considerable distance in the substrate transfer direction, which increases the dimensions of the chip mounting machine in the substrate transfer direction, and increases the movement distance of workers who manage multiple chip mounting machines. Therefore, there is a disadvantage that the number of manageable units is limited to a relatively small number. On the other hand, if the chip mounting machine in this section is used, the number of chip mounting machines that can be managed by one person can be increased. Furthermore, according to the present invention, a chip mounting machine suitable for carrying out the following method invention can be obtained.

  In addition, according to the chip mounting method according to the present invention, the time from application of the adhesive to mounting of the chip is short, and since there are few changes in properties such as the concentration and hardness of the adhesive in the meantime, It is easy to make the chip mounting state uniform. Conventionally, in order to avoid interference between the adhesive application device and the chip mounting device, the adhesive application area and the chip mounting area are usually separated by a considerable distance in the substrate transport direction. In addition, there are usually a plurality of substrates on which an adhesive is applied but chips are not yet mounted. For this reason, when the equipment stops for an unplanned reason, these multiple boards may become defective products. The method in this section eliminates the generation of such unnecessary products. obtain.

Aspects of the Invention

  In the following, the invention that is claimed to be claimable in the present application (hereinafter referred to as “claimable invention”. The claimable invention is at least the “present invention” to the invention described in the claims. Some aspects of the present invention, including subordinate concept inventions of the present invention, superordinate concepts of the present invention, or inventions of different concepts) will be illustrated and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, etc., and as long as the interpretation is followed, another aspect is added to the form of each section. In addition, an aspect in which constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

  In each of the following items, the combination of items (9), (15) and (16) corresponds to claim 1, (19) is claim 2, and (21) is claim. In claim 3, claim (23) is claim 4, claim (26) is claim 5, claim (30) and (31) are combined in claim 6, claim (32) is claim In claim 7, claim (33) is claim 8, claim (35) is claim 9, claim (37) is claim 10, claim (38) and (39) are combined. (40) corresponds to claim 12, (1) and (7) are combined, claim 13 corresponds to claim 13, and (8) corresponds to claim 14.

(1) A chip mounting method for manufacturing a chip-attached substrate by applying an adhesive to a plurality of locations on a substrate and mounting and bonding a bare chip to each of the application portions.
(2) The chip mounting method according to (1), wherein the bare chip is a semiconductor chip formed by forming a plurality of identical electronic circuits on a wafer and then cutting each electronic circuit.
(3) The chip mounting method according to (2), wherein the plurality of semiconductor chips are obtained by dicing the wafer to be fixed to a flexible sheet.
(4) The chip mounting method according to any one of (1) to (3), wherein the substrate is an assembly of a plurality of small substrate portions having the same wiring pattern.
The substrate in this section includes, for example, a tape-shaped substrate in which a plurality of small substrate portions are arranged in a line.
(5) The chip mounting method according to (4), wherein the substrate has a structure in which the small substrate portions are arranged in a matrix.
(6) The chip mounting method according to any one of (1) to (5), wherein the bare chip is mounted on the substrate face up.
(7) The chip mounting according to any one of (1) to (6), wherein the application of the adhesive and the mounting of the bare chip are alternately performed a plurality of times by a predetermined number of times. Method.
The features in this section are preferably used in conjunction with the features in the next section, but are not essential. For example, even when the adhesive application area and the chip mounting area are different, the method described in this section is implemented if the substrate is moved back and forth between the two areas between the set number of application and mounting. be able to. At this time, the adhesive application area and the chip mounting area may be set at different positions in the substrate transport direction, or may be set at different positions in a direction intersecting the substrate transport direction (for example, an orthogonal direction). .
(8) The chip mounting method according to any one of (1) to (7), wherein both the application of the adhesive and the mounting of the bare chip are performed on the substrate that is stationary at one place.
In the method of this section, since the application of the adhesive to one substrate and the mounting of the chip are performed in the same area, it is not necessary to move the substrate between the application of the adhesive and the mounting of the chip. It can be simplified.
In addition, when the features of this section and the features of the previous section are adopted, if the application head applies the adhesive while the mounting head is receiving the next chip to be mounted, The disadvantage of extending the tact time due to the application and mounting in the same area can be minimized.
Each feature described in each of the items (7) and (8) can be employed independently of each feature described in each of the items (1) to (6).
(9) A chip mounting machine that manufactures a substrate with a chip by applying an adhesive to a plurality of locations on the substrate and mounting and bonding a bare chip to each of the application portions.
(10) The chip mounting machine according to (9), wherein the bare chip is a semiconductor chip formed by forming a plurality of identical electronic circuits on a wafer and then cutting each electronic circuit.
(11) The chip mounting machine as set forth in (10), wherein the plurality of semiconductor chips are those in which the wafer is fixed to a flexible sheet and diced.
(12) The chip mounting machine according to any one of (9) to (11), wherein the substrate is an assembly of a plurality of small substrate portions having the same wiring pattern.
(13) The chip mounting machine according to (12), wherein the substrate has a structure in which the small substrate portions are arranged in a matrix.
(14) The chip mounting machine according to any one of (9) to (13), wherein the bare chip is mounted face-up on the substrate.
(15) A substrate transport apparatus that carries the substrate into a work area in the substrate transport direction and unloads the substrate in the substrate transport direction from the work area;
A substrate holding device for holding the substrate in a horizontal posture in the work area;
An adhesive application device that applies the adhesive to each of a plurality of locations of the substrate held by the substrate holding device;
A chip holding device for holding a plurality of the bare chips;
A chip mounting device that receives the plurality of bare chips held by the chip holding device one by one, and is mounted on each of the portions to which the adhesive is applied of the substrate held by the substrate holding device; A chip mounting machine according to any one of (9) to (14).
The chip mounting machine of this section is suitable for carrying out the chip mounting method according to any one of the above items (1) to (8).
(16) The chip mounting machine according to (15), wherein the adhesive application device and the chip mounting device are arranged side by side in a direction perpendicular to the substrate transport direction.
Since the adhesive applicator can often be configured smaller than the chip mounting device, when the chip mounting machine is viewed from the front side, the adhesive applicator is disposed on the front side of the substrate holding device, and the substrate holding device By disposing the chip mounting device on the back side, it is easy to access each part of the chip mounting machine. In particular, it is desirable that the adhesive coating device, the substrate holding device, the chip holding device, and the chip mounting device are arranged in this order from the front side. However, it is necessary that the coating head of the adhesive coating device can be moved to a position above the substrate holding device, and the mounting head of the chip mounting device must be movable to a position above the chip holding device and the substrate holding device. .
(17) The adhesive application device applies an adhesive to the application head, and the application head moves the application head at least in the X direction parallel to the substrate transport direction and in the horizontal Y direction perpendicular to the X direction. The chip mounting machine according to (16), including a moving device.
(18) The chip mounting apparatus holds and mounts the bare chip, and moves the mounting head in at least an X direction parallel to the substrate transport direction and a Y direction perpendicular to the X direction and horizontal. The chip mounting machine according to (16) or (17), including a mounting head moving device.
(19) The adhesive application device applies an adhesive to the application head, and the application head moves the application head at least in the X direction parallel to the substrate transport direction and in the horizontal Y direction perpendicular to the X direction. A mounting head on which the chip mounting apparatus holds and mounts the bare chip, an X direction parallel to at least the substrate transport direction, and a Y direction perpendicular to the X direction and a horizontal Y direction. And the coating head moving device and the mounting head moving device move the coating head and the mounting head to a position above the substrate held by the substrate holding device. The chip mounting machine according to item (18), including a coating head / mounting head movement control device that selectively moves.
According to the chip mounting machine of this section, it is possible to alternately perform adhesive application and chip mounting on a substrate stopped at one place while avoiding interference between the coating head and the mounting head.
(20) The mounting head includes a plurality of chip holding units, and the mounting head moving device receives each bare chip from the chip holding device, and the substrate holding device. The chip mounting machine according to the item (18) or (19), wherein the mounting head is imparted with a movement necessary to be transported all over the substrate held at a time and mounted sequentially one by one.
This chip mounting machine is particularly suitable for carrying out the method invention according to the above item (7) in a mode in which the set number is plural. The number of settings is set to be the same as the number of chip holding portions of the mounting head.
(21) The substrate transfer device is
A substrate guide path for guiding the substrate;
Work with the substrate by engaging the gripping portion for gripping the first end of the substrate to be carried into the work area and the second end of the substrate in the work area opposite to the first end. An action part provided back-to-back with each other in the substrate transport direction with the extrusion part extruded from the area;
The chip mounting machine according to any one of (15) to (20), including an action part moving device that holds the action part and moves the action part in the substrate transport direction.
According to the action part provided with the gripping part and the pushing part back to back, the next board can be carried onto the substrate holding apparatus while the board on the board holding apparatus is pushed out and carried out by the pushing part. With the substrate transport apparatus having a simple structure, the substrate can be transported efficiently. In addition, since the working portion provided with the gripping portion and the pushing portion back to back can reduce the size in the substrate transport direction, the substrate guide path can be shortened accordingly. It can be configured compactly.
(22) The substrate transfer device is
A substrate guide path for guiding the substrate;
A gripping portion having a gripping claw for gripping the first end portion of the substrate to be carried into the work area, and a contact for contacting the second end portion of the substrate in the work area opposite to the first end portion. An action part comprising an extruding part having a surface and extruding the substrate from the work area;
(15) to (20), wherein the distance between the tip of the gripping claw and the contact surface is 70 mm or less. The chip mounting machine according to any one of the items.
In order to make the chip mounting machine compact, it is more desirable that the distance is 50 mm or less, 40 mm or less, or 30 mm or less.
In the chip mounting machine of this section, the gripping part and the pushing part may be provided back to back, but this is not essential. For example, the gripping part may be provided at the center part in the width direction of the substrate, and the pushing part may be provided on both sides in the width direction of the gripping part. In this case, it is possible to overlap a part of the gripping part and the pushing part in the substrate transport direction, and it is possible to reduce the necessary gap between the overlap part and the back surface and the dimension of the action part in the transport direction. .
(23) The substrate transport apparatus includes a movable frame having a vertical portion extending vertically on one side of the substrate guide path and a horizontal portion extending horizontally in a cantilevered manner from the vertical portion, and the action portion is the horizontal The chip mounting machine according to (21) or (22), wherein the working unit moving device is held by a moving part and moves the working part via the movable frame.
If the movable frame has a vertical part and a horizontal part, the vertical part moves between the substrate guide path and the adhesive application device, chip holding device, chip mounting device, etc. disposed on both sides thereof. It is sufficient to secure a space required for the chip mounting, and the chip mounting machine can be configured compactly.
(24) The substrate transport apparatus includes a substrate guide path for guiding the substrate, and the substrate guide path supports at least both side edges of the substrate in the width direction from below;
A pair of defining surfaces facing both side surfaces of the substrate and defining a movement limit in the width direction of the substrate;
From the first specified surface, a forward position that is provided on the side of the first specified surface that is one of the pair of specified surfaces and protrudes from the first specified surface toward the second specified surface that is the other specified surface; A movable regulating member movable to a retracted position that does not protrude;
The chip mounting machine according to any one of (15) to (23), including a defining member driving device that moves the movable defining member between the forward movement position and the backward movement position.
In the advance position of the movable defining member, both the movable defining member and the second defining surface may contact both side surfaces of the substrate to prevent movement in the width direction. The distance between the two may be larger than the width of the substrate, and the movable amount in the width direction of the substrate may be defined smaller than the pair of defining surfaces. The latter is desirable from the viewpoint of allowing movement in the substrate transport direction even when the movable regulating member is in the forward position, and from the viewpoint of avoiding the curvature of the substrate.
(25) It includes at least one of an upstream guide path located upstream of the substrate guide path as the main guide path and a downstream guide path located downstream, at least one of which is at least both side edges of the substrate in the width direction. And a pair of defining surfaces that are opposed to both side surfaces of the substrate and define a movement limit in the width direction of the substrate, and the distance between at least one pair of defining surfaces is The chip mounting machine according to (24), which is smaller than a distance between a pair of defined surfaces of the main guide path.
The guide path of the substrate transfer apparatus can be constituted by a main guide path and at least one of an upstream guide path and a downstream guide path. However, from the viewpoint of reducing the dimension in the transport direction of the chip mounting machine, it is possible to employ at least one of forming the upstream guide path in the substrate supply cartridge and forming the downstream guide path in the substrate storage cartridge. desirable. In the former case, the substrate is directly carried out from the substrate supply cartridge by the substrate transfer device, and in the latter case, the substrate is directly stored in the substrate storage cartridge by the substrate transfer device. When both the formation of the upstream guide path in the substrate supply cartridge and the formation of the downstream guide path in the substrate storage cartridge are employed, a pair of prescribed surfaces of the substrate supply cartridge and the substrate storage cartridge are provided. It is desirable to make the distances equal, and in such a case, it is desirable to offset the substrate storage cartridge by a small distance from the main guide path toward the second prescribed surface side thereof. By doing so, the substrate brought close to the second regulation surface side by the movable regulation member is prevented from coming into contact with the upstream end surface of the regulation surface forming portion of the board storage cartridge when being stored in the board storage cartridge. can do.
(26) A heater that can heat a part of the substrate held by the substrate holding device and stationary, and a heater that moves the heater in a direction parallel to the stationary substrate held by the substrate holding device. The chip mounting machine according to any one of (15) to (25), including a moving device.
Conventionally, the entire substrate is heated by a heater. Therefore, it is inevitable that an unnecessary part of the substrate is heated, or even a part that needs to be heated is heated unnecessarily for a long time. On the other hand, according to the feature of this section, only the desired portion can be heated by moving the heater to the portion of the substrate to be heated.
Since the substrate is held and stationary by the substrate holding device, the chip mounting machine transports the substrate compared to the case where the adhesive is applied and the chip is mounted while moving the substrate intermittently in the substrate transport direction. The above effect can be obtained while being compact in the direction.
(27) The chip mounting machine according to (26), wherein the heater moving device moves the heater in a direction parallel to the substrate transport direction.
For example, the heater can be moved in a horizontal direction orthogonal to the transport direction. However, since it is often desirable to heat a part of the substrate in the substrate transport direction, it is generally desirable to employ the configuration of this section.
(28) The heater is a support member combined heater that supports the part of the stationary substrate held by the substrate holding device from below and supports the part while heating the part. The chip mounting machine according to item 26) or (27).
The configuration can be simplified and the desired portion of the substrate can be efficiently heated.
(29) The chip mounting machine as set forth in (28), wherein the supporting member combined heater has an air suction passage that is in contact with the substrate and opens in a supporting surface that supports the substrate.
The substrate can be fixed to the heater also serving as a support member, and the movement of the target portion of the substrate can be reliably prevented, and the heat of the heater can be efficiently transmitted to the substrate.
(30) The chip mounting machine according to any one of (15) to (29), wherein the substrate holding device includes a clamping device that clamps both side edges of the substrate parallel to the substrate transport direction.
The substrate can be firmly fixed on the substrate holding device.
(31) The substrate holding device provided above the both side edge portions, and the pressing member that presses the both side edge portions from below against the substrate holding member and clamps together with the substrate holding member, The chip mounting machine according to the item (30), including a pressing member lifting device that lifts and lowers the pressing member, wherein at least one of the two substrate pressing members is transparent.
Since the chip is mounted on the upper surface of the substrate, it is desirable that the vertical positioning of the substrate is performed with reference to the upper surface. According to the configuration of this section, this requirement can be satisfied. However, if the substrate presser is made of an opaque material, both edges of the substrate pressed by the substrate presser will not be visible. There are cases where a small substrate portion defect display portion (pattern defect display portion) or the like that displays a defective pattern or the like among the small substrate portions in the substrate is provided at the edge of the substrate, but these are not visible. It ends up. On the other hand, if the substrate holder is made of a transparent material such as glass, the small substrate portion defect display portion and the like can be seen and can be recognized by an optical recognition device such as an imaging device.
(32) Any of the items (15) to (31), wherein the chip holding device is provided so as not to move in at least an X direction parallel to the substrate transport direction and a Y direction perpendicular to the X direction and horizontal. The chip mounting machine described in Crab.
If the chip holding device is not moved in both the X and Y directions, the chip mounting machine can be made compact as much as no movement space is required.
(33) The chip holding device is
A plurality of types of holding members each having a holding part having a different size, the center of the holding part being closer to the substrate holding device side as the holding part is smaller,
The chip mounting machine according to item (32), including a holding member holding device capable of selectively attaching the plurality of types of holding members.
It is also possible to configure a plurality of types of holding members having different holding part sizes so that the centers of the holding parts coincide with each other. However, as described in this section, the smaller the holding unit, the more the chip held by the small holding unit is placed on the substrate held by the substrate holding device if the center of the holding unit is positioned on the substrate holding device side. The distance for carrying is short, and the efficiency of the mounting work can be increased. Further, when the chip holding device is disposed on the back side of the substrate holding device, even a small holding portion is close to the front side (front surface) of the chip mounting machine, and access from the front side is facilitated.
(34) The holding portion of the holding member is a cylindrical portion, and the plurality of types of cylindrical portions of the plurality of types of holding members are positioned on a horizontal straight line with their centers orthogonal to the substrate transport direction, and The chip mounting machine according to (33), wherein the center of each of the cylindrical portions is positioned closer to the substrate holding device on the straight line as the diameter of the circle is smaller.
Ideally, the center of the multiple types of cylindrical parts should be located on a horizontal straight line that is orthogonal to the substrate transport direction, but it may deviate from the straight line due to surrounding circumstances, etc. , “Located on a horizontal straight line orthogonal to the substrate transport direction”.
In addition, it is ideal that the plurality of types of cylindrical portions have their substrate holding device side ends positioned on the same point on the straight line, but they are not positioned on the same point due to manufacturing reasons. In some cases. Such a case should also be interpreted as being included when located on the same point.
Since a chip is often manufactured by cutting a circular wafer into a large number, it is reasonable to make the holding portion cylindrical. And when a holding | maintenance part is cylindrical, the said effect described in relation to the (33) term can be enjoyed by setting a holding member as the structure as described in this term.
(35) The coating head is
A needle for applying an adhesive;
An adhesive container containing the adhesive and connected to the needle by a connection passage;
An adhesive pump for discharging the adhesive in the adhesive container from the needle;
A chip mounting machine as set forth in (17), including a needle, an adhesive container, and an application head main body holding an adhesive pump, wherein the application head main body is moved by the application head moving device.
Conventionally, the adhesive container is provided at a fixed position, and the fixed adhesive container and the moving needle are connected by a relatively long flexible hose. The adhesive in the long flexible hose was wasted. If the configuration of this section is adopted, the connection passage can be shortened, so that waste can be reduced.
(36) The chip mounting machine according to (35), further including a connection tube for connecting the adhesive container and the adhesive pump, wherein the needle is attached to the adhesive pump.
(37) The chip mounting apparatus is
A suction nozzle that sucks and holds the bare chip under negative pressure;
(15) to (15) a load control device with a built-in position detector that can control both the position of the suction nozzle in the axial direction of the suction nozzle and the contact load of the suction nozzle with respect to the bare chip. The chip mounting machine according to any one of (36).
An air actuator which is a kind of load control device with a built-in position detector is commercially available. For example, if this air actuator is used to approach the chip held by the suction nozzle chip holding device, or to the chip substrate held by the suction nozzle or the chip mounted earlier, chip breakage will be avoided. It can be avoided well.
(38) The chip holding device includes any one of (15) to (37), wherein the chip holding device includes a sheet holding device that holds an outer peripheral portion of a holding sheet to which a plurality of the bare chips are attached and maintains the holding sheet in a tension state. The chip mounting machine described in Crab.
(39) A push-up pin that pushes up the holding sheet from the back surface side and lifts the bare chip from the holding sheet;
A pin driving device for driving the protruding pin;
The chip mounting machine according to (38), including a pin control device that controls the pin driving device to steplessly control the height position of the protruding pin.
Conventionally, the pin driving device is supposed to move the protruding pin to different height positions in a plurality of stages. However, in the chip mounting machine according to this section, the pin driving device is located at the height position of the protruding pin. Because, for example, the bare chip is pushed up at a very low speed on the push-up pin, and the speed is gradually increased to push up the bare chip from the holding sheet while avoiding damage. Can be. Further, the height position of the protrusion pin can be accurately set to a desired height, and for example, it is possible to satisfactorily prevent the tip from being pinched by an excessive force between the protrusion pin and the suction nozzle and being damaged. Can do.
The stepless control may be performed linearly or may be performed curvedly.
(40) The chip mounting apparatus is
A mounting head for holding and mounting the bare chip;
A mounting head moving device that moves the mounting head in at least an X direction parallel to the substrate transport direction and a Y direction that is perpendicular to the X direction and horizontal, and the chip mounting machine includes:
A movable imaging device that images the bare chip that is moved together with the mounting head by the mounting head moving device and is held by the chip holding device;
A first correction unit for correcting the position of the mounting head when receiving a bare chip from the chip holding device based on an imaging result by the movable imaging device;
A fixed imaging device that images the bare chip held stationary and held by the mounting head;
(15) thru | or (39) including the 2nd correction | amendment part which correct | amends the position of the said mounting head at the time of mounting a bare chip on the board | substrate currently hold | maintained at the said board | substrate holding apparatus based on the imaging result of the fixed imaging device The chip mounting machine according to any one of the items.
(41) A state in which the movable imaging device and the first correction unit, a first state in which both the fixed imaging device and the second correction unit are operated, and a second state in which only one of them is operated are switched. The chip mounting machine according to (40), including a switching unit.
If the chip on the chip holding device is imaged, the position of the suction nozzle is corrected based on the imaging result, and then the chip is sucked, the center of the chip can be held. If the chip is mounted on the substrate or the previously mounted chip in this state, the chip can be mounted at an accurate position. Further, the suction nozzle can apply a uniform pressing force to the entire chip, and the thickness of the adhesive and paste can be made uniform.
However, even if the tip is held on the suction nozzle as described above, a slight misalignment may remain. Therefore, if a chip is mounted after the chip held by the suction nozzle is imaged and the position of the suction nozzle is corrected based on the imaging result, the mounting position accuracy can be further improved.
It is also possible to omit the imaging of the chip on the chip holding device and perform only the imaging of the chip held by the suction nozzle, and the chip mounting position accuracy can be improved. However, in this case, there is a possibility that the suction nozzle is sucking a portion off the center of the chip.
Therefore, it is desirable to perform both imaging before and after holding when accuracy is important and to omit either imaging when importance is attached to tact. Note that when one is omitted, it is often desirable to omit imaging of the held chip.
The above items (21), (22), (24), (26), (30), (32), (35), (37), (38) and (40) Each feature described in each of the items) can be employed independently of each feature described in each of the items (9) to (20). The terms subordinate to these independently adoptable terms can also be independently adopted. Further, when these features are employed independently, for example, they can be employed in the chip mounting machine described in (15).

  Hereinafter, embodiments of the claimable invention will be described in detail with reference to the drawings. In addition to the following examples, the claimable invention can be practiced in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

  In this embodiment, as schematically shown in FIG. 1, a plurality of, for example, three chip mounting machines 10, 12, and 14 are arranged in a row adjacent to each other. In this embodiment, the configurations of the chip mounting machines 10, 12, and 14 are the same, and the mounting machine 10 will be described as a representative.

  In the chip mounting machine 10, as shown in FIG. 2, a semiconductor chip 22 (hereinafter abbreviated as “chip 22”) is mounted on a substrate 20. In this embodiment, as shown in FIG. 3, the chip 22 is a kind of bare chip formed by forming a plurality of identical electronic circuits on the wafer 24 and then cutting each electronic circuit. The wafer 24 has a circular shape, is attached to a flexible sheet, for example, an adhesive sheet 26 made of synthetic resin, is diced and divided into a large number of chips 22. The pressure-sensitive adhesive sheet 26 is a holding sheet, and the outer peripheral edge thereof is held by a holding frame 28 as a holding member. The chip 22 attached to the adhesive sheet 26 and held by the holding frame 28 is referred to as a chip assembly 30.

  In this embodiment, the substrate 20 has a rectangular shape. As shown in FIG. 2, the substrate 20 has a structure in which a plurality of package substrates 34 having the same wiring pattern 32 are arranged in a matrix. A plurality of package substrates 34 are arranged at equal intervals in the width direction and the longitudinal direction of the substrate 20. The substrate 20 is an aggregate of a plurality of package substrates 34, and the chip 22 is mounted on each of the plurality of package substrates 34 to manufacture a substrate with chips. The package substrate 34 is also referred to as an interposal. After the chip 22 is mounted, the chip 22 and the package substrate 34 are connected by a wire, the chip 22 and a resin such as a wire are encapsulated in a package, and the like. To obtain a packaged electronic circuit component. The package substrate 34 constitutes a part of the package electronic circuit component. The substrate 20 is a multi-piece substrate on which a large number of electronic circuit components can be formed. Moreover, this board | substrate 20 is a board | substrate for electronic circuit component manufacture with a lead.

  As shown in FIG. 2, a plurality of reference marks 36 are provided for each of the large number of package substrates 34, two in the present embodiment, and two are provided on the diagonal lines. In addition, after the substrate 20 is manufactured, each of the plurality of package substrates 34 is inspected, and a defective package substrate 34 has a package substrate defect display mark 37 (hereinafter referred to as a defect display mark 37) as a small substrate portion defect display portion. Is attached). In the substrate 20, as indicated by a two-dot chain line in FIG. 2, a plurality of defective display mark attaching portions 38 are set in one row along one side edge portion parallel to the longitudinal direction. The defective display mark attaching portion 38 is provided for each of the plurality of package substrates 34, and is a substrate defective display mark attaching portion. If the package substrate 34 is defective as a result of the inspection, the package substrate 34 is provided. The defect display mark 37 is attached to the portion 38 with the defect display mark provided for. The defect display mark 37 is provided in a manner that can be recognized by imaging by an imaging device described later.

  In this chip mounting machine, in addition to the substrate 20 shown in FIG. 2, although not shown, for example, semiconductor chips are mounted on a plurality of package substrates of a substrate for manufacturing a ball grid array. Similarly to the substrate 20, the ball grid array manufacturing substrate is also provided with defective display mark-attached portions in one row.

  In this embodiment, as shown schematically in FIG. 4, the chip mounting machine 10 includes a substrate transfer device 40, a substrate holding device 42, an adhesive application device 44, a chip holding device 46, a chip mounting device 48, and a substrate support heating. The apparatus 50 (refer FIG. 12), the chip | tip raising apparatus 52 (refer FIG. 22), and the control apparatus 54 (refer FIG. 27) which control these apparatuses 40 grade | etc., Are provided. These devices 40 to 54 are provided on a base 56 constituting a part of the main body of the mounting machine. Each device will be described below.

The substrate transfer device 40 and the substrate holding device 42 will be described.
As shown in FIG. 4, the substrate transfer device 40 carries the unmounted substrate 20 on which the chip 22 is not mounted from the substrate supply device 60 to the work area, and loads the mounted substrate 20 on which the chip 22 has been mounted. Unload from the work area and store in the substrate storage device 62. The substrate supply device 60, the work area, and the substrate storage device 62 are provided in parallel and in series in the width direction or the frontage direction of the chip mounting machine. In this embodiment, the substrate conveyance direction by the substrate conveyance device 40 is parallel to the width direction of the chip mounting machine, and the substrate 20 is conveyed in a posture in which the longitudinal direction is parallel to the substrate conveyance direction. The direction parallel to the substrate transport direction is defined as the X direction, and the direction perpendicular to the X direction and horizontal is defined as the Y direction. The Y direction is the width direction of the substrate 20 and the depth direction of the chip mounting machine. Hereinafter, when describing directions, appropriate terms are used among terms defining directions, such as a substrate transport direction, a substrate width direction, an X direction, and a Y direction, depending on the case.

  The substrate supply device 60 includes a substrate supply cartridge 66 (see FIG. 11) as a substrate supply member and a substrate supply cartridge lifting device 68 (see FIG. 27). In this embodiment, a chip mounting machine is used together with the substrate transfer device 40 and the like. It is composed. The cartridge main body 70 of the substrate supply cartridge 66 has a box shape, and as shown in FIGS. 6 and 7, a plurality of pairs of rails 72 are provided in a state of being arranged at equal intervals in the vertical direction. Thereby, the substrate supply cartridge 66 is provided with a plurality of shelves 74 at equal intervals in the vertical direction, and the substrates 20 are accommodated in multiple stages. The board | substrate 20 is mounted on the rail 72 in the both-sides edge parallel to the longitudinal direction, and is supported from the downward direction by the support surface 76 (refer FIG. 7 and FIG. 11) which the rail 72 faces upward. Further, a movement limit in the width direction is defined by a pair of vertical defining surfaces 78 (see FIG. 7) that are configured by the inner surface of the cartridge body 70 and are perpendicular to the support surfaces 76 of the pair of rails 72. In this embodiment, as shown in FIG. 7, the distance L1 between the pair of defining surfaces 78 is larger than the width W of the substrate 20 by the distance α, and the pair of defining surfaces 78 are both sides of the accommodated substrate 20. Corresponding to the surface 80, a slight gap is provided between them. The substrate supply cartridge 66 is arranged so that the rail 72 is parallel to the substrate transport direction and the substrate 20 is supplied in a posture in which the longitudinal direction is parallel to the substrate transport direction. In this embodiment, the substrate supply cartridge elevating device 68 uses a servo motor, which is a kind of electric motor, as a drive source, elevates the substrate supply cartridge 66, and sequentially moves the plurality of substrates 20 supported by the rails 72 in the vertical direction in advance. Position at the set board supply position. In FIG. 7, the gap between the defining surface including the pair of defining surfaces 78 and the side surface 80 of the substrate 20 is exaggerated for easy understanding.

  Similarly, the substrate storage device 62 includes a substrate storage cartridge 84 as a substrate storage member and a substrate storage cartridge lifting device 86 (see FIG. 27). As shown in FIG. 7 and FIG. 11, a plurality of pairs of rails 90 are arranged in a box shape of the substrate storage cartridge 84 in a state of being arranged at equal intervals in the vertical direction. The substrates 20 are accommodated in a plurality of shelves 92 in multiple stages. The substrate 20 is supported by rails 90 at both side edges parallel to the longitudinal direction, and is supported from below by a support surface 94. Further, the movement limit of the substrate 20 in the width direction is defined by a defining surface 96 perpendicular to the support surface 94.

  The distance L2 between the pair of defining surfaces 96 is equal to the distance L1 between the pair of defining surfaces 78 of the substrate supply cartridge 66, as shown in FIG. It faces 80 with a slight gap. The substrate storage cartridge 84 is disposed so as to store the substrate 20 in a posture in which the longitudinal direction thereof is parallel to the substrate transport direction, and is lifted and lowered by a substrate storage cartridge lifting device 86 using a servo motor as a drive source. Each support surface 84 of the rail 90 is sequentially positioned at a substrate storage position set in advance in the vertical direction.

  The substrate holding device 42 is provided in the work area. As shown in FIGS. 5 and 6, the substrate holding device 42 includes a substrate clamping device 100. The substrate clamp device 100 includes a pair of clamp units 102 and 104 and a pressing member lifting device 106 common to the units 102 and 104. The clamp units 102 and 104 are provided on support members 108 and 110 fixed to the base 56, respectively, and are provided at a distance in the substrate width direction. The support members 108 and 110 have a wall shape and are provided in parallel to the substrate transport direction. One clamp unit 102 is a fixed clamp unit provided fixed to the support member 108, and the other clamp unit 104 is a movable clamp unit provided to the support member 110 so as to be able to approach and separate from the clamp unit 102. The distance between the clamp units 102 and 104 is adjusted according to the width of the substrate 20.

  As shown in FIG. 5, the fixed clamp unit 102 includes a substrate pressing member 120 and a substrate pressing member 122. The substrate pressing member 120 is formed in a colorless and transparent longitudinal plate shape, and is made of glass in the present embodiment. A movable holding member 128 provided so as to be able to approach and separate from the member 126 is sandwiched and held from both upper and lower sides. The fixed holding member 126 includes a plate-like holding unit 130 that is long in a direction parallel to the substrate transport direction, and is protruded from the support member 108 to the movable clamp unit 104 side.

  The movable holding member 128 has a longitudinal plate shape, and as shown in FIG. 6, the movable holding member 128 can be rotated to the support member 108 by the bracket 132 at a plurality of locations separated in the longitudinal direction, in this embodiment, at two locations. Is attached. These brackets 132 are generally L-shaped, and are attached to the support member 108 so as to be rotatable about an axis parallel to the substrate transport direction. A movable holding member 128 is fixed to one arm portion 136 and fixedly held. The substrate pressing member 120 is sandwiched between the holding portion 130 and the holding portion 130 which is disposed below the holding portion 130 of the member 126. An engaging member 140 provided on the support member 108 is engaged with the other arm portion 138 of the bracket 132 to keep the substrate pressing member 120 sandwiched between the holding portion 130. The substrate pressing member 120 is held by the holding members 126 and 128 in a posture in which the longitudinal direction is parallel to the substrate transport direction, and the edge on the movable clamp unit 104 side is on the substrate pressing member 122 from the holding members 126 and 128. The lower surface of the surface facing the substrate pressing member 122 constitutes a reference surface 144 that positions the substrate 20 at a preset position in the vertical direction. In addition, the vertical side surface of the movable holding member 128 that is parallel to the substrate transport direction faces the side surface 80 of the substrate 20 and constitutes a defining surface 146 that defines the movement limit of the substrate 20 in the width direction.

  The engaging member 140 is rotatably attached to the support member 108, and the engaging member 140 is rotated and engaged with and separated from the bracket 132 by manually operating the lever 142. In a state where the engaging member 140 is separated from the bracket 132 as shown by a two-dot chain line in FIG. 5, the operator can rotate the bracket 132, and the movable holding member 128 is moved from the fixed holding member 126. The substrate pressing member 120 can be detached by rotating in the direction of separation to release the holding of the substrate pressing member 120. Therefore, for example, when the substrate pressing member 120 is damaged, it can be replaced or maintenance such as cleaning can be easily performed. Although not shown in FIG. 6, the fixed holding member 126 is provided with a notch, and is fixed to the support member 108 while avoiding interference with the bracket 132 and the movable holding member 128.

  The substrate pressing member 122 is held by a connecting member 150 as a pair of lifting members supported by a pair of support members 108 and 110 so as to be lifted and lowered, and is disposed below the substrate pressing member 120. 5 and 6, the connecting members 150 have a long plate shape, and as shown in FIG. 6, at both ends of the supporting members 108 and 110 separated in the substrate transport direction, It is arranged parallel to the width direction, and both end portions in the longitudinal direction of the connecting member 150 can be moved up and down on the guide rods 152 provided on the support members 108 and 110 at the leg portions protruding downward. Is fitted. Both ends of the holding member 156 having a long plate shape are fixed to the end portions of the pair of connecting members 150 on the support member 108 side, and the substrate pressing member 122 is fixed to the substrate by the holding member 156. It is held so as to be relatively movable in the vertical direction in a posture parallel to the transport direction. The guide rod 152 is an example of a guide member, and constitutes a guide device together with a guide sleeve as a guide member to which the guide rod is fitted. The same applies to the guide rods of other devices described later in the chip mounting machine. Moreover, also when a guide rail and a guide block are used as a guide member, they comprise a guide apparatus.

  As shown in FIG. 5, the substrate pressing member 122 is formed by a compression coil spring 160 as an elastic member which is a kind of urging means disposed between the connecting member 150 and the L-shaped cross section. It is biased in a direction approaching the substrate pressing member 120. The substrate pressing member 122 is moved up and down with respect to the holding member 156 by a plurality of pins 162 (see FIG. 6) that project from the holding member 156 in a posture parallel to the substrate width direction to form an engaging portion and the substrate pressing member 122. Guided by fitting with a plurality of long holes (not shown) that are provided in the vertical direction, and the upper limit of movement of the substrate pressing member 122 by the bias of the spring 160 is such that the lower end surface of the long hole is at the pin 162. Is defined by engaging The upper surface of the substrate pressing member 122 is long in the substrate transport direction, opposes the reference surface 144 below the reference surface 144 of the substrate pressing member 120, and presses the substrate 20 against the substrate pressing member 120 or the substrate 20 during substrate transport. A support surface 166 that supports one side edge parallel to the substrate transport direction from below is configured. The substrate pressing member 122 is also a substrate support rail, and the substrate pressing member 120 is provided above the side edge portion of the substrate 20 supported by the substrate pressing member 122 from below.

  The movable clamp unit 104 includes a substrate pressing member 170 and a substrate pressing member 172 as shown in FIG. The substrate pressing member 170 is detachably fixed to the support member 110 by an appropriate fixing device such as a bolt, has a long plate shape, and extends horizontally from the support member 110 to the fixed clamp unit 102 side. The holding portion 174 is provided. The lower surface of the pressing portion 174 is positioned in the same horizontal plane as the reference surface 144 of the substrate pressing member 122 to constitute a reference surface 176. Further, the side surface of the substrate pressing member 170 that is vertical and parallel to the substrate transport direction is opposed to the side surface 80 of the substrate 20 and constitutes a defining surface 178 that defines the movement limit of the substrate 20 in the width direction.

  The substrate pressing member 172 is held by the pair of connecting members 150 so as to be movable in the substrate width direction at both ends in the longitudinal direction, and is disposed below the pressing portion 174 of the substrate pressing member 170. . As shown in FIG. 6, each of these connecting members 150 is formed with a long hole 180 extending in the substrate width direction and penetrating the connecting member 150 in the thickness direction, and the holding member 182 passes through the long hole 180. The bolt 186 that is screwed to the contact plate 184 is fixed to the connecting member 150 at an arbitrary position.

  The holding member 182 has a longitudinal shape, the substrate pressing member 172 is held so as to be relatively movable in the vertical direction, and is compressed between the contact plate 184 through the long hole 180 of the connecting member 150. The coil spring 190 is biased in a direction approaching the substrate pressing member 170. The movement limit of the substrate pressing member 172 due to the urging of the spring 190 is defined by fitting a plurality of pins 192 (see FIG. 6) and elongated holes (not shown) in the same manner as the substrate pressing member 122. . The upper surface of the substrate pressing member 172 that faces the substrate pressing member 170 from below is long in the substrate transport direction, and is parallel to the pressing surface that presses the substrate 20 against the substrate pressing member 170 or the substrate transport direction of the substrate 20. A support surface 196 is provided to support the other side edge from below. The substrate pressing member 172 is also a substrate support rail like the substrate pressing member 122, and the support surface 196 is positioned in the same horizontal plane as the support surface 166.

  The substrate pressing member 172 is moved with respect to the connecting member 150 together with the holding member 182 so as to approach and separate from the substrate pressing member 122 of the fixed clamp unit 102, thereby adjusting the substrate clamp width to a size corresponding to the width of the substrate 20. Is done. At this time, the substrate pressing member 170 is replaced with a member corresponding to the width of the substrate 20, and as shown in FIG. 7, the distance L3 between the defining surfaces 146 and 178 is set to a size obtained by adding the distance β to the substrate width W. Thus, the reference surface 176 is opposed to the support surface 196, and the pressing portion 174 of the substrate pressing member 170 is sandwiched between the substrate pressing member 172 and the substrate 20. The distance β is larger than the distance α that defines a gap between the pair of defining surfaces 78 of the substrate supply cartridge 66 with respect to the substrate 20, and the distance L3 is one pair of the substrate supply cartridge 66 and the substrate storage cartridge 84. The distances L1 and L2 between the prescribed surfaces 78 and 96 are larger than the distances L1 and L2.

  The position of the substrate 20 in the width direction is defined by the substrate width direction position defining device 200. The substrate width direction position defining device 200 is provided on the defining surface 178 side. In this embodiment, as shown in FIG. 6, a plurality of the substrate width direction position defining devices 200 provided on the holding member 182 and spaced apart in the substrate transport direction. In the example, two movable defining members 202 and two air cylinders 204 serving as defining member driving devices for moving the movable defining members 202 in directions toward and away from the defining surface 146 are included. The movable defining member 202 has a vertical defining surface 206. The air cylinder 204 is a single-acting air cylinder in this embodiment, and when the air is not supplied, the movable defining member 202 is urged by a spring and the defining surface 206 is in the same plane as the defining surface 178 of the substrate pressing member 170. When the air is supplied, the movable defining member 202 is advanced, and the movable defining surface 206 is moved to the advanced position protruding toward the defining surface 146 of the substrate pressing member 120 of the fixed clamp unit 102. Let As shown in FIG. 7, the advance position is a position where the distance L4 between the movable defining surface 206 and the fixed defining surface 146 is a size obtained by adding the distance γ to the substrate width W. The distance γ is smaller than the distance α, and the distance L4 is smaller than the distances L2 and L3.

  As shown in FIG. 7, the substrate supply cartridge 66 has a pair of defining surfaces 78 positioned inside the pair of defining surfaces 146 and 178 of the substrate holding device 42, and the substrate supply cartridge 66 is defined by the defining surface 146. , 178 is provided at a position opening. On the other hand, the substrate storage cartridge 84 is provided such that the pair of defining surfaces 96 are located outside the defining surface 146 and the movable defining surface 206 of the substrate holding device 42. The substrate storage cartridge 84 is provided at a position offset in the substrate width direction with respect to the substrate holding device 42 by a minute distance toward the defining surface 146 side opposite to the side on which the movable defining member 202 is provided. In the portion where the movement limit in the width direction of the substrate 20 is defined by the defining surface 146 and the movable defining surface 206, the distance L4 between the defining surface 146 and the movable defining surface 206 is a distance L2 between the pair of defining surfaces 96. It is smaller and is opened at a portion between the pair of defining surfaces 96 of the distance substrate storage cartridge 84.

  In this embodiment, the pressing member elevating device 106 is driven by an air cylinder 220 (see FIG. 5), which is a fluid pressure cylinder, which is a kind of fluid pressure actuator, and the support members 108 and 110 are parallel to the substrate transport direction. It includes driving members 222 (only one driving member 200 is shown in FIG. 5) provided at both ends separated in the direction. The drive member 222 is formed in a plate shape, and is attached to the piston rod 224 of the air cylinder 220 at an intermediate portion in the longitudinal direction while being attached to the support member 108 and 110 so as to be rotatable about an axis parallel to the substrate width direction. It is linked movably. A roller 228 as an engaging member is rotatably attached to each end in the longitudinal direction of the pair of driving members 222 at a position deviated from the rotation axis. Further, one end portions of the pair of drive members 222 are connected by a link 230. Therefore, when the piston rod 224 is expanded and contracted, the pair of driving members 222 are rotated at the same time, and the two rollers 228 of the pair of driving members 222 are moved up and down all at once. The two rollers 228 of the pair of driving members 222 are respectively engaged with both ends in the longitudinal direction of the pair of connecting members 150 from below, and the connecting members 150 are lifted by raising the rollers 228. Then, the substrate pressing members 122 and 172 are simultaneously raised and moved toward the substrate pressing members 120 and 170, and the substrate 20 is pressed against the reference surfaces 144 and 176 to be clamped. If the roller 228 is lowered, the connecting member 150 and the holding members 156 and 182 are lowered following the roller 228 by its own weight, and the substrate pressing members 122 and 172 are lowered.

  In a state where the piston rod 224 is contracted, the connecting member 150 and the like are positioned at the lowered end position, and the substrate pressing members 122 and 172 are positioned at a movement limit position by the bias of the springs 160 and 190. At this position, the substrate pressing members 122 and 172 function as substrate support rails on which the substrate 20 is placed on the support surfaces 166 and 196, and the surface including the support surfaces 166 and 196 is a horizontal substrate transport surface. The lower end positions of the substrate pressing members 122 and 172 by the pressing member lifting / lowering device 106 are substrate release positions where the substrate 20 is not clamped and released, and are substrate support positions or rail function positions. By the extension of the piston rod 224, the substrate pressing members 122 and 172 are raised together with the substrate pressing members 120 and 170 to a clamping position for clamping the substrate 20. The substrate supply position of the substrate supply cartridge 66 is such that the pair of support surfaces 76 that support the substrate 20 to be supplied are in the same horizontal plane as the support surfaces 166 and 196 of the substrate pressing members 122 and 172 positioned at the substrate support position. The substrate storage position of the substrate storage cartridge 84 is such that the pair of support surfaces 94 that support the substrate 20 to be stored are the support surfaces 166 of the substrate pressing members 122 and 172 that are positioned at the substrate support positions. It is a position located in the same horizontal plane as 196. The movable regulation surface 206 of the movable regulation member 202 is clamped by the substrate pressing members 120 and 170 and the substrate pressing members 122 and 172 in the vertical direction even when the substrate 20 is conveyed by the substrate conveyance device 40. However, it has a length facing the side surface of the substrate 20.

The substrate transfer device 40 will be described.
As shown in FIGS. 7 to 11, the substrate transport apparatus 40 includes a guide path 240, a movable frame 242, a substrate carry-in / carry-out head 244 as an action unit, and a substrate carry-in / carry-out head moving device 246. In this embodiment, the guide path 240 includes a main guide path 247, an upstream guide path 248, and a downstream guide path 249, as shown in FIG. The main guide path 247 includes support surfaces 166, 196, defining surfaces 146, 178 of the substrate pressing members 122, 172 of the substrate holding device 42, a movable defining member 202 and an air cylinder 204. The support surfaces 166 and 196 function as a substrate support surface in a state where the substrate pressing members 122 and 172 are positioned at the lowered end position (substrate support position), and constitute a part of the main guide path 247. A part of the substrate holding device 42 also serves as the main guide path 247.

  In the present embodiment, the upstream guide path 248 includes a pair of support surfaces 76 and a pair of defining surfaces 78 of the substrate supply cartridge 66 positioned on the upstream side in the substrate transport direction of the substrate transport device 40 and the substrate holding device 42. including. In a state where the substrate supply cartridge 66 is positioned at the substrate supply position, a pair of support surfaces 76 located in the same plane as the support surfaces 166 and 196 constitute a part of the upstream guide path 248. In the present embodiment, the substrate supply cartridge 66 and the substrate holding device 42 are provided in close proximity in the substrate transfer direction, and the substrate 20 is directly carried out of the substrate supply cartridge 66 by the substrate transfer device 40 and is supplied by the substrate holding device 42. The upstream guide path 248 is formed in the substrate supply cartridge 66.

  In this embodiment, the downstream guide path 249 includes a pair of support surfaces 94 and a pair of defining surfaces 96 of the substrate storage cartridge 84 that are located downstream in the substrate transport direction of the substrate transport device 40 and the substrate holding device 42. including. In a state where the substrate storage cartridge 84 is positioned at the substrate storage position, a pair of support surfaces 94 located in the same plane as the support surfaces 166 and 196 constitute a part of the downstream guide path 249. In the present embodiment, the substrate supply cartridge 84 and the substrate holding device 42 are provided in close proximity in the substrate transport direction, and the substrate 20 is directly stored in the substrate storage cartridge 84 by the substrate transport device 40 and is stored in the substrate storage cartridge 84. A downstream guide path 249 is formed. The distance between the pair of defining surfaces 78 and 96 of the upstream guide path 248 and the downstream guide path 249 is the above-described distances L1 and L2, and the distance L3 between the pair of defining surfaces 146 and 178 of the main guide path 247. Smaller than.

  As shown in FIGS. 8 and 9, the movable frame 242 includes a vertical member 250 extending vertically on one side of the main guide path 247 and a horizontal member 252 extending horizontally from the vertical member 250 in a cantilevered manner. The vertical member 250 has a plate shape and is supported by a guide rail 254 provided on the support member 110 so as to be movable in the substrate transport direction. The substrate carry-in / carry-out head moving device 246 includes an endless belt 256 and a belt rotating device 258. The belt circling device 258 includes a belt circling motor 260 as a driving source and a plurality of pulleys 262. The vertical member 250 is detachably fixed to the belt 256, and the belt 256 is circulated by the belt circling device 258, thereby causing the vertical member to rotate. 250 is moved in a direction parallel to the substrate transport direction, and the substrate carry-in / carry-out head 244 is moved in a region from the substrate supply cartridge 66 to the end of the substrate storage cartridge 84 opposite to the substrate holding device 42 side. . The support member 110 is a support member for the movable clamp unit 104 and also serves as a support member for the movable frame 242, and accordingly, the size of the chip mounting machine in the depth direction can be shortened.

  The horizontal member 252 has a plate shape, is provided on the vertical member 250 so as to be movable up and down, and is moved up and down by a lifting device 274 including an air cylinder 276 (see FIG. 8). The horizontal member 252 is supported by a guide rail 278 (see FIG. 9) provided on the vertical member 250 so as to be movable up and down on the vertical member 250 and extending from the vertical member 250 onto the substrate holding device 42 in a cantilever manner. The elevating device 274 moves up and down to the rising end position and the falling end position.

  The substrate carry-in / carry-out head 244 is detachably mounted on the horizontal member 252 and can be adjusted in position in the substrate width direction, and is moved in a direction parallel to the substrate carrying direction by moving the movable frame 242. As shown in FIGS. 10 and 11, the substrate carry-in / carry-out head 244 includes a head main body 290, gripping claws 292, 294 as a pair of gripping members, and an extrusion member 296. The head main body 290 has a plate shape, the plate surface is provided in parallel with the substrate width direction, and is detachably fixed to the horizontal member 252 by a suitable fixing device such as a bolt 298. These bolts 298 are screwed to the head body 290 through a long hole 300 (see FIG. 8) provided in parallel to the substrate width direction to the horizontal member 252 to fix the head body 290 to the horizontal member 252. By adjusting the fixing position of the bolt 298 in the elongated hole 300, the position of the head main body 290, and thus the substrate loading / unloading head 244 in the substrate width direction is adjusted. This position is adjusted according to the width of the substrate 20, the gripping claws 292 and 294 grip the center portion in the width direction of the substrate 20, and the pushing member 296 presses the center portion in the width direction of the substrate 20. .

  A pair of gripping claws 292 and 294 are provided at the center of the surface of the head main body 290 on the substrate supply device 60 side in a direction parallel to the substrate width direction so as to be opened and closed in the vertical direction, thereby constituting a gripping portion. As shown in FIG. 10, a pair of elevating members 304 and 306 are guided by guide rails 308 and 310 at positions spaced apart in the substrate width direction, as shown in FIG. The holding claws 292 and 294 are detachably fixed to the elevating members 304 and 306, respectively. As shown in FIG. 11, the gripping claws 292 are generally L-shaped, are detachably fixed to the elevating member 304 in an L-shaped vertical arm portion 312, and are positioned at the center in the substrate width direction of the head main body 290. It has been. The other arm portion 314 of the gripping claw 292 is extended horizontally toward the substrate supply device 60 side, and a plurality of engaging members, that is, two pins 316 in this embodiment are vertically arranged at the protruding end portion thereof. It is upward and is erected at a distance in the substrate width direction.

  The gripping claws 294 are also generally L-shaped, and are detachably fixed to the elevating member 306 in the L-shaped vertical arm portion 320 and positioned at the center of the head body 290 in the substrate width direction. As shown in FIG. 11, the other arm portion 322 that extends horizontally toward the substrate supply device 60 side of the gripping claws 294 is positioned above the arm portion 314 of the gripping claws 292, and is pivoted on the pin 316. It is fitted so that it can move relative to the direction. Rubber 324 and 326 as high-friction coefficient members are affixed to the portions where the pins 316 of the arm portions 314 and 322 of the gripping claws 292 and 294 are fitted and opposed to each other. A coefficient layer is provided, and gripping surfaces 328 and 330 having a high friction coefficient are provided.

  Of the two elevating members 304 and 306, one elevating member 306 is raised and lowered by an air cylinder 332 as an elevating drive device. The raising / lowering of the elevating member 306 is vertically inverted by a reversing device 334 as a motion transmitting device provided in the head body 290 and transmitted to the elevating member 304. The reversing device 334 protrudes from the shaft 336 of the link 338 and protrudes from a link 338 and lift members 304 and 306 provided on the head main body 290 so as to be rotatable about an axis parallel to the substrate transport direction by the shaft 336. It includes pins 340 and 342 that are engaged with both ends extended in the direction so as to be relatively rotatable and constitute engaging portions. When the elevating member 306 is lowered, the elevating member 304 is raised, the gripping surfaces 328 and 330 of the pair of gripping claws 292 and 294 are brought close to each other, the substrate 20 is gripped, and the lifting member 306 is raised. When the lifting member 304 is lowered, the gripping surfaces 328 and 330 are separated from each other to release the substrate 20.

  The pushing member 296 is attached to the surface of the head main body 290 on the substrate storage device 62 side so as to be rotatable about an axis parallel to the substrate width direction, and constitutes a pushing portion. As shown in FIG. 11, the push-out member 296 is generally L-shaped as shown in FIG. 11, and is fixed to the central portion in the longitudinal direction of the shaft 350 that is rotatably supported by the head body 290. It is located in the center part of the direction parallel to the substrate width direction. The push member 296 has an abutment surface 352 that protrudes forward (on the substrate storage device 62 side) from the shaft 350. The pair of gripping claws 292 and 294 and the pushing member 296 are provided back to back in the substrate transport direction. In FIG. 11, the relationship between the substrate 20 supplied by the substrate supply cartridge 66 and the gripping claws 292 and 294 that hold the substrate 20 and the pushing member 296, and the pushing member 296 are pushed and stored in the substrate storage cartridge 84. In order to show the relationship with the substrate 20, for convenience, the substrate supply cartridge 66 and the substrate storage cartridge 84 are shown together with the gripping claws 292 and 294 and the pushing member 296.

  Further, as shown by a two-dot chain line in FIG. 11, the shaft 350 is fixed to one end portion in the axial direction so that the locking member 356 extends upward, and between the extended end portion and the head main body 290. The shaft 350 is urged by a tension coil spring 358 as an elastic member which is a kind of urging means disposed in the direction, and the pushing member 296 is a direction in which the abutting surface 352 protrudes in the pushing direction, that is, the substrate storage device 62 side. Is being energized.

  A detected member 366 is fixed to the other end portion of the shaft 350 in a direction extending from above the shaft 350 and is detected by an excessive resistance sensor 368 provided in the head main body 290. The excessive resistance sensor 368 is configured by, for example, a photoelectric sensor that is a kind of non-contact type detection device. In any case, the pushing member 296, the locking member 356, and the detected member 366 fixed to the shaft 350 are integrally rotated, and the pushing member 296 is in a state where the turning of the shaft 350 by the bias of the spring 358 is defined. Located in the push-out position, the contact surface 352 is vertical, and the detected member 266 is located at the detection position detected by the excessive resistance sensor 368. In this state, the pair of gripping claws 292 and 294 and the pushing member 296 provided back to back with each other have a distance between the tip of the gripping claws 292 and 294 and the contact surface 352 of 39 mm in this embodiment. ing. If the shaft 350 is rotated against the urging force of the spring 358 from the state where the pushing member 296 is located at the pushing position in this way, the detected member 366 moves away from the excessive resistance sensor 368 and moves to the non-detecting position. Then, the detection signal of the excessive resistance sensor 368 changes, and it is detected that the pushing member 296 is out of the pushing position. Note that the movement limit of the pushing member 296 due to the urging of the spring 358 is limited to the pin member 370 (see FIGS. 10 and 11) as a stopper or pushing position defining member provided in the head body 290, and the shaft of the detected member 366. It is defined by the extension part from 350 abutting.

The substrate support heating device 50 will be described with reference to FIGS.
In this embodiment, the substrate support heating device 50 is provided in the work area as shown in FIG. 5, and includes a support member combined heater 400 and a heater moving device 402 as shown in FIG. As shown in FIGS. 5 and 12, the heater moving device 402 includes a moving member 406 provided on the support member 110 so as to be movable in the X direction, and a moving member moving device 408 for moving the moving member 406. As shown in FIG. 5, the moving member moving device 408 includes a rotating belt 410 and a belt rotating device 412, and the moving member 406 is detachably fixed to the rotating belt 410. The belt circling device 412 includes a belt circling motor 414 and a plurality of pulleys 416 (only one is shown in FIG. 5). When the circling belt 410 is circulated by the belt circling device 412, the moving member 406 is guided. Guided by the rail 418 (see FIG. 12) and moved in the X direction (direction perpendicular to the paper surface in FIGS. 5 and 12), the support member combined heater 400 provided on the moving member 406 moves in the substrate transport direction. It can be moved to any position in the parallel direction.

  As shown in FIG. 12, the support member combined heater 400 is provided on the moving member 406 together with the heater elevating device 424, and is moved up and down on the moving member 406. The heater lifting device 424 includes a first lifting device 426 and a second lifting device 428 in this embodiment. The first elevating device 426 includes an elevating member 434 and an elevating member elevating device 436 that are guided by the guide rail 430 and provided on the moving member 406 so as to be elevable. The elevating member elevating device 436 is provided on the moving member 406 on the driving member 442 provided by the guide rail 438 so as to be movable in the Y direction, on the cam 444 provided on the driving member 442, and on the moving member 460. An air cylinder 446 that is provided in the Y direction and moves the drive member 442 and a roller 448 that is a cam follower provided on the elevating member 434 are included. In this embodiment, the cam 444 has a groove shape and includes an inclined portion that is inclined in the vertical plane. The roller 448 is rotatably fitted, and the drive member 442 is moved by the air cylinder 446. As a result, the cam 444 and the roller 448 are relatively moved in the Y direction, and the elevating member 434 is raised and lowered.

  The second lifting device 428 includes a damper cylinder 450 provided on the lifting member 434. The damper cylinder 450 is an air cylinder having a small thrust, and a support member combined heater 400 is held by a piston rod 452 of the damper cylinder 450 via a swing device 456. The use of the damper cylinder 450 will be described later. The swinging device 456 includes a first swinging member 460 attached to an upper end portion of the piston rod 452 so as to be rotatable about an axis parallel to the X direction by a shaft 458, a shaft 462 on the first swinging member 460, and the like. And a second oscillating member 464 that is rotatably mounted about an axis parallel to the Y direction (the direction perpendicular to the paper surface in FIG. 12), and is a heat insulating member fixed on the second oscillating member 464. The support member combined heater 400 is attached via the ceramic body 466 and the heat transfer reducing member 468 as the above.

  In this embodiment, the supporting member combined heater 400 includes a heating body 470, a heating member 472, and a substrate supporting member 474, as shown in FIGS. The first and second swinging members 460 and 464, the ceramic body 466, the heat transfer reducing member 468, the heating body 470, and the substrate support member 474 all have a long shape in the Y direction, and the substrate width of the substrate 20 It has a width that is slightly larger than the width of one row of package substrates 34 aligned in the direction (dimension in the direction parallel to the substrate transport direction). The heating body 470 is fixed to the heat transfer reducing member 468, and a heat generating member 472 is embedded in the inside thereof in parallel to the Y direction to warm the heating body 470. The substrate support member 474 is detachably fixed to the heating body 470. The substrate support member 474 includes a substrate support surface 476 and is heated by heat conduction from the heating body 470. An air suction passage 478 (see FIG. 14) is provided in the substrate support member 474 so as to open to the support surface 476, and a vacuum pump or the like via a passage 480 (see FIG. 12) provided in the heating body 470 or the like. The negative pressure source 482 is connected. The air suction passage 478 is opened at a portion corresponding to a portion where the substance of the substrate 20 is present (for example, a portion on which the chip 22 is mounted), and the substrate support member 474 is held by the substrate holding device 42. Then, a part of the stationary substrate 20, and one row of the package substrates 34 arranged in the substrate width direction is adsorbed and supported from below by supplying negative pressure, and is heated. In this embodiment, the substrate heating device and the substrate support device are integrally provided. Although both devices may be provided separately, the chip mounting machine can be made compact by providing them integrally.

  When the adhesive is applied and the chip is mounted without heating the substrate, a substrate support member having a larger number of air suction passages 478 than the case where the substrate is heated is attached to the heating body 470 and the substrate is mounted. For example, the substrate support member is provided with three rows of air suction passages 478. Depending on whether or not the substrate is heated, the substrate support member is replaced by the change of the setup. The substrate support member 474 is for heating the substrate. When the substrate is not heated, the heat generating member 472 cannot generate heat.

  A plurality of air passages 484 are formed in the heat transfer reducing member 468 to reduce heat transfer to the ceramic body 466. Thereby, the heat of the heating body 470 is prevented from being transmitted to the lifting member 434 side, and the substrate support member 474 is efficiently heated. A plurality of air passages 486 are formed in the second swing member 464, and air is supplied from the air supply device 488 to cool the second swing member 464, whereby the second swing member 464 is cooled. Unnecessary heating of members that do not require heating, such as the member 464, is prevented. The second swing member 464 constitutes a cooling device together with the air supply device 488.

  The heat transfer reduction member 468 is provided with a positioning device 494 that defines the substrate support position, which is the rising end position of the substrate support member 474. The positioning device 494 includes a plurality of positioning members 496 in the present embodiment. Two of these positioning members 496 are fixed positioning members, and the other two are movable positioning members 496 provided to be movable in the substrate width direction. Two fixed positioning members 496 and two movable positioning members 496 are provided at positions separated from each other in the substrate width direction, and are provided on both sides in a direction parallel to the substrate transport direction of the support member combined heater 400, respectively. Positions where the substrate pressing members 122 and 172 of the substrate holding device 42 come into contact with the substrate pressing member 122 and 172 from below to define the rising end position of the supporting member / heater 400, and the substrate supporting surface 474 contacts and supports the substrate 20 from below and heats it. Is positioned. The two movable positioning members 496 are guided by a pair of guide members 500 fixed to the heat transfer reducing member 468 and are movable in the substrate width direction, and are fixed to the heat transfer reducing member 468 by a bolt 502 as a fixing device. Is done. The movable positioning member 496 is moved to a position corresponding to the width of the substrate 20, and is positioned at a position where the movable positioning member 496 contacts the substrate pressing member 172 of the movable clamp unit 104.

The adhesive application device 44 will be described.
As shown schematically in FIG. 4, the adhesive application device 44 is located adjacent to the substrate transfer device 40 in a direction perpendicular to the substrate transfer direction, and in this embodiment, the front side of the chip mounting machine. Or it is provided on the near side. As shown in FIGS. 15 and 16, the adhesive application device 44 includes an application head 520 for applying an adhesive and an application head moving device 522 for moving the application head 520. The coating head moving device 522 moves the coating head 520 in the X direction (direction perpendicular to the paper surface in FIG. 16), the X direction moving device 524, and the Y direction moving device that moves in the Y direction (left and right direction in FIG. 16). 526 and a lifting device 528 for moving up and down.

  The X direction moving device 524 includes an X slide 530 and an X slide moving device 532 as moving members. As shown in FIG. 15, the X slide moving device 532 includes an X moving motor 534 as a drive source, a ball screw 536 that is a kind of screw shaft, and a nut 538, and the ball screw 536 is rotated by the X moving motor 534. Thus, the X slide 530 is guided by the pair of guide rails 540 and is moved to an arbitrary position in the X direction. Similarly, the Y-direction moving device 526 includes a Y slide 548 and a Y slide moving device 550. The Y slide moving device 550 includes a Y moving motor 552 as a driving source, a ball screw 554, and a nut 556. The Y slide 548 is guided to an arbitrary position in the Y direction on the X slide 530 while being guided by a pair of guide rails 558. Moved.

  As shown in FIG. 16, the X slide 530 is provided on the front side of the chip mounting machine in the Y direction from the substrate holding device 42, the Y slide 548 is long in the Y direction, and the Y slide 548 is closer to the substrate holding device 42 side. The coating head 520 mounted on the end is retracted onto the X slide 530 by the movement of the Y slide 548, retracted from the substrate holding device 42, and protrudes onto the substrate holding device 42. It is moved to a work position where the adhesive is applied to the held package substrate 34. The coating head 520 is also moved to an arbitrary position in the X direction by the movement of the X slide 530.

  In this embodiment, the application head 520 includes a needle 570, an adhesive container 572, an adhesive pump 574, and an application head main body 576 that holds them as shown in FIG. The coating head main body 576 is provided at the end of the Y slide 548 on the side of the substrate holding device 42 so as to be guided up and down by a pair of guide rails 578, and in the X direction and the Y direction by the coating head moving device 522. Moved. The coating head main body 576 is also moved up and down by a coating head lifting device 528 provided on the Y slide 548. In this embodiment, the coating head lifting / lowering device 528 includes a motor 588 as a drive source, a cam 590, and a roller 592 as a cam follower. The cam 590 is a positive cam, and a roller 592 rotatably attached to the coating head main body 576 is fitted in the cam groove 594, and the coating head main body 576 is rotated by the cam 590 being rotated by the motor 588. The needle 570 is moved up and down between the application position and the retracted position. In this embodiment, the application position is a position slightly above the upper surface of the substrate 20 held by the substrate holding device 42.

  The adhesive container 572 and the adhesive pump 574 are both mounted on the coating head main body 576, provided close to each other, and moved together by the movement of the coating head main body 576. The adhesive container 572 is a kind of adhesive and contains a silver paste which is a kind of thermosetting adhesive. The adhesive container 572 and the adhesive pump 574 are connected by a connection tube 600, and the needle 570 is attached downward to the adhesive pump 574. The adhesive pump 574 is connected to the adhesive container 572 via the connection tube 600. The adhesive is sucked and discharged from the needle 570 and applied to the package substrate 34. The connection tube 600 and a passage (not shown) that is provided in the adhesive pump 574 and connects the connection tube 600 and the needle 570 constitute a connection passage that connects the adhesive container 572 and the needle 570.

The chip holding device 46 will be described with reference to FIGS.
As schematically shown in FIG. 4, the chip holding device 46 is in a direction perpendicular to the substrate carrying direction with respect to the substrate carrying device 40 and the substrate holding device 42, and opposite to the adhesive application device 44. That is, it is provided so as to be immovable in the X direction and the Y direction on the back side of the chip mounting machine from the substrate holding device 42. The chip holding device 46 includes a chip assembly holding member 630, a chip assembly storage member 632, a tension applying member 634 as a holding member, and a tension applying member holding device 636 as a holding member holding device. The chip assembly 30 is held.

  As shown in FIG. 18, the tension applying member holding device 636 includes a support member 640 detachably fixed to the base 56 and an attachment device 642 provided on the support member 640. The support member 640 has a plate shape with a generally rectangular cross section, and is provided with a fitting hole 644 that penetrates in the thickness direction (vertical direction). Is provided. In this embodiment, the mounting device 642 includes a plurality of, for example, four support surfaces 646, engagement protrusions 648 provided on two of the support surfaces 646, and pressers provided on the other two, respectively. A member 650 is provided. The support member 640 is open at the upper surface thereof and the inner peripheral surface of the fitting hole 644, and is provided with four notches at equal angular intervals along the circumferential direction of the fitting hole 644. The support surface 646 is configured. Each of the two engaging protrusions 648 has a stepped shape, and is protruded from one end portion in the circumferential direction of two fitting holes 644 that are separated from each other in the diameter direction among the four support surfaces 646. Is configured. The two pressing members 650 each have a plate shape, and are fixed to the supporting member 640 in a state of being positioned on one circumferential end of the other two supporting surfaces 646.

  As shown in FIGS. 18 and 19, the tension applying member 634 includes a cylindrical portion 654 as a tension applying portion or a holding portion and a plurality of engaging portions 656 in the present embodiment. The tension applying member 634 shown in FIGS. 18 and 19 holds the largest wafer 24 among a plurality of types of wafers 24 having different diameters, and the inner diameter of the cylindrical portion 654 is made larger than the diameter of the wafer 24. The diameter of the fitting hole 644 of the support member 640 is slightly larger than the outer diameter of the largest cylindrical portion 654. In the tension applying member 634, the four engaging portions 656 are provided directly and equiangularly on the cylindrical portion 654, and two of the engaging portions 656 separated in the diametrical direction are the center of the cylindrical portion 654. A plate-like portion 658 extending outward in a posture perpendicular to the line is provided, and the other two engaging portions 656 extend in the circumferential direction of the cylindrical portion 654, penetrate in the vertical direction, and at one end portion in the circumferential direction. It has a notch 660 that opens.

  The tension applying member 634 is rotated with respect to the support member 640 from the state in which the cylindrical portion 654 is fitted in the fitting hole 644 and the four engaging portions 656 are placed on the four support surfaces 646. As a result, the notch 660 is fitted into the small-diameter portion of the engaging protrusion 648, and the plate-like portion 658 is sandwiched by the pressing member 650 and the support surface 646 from above and below, so that it cannot be lifted, and X, It is supported by the support member 640 while being positioned in the Y direction.

  The tension applying member that supports the wafer 24 smaller than the largest wafer 24 has a cylindrical portion and four engaging portions in the same manner as the tension applying member 634. The tension applying member indicated by a two-dot chain line in FIG. As in 670, the cylindrical portion 672 has an outer diameter corresponding to the diameter of the wafer 24, is smaller than the cylindrical portion 654, and extends radially outward from a lower end portion that is one end portion in the center line direction of the cylindrical portion 672. It has a flange-like held portion 674 that is extended. The held portion 674 has a diameter equal to the outer diameter of the cylindrical portion 654 and is eccentric with respect to the cylindrical portion 672, and four held portions 656 are provided on the held portion 674. The outer diameter of the held portion 674 is the same even if the outer diameter of the cylindrical portion is different, and a plurality of types of tension applying members having different cylindrical sizes are all similar to the support member 640 by the engaging portion 656. To be selectively attached. Further, the cylindrical portions of a plurality of types of tension applying members having different sizes of the cylindrical portions, for example, the cylindrical portions 654 and 672 of the tension applying members 634 and 670 and a cylindrical portion of another tension applying member, As shown schematically in FIG. 21, the cylindrical portion 676 whose diameter is smaller than the cylindrical portion 672 is a horizontal straight line in which the center of each cylindrical portion is orthogonal to the substrate transport direction when held by the tension applying member holding device 636. A cylindrical portion that is located on the line and has a smaller diameter is positioned closer to the substrate holding device 42 and closer to the substrate holding device 42. In FIG. 21, the arrow indicates the substrate transport direction. Further, each cylindrical portion 654 and the like are provided such that the tip surface or the upper end surface thereof has the same height from the support surface 646 when the tension applying member 634 and the like are held by the tension applying member holding device 636. It has been.

  As shown in FIGS. 17 and 19, the chip assembly storage member 632 is formed by integrally assembling a plurality of, for example, three members. The first member 690 has a plate-like shape, and as shown in FIG. Is provided. The second member 694 and the third member 696 also have a plate shape, and are detachably fixed on the first member 690 with a gap capable of accommodating the chip assembly holding member 630 between the first member 690 and the first member 690. Has been. As shown in FIG. 17, an opening 702 having a diameter larger than the cylindrical portion 654 is provided concentrically with the fitting hole 644 across the second and third members 694 and 696.

  The first member 690 is provided with a plurality of, in this embodiment, four guide rods 710 downward, and can be moved up and down in each of the four guide holes 712 (see FIG. 18) provided in the support member 640. The tip assembly storage member 632 is fitted and guided by a guide device 714 including a guide rod 710 and a guide hole 712 as the guide members, and the tip assembly lifting device 716 provides a tension applying member holding device 636. The tension applying member 634 is moved up and down. The chip assembly lifting / lowering device 716 is a kind of relative movement device that relatively moves the chip assembly 30 held by the chip assembly holding member 630 and the tension applying member 634, and is an approach / separation device that approaches and separates each other. It is.

  In this embodiment, the chip assembly lifting / lowering device 716 includes an air cylinder 720 as a drive source and four levers 722 as drive members, as shown in FIGS. As shown in FIG. 18, the lever 722 is attached to four portions of the support member 640 separated in the X direction and the Y direction, respectively, so as to be rotatable about an axis parallel to the X direction. As shown in FIG. 19, the first member 690 is engaged with a roller 724 that is rotatably mounted about an axis parallel to the X direction. Of the four levers 722, two levers 722 separated in the Y direction are connected to each other by a link 726 so as to be relatively rotatable, and one of the two levers 722 separated in the X direction. The two are connected by a rod 728 and rotated integrally. When the rod 728 is moved in the Y direction by expansion and contraction of the piston rod 730 of the air cylinder 720, the four levers 722 are simultaneously rotated, and the chip assembly storage member 632 is moved up and down.

  The rising end position of the chip assembly storage member 632 is defined by the stroke end of the air cylinder 720, and the falling end position is defined by a stopper device 734 provided on the support member 640 as shown in FIG. In this embodiment, the stopper device 734 includes a plate cam 736 as at least one, for example, two stopper members, as shown in FIGS. The plate cam 736 is provided on the support member 640 with a pair of brackets 740 and 742 (see FIG. 18) on a shaft 744 that is pivotally mounted about an axis parallel to the X direction, and is spaced apart in the Y direction. It is rotated together with the shaft 744. Each of the two plate cams 736 has a cam surface 746 whose distance from the axis of the shaft 744 is gradually changed.

  As shown in FIG. 19, the first member 690 of the chip assembly storage member 632 has two locations separated in the Y direction as rotation engaging members at positions corresponding to the plate cams 736 and 738, respectively. The roller 750 (only one is shown in FIG. 19) is attached so as to be rotatable about an axis parallel to the X direction, and when the chip assembly storage member 632 is lowered, the roller 750 The lowering is stopped by coming into contact with the uppermost end of 746. The height of the uppermost end portion of the cam surface 746 is adjusted by the rotation of the plate cam 736, and the lower end position of the chip assembly storage member 632 is adjusted. This adjustment is performed by an operator in this embodiment, and the shaft 744 is rotated by operating the operation lever 754 attached to the shaft 744. As shown in FIG. 18, the shaft 744 is provided with a plate-shaped scale 756 that represents the lower end position, and is adjusted while confirming the lower end position based on the scale value indicated by the needle 758 provided on the support member 640. .

  A bracket 740 that is one of the pair of brackets 740 and 742 that hold the shaft 744 is provided with a slit 760 as shown in FIG. 19, and a bolt 762 is provided at a portion of the bracket 740 where the slit 760 is provided. It is screwed. The operator operates the lever 764 to tighten the bolt 762 and contract the slit 760 to tighten the shaft 744 to prevent rotation, so that the plate cam 736 obtains a predetermined lower end position of the chip assembly storage member 632. Maintained in a rotated position. At the time of adjusting the descending end position, the screwing of the bolt 762 is loosened, the holding of the shaft 744 by the bracket 740 is loosened, and the rotation is allowed. The stopper device 734 is both a descending end position defining device and a tension adjusting device described later. The reason for adjusting the descending end position will be described later.

  As shown in FIG. 17, the chip assembly holding member 630 has a frame shape with a generally U-shaped cross section, and a pair of U-shaped arms 770 and one end of each of the arms 770. Each of the connecting portions 772 for connecting the chips is provided with an upward horizontal chip assembly support surface 774, and the chip assembly 30 is placed on the chip assembly support surface 774 in the holding frame 28. Further, the chip assembly holding member 630 is provided with two positioning pins 776 projecting vertically from the chip assembly support surface 774 provided in the connecting portion 772 with a distance in the X-axis direction. The two notches 778 formed on the holding frame 28 of the chip assembly 30 and constituting the positioning portion are engaged. One of the notches 778 has a V-shaped cross section, and one of the positioning pins 776 is fitted into the notch 778, and the other of the notches 778 has an inclined surface inclined with respect to the X-axis direction. The other end of the pin 776 is engaged, and the chip assembly 30 is positioned so as not to move in the X-axis direction and positioned in the Y-axis direction.

  Each of the pair of arm portions 770 is provided with a guide rail 782 (see FIG. 19) as a guide member at a lower portion thereof in parallel with the Y direction, and is provided on the first member 690 of the chip assembly storage member 632. The chip assembly holding member 630 is slidably fitted to a guide block 784 as a guide member, and is supported by the chip assembly storage member 632 so as to be movable in the Y direction while being opened forward. As shown in FIG. 17, each front end portion of the pair of arm portions 770 is provided with a handle 786 as an operation portion, and the operator manually holds the chip assembly holding member 630 with the handle 786. The chip assembly storage member 632 is moved in the Y direction so that the chip assembly 30 held by the chip assembly holding member 630 is stored in the chip assembly storage member 632 and pulled out from the chip assembly storage member 632. it can.

  The position of the chip assembly holding member 630 in the Y direction with respect to the chip assembly storage member 632 is determined by a pair of stoppers 790 (see FIGS. 17 and 19) provided at the rear of the first member 690. It is defined by the contact of the connecting portion 772 of the holding member 630. Further, as shown in FIG. 17, an engaging protrusion 792 as an engaging part protrudes from the rear surface of the connecting part 772, and this engaging protrusion 792 is provided at the rear part of the first member 690. The chip assembly holding member 630 is positioned in the X direction by being fitted into the engaging recess 794 serving as the engaging portion. The stopper 790 includes, for example, a bolt, and the accommodation position of the chip assembly holding member 630 can be adjusted by adjusting the screwing amount.

  The first member 690 and the second member 694 of the chip assembly storage member 632 are connected to each other by the connecting device 800 in a state where the chip assembly holding member 630 holding the chip assembly 30 is stored. As shown in FIGS. 19 and 20, the connecting device 800 includes a claw member 802 as a connecting member attached to the center of the front portion of the first member 690 in the X direction. The claw member 802 is fitted to the first member 690 by a bracket 804 so as to be slidable in the axial direction and relatively rotatable in a shaft 806 provided parallel to the X direction. A claw portion 808 (see FIG. 19) is included in the portion.

  As shown in FIG. 20, the claw member 802 is sandwiched between the bracket 804 and a plate-like holding member 810 fixed to the bracket 804, as shown by a solid line in FIG. The claw portion 808 is engaged with the upper surface of the second member 694, and the second member 694 is positioned in the X and Y directions with respect to the first member 690. In a state (in a state where the center of the opening 702 and the center of the fitting hole 644 coincide with each other), they are connected so as not to come out. This position is a connecting position or an operating position of the claw member 802. The operator holds the knob 812 (see FIG. 19) provided on the claw member 802 and moves the claw member 802 along the axis 806, and FIG. As indicated by a two-dot chain line, the shaft 806 is rotated around the shaft 806 in a state where it is detached from the holding member 810, and is detached from the second member 694 as indicated by a two-dot chain line in FIG. It is possible to move to the retracted position retracted downward from the movement path. Further, the claw member 802 is rotated, moved vertically along the shaft 806 in a state where the claw portion 808 is engaged with the second member 694, and as shown by a solid line in FIG. And the holding member 810 can be kept in a state of being located at the coupling position. The second member 694 of the chip assembly storage member 632 is positioned in the X direction, the Y direction, and the vertical direction with respect to the first member 690 by the positioning device, and is connected to the first member 690 by the connecting device 800, It is attached so that it cannot be detached.

  As shown in FIG. 20, the claw member 802 is also provided with a recess 816, and a pressing member 818 is attached to the shaft 820 so as to be rotatable around the vertical axis, and as an elastic member which is a kind of biasing means The compression coil spring 822, which is a spring member, is urged in a direction to protrude rearward (to the second member 694 side) from the claw member 802. The limit of rotation of the pressing member 818 due to the urging of the spring 822 is defined by the pressing member 818 coming into contact with the bottom surface of the recess 816.

  When the claw member 802 is rotated to the coupling position as described above, the pressing member 818 engages with the holding frame 28 of the chip assembly 30 held by the chip assembly holding member 630 and is biased by the spring 822. Then, the chip assembly holding member 630 is pressed against the stopper 790 through the chip assembly 30, the positioning pins 776 and the notches 778. As a result, the chip assembly 30 and the chip assembly holding member 630 are accommodated immovably in the X and Y directions with respect to the chip assembly storage member 632, and the center of the wafer 24 having the largest diameter is the chip assembly. The storage member 632 is positioned to coincide with the center of the opening 702 and the center of the cylindrical portion 654 of the tension applying member 634. In FIG. 20, reference numeral 824 denotes a sensor, which is constituted by, for example, a proximity sensor that is a kind of non-contact type detection device, and detects that the claw member 802 is located at the coupling position. Positioning pins 776, stoppers 790, engaging protrusions 792 and engaging recesses 794 position the chip assembly holding member 630 with respect to the chip assembly storage member 632 in the X and Y directions, and the chip assembly 30 is mounted on the chip holding device. A positioning device for positioning with respect to 46 is constructed. The coupling device 800 is also a storage state maintaining device that keeps the chip assembly 30 and the chip assembly holding member 630 stored in the chip assembly storage member 632.

  A plurality of types of second members 694 of the chip assembly storage member 632 are also provided depending on the diameter of the wafer 24. If the diameter of the wafer 24 is reduced, the opening 702 is formed only in the second member 694. The opening 702 has a diameter corresponding to the diameter of the wafer 24 and has a diameter larger than the outer diameter of the cylindrical portion of the tension applying member for the chip assembly 30 including the wafer 24. Each of the openings 702 having a diameter corresponding to the diameter of the wafer 24 is a tension applying member for the chip assembly 30 including the wafer 24, and is a cylindrical portion of the tension applying member held by the tension applying member holding device 636. It is provided to be concentric. Therefore, the smaller the diameter of the opening 702 is, the more the center is located on a horizontal straight line perpendicular to the substrate transport direction, and the smaller the diameter of the opening 702 is, the closer to the substrate holding device 42 is located. Therefore, it is provided close to the substrate holding device 42 side.

  Further, when the chip aggregate 30 having the diameter of the wafer 24 smaller than the maximum is held by the chip aggregate holding member 630, although not shown, an auxiliary holding member is used. As with the chip assembly 30 having the largest diameter of the wafer 24, the auxiliary holding member is positioned in the X and Y directions by a pair of positioning pins 776 and notches and is detachably held by the chip assembly holding member 630. The The auxiliary holding member is provided with a positioning portion such as a positioning pin for positioning the chip assembly 30, and the chip assembly 30 is moved to X, Y by engagement with a positioning portion such as a positioning hole provided in the chip assembly 30. Position and hold immovable in the direction. Further, when the connecting device 800 connects the second member 694 to the first member 690, the pressing member 818 may press the auxiliary holding member due to the bias of the spring 822, or may press the chip assembly 30. In any case, the chip assembly 30 is held by the chip assembly holding member 630 via the auxiliary holding member, and is stored in the chip assembly storage member 632 while being positioned in the X and Y directions. The auxiliary holding member is located in the cylindrical portion of the tension applying member that applies tension to the chip assembly 30 when the chip assembly 30 is stored in the chip assembly storage member 632, and the second member The chip assembly 30 is held so as to be positioned in the opening 702 of the 694. The smaller the diameter of the wafer 24, the closer the chip assembly 30 is to the chip assembly holding member 630 with the center thereof closer to the substrate holding device 42 side. It is held and stored in the chip assembly storage member 632.

  Below the chip holding device 46, as shown by a two-dot chain line in FIG. As shown in FIGS. 19 and 22, the tip protrusion device 52 includes a protrusion pin 832, a pin driving device 834, and a pin moving device 836. The pin moving device 836 moves the protrusion pin 832 and the pin driving device 834 to arbitrary positions in the X direction and the Y direction. Therefore, as shown in FIG. 19, the pin moving device 836 includes a Y slide 840, a Y slide moving device 842, an X slide 844, and an X slide moving device that are provided so as to be movable in the Y direction (left and right in FIG. 19). 846. The Y slide moving device 842 includes a Y moving motor 850 as a driving source, a ball screw and a nut (not shown), and moves the Y slide 840 to an arbitrary position in the Y direction. The X slide moving device 846 includes an X moving motor 854 as a drive source, a ball screw 856, and a nut 858, and moves the X slide 844 to an arbitrary position in the X direction on the Y slide 840.

  As shown in FIG. 22A, the pin driving device 834 includes an elevating member 864 and an elevating member elevating device 866 provided on the X slide 844 so as to be elevable. The elevating member elevating device 866 includes a nut 868, a ball screw 870, and a pin elevating motor 872, and moves the elevating member 864 to an arbitrary position in the vertical direction while being guided by the guide rail 874. The elevating member 864 is provided with a spline shaft 878 fixed vertically, and an adapter 880 is detachably fixed to an upper portion of the elevating member 864 and a pin holder 882 is attached so as not to be relatively rotatable. keeping. The spline shaft 878 also has a passage 886 formed therein, connected to the negative pressure source 482 at one end, and communicated to the outside via a passage 890 formed in the adapter 880.

  An adsorption cylinder 900 as an adsorption member is placed on the protrusion pin 832 so as to be relatively movable in the vertical direction. A nut 902 having a spline that meshes with the spline is fitted to the spline shaft 878 so as to be relatively movable in the axial direction and relatively non-rotatable, and a cylindrical suction member holding member 904 is fitted to the outside thereof. It is fixed. The adsorption member holding member 904 is fitted to the adapter 880 while being kept airtight. The suction cylinder 900 has a bottomed cylindrical shape, and is fitted to the adapter 880 and the pin holder 882 with a gap in the radial direction with the bottom 906 facing upward, and is airtight and relative to the suction member holding member 904. It is fitted so that it cannot rotate. Therefore, the negative pressure supplied from the passage 890 opened on the outer peripheral surface of the adapter 880 is supplied to the gap between the adapter 880 and the suction cylinder 900 and the negative pressure supply hole formed in the bottom 906. 908. The negative pressure supply hole 908 is also an air suction hole. Further, the suction cylinder 900 is prevented from rotating relative to the protrusion pin 832 by the spline shaft 878 via the suction member holding member 904 and the nut 902.

  The thrust pin 832 and the suction cylinder 900 are formed by the compression coil spring 910 as an elastic member which is a kind of urging means disposed between the nut 902 and the elevating member 864, so that the suction cylinder 900 is the thrust pin 832. It is urged | biased in the direction spaced apart upward. The movement limit of the suction cylinder 900 by the bias of the spring 910 is defined by the engagement surface 912 that is the upper surface of the suction member holding member 904 engaging with the downward engagement surface 914 provided on the adapter 880. The When the elevating member 864 is raised, the stopper portion 916 provided on the X slide 844 contacts the contact portion 918 of the suction member holding member 904 to prevent the suction cylinder 900 from rising.

  As shown in FIG. 23, an opening 920 is provided in the center of the bottom portion 906 of the suction cylinder 900 so that the protrusion pin 832 passes therethrough. A plurality of the negative pressure supply holes 908 are provided around the opening 920. 22 and 23, these negative pressure supply holes 908 penetrate the bottom 906 in a direction parallel to the center line of the suction cylinder 900 and are formed concentrically around the center line of the suction cylinder 900. A plurality of, in this embodiment, four annular grooves 924 are opened. These annular grooves 924 are bottomed grooves that open to the outer surface of the adsorption cylinder 900, and are formed at wider intervals toward the outer peripheral side of the adsorption cylinder 900, so that the bottom portion 906 of the adsorption cylinder 900 has a width (adsorption) A plurality of types of suction surfaces 926, 928, and 930 are formed in the present embodiment, in which the size of the cylinder 900 in the radial direction is larger toward the outer peripheral side of the suction tube 900. These suction surfaces 926, 928, and 930 are also divided into a plurality of equiangular intervals in the circumferential direction. Further, the portion of the bottom portion 906 of the suction tube 900 where the opening 920 is provided and the annular outer peripheral portion also constitute suction surfaces 932 and 934, respectively. In the present embodiment, these suction surfaces 926 to 934 are located in one plane perpendicular to the center line of the suction cylinder 900 and protrude upward from the outside (upper side) opening of the negative pressure supply hole 908.

  As shown in FIG. 4, an imaging system 950 is provided between the substrate holding device 42 and the chip holding device 46. The imaging system 950 includes an imaging device 952 and an illumination device 954, is fixed in position, and is provided upward. The imaging device 952 is constituted by, for example, a CCD camera. In this embodiment, the imaging device 952 is a surface imaging device, and has an imaging surface in which a large number of imaging elements are arranged on one plane. Hereinafter, the imaging device 952 is referred to as a fixed imaging device 952. The imaging device may be a line imaging device in which imaging elements are arranged in a straight line, and a two-dimensional image of the imaging object is obtained by relative movement between the imaging element and the imaging object.

The chip mounting device 48 will be described.
As shown in FIG. 4, the chip mounting device 48 includes a mounting head 960 and a mounting head moving device 962. What is the adhesive application device 44 relative to the substrate holding device 42 in the horizontal direction perpendicular to the substrate transport direction? The mounting head 960 is provided on the opposite side so as to be movable to a position above the chip holding device 46 and the substrate holding device 42. The adhesive application device 44 and the chip mounting device 48 are arranged side by side in a direction perpendicular to the substrate transport direction, and the adhesive application device 44, the substrate holding device 42, and the chip holding device are sequentially arranged from the front side of the chip mounting machine. 46 and the chip mounting device 48.

  In this embodiment, the mounting head moving device 962 is, as shown in FIGS. 24 and 25, an X direction moving device 964 that moves the mounting head 960 in the X direction, a Y direction moving device 966 that moves in the Y direction, and an X direction moving device 966. And a mounting head lifting device 968 that lifts and lowers in the vertical Z direction orthogonal to the direction Y. The Y direction moving device 966 includes a Y slide 970 and a Y slide moving device 972. As shown in FIG. 24, the Y slide moving device 972 includes a Y moving motor 974 as a drive source, a ball screw 976 and a nut 978, and the Y slide motor 974 is rotated by the Y moving motor 974. Is guided by a pair of guide rails 980 and moved to an arbitrary position in the Y direction.

  The X direction moving device 964 includes an X slide 986 and an X slide moving device 988. As shown in FIGS. 24 and 25, the X slide moving device 988 includes an X moving motor 990, a ball screw 992, and a nut 994 as a drive source. When the ball screw 992 is rotated by the X moving motor 990, The X slide 986 is guided by the pair of guide rails 996 and is moved to an arbitrary position in the X direction on the Y slide 970. The mounting head 960 is provided on the X slide 986, the area including the chip holding device 46 and the substrate holding device 42 is moved by the mounting head moving device 962, the chip 22 is taken out from the chip holding device 46, and the substrate holding device 42. And mounted on the package substrate 34 to which the adhesive is applied. The application of the adhesive to the package substrate 34 and the chip mounting are performed in the same area, and the work area is an adhesive application area and a chip mounting area.

  As shown in FIG. 26, the mounting head 960 includes a single suction nozzle 1010 that sucks and holds the chip 22 by negative pressure and constitutes a chip holding unit, and includes an air actuator 1012 as a load control device with a built-in position detector. At the same time, it is mounted on an X slide 986. The air actuator 1012 has an air cylinder 1016 provided with a linear encoder 1014 (see FIG. 27) as a position detector, and controls both the position of the suction nozzle 1010 in the axial direction and the contact load on the chip 22.

  A piston (not shown) of the air cylinder 1016 is supported by the cylinder housing 1018 via an air bearing so as to be slidable in the axial direction and relatively rotatable. Further, the piston rod 1020 extended downward from the piston is axially connected to the cylinder housing 1018 via an air bearing by a sleeve 1022 provided to the cylinder housing 1018 via a mechanical bearing so as not to be relatively movable in the axial direction. The piston and the piston rod 1020 are moved in the axial direction with little frictional resistance. The cross-sectional shape of the outer peripheral surface of the sleeve 1022 is circular, and the cross-sectional shape of the inner peripheral surface of the sleeve 1022 and the cross-sectional shape of the piston rod 1020 are non-circular, for example, a quadrangle, in this embodiment, a square. The piston rod 1020 cannot rotate relative to the sleeve 1022. Further, the weights of the piston and the piston rod 1020 are canceled out by the air pressure, and their weight is not applied to the suction nozzle 1010. The contact load is accurate and has a minute size (from the weight of the piston and the piston rod 1020). (Small size) can be controlled.

  The air actuator 1012 controls the supply of air to the air chamber based on the detection signal of the linear encoder 1014, controls the position of the suction nozzle 1010 in the axial direction, and is detected by the pressure sensor 1015 (see FIG. 27). The supply air pressure is controlled based on the air pressure in the air chamber, and the contact load of the suction nozzle 1010 on the chip 22 is controlled. The mounting head lifting / lowering device 968 includes a portion that moves the suction nozzle 1010 of the air actuator 1012 in the axial direction and moves it up and down.

  The sleeve 1022 is rotated around its vertical axis by the rotating device 1024. The rotation device 1024 is mounted on the X slide 986 together with the air actuator 1012, and includes a rotation motor 1026 and a rotation transmission device 1028. The rotation transmission device 1028 includes a drive gear 1030 that is rotated by a rotation motor 1026, and a driven gear 1032 that is attached to the sleeve 1022 so as not to rotate relative to the sleeve 102 and to be relatively unmovable in the axial direction, and meshed with the drive gear 1030. By rotating the sleeve 1022, the piston and the piston rod 1020 are rotated about their axes.

  A nozzle holder 1040 is provided at the lower end of the piston rod 1020, and the suction nozzle 1010 is detachably held. The suction nozzle 1010 is moved up and down by expansion and contraction of the piston rod 1020. In this embodiment, the nozzle holder 1040 is formed by assembling a plurality of, for example, two holding members 1042 and 1044. The holding member 1042 is detachably fixed to the piston rod 1020, and a slit 1046 is provided at a right angle to the axis of the piston rod 1020. The size of the slit 1046 (the dimension in the direction parallel to the axis of the piston rod 1020) is adjusted by adjusting the screwing amounts of the plurality of screws 1048 screwed to the holding member 1042.

  A slit 1052 is also formed in the holding member 1044. The slit 1052 is provided 90 degrees out of phase with the slit 1046, and the size of the slit 1052 is adjusted by adjusting the screwing amount of the screw 1054 that fixes the holding member 1044 to the holding member 1042. The The suction nozzle 1010 includes a nozzle body 1056 and a suction tube 1058 and is detachably held by the holding member 1044 in the nozzle body 1056. Therefore, by adjusting the sizes of the slits 1046 and 1052 of the two holding members 1042 and 1044, the suction surface 1060 which is the tip surface of the suction tube 1058 is made horizontal. The holding members 1042 and 1044 with slits constitute a leveling device for the suction surface 1060. The nozzle holder 1040 is a nozzle holder with a horizontal adjustment mechanism. In this way, the suction nozzle 1010 held by the nozzle holder 1040 is supplied with negative pressure from the negative pressure source 482 to suck the tip 22 and is supplied with positive pressure from a positive pressure source 1064 such as a compressor to tip. Open 22 actively. Switching of supply of negative pressure and positive pressure to the suction nozzle 1010 is performed by a switching valve 1066.

  As shown in FIG. 25, an imaging system 1080 is mounted on the X slide 986, and is moved to an arbitrary position in the horizontal plane by the mounting head moving device 962. The mounted head moving device 962 also serves as an imaging system moving device. The imaging system 1080 includes an imaging device 1082 and a lighting device 1084. The imaging device 1082 is constituted by, for example, a CCD camera that is a surface imaging device, and is provided downward. Hereinafter, the imaging device 1082 is referred to as a movable imaging device 1082.

  As shown in FIG. 27, the control device 54 is mainly composed of a CPU 1110, ROM 1112 and RAM 1114 and a computer 1110 having a bus connecting them. An input / output interface 1112 is connected to the bus, and an image processing computer 1118 for processing image data obtained by imaging of the fixed imaging device 952 and the movable imaging device 1082, a fixed imaging device 952, a movable imaging device 1082, and a linear imaging device. Various sensors such as an encoder 1014 and an input device 1120 are connected.

  The input device 1120 includes a keyboard and a mouse that is a kind of pointing device, and an operator inputs commands and data to the computer 1110 using the input device 1120 to instruct the imaging mode of the chip 22 when the chip is mounted. . In this chip mounting machine, a program is provided so that two types of chip imaging modes can be selectively executed. One of the chip imaging modes is a mounting position accuracy emphasis mode as a first state in which both the movable imaging device 1082 and the first correction unit, and the fixed imaging device 952 and the second correction unit are operated. One is a tact emphasis mode as a second state in which only the movable imaging device 1082 and the first correction unit are operated.

  The first correction unit is a correction unit that corrects the position of the mounting head 960 when receiving the chip 22 from the chip holding device 46 based on the imaging result of the movable imaging device 1082, and performs image processing from the image processing computer 1118 of the computer 1110. It is constituted by a portion that receives data to determine the position error of the chip 22 and corrects the movement position of the mounting head 960 so that the position error is canceled. The second correction unit is a correction unit that corrects the position of the mounting head 960 when the chip 22 is mounted on the substrate 20 held by the substrate holding device 42 based on the imaging result of the fixed imaging device 952. The image processing data is received from the image processing computer 1118, the holding posture error of the chip 22 is obtained, and the moving position of the mounting head 960 is corrected so as to cancel the error. Prior to the start of chip mounting work on a series of substrates 20 in the chip mounting machine, the operator uses the input device 1120 to input and instruct which of the two chip imaging modes is to be executed, The computer 1110 executes a program corresponding to the instructed chip imaging mode.

  The input / output interface 1112 also drives various actuators constituting drive sources of various devices constituting the chip mounting machine, such as the substrate supply cartridge elevating device 68, via the drive circuit 1130. In these devices 68 and the like, the motor constituting the drive source is a kind of actuator. In this embodiment, the motor 68 is an electric rotary motor that is a kind of electric motor, and is a servo motor capable of controlling the rotation angle with high accuracy. Many of them are configured, and the operation of a member driven by a servo motor is controlled based on a detection signal of an encoder as an operation amount detection device. A step motor may be used instead of the servo motor. The ROM 1102 and the RAM 1104 store various programs, data, and the like such as a basic operation program of the chip mounting machine and a chip mounting work program corresponding to the substrate 20 to be worked.

Next, the operation will be described.
In each of the three chip mounting machines 10, 12, and 14, mounting on the chip 22 on the package substrate 34 is performed in parallel. In these chip mounting machines 10, 12, and 14, for example, different types of chips 22 are mounted on package substrates 34 of different types of substrates 20. The different types of substrates 20 are, for example, substrates 20 having different sizes, at least one of the wiring patterns 32 of the package substrate 34, the number, etc., or are the substrates 20 for producing leaded electronic circuit components? Depending on whether the substrate is a ball grid array manufacturing substrate, the type is different. Since the mounting procedure of the chip 22 on the package substrate 34 is the same regardless of the type of the substrate, the mounting of the substrate 20 on the package substrate 34 of the substrate 20 in the chip mounting machine 10 will be described representatively. In addition, a state in which mounting on the chip 22 on the package substrate 34 in the chip mounting machine 10 is started and performed regularly will be described. Furthermore, first, it is assumed that the mounting position accuracy emphasis mode is selected as the imaging mode. A mode in which the substrate 20 is heated by the substrate support heating device 50 will be described.

  When the mounting of the chip 22 on all the package substrates 34 of the substrate 20 is completed in the work area, the substrate 20 is unloaded from the substrate holding device 42 and stored in the substrate storage cartridge 84, and then the chip 22 is mounted. The substrate 20 to be removed is taken out from the substrate supply cartridge 66 and carried into the substrate holding device 42. Storage and removal of the substrate 20 are performed simultaneously and in parallel by the substrate transfer device 40. While the chip 22 is mounted on the substrate 20 in the work area, the substrate carry-in / carry-out head 244 is retracted or waited at the retracted position or standby position in the substrate transport apparatus 40. The standby position is located on the main guide path 247 side or the end side opposite to the work area side of the substrate storage cartridge 84 in the substrate transport direction, and adheres to the substrate 20 held by the substrate holding device 42. The coating head 520 for applying the agent and the mounting head 960 for mounting the chip 22 do not interfere with each other, and are raised to the rising end position in the vertical direction, above the substrate holding device 42 and on the substrate supply cartridge 66 side. This position is such that it does not interfere with the substrate holding device 42 when moving to the position.

  After completion of chip mounting, the substrate carry-in / carry-out head 244 is moved in the substrate carrying direction by the substrate carry-in / carry-out head moving device 246 and moved to the substrate supply cartridge 66. When the chip 22 is mounted on the package substrate 34, the substrate supply cartridge 66 and the substrate storage cartridge 84 are moved to the retreat position positioned below the substrate transfer surface, and the chips 22 on all the package substrates 34 are moved. After completion of mounting, the substrate is raised to the substrate supply position and the substrate storage position, respectively. The substrate supply cartridge 66 is raised to a position where a pair of support surfaces 76 that support the substrate 20 to be supplied are located in the same plane as the substrate transport surface. The height of the substrate supply cartridge 66 at the time of substrate supply decreases as the supply number increases. Further, the substrate storage cartridge 84 is raised to a position where the pair of support surfaces 94 that support the substrate 20 to be stored are located in the same plane as the substrate transport surface. Are sequentially performed from the upper shelf 92, and the height of the substrate storage cartridge 84 during substrate storage increases as the storage number increases. As a result, both the substrate supply cartridge 66 and the substrate storage cartridge 84 are stored below the substrate 20 to be loaded and unloaded, both when the substrate 20 is taken out from the substrate supply cartridge 66 and stored in the substrate storage cartridge 84. Thus, it is possible to avoid the waste of the substrate from being applied to the substrate 20 that is actually accommodated in the cartridges 66 and 84.

  The substrate carry-in / carry-out head 244 is moved to a position between the substrate supply cartridge 66 and the substrate 20 held by the substrate holding device 42, and then lowered to the lowered end position. Then, it is moved to the substrate supply cartridge 66 side for a short distance, and the gripping claws 292 and 294 are the first end portion of the substrate 20 and grip the downstream end portion in the substrate transport direction. At this time, the gripping claws 292 and 294 are opened apart from each other, and the substrate carry-in / carry-out head 244 is moved until the pair of pins 316 come into contact with the end face of the substrate 20 as shown in FIG. It is done. The movement position of the substrate carry-in / carry-out head 244 is set to a position where the pair of pins 316 move to the substrate 20 side at a short distance from the position where the pair of pins 316 are expected to contact the end surface of the substrate 20. The substrate 20 is reliably brought into contact with the substrate 20. The extra moving distance of the substrate carry-in / carry-out head 244 is allowed by the backward movement of the substrate 20 to the back side of the substrate supply cartridge 66. Then, the gripping claws 292 and 294 are closed to grip the substrate 20. The gripping claws 292 and 294 have a high friction coefficient on their gripping surfaces 328 and 330, and can securely grip the substrate 20. Further, the position of the substrate loading / unloading head 244 in the substrate width direction with respect to the horizontal member 252 is adjusted in advance according to the width of the substrate 20, and the gripping claws 292 and 294 grip the center portion in the width direction of the substrate 20. The substrate 20 is gripped stably.

  After the gripping claws 292 and 294 grip the substrate 20, the substrate loading / unloading head 244 is moved to the work area side, and the substrate 20 is pulled out from the substrate supply cartridge 66. The substrate supply cartridge 66 and the substrate holding device 42 are provided close to each other in the substrate transport direction, and the substrate 20 is supported from below by the support surfaces 76 of the pair of rails 72 of the substrate supply cartridge 66. Then, the substrate is transferred onto the pair of support surfaces 166 and 196 of the substrate holding device 42 and guided to move. After the mounting of the chip 22 is completed, in the substrate holding device 42, the substrate pressing members 122, 172 are lowered to the lower end position to release the clamp of the substrate 20, and the pair of support surfaces 166, 196 are substrate transport surfaces. The substrate 20 is positioned in the same horizontal plane as the pair of support surfaces 76 that support the substrate 20 positioned in the substrate supply position, and the substrate 20 moves from the support surface 76 to the support surfaces 166 and 196. Further, at the same time when the substrate pressing members 122 and 172 are lowered to the substrate release position, the two movable defining members 202 are simultaneously retracted to the retracted position. Therefore, the width of the main guide path 247 is L3 (see FIG. 7) in all parts, and is wider than the distance L1 between the pair of defining surfaces 78 of the substrate supply cartridge 66, and 1 of the main guide path 247. Since the pair of defining surfaces 146 and 178 are located outside the pair of defining surfaces 78 and the opening of the main guide path 247 is wider than the substrate supply cartridge 66, the substrate 20 is transferred from the substrate supply cartridge 66 to the substrate holding device 42. Then, it is carried in smoothly without coming into contact with the end surfaces of the movable holding member 128 and the substrate pressing member 170.

  When the gripping claws 292 and 294 are thus gripped and moved, the contact surface 352 of the pushing member 296 is the upstream end in the substrate transport direction of the substrate 20 on which the chip 22 has been mounted. Abutting on the second end and pushing to move to the substrate storage cartridge 84. The contact surface 352 contacts and pushes against the substrate 20 in a vertical posture. As will be described later, after the substrate 20 is carried into the substrate holding device 42, the two movable defining members 202 are simultaneously advanced to the advance position to be moved toward the defining surface 146, and from the defining surface 146 and the defining surface 146. It is located between the positions separated by the distance L4. The distance L4 is narrower than the distance L2 between the pair of defining surfaces 96 of the substrate storage cartridge 84, and the pair of defining surfaces 96 of the substrate storage cartridge 84 are respectively connected to the defining surface 146 of the substrate holding device 42 and the advance position. Since the substrate 20 is positioned outside the defining surface 206 of the movable defining member 202 located at the position, the substrate 20 is smoothly pushed out of the work area without contacting the upstream end surface of the cartridge body 88 in the substrate transport direction. It enters the substrate storage cartridge 84. When the substrate 20 is stored in the substrate storage cartridge 84, the movable defining member 202 is retracted to the retracted position, but the substrate 20 brought close to the defining surface 146 has a longitudinal direction parallel to the substrate transport direction. 11, and is pushed by the pushing member 296 and pushed out of the substrate holding device 42 while maintaining a position located within the distance L 4 from the regulation surface 146, and as shown in FIG. It is stored in. In the present embodiment, the movable defining member 202 defines the position in the width direction of the substrate 20 at a position where it can be smoothly stored in the substrate storage cartridge 84 as described above.

  The pushing member 296 is pushed out by abutting the substrate 20 with its abutment surface 352 in a vertical posture. However, if the movement resistance of the substrate 20 becomes excessive for some reason, for example, the specified surfaces 146, 178 or When an abnormal situation occurs in which foreign matter is sandwiched between the support surfaces 166 and 196 and the substrate 20 or the downstream end of the substrate 20 contacts the end surface of the cartridge main body 88 in the substrate transport direction. Then, a force opposite to the substrate transport direction is applied to the pushing member 296, whereby the shaft 350 is rotated against the urging force of the spring 356, and the detected member 366 is detached from the excessive resistance sensor 368. The detection signal of the excessive resistance sensor 368 changes, and it is detected that the movement resistance of the substrate 20 is excessive. Based on this, appropriate processing is performed, for example, the conveyance of the substrate 20 is stopped, or an operator is notified of the occurrence of an abnormality by a notification device such as a display device or an alarm device. By setting the set load of the spring 356, a failure can be detected as appropriate.

  The substrate carry-in / carry-out head 244 conveys the substrate 20 taken out from the substrate supply cartridge 66 to a preset position and stops. The substrate carry-in / carry-out head 244 opens the holding claws 292 and 294 to open the substrate 20 and is further moved to the substrate storage cartridge 84 side to be separated from the carried substrate 20. Next, the two movable defining members 202 are simultaneously moved to the advance position, the substrate 20 is moved toward the defining surface 146 side, and the position in the width direction is defined within a range away from the defining surface 146 by the distance L4. Is done. In this state, the substrate pressing members 122 and 172 are raised by the pressing member lifting device 106 and both side edges parallel to the substrate transport direction of the substrate 20 are pressed against the reference surfaces 144 and 176 of the substrate pressing members 120 and 170 from below. Clamp in a horizontal position in cooperation with the substrate pressing members 120 and 170. At this time, the connecting member 150 and the holding members 156 and 182 for holding the substrate pressing members 122 and 172 are raised to a position corresponding to the moving end of the piston rod 224 of the air cylinder 220 of the pressing member lifting device 106. The position is higher than the position where the substrate pressing members 122 and 172 are just sandwiching the substrate 20 between the substrate pressing members 120 and 170, and the extra rising distance of the connecting member 150 and the holding members 156 and 182 is the spring 160. , 190 is absorbed. Therefore, when the thicknesses of the substrates 20 are different, the difference in thickness is absorbed by the compression of the springs 160 and 190, and the substrate pressing members 122 and 172 do not damage any substrate 20, and the substrate pressing members 120 and 170 are not damaged. Can be pressed firmly against. Positioning of the substrate 20 in the vertical direction is performed with reference to the upper surface thereof, and positioning the substrate 20 by pressing the substrate 20 against the reference surfaces 144 and 176 provided to fix the position increases the reproducibility of the positioning. Any of the substrates 20 can be positioned at a position where the upper surface is located at the same height.

  The substrate carry-in / carry-out head 244 opens the loaded substrate 20 and is further moved to the substrate storage cartridge 84 side, and the pushing member 296 pushes the substrate 20 on which the chip 22 is mounted into the substrate storage cartridge 84. When the substrate carry-in / carry-out head 244 is moved to a predetermined push-in position, the substrate carry-in / carry-out head 244 is moved to the work area side by a short distance to separate the contact surface 352 of the pushing member 296 from the substrate 20 and to the standby position. To wait for the next transport. Further, the substrate supply cartridge 66 and the substrate storage cartridge 84 are lowered to the retracted position, and thereafter, the adhesive is applied to the substrate 20 and the chip 22 is mounted.

  As described above, the adhesive is applied to the package substrate 34 and the chip 22 is mounted on the substrate 20 held by the substrate holding device 42 and stationary at one place, that is, in the work area. Prior to that, it is detected whether or not the defect display mark 37 is attached to the substrate 20. This detection is performed by imaging all the positions 38 with the defective display mark by the movable imaging device 1082 and determining whether or not the defective display mark 37 is attached. In the present embodiment, when the substrate 20 is carried in, the movable imaging device 1082 is positioned above the location 38 with the defective display mark, and images the moving location 38 with the defective display mark.

  In this chip mounting machine, the substrate 20 is stored and supplied in the substrate storage cartridge 60 so that the edge on the side where the defective display mark attaching portion 38 is provided is clamped by the substrate pressing member 120 and the substrate pressing member 122. The For this reason, the edge of the substrate 20 where the defect display mark attaching portion 38 is provided is pressed from above by the substrate pressing member 120, but the substrate pressing member 120 is colorless and transparent, and the movable imaging device 1082 is defective through the substrate pressing member 120. The display mark-attached portion 38 and the defect display mark 37 can be imaged.

  As described above, the plurality of defective display mark attaching portions 38 are provided in one row along the longitudinal direction of the substrate 20, and the movable imaging device 1082 is defective in the horizontal direction (Y direction) perpendicular to the substrate transport direction. A plurality of defective display mark-attached portions 38 which are placed at a position corresponding to the display mark-attached portions 38 and move at the time of carry-in are sequentially imaged. Therefore, the carry-in speed of the substrate 20 is set to a speed at which the location 38 with the defective display mark where the movable imaging device 1082 moves can be imaged. Alternatively, the substrate 20 may be moved intermittently, and the movable imaging device 1082 may image the location 38 with the defective display mark when stopped, or may be stopped after loading and before the substrate 20 is clamped or clamped. After that, the movable image pickup device 1082 may be moved so as to pick up an image of the location 38 with the defective display mark.

  Then, if the image data is processed by the image processing computer 1118 and an image of the defective display mark 37 is obtained, it can be seen that the defective display mark 37 is attached, and from which position which package substrate 34 is defective. I understand. The defective package substrate data for specifying the defective package substrate 34 is stored in the RAM 1104 so that the chip 22 is not mounted.

  After the defective package substrate 34 is detected, the chip 22 is mounted on the normal package substrate 34. In this chip mounting machine, each time an adhesive is applied to one package substrate 34, the chip 22 is mounted on the package substrate 34. Application of the adhesive and mounting of the chips 22 are performed alternately one by one.

  In addition, the substrate 20 is partially supported by the support member combined heater 400 from below, and the adhesive application and chip mounting are performed in a heated state. The temperature of the substrate support member 474 has already been raised to a set temperature suitable for heating the substrate 20 when supporting the substrate 20, and is set during the mounting of the chip 22 on the plurality of package substrates 34 of the substrate 20. Kept at temperature. After the substrate 20 is held by the substrate holding device 42, the support member combined heater 400 is raised, and the substrate support surface 476 is brought into contact with a part of the substrate 20 from below. In the present embodiment, the “part of the substrate 20” corresponds to a row of the package substrates 34 aligned in the width direction of the substrate 20. In this chip mounting machine, for example, the chips 22 are arranged in one row in the substrate width direction in the substrate width direction in order from one end, for example, the downstream end, in the substrate transport direction of the substrate 20 having a longitudinal shape. Is installed. Therefore, the heater 400 serving as a supporting member is moved in a direction parallel to the substrate transport direction by the heater moving device 402, and is moved in a direction parallel to the stationary substrate 20 held by the substrate holding device 42, and the chip. 22 is moved to a position corresponding to the row of the package substrates 34 on which 22 is mounted.

  After the movement, the support member combined heater 400 is raised by the heater elevating device 424. At this time, the support member combined heater 400 is first raised by the first lifting device 426, raised to the rising end position by the first lifting device 426, and then raised by the second lifting device 428. The second lifting device 428 lifts the support member combined heater 400 by means of the damper cylinder 450. Therefore, as shown in FIG. 12, the rising of the heater 400 serving as the supporting member is stopped when the positioning member 496 comes into contact with the substrate pressing members 122 and 172, but stops at a position corresponding to the thickness of the substrate 20. Then, the substrate 20 is supported by contacting the plurality of types of substrates 20 having different thicknesses from below at the corresponding substrate support positions.

  The support member combined heater 400 is supported by a heater lifting / lowering device 424 via a swinging device 456, and is inclined to the positioning member 496 or the substrate support surface 476 due to an assembly error of the heater lifting / lowering device 424 or the heater moving device 402. Even if there is, the four positioning members 496 abut against the substrate pressing members 122, 172 and the substrate support surface 476 is clamped by the swing of at least one of the first and second swing members 460, 464. It is made to contact along the lower surface of a part of the substrate 20 (one row of package substrates). The support / heating head including the support member combined heater 400, the positioning member 486, the heat transfer reduction member 468 and the ceramic body 466 is swingably supported by the swing device 456, and adhesion to the substrate 20 is ensured. It is. The substrate pressing members 120 and 170, the substrate pressing members 122 and 172, the four positioning members 496, the substrate supporting member 474, the heating body 470, the heat transfer reducing member 468 and the ceramic body 466 are made with high dimensional accuracy and swing. By swinging the device 456, a state in which the substrate support surface 476 follows the lower surface of the substrate 20 with high accuracy is obtained. Further, the substrate 20 is adsorbed to the substrate support surface 476 by the negative pressure supplied to the air suction passage 478 and is firmly supported. Furthermore, the substrate support surface 476 is heated by the heat generated by the heat generating member 472, and a part of the substrate 20 that is supported by the substrate support surface 476 is efficiently heated.

  After the substrate 20 is supported by the support member combined heater 400 and heated, the coating head 520 is moved from the retracted position to the work area to apply the adhesive to the chip mounting portion of the package substrate 34. At this time, the substrate carry-in / carry-out head 244 of the substrate transport apparatus 40 is positioned at the standby position and does not interfere with the coating head 520 and the mounting head 960. The coating head 520 is moved by the coating head moving device 522 from the retracted position retracted from the substrate holding device 42 in the horizontal direction perpendicular to the substrate transport direction to the work area, and the needle 570 is supported by the support member combined heater 400. It is positioned on the package substrate 34 and lowered. The coating head 520 is lowered by the coating head lifting / lowering device 528 including the cam 590, and is lowered until the needle 570 is located at a position slightly away from the package substrate 34. In this state, the adhesive pump 574 is operated, and the application head 520 is moved in the X and Y directions while the adhesive is discharged from the needle 570, and the adhesive forms a predetermined figure on the chip mounting portion of the package substrate 34. Painted and painted. After application, the application head 520 is raised and retracted from the work area to the retracted position. The position where the adhesive is applied by being moved to the work area of the coating head 520 is the work position, and is the application position. The position is moved along a preset work route so that the adhesive is put into a predetermined shape. Apply.

  After coating, the coating head 520 is raised and retracted to the retracted position, while the mounting head 960 is moved to a position above the substrate 20 by the mounting head moving device 962, and the chip 22 received from the chip holding device 46 is received. And mounted on the package substrate 34 coated with an adhesive. The chip 22 is received in parallel with the application of the adhesive to the package substrate 34. The chip holding device 46 is provided with a fixed position in the present embodiment, and the mounting head 960 is moved to the position of the predetermined chip 22 and is sucked and held.

  In the chip holding device 46, here, the chip assembly 30 having the largest diameter of the wafer 24 is held by the chip assembly holding member 630 and stored in the chip assembly storage member 632 by the tension applying member 634. Tension is applied to the pressure-sensitive adhesive sheet 26 and is kept in a tension state. In particular, in this embodiment, the pressure-sensitive adhesive sheet 26 is maintained in a stretched state by a predetermined amount. The chip assembly storage member 632 is lowered by the chip assembly lifting device 716 after the chip assembly holding member 630 on which the chip assembly 30 is placed is stored. Accordingly, the cylindrical portion 654 of the tension applying member 634 enters the chip storage member 632 through the opening 692, contacts the portion of the adhesive sheet 26 between the wafer 24 and the holding frame 28, and the wafer 24 descends. To prevent. The chip assembly storage member 632 is further lowered from this state. The pressure-sensitive adhesive sheet 26 has elasticity, and allows the holding frame 28 and the chip assembly storage member 632 to descend with respect to the cylindrical portion 654 by stretching itself. As a result, the pressure-sensitive adhesive sheet 26 is stretched almost uniformly in all directions, and the cutting lines of a large number of chips 22 cut by dicing are expanded, so that the removal from the pressure-sensitive adhesive sheet 26 is facilitated.

  The chip assembly storage member 632 is lowered to the lowered end position defined by the stopper device 734. The lower end position is adjusted to a position where the chip assembly storage member 632 is lowered as described above, an appropriate tensile force acts on the adhesive sheet 26, and an interval between adjacent chips 22 is expanded by an appropriate amount. The adhesive sheet 26 is maintained in the stretched state while the chip assembly storage member 632 is positioned at the lowered end position. In this embodiment, the chip assembly storage member 632, the tension applying member 634, and the chip assembly lifting / lowering device 716 constitute a sheet holding device or tension applying device that keeps the adhesive sheet 26 in the stretched state.

  Further, when the holding frame 28 is lowered with respect to the cylindrical portion 654, an upward reaction force acts on the outer peripheral portion of the chip assembly 30, but the warpage of the chip assembly 30 is caused by the chip assembly storage member 632. The second member 694 and the third member 696 (only the second member 694 when the diameter of the wafer 24 is small) are pressed, and the tension is increased as the chip assembly storage member 632 is lowered. The third member 696 has a thin plate shape, but is fixed to the first member 690 by a bolt as a kind of fixing means, and the second member 694 has a thin plate shape, but as described above, the chip assembly holding member After 630 is stored, it is connected to the first member 690 by the connecting device 800, so that it can be pressed even if the reaction force of the chip assembly 30 is applied. The connecting device 800 is also a reinforcing device, and the claw member 802 constitutes a movable connecting member or reinforcing member, and the holding member 810 constitutes a connected state or reinforcing state maintaining device.

  The suction nozzle 1010 is moved to the position of the chip 22 to be mounted on the package substrate 34 among the plurality of chips 22 of the chip assembly 30 held in this way. At this time, prior to suction of the chip 22, the movable imaging device 1082 is moved upward of the chip 22 and images the chip 22. The movable imaging device 1082 is moved onto the chip 22 in accordance with preset chip extraction data and images the chip 22. The image data of the chip 22 obtained thereby is processed by the image processing computer 1118, and the position shift is performed. Each position error in the X direction and the Y direction of the chip 22 is detected by comparing with normal image data having no image. In addition, for a defective chip 22, a chip defect display mark is attached to a portion with a chip defect display mark provided on the chip 22, and if a chip defect display mark is obtained, the chip 22 is a defective chip. The mounting head 960 is not held and the next chip 22 is held.

  The movement position of the mounting head 960 is corrected so that the position error of the chip 22 is canceled and the suction nozzle 1010 can suck the center of the chip 22, and the movement position of the suction nozzle 1010 is corrected and the center of the chip 22 is corrected. The position can be moved with high accuracy. After the movement, the suction nozzle 1010 is lowered to the chip receiving position or the chip suction position by the air actuator 1012.

  In this manner, the tip 22 is pushed up by the tip thrusting device 52 and sucked and held by the suction nozzle 1010 with respect to the suction nozzle 1010 lowered to the tip suction position. The tip holding device 46 is provided with a fixed position. The protrusion pin 832 is moved in the horizontal direction by the pin moving device 836 and is moved below the tip 22 to be sucked by the suction nozzle 1010. It is raised by the driving device 834 to push up the chip 22.

  At the time of non-push-up, the push-up pin 832 is positioned at the standby position as shown in FIG. 22A, and is positioned below the suction surfaces 926 to 934 of the suction cylinder 900. At the time of pushing up, the elevating member 864 is raised by the elevating member elevating device 866. Until the contact portion 918 of the suction member holding member 904 comes into contact with the stopper portion 916, the suction tube 900 and the protrusion pin 832 rise integrally. The suction pin holding member 904 rises against the biasing force, and the thrust pin 832 rises with respect to the stopped suction cylinder 900. As a result, as shown in FIG. 22B, the push-up pin 832 protrudes upward from the suction cylinder 900 through the opening 920 and is raised to a preset push-up position.

  The adsorption cylinder 900 is raised while a negative pressure is supplied. The rising end position of the suction tube 900 is determined by the contact of the contact portion 918 with the stopper portion 916, and the suction surfaces 926 to 934 are positioned slightly below the adhesive sheet 26 to which tension is applied as described above. The suction surfaces 926 to 934 adsorb and support the portion of the adhesive sheet 26 to which the chip 22 to be supplied adheres from below by supplying negative pressure. The suction surfaces 926 to 934 are divided and provided in large numbers as described above, and the negative pressure supply holes 908 are opened adjacent to each of the suction surfaces 926. can do. Further, since the negative pressure supply hole 908 is opened at the bottom surface of the annular groove 924 and supplies negative pressure at a position retracted from the suction surfaces 926 to 934, compared with a case where negative pressure is directly supplied to the suction surface. Thus, the suction force of each suction surface can be reduced while securing the suction force of the entire suction cylinder, and the chip 22 and the adhesive sheet 26 can be sucked without fear of damage. Further, since the suction cylinder 900 is prevented from rotating with respect to the protrusion pin 832, the suction cylinder 900 does not rotate and does not damage the adhesive sheet 26 or the like.

  When the push-up pin 832 is raised with respect to the suction cylinder 900, the adhesive sheet 26 is pushed up from the back side opposite to the surface to which the chip 22 is attached. Therefore, only the portion of the adhesive sheet 26 where the protruding pin 832 contacts and the vicinity thereof are not pushed up, and only the portion where the protruding pin 832 contacts and the vicinity thereof are strongly curved and separated from the adsorption cylinder 900. The tip 22 is pushed up. Particularly in the present embodiment, the width of each of the suction surfaces 926 to 930 is made smaller toward the center of the suction cylinder 900, and the formation density of the negative pressure supply holes 908 is increased. The adhesive sheet 26 is strongly curved and the chip 22 is peeled off.

  The pin driving device 834 for raising and lowering the raising pin 832 uses a pin raising and lowering motor 872 constituted by a servo motor as a driving source, and the rising speed of the raising pin 832 or the tip raising speed is steplessly controlled by controlling the rotation angle. It can be controlled to be lifted up while avoiding damage to the chip 22, peeled off from the adhesive sheet 26, and lifted up. Since the chip 22 is thin and easily damaged, it is desirable that the chip 22 has a large adhesive area with respect to the adhesive sheet 26 and has a large adhesive force at the beginning of thrusting or at the beginning of peeling. The rising pin 832 may be raised in multiple stages, and the rising distance (upward amount) for each step may be reduced at the beginning of the protrusion and gradually increased. It is not enough to keep the climb rate small. On the other hand, if the servo motor is used as the drive source and the ascent speed of the ascent pin 832 is controlled steplessly, the ascent speed (intrusion speed) at the beginning of the ascent will be kept sufficiently small and the ascent speed will gradually increase smoothly. Thus, the curve operation can be controlled so that the height (rising distance) of the thrust pin 832 with respect to time increases in a quadratic function. Thereby, at the beginning of the protrusion, the amount of protrusion of the chip 22 is kept small and pushed up little by little, and the chip 22 is pushed up to some extent to reduce the sticking area to the adhesive sheet 26. In a state where the holding force is decreased, the tip 22 is quickly moved to a predetermined ascending end position (height position) or a supply position by increasing the thrusting speed, and while avoiding breakage of the tip 22 well, Can be pushed up.

  The protruding position of the protruding pin 832 is set to a position where the chip 22 is pushed up to a position slightly above the suction surface 1060 of the suction nozzle 1010 lowered to the chip suction position. Therefore, the tip 22 comes into contact with the suction surface 1060 while being pushed up by the push-up pin 832, and then further lifted, whereby the suction nozzle 1010 is retracted. At this time, the contact load is controlled by the air actuator 1012, and the suction nozzle 1010 and the tip 22 are brought into contact with the set contact load. By controlling the contact load of the suction nozzle 1010 to an appropriate size in this way, the tip 22 can be reliably attached to the suction nozzle 1010 while avoiding the tip 22 from being sandwiched between the suction nozzle 1010 and the protrusion pin 832 and being damaged. Can be retained. The wafer 24 is attached to the surface of the adhesive sheet 26 opposite to the side where the electronic circuit is formed, and the suction nozzle 1010 sucks the surface of the chip 22 where the electronic circuit is formed.

  After the suction nozzle 1010 sucks the chip 22 by negative pressure in this way, the mounting head 960 is raised and moved to the package substrate 34 coated with an adhesive to be mounted. Application of the adhesive to the package substrate 34 is completed until the mounting head 960 holds the chip 22 and moves to the substrate 20, and the application head 520 is retracted to the retracted position. Instead of 520, the mounting head 960 is moved above the substrate 20 to mount the chip 22 on the package substrate 34. In the middle of this movement, the mounting head 960 moves onto the fixed imaging device 952, and the chip 22 adsorbed by the adsorption nozzle 1010 is imaged. Then, the image data is processed by the image processing computer 1118, and the holding posture error of the chip 22 by the suction nozzle 1010 is calculated. The holding posture error includes each position error in the X direction and the Y direction and a rotational position error that is a position error about an axis perpendicular to the surface of the chip 22. Prior to mounting the chip 22 on the package substrate 34, the reference mark 36 provided on the package substrate 34 is imaged by the movable imaging device 1082, and each positional error and package in the X direction and Y direction of the package substrate 34 are detected. A rotational position error of the substrate 34 (position error about an axis perpendicular to the package substrate 34) is calculated.

  The movement position of the suction nozzle 1010 cancels the positional error in the X and Y directions of the chip 22, the positional deviation in the X and Y directions caused by the correction of the rotational position error, and the positional errors in the X and Y directions of the package substrate 34. It is corrected as follows. Further, the suction nozzle 1010 is rotated so that the rotational position error of the chip 22 and the rotational position error of the package substrate 34 are canceled out. The suction nozzle 1010 is rotated by rotating the sleeve 1022 by the rotating device 1024 and rotating the piston rod 1020 that holds the suction nozzle 1010. By correcting these errors, the chip 22 is mounted with high accuracy in a normal posture on the chip mounting portion, which is an application portion to which the adhesive of the package substrate 34 is applied.

  At the time of mounting, the suction nozzle 1010 is lowered by the air actuator 1012 to a preset mounting position. This mounting position is a position where the chip 22 is further lowered slightly from the state in which the chip 22 is in contact with the adhesive, and the adhesive is accurately crushed to a predetermined set thickness. At this time, the contact load of the suction nozzle 1010 on the package substrate 34 is controlled to an appropriate magnitude by the air actuator 1012, and the chip 22 is mounted on the package substrate 34 without damage. As described above, when the chip 22 is mounted on the package substrate 34, the package substrate 34 is heated by the support member combined heater 400, the adhesive is cured, and the chip 22 is quickly bonded to the package substrate 34. The suction nozzle 1010 sucks the surface of the chip 22 where the electronic circuit is formed, and the chip 22 is mounted on the package substrate 34 on the back surface of the chip 22 where the electronic circuit is not formed. Glued. The chip 22 is mounted on the package substrate 34 face up with the surface on which the electronic circuit is formed facing upward. Thus, after the suction nozzle 1010 is lowered to the mounting position and the chip 22 is mounted, the supply of negative pressure is cut off, and positive pressure is supplied to the suction nozzle 1010 from the positive pressure source 1064 to remove the chip 22. Open actively. Then, the suction nozzle 1010 is raised and moved to the chip holding device 46 to receive the chip 22 to be mounted next.

  The application of the adhesive to each of the plurality of package substrates 34 of the substrate 20 and the mounting of the chips 22 are alternately performed, and the chips 22 are mounted on all the rows of the package substrates 34 parallel to the width direction of the substrate 20. Then, the support member combined heater 400 is lowered and separated from the substrate 20, and is moved in the X direction by the heater moving device 402, where the chip 22 is mounted next to the substrate 20, here the chip. 22 is moved to a position corresponding to a portion adjacent to the upstream side in the substrate transport direction in the row of package substrates 34 on which the mounting of the chips 22 on the substrate 20 is performed. The part is supported from below and heated.

  If the chips 22 are mounted on all the package substrates 34 of the substrate 20, the position regulation is released by the clamps by the substrate pressing members 120 and 170 and the substrate pressing members 122 and 172 of the substrate 20 and the movable defining member 202. 20 is unloaded from the work area by the substrate transfer device 40 and stored in the substrate storage cartridge 84, and the substrate 20 supplied by the substrate supply cartridge 66 is loaded into the work area.

  If the chip 22 of the chip assembly 30 is exhausted, the chip assembly 30 is replaced with a chip holding the chip 22. This exchange is performed by an operator. At the time of replacement, the chip assembly storage member 632 is raised by the chip assembly lifting / lowering device 716, and the chip assembly 30 is in a state in which tension is not applied to the adhesive sheet 26. Then, the operator moves the claw member 802 of the connecting device 800 to the retracted position, and releases the connection between the first member 690 and the second member 694 of the chip assembly storage member 632. In this state, the operator holds the handle 786 and pulls the chip assembly holding member 630 from the chip assembly storage member 632 to the front side of the chip mounting machine, that is, the adhesive application device 44 side. As a result, the chip assembly 30 is also pulled out, so that the chip assembly 30 held by the chip assembly holding member 630 is removed from the chip assembly holding member 630 and the new chip assembly 30 is held by the chip assembly holding member 630. Let The notch 778 is engaged with the positioning pin 776 and placed on the chip assembly support surface 774. Thereafter, the chip assembly holding member 630 is moved into the chip assembly storage member 632, and after storage, the connecting device The second member 694 is coupled to the first member 690 by 800. The chip holding device 46 is provided on the far side from the work area of the chip mounting machine. However, the chip assembly holding member 630 can be moved in the front-rear direction and pulled out to the front side, so that the chip assembly 30 can be easily moved. Can be exchanged.

  In addition to the replacement of the chip assembly 30, the work performed by the operator on the chip mounting machine 10, such as adjustment of the substrate holding width by the substrate holding device 42, is performed by three chip mounting machines 10 arranged in a row. , 12, and 14 are performed by one operator. In the chip mounting machines 10, 12, and 14, the adhesive application device 44 and the chip mounting device 48 are arranged in a direction perpendicular to the substrate transport direction. Therefore, the width (frontage) of each of the chip mounting machines 10, 12, and 14 is shorter and the movement distance of the worker is shorter than when arranging them in parallel with the substrate transport direction. One person can manage the three chip mounting machines 10, 12, and 14.

  Further, when the type of the substrate 20 on which the chip 22 is mounted is changed, the type of the chip 22 is changed, the type of the chip assembly 30 held by the chip holding device 46 is changed, and the diameter of the wafer 24 is changed. The second member 694 and the tension applying member of the chip assembly storage member 632 are replaced with ones corresponding to the diameter of the wafer 24, respectively. If necessary, the chip assembly 30 is held by the chip assembly holding member 630 using an auxiliary holding member. In any case, the smaller the diameter of the cylindrical portion of the tension applying member, the closer the center is to the substrate holding device 42 side, and the end of the cylindrical portion on the substrate holding device 42 side is toward the substrate holding device 42 side. The chip assembly 30 is held by the chip assembly holding member 630 so that the wafer 24 is located in the cylindrical portion. Therefore, even if the wafer 24 of the chip assembly 30 is small, the chip assembly 30 is positioned on the substrate holding device 42 side. The distance for the chip 22 of the wafer 24 held in the small cylindrical portion to be transferred to the substrate 20 held by the substrate holding device 42 by the mounting head 960 can be shortened.

  The case where the mounting position accuracy emphasis mode is selected as the chip imaging mode has been described above. However, when the tact emphasis mode is selected, the fixed imaging device 952 captures the chip 22 sucked by the suction nozzle 1010. Instead, it is mounted on the package substrate 34 immediately after the suction, and the chip mounting cycle time is shortened. Imaging of the reference mark 36 on the package substrate 34 and detection of a position error are performed.

As apparent from the above description, in this embodiment, the X direction and Y direction moving devices 524 and 526 and the X direction and Y direction moving devices 964 and 966 of the control device 54 are controlled to apply the coating head. A portion for selectively moving the 520 and the mounting head 960 to the upper position of the substrate 20 constitutes a coating head / mounting head movement control device, and controls the pin driving device 834 to control the height position of the protrusion pin 832. The part that controls the steplessly constitutes the pin control device. Further, a portion of the input device 1120 as the input unit and the control device 54 that executes the chip imaging mode selected by the input of the input device 1120 constitutes a state switching unit. Further, the substrate supply cartridge lifting / lowering device 68 and the substrate storage cartridge lifting / lowering device 86 of the control device 54 are controlled to raise and lower the substrate supply cartridge 66 and the substrate storage cartridge 84 to supply and store the substrates 20 in a preset order. The portions constitute a substrate supply sequence control unit and a substrate storage sequence control unit, respectively.
The input unit is not limited to the input device 1120, and may be configured by a host computer, for example, and the chip imaging mode may be automatically switched based on the instruction. Alternatively, the chip imaging mode may be set in advance according to at least one type of the substrate and the chip, the number of manufactured substrates with chips, and the like, and the chip imaging mode may be switched accordingly. In this case, the part from which the computer 1110 reads the chip imaging mode setting data stored therein constitutes the input unit.

  In addition, when making the board | substrate holding | suppressing of a board | substrate holding | maintenance apparatus transparent, it may be colored and transparent and may be made from a synthetic resin.

  Further, the mounting head of the chip mounting device includes a plurality of chip holding units, and the mounting head moving device causes each of the plurality of chip holding units to receive a chip from the chip holding device and holds the chip holding device on the substrate holding device. It is also possible to use a device that is transported all at once to the upper portion of the substrate thus mounted and sequentially mounted one by one. For example, a nozzle holder is provided on the piston rod of the air actuator 1012, and the plurality of suction nozzles are held at predetermined intervals around the axis of the piston rod, for example, at equiangular intervals, and one of the plurality of suction nozzles is provided. A chip selection device that selectively lowers the suction nozzle with respect to the other suction nozzles to mount the chip, and selects a plurality of suction nozzles by the chip selection device, raising and lowering the suction nozzle by an air actuator, and contact load control. After the chips are sequentially sucked by the suction nozzle, they are moved to the substrate and sequentially mounted. In this case, the rotational position error of the tip held by the suction nozzle can be corrected by correcting the positional deviation in the X and Y directions of the tip caused by the rotation and rotation of the piston rod.

  Further, the chips may be stored and supplied in a tray. The tray includes a plurality of chip receiving recesses, and one chip is stored in each of the chip receiving recesses.

  Further, the movable defining member 202 is moved to the advanced position (the distance between the movable defining surface 206 and the fixed defining surface 146 is equal to the substrate width W by the distance γ even after the substrate pressing members 122 and 172 release the clamp of the substrate 20. The position of the substrate 20 is kept at the position where the substrate 20 is added, and when the substrate 20 is pushed by the pushing member 296 and stored in the substrate storage cartridge 84, the movement limit in the width direction of the substrate 20 is defined. Good. In this case, even when the substrate 20 carried into the substrate holding device 42 from the substrate supply cartridge 66 reaches the upstream movable defining member 202 in the substrate transport direction, both of the two movable defining members 202 are retracted to the retracted position. The upstream movable defining member 202 is retracted to the retracted position before the loaded substrate 20 arrives, and the downstream movable defining member 202 is then moved to the retracted position before the substrate 20 is further loaded. You may retreat. In this case, the movable defining member 202 constitutes a substrate width direction position defining device, a substrate transport width defining device, or a substrate width direction movement limit defining device.

FIG. 3 is a diagram schematically illustrating a chip mounting machine that is an embodiment of the claimable invention, in which three chip mounting machines on which the method of the claimable invention is implemented are arranged in a line. It is a top view which shows the board | substrate which is a collection of the some package board | substrate with which a chip | tip is mounted by the said chip mounting machine. It is a top view which shows the chip | tip aggregate | assembly which is the aggregate | assembly of the said chip | tip. It is a top view which shows the said chip mounting machine roughly. It is a right view which shows the board | substrate holding | maintenance apparatus of the said chip mounting machine. It is a top view which shows the said board | substrate holding apparatus. It is a top view which shows schematically the guide path of the board | substrate conveyance apparatus of the said chip mounting machine, a board | substrate supply cartridge, and a board | substrate storage cartridge. It is a top view which shows the board | substrate conveyance apparatus of the said chip mounting machine. It is a left view which shows the said board | substrate conveyance apparatus. It is a left view which shows the board | substrate carrying in / out head of the said board | substrate conveyance apparatus. It is a front view (part cross section) which shows the said board | substrate carrying in / out head with a board | substrate supply cartridge and a board | substrate storage cartridge. It is a right view (part cross section) which shows the board | substrate support heating apparatus of the said chip mounting machine. It is a rear view (partial cross section) which shows the said board | substrate support heating apparatus. It is a top view which shows the board | substrate support surface of the said board | substrate support heating apparatus. It is a front view which shows the adhesive agent coating device of the said chip mounting machine. It is a left view which shows the said adhesive agent coating device. It is a top view which shows the chip assembly holding member and chip assembly storage member of the chip holding device of the chip mounting machine. It is a top view which shows the tension | tensile_strength provision member of the said chip | tip holding device, and a tension | tensile_strength member holding apparatus. It is a right view which shows the said chip holding device. It is a front view (partial cross section) which shows the connection apparatus of the said chip holding device. It is a figure explaining arrangement | positioning of each cylindrical part of the multiple types of tension | tensile_strength provision member of the said chip | tip holding | maintenance apparatus. It is a right view (partial cross section) which shows the chip | tip raising apparatus of the said chip mounting machine. It is a top view which shows the adsorption | suction cylinder of the said chip | tip raising apparatus. It is a top view which shows the chip mounting apparatus of the said chip mounting machine. It is a front view which shows the said chip mounting apparatus. It is a front view (partial cross section) which shows the mounting head of the said chip mounting apparatus. It is a block diagram which shows roughly the control apparatus which controls the said chip mounting machine.

Explanation of symbols

10, 12, 14: Chip mounting machine 20: Substrate 22: Semiconductor chip 24: Wafer 26: Adhesive sheet 30: Chip assembly 34: Package substrate 40: Substrate transport device 42: Substrate holding device 44: Adhesive coating device 46 : Chip holding device 48: Chip mounting device 50: Substrate support heating device 52: Chip protrusion device 54: Control device 106: Pressing member lifting device 120: Substrate pressing member 122: Substrate pressing member 170: Substrate pressing member 172: Substrate Pushing member 24 0: Guide path 242: Movable frame 244: Substrate carry-in / carry-out head moving device 246: Substrate carry-in / carry-out head moving device 250: Vertical member 252: Horizontal member 400: Heater serving also as a support member 402: Heater moving device 520: Application head 522: Coating head moving device 570: Needle 572: Adhesive accommodation 574: Adhesive pump 576: Coating head main body 634: Tension applying member 636: Tension applying member holding device 654: Cylindrical portion 670: Tension applying member 672: Cylindrical portion 832: Push-up pin 834: Pin driving device 952: Fixed Imaging device 960: Mounting head 962: Mounting head moving device 1010: Suction nozzle 1012: Air actuator 1082: Movable imaging device

Claims (14)

A chip mounting machine that manufactures a substrate with a chip by applying an adhesive to a plurality of locations on the substrate and mounting and bonding a bare chip to each of the application portions,
A substrate carrying device that carries the substrate into the work area in the substrate carrying direction and unloads the substrate in the substrate carrying direction from the work area;
A substrate holding device for holding the substrate in a horizontal posture in the work area;
An adhesive application device that applies the adhesive to each of a plurality of locations of the substrate held by the substrate holding device;
A chip holding device for holding a plurality of the bare chips;
A chip mounting device that receives the plurality of bare chips held by the chip holding device one by one, and is mounted on each of the portions to which the adhesive is applied of the substrate held by the substrate holding device; And a chip mounting machine in which the adhesive coating device and the chip mounting device are arranged side by side in a direction perpendicular to the substrate transport direction.   The adhesive application device applies an adhesive, and an application head moving device that moves the application head at least in the X direction parallel to the substrate transport direction and in the horizontal Y direction perpendicular to the X direction. The chip mounting apparatus includes a mounting head that holds and mounts the bare chip, and a mounting head moving apparatus that moves the mounting head in at least the X direction and the Y direction, and the coating head moving apparatus And the mounting head moving device includes a coating head / mounting head movement control device that selectively moves the coating head and the mounting head to a position above the substrate held by the substrate holding device. The chip mounting machine according to claim 1. The substrate transfer device is
A substrate guide path for guiding the substrate;
Work with the substrate by engaging the gripping portion for gripping the first end of the substrate to be carried into the work area and the second end of the substrate in the work area opposite to the first end. An action part provided back-to-back with each other in the substrate transport direction with the extrusion part extruded from the area;
The chip mounting machine according to claim 1, further comprising: an action part moving device that holds the action part and moves the action part in the substrate transport direction.   The substrate transport device includes a movable frame having a vertical portion that extends vertically on one side of the substrate guide path and a horizontal portion that extends horizontally in a cantilevered manner from the vertical portion, and the action portion is held by the horizontal portion. The chip mounting machine according to claim 3, wherein the action part moving device moves the action part via the movable frame. A heater capable of heating a portion of the substrate held by the substrate holding device and stationary;
The chip mounting machine according to any one of claims 1 to 4, further comprising: a heater moving device that moves the heater in a direction parallel to a stationary substrate held by the substrate holding device.   The substrate holding device is provided with a substrate presser provided above both side edges parallel to the substrate transport direction of the substrate, and the both side edges are pressed against the substrate presser from below to cooperate with the substrate presser. A pressing member that clamps the pressing member, and a pressing member lifting device that lifts and lowers the pressing member, wherein at least one of the two substrate pressing members is transparent, and includes a clamping device that clamps the side edges. The chip mounting machine according to claim 1.   7. The chip holding device according to claim 1, wherein the chip holding device is provided so as not to move in at least an X direction parallel to the substrate transport direction and a Y direction perpendicular to the X direction and horizontal. The chip mounting machine described. The chip holding device is
A plurality of types of holding members each having a holding part having a different size, the center of the holding part being closer to the substrate holding device side as the holding part is smaller,
The chip mounting machine according to claim 7, further comprising: a holding member holding device capable of selectively attaching the plurality of types of holding members. The application head is
A needle for applying an adhesive;
An adhesive container containing the adhesive and connected to the needle by a connection passage;
An adhesive pump for discharging the adhesive in the adhesive container from the needle;
The chip mounting machine according to claim 2, further comprising: an application head body that holds the needle, an adhesive container, and an adhesive pump, and the application head body is moved by the application head moving device. The chip mounting device is
A suction nozzle that sucks and holds the bare chip under negative pressure;
A load control device with a built-in position detector capable of controlling both the position of the suction nozzle in the axial direction of the suction nozzle and the contact load of the suction nozzle with respect to the bare chip. The chip mounting machine according to claim 1. The chip holding device includes a sheet holding device that holds an outer peripheral portion of a holding sheet to which a plurality of the bare chips are attached and maintains the holding sheet in a tension state; and
A push-up pin that pushes up the holding sheet from the back side and lifts the bare chip from the holding sheet;
A pin driving device for driving the protruding pin;
The chip mounting machine according to any one of claims 1 to 10, further comprising: a pin control device that controls the pin driving device to steplessly control the height position of the protruding pin. The chip mounting device is
A mounting head for holding and mounting the bare chip;
A mounting head moving device that moves the mounting head in at least an X direction parallel to the substrate transport direction and a Y direction that is perpendicular to the X direction and horizontal, and the chip mounting machine includes:
A movable imaging device that images the bare chip that is moved together with the mounting head by the mounting head moving device and is held by the chip holding device;
A first correction unit for correcting the position of the mounting head when receiving a bare chip from the chip holding device based on an imaging result by the movable imaging device;
A fixed imaging device that images the bare chip held stationary and held by the mounting head;
2. A second correction unit that corrects a position of the mounting head when a bare chip is mounted on a substrate held by the substrate holding device based on an imaging result of the fixed imaging device. The chip mounting machine in any one of thru | or 11. A chip mounting method for manufacturing a substrate with a chip by applying an adhesive to a plurality of locations on a substrate and mounting and bonding a bare chip to each of the application portions,
The chip mounting method characterized in that the application of the adhesive and the mounting of the bare chip are alternately performed a predetermined number of times a plurality of times.   14. The chip mounting method according to claim 13, wherein both the application of the adhesive and the mounting of the bare chip are performed on the substrate which is stationary at one place.

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