JPH11288980A - Die bonder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die bonder of a structure, wherein the time taken for mounting dies can be very much shortened and at the same time, different kinds of dies can be mounted in a simultaneous progress. SOLUTION: A die bonder is one provided with a die feeding means 6 for feeding dies D, a plurality of bonding heads 14 which chuck the dies D fed by the means 6 and mount these attracted dies D on works W, a rotator, which mounts the plurality of the bonding heads 14 on the peripheral surface thereof, and at the same time is rotatably constituted, and rotatably carrying means, which rotate the rotator and carry each bonding head 14 between a chucking position for chucking the dies D and a mounting position for mounting these dies D.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonder for mounting a die on a work such as a substrate or a lead frame.

[0002]

2. Description of the Related Art In a conventional die bonder, a die supplied from a wafer or a die tray is transferred to a pickup table by a transfer device, and the bonding head is made to face the pickup table to attract the die and transfer the die to a work position. And implement it. In this case, since the mounting of the die needs to be performed with high accuracy, the movement of the bonding head is limited only in the Z-axis direction, or in the X / Z-axis direction or the YZ-axis direction.

[0003]

In such a conventional die bonder, since the movement of the bonding head is a linear reciprocating movement, even if the moving time of the bonding head is reduced, the tact time for mounting is greatly reduced. The thing is
There was a limit. Further, since the die is mounted by a single bonding head (collet), different types of die cannot be mounted simultaneously.

An object of the present invention is to provide a die bonder capable of extremely reducing the time required for mounting dies and mounting different types of dies simultaneously.

[0005]

A die bonder according to the present invention comprises:
A die supply means for supplying the die, a plurality of bonding heads for adsorbing the die supplied by the die supply means and mounting the same on a work, and a plurality of bonding heads mounted on a peripheral surface and rotatable. And a rotating / transporting means for rotating the rotating body and transporting each bonding head between a suction position at which the die is suctioned and a mounting position at which the die is mounted.

According to this configuration, since a plurality of bonding heads are provided, when one arbitrary bonding head is performing a mounting operation, it can be attracted to another bonding head. Further, since a plurality of bonding heads do not interfere with each other due to the rotation, when any one bonding head moves from the mounting position to the suction position, another bonding head is moved from the suction position to the mounting position. Can be moved. On the other hand, by mounting different suction nozzles (collets) on a plurality of bonding heads, different dies can be mounted simultaneously.

In this case, the rotating body is mounted with an even number of bonding heads at equal intervals in the circumferential direction, and the rotating / conveying means conveys each bonding head by rotating the rotating body in forward and reverse directions. preferable.

According to this configuration, the heater cord and the like can be wired without difficulty, and a special connector is not required.

In these cases, it is preferable to further include a main recognition means which faces between the die to be mounted and the mounting part of the work at the mounting position and recognizes the position of the die and the position of the mounting part.

According to this configuration, since the position of the die and the position of the mounting site can be recognized at the mounting position, the die can be mounted with extremely high accuracy.

In this case, it is preferable to further include a die transfer means for transferring the die from the die supply means to the suction position, and a sub-recognition means for recognizing the die transferred by the die transfer means.

According to this configuration, since the die is recognized before it is attracted to the bonding head, the damaged die can be removed in advance, and the position of the die is corrected so that the main recognition can be performed. There is no problem such as the die coming out of the field of view when recognizing the means.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a die bonder according to an embodiment of the present invention will be described with reference to the accompanying drawings. This die bonder bonds a die, which is a flip chip, to a work, which is a substrate, and FIG. 1 is a configuration diagram schematically showing the die bonder. As shown in the figure, a die bonder 1 includes a die supply unit 2 for supplying a die D.
And a bonding section 3 for bonding the supplied die D to the work W, and a work supply section 4 for supplying the bonding section 3 with the work W.

The die supply unit 2 stores a die D and supplies the die D to the bonding unit 3.
And a die transfer device 7 for transferring the die D from the die supply device 6 to the suction position. The die transfer device 7 is provided with a first recognition camera (sub-recognition camera) 8 that recognizes the outer shape of the die D.

The bonding unit 3 is lifted and lowered by the lifting device 11 supported by the machine base 10, the unit body 13 and the two bonding heads 1.
A head unit 12 composed of a head unit 4 and a head transfer device 15 for rotatingly transferring the two bonding heads 14 between a mounting position for bonding to the die D and a suction position for sucking the die D. ing. A second recognition camera (main recognition camera) 16 that recognizes the position of the die D and the workpiece W faces the mounting position, and the second recognition camera 16 is moved forward and backward by a device (not shown). .

The work supply unit 4 holds a work W and moves the work W in the X, Y, (θ) axis directions, and a work table (not shown) for carrying the work W into and out of the horizontal work table 18. And a loading / unloading device.

The die D supplied from the die supply device 6 is sucked by the die transfer device 7, where it is recognized by the first recognition camera 8, and then transferred to the suction position. The die D transferred to the suction position is suctioned by the bonding head 14 and is transferred by the head transfer device 15 to the bonding head 14.
Is transported to the mounting position. When the die D is transported to the mounting position, the bonding head 14
Here, the lifting device 11 is driven to lower the bonding head 14 to the position of the second recognition camera 16. Then, the die D and the work W are moved to the second recognition camera 1.
After the recognition at 6, the second recognition camera 16 waits for retreat and the bonding head 14 descends again to bond the die D onto the work W.

The die supply device 6 of the die supply section 2 has a pallet stocker 21 and a pallet pull-out mechanism 22. A large number of dies D are accommodated in a matrix on a die tray 23, and a plurality of die trays 23 are
And is stocked in the pallet stocker 21. The pallet stocker 21 has a plurality of pallets 2
The pallet pulling mechanism 22 pulls out any one of the plurality of pallets 24 from the pallet stocker 21 and faces the die transfer device 7. .

The die transfer device 7 includes a supply head 31, a head reversing mechanism 32 for reversing the supply head 31 up and down,
It has a head moving mechanism 33 that moves the supply head 31 in the X, Y, and Z axis directions and makes a minute rotation (θ direction) in a horizontal plane. When the supply head 31 faces the pallet 24 pulled out by the head moving mechanism 33 and sucks the die D, the head rotating mechanism 32 turns the supply head 31 upside down so that the sucked die D faces the first recognition camera 8. Here, the die D is
Are recognized, and the position of the die D in the X, Y, and θ directions is corrected based on the recognition result.
However, if it is recognized that the die D is damaged at this time, the die D is discarded. In this way, the die D is introduced from the die supply device 6 to the bonding position of the bonding head via the die transfer device.

As shown in FIG. 2, the lifting / lowering device 11 of the bonding portion comprises a lifting / lowering motor 41 fixed to the machine base 10 and a ball screw 43 rotatably attached to the lifting / lowering motor 41 via a coupling 42. Have been. The ball screw 43 is connected to the female screw member 5 of the head unit 12 described later.
1 and the head unit 12 is moved up and down for bonding via the ball screw 43 and the female screw member 51 when the elevating motor 41 rotates forward and backward.

Unit body 13 of head unit 12
Holds the engagement claw 45 at the mounting position, the transmission rod 46 disposed so that the lower end abuts against the upper end of the bonding head 14, and the engagement claw 45 at the lower end. A support arm 47 for slidably supporting the transmission rod 46 in a vertical direction, a load cell 48 in contact with an upper end of the transmission rod 46, an air cylinder 49 holding the load cell 48 and disposed above the load cell 48; The lower portion supports the air cylinder 49 and the support arm 47, and the upper portion includes a frame member 50 that supports the female screw member 51.

The frame member 50 and the support arm 47 are slidably engaged with a main guide rail 52 fixed to the machine base 10.
It is guided by 2 and goes up and down. A stopper plate 53 is fixed to a lower portion of the main guide rail 52, and a distal end of the stopper plate 53 comes into contact with the engaging claw 45 raised to the home position. The engagement claw 45 is rotatably attached to the support arm 47 in a state where the engagement claw 45 is urged in a counterclockwise direction in the figure. doing.

More specifically, the bonding head 14
The abutting portion 54 is sandwiched between a transmission rod 46 facing upward and an engaging claw 45 facing downward, and moves up and down in this state. Also, in the elevating operation, the unit body 13
Rises to the home position, the engaging claws 45 abut against the stopper plate 53, and in the process of further raising the unit body 13 to the rising end position, the engaging claws 14 rotate,
The latching state with the abutting portion 54 is released so that the bonding head 14 is left behind.

The transmission rod 46 connects the bonding head 14 and the air cylinder 49 via a load cell 48. The reaction force received when the bonding head 14 bonds the die D is applied to the air cylinder 49 via the load cell 48. To 49. That is, the air cylinder 49 applies a bonding pressure to the bonding head 14, and when applying the pressure, the load cell 48 detects the bonding pressure. When the head unit 12 moves down to perform the bonding operation, a bonding pressure is applied to the bonding head 14 by the air cylinder 49. Here, when the load cell 48 detects a predetermined bonding pressure, the operating air of the air cylinder 49 is removed (pressure drop) via a controller and a pneumatic circuit (not shown), and the bonding head 14 shifts to a rising operation. .

The head transfer device 15 includes a head holder (rotary body) 61 for supporting the two bonding heads 14 and 14 at 180 ° point symmetric positions, a support table 62 for rotatably supporting the head holder 61, and a belt ( And a transport motor (rotary transport means) 64 for rotating the head holder 61 forward and reverse via a timing belt 63. The head holder 61 is rotatably supported by a support table 62 fixed to the machine base 10 via a pair of bearings 65, 65 arranged one above the other. Similarly, the transport motor 64 is supported by the machine base 10 in a downward attitude.

When the transport motor 64 rotates forward and backward, the head holder 61 reciprocates at an angle of 180 ° via the belt 63. Thus, one bonding head 14 that has sucked the die D at the suction position rotates (revolves) and is conveyed to the mounting position, and the other bonding head 14 that has completed bonding and is at the mounting position.
Is rotated (revolved) and transported to the suction position. At this time, if the different dies D are alternately made to come from the die supply unit 2, the different dies D can be mounted. In such a case, it is assumed that a collet corresponding to the die D to be attracted is mounted on each bonding head 14.

An annular guide groove 66 having a U-shaped cross section is formed on the lower peripheral surface of the support table 62. Each bonding head 14 is guided by the annular guide groove 66 via a roller 55. Rotate (orbit). Further, the lower portion of the annular guide groove 66 on the mounting position side is notched, and the bonding head 14 is separated from this portion and descends.

That is, when the bonding head 14 moves from the suction position to the mounting position, the unit body 1
Reference numeral 3 is at the rising end position, and the engagement state between the engagement claw 45 and the bonding head 14 is released. Head transfer device 1
5 is driven, a pair of bonding heads 14,
Is guided by the annular guide groove 66 and simultaneously rotates (revolves)
I do. When the rotation and conveyance of the bonding heads 14 and 14 are completed, the unit main body 13 starts descending from the rising end position, and when passing the home position, holds the bonding head 14 and descends for bonding.

On the other hand, the descent of the bonding head 14 is 2
Done in stages. That is, before the bonding head 14 starts descending, the horizontal moving table 18 moves the work W
Is mounted directly below the die D, and the second recognition camera 16 moves forward between the mounted portion and the die D. The bonding head 14 first lowers the die D to the focal position of the second recognition camera 16. Here, the position of the die D and the position of the mounting portion of the work W are recognized by the second recognition camera 16, and the position of the work W is corrected by the horizontal movement table 18 based on the recognition result. Next, the bonding head 14 is lowered again to bond the die D to the mounting portion of the work W.

Reference numeral 67 in the drawing denotes a sub guide rail for guiding the bonding head 14 to descend. Reference numeral 56 denotes a collet attached to the lower end of the bonding head 14 for sucking the die D. The collet 56 has a heater incorporated therein.

As described above, according to the present embodiment, two bonding heads 14, 14 are mounted at 180 ° point symmetrical positions on the peripheral surface of the head holder 61, and each bonding head 14 is attached to the suction position and the mounting position, respectively. When the die D is mounted on one of the bonding heads 14, the die D can be sucked on the other bonding head 14. Between two bonding heads 1
4, 14 can be moved simultaneously. For this reason,
Bonding can be performed at twice the speed of a conventional die bonder in which a bonding head reciprocates linearly.

The two bonding heads 14, 1
If different collets 56 are mounted on 4, different types of dies D can be bonded alternately. Furthermore, since the position of the die D and the work W is recognized immediately before bonding by the second recognition camera 16, the die D can be bonded with extremely high precision.

As shown by phantom lines in FIG. 1, four bonding heads may be mounted at four positions on the peripheral surface of the head holder at a 90 ° pitch. Of course, three or five or more bonding heads may be mounted. Also,
The head holder may be rotated directly by the transport motor, or may be rotated via a gear train.

[0034]

As described above, according to the die bonder of the present invention, a plurality of bonding heads are provided and rotated between the suction position and the mounting position.
The mounting operation and the suction operation of the die and the movement can be performed in parallel. For this reason, the time required for mounting the dies can be extremely reduced, and different dies can be mounted simultaneously.

[Brief description of the drawings]

FIG. 1 is a configuration diagram illustrating a device configuration of a die bonder according to an embodiment of the present invention.

FIG. 2 is an enlarged side view of a bonding portion of the die bonder according to the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Die bonder 2 Die supply part 3 Bonding part 4 Work supply part 6 Die supply device 7 Die transfer device 8 First recognition camera 14 Bonding head 15 Head transfer device 16 Second recognition camera 18 Horizontal movement table 61 Head holder 62 Support table 63 Belt 64 Transport motor D Die W Work

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Haruhiko Yamaguchi 2-5-1-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd.

Claims (4)

[Claims] 1. A die supply means for supplying a die, a plurality of bonding heads for sucking the die supplied by the die supply means and mounting the same on a work, and mounting the plurality of bonding heads on a peripheral surface. And a rotatable rotatable body, and rotatable transport means for rotating the rotatable body and transporting each of the bonding heads between a suction position where the die is suctioned and a mounting position where the die is mounted. A die bonder characterized in that: 2. An even number of bonding heads are mounted on the rotating body at equal intervals in a circumferential direction, and the rotating / conveying means conveys each of the bonding heads by rotating the rotating body forward / reversely. The die bonder according to claim 1, wherein: 3. A main recognizing means which faces between a die to be mounted and a mounting part of a work at the mounting position and recognizes the position of the die and the position of the mounting part. The die bonder according to claim 1. 4. The apparatus according to claim 1, further comprising: a die transfer unit for transferring the die from the die supply unit to the suction position; and a sub-recognition unit that faces the die transferred by the die transfer unit and recognizes the die. The die bonder according to claim 3, characterized in that: