JP4501093B2 - Flip chip mounting apparatus and mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a flip-chip mounting apparatus and mounting method, and more particularly to a flip-chip mounting apparatus and mounting method for performing high-precision mounting, high-precision pressurization, and low-impact mounting.
[0002]
[Prior art]
A conventional flip chip mounting apparatus and mounting method will be described with reference to FIG. FIG. 2 is a side view schematically showing the structure of a conventional flip chip mounting apparatus. As shown in FIG. 2, the conventional flip chip mounting apparatus includes a vertical position control unit that moves the flip chip up and down and a pressure unit that pressurizes the flip chip, and includes a vertical position control unit and a pressure unit. A linear guide 17 is provided between them, and the pressure unit moves up and down along the linear guide 17.
[0003]
The vertical position control unit includes a motor 15 and a ball screw 16 that converts the rotational motion of the motor 15 into vertical motion using a screw. The pressure unit includes a pressure cylinder 14 that pressurizes the flip chip 11, and the flip chip 11. The θ-axis motor 7 and the timing belt 8 for controlling the position in the θ-direction of the motor, the spherical bearing 9 for maintaining the parallelism between the package 12 and the flip chip 11, and the heater 10 for heating the flip chip 11. .
[0004]
When mounting using the flip chip mounting apparatus having such a structure, first, the flip chip 11 is heated by the heater 10, aligned by the θ-axis motor 7 and the timing belt 8, and then the motor 15 is rotated. Let When the motor 15 rotates, the rotational motion is converted into a vertical motion by the ball screw 16, and the pressurizing unit descends along the linear guide 17 by this vertical motion. After the flip chip 11 and the package 12 are brought into contact with each other, the flip chip 11 is mounted by applying a load to the flip chip 11 by the pressure cylinder 14.
[0005]
[Problems to be solved by the invention]
However, in such a conventional flip chip mounting apparatus, a load is applied to the linear guide 17 when the flip chip 11 is pressed by the pressure cylinder 14, and depending on the magnitude of the load, the bearing in the linear guide 17 may bend. Occurs, and the pressing direction of the pressure cylinder 14 changes. Due to this change in the pressing direction, a force acts in a direction different from the normal direction of the flip chip mounting surface of the package 12, and there is a problem that the flip chip 11 is displaced due to this force.
[0006]
Further, since the conventional flip chip mounting apparatus uses rolling bearings such as the ball screw 16 and the linear guide 17, when the flip chip 11 is brought into contact with the package 12, a frictional force is generated by the rolling of the ball in the linear guide 17. However, since the frictional force does not become constant during the progress, there is a problem that the load at the time of contact cannot be made light and the load at the time of mounting cannot be controlled with high accuracy.
[0007]
The present invention has been made in view of the above-mentioned problems, and its main purpose is to prevent misalignment when pressing the flip chip, and to mount the flip chip with high accuracy. An object of the present invention is to provide a flip chip mounting apparatus and a mounting method capable of reducing the load at the time of contact between the chip and the package and controlling the load at the time of mounting with high accuracy.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a cylinder that presses a flip chip against a package, a motor that is connected to the cylinder and controls a position in the height direction of the flip chip, and between the motor and the flip chip. A flip chip mounting apparatus comprising: an air slider disposed on the substrate; a θ-axis motor that controls the rotation angle of the flip chip; and a stage that fixes the package. The cylinder, the motor, and the air slider Are arranged linearly in this order toward the flip chip, and the air slider slides up and down in the direction of the central axis, a bearing abutting against the inner surface of the slider shaft, and the bearing. And a pusher that freely rotates, and the central axis of the air slider and the cylinder A drive shaft overlap phase, is shall depressing the pusher.
[0010]
In the present invention, it is preferable that the motor that controls the position of the flip chip in the height direction is a VCM.
[0011]
The flip chip mounting method of the present invention includes a cylinder that presses the flip chip against a package, a motor that is connected to the cylinder and controls a position in the height direction of the flip chip, and between the motor and the flip chip. An air slider, a θ-axis motor that controls the rotation angle of the flip chip, and a stage that fixes the package, and the cylinder, the motor, and the air slider are directed toward the flip chip. A flip-chip mounting method using a flip-chip mounting apparatus arranged in a straight line in this order , wherein the air slider abuts on a cylindrical slider shaft that slides up and down in a central axis direction, and an inner surface of the slider shaft. A bearing and a pusher that freely rotates via the bearing, The central axis of the slider and the drive shaft of the cylinder overlap phase, the drives the cylinder to depress the pusher, the arrangement direction of said cylinder and said motor and said air slider, which presses the flip chip It is.
[0012]
As described above, in the present invention, since the cylinder to be pressurized and the other mechanical parts are arranged in the same straight line, the flip chip can be mounted on the package with high positional accuracy, and when the flip chip is brought into contact with the air slider. The load at the time of mounting can be made light, and the load at the time of mounting can be controlled with high accuracy.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
In a preferred embodiment of the flip chip mounting apparatus according to the present invention, the low friction cylinder 1 that presses the flip chip 11 against the package 12, the VCM 2 that controls the height position of the flip chip, and the flip chip. An air slider 3 for controlling the applied load, a θ-axis motor 7 and timing belt 8 for controlling the position of the flip chip in the θ direction, a spherical bearing 9 for maintaining parallelism between the package and the flip chip, and a flip chip The heater 10 for heating is provided, the low friction cylinder 1, the VCM 2, and the air slider 3 are arranged linearly, and the central axis of the air slider 3 and the drive shaft of the low friction cylinder 1 are arranged to overlap each other. As a result, the flip chip is mounted on the package with high positional accuracy without giving an impact to the flip chip.
[0014]
【Example】
In order to describe the above-described embodiment of the present invention in more detail, an example of the present invention will be described with reference to FIG. 1A and 1B are diagrams schematically showing a structure of a flip chip mounting apparatus according to an embodiment of the present invention, in which FIG. 1A is a side view and FIG. 1B is an enlarged sectional view of an air slider.
[0015]
Referring to FIG. 1, the flip chip mounting apparatus of the present embodiment is disposed on a low friction cylinder 1 for pressurizing the flip chip and a drive shaft of the low friction cylinder 1, and controls the height position and mounts a low load. VCM (voice coil motor) 2 that realizes the same, an air slider 3 that is disposed on the drive shaft of the low-friction cylinder 1 and performs load control with high accuracy, and a θ-axis motor 7 that performs position control in the θ direction. And the timing belt 8, the mounting surface of the flip chip 11 is freely movable, the spherical bearing 9 that maintains the parallelism between the package 12 and the flip chip 11, the heater 10 that heats the flip chip 11, and the flip chip 11 The mounting package 12 and the mounting stage 13 for fixing the mounting package are included.
[0016]
Further, as shown in FIG. 1B, the air slider 3 includes a hollow slider shaft 4 that slides up and down in the air slider 3, a bearing 6 disposed in the slider shaft 4, and an inner portion of the slider shaft 4. And a pusher 5 rotatably disposed via a bearing 6.
[0017]
When mounting using such a flip chip mounting apparatus, first, the flip chip 11 is heated by the heater 10, and alignment in the θ direction is performed by the θ axis motor 7 and the timing belt 8. Next, the VCM 2 is driven to push down the pusher 5 in the air slider 3 to lower the flip chip 11 and mount the flip chip 11 on the package 12. At this time, the VCM 2 is initially moved at a high speed and moved at a low speed immediately before the package 12 and the flip chip 11 are in contact with each other.
[0018]
Here, since the VCM 2 and the air slider 3 perform a non-contact motion, the frictional force is extremely small and there is no frictional fluctuation due to rolling friction, so that the low-speed motion can be stably performed. Therefore, the package 12 and the flip chip 11 can be brought into contact without applying an impact. Furthermore, since the spherical bearing 9 is kept in a free state upon contact, the lower surface of the flip chip 11 and the upper surface of the package 12 can be brought into contact with each other.
[0019]
Next, compressed air is fed into the low friction cylinder 1 to pressurize the flip chip 11. At this time, the pressing position of the low friction cylinder 1 and the VCM 2 and the air slider 3 for moving in the vertical direction are arranged linearly on the drive shaft of the low friction cylinder 1, so that the pressing direction is applied to the flip chip 11. The load of the direction component different from the above is not applied, and it is possible to prevent the flip chip 11 from being displaced during pressurization.
[0020]
Further, since the spherical bearing 9 that can move freely can keep the lower surface of the flip chip 11 and the upper surface of the package 12 parallel to each other, a load is applied to the flip chip 11 only from the normal direction of the mounting surface. Can do. Therefore, it is possible to prevent the flip chip 11 from changing in a direction perpendicular to the pressing direction during pressing.
[0021]
Further, since a low friction cylinder is used as the cylinder 1, the frictional force in the cylinder can be reduced, and the frictional force of the air slider 3 is minimal, so that the applied pressure can be accurately matched to the air pressure. Therefore, it is possible to pressurize the flip chip 11 with high accuracy.
[0022]
Further, since the pusher 5 in the slider shaft 4 is pressurized when the flip chip 11 is pressed, a load is not directly applied to the air slider 3 and the slider shaft 4 made of ceramic or the like. Breakage of the slider shaft 4 can be prevented.
[0023]
【The invention's effect】
As described above, the flip chip mounting apparatus of the present invention has the following effects.
[0024]
The first effect is that the flip chip can be mounted on the package with high positional accuracy.
[0025]
The reason is that a cylinder to be pressurized and other mechanical parts such as a VCM and an air cylinder are arranged in the same straight line, and a spherical bearing in which the flip chip and the surface of the package are held parallel to each other is used. This is because a lateral load is not applied to the flip chip, and no displacement occurs during pressurization.
[0026]
The second effect is that the load at the time of flip chip contact can be made light and the load at the time of mounting can be controlled with high accuracy.
[0027]
The reason is that the pressure applied to the cylinder can be accurately transmitted to the flip chip by using a low friction cylinder, VCM or air slider.
[Brief description of the drawings]
1A and 1B are views schematically showing a structure of a flip chip mounting apparatus according to an embodiment of the present invention, in which FIG. 1A is a side view and FIG. 1B is an enlarged sectional view of an air slider;
FIG. 2 is a side view schematically showing the structure of a conventional flip chip mounting apparatus.
[Explanation of symbols]
1 Low friction cylinder 2 VCM
3 Air slider 4 Slider shaft 5 Pusher 6 Bearing 7 θ axis motor 8 Timing belt 9 Spherical bearing 10 Heater 11 Flip chip 12 Package 13 Mounting stage 14 Pressure cylinder 15 Motor 16 Ball screw 17 Linear guide

Claims (4)

A cylinder that presses the flip chip against the package, a motor that is connected to the cylinder and controls a position in the height direction of the flip chip, an air slider disposed between the motor and the flip chip, and the flip A flip chip mounting apparatus comprising a θ-axis motor for controlling a rotation angle of a chip and a stage for fixing the package,
The cylinder , the motor, and the air slider are linearly arranged in this order toward the flip chip ,
The air slider includes a cylindrical slider shaft that slides up and down in a central axis direction, a bearing that contacts the inner surface of the slider shaft, and a pusher that freely rotates via the bearing, center axis and the drive shaft overlap phase of the cylinder, the flip chip mounting apparatus according to claim Rukoto depressing the pusher. 2. The flip chip mounting apparatus according to claim 1, wherein the motor for controlling the position in the height direction of the flip chip is a VCM (voice coil motor) . A cylinder that presses the flip chip against the package, a motor that is connected to the cylinder and controls a position in the height direction of the flip chip, an air slider disposed between the motor and the flip chip, and the flip Flip chip mounting comprising a θ-axis motor for controlling the rotation angle of the chip and a stage for fixing the package, wherein the cylinder, the motor, and the air slider are linearly arranged in this order toward the flip chip. A flip chip mounting method using an apparatus,
The air slider includes a cylindrical slider shaft that slides up and down in a central axis direction, a bearing that contacts the inner surface of the slider shaft, and a pusher that freely rotates via the bearing, The center axis and the drive shaft of the cylinder overlap, and the cylinder is driven to push down the pusher,
A flip chip mounting method , wherein the flip chip is pressed in an arrangement direction of the cylinder, the motor, and the air slider . 4. The flip chip mounting method according to claim 3 , wherein the position of the flip chip in the height direction is controlled using a VCM.

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